Method and device for adjusting internal environment state of equipment, equipment and medium

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By monitoring the temperature and humidity of electronic components inside the equipment in real time and implementing appropriate control strategies according to changes in the external environment, the problem of internal environmental regulation of the equipment is solved to ensure the normal operation of the electronic components and improve system stability.

CN119781554APending Publication Date: 2025-04-08GREE ELECTRIC APPLIANCE INC OF ZHUHAI

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Patent Information

Application Number: CN202411925540.0
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Filing Date: 2024-12-25
Publication Date: 2025-04-08

AI Technical Summary

Technical Problem

The prior art is difficult to effectively adjust the temperature and humidity of the internal environment of the equipment, resulting in the inability to work normally and affecting the stability of the system.

Method used

By obtaining the temperature and humidity data of each electronic component inside the device, we judge whether it is beyond the working range, and implement preset temperature and humidity control strategies based on the changing trend of external ambient temperature and humidity, including heating, cooling, ventilation, humidification and dehumidification treatment.

Benefits of technology

It realizes precise adjustment of the internal environment of the equipment, ensures that the electronic components work within the normal temperature and humidity range, and improves the stability and reliability of the system.

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Abstract

The embodiment of the invention relates to the field of automation, and discloses a method and device for adjusting the internal environment state of equipment, the equipment, a medium and a meal cabinet. According to the current environment temperature of the external area of the equipment and the change trend of the environment temperature, carrying out temperature control operation on the internal area of the equipment according to a preset temperature control strategy; when the humidity of the position where a second electronic element is located exceeds the working humidity interval of the second electronic element, humidity control operation is conducted on the internal area of the equipment according to the current environment humidity of the external area of the equipment and the change trend of the environment humidity and a preset humidity control strategy. The temperature and humidity of the environment of the internal area of the equipment can be adjusted, and it is guaranteed that electronic elements in the internal area of the equipment work within the normal temperature and humidity range.

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Description

Technical Field

[0001] The embodiments of the present invention relate to the field of automatic control, and in particular to a method, device, equipment and medium for adjusting the internal environmental state of a device. Background Art

[0002] With the development of intelligence and artificial intelligence, unmanned factories, unmanned supermarkets, unmanned vending machines and other related scene applications and products have been promoted one after another, and the stable operation of these unmanned vending products has become very important. Food cabinets usually include merchandise areas (display areas and inventory areas), refrigeration and dehumidification device areas, heating device areas, control equipment areas, etc. Among them, there are many small electronic components, which have strict requirements on temperature and ambient humidity during use. Appropriate temperature and humidity conditions help ensure the reliability and stability of the use of electronic products. Improper temperature regulation may cause electronic components to fail to work properly, causing the system to stop working, etc. Improper humidity conditions will cause the performance of electronic components to degrade or even be damaged, such as reduced capacitance, short circuit of integrated circuits, oxidation of metal parts, etc., causing electronic products to fail. Summary of the invention

[0003] The purpose of the present invention is to at least provide a method, device, equipment, medium and food cabinet for adjusting the internal environmental state of the equipment, which can at least solve the problem of how to adjust the internal environmental state of the equipment and at least ensure that the electronic components inside the equipment operate within a normal temperature and humidity range.

[0004] To solve the above technical problems, at least one embodiment of the present application provides a method for adjusting the internal environmental state of a device, comprising:

[0005] Obtain the temperature and humidity of each electronic component in the internal area of the device;

[0006] Determine whether the temperature and humidity at the location of each electronic component exceed the corresponding operating temperature range and operating humidity range of the electronic component;

[0007] When the temperature at the location of the first electronic component exceeds the operating temperature range of the first electronic component, according to the current ambient temperature of the external area of the device and the change trend of the ambient temperature, the temperature control operation is performed on the internal area of the device according to a preset temperature control strategy, so as to control the temperature in the internal area of the device within the operating temperature range corresponding to the first electronic component;

[0008] When the humidity at the location of the second electronic component exceeds the working humidity range of the second electronic component, the humidity control operation is performed on the internal area of the device according to the current ambient humidity of the external area of the device and the changing trend of the ambient humidity and a preset humidity control strategy to control the humidity in the internal area of the device within the working humidity range corresponding to the second electronic component.

[0009] In some optional embodiments, the temperature control strategy includes:

[0010] Based on the relationship between the temperature of the location of the first electronic component, the current ambient temperature of the external area of the device and the limit value of the working temperature range corresponding to the first electronic component, and the change trend of the current ambient temperature of the external area of the device, corresponding temperature control measures are set, and the temperature control measures include temperature regulation processing and / or ventilation processing.

[0011] In some optional embodiments, the temperature control process includes:

[0012] Detecting whether a temperature control device for controlling the temperature of an internal area of the device is turned on;

[0013] When the temperature control device is not turned on, the temperature control device is controlled to control the temperature of the internal area of the device at the maximum working power of the temperature control device; when the temperature control device is turned on, the temperature control device is controlled to maintain the current working power of the temperature control device to control the temperature of the internal area of the device;

[0014] Monitor the temperature of the location of each electronic component in the current internal area of the device, and determine the temperature control time of the temperature control device according to the limit value of the working temperature range corresponding to each electronic component in the internal area of the device, the current temperature of the location of each electronic component, and the spatial volume of the internal area of the device.

[0015] In some optional embodiments, determining the temperature control time of the temperature control device according to the lower limit value of the operating temperature range corresponding to each of the electronic components in the internal area of the device, the current temperature of each electronic component at a location, and the spatial volume of the internal area of the device includes:

[0016] Determining the pre-control temperature of the temperature control device according to the limit value of the working temperature range corresponding to each of the electronic components in the internal area of the device and the current temperature of the location of each of the electronic components;

[0017] The temperature control time of the temperature control device is determined according to the pre-controlled temperature and the spatial volume of the internal area of the equipment.

[0018] In some optional embodiments, the humidity control strategy includes:

[0019] According to the relationship between the humidity at the location of the first electronic component, the current ambient humidity of the external area of the device and the limit value of the working humidity range corresponding to the first electronic component, and the changing trend of the current ambient humidity in the external area of the device, corresponding humidity control measures are set, and the humidity control measures include humidity control processing and / or ventilation processing.

[0020] In some optional embodiments, the humidity control process includes

[0021] Detecting whether a humidity control device for controlling the humidity of an internal area of the device is turned on;

[0022] When the humidity control device is not turned on, the humidity control device is controlled to control the humidity of the internal area of the device at the maximum working power of the humidity control device; when the humidity control device is turned on, the humidity control device is controlled to maintain the current working power of the humidity control device to control the humidity of the internal area of the device;

[0023] Monitor the humidity at the locations of the electronic components currently located in the internal area of the device, and determine the humidity control time of the humidity control device based on the limit values of the working humidity ranges corresponding to the electronic components in the internal area of the device, the humidity at the locations of the electronic components currently located, and the spatial volume of the internal area of the device.

[0024] In some optional embodiments, determining the humidity control time of the humidity control device according to the working humidity range corresponding to each of the electronic components in the internal area of the device, the humidity at the current location of each of the electronic components, and the spatial volume of the internal area of the device includes:

[0025] Determining the pre-controlled humidity of the humidity control device according to the limit value of the working humidity range corresponding to each of the electronic components in the internal area of the device and the humidity at the current location of each of the electronic components;

[0026] The humidity control time of the humidity control device is determined according to the pre-controlled humidity and the spatial volume of the internal area of the equipment.

[0027] In some optional embodiments, the ventilation process includes:

[0028] Opening the ventilation openings in the internal area of the device, and monitoring the temperature and humidity of the locations where the electronic components are located in the internal area of the device;

[0029] When the temperatures at the locations of the electronic components in the internal area of the device are all within the corresponding operating temperature range of the electronic components, and the humidity at the locations of the electronic components in the internal area of the device are all within the corresponding operating humidity range of the electronic components, the vents in the internal area of the device are closed.

[0030] At least one embodiment of the present application further provides a device for adjusting the internal environmental state of a device, comprising:

[0031] The temperature and humidity monitoring module is used to obtain the temperature and humidity of each electronic component in the internal area of the device;

[0032] a temperature control module, configured to determine whether the temperature at the location of each electronic component exceeds the operating temperature range of the corresponding electronic component, and when the temperature at the location of a first electronic component exceeds the operating temperature range of the first electronic component, perform temperature control operations on the internal area of the device according to the current ambient temperature of the external area of the device and the change trend of the ambient temperature and a preset temperature control strategy, so as to control the temperature in the internal area of the device within the operating temperature range corresponding to the first electronic component;

[0033] A humidity control module is used to determine whether the humidity at the location of the electronic component exceeds the corresponding working humidity range of the electronic component; when the humidity at the location of the second electronic component exceeds the working humidity range of the second electronic component, according to the current ambient humidity of the external area of the device and the changing trend of the ambient humidity, according to a preset humidity control strategy, a humidity control operation is performed on the internal area of the device to control the humidity in the internal area of the device within the working temperature range corresponding to the second electronic component.

[0034] At least one embodiment of the present application also provides a meal cabinet, comprising a cabinet body and a temperature and humidity sensor, a heating device, a cooling device, a dehumidification device, a humidification device and a device for adjusting the internal environmental state of the equipment as described above, arranged in the cabinet body, wherein the temperature and humidity sensor, the heating device, the cooling device, the dehumidification device and the humidification device are all communicatively connected to the temperature and humidity controller.

[0035] At least one embodiment of the present application also provides an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the above-mentioned method for adjusting the internal environmental state of the device.

[0036] At least one embodiment of the present application further provides a computer-readable storage medium storing a computer program, wherein the computer program implements the above-mentioned method for adjusting the internal environmental state of the device when executed by a processor.

[0037] The method, device, equipment, medium and dining cabinet for adjusting the internal environmental state of the equipment provided by the embodiment of the present application, by obtaining the temperature and humidity of the position of each electronic component in the internal area of the equipment; and judging whether the temperature and humidity of the position of each electronic component correspond to the working temperature range and working humidity range of the corresponding electronic component; when the temperature of the position of the first electronic component exceeds the working temperature range of the first electronic component, according to the current ambient temperature of the external area of the equipment and the change trend of the ambient temperature, according to the preset temperature control strategy, the temperature control operation is performed on the internal area of the equipment to control the temperature in the internal area of the equipment within the working temperature range corresponding to the first electronic component; when the humidity of the position of the second electronic component exceeds the working humidity range of the second electronic component, according to the current ambient humidity of the external area of the equipment and the change trend of the ambient humidity, according to the preset humidity control strategy, the humidity control operation is performed on the internal area of the equipment to control the humidity in the internal area of the equipment within the working humidity range corresponding to the second electronic component. Thus, the present application can adjust the temperature and humidity of the environment inside the equipment to ensure that the electronic components inside the equipment work within the normal temperature and humidity range. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] One or more embodiments are exemplarily described by the pictures in the corresponding drawings, and these exemplary descriptions do not constitute limitations on the embodiments.

[0039] Figure 1 is a flow chart of a method for adjusting the internal environmental state of a device provided by an embodiment of the present application;

[0040] Figure 2 is a schematic diagram of a temperature control strategy provided by an embodiment of the present application;

[0041] Figure 3 is a schematic diagram of a humidity control strategy provided by an embodiment of the present application;

[0042] Figure 4 is a partial schematic diagram of a dining cabinet provided by an embodiment of the present application;

[0043] Figure 5 It is a schematic diagram of the structure of a controller provided by an embodiment of the present application. DETAILED DESCRIPTION

[0044] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for the convenience of description, and the specific implementation of the present application should not be construed as any limitation, and the various embodiments can be combined and referenced with each other under the premise of no contradiction.

[0045] In order to solve the above-mentioned technical problem of how to adjust the internal environmental state of the device, the present invention proposes a method for adjusting the internal environmental state of the device. The implementation details of the method for adjusting the internal environmental state of the device in this embodiment are specifically described below. The following content is only the implementation details provided for the convenience of understanding and is not necessary for the implementation of this solution.

[0046] Embodiment 1:

[0047] The method for adjusting the internal environment state of a device in this embodiment can be applied to electronic devices with communication, computing and data storage capabilities. The specific process can be as follows: Figure 1 As shown, including:

[0048] Step S1, obtaining the temperature Ti and humidity Hi of each electronic component in the internal area of the device. Ti represents the temperature of the i-th electronic component in the internal area of the device. Hi represents the humidity of the i-th electronic component in the internal area of the device.

[0049] Specifically, by placing high-precision temperature sensors and humidity sensors at the locations of the electronic components in the internal area of the device, an intelligent temperature and humidity controller is used to sense the temperature and humidity of each sensor in real time, based on the known working temperature range and working humidity range of each electronic component, such as the working temperature range T1x~T1y and working humidity range H1x~H1y of the electronic component where sensor 1 is located, the working temperature range T2x~T2y and working humidity range H2x~H2y of the electronic component where sensor 2 is located, and the working temperature range Tnx~Tny and working humidity range Hnx~Hny of the electronic component where sensor n is located. The temperature of the sensor monitoring point in the key electronic component area is Ti=(T1, T2,…, Tn), and the humidity is Hi=(H1, H2,…, Hn), where n is the total number of electronic components.

[0050] The temperature Ti and humidity Hi of each electronic component in the internal area of the device are collected.

[0051] Step S2, determining whether the temperature Ti and humidity Hi at the location of each electronic component are beyond the corresponding operating temperature range [Tix, Tiy] and operating humidity range [Hix, Hiy] of the electronic component.

[0052] Step S3, when the temperature Tix at the location of the first electronic component exceeds the operating temperature range [Tix, Tiy] of the first electronic component, according to the current ambient temperature T0 of the external area of the device and the changing trend of the ambient temperature, according to a preset temperature control strategy, a temperature control operation is performed on the internal area of the device to control the temperature in the internal area of the device within the operating temperature range [Tix, Tiy] corresponding to the first electronic component; when the humidity Hi at the location of the second electronic component exceeds the operating humidity range [Hix, Hiy] of the second electronic component, according to the current ambient humidity H0 of the external area of the device and the changing trend of the ambient humidity, according to a preset humidity control strategy, a humidity control operation is performed on the internal area of the device to control the humidity in the internal area of the device within the working humidity range corresponding to the second electronic component.

[0053] Specifically, the temperature control strategy includes: setting corresponding temperature control measures according to the relationship between the temperature Tix of the location of the first electronic component, the current ambient temperature T0 of the external area of the device, and the limit values Tiy and Tix of the working temperature range corresponding to the first electronic component, and the change trend of the current ambient temperature T0 of the external area of the device, wherein the temperature control measures include temperature control processing and / or ventilation processing. Among them, the temperature control processing includes heating processing and cooling processing.

[0054] The humidity control strategy includes: according to the relationship between the humidity Hi at the location of the first electronic component, the current ambient humidity H0 in the external area of the device, and the limit values Hix and Hiy of the working humidity range corresponding to the first electronic component, and the change trend of the current ambient humidity H0 in the external area of the device, corresponding humidity control measures are set, and the humidity control measures include humidity control processing and / or ventilation processing

[0055] In an example, Figure 2 As shown, the temperature control strategy includes:

[0056] (1) When the temperature Ti at the location where the first electronic component is located is lower than the lower limit value Tix of the operating temperature range corresponding to the first electronic component, and the current ambient temperature T0 of the external area of the device is lower than the temperature Ti at the location where the first electronic component is located, heating the internal area of the device;

[0057] (2) When the temperature Ti at the location of the first electronic component is less than the lower limit value Tix of the operating temperature range corresponding to the first electronic component, and the current ambient temperature T0 of the external area of the device is greater than or equal to the temperature Ti at the location of the first electronic component and less than the lower limit value Tix of the operating temperature range corresponding to the first electronic component, and the trend of the ambient temperature T0 is cooling, the internal area of the device is heated;

[0058] (3) When the temperature Ti at the location of the first electronic component is less than the lower limit value Tix of the operating temperature range corresponding to the first electronic component, and the current ambient temperature T0 of the external area of the device is greater than or equal to the temperature Ti at the location of the first electronic component and less than the lower limit value Tix of the operating temperature range corresponding to the first electronic component, and the trend of the ambient temperature T0 is rising, the internal area of the device is ventilated;

[0059] (4) When the temperature Ti at the location of the first electronic component is less than the lower limit value Tix of the operating temperature range corresponding to the first electronic component, and the current ambient temperature T0 of the external area of the device is greater than or equal to the lower limit value Tix of the operating temperature range corresponding to the first electronic component, ventilate the internal area of the device;

[0060] (5) When the temperature Ti at the location of the first electronic component is greater than the upper limit Tiy of the operating temperature range corresponding to the first electronic component, and the current ambient temperature T0 of the external area of the device is less than the upper limit Tiy of the operating temperature range corresponding to the first electronic component, ventilating the internal area of the device;

[0061] (6) When the temperature Ti at the location of the first electronic component is greater than the upper limit Tiy of the operating temperature range corresponding to the first electronic component, the current ambient temperature T0 of the external area of the device is greater than or equal to the upper limit Tiy of the operating temperature range corresponding to the first electronic component and is less than the temperature Ti at the location of the first electronic component, and the ambient temperature T0 of the external area of the device tends to increase, cooling the internal area of the device;

[0062] (7) When the temperature Ti at the location of the first electronic component is greater than the upper limit Tiy of the working temperature range corresponding to the first electronic component, the current ambient temperature Ti of the external area of the device is greater than or equal to the upper limit Tiy of the working temperature range corresponding to the first electronic component and less than the temperature Ti at the location of the first electronic component, and the trend T0 of the ambient temperature of the external area of the device is cooling, ventilation treatment is performed on the internal area of the device;

[0063] (8) When the temperature Ti at the location of the first electronic component is greater than the upper limit value Tiy of the operating temperature range corresponding to the first electronic component, and the current ambient temperature T0 of the external area of the device is greater than or equal to the temperature Ti at the location of the first electronic component, the internal area of the device is cooled.

[0064] In an example, Figure 3 As shown, the humidity control strategy includes:

[0065] (1) When the humidity Hi at the location where the second electronic component is located is less than the lower limit value Hix of the working humidity range corresponding to the second electronic component, and the current ambient humidity H0 of the external area of the device is less than the humidity Hi at the location where the second electronic component is located, humidifying the internal area of the device;

[0066] (2) When the humidity Hi at the location where the second electronic component is located is less than the lower limit value Hix of the working humidity range corresponding to the second electronic component, and the current ambient humidity H0 of the external area of the device is greater than or equal to the humidity Hi at the location where the second electronic component is located and less than the lower limit value Hix of the working humidity range corresponding to the second electronic component, and the trend of the ambient humidity H0 is humidification, ventilation treatment is performed on the internal area of the device;

[0067] (3) When the humidity Hi at the location of the second electronic component is less than the lower limit value Hix of the working humidity range corresponding to the second electronic component, and the current ambient humidity H0 of the external area of the device is greater than or equal to the humidity Hi at the location of the second electronic component and less than the lower limit value Hix of the working humidity range corresponding to the second electronic component, and the trend of the ambient humidity H0 is a decrease in humidity, humidification treatment is performed on the internal area of the device;

[0068] (4) When the humidity Hi at the location of the second electronic component is less than the lower limit value Hix of the working humidity range corresponding to the second electronic component, and the current ambient humidity H0 of the external area of the device is greater than or equal to the lower limit value Hix of the working humidity range corresponding to the second electronic component, ventilate the internal area of the device;

[0069] (5) When the humidity Hi at the location of the second electronic component is greater than the upper limit value Hiy of the working humidity range corresponding to the second electronic component, and the current ambient humidity Hi of the external area of the device is less than the upper limit value Hiy of the working humidity range corresponding to the second electronic component, ventilating the internal area of the device;

[0070] (6) When the humidity Hi at the location where the second electronic component is located is greater than the upper limit value Hiy of the working humidity interval corresponding to the second electronic component, the current ambient humidity H0 of the external area of the device is greater than or equal to the upper limit value Hiy of the working humidity interval corresponding to the second electronic component and is less than the humidity Hi at the location where the second electronic component is located, and the trend of the ambient humidity H0 of the external area of the device is dehumidification, ventilation treatment is performed on the internal area of the device;

[0071] (7) When the humidity Hi at the location of the second electronic component is greater than the upper limit value Hiy of the working humidity interval corresponding to the second electronic component, the current ambient humidity H0 of the external area of the device is greater than or equal to the upper limit value Hiy of the working humidity interval corresponding to the second electronic component and is less than the humidity Hi at the location of the second electronic component, and the trend of the ambient humidity H0 of the external area of the device is humidification, dehumidification treatment is performed on the internal area of the device;

[0072] (8) When the humidity Hi at the location of the second electronic component is greater than the upper limit value Hiy of the working humidity range corresponding to the second electronic component, and the current ambient humidity H0 of the external area of the device is greater than or equal to the humidity Hi at the location of the second electronic component, the internal area of the device is dehumidified.

[0073] Specifically, the heating process and the cooling process can be achieved by controlling a temperature control device, which includes a heating device and a cooling device.

[0074] In some embodiments, the temperature control process includes:

[0075] Step S1, detecting whether a temperature control device for controlling the temperature of an internal area of the device is turned on;

[0076] Step S2, when the temperature control device is not turned on, controlling the temperature control device to control the temperature of the internal area of the device at the maximum working power of the temperature control device; when the temperature control device is turned on, controlling the temperature control device to maintain the current working power of the temperature control device to control the temperature of the internal area of the device;

[0077] Step S3, monitor the temperature of the location of each electronic component in the internal area of the device, and determine the temperature control time of the temperature control device according to the limit value of the working temperature range corresponding to each electronic component in the internal area of the device, the current temperature of the location of each electronic component, and the spatial volume of the internal area of the device.

[0078] Specifically, the temperature control time of the temperature control device is determined according to the limit value of the working temperature range corresponding to each electronic component in the internal area of the device, the temperature at the current location of each electronic component, and the spatial volume of the internal area of the device, including: determining the pre-control temperature of the temperature control device according to the limit value of the working temperature range corresponding to each electronic component in the internal area of the device and the temperature at the current location of each electronic component; and then determining the temperature control time of the temperature control device according to the pre-control temperature and the spatial volume of the internal area of the device.

[0079] In some embodiments, the step of heating the internal area of the device comprises:

[0080] Step S1, detecting whether a heating device for heating the internal area of the device is turned on.

[0081] Step S2, when the heating device is not turned on, controlling the heating device to heat the internal area of the equipment with the maximum working power of the heating device; when the heating device is turned on, controlling the heating device to maintain the current working power of the heating device to heat the internal area of the equipment.

[0082] Step S3, monitor the temperature of the position where each electronic component is currently located in the internal area of the device, and determine the heating time of the heating device according to the lower limit value of the working temperature range corresponding to each electronic component in the internal area of the device, the current temperature of the position where each electronic component is located, and the spatial volume of the internal area of the device.

[0083] Specifically, the determining the heating time of the heating device according to the lower limit of the working temperature range corresponding to each of the electronic components in the internal area of the device, the current temperature of each of the electronic components, and the spatial volume of the internal area of the device includes: determining the heating temperature of the heating device according to the lower limit of the working temperature range corresponding to each of the electronic components in the internal area of the device and the current temperature of each of the electronic components. Determining the heating time of the heating device according to the heating temperature and the spatial volume of the internal area of the device.

[0084] In some embodiments, the cooling process of the internal area of the device includes:

[0085] Step S1, detecting whether a cooling device for cooling the internal area of the device is turned on.

[0086] Step S2: when the cooling device is not turned on, control the cooling device to cool the internal area of the equipment with the maximum working power of the cooling device; when the cooling device is turned on, control the cooling device to maintain the current working power of the cooling device to cool the internal area of the equipment.

[0087] Step S3, monitor the temperature of the location of each electronic component in the internal area of the device, and determine the cooling time of the cooling device according to the upper limit value of the working temperature range corresponding to each electronic component in the internal area of the device, the current temperature of the location of each electronic component, and the spatial volume of the internal area of the device.

[0088] In a specific implementation, the cooling time of the cooling device is determined based on the upper limit value of the working temperature range corresponding to each of the electronic components in the internal area of the device, the temperature at the current location of each of the electronic components, and the spatial volume of the internal area of the device, including: determining the cooling temperature of the cooling device based on the upper limit value of the working temperature range corresponding to each of the electronic components in the internal area of the device and the temperature at the current location of each of the electronic components; determining the cooling time of the cooling device based on the cooling temperature and the spatial volume of the internal area of the device.

[0089] In some embodiments, the ventilating the internal area of the device includes: opening the vents in the internal area of the device, and monitoring the temperature and humidity of the locations of the electronic components in the internal area of the device. When the temperatures of the locations of the electronic components in the internal area of the device are within the corresponding operating temperature range of the electronic components, and the humidity of the locations of the electronic components in the internal area of the device are within the corresponding operating humidity range of the electronic components, the vents in the internal area of the device are closed.

[0090] Specifically, the humidification process and the dehumidification process can be achieved by controlling a humidity control device. The humidity control device includes a humidification device and a dehumidification device.

[0091] In some embodiments, the humidity control process includes

[0092] Detecting whether a humidity control device for controlling the humidity of an internal area of the device is turned on;

[0093] When the humidity control device is not turned on, the humidity control device is controlled to control the humidity of the internal area of the device at the maximum working power of the humidity control device; when the humidity control device is turned on, the humidity control device is controlled to maintain the current working power of the humidity control device to control the humidity of the internal area of the device;

[0094] Monitor the humidity at the locations of the electronic components currently located in the internal area of the device, and determine the humidity control time of the humidity control device based on the limit values of the working humidity ranges corresponding to the electronic components in the internal area of the device, the humidity at the locations of the electronic components currently located, and the spatial volume of the internal area of the device.

[0095] Specifically, the humidity control time of the humidity control device is determined according to the limit value of the working humidity range corresponding to each electronic component in the internal area of the device, the humidity at the current location of each electronic component, and the spatial volume of the internal area of the device, including: determining the pre-control humidity of the humidity control device according to the limit value of the working humidity range corresponding to each electronic component in the internal area of the device and the humidity at the current location of each electronic component, wherein the pre-control humidity includes pre-humidification humidity or pre-dehumidification humidity; and then determining the humidity control time of the humidity control device according to the pre-control humidity and the spatial volume of the internal area of the device.

[0096] In some embodiments, the humidifying the internal area of the device includes:

[0097] Step S1, detecting whether a humidifying device for humidifying the internal area of the device is turned on;

[0098] Step S2, when the humidifying device is not turned on, controlling the humidifying device to humidify the internal area of the device at the maximum working power of the humidifying device; when the humidifying device is turned on, controlling the humidifying device to maintain the current working power of the humidifying device to humidify the internal area of the device;

[0099] Step S3, monitor the humidity at the locations of the electronic components in the internal area of the device, and determine the humidification time of the humidification device according to the lower limit value of the working humidity range corresponding to the electronic components in the internal area of the device, the humidity at the locations of the electronic components, and the spatial volume of the internal area of the device.

[0100] In some embodiments, the dehumidifying the internal area of the device includes:

[0101] Step S1, detecting whether a dehumidification device for dehumidifying an internal area of the device is turned on;

[0102] Step S2, when the dehumidifier is not turned on, controlling the dehumidifier to dehumidify the internal area of the device at the maximum working power of the dehumidifier; when the dehumidifier is turned on, controlling the dehumidifier to maintain the current working power of the dehumidifier to dehumidify the internal area of the device;

[0103] Step S3, monitor the humidity at the location of each electronic component in the internal area of the device, and determine the dehumidification time of the dehumidification device according to the upper limit value of the working humidity range corresponding to each electronic component in the internal area of the device, the humidity at the current location of each electronic component, and the spatial volume of the internal area of the device.

[0104] This embodiment obtains the temperature and humidity of each electronic component in the internal area of the device; and determines whether the temperature and humidity of each electronic component are beyond the corresponding working temperature range and working humidity range of the electronic component; when the temperature of the first electronic component exceeds the working temperature range of the first electronic component, according to the current ambient temperature of the external area of the device and the change trend of the ambient temperature, according to the preset temperature control strategy, the temperature control operation is performed on the internal area of the device to control the temperature in the internal area of the device within the working temperature range corresponding to the first electronic component; when the humidity of the second electronic component exceeds the working humidity range of the second electronic component, according to the current ambient humidity of the external area of the device and the change trend of the ambient humidity, according to the preset humidity control strategy, the humidity control operation is performed on the internal area of the device to control the humidity in the internal area of the device within the working humidity range corresponding to the second electronic component. Thus, this embodiment can adjust the temperature and humidity of the environment inside the device to ensure that the electronic components inside the device work within the normal temperature and humidity range.

[0105] Embodiment 2:

[0106] Another embodiment of the present application relates to a device for adjusting the internal environmental state of a device. The implementation details of the device for adjusting the internal environmental state of the device of this embodiment are specifically described below. The following content is only the implementation details provided for the convenience of understanding and is not necessary for the implementation of this solution. The device for adjusting the internal environmental state of the device of this embodiment includes a temperature and humidity monitoring module, a temperature control module and a humidity control module.

[0107] The temperature and humidity monitoring module is used to obtain the temperature and humidity of each electronic component in the internal area of the device;

[0108] a temperature control module, configured to determine whether the temperature at the location of each electronic component exceeds the operating temperature range of the corresponding electronic component, and when the temperature at the location of a first electronic component exceeds the operating temperature range of the first electronic component, perform temperature control operations on the internal area of the device according to the current ambient temperature of the external area of the device and the change trend of the ambient temperature and a preset temperature control strategy, so as to control the temperature in the internal area of the device within the operating temperature range corresponding to the first electronic component;

[0109] A humidity control module is used to determine whether the humidity at the location of the electronic component exceeds the corresponding working humidity range of the electronic component; when the humidity at the location of the second electronic component exceeds the working humidity range of the second electronic component, according to the current ambient humidity of the external area of the device and the changing trend of the ambient humidity, according to a preset humidity control strategy, a humidity control operation is performed on the internal area of the device to control the humidity in the internal area of the device within the working humidity range corresponding to the second electronic component.

[0110] It is worth mentioning that all modules involved in this embodiment are logic modules. In practical applications, a logic unit can be a physical unit, a part of a physical unit, or a combination of multiple physical units. In addition, in order to highlight the innovative part of this application, this embodiment does not introduce units that are not closely related to solving the technical problems proposed by this application, but this does not mean that there are no other units in this embodiment.

[0111] Embodiment three:

[0112] Another embodiment of the application relates to a meal cabinet. The implementation details of the meal cabinet of this embodiment are described in detail below. The following content is only for the convenience of understanding the implementation details and is not necessary for the implementation of this solution. The meal cabinet of this embodiment includes a cabinet body and a temperature and humidity sensor, a heating device, a cooling device, a dehumidification device, a humidification device and a device for adjusting the internal environmental state of the equipment as described in the above embodiments, arranged in the cabinet body, wherein the temperature and humidity sensor, the heating device, the cooling device, the dehumidification device and the humidification device are all communicatively connected to the temperature and humidity controller.

[0113] Specifically, the cabinet body is divided into a commodity area, a cooling device area, a heating device area, a dehumidification device area, a controller area, etc., wherein the commodity area is further divided into a display area and a storage area, which is located in the front position of the food cabinet, while the cooling device area and the dehumidification device area are located in the rear position of the food cabinet, the heating device area is located at the delivery port, and the controller area is located behind the screen.

[0114] In a specific application embodiment, Figure 4 As shown, the cooling device includes a compressor, a condenser, an expansion valve, an evaporator, a return air duct, a fan, etc. Based on the thermodynamic cycle process, the commodity area space is cooled by absorbing and releasing heat, and the low temperature environment inside the commodity area is maintained through the continuous operation of the compressor.

[0115] The dehumidification device includes a solid dehumidifier with an external electric field, a three-way valve airbag, a drain port and other devices. A dehumidifier with good electroosmosis and dehumidification properties, such as zeolite, or a solid dehumidifier composed of a dehumidification material and an electroosmosis material is used to regenerate the solid dehumidifier through the electroosmosis effect, that is, while the solid dehumidifier absorbs moisture from the air, the absorbed moisture is removed by the electroosmosis effect, thereby maintaining the continuous dehumidification ability of the dehumidifier without adding additional electrolyte.

[0116] The cooling device area and the heating device area are each provided with an air outlet connected to the controller area, and switches are provided at the cooling device end and the heating device end to control opening and closing. The three-way valve airbag in the dehumidification device is respectively controlled by the switch to be connected to the solid dehumidifier of the dehumidification device, the air outlet of the cooling device area, and the drain outlet of the dehumidification device area.

[0117] like Figure 5 As shown, the controller area includes a CPU, a communication module, a display module, a temperature and humidity monitoring module, a refrigeration module, a heating module, a dehumidification module, a temperature and humidity control module, a ventilation control module, a dehumidification control module, a hot air control module and a cold air control module. The communication module, the temperature and humidity monitoring module, the temperature and humidity control module, the heating module and the refrigeration module are connected to the CPU in communication. The ventilation control module, the dehumidification control module, the hot air control module and the cold air control module are connected to the temperature and humidity control module. The refrigeration module controls the operation of the refrigeration device, the heating module controls the operation of the heating device, the temperature and humidity monitoring module monitors the temperature and humidity of multiple key electronic components inside the equipment and the ambient temperature and humidity of the external area of the equipment, and the temperature and humidity control module controls the opening of hot air, cold air, ventilation and dehumidification functions through multiple switches. The hot air function uses a heating device to turn on the hot air; the cold air function is realized by the fan of the refrigeration device; the ventilation module opens the vents to realize internal and external air convection; the dehumidification function adopts electroosmotic regeneration solid dehumidification technology, and the humidification function is realized by cold air and water stored in the dehumidification module.

[0118] The key electronic component areas in the control area are equipped with high-precision temperature sensors and humidity sensors. Intelligent temperature and humidity controllers are used to sense the ambient temperature and humidity of each sensor in real time. According to the known working temperature range and working humidity range of each electronic component, such as the working temperature range T1x~T1y and working humidity range H1x~H1y of the electronic component where sensor 1 is located, the working temperature range T2x~T2y and working humidity range H2x~H2y of the electronic component where sensor 2 is located, and the working temperature range Tnx~Tny and working humidity range Hnx~Hny of the electronic component where sensor n is located. The temperature of the sensor monitoring point in the key electronic component area is Ti=(T1, T2,…, Tn), and the humidity is Hi=(H1, H2,…, Hn). The temperature of the external sensor monitoring point is T0, and the humidity is H0.

[0119] like Figure 2 and Figure 4 As shown, the temperature control process is as follows: monitor the sensor temperature Ti in real time. When Tix≤Ti≤Tiy, continue monitoring. When the temperature of the monitoring point is not within Tix≤Ti≤Tiy, check the external temperature T0 and make judgments and processing according to several situations.

[0120] 1-1. When Ti<Tix, that is, the ambient temperature Ti inside the device is too low, check the ambient temperature T0 outside the device.

[0121] 1-2. When T0<Ti, that is, the ambient temperature T0 of the external area of the equipment is lower than the ambient temperature Ti inside the equipment, start the hot air function, turn on the switch K12 at the heating device, confirm that the heating function is turned on, and blow hot air to the controller area. If the current heating function is already turned on, heat it with the current working power, and monitor the ambient temperature Ti inside the equipment at the same time. If the current heating function has just been turned on, heat it with the maximum working power, and determine the heating temperature according to the value of a, a=min(T1x-T1, T2x-T2,…, Tnx-Tn)<0, and then determine the space size according to the space volume of the controller area, and combine the determined heating temperature and the space volume of the controller area to determine the heating time. When a≥0, turn off K12.

[0122] 1-3. When T0 ≥ Tix, that is, the ambient temperature T0 of the external area of the device is higher than the lowest temperature Tix of the operating temperature range of the electronic components inside the device, the ventilation function is started, and the air convection is achieved by turning on the vent switch. The ambient temperature Ti and ambient humidity Hi inside the device are monitored, and K0 is turned off when the ambient temperature Ti and ambient humidity Hi inside the device meet the temperature and humidity working requirements of the electronic components.

[0123] 1-4. When Ti≤T0<Tix, that is, the ambient temperature T0 of the external area of the equipment is higher than the ambient temperature inside the equipment and lower than the lowest temperature Tix of the operating temperature range of the electronic components inside the equipment, then check the change trend of the external ambient temperature T0. If the trend is heating up, start the ventilation function; if the trend is cooling down, start the hot air function. The specific measures are the same as 1-2 or 1-3.

[0124] 2-1. When Ti>Tiy, that is, the ambient temperature Ti inside the device is too high, check the ambient temperature T0 outside the device.

[0125] 2-2. When T0<Tiy, that is, the ambient temperature T0 of the external area of the equipment is lower than the highest temperature Tiy of the operating temperature range of the electronic components inside the equipment, the ventilation function is started, and the air convection is achieved by turning on the vent switch. The ambient temperature Ti and ambient humidity Hi inside the equipment are monitored, and K0 is turned off when both the ambient temperature Ti and ambient humidity Hi meet the temperature and humidity working requirements of the electronic components.

[0126] 2-3. When T0≥Ti, that is, the ambient temperature T0 of the external area of the equipment is higher than the ambient temperature Ti inside the equipment, start the cold air function, turn on the switch K11 at the fan device, confirm that the fan function is turned on, and blow cold air to the controller area. If the current fan function is already turned on, cool down with the current working power, and monitor the ambient temperature Ti inside the equipment at the same time. If the current fan function has just been turned on, cool down with the maximum working power, and determine the cooling temperature according to the size of the b value, b=max(T1-T1y, T2-T2y,…, Tn-Tny)>0, and then determine the space size according to the space volume of the controller area, so as to determine the cooling time according to the determined cooling temperature and the space volume of the controller area, and turn off K11 when b≤0.

[0127] 2-4. When Tiy<T0≤Ti, that is, the ambient temperature T0 of the equipment's external area is higher than the highest temperature Tiy of the operating temperature range of the electronic components inside the equipment and lower than the ambient temperature Ti inside the equipment, then check the change trend of the ambient temperature T0 of the equipment's external area. If the trend is a temperature increase, start the cooling function; if the trend is a temperature decrease, start the ventilation function. The specific measures are the same as 2-2 or 2-3.

[0128] like Figure 3 and Figure 4 As shown, the humidity control process is as follows: monitor the sensor temperature Ti in real time. When Hix≤Hi≤Hiy, continue monitoring. When the humidity at the monitoring point is not within the range of Hix≤Hi≤Hiy, check the external humidity H0 and make judgments and processing according to several situations.

[0129] 3-1. When Hi<Hix, that is, the ambient humidity Hi inside the device is too low, check the ambient humidity H0 outside the device.

[0130] 3-2. When H0<Hi, that is, the ambient humidity H0 in the area outside the device is lower than the ambient humidity Hi inside the device, the humidification function is started, and the switch K2 of the three-way valve airbag in the dehumidification device (the switches K1 and K3 are closed by default at this time) is turned on, and the moisture is transferred to the fan outlet through the guide tube, and the humidified air is blown to the controller area through the fan. If the current fan function is already turned on, humidification is performed at the current working power. If the current fan function is not turned on, humidification is performed at the maximum working power. At the same time, the humidity is monitored, and the humidity to be increased is determined according to the size of the c value, c=min(H1x-H1, H2x-H2,…, Hnx-Hn)<0, and then the space size is determined according to the space volume of the controller area, so as to determine the humidification time according to the determined humidity to be increased and the space volume of the controller area. When c≥0, the switches K2 and K11 are turned off, that is, the humidification function is turned off.

[0131] 3-3. When H0≥Tix, that is, the ambient humidity H0 in the area outside the device is higher than the lowest humidity Hix of the working humidity range of the electronic components inside the device, the ventilation function is started, and the air convection is achieved by turning on the vent switch. The ambient temperature Ti and ambient humidity Hi inside the device are monitored, and K0 is turned off when the ambient temperature Ti and ambient humidity Hi inside the device meet the temperature and humidity working requirements of the electronic components.

[0132] 3-4. When Hi≤H0<Hix, that is, the ambient humidity H0 in the external area of the equipment is higher than the ambient humidity Hi inside the equipment and lower than the lowest humidity Hix of the working humidity range of the electronic components inside the equipment, then check the change trend of the external ambient humidity H0. If the trend is humidification, start the ventilation function; if the trend is dehumidification, start the humidification function. The specific measures are the same as 3-2 or 3-3.

[0133] 4-1. When Hi>Hiy, that is, the ambient humidity Hi inside the device is too high, check the ambient humidity H0 outside the device.

[0134] 4-2. When H0<Hiy, that is, the ambient humidity H0 in the area outside the device is lower than the highest humidity Hiy in the working humidity range of the electronic components inside the device, the ventilation function is started, and the air convection is achieved by turning on the vent switch. The ambient humidity Hi and ambient humidity Hi inside the device are monitored, and K0 is turned off when both ambient humidity Hi and ambient humidity Hi meet the temperature and humidity working requirements of the electronic components.

[0135] 4-3. When H0≥Hi, that is, the ambient humidity H0 in the area outside the device is higher than the ambient humidity Hi inside the device, the dehumidification function is started. Dehumidification is performed by starting the dehumidification device, that is, starting the external electric field of the solid dehumidifier. At the same time, the switch K1 of the three-way valve airbag is turned on (the switches K2 and K3 are closed by default at this time), and the moisture removed from the solid dehumidifier by the electroosmotic effect enters the airbag through the guide tube. When the airbag is full, the switch K3 is turned on to discharge it from the drain port. When the drainage reaches the critical value, the switch K3 is turned off, that is, a certain amount of moisture is always kept in the airbag for humidification. At the same time, the humidity is monitored, and the humidity to be reduced is determined according to the size of the d value, d=max(H1x-H1,H2x-H2,…,Hnx-Hn)>0, and then the space size is determined according to the space volume of the controller area, so as to determine the dehumidification time according to the determined humidity to be reduced and the space volume of the controller area. When d≤0, the switch K1 is turned off, that is, the dehumidification function is turned off.

[0136] 4-4. When Hiy<H0≤Hi, that is, the ambient humidity H0 in the area outside the equipment is higher than the highest humidity Hiy in the working humidity range of the electronic components inside the equipment and lower than the ambient humidity Hi inside the equipment, then check the change trend of the ambient humidity H0 in the area outside the equipment. If the trend is humidification, start the dehumidification function; if the trend is dehumidification, start the ventilation function. The specific measures are the same as 4-2 or 4-3.

[0137] Embodiment 4:

[0138] Another embodiment of the present application relates to an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method for adjusting the internal environmental state of the device in the above-mentioned embodiments.

[0139] Among them, the memory and the processor are connected in a bus manner, and the bus may include any number of interconnected buses and bridges, and the bus connects various circuits of one or more processors and memories together. The bus can also connect various other circuits such as peripherals, voltage regulators, and power management circuits, which are well known in the art and are therefore not further described herein. The bus interface provides an interface between the bus and the transceiver. The transceiver can be one element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices on a transmission medium. The data processed by the processor is transmitted on a wireless medium via an antenna, and further, the antenna also receives data and transmits the data to the processor.

[0140] The processor is responsible for managing the bus and general processing, and can also provide various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions. Memory can be used to store data used by the processor when performing operations.

[0141] Embodiment five:

[0142] Another embodiment of the present application relates to a computer-readable storage medium storing a computer program, which implements the above method embodiment when executed by a processor.

[0143] That is, those skilled in the art can understand that all or part of the steps in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a program, and the program is stored in a storage medium, including a number of instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as: ROM), random access memory (Random Access Memory, referred to as: RAM), disk or optical disk and other media that can store program codes.

[0144] Those skilled in the art will appreciate that the above embodiments are specific embodiments for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. A method for adjusting the internal environmental state of a device, characterized in that: include: Obtain the temperature and humidity of each electronic component in the internal area of the device; Determine whether the temperature and humidity at the location of each electronic component exceed the corresponding operating temperature range and operating humidity range of the electronic component; When the temperature at the location of the first electronic component exceeds the operating temperature range of the first electronic component, according to the current ambient temperature of the external area of the device and the change trend of the ambient temperature, the temperature control operation is performed on the internal area of the device according to a preset temperature control strategy, so as to control the temperature in the internal area of the device within the operating temperature range corresponding to the first electronic component; When the humidity at the location of the second electronic component exceeds the working humidity range of the second electronic component, the humidity control operation is performed on the internal area of the device according to the current ambient humidity of the external area of the device and the changing trend of the ambient humidity and a preset humidity control strategy to control the humidity in the internal area of the device within the working humidity range corresponding to the second electronic component.

2. The method for adjusting the internal environment state of a device according to claim 1, characterized in that: The temperature control strategy includes: Based on the relationship between the temperature of the location of the first electronic component, the current ambient temperature of the external area of the device and the limit value of the working temperature range corresponding to the first electronic component, and the change trend of the current ambient temperature of the external area of the device, corresponding temperature control measures are set, and the temperature control measures include temperature regulation processing and / or ventilation processing.

3. The method for adjusting the internal environment state of a device according to claim 2, characterized in that: The temperature control process comprises: Detecting whether a temperature control device for controlling the temperature of an internal area of the device is turned on; When the temperature control device is not turned on, the temperature control device is controlled to control the temperature of the internal area of the device at the maximum working power of the temperature control device; when the temperature control device is turned on, the temperature control device is controlled to maintain the current working power of the temperature control device to control the temperature of the internal area of the device; Monitor the temperature of the location of each electronic component in the current internal area of the device, and determine the temperature control time of the temperature control device according to the limit value of the working temperature range corresponding to each electronic component in the internal area of the device, the current temperature of the location of each electronic component, and the spatial volume of the internal area of the device.

4. The method for adjusting the internal environment state of a device according to claim 3, characterized in that: The determining the temperature control time of the temperature control device according to the limit value of the working temperature range corresponding to each of the electronic components in the internal area of the device, the current temperature of each electronic component at a location, and the spatial volume of the internal area of the device includes: Determining the pre-control temperature of the temperature control device according to the limit value of the working temperature range corresponding to each of the electronic components in the internal area of the device and the current temperature of the location of each of the electronic components; The temperature control time of the temperature control device is determined according to the pre-controlled temperature and the spatial volume of the internal area of the equipment.

5. The method for adjusting the internal environment state of a device according to claim 1, characterized in that: The humidity control strategy includes: According to the relationship between the humidity at the location of the first electronic component, the current ambient humidity of the external area of the device and the limit value of the working humidity range corresponding to the first electronic component, and the changing trend of the current ambient humidity in the external area of the device, corresponding humidity control measures are set, and the humidity control measures include humidity control processing and / or ventilation processing.

6. The method for adjusting the internal environment state of a device according to claim 5, characterized in that: The humidity control process includes Detecting whether a humidity control device for controlling the humidity of an internal area of the device is turned on; When the humidity control device is not turned on, the humidity control device is controlled to control the humidity of the internal area of the device at the maximum working power of the humidity control device; when the humidity control device is turned on, the humidity control device is controlled to maintain the current working power of the humidity control device to control the humidity of the internal area of the device; Monitor the humidity at the locations of the electronic components currently located in the internal area of the device, and determine the humidity control time of the humidity control device based on the limit values of the working humidity ranges corresponding to the electronic components in the internal area of the device, the humidity at the locations of the electronic components currently located, and the spatial volume of the internal area of the device.

7. The method for adjusting the internal environment state of a device according to claim 6, characterized in that: The step of determining the humidity control time of the humidity control device according to the limit value of the working humidity range corresponding to each of the electronic components in the internal area of the device, the humidity at the current location of each of the electronic components, and the spatial volume of the internal area of the device includes: Determining the pre-controlled humidity of the humidity control device according to the limit value of the working humidity range corresponding to each of the electronic components in the internal area of the device and the humidity at the current location of each of the electronic components; The humidity control time of the humidity control device is determined according to the pre-controlled humidity and the spatial volume of the internal area of the equipment.

8. The method for adjusting the internal environment state of a device according to claim 2 or 5, characterized in that: The ventilation treatment comprises: Opening the vents in the internal area of the device, and monitoring the temperature and humidity of each electronic component in the internal area of the device; When the temperatures at the locations of the electronic components in the internal area of the device are all within the corresponding operating temperature range of the electronic components, and the humidity at the locations of the electronic components in the internal area of the device are all within the corresponding operating humidity range of the electronic components, the vents in the internal area of the device are closed.

9. A device for adjusting the internal environmental state of a device, characterized in that: include: The temperature and humidity monitoring module is used to obtain the temperature and humidity of each electronic component in the internal area of the device; a temperature control module, configured to determine whether the temperature at the location of each electronic component exceeds the operating temperature range of the corresponding electronic component, and when the temperature at the location of a first electronic component exceeds the operating temperature range of the first electronic component, perform temperature control operations on the internal area of the device according to the current ambient temperature of the external area of the device and the change trend of the ambient temperature and a preset temperature control strategy, so as to control the temperature in the internal area of the device within the operating temperature range corresponding to the first electronic component; A humidity control module is used to determine whether the humidity at the location of the electronic component exceeds the corresponding working humidity range of the electronic component; when the humidity at the location of the second electronic component exceeds the working humidity range of the second electronic component, according to the current ambient humidity of the external area of the device and the changing trend of the ambient humidity, according to a preset humidity control strategy, a humidity control operation is performed on the internal area of the device to control the humidity in the internal area of the device within the working temperature range corresponding to the second electronic component.

10. A dining cabinet, characterized in that: It includes a cabinet body and a temperature and humidity sensor, a heating device, a cooling device, a dehumidifying device, a humidifying device and a device for adjusting the internal environmental state of the equipment as described in claim 8, wherein the temperature and humidity sensor, the heating device, the cooling device, the dehumidifying device and the humidifying device are all communicatively connected with the temperature and humidity controller.

11. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method for adjusting the internal environmental state of a device as described in any one of claims 1 to 8.

12. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for adjusting the internal environmental state of a device according to any one of claims 1 to 8 is implemented.