A piezoelectric array adaptive oscillation acceleration off-site edge ablation suppression method and device

Abstract

The present invention provides a method and device for suppressing edge ablation of a piezoelectric array adaptive oscillation acceleration off-position, and relates to the field of methods for suppressing edge ablation of an oscillation acceleration off-position. The method is based on a piezoelectric array adaptive oscillation acceleration off-position edge ablation method, comprising: S1, constructing a three-dimensional model of a piezoelectric element: using computer-aided design software, constructing a three-dimensional geometric model of the piezoelectric element, simulating its actual geometric shape and material properties, so as to perform detailed mechanical analysis. By defining the mechanical and electrical parameters of the piezoelectric material, inputting basic parameters such as Young's modulus, Poisson's ratio, piezoelectric constant and dielectric constant, ensuring that the basic data of the simulation is complete and reliable, and establishing the dynamic response equation of the piezoelectric element: using the piezoelectric coupling equation to accurately describe the dynamic response of the piezoelectric element under high-frequency oscillation conditions, ensuring the accuracy and precision of the simulation.

Description

Technical Field

[0001] The present invention relates to the technical field of methods for suppressing edge ablation during oscillation acceleration and off-site operation, and in particular to a method for suppressing edge ablation during self-adaptive oscillation acceleration and off-site operation of a piezoelectric array. Background Art

[0002] The precision machining of difficult-to-machine materials commonly used in the aerospace and nuclear industries faces many technical challenges. As a green processing method that does not strongly rely on the machinability of the material, laser processing technology has shown great potential in the surface manufacturing process of difficult-to-machine materials. However, the first pulse effect and inertial effects of ultrafast lasers can lead to heat accumulation and edge overburning, thus affecting the processing accuracy and surface quality. To solve these problems, in addition to optimizing the laser process parameters, the selective micro-vibration of the target surface can effectively match the thermal effect of the laser pulse in both time and space dimensions, thereby significantly suppressing forming defects.

[0003] The piezoelectric array adaptive oscillation acceleration off-site edge ablation suppression method consists of the following parts: Piezoelectric array: composed of multiple piezoelectric elements, usually arranged in a matrix form. Each piezoelectric element has an independent driving circuit that can individually adjust its oscillation frequency and amplitude. Control system: includes sensors, signal processing units and control algorithms. The sensor is used to monitor the status of the ablation area in real time, the signal processing unit converts the sensor data into usable control signals, and the control algorithm dynamically adjusts the oscillation parameters of each piezoelectric element based on these signals. Driving circuit: provides electrical energy to the piezoelectric element and adjusts the electric field strength according to the instructions of the control system, thereby changing the vibration mode of the piezoelectric element. Feedback loop: used to continuously monitor the operating status of the system to ensure that the oscillation effect of the piezoelectric array matches the ablation suppression requirements. By utilizing the characteristic of piezoelectric materials to deform under the action of an electric field, edge ablation is suppressed by precisely controlling the oscillation behavior of each piezoelectric element.

[0004] Although this method has shown significant advantages in suppressing edge ablation, it still has some drawbacks that cannot be ignored: piezoelectric elements may face material fatigue and performance degradation under high-frequency oscillation and long-term operation conditions. This will lead to a decrease in the overall reliability and life of the system. The piezoelectric array structure is complex, and each piezoelectric element requires an independent drive circuit and a precise control system. The performance of piezoelectric elements is sensitive to environmental factors such as temperature and humidity changes. In high temperature or high humidity environments, the motor performance of the piezoelectric material may change, resulting in a weakened oscillation effect and a decrease in the suppression effect of the system. Summary of the Invention

[0005] (1) Technical problems solved

[0006] In response to the shortcomings of the existing technology, the present invention provides a method and device for suppressing off-site edge erosion of a piezoelectric array through adaptive oscillation acceleration, which solves the problem that piezoelectric elements may face material fatigue and performance degradation under high-frequency oscillation and long-term operation conditions; the performance of piezoelectric elements is more sensitive to environmental factors such as temperature and humidity changes. In high temperature or high humidity environments, the motor performance of piezoelectric materials may change, resulting in a weakened oscillation effect and a decrease in the suppression effect of the system.

[0007] (2) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: A method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array, comprising:

[0009] S1. Build a 3D model of the piezoelectric element: Use computer-aided design software to build a 3D geometric model of the piezoelectric element, simulating its actual geometry and material properties for detailed mechanical analysis.

[0010] S2. Define the mechanical and electrical parameters of the piezoelectric material: Input the Young's modulus, Poisson's ratio, piezoelectric constant, and dielectric constant parameters of the piezoelectric material. These parameters are the basic data for simulating the behavior of the piezoelectric element.

[0011] S3. Establish the dynamic response equation of the piezoelectric element: Use the piezoelectric coupling equation to express the dynamic response of the piezoelectric element under high-frequency oscillation conditions. The formula is:

[0012] D=d·E+e·S

[0013] T=c·Se T ·E

[0014] Where D is the electric displacement, E is the electric field, T is the stress, S is the strain, d is the dielectric constant, e is the piezoelectric constant, and c is the elastic constant;

[0015] S4. Set boundary conditions and initial conditions: Define the operating environment of the piezoelectric element, including fixed constraints and free boundary conditions, as well as initial displacement and initial velocity, to simulate actual working conditions;

[0016] S5. Use finite element analysis software for dynamic simulation: Use ANSYS, COMSOL or Abaqus to perform dynamic simulation of the piezoelectric element under high-frequency oscillation conditions to obtain its stress, strain and electric field distribution;

[0017] S6. Introducing material fatigue model: Based on the SN curve or Paris fatigue crack growth model, the fatigue behavior of piezoelectric elements during long-term operation is simulated. The formula is:

[0018]

[0019] Where N is fatigue life, σ a is the stress amplitude, σ′ f is the fatigue strength coefficient, b is the fatigue strength index;

[0020] S7. Calibrate the material fatigue model using experimental data: Use stress-strain curves and fatigue life data to calibrate the material fatigue model to ensure the accuracy of the simulation results;

[0021] S8. Conduct environmental factor impact analysis: Simulate and analyze the performance of piezoelectric components under different environmental conditions, including -20°C to 150°C to evaluate the impact of environmental factors on their performance;

[0022] S9. Comparison of performance changes under different environmental conditions: Through simulation analysis, the performance changes of piezoelectric elements under different temperature and humidity conditions are compared to evaluate their stability and durability.

[0023] S10. Generate performance curves and provide fatigue life prediction: Generate stress-strain curves, frequency response curves, and fatigue life curves based on simulation results, and provide fatigue life predictions for piezoelectric components under different operating conditions;

[0024] S11. Export simulation results and generate a test report: Export the simulation analysis results to generate a detailed test report, including performance evaluation and life prediction, to provide a reference for the design and optimization of the piezoelectric array system.

[0025] S12. Use the test report results to optimize the design parameters of the piezoelectric element to improve its reliability and durability in actual operation.

[0026] Preferably, the dynamic response equation is expressed using a piezoelectric coupling equation to accurately describe the deformation behavior of the piezoelectric element under the action of an electric field.

[0027] Preferably, the initial conditions include initial displacement and initial velocity to set the initial state of the piezoelectric element at the beginning of the simulation.

[0028] Preferably, the material fatigue model is based on the SN curve or the Paris fatigue crack growth model to simulate the fatigue behavior of the piezoelectric element during long-term operation.

[0029] Preferably, the simulation analysis results are used to adjust the driving circuit parameters of the piezoelectric element to improve its stability under high-frequency oscillation conditions.

[0030] Preferably, the simulation analysis results are used to design an environmental control system to keep the piezoelectric array system running under stable temperature and humidity conditions to ensure its optimal performance.

[0031] Preferably, the boundary conditions include fixed constraints and free boundaries to simulate the operating state of the piezoelectric element in an actual working environment.

[0032] A piezoelectric array adaptive oscillation acceleration off-position edge ablation suppression device, the piezoelectric array: includes a plurality of piezoelectric elements arranged in a matrix form, each of the piezoelectric elements can work independently and oscillate according to a control signal;

[0033] Driving circuit: used to provide the required electrical energy to the piezoelectric element, and can accurately adjust the electric field strength of each piezoelectric element, thereby controlling its oscillation frequency and amplitude;

[0034] Sensor module: used to monitor the status of the ablation area in real time, including temperature, humidity, stress and strain parameters;

[0035] Signal processing unit: converts sensor data into usable control signals and performs data analysis and processing;

[0036] Housing and bracket: used to fix the piezoelectric array and related electronic components, provide structural support and protection, and ensure stable operation of the equipment in harsh environments;

[0037] Temperature control module: used to monitor and adjust the temperature around the system to ensure that the piezoelectric element operates within the optimal temperature range;

[0038] Humidity control module: used to monitor and adjust the humidity around the system to prevent excessively high or low humidity from affecting the performance of piezoelectric elements;

[0039] Interface module: used for communication and data exchange with external devices and systems, including data transmission interface and power supply interface.

[0040] (3) Beneficial effects

[0041] The present invention provides a method and device for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array. This method has the following beneficial effects:

[0042] Define the mechanical and electrical parameters of the piezoelectric material, input basic parameters such as Young's modulus, Poisson's ratio, piezoelectric constant, and dielectric constant to ensure that the basic data of the simulation is complete and reliable, establish the dynamic response equation of the piezoelectric element: use the piezoelectric coupling equation to accurately describe the dynamic response of the piezoelectric element under high-frequency oscillation conditions to ensure the accuracy and precision of the simulation, set boundary conditions and initial conditions: define fixed constraints and free boundaries in the operating environment, as well as initial displacement and initial velocity, to ensure that the simulation conditions meet the actual working environment, introduce material fatigue model: based on the SN curve or Paris fatigue crack growth model, simulate fatigue behavior during long-term operation and provide fatigue life prediction, calibrate the material fatigue model through experimental data: use stress-strain curves and fatigue life data to calibrate the model to ensure the accuracy of the simulation results, compare performance changes under different environmental conditions: analyze the performance changes under different temperature and humidity conditions through simulation, evaluate its stability and durability, generate performance curves and provide fatigue life prediction: generate stress-strain curves, frequency response curves, and fatigue life curves to provide reliable data for design optimization. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the process structure of the present invention;

[0044] Figure 2 Schematic diagram of the edge ablation suppression principle of the present invention;

[0045] Figure 3 Schematic diagram of an example piezoelectric dipole array element;

[0046] Figure 4 Schematic diagram of an example piezoelectric dipole array element;

[0047] Figure 5 Schematic diagram of an example of a piezoelectric unit series array element;

[0048] Figure 6 Schematic diagram of directional oscillation of piezoelectric unit series array elements;

[0049] Figure 7 Schematic diagram of an example of anisotropic array element of piezoelectric unit;

[0050] Figure 8 Schematic diagram of piezoelectric unit topology array elements and directional oscillation examples;

[0051] Figure 9 Schematic diagram of the construction scheme of the dual-stage piezoelectric array topology unit;

[0052] Figure 10 Schematic diagram of the hierarchical oscillation scheme of the two-stage piezoelectric array topology unit. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0054] An embodiment of the present invention provides a method for suppressing off-site edge ablation of a piezoelectric array by adaptive oscillation acceleration, including: S1, constructing a three-dimensional model of the piezoelectric element: using computer-aided design software, constructing a three-dimensional geometric model of the piezoelectric element to simulate its actual geometric shape and material properties for detailed mechanical analysis.

[0055] S2. Define the mechanical and electrical parameters of the piezoelectric material: Input the Young's modulus, Poisson's ratio, piezoelectric constant, and dielectric constant parameters of the piezoelectric material. These parameters are the basic data for simulating the behavior of piezoelectric elements.

[0056] S3. Establish the dynamic response equation of the piezoelectric element: Use the piezoelectric coupling equation to express the dynamic response of the piezoelectric element under high-frequency oscillation conditions. The formula is:

[0057] D=d·E+e·S

[0058] T=c·Se T ·E

[0059] Wherein, D is the electric displacement, E is the electric field, T is the stress, S is the strain, d is the dielectric constant, e is the piezoelectric constant, and c is the elastic constant. The dynamic response equation is expressed using the piezoelectric coupling equation to accurately describe the deformation behavior of the piezoelectric element under the action of the electric field.

[0060] S4. Set boundary conditions and initial conditions: Define the operating environment of the piezoelectric element, including fixed constraints and free boundary conditions, as well as initial displacement and initial velocity, to simulate actual working conditions. The initial conditions include initial displacement and initial velocity to set the initial state of the piezoelectric element at the beginning of the simulation.

[0061] S5. Use finite element analysis software for dynamic simulation: Use ANSYS, COMSOL or Abaqus to perform dynamic simulation of the piezoelectric element under high-frequency oscillation conditions to obtain its stress, strain and electric field distribution.

[0062] S6. Introducing material fatigue model: Based on the SN curve or Paris fatigue crack growth model, the fatigue behavior of piezoelectric elements during long-term operation is simulated. The formula is:

[0063]

[0064] Where N is fatigue life, σa is the stress amplitude, σ′ f is the fatigue strength coefficient, b is the fatigue strength index, and the material fatigue model is based on the SN curve or the Paris fatigue crack growth model to simulate the fatigue behavior of the piezoelectric element during long-term operation.

[0065] S7. Calibrate the material fatigue model using experimental data: Use stress-strain curves and fatigue life data to calibrate the material fatigue model to ensure the accuracy of the simulation results.

[0066] S8. Conduct environmental factor impact analysis: Conduct simulation analysis on the performance of piezoelectric elements under different environmental conditions, including evaluating the impact of environmental factors on their performance under -20°C to 150°C. The simulation analysis results are used to adjust the driving circuit parameters of the piezoelectric elements to improve their stability under high-frequency oscillation conditions. The simulation analysis results are used to design an environmental control system to keep the piezoelectric array system running under stable temperature and humidity conditions to ensure its optimal performance.

[0067] S9. Compare performance changes under different environmental conditions: Through simulation analysis, compare the performance changes of piezoelectric elements under different temperature and humidity conditions to evaluate their stability and durability.

[0068] S10. Generate performance curves and provide fatigue life prediction: Generate stress-strain curves, frequency response curves, and fatigue life curves based on the simulation results, and provide fatigue life predictions for the piezoelectric element under different operating conditions. The boundary conditions include fixed constraints and free boundaries to simulate the operating state of the piezoelectric element in an actual working environment.

[0069] S11. Export simulation results and generate a test report: Export the simulation analysis results to generate a detailed test report, including performance evaluation and life prediction, to provide a reference for the design and optimization of the piezoelectric array system.

[0070] S12. Use the test report results to optimize the design parameters of the piezoelectric element to improve its reliability and durability in actual operation.

[0071] A piezoelectric array adaptive oscillation acceleration off-site edge ablation suppression device, the piezoelectric array: includes multiple piezoelectric elements arranged in a matrix form, each of the piezoelectric elements can work independently and oscillate according to a control signal.

[0072] Driving circuit: used to provide the required electrical energy to the piezoelectric elements, and can accurately adjust the electric field strength of each piezoelectric element, thereby controlling its oscillation frequency and amplitude.

[0073] Sensor module: used to monitor the status of the ablation area in real time, including temperature, humidity, stress and strain parameters.

[0074] Signal processing unit: converts sensor data into usable control signals and performs data analysis and processing.

[0075] Housing and bracket: Used to fix the piezoelectric array and related electronic components, provide structural support and protection, and ensure stable operation of the equipment in harsh environments.

[0076] Temperature control module: used to monitor and adjust the temperature around the system to ensure that the piezoelectric element operates within the optimal temperature range.

[0077] Humidity control module: used to monitor and adjust the humidity around the system to prevent the impact of excessively high or low humidity on the performance of piezoelectric elements.

[0078] Interface module: used for communication and data exchange with external devices and systems, including data transmission interface and power supply interface.

[0079] Table 1: Data comparison table

[0080]

[0081] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A piezoelectric array adaptive oscillation acceleration off-site edge ablation suppression method, characterized in that: include: S1. Build a 3D model of the piezoelectric element: Use computer-aided design software to build a 3D geometric model of the piezoelectric element, simulating its actual geometry and material properties for detailed mechanical analysis. S2. Define the mechanical and electrical parameters of the piezoelectric material: Input the Young's modulus, Poisson's ratio, piezoelectric constant, and dielectric constant parameters of the piezoelectric material. These parameters are the basic data for simulating the behavior of the piezoelectric element. S3. Establish the dynamic response equation of the piezoelectric element: Use the piezoelectric coupling equation to express the dynamic response of the piezoelectric element under high-frequency oscillation conditions. The formula is: D=d·E+e·S T=c·S-e T ·E Where D is the electric displacement, E is the electric field, T is the stress, S is the strain, d is the dielectric constant, e is the piezoelectric constant, and c is the elastic constant; S4. Set boundary conditions and initial conditions: Define the operating environment of the piezoelectric element, including fixed constraints and free boundary conditions, as well as initial displacement and initial velocity, to simulate actual working conditions; S5. Use finite element analysis software for dynamic simulation: Use ANSYS, COMSOL or Abaqus to perform dynamic simulation of the piezoelectric element under high-frequency oscillation conditions to obtain its stress, strain and electric field distribution; S6. Introducing material fatigue model: Based on the SN curve or Paris fatigue crack growth model, the fatigue behavior of piezoelectric elements during long-term operation is simulated. The formula is: Where N is fatigue life, σ a is the stress amplitude, σ′ f is the fatigue strength coefficient, b is the fatigue strength index; S7. Calibrate the material fatigue model using experimental data: Use stress-strain curves and fatigue life data to calibrate the material fatigue model to ensure the accuracy of the simulation results; S8. Conduct environmental factor impact analysis: Simulate and analyze the performance of piezoelectric components under different environmental conditions, including -20°C to 150°C to evaluate the impact of environmental factors on their performance; S9. Comparison of performance changes under different environmental conditions: Through simulation analysis, the performance changes of piezoelectric elements under different temperature and humidity conditions are compared to evaluate their stability and durability. S10. Generate performance curves and provide fatigue life prediction: Generate stress-strain curves, frequency response curves, and fatigue life curves based on simulation results, and provide fatigue life predictions for piezoelectric components under different operating conditions; S11. Export simulation results and generate a test report: Export the simulation analysis results to generate a detailed test report, including performance evaluation and life prediction, to provide a reference for the design and optimization of the piezoelectric array system. S12. Use the test report results to optimize the design parameters of the piezoelectric element to improve its reliability and durability in actual operation.

2. The method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array according to claim 1, characterized in that: The dynamic response equation is expressed using a piezoelectric coupling equation to accurately describe the deformation behavior of the piezoelectric element under the action of an electric field.

3. The method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array according to claim 1, characterized in that: The initial conditions include initial displacement and initial velocity, so as to set the initial state of the piezoelectric element at the beginning of the simulation.

4. The method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array according to claim 1, characterized in that: The material fatigue model is based on the SN curve or the Paris fatigue crack growth model to simulate the fatigue behavior of the piezoelectric element during long-term operation.

5. The method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array according to claim 1, characterized in that: The simulation analysis results are used to adjust the driving circuit parameters of the piezoelectric element to improve its stability under high-frequency oscillation conditions.

6. The method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array according to claim 1, characterized in that: The simulation analysis results are used to design an environmental control system to keep the piezoelectric array system operating under stable temperature and humidity conditions to ensure its optimal performance.

7. The method for suppressing off-site edge ablation by adaptive oscillation acceleration of a piezoelectric array according to claim 1, characterized in that: The boundary conditions include fixed constraints and free boundaries to simulate the operating state of the piezoelectric element in an actual working environment.

8. A piezoelectric array adaptive oscillation acceleration off-site edge ablation suppression device, characterized by: Piezoelectric array: includes multiple piezoelectric elements arranged in a matrix, each of which can work independently and oscillate according to a control signal; Driving circuit: used to provide the required electrical energy to the piezoelectric element, and can accurately adjust the electric field strength of each piezoelectric element, thereby controlling its oscillation frequency and amplitude; Sensor module: used to monitor the status of the ablation area in real time, including temperature, humidity, stress and strain parameters; Signal processing unit: converts sensor data into usable control signals and performs data analysis and processing; Housing and bracket: used to fix the piezoelectric array and related electronic components, provide structural support and protection, and ensure stable operation of the equipment in harsh environments; Temperature control module: used to monitor and adjust the temperature around the system to ensure that the piezoelectric element operates within the optimal temperature range; Humidity control module: used to monitor and adjust the humidity around the system to prevent excessively high or low humidity from affecting the performance of piezoelectric elements; Interface module: used for communication and data exchange with external devices and systems, including data transmission interface and power supply interface; The piezoelectric element is obtained by designing and optimizing according to any of the methods described in claims 1-7.

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