Layout method and system, device and storage medium of layout metal vias

Abstract

The present invention provides a method and system, device, and storage medium for arranging metal vias in a layout. The steps of the method include: dividing the layout into multiple regions to be processed; obtaining the metal density of the regions to be processed; determining the size, spacing, and setting positions of the metal vias in the regions to be processed according to the metal density; and setting the metal vias in the regions to be processed according to the size, spacing, and setting positions of the metal vias. This method can automatically set metal vias in the layout and adjust the metal density of each region in the layout.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductors, and particularly relates to a method and system for arranging metal vias in a layout, a device, and a storage medium. Background Art

[0002] In the process of manufacturing semiconductor devices, patterning techniques are often used to pattern the film layers of semiconductor devices, such as forming metal vias, grooves, etc.

[0003] Patterning techniques generally include steps such as coating photoresist, exposure, development, and etching. When etching a metal layer, a photoresist layer is first formed on the surface of the metal layer. Subsequently, the photoresist layer is exposed through a photolithography layout. The areas of the photoresist layer irradiated by light will be removed in the subsequent development step, and the areas of the photoresist layer blocked by the photolithography layout will be retained in the subsequent development step. Finally, through the etching step, the metal layer not blocked by the photoresist layer is etched to form a patterned area (such as metal vias, grooves, etc.) on the surface of the metal layer.

[0004] The metal layer in a semiconductor device is generally formed by electroplating. Due to the defects inherent in the electroplating process, the thickness of the metal layer is uneven. For example, the thickness of the metal layer in the edge region is relatively thick, and the thickness of the metal layer in the central region is relatively thin. Therefore, after forming a pattern on the metal layer using a patterning technique, the metal layer needs to be polished to make the surface of the metal layer uniform.

[0005] However, due to the influence of the photolithography layout, after patterning the metal layer, the remaining metal parts of the metal layer are not evenly distributed. For example, in some areas, more metal of the metal layer is retained (that is, less etching of the metal layer occurs in this area), resulting in a situation of local large metal blocks, while in some areas, less metal of the metal layer is retained (more etching of the metal layer occurs in this area). For the situation of local large metal blocks, when flattening the metal layer (that is, polishing the surface of the metal layer using a chemical mechanical polishing process), the polishing effect is relatively poor, and the surface of the large metal layer cannot be polished flat enough. If the surface of the metal layer is not flat enough, it will affect the subsequent process, be unfavorable to the yield of the subsequent process, and also be unfavorable to the performance of the finally formed semiconductor device. Summary of the Invention

[0006] The present invention provides a method and system for arranging metal vias in a layout, a device, and a storage medium, which can automatically set metal vias in the layout and adjust the metal density of each area in the layout.

[0007] On the one hand, a method for arranging metal vias in a layout is provided. The method for arranging metal vias in a layout includes:

[0008] Divide the layout into multiple areas to be processed;

[0009] Obtain the metal density of the area to be processed;

[0010] Determine the size, spacing, and setting position of the metal vias in the area to be processed according to the metal density;

[0011] Set metal vias in the area to be processed according to the size, spacing, and setting position of the metal vias.

[0012] Optionally, the step of obtaining the metal density of the area to be processed includes:

[0013] Obtain the area of the metal layer in the area to be processed and the area of the area to be processed, and the metal density of the area to be processed is equal to the ratio of the area of the metal layer in the area to be processed to the area of the area to be processed.

[0014] Optionally, the step of determining the size, spacing, and setting position of the metal vias in the area to be processed according to the metal density includes:

[0015] When the metal density in the area to be processed exceeds the metal density threshold, determine that metal vias need to be set in the area to be processed;

[0016] According to the preset size range of the metal vias, the spacing range of the metal vias, and the size of the metal layer in the area to be processed, determine the area to be vias in the area to be processed as the setting area of the metal vias;

[0017] Determine the magnitude of the metal density that needs to be reduced in the area to be processed according to the magnitude of the metal density of the area to be processed and the metal density threshold;

[0018] Determine the magnitude of the metal density that needs to be reduced in each area to be vias according to the size of each area to be vias in the area to be processed;

[0019] Determine the size, spacing, and setting position of the metal vias in each area to be vias according to the magnitude of the metal density that needs to be reduced in each area to be vias, the size of each area to be vias, the preset size range of the metal vias, and the spacing range of the metal vias.

[0020] Optionally, the step of determining the size, spacing, and setting position of the metal vias in each area to be vias according to the magnitude of the metal density that needs to be reduced in each area to be vias, the size of each area to be vias, the preset size range of the metal vias, and the spacing range of the metal vias includes:

[0021] Adopt the formula 、 , with the principle of minimizing the number of metal vias and the metal vias being arranged in an array, determine the size, spacing, and setting position of the metal vias;

[0022] Among them, represents the width of the area where holes are to be arranged, represents the length of the area where holes are to be arranged; represents the number of rows of metal holes, represents the number of columns of metal holes; represents the maximum width of the row of metal holes, represents the maximum length of the column of metal holes; represents the spacing between the row and the row of metal holes, represents the spacing between the

[0023] Optionally, according to the magnitude of the metal density to be reduced in each area where holes are to be arranged, the size of each area where holes are to be arranged, the preset size range of metal holes, and the spacing range of metal holes, the steps of determining the size, spacing, and setting position of metal holes in each area where holes are to be arranged include:

[0024] According to the magnitude of the metal density to be reduced in each area where holes are to be arranged, the size of each area where holes are to be arranged, the preset size range of metal holes, and the spacing range of metal holes, determine the largest metal holes that can be set in each area where holes are to be arranged, and use them as the first metal holes;

[0025] Calculate the metal density of the area to be processed after filling the first metal holes in the area where holes are to be arranged;

[0026] When the metal density of the area to be processed after filling the first metal holes in the area to be processed is higher than the metal density threshold, determine again the magnitude of the metal density to be reduced in each area where holes are to be arranged according to the size of each area where holes are to be arranged in the area to be processed;

[0027] According to the magnitude of the metal density to be reduced in each area where holes are to be arranged, the size of each area where holes are to be arranged, the preset size range of metal holes, and the spacing range of metal holes, determine the largest metal holes that can be set in each area where holes are to be arranged, and use them as the second metal holes;

[0028] After setting the second metal holes in the area to be hole - placed, calculate the density of the area to be hole - placed again. If the density of the area to be hole - placed does not meet the requirements, determine a new metal density reduction threshold and the maximum metal holes that can be set in the area to be hole - placed again until the metal density in the area to be processed is lower than the metal density threshold, and then output the size, spacing, and setting position of the determined metal holes.

[0029] Optionally, the step of determining the size, spacing, and setting position of the metal holes in the area to be processed further includes:

[0030] Use a movable window to scan and determine the metal density at all positions in the layout. If the metal density under the area covered by the movable window is higher than the metal density threshold, determine the area covered by the movable window as the area to be processed;

[0031] According to the magnitude relationship between the metal density of the area to be processed and the metal density threshold, determine the magnitude of the metal density that needs to be reduced in the area to be processed;

[0032] According to the size of each area to be hole - placed in the area to be processed, determine the magnitude of the metal density that needs to be reduced in each area to be hole - placed;

[0033] According to the magnitude of the metal density that needs to be reduced in each area to be hole - placed, the size of each area to be hole - placed, the preset size range of the metal holes, and the spacing range of the metal holes, determine the size, spacing, and setting position of the metal holes in each area to be hole - placed.

[0034] Optionally, the method for arranging the layout metal holes further includes:

[0035] Perform a design rule check on the layout to determine whether the size, spacing, and setting position of the metal holes meet the design rules; when the size, spacing, and setting position of the metal holes do not meet the design rules, re - determine the size, spacing, and setting position of the metal holes in each area to be processed in the layout.

[0036] On the other hand, a system for arranging layout metal holes is provided. The system for arranging layout metal holes includes:

[0037] A layout division module for dividing the layout into multiple areas to be processed;

[0038] A metal density acquisition module for acquiring the metal density of the area to be processed;

[0039] A metal hole determination module for determining the size, spacing, and setting position of the metal holes in the area to be processed according to the metal density;

[0040] A metal hole setting module for setting metal holes in the area to be processed according to the size, spacing, and setting position of the metal holes.

[0041] On the other hand, an electronic device is provided, which includes the layout metal hole arrangement system as described above.

[0042] On the other hand, a computer-readable storage medium is provided, in which at least one program code is stored, and the program code is executed by a processor to implement the layout metal hole arrangement method as described in any one of the above.

[0043] The unexpected technical effects achieved by the technical solution provided by the present invention are as follows:

[0044] In the embodiments of the present disclosure, a method for arranging layout metal holes is provided. This method automatically sets metal holes according to the metal density of the area to be processed. The unexpected technical effects are that by setting metal holes based on the metal density of the area to be processed, on the one hand, it can ensure that the overall metal density of the layout meets the requirements, and on the other hand, it can ensure that the local metal density of the layout meets the requirements, thereby ensuring a relatively uniform metal distribution in the layout and relatively uniform metal density in each area of the layout. By setting metal holes through this method, while ensuring the layout efficiency, the uniformity of the metal density in the layout can be ensured. When subsequently patterning the metal layer of a semiconductor device using a layout with relatively uniform metal density in each area, it can be ensured that after the metal layer is patterned, the metal distribution in the metal layer is relatively uniform and there will be no situation of large local metal blocks. A uniform distribution of the metal layer is beneficial for planarizing the metal layer, so that after planarizing the metal layer, the surface of the metal layer can be relatively flat to ensure the yield of subsequent process steps and the performance of the finally formed semiconductor device. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0046] Figure 1 It is a flowchart of a method for arranging layout metal holes provided by an embodiment of the present disclosure;

[0047] Figure 2 It is a flowchart of another method for arranging layout metal holes provided by an embodiment of the present disclosure;

[0048] Figure 3 It is a schematic diagram of a layout provided by an embodiment of the present disclosure;

[0049] Figure 4Schematic diagram of another layout provided by an embodiment of the present disclosure;

[0050] Figure 5 Schematic diagram of another layout provided by an embodiment of the present disclosure;

[0051] Figure 6 Schematic diagram of a region to be drilled provided by an embodiment of the present disclosure;

[0052] Figure 7 Schematic diagram of another region to be processed provided by an embodiment of the present disclosure;

[0053] Figure 8 Schematic diagram of another region to be drilled provided by an embodiment of the present disclosure;

[0054] Figure 9 Schematic diagram of a movable window provided by an embodiment of the present disclosure;

[0055] Figure 10 Schematic diagram of another movable window provided by an embodiment of the present disclosure;

[0056] Figure 11 Schematic diagram of another movable window provided by an embodiment of the present disclosure;

[0057] Figure 12 Block diagram of the structure of a layout metal hole arrangement system provided by an embodiment of the present disclosure;

[0058] Figure 13 Block diagram of the structure of an electronic device provided by an embodiment of the present disclosure.

[0059] Reference numerals are as follows:

[0060] 1: Layout; 11: Metal layer; 110: Metal layer selected as the region to be drilled; 111: First metal region; 112: Second metal region; 113: Third metal region; 12: Region to be processed; 13: Region to be drilled; 131: First region to be drilled; 132: Second region to be drilled; 133: Third region to be drilled; 14: Metal hole; 141: First metal hole; 142: Second metal hole; 143: Third metal hole; 144: Fourth metal hole; 15: Movable window;

[0061] 301: Layout division module; 302: Metal density acquisition module; 303: Metal hole determination module; 304: Metal hole setting module;

[0062] 401: Processor; 402: Memory. Detailed implementation manners

[0063] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts shall fall within the protection scope of the present invention.

[0064] Figure 1 It is a flowchart of a method for arranging layout metal vias provided by an embodiment of the present disclosure. Refer to Figure 1 The method steps include:

[0065] S101. Divide the layout into multiple regions to be processed.

[0066] S102. Obtain the metal density of the region to be processed.

[0067] S103. Determine the size, spacing, and setting position of the metal vias in the region to be processed according to the metal density.

[0068] S104. Set the metal vias in the region to be processed according to the size, spacing, and setting position of the metal vias.

[0069] In an embodiment of the present disclosure, a method for arranging layout metal vias is provided. The method automatically sets metal vias according to the metal density of the region to be processed. The unexpected technical effect is to set metal vias based on the metal density of the region to be processed. On the one hand, it can ensure that the overall metal density of the layout meets the requirements, and on the other hand, it can ensure that the local metal density of the layout meets the requirements, thereby ensuring that the metal distribution in the layout is relatively uniform and the metal density in each region of the layout is relatively uniform. By setting metal vias through this method, while ensuring the arrangement efficiency, the uniformity of the metal density in the layout can be ensured. When subsequently patterning the metal layer of a semiconductor device using a layout with relatively uniform metal density in each region, it can be ensured that after the metal layer is patterned, the metal layer is relatively uniformly distributed and there will be no situation of large local metal blocks. The uniform distribution of the metal layer will be beneficial to the planarization process of the metal layer, thereby ensuring that after the planarization process of the metal layer, the surface of the metal layer can be relatively flat to ensure the yield of subsequent process steps and the performance of the finally formed semiconductor device.

[0070] Figure 2 It is a flowchart of another method for arranging layout metal vias provided by an embodiment of the present disclosure. Refer to Figure 2 The method steps include:

[0071] S201. Divide the layout into multiple regions to be processed.

[0072] In step S201, the layout can be divided into multiple rectangular regions of the same size, multiple rectangular regions of different sizes, or multiple regions of other shapes, and the present disclosure does not limit this.

[0073] Figure 3 It is a schematic diagram of a layout provided by an embodiment of the present disclosure. Among them, the layout Figure 1 has multiple metal layers 11 of different sizes, and the space regions (i.e., the regions where the metal layers are etched) are between the metal layers 11.

[0074] Figure 4 It is a schematic diagram of another layout provided by an embodiment of the present disclosure. Refer to Figure 4 , in Figure 4 a schematic diagram after the layout is divided is shown. Among them, the layout Figure 1 is divided into 9 rectangular regions to be processed 12 by a dashed line.

[0075] S202. Obtain the metal density of the region to be processed.

[0076] In one example, step S202 includes:

[0077] Obtain the area of the metal layer in the region to be processed and the area of the region to be processed. The metal density of the region to be processed is equal to the ratio of the area of the metal layer in the region to be processed to the area of the region to be processed.

[0078] In this embodiment, the metal density in a certain region is determined according to the ratio of the metal area in that region and the area of that region.

[0079] Figure 5 It is a schematic diagram of another layout provided by an embodiment of the present disclosure. Refer to Figure 5 , taking the region to be processed 12 in the upper left corner of the layout as an example, the metal layer 11 in the region to be processed 12 in the upper left corner includes 3 metal regions, namely the first metal region 111, the second metal region 112, and the third metal region 113. The area of the first metal region 111 is respectively , the area of the second metal region 112 is , the area of the third metal region 113 is , and the area of the region to be processed 12 in the upper left corner is , then the metal density of the region to be processed 12 in the upper left corner is .

[0080] S203. Determine the size, pitch, and setting position of the metal vias in the region to be processed according to the metal density.

[0081] In one example provided by the present invention, step S203 includes:

[0082] Step 1: When the metal density in the area to be processed exceeds the metal density threshold, determine that metal holes need to be set in the area to be processed.

[0083] Among them, the metal density threshold can be set as needed. For example, the metal density threshold can be 50%, 40%, etc.

[0084] Step 2: According to the preset size range of the metal holes, the spacing range of the metal holes, and the size of the metal layer in the area to be processed, determine the area to be drilled in the area to be processed as the area for setting the metal holes.

[0085] Among them, the area to be processed includes multiple metal areas. By determining the area size of each metal area, it is determined whether each metal area can accommodate metal holes. If it can accommodate, then determine that metal area as the area to be drilled.

[0086] In one example, whether a metal area can accommodate metal holes can be determined in the following way:

[0087] Use the size of the smallest metal hole in the preset size range of the metal holes (i.e., the smallest length and the smallest width ), and the smallest boundary spacing in the preset spacing range of the metal holes (i.e., the smallest vertical spacing and the smallest horizontal spacing ), and fill a smallest metal hole into this metal area. If this metal area can accommodate a metal hole with the smallest size, then determine this metal area as the area to be drilled.

[0088] Step 3: According to the size relationship between the metal density of the area to be processed and the metal density threshold, determine the size of the metal density that needs to be reduced in the area to be processed.

[0089] In Step 3, the size of the metal density that needs to be reduced is greater than or equal to the difference between the metal density of the area to be processed and the metal density threshold.

[0090] Step 4: According to the size of each area to be drilled in the area to be processed, determine the size of the metal density that needs to be reduced in each area to be drilled.

[0091] In one example, according to the area ratio of each area to be drilled, determine the proportion of the metal density that needs to be reduced in each area to be drilled. According to the size of the metal density that needs to be reduced in the area to be processed and the proportion of the metal density that needs to be reduced in each area to be drilled, determine the size of the metal density that needs to be reduced in each area to be drilled.

[0092] Step 5. Determine the size, spacing, and setting position of the metal holes in each area to be drilled with holes according to the magnitude of the metal density to be reduced in each area to be drilled with holes, the size of each area to be drilled with holes, the preset size range of the metal holes, and the spacing range of the metal holes.

[0093] In an example provided by the present invention, Step 5 includes:

[0094] Adopt the formula , , and determine the size, spacing, and setting position of the metal holes based on the principle that the number of metal holes is the least and the metal holes are arranged in an array;

[0095] Wherein, represents the width of the area to be drilled with holes, represents the length of the area to be drilled with holes; represents the number of rows of metal holes, represents the number of columns of metal holes; represents the maximum width of the th row of metal holes, represents the maximum length of the th column of metal holes; represents the spacing between the th row and the th row of metal holes, represents the spacing between the th column and the th column of metal holes; represents the spacing between the first row and the last row of metal holes and the edge of the area to be drilled with holes, represents the spacing between the first column and the last column of metal holes and the edge of the area to be drilled with holes.

[0096] In this embodiment, according to the size of each area to be drilled with holes, and based on the principle of array distribution of metal holes and the least number of metal holes, determining the size and spacing of the metal holes in each area to be drilled with holes is beneficial to ensuring that the metal holes are relatively evenly distributed in each area to be drilled with holes and the efficiency of arranging the metal holes is relatively high.

[0097] When determining the size and spacing of the metal holes by using the above formula, it is possible to further make the metal hole spacing the smallest (that is, , , and all adopt the minimum value), and the metal hole size the largest (among , , and In the case where the minimum values are all adopted, the width and length of the metal holes are correspondingly determined. The size and spacing of the metal holes are determined based on the principle that the larger the metal holes are set, the fewer the number of metal holes that ultimately need to be set, which is beneficial to the layout efficiency of the metal holes.

[0098] In this embodiment, to further simplify the layout rules and accelerate the layout efficiency of the metal holes, the size and spacing of the metal holes in the same area to be filled with holes can be further set to the same size. For example, the length and width of each metal hole are the same, the spacing between each row of metal holes is the same, and the spacing between each column of metal holes is the same.

[0099] See Figure 6 and 7 the situation shown in Figure 6 wherein Figure 7 is the structure of the layout before the metal holes are set, and

[0100] In another example provided by the present invention, step 5 includes:

[0101] First step, according to the magnitude of the metal density to be reduced in each area to be filled with holes, the size of each area to be filled with holes, the preset size range of the metal holes, and the spacing range of the metal holes, determine the largest metal holes that can be set in each area to be filled with holes as the first metal holes.

[0102] See Figure 8 the situation shown in Figure 8 wherein the area to be processed 12 in

[0103] includes a first area to be filled with holes 131, a second area to be filled with holes 132, and a third area to be filled with holes 133. Determine the first metal holes 141 for the first area to be filled with holes 131, the second area to be filled with holes 132, and the third area to be filled with holes 133 respectively. Figure 8 In this embodiment, if after the area to be filled with holes is filled with the first metal holes, the metal density reduced in this area to be filled with holes is exactly equal to the metal density that needs to be reduced and is allocated to this area to be filled with holes, as in

[0104] the situation of the second area to be filled with holes in Figure 8The situations of the first hole-to-be-arranged area and the second hole-to-be-arranged area. At this time, the first metal hole is arranged at the edge of the first hole-to-be-arranged area and the second hole-to-be-arranged area, and further determine the size and position of the second metal hole that can be arranged in the first hole-to-be-arranged area and the second hole-to-be-arranged area.

[0105] Step 2: Calculate the metal density of the area to be processed after filling the first metal hole in the hole-to-be-arranged area.

[0106] Among them, if the metal density of the area to be processed is exactly equal to the metal density threshold after filling the first metal hole in the hole-to-be-arranged area, determine the first metal hole as the metal hole to be filled in the area to be processed. Otherwise, it is necessary to further determine the second metal hole to further reduce the metal density of the area to be processed.

[0107] Step 3: When the metal density of the area to be processed is higher than the metal density threshold after filling the first metal hole in the area to be processed, again determine the size of the metal density to be reduced in each hole-to-be-arranged area according to the size of each hole-to-be-arranged area in the area to be processed.

[0108] See Figure 8 In the situation in, after filling the first metal hole, the metal density reduced in the first hole-to-be-arranged area is still greater than the metal density to be reduced in the first hole-to-be-arranged area, and the metal density reduced in the second hole-to-be-arranged area is still greater than the metal density to be reduced in the second hole-to-be-arranged area. At this time, further determine the size of the metal density that needs to be continuously reduced in the first hole-to-be-arranged area and the second hole-to-be-arranged area.

[0109] Step 4: According to the size of the metal density to be reduced in each hole-to-be-arranged area, the size of each hole-to-be-arranged area, the preset size range of the metal hole, and the spacing range of the metal holes, determine the largest metal hole that can be arranged in each hole-to-be-arranged area as the second metal hole.

[0110] See Figure 8 In the situation in, if the maximum size (maximum width and maximum length) in the preset size range of the metal hole is used as the size of the second metal hole, and after filling the second metal hole into the hole-to-be-arranged area, the size of the metal density reduced in the hole-to-be-arranged area is greater than the size of the metal density to be reduced in the hole-to-be-arranged area, then the size of the second metal hole can be determined according to the size of the metal density to be reduced in the hole-to-be-arranged area (such as the situation under the second hole-to-be-arranged area), so that after filling the second metal hole into the hole-to-be-arranged area, the size of the metal density reduced in the hole-to-be-arranged area is exactly equal to the size of the metal density to be reduced in the hole-to-be-arranged area.

[0111] Step 5: After setting the second metal holes in the area to be hole-arranged, calculate the density of the area to be hole-arranged again. If the density of the area to be hole-arranged does not meet the requirements, determine a new metal density reduction threshold and the maximum metal holes that can be set in the area to be hole-arranged again until the metal density in the area to be processed is lower than the metal density threshold, and then output the size, spacing, and setting positions of the determined metal holes.

[0112] Refer to Figure 8 In the situation shown in , after filling the first metal holes 141 and the second metal holes 142 in the first area to be hole-arranged 131, if the reduced metal density in the first area to be hole-arranged 131 still does not meet the required size of the metal density to be reduced in the first area to be hole-arranged 131, further determine the size of the third metal holes 143 in the first area to be hole-arranged 131.

[0113] In another example provided by the present invention, step 5 may further include:

[0114] Step 1: Use a movable window to scan and determine the metal density at all positions in the layout; if the metal density under the area covered by the movable window is higher than the metal density threshold, determine the area covered by the movable window as the area to be processed.

[0115] Refer to Figure 9 In the situation shown in , the movable window 15 starts from the upper left corner of the layout and sequentially scans to determine the metal density of each area in the layout. The dashed arrow in the figure indicates the moving direction of the movable window. Figure 1

[0116] Figure 10 Refer to In the situation shown in , after the movable window 15 sequentially moves from the upper left corner to the upper right corner of the layout, the moving direction of the movable window changes to move downward.

[0117] Refer to Figure 11 In the situation shown in , after the movable window moves downward by a distance equal to half the width of the movable window, it starts to move from the rightmost side to the leftmost side of the layout. Among them, moving the movable window downward by a distance equal to half the width of the movable window can avoid the situation of missed detection in some areas of the layout. Specifically, refer to Figure 4 In the situation shown in , part of the metal area is divided into two parts by a dashed line, which will cause a large metal block to be divided into two small metal blocks with smaller areas, resulting in the possibility that the two small metal blocks may be ignored or the size of the metal holes filled in the two small metal blocks is small. By using the movable window method, the above situation can be avoided.

[0118] By adopting the above moving method, the movable window sequentially determines the metal density of each area in the layout.

[0119] Of course, the moving manner of the above movable window is only an example provided by the present invention. In actual situations, other moving manners may also be adopted, and the present invention does not limit this.

[0120] Step 2: Determine the magnitude of the metal density to be reduced in the area to be processed according to the magnitude relationship between the metal density in the area to be processed and the metal density threshold.

[0121] Step 3: Determine the magnitude of the metal density to be reduced in each hole-placement area in the area to be processed according to the size of each hole-placement area in the area to be processed.

[0122] Step 4: Determine the size, spacing, and setting position of the metal holes in each hole-placement area according to the magnitude of the metal density to be reduced in each hole-placement area, the size of each hole-placement area, the preset size range of the metal holes, and the spacing range of the metal holes.

[0123] In this embodiment, the method of dynamically determining the metal density of each area in the layout using a movable window can be used after the metal holes are set, so as to further check the areas with excessive local metal density in the layout. Alternatively, the method of dynamically determining the metal density of each area in the layout using a movable window can be directly adopted to arrange metal holes in the layout.

[0124] S204: Set metal holes in the area to be processed according to the size, spacing, and setting position of the metal holes.

[0125] After determining the size, spacing, and setting position of the metal holes in step S203, the arrangement of the metal holes can be carried out.

[0126] In one example, step S204 includes:

[0127] Set metal holes in sequence from left to right and from top to bottom starting from the upper left corner of the hole-placement area according to the size and spacing of the metal holes;

[0128] Or, set metal holes in sequence from left to right and from bottom to top starting from the lower left corner of the hole-placement area according to the size and spacing of the metal holes;

[0129] Or, set metal holes in sequence from right to left and from top to bottom starting from the upper right corner of the hole-placement area according to the size and spacing of the metal holes;

[0130] Or, set metal holes in sequence from right to left and from bottom to top starting from the lower right corner of the hole-placement area according to the size and spacing of the metal holes.

[0131] It should be noted that in this embodiment, the metal holes are rectangular metal holes. In other embodiments, the metal holes can also be circular, polygonal, or irregularly shaped holes, and the present invention does not limit this.

[0132] S205. Perform design rule checking on the layout to determine whether the size, spacing, and setting position of the metal vias conform to the design rules; when the size, spacing, and setting position of the metal vias do not conform to the design rules, re-determine the size, spacing, and setting position of the metal vias in each area to be processed in the layout.

[0133] In summary, by arranging metal vias using the layout metal via arrangement method provided in this application, the metal density in each area of the layout is balanced. The unexpected technical effect is that by setting the metal vias according to the metal density of the area to be processed, on the one hand, it can ensure that the overall metal density of the layout meets the requirements, and on the other hand, it can ensure that the local metal density of the layout meets the requirements, thereby ensuring that the metal distribution in the layout is relatively uniform and the metal density in each area of the layout is relatively uniform. By setting the metal vias using this method, while ensuring the arrangement efficiency, the uniformity of the metal density in the layout can be ensured. When subsequently patterning the metal layer of a semiconductor device using a layout with relatively uniform metal density in each area, it can be ensured that after the metal layer is patterned, the metal distribution in the metal layer is relatively uniform and there will be no situation of large local metal blocks. The uniform distribution of the metal layer is beneficial for planarizing the metal layer, thereby ensuring that after planarizing the metal layer, the surface of the metal layer can be relatively flat to ensure the yield of subsequent process steps and the performance of the finally formed semiconductor device.

[0134] Figure 12 The block diagram of a layout metal via arrangement system provided by an embodiment of the present disclosure is shown in FIG. Figure 12 , the layout metal via arrangement system includes:

[0135] A layout division module 301, configured to divide the layout into multiple areas to be processed;

[0136] A metal density acquisition module 302, configured to acquire the metal density of the area to be processed;

[0137] A metal via determination module 303, configured to determine the size, spacing, and setting position of the metal vias in the area to be processed according to the metal density;

[0138] A metal via setting module 304, configured to set metal vias in the area to be processed according to the size, spacing, and setting position of the metal vias.

[0139] Figure 13 The block diagram of an electronic device provided by an embodiment of the present disclosure is shown in FIG. Figure 13 , this electronic device may include a layout metal via arrangement system. Generally, an electronic device includes: a processor 401 and a memory 402.

[0140] The processor 401 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 401 may be implemented in at least one hardware form of DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), or PLA (Programmable Logic Array). The processor 401 may also include a main processor and a coprocessor. The main processor is a processor used to process data in the wake state, also known as the CPU (Central Processing Unit); the coprocessor is a low-power processor used to process data in the standby state.

[0141] The memory 402 may include one or more computer-readable storage media, and the computer-readable storage media may be non-transitory. The memory 402 may further include high-speed random access memory and non-volatile memory, such as one or more disk storage devices and flash storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory 402 is used to store at least one instruction, and the at least one instruction is used to be executed by the processor 401 to implement the layout metal hole arrangement method performed by the electronic device provided in the method embodiments of the present application.

[0142] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for arranging metal holes in a layout, characterized in that: The layout metal hole arrangement method comprises: Divide the map into multiple areas to be processed; Obtaining the metal density of the area to be treated; Determine the size, spacing and location of the metal holes in the area to be processed according to the metal density; The metal density of all positions in the layout is determined by scanning with a movable window, and the area where the metal density exceeds the metal density threshold under the movable window coverage area is taken as the area to be processed, and the size, spacing and setting position of the metal hole are determined according to the metal density of the area where the metal density exceeds the metal density threshold under the movable window coverage area; The metal holes are arranged in the area to be processed according to the size, spacing and arrangement position of the metal holes.

2. The layout metal hole arrangement method according to claim 1, characterized in that: The steps for obtaining the metal density of the area to be treated include: The area of ​​the metal layer in the area to be processed and the area of ​​the area to be processed are obtained, and the metal density of the area to be processed is equal to the ratio of the area of ​​the metal layer in the area to be processed to the area of ​​the area to be processed.

3. The layout metal hole arrangement method according to claim 1, characterized in that: The step of determining the size, spacing and location of the metal holes in the area to be processed according to the metal density comprises: When the metal density in the area to be processed exceeds a metal density threshold, determining that a metal hole needs to be provided in the area to be processed; According to the preset size range of the metal holes, the spacing range of the metal holes and the size of the metal layer in the area to be processed, determine the area to be holed in the area to be processed as the area to set the metal holes; Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold; According to the size of each hole-laying area in the area to be processed, determine the size of the metal density that needs to be reduced in each hole-laying area; The size, spacing and setting position of the metal holes in each area to be holed are determined based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

4. The layout metal hole arrangement method according to claim 3, characterized in that: The step of determining the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes includes: Using formula , , taking the minimum number of metal holes and the array distribution of metal holes as the design principle, determine the size, spacing and location of the metal holes; in, Indicates the width of the area to be holed. Indicates the length of the area to be holed; Indicates the number of rows of metal holes, Indicates the number of columns of metal holes; Indicates The maximum width of the row metal hole, Indicates The maximum length of the metal hole in the column; Indicates Row and The spacing between rows of metal holes, Indicates Column metal holes and The spacing between the rows of metal holes; Indicates the distance between the first and last rows of metal holes and the edge of the area to be holed. Indicates the distance between the first and last columns of metal holes and the edge of the area to be holed.

5. The layout metal hole arrangement method according to claim 3, characterized in that: The step of determining the size, spacing and setting position of the metal holes in each area to be holed according to the size of the metal density to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes includes: According to the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes, the largest metal hole that can be set in each area to be holed is determined as the first metal hole; Calculate the metal density of the area to be processed after the first metal hole is filled in the area to be holed; After the first metal hole is filled in the area to be processed, when the metal density of the area to be processed is higher than the metal density threshold, the size of the metal density that needs to be reduced in each area to be holed is determined again according to the size of each area to be holed in the area to be processed; According to the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes, the largest metal hole that can be set in each area to be holed is determined as the second metal hole; After setting the second metal hole in the area to be holed, the density of the area to be holed is calculated again. If the density of the area to be holed does not meet the requirements, the new metal density reduction threshold and the maximum metal hole that can be set in the area to be holed are determined again until the metal density in the area to be processed is lower than the metal density threshold, and the determined size, spacing and setting position of the metal holes are output.

6. The layout metal hole arrangement method according to claim 4 or 5, characterized in that: The steps of using a movable window to scan and determine the metal density of all positions in the layout, taking the area where the metal density exceeds the metal density threshold under the movable window coverage area as the area to be processed, and determining the size, spacing and setting position of the metal hole according to the metal density of the area where the metal density exceeds the metal density threshold under the movable window coverage area include: A movable window is used to scan and determine the metal density of all positions in the layout; if the metal density under the area covered by the movable window is higher than the metal density threshold, the area covered by the movable window is determined to be the area to be processed; Determine the metal density that needs to be reduced in the area to be processed according to the metal density of the area to be processed and the metal density threshold; According to the size of each hole-laying area in the area to be processed, determine the size of the metal density that needs to be reduced in each hole-laying area; The size, spacing and setting position of the metal holes in each area to be holed are determined based on the size of the metal density that needs to be reduced in each area to be holed, the size of each area to be holed, the preset size range of the metal holes, and the spacing range of the metal holes.

7. The method for arranging metal holes in a layout according to any one of claims 1 to 5, characterized in that: The layout metal hole arrangement method further includes: Perform a design rule check on the layout to determine whether the size, spacing and setting position of the metal holes meet the design rules; when the size, spacing and setting position of the metal holes do not meet the design rules, redetermine the size, spacing and setting position of the metal holes in each area to be processed in the layout.

8. A layout metal hole arrangement system, characterized in that: The layout metal hole arrangement system includes: A layout division module, used for dividing the layout into a plurality of areas to be processed; A metal density acquisition module is used to acquire the metal density of the area to be processed; it is also used to determine the metal density of all positions in the layout by scanning with a movable window, and to take the area where the metal density exceeds the metal density threshold under the area covered by the movable window as the area to be processed; A metal hole determination module, used to determine the size, spacing and setting position of the metal holes in the area to be processed according to the metal density; and also used to determine the size, spacing and setting position of the metal holes according to the metal density of the area under the movable window coverage area where the metal density exceeds the metal density threshold; The metal hole setting module is used to set the metal holes in the area to be processed according to the size, spacing and setting position of the metal holes.

9. An electronic device, characterized in that: The electronic device comprises the layout metal hole arrangement system as claimed in claim 8.

10. A computer-readable storage medium, characterized in that: At least one program code is stored in the computer-readable storage medium, and the program code is executed by a processor to implement the layout metal hole arrangement method according to any one of claims 1 to 7.

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