Method and device for determining temperature of circuit board, and storage medium

Abstract

The present application discloses a method and device for determining the temperature condition of a circuit board, and a storage medium. The method includes: obtaining the component conditions on the circuit board to be measured. Determine the temperature conditions of each component during operation according to the component conditions; determine the steady-state thermal balance relationship of the circuit board according to the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, wherein the steady-state thermal balance relationship is used to indicate the influence of the temperature conditions of each position on the circuit board on the temperature condition of the circuit board; and superimpose the temperature conditions of each component during operation according to the layout position and the steady-state thermal balance relationship to determine the temperature condition of the circuit board. The temperature condition of the circuit board is determined by superimposing the temperature conditions of each component, thereby avoiding mutual interference of the component temperatures, and the obtained temperature condition of the circuit board is more accurate.

Description

Technical Field

[0001] The present application relates to the field of circuits, and in particular, to a method and device for determining the temperature of a circuit board, and a storage medium. Background Art

[0002] Printed Circuit Board (PCB) plays a vital role in the development and manufacturing of electronic devices. As the carrier of electronic components, the thermal performance of PCB directly affects the stability and service life of electronic devices. As electronic products develop towards smaller size, higher power and more complex functions, the density of components on PCB continues to increase, which makes PCB thermal management a key challenge in design. Accurately measuring and analyzing the temperature distribution of PCB is of great significance for optimizing design, improving performance, ensuring reliability and extending equipment life.

[0003] In the related technology, the temperature measurement methods for PCB boards mainly include contact and non-contact methods. Contact measurement is mainly achieved through physical contact sensors such as thermistors and thermocouples. Non-contact measurement methods, such as infrared thermal imagers, overcome the limitations of contact measurement and can quickly and non-destructively obtain temperature images of PCBs. They are suitable for temperature detection of large ranges and complex structures.

[0004] However, in the solutions of the related art, the measurement of the temperature distribution of the PCB is subject to the conditions such as the environment and the viewing angle, resulting in inaccurate measurement. Summary of the invention

[0005] The embodiments of the present application provide a method and device for determining the temperature of a circuit board, and a storage medium, so as to at least solve the technical problem that the temperature of the circuit board cannot be accurately determined.

[0006] According to one aspect of an embodiment of the present application, a method for determining the temperature condition of a circuit board is provided, comprising: obtaining a component condition on a circuit board to be measured, wherein the component condition comprises: the arrangement position of each component on the circuit board and the component parameters of each component; determining, according to the component condition, a first surface area of ​​the component in contact with the circuit board and a second surface area of ​​the component exposed to the air; determining, according to the component parameters, a power condition of the component during operation, wherein the power condition is used to indicate the calorific value of the component; determining, according to the calorific value of the component, a normal heat flux density of the component on the first surface area; determining, according to the normal heat flux density of the component and the first surface area, a thermal conduction heating condition of the component; determining, according to the second surface area and environmental parameters of an area where the circuit board is located, a heat exchange heating condition between the component and the air; determining, according to the thermal conduction heating condition and the heat exchange heating condition of the component, a temperature condition of the component during operation; determining, according to the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, a steady-state thermal balance relationship of the circuit board, wherein the steady-state thermal balance relationship is used to indicate the influence of the temperature condition of each position on the circuit board on the temperature condition of the circuit board; and superimposing, according to the arrangement position and the steady-state thermal balance relationship, the temperature conditions of each component during operation to determine the temperature condition of the circuit board.

[0007] In an exemplary embodiment, the temperature conditions of each component during operation are determined based on component parameters, including: determining the power conditions of each component during operation and the heat dissipation area conditions of each component based on the component parameters; determining the heat generated by each component during operation based on the power conditions, the heat dissipation area conditions, and a preset heat source model of each component; determining the temperature conditions of each component during operation based on the heat generated by each component during operation and the preset environmental parameters of each component during operation.

[0008] In an exemplary embodiment, the steady-state thermal equilibrium relationship of the circuit board is determined based on the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, including: determining the thermal conductivity model of the circuit board based on the board parameters used to manufacture the circuit board and the heat transfer coefficient of the area where the circuit board is located; determining the heat flux density of the circuit board based on the normal heat flux density at each position on the circuit board; under preset boundary conditions, determining the steady-state thermal equilibrium relationship of the circuit board based on the thermal conductivity model and the heat flux density of the circuit board; wherein the boundary condition is that the inflow and outflow of heat energy at the boundary of the circuit board are equal.

[0009] In an exemplary embodiment, the temperature conditions of each component during operation are superimposed according to the layout position and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board, including: determining the component temperature field corresponding to each component according to the temperature condition of each component during operation; determining the temperature field of the circuit board according to the layout position of each component, the component temperature field corresponding to each component, and the steady-state thermal equilibrium relationship; wherein the temperature field of the circuit board is used to indicate the temperature condition of the circuit board.

[0010] In an exemplary embodiment, after the temperature conditions of each component during operation are superimposed according to the layout position and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board, the method further includes: determining target adjustment parameters of the circuit board according to the temperature condition of the circuit board and a preset temperature target, wherein the target adjustment parameters include at least one of the following: component spacing, component layout position, and size of the circuit board; and redesigning the circuit board according to the target adjustment parameters of the circuit board so that the temperature condition of the redesigned circuit board reaches the preset temperature target.

[0011] In an exemplary embodiment, after the temperature conditions of each component during operation are superimposed according to the layout position and the steady-state thermal balance relationship to determine the temperature condition of the circuit board, the method also includes: measuring the actual temperature condition of the circuit board during operation; when the actual temperature condition is inconsistent with the determined temperature condition, determining the temperature condition of each component on the circuit board during operation according to the steady-state thermal balance relationship, the actual temperature condition, and the component condition.

[0012] In an exemplary embodiment, after determining the temperature conditions of each component on the circuit board during operation, the method further includes: determining the heat dissipation area conditions of each component on the circuit board and a preset heat source model of each component; determining the power conditions of each component on the circuit board based on the temperature conditions, heat dissipation area conditions, and preset heat source models of each component during operation.

[0013] Another aspect of the present application provides a device for determining the temperature condition of a circuit board, comprising: a component condition acquisition module, used to acquire the component condition on the circuit board to be measured, wherein the component condition includes: the layout position of each component on the circuit board and the component parameters of each component; a first temperature determination module, used to determine, according to the component condition, a first surface area of ​​the component in contact with the circuit board and a second surface area of ​​the component exposed to the air; determine the power condition of the component during operation according to the component parameters, wherein the power condition is used to indicate the heat generation of the component; determine the normal heat flux density of the component on the first surface area according to the heat generation of the component; determine the normal heat flux density of the component and the first surface area according to the normal heat flux density of the component. heat conduction heating condition; determine the heat exchange heating condition between the component and the air according to the second surface area and the environmental parameters of the area where the circuit board is located; determine the temperature of the component during operation according to the heat conduction heating condition and the heat exchange heating condition of the component; a thermal balance determination module is used to determine the steady-state thermal balance relationship of the circuit board according to the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, wherein the steady-state thermal balance relationship is used to indicate the influence of the temperature conditions of various positions on the circuit board on the temperature conditions of the circuit board; a second temperature determination module is used to superimpose the temperature conditions of various components during operation according to the layout position and the steady-state thermal balance relationship to determine the temperature condition of the circuit board.

[0014] According to another aspect of the embodiments of the present application, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute the method for determining the temperature condition of the above-mentioned circuit board when running.

[0015] According to another aspect of the embodiment of the present application, a computer program product or a computer program is provided, the computer program product or the computer program includes computer instructions, the computer instructions are stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the method for determining the temperature condition of the circuit board as described above.

[0016] According to another aspect of the embodiments of the present application, there is also provided an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to execute the method for determining the temperature condition of the circuit board through the computer program.

[0017] The method for determining the temperature condition of the above-mentioned circuit board first obtains the component condition on the circuit board to be measured. By accurately obtaining the component condition, the necessary data support is provided for the subsequent thermal model establishment and temperature field calculation, ensuring the accuracy and reliability of the circuit board thermal analysis. Then, the temperature condition of each component during the working process is determined according to the component parameters. By determining the temperature condition of each component on the circuit board during the working process, the temperature condition of each component itself can be determined, and the temperature condition determined in this way is not interfered by other components. Then, according to the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, the steady-state thermal balance relationship of the circuit board is determined. The determination of the steady-state thermal balance relationship enables the influence of the circuit board material, process and environmental factors on the circuit board temperature condition to be fully considered, which is convenient for the subsequent superposition of the component temperature field. Finally, according to the layout position and the steady-state thermal balance relationship, the temperature conditions of each component during the working process are superimposed to determine the temperature condition of the circuit board. Since the temperature conditions of each component are determined separately, the temperature condition of the circuit board can be determined by superimposing the temperature conditions of each component to avoid mutual interference of the component temperatures, so that the obtained temperature condition of the circuit board is more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 is a schematic diagram of an application environment of an optional method for determining the temperature condition of a circuit board according to an embodiment of the present application;

[0020] Figure 2 is a flow chart of a method for determining a temperature condition of a circuit board according to an embodiment of the present application;

[0021] Figure 3 This is a second flow chart of a method for determining a temperature condition of a circuit board according to an embodiment of the present application;

[0022] Figure 4 is a third flow chart of a method for determining the temperature of a circuit board according to an embodiment of the present application;

[0023] Figure 5 is a fourth flow chart of a method for determining a temperature condition of a circuit board according to an embodiment of the present application;

[0024] Figure 6 is a fifth flow chart of a method for determining a temperature condition of a circuit board according to an embodiment of the present application;

[0025] Figure 7is a sixth flowchart of a method for determining a temperature condition of a circuit board according to an embodiment of the present application;

[0026] Figure 8 is a structural example diagram of a circuit board according to an embodiment of the present application;

[0027] Fig. 9 is a structural block diagram of an optional device for determining the temperature condition of a circuit board according to an embodiment of the present application;

[0028] Fig.10 It is a structural schematic diagram of an optional product for determining the temperature condition of a circuit board according to an embodiment of the present application;

[0029] Fig.11 It is a schematic diagram of the structure of an optional electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0032] According to one aspect of an embodiment of the present application, a method for determining the temperature of a circuit board is provided. Optionally, in this embodiment, the method for determining the temperature of a circuit board can be applied to Figure 1 In the hardware environment composed of the server 101 and the terminal device 103 shown in FIG. Figure 1As shown, the server 101 is connected to the terminal 103 via a network, and can be used to provide services for the terminal device or the application installed on the terminal device. The application can be a video application, an instant messaging application, a browser application, an educational application, a game application, etc. A database 105 may be set up on the server or independently of the server to provide data storage services for the server 101, for example, a game data storage server. The above-mentioned network may include, but is not limited to, a wired network and a wireless network, wherein the wired network includes, a local area network, a metropolitan area network and a wide area network; the wireless network includes, Bluetooth, WIFI and other networks that implement wireless communication; the terminal device 103 may be a terminal configured with an application, and may include, but is not limited to, at least one of the following: a mobile phone (such as an Android phone, an iOS phone, etc.), a laptop computer, a tablet computer, a PDA, a MID (Mobile Internet Devices), a PAD, a desktop computer, a smart TV, an intelligent voice interaction device, a smart home appliance, a vehicle-mounted terminal, an aircraft, a virtual reality (VR) terminal, an augmented reality (AR) terminal, a mixed reality (MR) terminal and other computer devices; the above-mentioned server may be a single server, a server cluster consisting of multiple servers, or a cloud server.

[0033] Combination Figure 1 As shown, the method for determining the temperature condition of the above-mentioned circuit board can be executed by an electronic device, which can be a terminal device or a server. The method for determining the temperature condition of the above-mentioned circuit board can be implemented by the terminal device or the server separately, or by the terminal device and the server together.

[0034] The above is only an example and is not specifically limited in this embodiment.

[0035] Optionally, as an optional implementation, as Figure 2 As shown, the method for determining the temperature of the circuit board includes steps S200-S230:

[0036] Step S200, obtaining the component status on the circuit board to be measured.

[0037] The component conditions include: the layout positions of the various components on the circuit board and the component parameters of the various components.

[0038] Specifically, the component situation refers to the physical location of all components on the circuit board and their component parameters. By analyzing the circuit board layout design file (such as Allegro's .brd file), the layout location of each component can be accurately obtained. Component parameters can include the power consumption, surface area, thermal resistance and thermal capacitance of the component, which are crucial for calculating the temperature during the operation of the component.

[0039] Exemplarily, a component list is exported from the circuit board design software, including the type, model, power specification and location coordinates of each component. In addition, the thermal parameters of the components are collected, such as through component data sheets or thermal test data. For those components that generate significant heat in the circuit, special attention is paid to their active power (P) and the surface shape in contact with the PCB board (S1) and the surface in the air (S2). This information will be used for subsequent temperature calculations.

[0040] Step S210: determining a first surface area of ​​the component in contact with the circuit board and a second surface area of ​​the component exposed to the air according to the component condition.

[0041] Specifically, the contact area between the component and the circuit board (first surface area) directly affects the efficiency of heat conduction from the component to the PCB, while the area of ​​the component exposed to the air (second surface area) affects its convection heat dissipation with the air. Accurately measuring or calculating these two areas is crucial to understanding and optimizing the thermal behavior of components.

[0042] Exemplarily, the first surface area and the second surface area are obtained by analyzing the physical size of the component and the surface area in contact with the PCB. For each component, its surface in the air (S2) and the surface in contact with the PCB (S1) need to be considered to calculate the total heat dissipation area (S=S1+S2).

[0043] Step S220, determining the power condition of the component during operation according to the component parameters.

[0044] Specifically, the power behavior (heat generation) of a component is determined by its operating conditions, such as parameters such as current, voltage, and resistance. Understanding the power behavior of a component is critical to assessing its cooling needs and the overall thermal management of the board.

[0045] Among them, the power condition is used to indicate the heat generated by the component. According to the circuit board design file, the model, operating voltage, operating current and thermal parameters of each component can be extracted. The power condition is calculated by circuit parameters and operating conditions. For example, for a resistor component, the power (P) can be calculated by the formula (P=I^2R) or (V^2 / R), where (I) and (V) are the current and voltage passing through the component respectively.

[0046] Step S230: determining the normal heat flux density of the element on the first surface area according to the heating value of the element.

[0047] Specifically, normal heat flux refers to the heat flow perpendicular to the surface per unit area, and is a key parameter for evaluating the heat transfer efficiency of components. Normal heat flux refers to the flow rate of heat through a surface per unit area along the normal (i.e., a straight line perpendicular to the surface). In thermal transfer, heat flux is a key parameter for measuring the heat transfer rate, and normal heat flux pays special attention to the heat flow perpendicular to the surface. Therefore, it can represent the heat from the component to the circuit board through heat conduction.

[0048] Step S240, determining the heat conduction heating condition of the component according to the normal heat flux density and the first surface area of ​​the component.

[0049] Specifically, heat generation by thermal conduction is the heat dissipated by components to the circuit board through thermal conduction, which is an important part of the overall thermal analysis of the circuit board.

[0050] For example, the heat conduction heating condition can be directly obtained by multiplying the normal heat flux density by the first surface area:

[0051] Step S250, determining the heat exchange and heating conditions between the component and the air according to the second surface area and the environmental parameters of the area where the circuit board is located.

[0052] Specifically, heat transfer refers to the heat dissipated by the component through convection heat transfer with the air, which is related to the area of ​​the component exposed to the air and environmental conditions (such as convection heat transfer coefficient, wind speed and ambient temperature).

[0053] Step S260, determining the temperature of the component during operation according to the heat conduction heating and heat exchange heating of the component.

[0054] Specifically, the temperature of the component can be obtained by combining the heat conduction heating and heat exchange heating, that is, the heating of the component, especially the power consumption, can be determined based on the component parameters. Combined with the preset ambient temperature T0, the convection heat transfer coefficient h and the heat flux density q, the temperature field generated by each component in the working state is calculated using the thermal formula. This step is the basis for the overall temperature analysis of the circuit board, which reflects the heat source characteristics of each component.

[0055] For example, the calculation formula for the heat generation of a component may be as follows:

[0056] Among them, P is the power of the component, which means the thermal power of the component per unit time, that is, the heat generated or consumed by the component, and the unit is usually watt (W). The residual temperature of the component indicates the temperature difference between the component surface and the environment (residual temperature), that is, the component surface temperature minus the ambient temperature, in Kelvin (K), T is the actual temperature, T0 is the ambient temperature. S1 is the surface area of ​​the component in contact with the PCB. S2 is the surface area of ​​the component in the air, S = S1+S2 is the component surface. is the average residual temperature of the component surface, which is the difference between the average temperature of the entire component surface (including the surface in contact with the PCB and exposed to the air) minus the ambient temperature. q is the normal heat flux density of the surface, which represents the heat flux density transferred from the component to the surface in direct contact with the PCB through heat conduction, and the unit is watts per square meter (W / m²). h represents the convective heat transfer coefficient, which is the rate of heat exchange between the component surface and the surrounding air through natural convection (in the absence of forced airflow) or forced convection (such as fan forced airflow), and the unit is watts per square meter per Kelvin (W / m²K). q' represents the heat flux density after taking into account thermal radiation, that is, in addition to heat conduction and convection heat transfer, the heat released or absorbed by the component to the surrounding environment through thermal radiation, and the unit is watts per square meter (W / m²).

[0057] This formula describes the total energy balance of heat exchange between the component and the environment through conduction, convection and thermal radiation. The two integrals on the left represent the heat exchange power through conduction and convection respectively, while the right side is the heat exchange power calculated by the average temperature difference and the total surface area after considering thermal radiation. Under thermal equilibrium conditions, the total heat released or absorbed by the component in various ways should be equal to the thermal power it generates. The temperature of each component on the circuit board is calculated by this formula. The temperature changes of components under different power and environmental conditions can also be simulated by adjusting the parameters in the formula.

[0058] For example, the calculated heat generation and the heat dissipation area of ​​the component are used in combination with environmental parameters (such as ambient temperature, air convection heat transfer coefficient, etc.) to determine the temperature of the component during operation. The temperature of each component during operation can be determined by the following formula:

[0059]

[0060] in, It represents the heat generation rate of the i-th component, that is, the heat generated by the component per unit time, in watts (W). It represents the total heat flux density at the position (r=(x,y)) (in watts per square meter, W / m²), which is related to the heat generation rate and heat dissipation efficiency of the component, and can reflect the heat generation and loss of the component at this position. kc represents thermal resistance, which is determined by the thermal conductivity (k) and thickness (c) of the material. Thermal resistance describes the resistance encountered by heat when passing through the material, that is, the heat flux density generated by each degree of temperature difference per unit area, and the unit is m²K / W. It indicates that the position vector r belongs to the surface area of ​​component i, which includes the surface of the component in contact with the PCB and the part of the component surface in the air. It indicates that the position vector r belongs to the area of ​​non-heat-generating components on the circuit board. In these areas, the heat flux density is assumed to be 0, that is, there is no additional heat source.

[0061] When the position vector r belongs to the surface area of ​​the i-th element When the heat flux density q'(r) is equal to the heat generation rate qi of the component divided by the thermal resistance kc of the component. This means that in the component surface area, the heat flux density is directly related to the heat generation rate and thermal resistance of the component.

[0062] When the position vector r does not belong to the surface area of ​​any component, the heat flux density q'(r)) is set to 0, which means that there is no additional heat source in these areas and the flow of heat is mainly determined by the thermal diffusion and convection of other components.

[0063] Step S270, determining a steady-state thermal balance relationship of the circuit board according to actual manufacturing process parameters of the circuit board and environmental parameters of the area where the circuit board is located.

[0064] The steady-state thermal balance relationship is used to indicate the influence of the temperature conditions at various locations on the circuit board on the temperature conditions of the circuit board.

[0065] Specifically, the steady-state thermal balance relationship describes the influence of the temperature at each location on the temperature distribution of the entire circuit board when the circuit board reaches temperature balance under working conditions. The steady-state thermal balance equation of the circuit board can be determined by considering the material properties of the circuit board, the manufacturing process parameters (such as the thickness c of the board, the thermal conductivity k) and the environmental parameters (such as the air convection heat transfer coefficient h).

[0066] For example, the steady-state thermal balance equation of the circuit board is established according to the law of heat conduction, such as

[0067] Where λ > 0, λ = (2h / kc), λ is the heat transfer coefficient related to the heat exchange between the circuit board and the environment, h is the air convection heat transfer coefficient, c is the board thickness, k is the board thermal conductivity, is the Laplace operator. , which means that the Laplace operator of the temperature field acts on the temperature distribution The result is , where (r=(x,y)) refers to the position vector in two-dimensional space. It represents the temperature deviation at the position (r=(x,y)), that is, the difference between the surface temperature of the component and the ambient temperature (residual temperature), and the unit is usually Kelvin (K). It represents the total heat flux density at the position (r=(x,y)) in watts per square meter (W / m²), which is related to the heat generation rate and heat dissipation efficiency of the component, and can reflect the heat generation and loss of the component at that position.

[0068] Under steady-state conditions, the distribution of the temperature field will satisfy the above equation, so the temperature distribution at any position on the circuit board can be obtained by solving this equation. By solving the temperature distribution and heat flux density inside the circuit board, the temperature conditions at each position of the circuit board under steady-state conditions can be obtained.

[0069] Step S280, based on the arrangement positions and the steady-state thermal balance relationship, the temperature conditions of the various components during operation are superimposed to determine the temperature condition of the circuit board.

[0070] Specifically, the steady-state thermal balance of the circuit board is used to superimpose the temperature conditions of all components during operation to determine the overall temperature distribution of the circuit board, taking into account the mutual influence between components and the thermal diffusion effect of the circuit board.

[0071] Exemplarily, after obtaining the temperature field of each component, the temperature fields of all components are superimposed and calculated using the superposition principle to obtain the total temperature contribution of any point on the circuit board. Specifically, according to the geometric structure and material properties of the circuit board, the Green function and Laplace operator are applied to calculate the temperature contribution of each position on the circuit board, and then all contributions are linearly combined to form the total temperature field of the circuit board.

[0072] For example, when there is a large temperature difference between an object and the environment, thermal radiation must usually be considered. Assuming that the ambient temperature is room temperature (300K), the average temperature difference between the single board and the environment is 20K. At this time, the thermal radiation rate per unit area accounts for only 3.5% of the total heat transfer power. Therefore, in order to simplify the calculation, it can be assumed that the circuit board has the following conditions: the thickness is the smallest compared to the length and width, so the temperature of the circuit board is constant along the thickness direction. The thermal conductivity of the material of the circuit board is a constant. Compared with heat conduction and convection, thermal radiation is small, so the thermal radiation of the circuit board can be ignored.

[0073] In this embodiment, the component conditions on the circuit board to be measured are first obtained. By accurately obtaining the component conditions, necessary data support is provided for the subsequent thermal model establishment and temperature field calculation, ensuring the accuracy and reliability of the thermal analysis of the circuit board. Then, the temperature conditions of each component during the working process are determined according to the component parameters. By determining the temperature conditions of each component on the circuit board during the working process, the temperature conditions of each component itself can be determined, and the temperature conditions determined in this way are not interfered by other components. Then, according to the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, the steady-state thermal balance relationship of the circuit board is determined. The determination of the steady-state thermal balance relationship enables the influence of the circuit board material, process and environmental factors on the temperature condition of the circuit board to be fully considered, which is convenient for the subsequent superposition of the component temperature field. Finally, according to the layout position and the steady-state thermal balance relationship, the temperature conditions of each component during the working process are superimposed to determine the temperature condition of the circuit board. Since the temperature conditions of each component are determined separately, the temperature condition of the circuit board can be determined by using the superposition of the temperature conditions of each component to avoid the mutual interference of the component temperature and the interference of noise (such as the thermal noise and amplifier noise of the infrared thermal imaging instrument), so that the obtained temperature condition of the circuit board is more accurate.

[0074] In one embodiment, Figure 3 As shown, step S270 determines the steady-state thermal balance relationship of the circuit board according to the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located. It includes: steps S300-S310, wherein:

[0075] Step S300, determining a thermal conductivity model of the circuit board according to the board parameters used to manufacture the circuit board and the heat transfer coefficient of the area where the circuit board is located.

[0076] Specifically, the thermal conductivity model of the circuit board is based on the thermal conductivity and heat transfer coefficient of the material used for the circuit board, and is used to simulate the heat conduction inside the circuit board and the heat exchange process with the environment.

[0077] Step S310: Under preset boundary conditions, according to the thermal conductivity model and heat flux density of the circuit board, determine the steady-state thermal balance relationship of the circuit board.

[0078] The boundary condition is that the inflow and outflow of heat energy at the boundary of the circuit board are equal.

[0079] Specifically, when the circuit board is in working condition, the steady-state thermal equilibrium relationship describes the equilibrium state between the temperature of each point on the circuit board and the overall thermal environment, where the boundary conditions ensure that the heat energy inflow and outflow at the circuit board boundary are equal.

[0080] For example, the thermal conductivity model and heat flux density of the circuit board are applied, and the boundary conditions are combined to solve the steady-state thermal balance equation of the circuit board using numerical simulation or analytical methods. The steady-state thermal balance equation can be expressed as:

[0081]

[0082] in, The gradient of the temperature gradient of element i at position r (i.e., the Laplace operator of temperature) reflects the curvature of temperature change with position. It is a dimensional parameter determined by the heat conduction characteristics and convection heat transfer characteristics, λ =(2h / kc), λ is the heat transfer coefficient related to the heat exchange between the circuit board and the environment, h is the air convection heat transfer coefficient, c is the board thickness, k is the board thermal conductivity, it reflects the combined effect of heat conduction inside the component and convection heat transfer between the component and the environment. It represents the temperature deviation of component i at position r, that is, the difference between the surface temperature of the component and the ambient temperature, in Kelvin (K). It represents the heat generation rate of the i-th component, that is, the heat generated by the component per unit time, in watts (W). It represents the total heat flux density at the position (r=(x,y)) (in watts per square meter, W / m²), which is related to the heat generation rate and heat dissipation efficiency of the component, and can reflect the heat generation and loss of the component at this position. kc represents thermal resistance, which is determined by the thermal conductivity (k) and thickness (c) of the material. Thermal resistance describes the resistance encountered when heat passes through a material. represents the surface area of ​​element i to which the position vector r belongs.

[0083] The boundary conditions ensure that the normal component of the heat flow is zero at the board boundary, as expressed by the following formula:

[0084]

[0085] in, Represents the temperature gradient on the boundary. The temperature gradient is a vector that indicates the fastest direction and rate of temperature change with position. On the boundary, the absolute value of the temperature gradient can reflect the direction and intensity of heat transfer. It represents the magnitude (magnitude) of the temperature gradient, that is, the absolute value of the rate of temperature change at the boundary. It is a parameter related to boundary conditions, called heat transfer coefficient or boundary condition coefficient, which determines the heat transfer rate between the temperature change at the boundary and the surrounding environment. Represents the boundary of a circuit board or component, that is, the edge that contacts the outside world or other areas with different thermal properties. At this boundary, the temperature field must meet specific constraints. It indicates the temperature at position (r), that is, the difference between the actual temperature of the circuit board or component at position (r) and the ambient temperature.

[0086] This boundary condition equation describes that the gradient modulus of the temperature at the boundary (i.e., the rate of heat transfer) is linearly related to the temperature at the boundary. As the temperature increases, the absolute value of the temperature gradient also increases to maintain thermal equilibrium. This relationship shows that when the temperature at the boundary is high, it promotes rapid heat transfer to the surrounding environment, while when the temperature is low, the rate of heat transfer slows down.

[0087] In this embodiment, the construction of the circuit board thermal conductivity model provides a basis for the thermal control analysis of the circuit board, allowing us to simulate the thermal conduction characteristics inside the circuit board and the heat exchange with the environment, so as to better understand the thermal behavior of the circuit board and provide a basis for thermal optimization design. The determination of the heat flux density enables us to accurately evaluate the flow and distribution of heat on the circuit board, which plays a key role in identifying areas of heat accumulation and guiding heat dissipation design. Determining the steady-state thermal balance relationship of the circuit board can fully understand the thermal distribution of the circuit board and effectively predict the hot spot areas of the circuit board, which is crucial for the thermal design and optimization of the circuit board. By meeting the boundary conditions, the integrity and accuracy of the circuit board thermal model are ensured, providing a reliable foundation for subsequent temperature field superposition and parameter optimization.

[0088] In one embodiment, Figure 4 As shown, step S280, according to the arrangement position and the steady-state thermal balance relationship, the temperature conditions of each component during operation are superimposed to determine the temperature condition of the circuit board. It includes: steps S400-S410, wherein:

[0089] Step S400, determining the component temperature field corresponding to each component according to the temperature condition of each component during operation.

[0090] Specifically, the component temperature field refers to the temperature distribution of a single component on a circuit board, which is calculated through a thermal model based on the temperature conditions of the component during operation.

[0091] Exemplarily, the temperature conditions of each component during operation determined above are used in combination with the geometric shapes of the components to calculate the temperature field of the components. For each component, its temperature field can be represented as the temperature distribution at the location of the component.

[0092] Step S410, determining the temperature field of the circuit board according to the arrangement positions of the components, the component temperature fields corresponding to the components, and the steady-state thermal balance relationship.

[0093] Among them, the temperature field of the circuit board is used to indicate the temperature condition of the circuit board.

[0094] Specifically, the temperature field of a circuit board is a combination of the temperature fields of all components on the circuit board, reflecting the overall temperature distribution of the circuit board.

[0095] For example, according to the arrangement positions of various components on the circuit board, the corresponding component temperature fields are superimposed, and the interaction between components and the thermal diffusion characteristics of the circuit board are taken into consideration. The temperature field of the circuit board can be calculated by the following formula:

[0096] =

[0097] in, is the temperature field of the circuit board, is the temperature field of the i-th element at position r, and m is the number of elements.

[0098] In this embodiment, determining the temperature field of each component helps to understand the temperature changes of the component itself and the surrounding area, which is of great value for the thermal design and fault diagnosis of the circuit board. By integrating the temperature fields of each component, the temperature field of the entire circuit board can be obtained.

[0099] In one embodiment, Figure 5 As shown, in step S280, after the temperature conditions of each component during operation are superimposed according to the arrangement position and the steady-state thermal balance relationship to determine the temperature condition of the circuit board, the method further includes: steps S500-S510, wherein:

[0100] Step S500, determining target adjustment parameters of the circuit board according to the temperature condition of the circuit board and a preset temperature target.

[0101] The target adjustment parameter includes at least one of the following: component spacing, component layout position, and circuit board size.

[0102] Specifically, based on the temperature distribution of the circuit board, it is compared with a preset temperature target to identify parameters that need to be adjusted to optimize the thermal performance of the circuit board.

[0103] Exemplarily, first, analyze the circuit board temperature field data to identify hot spots or temperature abnormalities. Next, set the target temperature range based on the thermal analysis results of the circuit board, for example, to ensure that the temperature of all components on the circuit board does not exceed its maximum allowable operating temperature. Based on the difference between the temperature of the circuit board and the preset temperature target, determine the target parameters that need to be adjusted, including component spacing, component layout position, and circuit board size. This may involve multiple iterations and optimizations to find the optimal combination of parameters.

[0104] Step S510, redesigning the circuit board according to the target adjustment parameters of the circuit board so that the temperature of the redesigned circuit board reaches a preset temperature target.

[0105] Specifically, the circuit board redesign step is based on target adjustment parameters, aiming to achieve a preset temperature target for the circuit board temperature by modifying the circuit layout and size.

[0106] For example, the redesign process usually includes layout adjustments using circuit design software. This may involve changing the spacing between components to improve the circulation of thermal airflow; adjusting the layout of components to avoid direct interference between heat sources; or modifying the size of the circuit board to increase the heat dissipation area or improve the heat conduction path. After the redesign, thermal simulation needs to be performed again to confirm whether the new design can achieve the preset temperature target.

[0107] In this embodiment, by comparing the actual temperature of the circuit board with the preset target, the accuracy of the thermal performance optimization direction is ensured, the risk of overheating is effectively avoided, and the reliability and performance of the circuit board are improved. The determination of the target adjustment parameters provides clear guidance for the improvement of circuit board design, which helps to reduce the overall design cost and shorten the product development cycle. The redesign of the circuit board can significantly improve its thermal performance, ensure that the components operate within the optimal operating temperature range, and avoid circuit failures and performance degradation caused by overheating. In addition, by optimizing the structural parameters of the circuit board, the manufacturing yield and assembly convenience of the circuit board can be improved, the production cost can be reduced, and the overall quality and user experience of electronic products can be improved.

[0108] In one embodiment, Figure 6 As shown, in step S280, after the temperature conditions of each component during operation are superimposed according to the arrangement position and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board, the method further includes steps S600-S610, wherein:

[0109] Step S600, measuring the actual temperature of the circuit board during operation.

[0110] Specifically, during the actual operation of the circuit board, the temperature data of each point is obtained through the temperature measurement device to verify the accuracy of the temperature conditions predicted in the design stage.

[0111] For example, use a high-precision temperature measuring instrument, such as an infrared thermal imager or a thermocouple, to measure the temperature at multiple measurement points on the circuit board. These measurement points should cover the critical areas and components of the circuit board, especially those locations that are considered to be hot spots or temperature-sensitive areas in the prediction. Make sure to measure when the circuit board reaches a steady-state working state to obtain stable and reliable temperature data.

[0112] Step S610, when the actual temperature condition is inconsistent with the determined temperature condition, the temperature condition of each component on the circuit board during operation is determined according to the steady-state thermal balance relationship, the actual temperature condition, and the component condition.

[0113] Specifically, if the actually measured temperature differs from the temperature determined in the design phase, it means that the temperature conditions of some components may be inaccurate or missing. Therefore, it is necessary to decouple the temperature conditions of each component based on the steady-state thermal balance relationship, actual temperature data and component conditions.

[0114] Specifically, the actual temperature conditions measured may be missing, for example, the temperature conditions of some components on the circuit board are missing, so the actual temperature conditions measured are different from the temperature conditions determined in the design stage. This is because the actual measurement may cause the loss of temperature field information of some components due to factors such as field of view limitation, measurement equipment accuracy, component changes or incomplete installation, which will cause a mismatch between theory and practice. However, this problem can be effectively solved by decoupling the temperature field of the circuit board. The basic idea of ​​decoupling analysis is to decompose the overall temperature field on the circuit board into the temperature field contributed by each component. Each component, such as diodes, resistors, capacitors, etc., has its own specific thermal characteristics, including thermal resistance, heat capacity and heat generation rate. In the design stage, a temperature field model can be theoretically established for each component to calculate its temperature distribution at a specific position on the circuit board. When the actual measured temperature field lacks information about some components, the temperature field of the missing components can be estimated by using the measurement data of other components on the circuit board through reverse engineering, that is, separating the temperature contribution of the known components from the overall temperature field. This is because the temperature on the circuit board is the superposition of the temperature fields of all components. If the accurate temperature distribution of most components is known, the temperature of the missing components can be reversely deduced. This approach usually involves numerical calculations, using mathematical tools such as finite element analysis, boundary element method or Green's function, combined with the geometric parameters of the board, material properties and measurement data to reconstruct the complete temperature field.

[0115] By decoupling analysis and simulating the missing component temperature field, the thermal performance of the circuit board can be evaluated more accurately, potential hot spots or heat dissipation bottlenecks can be identified, and component layout and heat dissipation design can be optimized to improve the reliability and performance of the circuit board. This method is very useful in circuit board design and fault diagnosis.

[0116] For example, a structural model of a PCB can be constructed, which is a process of converting the physical structure of a circuit board into a mathematical model for subsequent thermal analysis. Computer-aided design software can be used to construct a three-dimensional model of a circuit board, which includes the geometric dimensions, material properties, component layout, and thermal parameters of the circuit board. When constructing the model, the location, size, and heat source characteristics of each component need to be described in detail, while taking into account the structural characteristics of the circuit board, such as the number of layers, thickness, and thermal conductivity.

[0117] By building an accurate PCB structure model, accurate thermal simulation can be performed, providing a solid foundation for subsequent temperature field analysis and parameter optimization. The accuracy of the model directly affects the reliability and performance of the final design.

[0118] Then, the contribution of the temperature field of each component on the circuit board to the overall temperature field of the circuit board is determined by using the method in the above embodiment. Specifically, this can be achieved with the help of Green's function, which is a tool used in mathematical physics to describe the response of the system. The Green's function theory is applied to calculate the influence of each heating element on the circuit board on the surrounding temperature field. The calculation of Green's function can decouple the mutual influence of the components on the circuit board on the temperature field and analyze the thermal behavior of each component separately, which is crucial for the accurate solution of component power and the optimization of thermal performance.

[0119] Then determine the temperature rise matrix of each component. The temperature rise matrix is ​​used to represent the dynamic temperature changes of each component on the circuit board during operation.

[0120] In this embodiment, the actual temperature measurement provides a means to verify the thermal analysis results in the circuit board design stage, and can confirm the degree of matching between the theoretical model and the actual situation. When the actual temperature is inconsistent with the determined temperature, it means that the temperature determination of a certain component on the circuit board may be wrong. Therefore, at this time, the temperature condition of the circuit board is decoupled through the actual temperature condition, that is, the steps of the above embodiment are reversed. By decoupling the temperature condition of the circuit board, the temperature condition of each component on the circuit board during operation can be determined.

[0121] In one embodiment, Figure 7 As shown, in step S610, after determining the temperature of each component on the circuit board during operation, the method includes: steps S700-S710, wherein:

[0122] Step S700, determining the heat dissipation area of ​​each component on the circuit board and the preset heat source model of each component.

[0123] Specifically, the heat dissipation area and the heat source model provide the necessary basic data for calculating the component power. The heat dissipation area affects the heat exchange efficiency between the component and the environment, while the heat source model defines the heat generation characteristics of the component.

[0124] Exemplarily, the heat dissipation area of ​​each component is determined through the circuit board design file and the component specification. This includes the bottom surface area in contact with the PCB, the side area and top area of ​​the component in the air, etc. At the same time, the preset heat source model is usually based on the electrical characteristics and working state of the component, for example, the rated power, current, voltage and other parameters of the component, combined with the thermal resistance characteristics of the component, the heat generation rate of the component can be estimated. The heat source model can also be established through experimental measurement or using thermal characteristic data provided by the component manufacturer.

[0125] Step S710, determining the power of each component on the circuit board according to the temperature of each component on the circuit board during operation, the heat dissipation area, and the preset heat source model of each component.

[0126] Specifically, by combining actual temperature measurement data, heat dissipation area and heat source model, the actual power consumption of each component on the circuit board can be reversely calculated.

[0127] Exemplarily, the actual power of the component is solved by mathematical calculation using a heat balance equation and the relationship between heat generation and heat dissipation of the component, combined with the measured actual temperature conditions, heat dissipation area conditions, and a preset heat source model.

[0128] The heat generation equation of the component can be expressed as:

[0129]

[0130] Among them, P is the power of the component, which means the thermal power of the component per unit time, that is, the heat generated or consumed by the component, and the unit is usually watt (W). The residual temperature of the component indicates the temperature difference between the component surface and the environment (residual temperature), that is, the component surface temperature minus the ambient temperature, in Kelvin (K), T is the actual temperature, T0 is the ambient temperature. S1 is the surface area of ​​the component in contact with the PCB. S2 is the surface area of ​​the component in the air, S = S1+S2 is the component surface. is the average residual temperature of the component surface, which is the difference between the average temperature of the entire component surface (including the surface in contact with the PCB and exposed to the air) minus the ambient temperature. q is the normal heat flux density of the surface, which represents the heat flux density transferred from the component to the surface in direct contact with the PCB through heat conduction, and the unit is watts per square meter (W / m²). h represents the convective heat transfer coefficient, which is the rate of heat exchange between the component surface and the surrounding air through natural convection (in the absence of forced airflow) or forced convection (such as fan forced airflow), and the unit is watts per square meter per Kelvin (W / m²K). q' represents the heat flux density after taking into account thermal radiation, that is, in addition to heat conduction and convection heat transfer, the heat released or absorbed by the component to the surrounding environment through thermal radiation, and the unit is watts per square meter (W / m²).

[0131] In this embodiment, determining the heat dissipation area and the heat source model can provide an accurate physical and mathematical description for the calculation of the component power, ensuring the accuracy of the power determination. By providing a method for determining the power situation of a component, it can be used to determine the actual power of a new component with unknown power or the actual power of a component with missing data.

[0132] It can provide key information for the thermal design of circuit boards, help designers identify components with high power consumption, and optimize circuit design to avoid overheating problems. In addition, by accurately calculating component power, the thermal performance of circuit boards can be more accurately evaluated to ensure the stability and reliability of electronic equipment under various working conditions, while also providing more scientific guidance for the manufacture of circuit boards.

[0133] In one embodiment, Figure 8 The figure shows a structural model of a circuit board. The model consists of two TPS54360DDAR chips (U1, U2) in SOP-8 package, two capacitors (C1, C2) in 0805 package, six chip capacitors (C3-C8) in 1210 package, two aluminum electrolytic capacitors (C10, C11) in SMD-2 package, multiple other capacitors (C12-C17), 10 resistors (R1-R10) in 0805 package, two integrated inductors (L1, L2) in 1040 package, three Schottky diodes SS56 (D1-D3) in SMA package, two light-emitting diodes (D4, D5) in 0805 package and two terminal blocks.

[0134] Specific experimental parameters: A dc / dc converter with a maximum input voltage of 60V was selected as the experimental object. The dc / dc converter includes positive and negative voltage outputs. The input end is connected in series with a Schottky diode to prevent reverse voltage. The positive and negative voltage circuits have the same structure, and the TPS54360 adjusts the input voltage to 15 V and -15 V output respectively. The maximum output current of the positive and negative voltage circuits is 3.5 V and 2.4 V respectively. The output voltage ripple is less than 120mv. The maximum conversion efficiency of the positive voltage circuit is 91%, and the maximum conversion efficiency of the negative voltage circuit is better than 77%.

[0135] By adjusting the input voltage and load of the positive and negative voltage output circuits, three groups of experiments were conducted (respectively: 1. Input voltage 20V, load positive voltage 10V, load negative voltage 30V, 2. Input voltage 25V, load positive voltage 10V, load negative voltage 30V, 1. Input voltage 30V, load positive voltage 10V, load negative voltage 30V). The PCB to be tested was placed on a rough workbench with the thermal imager lens facing the PCB surface at a distance of 0.2 m. The imaging area of ​​the thermal imager completely includes the PCB surface. The ambient temperature is 21.6℃ and the relative humidity is 5%. The wind speed is 0 during the experiment, so natural convection heat transfer occurs between the PCB and the air.

[0136] After adjusting the input voltage, each time the load is positive and negative, the voltage is applied continuously for 3 minutes to ensure that the PCB temperature reaches a steady state (the temperature at each location does not change over time), and then the thermal imager starts to collect thermal images. 15 measurement points are selected near the heating element to determine the temperature using the method of this application. The results are compared with those measured by traditional electrical methods.

[0137] The data obtained by comparing the modeling method of the present invention with the electrical method show that the relative error of the temperature result determined by the method of the present invention is no more than 10% compared with the temperature result determined by the traditional electrical method, and the average relative error is 5.65%. Compared with the electrical method, the results have good consistency. When the circuit input voltage and load are changed, the average calculation accuracy is less than 0.7%. Therefore, the PCB can use the method of the present invention to accurately and reliably calculate power under different working conditions. In addition, by adjusting the selection range of the temperature measurement point, the situation of incomplete imaging can be simulated.

[0138] The noise of infrared thermal imaging instruments includes thermal noise and amplifier noise, both of which are Gaussian white noise with a mean of 0 and a variance proportional to the temperature. Gaussian noise can be added in the experiment to simulate the thermal noise and amplifier noise of the infrared thermal imaging instrument. According to the experimental results, it can be verified that the method of the present application still has good performance under high noise levels. The noise robustness of the method of the present invention is verified.

[0139] In this embodiment, an experiment of measuring temperature using the method of the present application is given as an example. According to the experimental results, it is shown that the method of the present application can accurately measure the temperature of the PCB.

[0140] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0141] According to another aspect of the embodiments of the present application, a device for determining the temperature of a circuit board for implementing the above-mentioned method for determining the temperature of a circuit board is also provided. Fig. 9 As shown, the device comprises:

[0142] The component condition acquisition module 901 is used to acquire the component condition on the circuit board to be measured, wherein the component condition includes: the layout position of each component on the circuit board and the component parameters of each component.

[0143] The first temperature determination module 902 is used to determine, according to the component condition, a first surface area of ​​the component in contact with the circuit board and a second surface area of ​​the component exposed to the air; determine the power condition of the component during operation according to the component parameters, wherein the power condition is used to indicate the heat generation of the component; determine the normal heat flux density of the component on the first surface area according to the heat generation of the component; determine the thermal conduction heating condition of the component according to the normal heat flux density of the component and the first surface area; determine the heat exchange heating condition between the component and the air according to the second surface area and the environmental parameters of the area where the circuit board is located; determine the temperature condition of the component during operation according to the thermal conduction heating condition and the heat exchange heating condition of the component.

[0144] The thermal balance determination module 903 is used to determine the steady-state thermal balance relationship of the circuit board based on the actual manufacturing process parameters of the circuit board and the environmental parameters of the area where the circuit board is located, wherein the steady-state thermal balance relationship is used to indicate the influence of the temperature conditions at various positions on the circuit board on the temperature conditions of the circuit board.

[0145] The second temperature determination module 904 is used to superimpose the temperature conditions of each component during operation according to the arrangement position and the steady-state thermal balance relationship to determine the temperature condition of the circuit board.

[0146] In one embodiment, the heat balance determination module 903 is further used to determine the thermal conductivity model of the circuit board according to the plate material parameters used to make the circuit board and the heat transfer coefficient of the area where the circuit board is located. Under the preset boundary conditions, the steady-state thermal balance relationship of the circuit board is determined according to the thermal conductivity model and heat flux density of the circuit board. The boundary condition is that the inflow and outflow of heat energy at the boundary of the circuit board are equal.

[0147] In one embodiment, the second temperature determination module 904 is further used to determine the component temperature field corresponding to each component according to the temperature condition of each component during operation. The temperature field of the circuit board is determined according to the arrangement position of each component, the component temperature field corresponding to each component, and the steady-state thermal equilibrium relationship. The temperature field of the circuit board is used to indicate the temperature condition of the circuit board.

[0148] In one embodiment, the above device further comprises:

[0149] The adjustment determination module is used to determine the target adjustment parameters of the circuit board according to the temperature of the circuit board and the preset temperature target, wherein the target adjustment parameters include at least one of the following: component spacing, component layout position, and circuit board size.

[0150] The design optimization module is used to redesign the circuit board according to the target adjustment parameters of the circuit board so that the temperature of the redesigned circuit board reaches the preset temperature target.

[0151] In one embodiment, the above device further comprises:

[0152] The measurement module is used to measure the actual temperature of the circuit board during operation.

[0153] The temperature determination module is used to determine the temperature conditions of various components on the circuit board during operation according to the steady-state thermal balance relationship, the actual temperature conditions, and the component conditions when the actual temperature conditions are inconsistent with the determined temperature conditions.

[0154] In one embodiment, the above device further comprises:

[0155] The parameter determination module is used to determine the heat dissipation area of ​​each component on the circuit board and the preset heat source model of each component.

[0156] The power determination module is used to determine the power of each component on the circuit board according to the temperature of each component on the circuit board during operation, the heat dissipation area, and the preset heat source model of each component.

[0157] In the embodiments of the present application, the term "module" or "unit" refers to a computer program or a part of a computer program that has a predetermined function and works together with other related parts to achieve a predetermined goal, and can be implemented in whole or in part by using software, hardware (such as processing circuits or memories), or a combination thereof. Similarly, a processor (or multiple processors or memories) can be used to implement one or more modules or units. In addition, each module or unit can be part of an overall module or unit that includes the function of the module or unit.

[0158] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0159] According to one aspect of the present application, a computer program product is provided. The computer program product includes a computer program.

[0160] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0161] Fig.10 The structure block diagram of a computer system for implementing an electronic device according to an embodiment of the present application is schematically shown.

[0162] It should be noted that Fig.10 The computer system 1000 of the electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0163] like Fig.10 As shown, the computer system 1000 includes a central processing unit 1001 (CPU), which can perform various appropriate actions and processes according to the program stored in the read-only memory 1002 (ROM) or the program loaded from the storage part 1008 to the random access memory 1003 (RAM). Various programs and data required for system operation are also stored in the random access memory 1003. The central processing unit 1001, the read-only memory 1002 and the random access memory 1003 are connected to each other through a bus 1004. The input / output interface 1005 (Input / Output interface, i.e., I / O interface) is also connected to the bus 1004.

[0164] The following components are connected to the input / output interface 1005: an input section 1006 including a keyboard, a mouse, etc.; an output section 1007 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 1008 including a hard disk, etc.; and a communication section 1009 including a network interface card such as a LAN card, a modem, etc. The communication section 1009 performs communication processing via a network such as the Internet. A drive 1011 is also connected to the input / output interface 1005 as needed. A removable medium 1011, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1011 as needed so that a computer program read therefrom is installed into the storage section 1008 as needed.

[0165] In particular, according to an embodiment of the present application, the process described in each method flow chart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer readable medium, and the computer program contains a program code for executing the method shown in the flow chart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 1009, and / or installed from the removable medium 1011. When the computer program is executed by the central processor 1001, various functions defined in the system of the present application are executed.

[0166] In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 1009, and / or installed from the removable medium 1011. When the computer program is executed by the central processor 1001, various functions provided by the embodiments of the present application are executed.

[0167] According to another aspect of the embodiment of the present application, an electronic device for implementing the method for determining the temperature of the circuit board is provided. The electronic device may be Figure 1 The terminal device or server shown in the figure. This embodiment is described by taking the electronic device as a terminal device as an example. Fig.11 As shown, the electronic device includes a memory 1102 and a processor 1104. The memory 1102 stores a computer program. The processor 1104 is configured to execute the steps of at least one of the above method embodiments through the computer program.

[0168] Optionally, in this embodiment, the electronic device may be located in at least one network device among a plurality of network devices of a computer network.

[0169] Optionally, in this embodiment, the above-mentioned processor can be configured to execute the methods in each embodiment of the present application through a computer program.

[0170] Alternatively, a person skilled in the art may understand that: Fig.11 The structure shown is for illustration only. Fig.11 The structure of the electronic device is not limited. Fig.11 More or fewer components (such as network interfaces, etc.) as shown in, or with Fig.11 Different configurations are shown.

[0171] Among them, the memory 1102 can be used to store software programs and modules, such as the program instructions / modules corresponding to the method and device for determining the temperature condition of the circuit board in the embodiment of the present application. The processor 1104 executes various functional applications and data processing by running the software programs and modules stored in the memory 1102, that is, realizing the above-mentioned method for determining the temperature condition of the circuit board. The memory 1102 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 1102 may further include a memory remotely located relative to the processor 1104, and these remote memories may be connected to the terminal via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof. Among them, the memory 1102 can be specifically, but not limited to, used for information such as device information. As an example, such as Fig.11 As shown, the memory 1102 may include, but is not limited to, the modules in the device for determining the temperature condition of the circuit board, which will not be described in detail in this example.

[0172] Optionally, the transmission device 1106 is used to receive or send data via a network. Specific examples of the network may include a wired network and a wireless network. In one example, the transmission device 1106 includes a network adapter (Network Interface Controller, NIC), which can be connected to other network devices and routers via a network cable so as to communicate with the Internet or a local area network. In one example, the transmission device 1106 is a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0173] In addition, the electronic device further includes: a display 1108 for displaying the data transmitted by the target device; and a connection bus 1110 for connecting various module components in the electronic device.

[0174] In other embodiments, the terminal device or server may be a node in a distributed system, wherein the distributed system may be a blockchain system, and the blockchain system may be a distributed system formed by connecting the multiple nodes through network communication. The nodes may form a peer-to-peer network, and any form of computing device, such as a server, terminal or other electronic device, may become a node in the blockchain system by joining the peer-to-peer network.

[0175] According to one aspect of the present application, a computer-readable storage medium is provided, and a processor of an electronic device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the electronic device executes the method for determining the temperature condition of the circuit board provided in various optional implementations of the above-mentioned determination of the temperature condition of the circuit board.

[0176] Optionally, in this embodiment, the above-mentioned computer-readable storage medium can be configured to store data for executing the methods in various embodiments of the present application.

[0177] Optionally, in this embodiment, a person of ordinary skill in the art may understand that all or part of the steps in the various methods of the above embodiments may be completed by instructing hardware related to the terminal device through a program, and the program may be stored in a computer-readable storage medium, and the storage medium may include: a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0178] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0179] If the integrated units in the above embodiments are implemented in the form of software functional units and sold or used as independent products, they can be stored in the above computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for one or more electronic devices to execute all or part of the steps of the methods described in each embodiment of the present application.

[0180] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0181] In the several embodiments provided in the present application, it should be understood that the disclosed application can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0182] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0183] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0184] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for determining the temperature of a circuit board, characterized in that: include: Acquire the component conditions on the circuit board to be measured, wherein the component conditions include: the arrangement positions of the various components on the circuit board and the component parameters of the various components; According to the component condition, determining a first surface area of ​​the component in contact with the circuit board and a second surface area of ​​the component exposed to the air; Determining the power condition of the component during operation according to the component parameters, wherein the power condition is used to indicate the heat generated by the component; Determining the normal heat flux density of the element on the first surface area according to the calorific value of the element; Determining heat conduction heating conditions of the element according to the normal heat flux density of the element and the first surface area; Determining heat exchange and heating conditions between the component and the air according to the second surface area and environmental parameters of the area where the circuit board is located; Determining the temperature of the element during operation according to the heat conduction heating and the heat exchange heating of the element; Determine a steady-state thermal balance relationship of the circuit board according to actual manufacturing process parameters of the circuit board and environmental parameters of the area where the circuit board is located, wherein the steady-state thermal balance relationship is used to indicate the influence of the temperature conditions of various positions on the circuit board on the temperature conditions of the circuit board; According to the arrangement position and the steady-state thermal equilibrium relationship, the temperature conditions of the various components during operation are superimposed to determine the temperature condition of the circuit board.

2. The method according to claim 1, characterized in that Determining the steady-state thermal balance relationship of the circuit board according to actual manufacturing process parameters of the circuit board and environmental parameters of the area where the circuit board is located includes: Determining a thermal conductivity model of the circuit board according to the plate material parameters used to make the circuit board and the heat transfer coefficient of the area where the circuit board is located; Under preset boundary conditions, the steady-state thermal equilibrium relationship of the circuit board is determined according to the thermal conductivity model of the circuit board and the heat flux density; wherein the boundary condition is that the inflow and outflow of heat energy at the boundary of the circuit board are equal.

3. The method according to claim 1, characterized in that The step of superimposing the temperature conditions of the various components during operation according to the arrangement positions and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board includes: Determining the component temperature fields corresponding to the components respectively according to the temperature conditions of the components during operation; The temperature field of the circuit board is determined according to the arrangement positions of the various components, the component temperature fields corresponding to the various components, and the steady-state thermal equilibrium relationship; wherein the temperature field of the circuit board is used to indicate the temperature condition of the circuit board.

4. The method according to any one of claims 1 to 3, characterized in that: After the temperature conditions of the various components during operation are superimposed according to the arrangement positions and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board, the method further includes: Determining target adjustment parameters of the circuit board according to the temperature of the circuit board and a preset temperature target, wherein the target adjustment parameters include at least one of the following: component spacing, component layout position, and circuit board size; The circuit board is redesigned according to the target adjustment parameters of the circuit board so that the temperature of the redesigned circuit board reaches the preset temperature target.

5. The method according to any one of claims 1 to 3, characterized in that: After the temperature conditions of the various components during operation are superimposed according to the arrangement positions and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board, the method further includes: Measuring the actual temperature of the circuit board during operation; When the actual temperature condition is inconsistent with the determined temperature condition, the temperature condition of each component on the circuit board during operation is determined according to the steady-state thermal equilibrium relationship, the actual temperature condition, and the component condition.

6. The method according to claim 5, characterized in that After determining the temperature of each component on the circuit board during operation, the method further includes: Determine the heat dissipation area of ​​each component on the circuit board and the preset heat source model of each component; The power condition of each component on the circuit board is determined according to the temperature condition of each component on the circuit board during operation, the heat dissipation area condition, and the preset heat source model of each component.

7. A device for determining the temperature of a circuit board, characterized in that: include: A component condition acquisition module, used to acquire the component condition on the circuit board to be measured, wherein the component condition includes: the arrangement position of each component on the circuit board and the component parameters of each component; A first temperature determination module is used to determine, according to the component condition, a first surface area of ​​the component in contact with the circuit board and a second surface area of ​​the component exposed to the air; determine, according to the component parameters, a power condition of the component during operation, wherein the power condition is used to indicate a heat generation of the component; determine, according to the heat generation of the component, a normal heat flux density of the component on the first surface area; determine, according to the normal heat flux density of the component and the first surface area, a heat conduction heating condition of the component; determine, according to the second surface area and environmental parameters of the area where the circuit board is located, a heat exchange heating condition between the component and the air; and determine, according to the heat conduction heating condition and the heat exchange heating condition of the component, a temperature condition of the component during operation; a thermal balance determination module, used to determine a steady-state thermal balance relationship of the circuit board according to actual manufacturing process parameters of the circuit board and environmental parameters of the area where the circuit board is located, wherein the steady-state thermal balance relationship is used to indicate the influence of the temperature conditions of various positions on the circuit board on the temperature conditions of the circuit board; The second temperature determination module is used to superimpose the temperature conditions of the various components during operation according to the arrangement positions and the steady-state thermal equilibrium relationship to determine the temperature condition of the circuit board.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored computer program, wherein the computer program can be executed by an electronic device to perform the method described in at least one of claims 1 to 6.

9. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method described in at least one of claims 1 to 6 are implemented.

10. An electronic device comprising a memory and a processor, characterized in that: A computer program is stored in the memory, and the processor is configured to execute the method described in at least one of claims 1 to 6 through the computer program.

Images