Disk device

Abstract

The invention provides a disc device capable of inhibiting pollution. A disk device according to one embodiment includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The flexible printed circuit board is electrically connected with the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has a higher rigidity than the flexible printed circuit board, and is attached to the flexible printed circuit board. The flexible printed circuit board has a first surface facing the electronic component with a gap therebetween, and a second surface positioned on the opposite side of the first surface and facing the wall, and the flexible printed circuit board is provided with a first through-hole that opens on the first surface and the second surface and communicates with the gap. The wall is provided with a second through-hole that passes through the wall and communicates with the first through-hole.

Description

[0001] This application is a divisional application of the application with application number 202211012212.2, application date August 23, 2022, and invention name “Disk Device”.

[0002] This application claims priority based on Japanese Patent Application No. 2021-138140 (filing date: August 26, 2021) and Japanese Patent Application No. 2022-122931 (filing date: August 1, 2022). This application incorporates the entire contents of the basic application by reference. Technical Field

[0003] An embodiment of the present invention relates to a disk device. Background Art

[0004] A disk device such as a hard disk drive reads and writes information on a magnetic disk using a magnetic head. The disk device has, for example, a flexible printed circuit board that electrically connects a controller and the magnetic head. Various electronic components are provided on the flexible printed circuit board.

[0005] The disk device is cleaned to remove substances such as flux that may contaminate the disk device. However, when there is a gap between the flexible printed circuit board and the electronic component, substances that may contaminate the disk device may remain in the gap. Summary of the invention

[0006] The present invention provides a disk device capable of suppressing contamination.

[0007] A disk device according to one embodiment includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The magnetic head is configured to read and write information relative to the magnetic disk. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has a higher rigidity than the flexible printed circuit board and is mounted on the flexible printed circuit board. The flexible printed circuit board has a first surface facing the electronic component across a gap and a second surface located on the opposite side of the first surface and facing the wall, and a first through hole is provided on the flexible printed circuit board, the first through hole is opened on the first surface and the second surface and is connected to the gap. A second through hole is provided on the wall, the second through hole penetrates the wall and is connected to the first through hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is an exemplary perspective view showing an exploded view of the HDD according to the first embodiment.

[0009] Figure 2 It is an exemplary plan view schematically showing the FPC according to the first embodiment.

[0010] Figure 3 This is an illustrative plan view showing a part of the second connection portion near the sensor according to the first embodiment.

[0011] Figure 4 It is along Figure 3 The F4-F4 line is an exemplary cross-sectional view of a portion of the second connecting portion of the first embodiment.

[0012] Figure 5 This is an illustrative plan view showing a part of the second connection portion near the relay connector according to the first embodiment.

[0013] Figure 6 It is along Figure 5 The F6-F6 line is an exemplary cross-sectional view of a portion of the second connecting portion of the first embodiment.

[0014] Figure 7 This is an exemplary cross-sectional view showing a part of the second connection portion near the sensor according to the second embodiment.

[0015] Figure 8 This is an illustrative plan view showing a part of the second connection portion near the relay connector according to the third embodiment.

[0016] Fig. 9 It is along Figure 8 The F9-F9 line is an illustrative cross-sectional view of a portion of the second connecting portion of the third embodiment.

[0017] Fig.10 It is an exemplary bottom view showing the relay connector according to the third embodiment. DETAILED DESCRIPTION

[0018] (First embodiment)

[0019] Below, refer to Figures 1 to 6 The first embodiment is described. In addition, in this specification, the constituent elements of the embodiment and the description of the element are sometimes recorded by multiple expressions. The constituent elements and their description are examples and are not limited by the expressions in this specification. The constituent elements can also be identified by names different from the names in this specification. In addition, the constituent elements can also be described by expressions different from the expressions in this specification.

[0020] Figure 1 This is an exemplary perspective view showing an exploded hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is an example of a disk device, and may also be called an electronic device, a storage device, an external storage device, or a magnetic disk device. The disk device is not limited to the HDD 10.

[0021] The HDD 10 has a housing 11 , a plurality of magnetic disks 12 , a spindle motor 13 , a plurality of magnetic heads 14 , an actuator assembly 15 , a voice coil motor (VCM) 16 , a ramp loading mechanism 17 , a flexible printed circuit board (FPC) 18 , and a printed circuit board (PCB) 19 .

[0022] The housing 11 includes a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container made of a metal material such as an aluminum alloy, and includes a bottom wall 25 and a side wall 26. The bottom wall 25 is formed in a substantially rectangular (quadrilateral) plate shape. The side wall 26 protrudes from the edge of the bottom wall 25. The bottom wall 25 and the side wall 26 are formed integrally.

[0023] The inner cover 22 and the outer cover 23 are made of metal materials such as aluminum alloy. The inner cover 22 is attached to the end of the side wall 26 by screws, for example. The outer cover 23 covers the inner cover 22 and is fixed to the end of the side wall 26 in an airtight manner by welding, for example.

[0024] The inside of the housing 11 is sealed. Inside the housing 11, a magnetic disk 12, a spindle motor 13, a magnetic head 14, an actuator assembly 15, a VCM 16, a ramp load mechanism 17, and an FPC 18 are arranged.

[0025] The inner cover 22 is provided with a vent 22a. Furthermore, the outer cover 23 is provided with a vent 23a. After components are installed inside the base 21 and the inner cover 22 and the outer cover 23 are installed on the base 21, the air inside the housing 11 is extracted from the vents 22a and 23a. Furthermore, the inside of the housing 11 is filled with a gas different from air.

[0026] The gas filled into the shell 11 is, for example, a low-density gas having a lower density than air, an inert gas with low reactivity, etc. For example, helium gas is filled into the shell 11. In addition, other fluids may be filled into the shell 11. In addition, the inside of the shell 11 may also be maintained at a vacuum, a low pressure close to a vacuum, or a negative pressure lower than the atmospheric pressure.

[0027] The vent 23a of the cover 23 is blocked by a seal 28. The seal 28 hermetically seals the vent 23a, and prevents leakage of the fluid filled in the housing 11 from the vent 23a. The housing 11 may also be in communication with the outside.

[0028] The magnetic disk 12 is, for example, a disk having a magnetic recording layer provided on the upper surface and the lower surface. The diameter of the magnetic disk 12 is, for example, 3.5 inches, but is not limited to this example. A plurality of magnetic disks 12 are stacked at intervals.

[0029] The spindle motor 13 supports and rotates the stacked magnetic disks 12. The magnetic disks 12 are held by bosses of the spindle motor 13 by, for example, circlips.

[0030] The magnetic head 14 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 14 reads and writes information on the magnetic disk 12. The magnetic head 14 is mounted on the actuator assembly 15.

[0031] The actuator assembly 15 is supported by a support shaft 31 so as to be rotatable, and the support shaft 31 is arranged at a position separated from the magnetic disk 12. The VCM 16 rotates the actuator assembly 15 and arranges it at a desired position. When the magnetic head 14 moves to the outermost periphery of the magnetic disk 12, the ramp loading mechanism 17 keeps the magnetic head 14 at an unloading position separated from the magnetic disk 12.

[0032] The actuator assembly 15 includes an actuator block 35, a plurality of arms 36, and a plurality of head suspension assemblies 37. Hereinafter, the head suspension assembly 37 is referred to as a suspension 37. The suspension 37 can also be referred to as a head gimbal assembly (HGA).

[0033] The actuator block 35 is rotatably supported on the support shaft 31 via a bearing, for example. A plurality of arms 36 protrude from the actuator block 35 in a direction substantially orthogonal to the support shaft 31. Alternatively, the actuator assembly 15 may be divided so that the arms 36 protrude from each of the plurality of actuator blocks 35.

[0034] The plurality of arms 36 are arranged at intervals in the direction in which the support shaft 31 extends. Each of the arms 36 is formed in a plate shape that can enter between adjacent magnetic disks 12. The plurality of arms 36 extend substantially in parallel.

[0035] The actuator block 35 and the plurality of arms 36 are integrally formed of, for example, aluminum. In addition, the materials of the actuator block 35 and the arms 36 are not limited to this example.

[0036] The voice coil of the VCM 16 is provided on a protrusion protruding from the actuator block 35 to the opposite side of the arm 36. The VCM 16 includes a pair of yokes, a voice coil disposed between the yokes, and a magnet provided on the yokes.

[0037] As described above, the VCM 16 rotates the actuator assembly 15. In other words, the VCM 16 rotates (moves) the actuator block 35, the arm 36, and the suspension 37 integrally.

[0038] The hangers 37 are attached to the front end portions of the corresponding arms 36, and protrude from the arms 36. Thus, the plurality of hangers 37 are arranged at intervals in the direction in which the support shaft 31 extends.

[0039] Each of the plurality of suspensions 37 includes a base plate 41, a load beam 42, and a flexure 43. Furthermore, the magnetic head 14 is mounted on the front end portion of the suspension 37.

[0040] The substrate 41 and the loading beam 42 are made of, for example, stainless steel. The materials of the substrate 41 and the loading beam 42 are not limited to this example. The substrate 41 is formed in a plate shape and is attached to the front end of the arm 36. The loading beam 42 is formed in a plate shape that is thinner than the substrate 41. The loading beam 42 is attached to the front end of the substrate 41 and protrudes from the substrate 41.

[0041] The flexible member 43 is formed in a long and narrow strip shape. The shape of the flexible member 43 is not limited to this example. The flexible member 43 is a laminated plate having a metal plate (lining layer) such as stainless steel, an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting a plurality of wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.

[0042] A universal joint (elastic support portion) that is located on the load beam 42 and can be displaced is provided at one end of the flexure 43. The universal joint portion is provided at the front end of the suspension 37 and carries the magnetic head 14. The other end of the flexure 43 is connected to the FPC 18. Thus, the FPC 18 is electrically connected to the magnetic head 14 via the wiring of the flexure 43.

[0043] The PCB 19 is, for example, a rigid substrate such as a glass epoxy substrate, and is a multi-layer substrate or a build-up substrate, etc. The PCB 19 is disposed outside the housing 11 and mounted on the bottom wall 25 of the base 21. The PCB 19 is mounted on the bottom wall 25, for example, by a plurality of screws.

[0044] For example, an interface (I / F) connector 51, a controller 52, and a relay connector 53 are mounted on the PCB 19. In addition, other components may be mounted on the PCB 19.

[0045] The I / F connector 51 is a connector conforming to an interface standard such as Serial ATA (SATA), and is connected to an I / F connector of a host computer. The HDD 10 receives power from the host computer through the I / F connector 51 and transmits and receives various data to and from the host computer.

[0046] The controller 52 is, for example, a system on chip (SoC), and includes a read / write channel (RWC), a hard disk controller (HDC), and a processor. In addition, the RWC, HDC, and processor may be separate components.

[0047] The processor of the controller 52 is, for example, a CPU (Central Processing Unit). The processor controls the entire HDD 10 according to, for example, firmware pre-stored in the ROM. For example, the processor loads the firmware of the ROM into the RAM, and controls the magnetic head 14, the RWC, the HDC, and other parts according to the loaded firmware.

[0048] The relay connector 53 is electrically connected to various components arranged inside the housing 11 through a connector provided on the bottom wall 25. Thus, the PCB 19 is electrically connected to the spindle motor 13, the magnetic head 14, the actuator assembly 15, the VCM 16 and the FPC 18 arranged inside the housing 11.

[0049] Figure 2 FIG. 1 is a schematic plan view showing an exemplary FPC 18 according to the first embodiment. Figure 2 As shown in FIG. 1 , the FPC 18 is formed into a substantially L-shaped strip in a natural state when it is removed from other components and no external force is applied. The shape of the FPC 18 is not limited to this example. The FPC 18 includes a first connection portion 61 , a second connection portion 62 , and an intermediate portion 63 .

[0050] The first connection portion 61 is provided, for example, at one end portion of the FPC 18 in the direction in which the FPC 18 extends. The first connection portion 61 is attached to the actuator block 35 by, for example, screws. The first connection portion 61 is electrically connected to the VCM 16 and the flexure 43 .

[0051] The second connection portion 62 is provided at the other end of the FPC 18 in the direction in which the FPC 18 extends. The second connection portion 62 is attached to the bottom wall 25 by screws, for example. The second connection portion 62 is electrically connected to the PCB 19 by a connector provided on the bottom wall 25, for example.

[0052] The intermediate portion 63 is provided between the first connection portion 61 and the second connection portion 62. The intermediate portion 63 extends in a belt shape, and is bent between the first connection portion 61 and the second connection portion 62 in accordance with the rotation of the actuator block 35.

[0053] As shown in the figures, in this specification, the X-axis, Y-axis and Z-axis are defined for convenience. The X-axis, Y-axis and Z-axis are orthogonal to each other. The X-axis is set along the width of the middle part 63 in the natural state. The Y-axis is set along the length of the middle part 63 in the natural state. The Z-axis is set along the thickness of the FPC 18 in the natural state.

[0054] Furthermore, in this specification, the X direction, the Y direction, and the Z direction are defined. The X direction is a direction along the X axis, including the +X direction indicated by the arrow of the X axis, and the -X direction which is the opposite direction of the arrow of the X axis. The Y direction is a direction along the Y axis, including the +Y direction indicated by the arrow of the Y axis, and the -Y direction which is the opposite direction of the arrow of the Y axis. The Z direction is a direction along the Z axis, including the +Z direction indicated by the arrow of the Z axis, and the -Z direction which is the opposite direction of the arrow of the Z axis.

[0055] The first connection portion 61 is connected to the end of the middle portion 63 in the +Y direction and extends from the end toward the +Y direction. The second connection portion 62 is connected to the end of the middle portion 63 in the -Y direction and extends from the end toward the +X direction. The first connection portion 61 and the second connection portion 62 are not limited to this example.

[0056] The HDD 10 further includes a plurality of preamplifiers 65, a relay connector 66, a sensor 67, and a plurality of reinforcing plates 68. The relay connector 66 and the sensor 67 are examples of electronic components. The reinforcing plate 68 is an example of a wall.

[0057] The preamplifier 65 is mounted on the first connecting portion 61. The preamplifier 65 is electrically connected to the flexure 43 via, for example, the wiring and pads of the FPC 18. In addition, the preamplifier 65 is electrically connected to the magnetic head 14 via the flexure 43. The preamplifier 65 amplifies the write signal and sends it to the magnetic head 14, and amplifies the read signal received from the magnetic head 14.

[0058] The relay connector 66 and the sensor 67 are mounted on the second connection portion 62. The relay connector 66 is electrically connected to the relay connector 53 of the PCB 19 through, for example, a connector provided on the bottom wall 25. Thus, the second connection portion 62 is connected to the PCB 19. In addition, the relay connector 66 may be directly connected to the relay connector 53 of the PCB 19. The sensor 67 detects, for example, humidity or air pressure inside the housing 11. In addition, the sensor 67 is not limited to this example.

[0059] The reinforcing plate 68 is made of metal such as aluminum or synthetic resin, and is formed into a plate shape. The reinforcing plate 68 is not limited to this example. A plurality of reinforcing plates 68 are attached to the first connecting portion 61 and the second connecting portion 62 .

[0060] The rigidity of the reinforcing plate 68 is higher than the rigidity of the FPC 18. Therefore, the reinforcing plate 68 improves the rigidity of the first connecting portion 61 and the second connecting portion 62. The intermediate portion 63 is not attached to the reinforcing plate 68 and is flexible.

[0061] Figure 3 This is an illustrative plan view showing a portion of the second connection portion 62 near the sensor 67 according to the first embodiment. Figure 4 It is along Figure 3 The F4-F4 line shows an exemplary cross-sectional view of a part of the second connecting portion 62 according to the first embodiment.

[0062] like Figure 4As shown, the FPC 18 has a mounting surface 71 and a back surface 72. The back surface 72 is an example of a second surface. The mounting surface 71 is one surface of the FPC 18. The preamplifier 65, the relay connector 66, and the sensor 67 are mounted on the mounting surface 71. Therefore, the mounting surface 71 faces the preamplifier 65, the relay connector 66, and the sensor 67. The back surface 72 is located on the opposite side of the mounting surface 71. The back surface 72 faces the reinforcing plate 68.

[0063] The FPC 18 includes a base layer 75, a conductive layer 76, and a cover layer 77. The base layer 75 is an example of a first layer. The conductive layer 76 is an example of a third layer. The cover layer 77 is an example of a second layer.

[0064] The base layer 75 is made of an insulating material such as polyimide, and has insulating properties. In addition, when the FPC 18 is a multi-layer FPC, the base layer 75 may include a plurality of insulating layers and a plurality of conductive layers.

[0065] The base layer 75 has an upper surface 75a and a lower surface 75b. Figure 4 For the sake of convenience, the up-down direction in the figure is used as a reference, and there is no limitation on the direction, position, and other conditions. The upper surface 75a is an example of the first surface. The lower surface 75b is an example of the second surface.

[0066] The upper surface 75a is the surface of the base layer 75 facing the +Z direction. The lower surface 75b is located on the opposite side of the upper surface 75a and is the surface of the base layer 75 facing the -Z direction. The back surface 72 of the FPC 18 includes the lower surface 75b.

[0067] The conductive layer 76 is made of a conductive body such as copper and has conductivity. The conductive layer 76 is provided on the upper surface 75a of the base layer 75. In addition, an adhesive layer may be provided between the conductive layer 76 and the upper surface 75a.

[0068] like Figure 3 As shown in FIG. 1 , the conductive layer 76 includes a plurality of pads 81 and a plurality of wirings 82 . The pads 81 are an example of first terminals and may also be referred to as connection pads or electrodes. The pads 81 and the wirings 82 are provided on the upper surface 75 a of the base layer 75 .

[0069] The sensor 67 is electrically connected to the pad 81. The wiring 82 extends from the pad 81, for example, to electrically connect the pad 81 to the relay connector 66. In addition, the wiring 82 may also be connected to other wirings, through holes, ground or other conductive bodies.

[0070] The cover layer 77 covers at least a portion of the upper surface 75a of the base layer 75 and at least a portion of the conductive layer 76. Therefore, the conductive layer 76 is located between the base layer 75 and the cover layer 77. For example, the cover layer 77 covers a portion of the pad 81 and the wiring 82. Figure 4 As shown, the cover layer 77 has a lower surface 77a and an upper surface 77b. The upper surface 77b is an example of a third surface.

[0071] The lower surface 77a is the surface of the cover layer 77 facing the -Z direction. The lower surface 77a faces the upper surface 75a of the base layer 75. The upper surface 77b is located on the opposite side of the lower surface 77a and is the surface of the cover layer 77 facing the +Z direction. The upper surface 77b forms the surface of the FPC 18. Therefore, the mounting surface 71 of the FPC 18 includes the upper surface 77b of the cover layer 77.

[0072] The cover layer 77 has a cover film 85 and an adhesive 86. The cover film 85 is made of an insulating material such as polyimide. The adhesive 86 is made of an insulating adhesive, for example. Therefore, the cover layer 77 has insulating properties. In other words, the resistance of each of the base layer 75 and the cover layer 77 is higher than the resistance of the conductive layer 76.

[0073] The adhesive 86 is interposed between the cover film 85 and the upper surface 75 a of the base layer 75 and the conductive layer 76 . The adhesive 86 bonds the cover film 85 to the upper surface 75 a of the base layer 75 and the conductive layer 76 .

[0074] The cover layer 77 is provided with an exposure hole 87. The exposure hole 87 is an example of a third through hole and an exposure hole. The exposure hole 87 penetrates the cover layer 77 substantially along the Z direction and opens on the lower surface 77a and the upper surface 77b. Figure 3 As shown, the exposure hole 87 has an exposure portion 87a and a plurality of protruding portions 87b.

[0075] The exposed portion 87a has a shape corresponding to the shape of the sensor 67. In the present embodiment, the exposed portion 87a is a substantially quadrilateral hole. The exposed portion 87a exposes a portion of the upper surface 75a of the base layer 75 and a portion of the plurality of pads 81. Therefore, the exposed upper surface 75a forms the surface of the FPC 18 and is included in the mounting surface 71 of the FPC 18.

[0076] The plurality of extensions 87b extend radially from the exposed portion 87a, for example. The extensions 87b expose a portion of the upper surface 75a of the base layer 75. On the other hand, the extensions 87b are separated from the conductive layer 76. That is, the conductive layer 76 is not exposed through the extensions 87b.

[0077] like Figure 4As shown, the cover layer 77 also has an inner surface, i.e., an inner surface 77c, which exposes the hole 87. The inner surface 77c extends between the lower surface 77a and the upper surface 77b of the cover layer 77. The lower surface 77a is bonded to the upper surface 75a of the base layer 75, so the inner surface 77c extends between the upper surface 75a of the base layer 75 and the upper surface 77b of the cover layer 77.

[0078] The inner surface 77c has a first edge 77d and a second edge 77e. The first edge 77d is an edge of the inner surface 77c connected to the lower surface 77a. The first edge 77d is also an edge of the lower surface 77a connected to the inner surface 77c. The lower surface 77a is bonded to the upper surface 75a of the base layer 75, so the first edge 77d is connected to the upper surface 75a of the base layer 75. The second edge 77e is an edge of the inner surface 77c connected to the upper surface 77b. The second edge 77e is also an edge of the upper surface 77b connected to the inner surface 77c.

[0079] At least a portion of the exposure hole 87 tapers toward the upper surface 75a of the base layer 75. Therefore, the second edge 77e is larger than the first edge 77d. At least a portion of the inner surface 77c extends between the first edge 77d and the second edge 77e, for example, obliquely relative to the upper surface 75a of the base layer 75. In addition, a portion of the inner surface 77c may extend substantially perpendicularly relative to the upper surface 75a.

[0080] For example, the exposure hole 87 is formed by punching the cover film 85. The shape of the inner surface 77c can be easily controlled by punching, so that the exposure hole 87 extending obliquely with respect to the upper surface 75a can be easily formed.

[0081] In the above FPC 18, the mounting surface 71 has a surface area 91 and a recessed area 92. The surface area 91 is an example of a first area. The recessed area 92 is an example of a second area. Figure 3 as well as Figure 4 In the example of FIG. 8 , the surface region 91 has the upper surface 77 b of the cover layer 77 . Therefore, the exposure hole 87 is opened in the surface region 91 .

[0082] The concave region 92 is recessed from the surface region 91. Figure 3 as well as Figure 4 In the example of , the concave region 92 has the upper surface 75a of the base layer 75 exposed through the exposure hole 87, and the inner surface 77c of the cover layer 77. Therefore, the pad 81 is provided in the concave region 92. In addition, the second edge 77e of the inner surface 77c is also an edge of the surface region 91 connected to the inner surface 77c of the concave region 92.

[0083] The FPC 18 is provided with a through hole 95. The through hole 95 is an example of a first through hole. The through hole 95 penetrates the base layer 75 substantially along the Z direction and opens on the upper surface 75a and the lower surface 75b. Figure 3 In the example of FIG. 1 , the through hole 95 has a circular cross section. In addition, the cross-sectional shape of the through hole 95 is not limited to this example, and may be a quadrilateral or other shapes.

[0084] like Figure 4 As shown, the through hole 95 is provided in the portion of the upper surface 75a exposed by the exposure hole 87. Therefore, the through hole 95 is exposed through the exposure hole 87 and provided in the concave area 92. In other expressions, the through hole 95 and the exposure hole 87 are connected.

[0085] The reinforcing plate 68 is attached to the FPC 18 so as to cover the lower surface 75b of the base layer 75. Therefore, the base layer 75 is located between the cover layer 77 and the reinforcing plate 68. The reinforcing plate 68 is provided with a through hole 101. The through hole 101 is an example of a second through hole.

[0086] The through hole 101 penetrates the reinforcing plate 68 substantially along the Z direction. The through hole 101 has substantially the same shape as the through hole 95 of the FPC 18. The through hole 101 overlaps with the through hole 95 in the Z direction and communicates with the through hole 95. In addition, the shape of the through hole 101 may be different from that of the through hole 95.

[0087] An adhesive layer 110 is provided between the FPC 18 and the reinforcing plate 68. The adhesive layer 110 adheres the FPC 18 and the reinforcing plate 68 to each other. A through hole 111 is provided in the adhesive layer 110. The through hole 111 has substantially the same shape as the through holes 95 and 101, and allows the through hole 95 and the through hole 101 to communicate with each other.

[0088] The sensor 67 is, for example, a land grid array (LGA). The sensor 67 is not limited to this example. The sensor 67 includes a package 121 and a plurality of lands 122. The package 121 is an example of a housing. The lands 122 are an example of a second terminal.

[0089] The package 121 includes, for example, a circuit board on which a plurality of elements are mounted, and a mold resin covering the circuit board and the elements. The housing is a member forming the outer surface of an electronic component, and may also serve as a member provided with an electric circuit such as a circuit board.

[0090] The package 121 has a lower surface 121a. The lower surface 121a faces the upper surface 75a of the base layer 75 exposed from the exposure hole 87 via the space S1. In other words, the upper surface 75a of the base layer 75 faces the package 121 of the sensor 67 via the space S1. The space S1 is an example of a gap.

[0091] The connection land 122 is provided on the lower surface 121a of the package 121. The connection land 122 is electrically connected to the pad 81 of the FPC 18 via the solder 125. Thus, the sensor 67 is mounted on the concave region 92 in the mounting surface 71 of the FPC 18.

[0092] The through hole 95 of the FPC 18 is connected to the space S1 provided between the upper surface 75a of the base layer 75 and the package 121. In the direction along the upper surface 75a (XY plane), the through hole 95 is connected to the space S1 at the approximate center of the space S1. In addition, the position of the through hole 95 is not limited to this example. The space S1 is connected to the outside of the FPC 18 through the through holes 95, 101, and 111.

[0093] In the direction along the upper surface 75a, the through holes 95, 101, 111 are respectively smaller than the exposure hole 87. In addition, in the direction along the upper surface 75a, the through holes 95, 101, 111 are respectively smaller than the package 121.

[0094] In the direction along the upper surface 75a, the edge of the upper surface 77b connected to the inner surface 77c (second edge 77e) is larger than the package 121 of the sensor 67. In the direction along the upper surface 75a, the package 121 is located inside the second edge 77e.

[0095] In the direction along the upper surface 75a, the second edge 77e is separated from the package 121. In other words, in the direction along the surface area 91, the edge (second edge 77e) of the surface area 91 connected to the inner surface 77c of the concave area 92 is separated from the package 121. In addition, in the direction along the upper surface 75a, the first edge 77d is also separated from the package 121.

[0096] A gap G1 is provided between the package 121 and the second edge 77e. The gap G1 communicates with the space S1 and the outside of the FPC 18. In other words, the space S1 communicates with the outside of the FPC 18 through the gap G1.

[0097] In the direction along the upper surface 75a, at least a portion of the extension 87b of the exposure hole 87 is separated from the package 121. Therefore, the extension 87b communicates with the space S1 and the outside of the FPC 18. In other words, the space S1 communicates with the outside of the FPC 18 through the extension 87b.

[0098] Figure 5 This is an illustrative plan view showing a portion of the second connection portion 62 in the vicinity of the relay connector 66 according to the first embodiment. Figure 6 It is along Figure 5 The F6 - F6 line in FIG. 1 is an exemplary cross-sectional view of a portion of the second connecting portion 62 according to the first embodiment.

[0099] like Figure 5 As shown, the conductive layer 76 includes a plurality of pads 131 and a plurality of wirings 132. The pads 131 are an example of first terminals and may also be referred to as connection pads or electrodes. The pads 131 and the wirings 132 are provided on the upper surface 75a of the base layer 75.

[0100] The relay connector 66 is electrically connected to the pad 131. The wiring 132 extends from the pad 131, for example, to electrically connect the pad 131 to the preamplifier 65 or the sensor 67. In addition, the wiring 132 may also be connected to other wirings, through holes, ground or other conductors.

[0101] The cover layer 77 covers a portion of the pad 131 and the wiring 132. A plurality of exposure holes 135 are provided on the cover layer 77. Figure 6 As shown, the exposure hole 135 penetrates the cover layer 77 substantially in the Z direction and opens on the lower surface 77a and the upper surface 77b. The exposure hole 135 exposes a portion of the upper surface 75a of the base layer 75 and a portion of the plurality of pads 131.

[0102] The FPC 18 is provided with a plurality of through holes 141. The through holes 141 are examples of first through holes. The plurality of through holes 141 penetrate the base layer 75 and the cover layer 77 substantially along the Z direction and open on the upper surface 77b of the mounting surface 71 and the lower surface 75b of the rear surface 72.

[0103] exist Figure 5 In the example of , the through hole 141 has a circular cross section. In addition, the cross-sectional shape of the through hole 141 is not limited to this example, and may be a quadrilateral or other shapes. In addition, the shapes of the plurality of through holes 141 may be different from each other.

[0104] like Figure 6 As shown in FIG. 1 , a plurality of through holes 142 are provided on the reinforcing plate 68. The through hole 142 is an example of a second through hole. The through hole 142 penetrates the reinforcing plate 68 substantially along the Z direction. The through hole 142 has substantially the same shape as the through hole 141 of the FPC 18. The through hole 142 overlaps with the through hole 141 in the Z direction and communicates with the through hole 141. In addition, the shape of the through hole 142 may be different from that of the through hole 141.

[0105] The adhesive layer 110 is provided with a plurality of through holes 143. The through holes 143 have substantially the same shape as the through holes 141 and 142, and the through holes 141 and 142 communicate with each other.

[0106] The relay connector 66 includes a housing 151 and a plurality of lead wires 152. The lead wires 152 are an example of a second terminal. The housing 151 is a portion of the relay connector 66 that is formed of an insulator such as synthetic resin. Conductors including the lead wires 152 are attached to the housing 151.

[0107] The housing 151 has a lower surface 151a and a side surface 151b. The lower surface 151a faces the upper surface 77b of the cover layer 77 across the space S2. In other words, the upper surface 77b of the cover layer 77 faces the housing 151 of the relay connector 66 across the space S2. The space S2 is an example of a gap. The side surface 151b faces a direction intersecting the direction in which the lower surface 151a faces.

[0108] The lead wire 152 is provided on the side surface 151b of the housing 151. The lead wire 152 is electrically connected to the pad 131 of the FPC 18 via the solder 155. Thus, the relay connector 66 is mounted on the FPC 18.

[0109] The through hole 141 of the FPC 18 is connected to the space S2 provided between the upper surface 77b of the cover layer 77 and the housing 151. In the direction along the upper surface 77b (XY plane), one of the through holes 141 is connected to the space S2 at the approximate center of the space S2. In addition, the position of the through hole 141 is not limited to this example. The space S2 is connected to the outside of the FPC 18 through the through holes 141, 142, and 143.

[0110] The following is a partial example of a method for mounting the relay connector 66 and the sensor 67 on the FPC 18. The method for mounting the relay connector 66 and the sensor 67 on the FPC 18 is not limited to the following method, and other methods may be used. First, solder paste (solder 125, 155) is supplied to the pads 81, 131 by printing or coating, for example.

[0111] Next, the sensor 67 is mounted on the pad 81. Furthermore, the relay connector 66 is mounted on the pad 131. The FPC 18 is located between the sensor 67 and the reinforcing plate 68, and between the relay connector 66 and the reinforcing plate 68. Therefore, the reinforcing plate 68 can suppress deformation of the FPC 18 during mounting.

[0112] Next, the FPC 18 is heated in a reflow furnace to melt the solder paste, thereby joining the connection pad 122 of the sensor 67 to the pad 81 and joining the lead wire 152 of the relay connector 66 to the pad 131. At this time, the flux mixed in the solder 125, 155 or supplied separately may flow out of the solder 125, 155.

[0113] Next, the FPC 18 is cleaned, for example, by ultrasonic cleaning. For example, the FPC 18 is placed in a tank filled with cleaning liquid C. Figure 4 As shown by the middle arrow, the cleaning liquid C flows into the space S1 through the through holes 95 , 101 , 111 . In addition, the cleaning liquid C can be discharged from the space S1 to the outside of the FPC 18 through the through holes 95 , 101 , 111 .

[0114] The cleaning liquid C flows into the space S1 through the gap G1. The cleaning liquid C flows into the space S1 through the extension portion 87b of the exposure hole 87. The cleaning liquid C can be discharged from the space S1 to the outside of the FPC 18 through the gap G1 and the extension portion 87b.

[0115] The cleaning liquid C flows into the space S1 and is discharged from the space S1. That is, the cleaning liquid C flows through the space S1. Thus, the cleaning liquid C can remove substances such as flux that may contaminate the HDD 10 from the space S1.

[0116] like Figure 6 As shown, the cleaning liquid C flows into the space S2 through the through holes 141, 142, 143. The cleaning liquid C can be discharged from the space S2 to the outside of the FPC 18 through the through holes 141, 142, 143. The cleaning liquid C can pass through the gap G2 between the housing 151 and the FPC 18.

[0117] The cleaning liquid C flows into the space S2 and is discharged from the space S2. That is, the cleaning liquid C flows through the space S2. Thus, the cleaning liquid C can remove substances that may contaminate the HDD 10 and exist in the space S2.

[0118] When the ultrasonic cleaning is completed, the FPC 18 is removed from the cleaning liquid C. At this time, the cleaning liquid C in the space S1 is discharged through at least one of the through holes 95, 101, 111, the gap G1, and the extension 87b. In addition, the cleaning liquid C in the space S2 is discharged through at least one of the through holes 141, 142, 143 and the gap G2.

[0119] For example, the cleaning liquid C flowing into the spaces S1 and S2 transmits ultrasonic waves. The ultrasonic waves cause the flux in the spaces S1 and S2 to float from the FPC 18. Afterwards, the cleaning liquid C is discharged from the spaces S1 and S2 together with the flux as described above. In this way, the mounting of the component to the FPC 18 is completed.

[0120] In the HDD10 of the first embodiment described above, the FPC18 has an upper surface 75a facing the sensor 67 across the space S1, and a lower surface 75b located on the opposite side of the upper surface 75a and facing the reinforcing plate 68. The FPC18 is provided with a through hole 95 that opens on the upper surface 75a and the lower surface 75b and communicates with the space S1. The reinforcing plate 68 is provided with a through hole 101 that penetrates the reinforcing plate 68 and communicates with the through hole 95. That is, the space S1 between the sensor 67 and the upper surface 75a is connected to the outside through the through holes 95 and 101. Thus, the through holes 95 and 101 can be used for the cleaning liquid C for cleaning the space S1 to circulate, and substances such as residual flux that may contaminate the HDD10 in the space S1 can be suppressed. Therefore, the HDD10 of this embodiment can suppress the contamination of the HDD10, and further suppress the adverse situation such as the head collision caused by the substances that may contaminate the HDD10.

[0121] The FPC 18 has a pad 81. The sensor 67 has a package 121 and a connection pad 122 provided on the package 121 and electrically connected to the pad 81 via a solder 125. The space S1 is provided between the upper surface 75a and the package 121. That is, the through holes 95 and 101 can introduce the cleaning liquid C into the large space S1 between the package 121 and the upper surface 75a. Therefore, the HDD 10 of the present embodiment can easily clean the large space S1 between the package 121 and the upper surface 75a, where substances that may contaminate the HDD 10 are likely to remain, by the cleaning liquid C.

[0122] The FPC 18 includes a base layer 75 including an upper surface 75a, and a cover layer 77 covering the upper surface 75a. The cover layer 77 is provided with an exposure hole 87 penetrating the cover layer 77 to expose the upper surface 75a, the through hole 95, and the pad 81. The cover layer 77 includes an upper surface 77b where the exposure hole 87 opens, and an inner surface 77c of the exposure hole 87 extending between the upper surface 75a and the upper surface 77b. In the direction along the upper surface 75a, the edge (second edge 77e) of the upper surface 77b connected to the inner surface 77c is separated from the package 121. Therefore, a gap G1 communicating with the space S1 is provided between the second edge 77e and the package 121. The gap G1 allows the cleaning liquid C for cleaning the space S1 to flow, and can suppress the residual flux and other substances that may contaminate the HDD 10 in the space S1. In addition, since the space S1 is connected to the outside through two or more paths, it is possible to suppress the cleaning liquid C from being stagnant in the space S1.

[0123] The inner surface 77c has a first edge 77d connected to the upper surface 75a, and a second edge 77e connected to the upper surface 77b and larger than the first edge 77d. At least a portion of the inner surface 77c extends obliquely relative to the upper surface 75a between the first edge 77d and the second edge 77e. Thus, compared with the case where the inner surface 77c extends perpendicularly to the upper surface 75a, the cover layer 77 can enlarge the gap G1 and cover a larger range of the upper surface 75a. Therefore, the HDD 10 of the present embodiment can suppress the conductive layer 76 provided on the upper surface 75a from being exposed further, and can further suppress the conductive layer 76 from being corroded.

[0124] The FPC 18 includes a base layer 75, a cover layer 77, and a conductive layer 76. The conductive layer 76 is located between the base layer 75 and the cover layer 77 and includes a pad 81. The cover layer 77 is provided with an exposure hole 87 that penetrates the cover layer 77. The exposure hole 87 includes an exposure portion 87a that exposes the upper surface 75a, the through hole 95, and the pad 81; and an extension portion 87b that extends from the exposure portion 87a to expose the upper surface 75a and is separated from the conductive layer 76. At least a part of the extension portion 87b is separated from the package 121 in the direction along the upper surface 75a. Therefore, the extension portion 87b connects the space S1 with the outside. The extension portion 87b allows the cleaning liquid C for cleaning the space S1 to flow, and can suppress the residual flux and other substances that may contaminate the HDD 10 in the space S1. In addition, since the space S1 is connected to the outside through two or more paths, it is possible to suppress the cleaning liquid C from being retained in the space S1. Furthermore, since the extension portion 87b is separated from the conductive layer 76, the conductive layer 76 is not exposed. Thus, the HDD 10 of the present embodiment can suppress corrosion of the conductive layer 76.

[0125] The sensor 67 is LGA. Therefore, the space S1 becomes small, making it difficult for the cleaning liquid C to flow. However, the HDD 10 of this embodiment allows the space S1 to communicate with the outside through the through holes 95 and 101. Thus, the cleaning liquid C can clean the space S1, and substances such as flux that may contaminate the HDD 10 can be suppressed from remaining in the space S1.

[0126] The FPC 18 has a mounting surface 71 and a pad 81 provided on the mounting surface 71. The sensor 67 has a package 121 and a connection pad 122 provided on the package 121 and electrically connected to the pad 81 via a solder 125. The mounting surface 71 has a surface area 91 and a concave area 92 which is recessed from the surface area 91 and provided with the pad 81. In the direction along the surface area 91, the edge (second edge 77e) of the surface area 91 connected to the concave area 92 is separated from the package 121. Therefore, a gap G1 which is connected to the space S1 between the mounting surface 71 and the package 121 is provided between the second edge 77e and the package 121. The gap G1 can be used for the cleaning liquid C for cleaning the space S1 to flow, and can suppress the residual flux in the space S1 that may contaminate the HDD 10. Therefore, the HDD 10 of the present embodiment can suppress the contamination of the HDD 10, and further suppress the adverse situation such as the head collision caused by the material that may contaminate the HDD 10.

[0127] The FPC 18 includes a base layer 75 provided with a pad 81, and a cover layer 77 covering the base layer 75. The cover layer 77 includes a surface region 91. The cover layer 77 includes an exposure hole 87 which penetrates the cover layer 77 and opens in the surface region 91, and exposes the base layer 75 and the pad 81. The recessed region 92 includes an inner surface 77c of the exposure hole 87. In the direction along the surface region 91, the edge (second edge 77e) of the surface region 91 connected to the inner surface 77c is separated from the package 121. That is, by forming the exposure hole 87 in the cover layer 77, a gap G1 is formed between the second edge 77e and the package 121. Therefore, the HDD 10 of the present embodiment can easily form the gap G1 through which the cleaning liquid C can flow.

[0128] (Second embodiment)

[0129] Below, refer to Figure 7 The second embodiment is described. In the following description of the embodiments, a component having the same function as a component already described is sometimes given the same symbol as the component already described, and further description is omitted. In addition, multiple components given the same symbol are not limited to having all functions and properties in common, and may also have different functions and properties corresponding to each embodiment.

[0130] Figure 7 FIG. 2 is an exemplary cross-sectional view showing a portion of the second connection portion 62 near the sensor 67 according to the second embodiment. Figure 7As shown, the HDD 10 of the second embodiment includes an adhesive layer 200 instead of the adhesive layer 110. The adhesive layer 200 is the same as the adhesive layer 110 of the first embodiment except for the following contents.

[0131] The adhesive layer 200 is provided with a through hole 201 instead of the through hole 111. The through hole 201 is an example of a fourth through hole and a through hole. The through hole 201 penetrates the adhesive layer 200 substantially in the Z direction.

[0132] In the direction along the upper surface 75a (XY plane), the through hole 201 is larger than the package 121 and larger than the exposed portion 87a of the exposure hole 87. In the direction along the upper surface 75a, the package 121 and the exposed portion 87a of the exposure hole 87 are located inside the edge 201a of the through hole 201.

[0133] In the direction along the upper surface 75a, the edge 201a of the through hole 201 is separated from the package 121 and separated from the exposed portion 87a of the exposure hole 87. In addition, the size of the through hole 201 is not limited to this example.

[0134] The HDD 10 of the second embodiment includes an FPC 218 instead of the FPC 18. The FPC 218 is the same as the FPC 18 of the first embodiment except for the following contents. The FPC 218 includes a first portion 218a and a second portion 218b.

[0135] The first portion 218a is a portion of the FPC 218 bonded to the reinforcing plate 68 via the adhesive layer 200. The second portion 218b is a portion of the FPC 218 overlapping the through hole 201 in the Z direction. The first portion 218a and the second portion 218b each include a base layer 75, a conductive layer 76, and a cover layer 77.

[0136] The first portion 218a extends substantially flat along the reinforcing plate 68. The first portion 218a has a surface region 91 of the mounting surface 71. The surface region 91 has an upper surface 77b of the cover layer 77. The first portion 218a may have projections and depressions or may be curved.

[0137] The second portion 218b is bent so as to contact the reinforcing plate 68 through the through hole 201. Therefore, the lower surface 75b of the base layer 75 of the second portion 218b contacts the reinforcing plate 68. The second portion 218b is recessed from the upper surface 77b of the cover layer 77 of the first portion 218a. Therefore, the second portion 218b has the recessed region 92 of the mounting surface 71.

[0138] In the second portion 218b, an exposure hole 87 is provided in the cover layer 77. The concave region 92 of the second portion 218b has an upper surface 75a facing the base layer 75 of the package 121, and a pad 131 is provided on the upper surface 75a. In addition, a through hole 95 opening on the upper surface 75a is provided in the second portion 218b.

[0139] The through hole 95 is directly connected to the through hole 101 of the reinforcing plate 68. Therefore, the space S3 provided between the upper surface 75a and the package 121 of the second embodiment is connected to the outside of the FPC 218 through the through holes 95 and 101. In addition, the through hole 95 may be connected to the through hole 101 via another hole or space.

[0140] In the second portion 218b, the base layer 75, the conductive layer 76, and the cover layer 77 are all bent so as to be recessed from the first portion 218a. Therefore, the recessed area 92 of the second embodiment includes not only the upper surface 75a of the base layer 75 and the inner surface 77c of the cover layer 77, but also the upper surface 77b of the cover layer 77.

[0141] In the second embodiment, edge 91a of surface region 91 connected to recessed region 92 is provided on upper surface 77b of cover layer 77. Edge 91a of surface region 91 connected to recessed region 92 is separated from package 121 in the direction along surface region 91 (XY plane).

[0142] In the second embodiment, the connection pad 122 is electrically connected to the pad 81 of the FPC 218 via the solder 225 instead of the solder 125. In the Z direction, the length (height) of the solder 225 of the second embodiment is longer than the length (height) of the solder 125 of the first embodiment. For example, the solder 225 is supplied to the pad 81 by printing using a metal mask. The metal mask is generally formed roughly flat. Therefore, when the metal mask is placed on the first part 218a of the FPC 218, it is separated from the recessed second part 218b. Therefore, the hole of the metal mask is substantially extended according to the depth of the recess of the second part 218b.

[0143] The amount of solder 225 supplied to the hole of the metal mask increases according to the depth of the depression of the second portion 218b. Therefore, the height of the solder 225 exceeds the height of the solder 125 of the first embodiment. The solder 225 is not limited to this example.

[0144] Since the height of the solder 225 is increased, the distance between the upper surface 75a of the base layer 75 and the package 121 in the second embodiment is longer than that in the first embodiment. Therefore, the space S3 provided between the upper surface 75a and the package 121 is larger than the space S1 in the first embodiment.

[0145] When cleaning the FPC 218 of the second embodiment, the cleaning liquid C flows into the space S3 through the through holes 95 and 101. The cleaning liquid C can be discharged from the space S3 to the outside of the FPC 218 through the through holes 95 and 101.

[0146] The cleaning liquid C flows into the space S3 through the gap G3 between the edge 91a of the surface area 91 connected to the concave area 92 and the package 121. In addition, the cleaning liquid C can be discharged from the space S3 to the outside of the FPC 218 through the gap G3.

[0147] In the HDD 10 of the second embodiment described above, the adhesive layer 200 bonds the FPC 218 and the reinforcing plate 68 to each other. The adhesive layer 200 is provided with a through hole 201 penetrating the adhesive layer 200. The FPC 218 has a first portion 218a bonded to the reinforcing plate 68 via the adhesive layer 200, and a second portion 218b bent so as to contact the reinforcing plate 68 via the through hole 201. That is, the second portion 218b is bent so as to be recessed from the first portion 218a. The second portion 218b has an upper surface 75a, and is provided with a through hole 95 and a solder pad 81. For example, the solder 225 connecting the solder pad 81 and the connection pad 122 is formed by printing using a metal mask. The metal mask is placed on the first portion 218a of the FPC 218 that is not recessed. Therefore, compared with the case where the second portion 218b is not recessed, the amount of solder 225 printed on the pad 81 of the recessed second portion 218b becomes larger. Since a large amount of solder 225 is provided between the pad 81 and the connection pad 122, the space S3 between the upper surface 75a and the package 121 becomes larger (higher). Therefore, the HDD 10 of this embodiment can easily flow the cleaning liquid C from the side into the space S3 between the upper surface 75a and the package 121, and can suppress the residual flux and other substances that may contaminate the HDD 10 in the space S3. In addition, the space S3 is connected to the outside through two or more paths, so that the cleaning liquid C can be suppressed from being retained in the space S3.

[0148] The reinforcing plate 68 has a higher rigidity than the FPC 218 and is mounted on the FPC 218. The adhesive layer 200 adheres the FPC 218 and the reinforcing plate 68 to each other. The adhesive layer 200 is provided with a through hole 201 penetrating the adhesive layer 200. The FPC 218 has a first portion 218a adhered to the reinforcing plate 68 through the adhesive layer 200, and a second portion 218b bent so as to contact the reinforcing plate 68 through the through hole 201. The first portion 218a has a surface area 91. The second portion 218b has a concave area 92. That is, by providing the through hole 201 in the adhesive layer 200 and forming the bent second portion 218b on the FPC 218, a gap G3 is formed between the edge 91a of the surface area 91 connected to the concave area 92 and the package 121. Therefore, the HDD 10 of the present embodiment can easily form the gap G3 between the edge 91 a of the surface region 91 connected to the recessed region 92 and the package 121 .

[0149] (Third embodiment)

[0150] Below, refer to Figures 8 to 10 A third embodiment will be described. Figure 8 This is an illustrative plan view showing a portion of the second connection portion 301 near the relay connector 302 according to the third embodiment. Fig. 9 It is along Figure 8 The F9-F9 line is an illustrative cross-sectional view of a portion of the second connecting portion 301 according to the third embodiment.

[0151] like Figure 8 As shown, the HDD 10 of the third embodiment includes a second connection portion 301 instead of the second connection portion 62, and includes a relay connector 302 instead of the relay connector 66. The second connection portion 301 is the same as the second connection portion 62, and the relay connector 302 is the same as the relay connector 66 except for the following points.

[0152] In the second connection portion 301, the FPC 18 further includes a plurality of pads 311. The plurality of pads 311 are arranged in two rows in the X direction together with the plurality of pads 131. The pads 311 are located at both ends of the row including the plurality of pads 131 and 311. The pads 311 are not limited to this example.

[0153] The pads 311 are included in the conductive layer 76. Therefore, the plurality of pads 311 are provided on the upper surface 75a of the base layer 75. The upper surface 75a is an example of the surface of the first layer. The pads 311 may be electrically connected to other pads, electronic components, or the ground via wiring, or may not be connected to wiring.

[0154] The plurality of pads 131 and 311 are each formed in a substantially rectangular shape extending in the Y direction. Therefore, the length of the pad 311 in the Y direction is longer than the length of the pad 311 in the X direction. The shapes of the pads 131 and 311 are not limited to this example.

[0155] Each of the plurality of pads 311 has four edges 311a, 311b, 311c, and 311d. The edge 311a is an example of an end of the pad in the first direction. The edge 311b is an example of an end of the pad in the second direction.

[0156] The edge 311a is an end of the pad 311 in the direction toward the center of the relay connector 302 in the Y direction (hereinafter referred to as the inner direction). The inner direction is a direction along the upper surface 75a and is an example of the first direction. Fig. 9 For the pad 311 shown, the +Y direction is the inner direction.

[0157] The edge 311b is an end of the pad 311 in the direction opposite to the inner direction (hereinafter referred to as the outer direction). The outer direction is a direction along the upper surface 75a and is an example of the second direction. Fig. 9 The -Y direction of the pad 311 is the outer direction. Figure 8 As shown, the end edges 311a, 311b extend substantially along the X-direction.

[0158] The edge 311c is an end of the pad 311 in the +X direction. The edge 311d is an end of the pad 311 in the -X direction. The edges 311c and 311d extend substantially in the Y direction between the edge 311a and the edge 311b.

[0159] In the second connection portion 301, a plurality of exposure holes 320 are provided in the cover layer 77. The exposure holes 320 are examples of exposure holes and fifth through holes. Fig. 9 As shown, the exposure hole 320 penetrates the cover layer 77 substantially along the Z direction and opens on the lower surface 77a and the upper surface 77b.

[0160] The number of the plurality of exposure holes 320 is equal to the number of the plurality of pads 311. The plurality of exposure holes 320 partially expose the upper surface 75a of the base layer 75 and a corresponding one of the plurality of pads 311. The exposure holes 320 are not limited to this example.

[0161] The cover layer 77 also has an inner surface, i.e., an inner surface 321, which is an inner surface exposing the hole 320. The inner surface 321 extends between the lower surface 77a and the upper surface 77b of the cover layer 77. The lower surface 77a is bonded to the upper surface 75a of the base layer 75, so the inner surface 321 extends between the upper surface 75a of the base layer 75a and the upper surface 77b of the cover layer 77.

[0162] The exposure hole 320 does not cover but exposes the edge 311a, a part of the edge 311c, and a part of the edge 311d of the pad 311. In other words, the inner surface 321 of the exposure hole 320 is separated from the edge 311a.

[0163] The cover layer 77 covers the edge 311b, the other part of the edge 311c, and the other part of the edge 311d of the pad 311. The edges 311a, 311b, and 311c may be exposed through the exposure hole 320, for example.

[0164] like Figure 8 As shown, the side surface 151b of the housing 151 includes two side surfaces 331 and two side surfaces 332. The two side surfaces 331 are disposed at two ends of the housing 151 in the Y direction. The wire 152 is disposed on the side surface 331. The two side surfaces 332 are disposed at two ends of the housing 151 in the X direction.

[0165] Fig.10 FIG. 2 is an exemplary bottom view showing a relay connector 302 according to the third embodiment. Fig.10 As shown, a plurality of cutouts 335 are provided on the housing 151. The plurality of cutouts 335 are opened on a corresponding one of the two side surfaces 332, a corresponding one of the two side surfaces 331, and the lower surface 151a, respectively.

[0166] The housing 151 further includes a bottom surface 335a and an inner side surface 335b of the cutout 335. The bottom surface 335a is generally oriented in the -Z direction. The inner side surface 335b is oriented in a direction intersecting with the direction oriented by the bottom surface 335a.

[0167] The housing 151 further includes a plurality of holding protrusions 336 and 337. The holding protrusion 336 protrudes from the bottom surface 335a in the substantially -Z direction at a position separated from the inner side surface 335b. The holding protrusion 337 protrudes from the inner side surface 335b in the -Z direction at a position separated from the bottom surface 335a.

[0168] like Figure 8 As shown, the relay connector 302 further includes a plurality of wires 340. The wires 340 are an example of a metal component. The wires 152 and 340 of the relay connector 302 are made of metal.

[0169] The wire 152 electrically connects the pad 131 to the connector provided on the bottom wall 25 or the relay connector 53 of the PCB 19. The wire 340 may also electrically connect the pad 311 to other components. In addition, the wire 340 may also be a reinforcing pin that is not electrically connected to the component to which the relay connector 302 is connected.

[0170] like Fig.10As shown, the plurality of wires 340 are fitted into the cutout 335 of the housing 151 and mounted on the housing 151. In addition, a portion of the wires 340 may be embedded in the housing 151. A portion of the plurality of wires 340 protrudes from the side surface 331 of the housing 151. In other words, the plurality of wires 340 are provided on the side surface 331. The plurality of wires 340 respectively have a joint portion 341, a separation portion 342, and an intermediate portion 343. The joint portion 341, the separation portion 342, and the intermediate portion 343 are formed integrally.

[0171] like Fig. 9 As shown, the joint portion 341 extends substantially in the Y direction. At least a portion of the joint portion 341 is located outside the cutout 335 . The joint portion 341 is joined to the pad 311 of the FPC 18 via solder 345 .

[0172] The separation portion 342 is received in the cutout 335 and is attached to the housing 151. Therefore, the separation portion 342 is provided between the joining portion 341 and the housing 151. In addition, the separation portion 342 may be located outside the cutout 335.

[0173] The separation portion 342 is separated from the joining portion 341 inward in the direction along the upper surface 75a. Furthermore, the separation portion 342 is farther from the upper surface 75a than the joining portion 341 in the Z direction. The Z direction is a direction perpendicular to the upper surface 75a.

[0174] The middle portion 343 is provided between the engaging portion 341 and the separating portion 342. The middle portion 343 extends obliquely relative to the upper surface 75a between the end of the engaging portion 341 in the inner direction and the end of the separating portion 342 in the outer direction. The middle portion 343 extends in a manner that moves away from the upper surface 75a as it approaches the separating portion 342 from the engaging portion 341.

[0175] The inner surface 321 of the exposure hole 320 is separated from the end of the middle portion 343 in the inner direction. For example, the inner surface 321 has an edge 321a. The edge 321a is, for example, provided at the end of the inner surface 321 in the inner direction and extends substantially along the X direction. The edge 321a of the inner surface 321 and the edge 311a of the pad 311 face each other.

[0176] The end edge 321a of the inner surface 321 is separated from the end edge 311a of the pad 311 inwardly. Furthermore, in the Y direction, the end edge 321a is separated from the middle portion 343 inwardly. The separation portion 342 covers at least a portion of the end edge 321a. In other words, in the Y direction, the end edge 321a is located between the two ends of the separation portion 342 in the Y direction. In addition, the middle portion 343 may also cover a portion of the end edge 321a. At least a portion of the end edge 321a of the inner surface 321 is covered by the shell 151. In other words, at least a portion of the end edge 321a is located between the upper surface 75a and the shell 151.

[0177] like Fig.10 As shown, a portion of the joint portion 341, a portion of the separation portion 342, and the intermediate portion 343 are located between the inner side surface 335b of the cutout 335 and the holding protrusion 336. Furthermore, the separation portion 342 is located between the bottom surface 335a of the cutout 335 and the holding protrusion 337. Thus, the holding protrusions 336 and 337 hold the wire 340.

[0178] like Fig. 9 As shown, a space S4 is provided between the separation portion 342 and the upper surface 77b of the cover layer 77. The space S4 is a part of the cutout 335 and is open on the side surface 332 of the housing 151. Furthermore, a space S5 is provided between the separation portion 342 and the intermediate portion 343 and the upper surface 75a of the base layer 75 exposed from the exposure hole 320.

[0179] The space S4 communicates with the spaces S2 and S5. Therefore, the space S5 communicates with the space S2 and the through holes 141, 142, and 143 via the space S4. Furthermore, the space S5 communicates with the side surface 332 of the housing 151 via the space S4.

[0180] The following is a partial example of a method for mounting the relay connector 302 on the FPC 18. The method for mounting the relay connector 302 on the FPC 18 is not limited to the following method, and other methods may be used. First, solder paste (solder 155, 345) is supplied to the pads 131, 311 by printing or coating, for example.

[0181] Next, the relay connector 302 is mounted on the pads 131 and 311. Next, the FPC 18 is heated in a reflow furnace to melt the solder paste. Thus, the wires 152 and 340 of the relay connector 302 are joined to the pads 131 and 311. At this time, the flux mixed in the solder 155 and 345 or supplied separately may flow out of the solder 155 and 345.

[0182] Next, the FPC 18 is cleaned, for example, by ultrasonic cleaning. For example, the FPC 18 is placed in a tank filled with cleaning liquid C. The cleaning liquid C flows into the space S5 through the through holes 141, 142, 143, the space S2, and the space S4. In addition, the cleaning liquid C can also flow into the space S5 through the space S4 opened on the side surface 332. The cleaning liquid C can be discharged from the space S5 to the outside of the FPC 18 through the space S4.

[0183] The cleaning liquid C flows into the spaces S4 and S5 and is discharged from the spaces S4 and S5. That is, the cleaning liquid C flows through the spaces S4 and S5. Thus, the cleaning liquid C can remove substances that may contaminate the HDD 10 present in the spaces S4 and S5.

[0184] like Fig.10 As shown in FIG. 1 , a blocking portion DE is provided between the FPC 18 and the relay connector 302. The blocking portion DE includes a portion of the space S4 and the space S5. The blocking portion DE is surrounded by the FPC 18, the inner side surface 335b of the cutout 335, the retaining protrusion 336, the retaining protrusion 337, the engaging portion 341, the separating portion 342, and the intermediate portion 343, and is only open to the substantially inner direction. Therefore, it is sometimes difficult for the cleaning liquid C to flow into the blocking portion DE, and it is difficult to flow out of the blocking portion DE.

[0185] In this embodiment, the inner surface 321 of the exposure hole 320 is separated from the edge 311a of the pad 311. Therefore, the exposure hole 320 is set larger in the dam DE, and the area of ​​the upper surface 75a of the base layer 75 exposed by the exposure hole 320 is set larger.

[0186] By setting the exposure hole 320 in the blocking portion DE larger, the size of the blocking portion DE in the Z direction, for example, becomes larger. Specifically, the distance between the separation portion 342 and the middle portion 343 and the FPC 18 becomes longer. Therefore, the cleaning liquid C easily flows into the blocking portion DE and easily flows out of the blocking portion DE.

[0187] When the ultrasonic cleaning is completed, the FPC 18 is removed from the cleaning liquid C. At this time, the cleaning liquid C in the space S5 is discharged through the space S4 together with the flux. As described above, the attachment of the relay connector 302 to the FPC 18 is completed.

[0188] In the HDD 10 of the third embodiment described above, the FPC 18 has a base layer 75 including an upper surface 75a, a cover layer covering the upper surface 75a, and a pad 311 provided on the upper surface 75a. The relay connector 302 has a housing 151 and a wire 340 provided on the housing 151. The cover layer 77 is provided with an exposure hole 320 that penetrates the cover layer 77 and exposes the upper surface 75a and the pad 311. The cover layer 77 has an upper surface 77b in which the exposure hole 320 is opened, and an inner surface 321 of the exposure hole 320 extending between the upper surface 75a and the upper surface 77b. The wire 340 has a joining portion 341 and a separating portion 342. The welding portion 341 is joined to the pad 311 via solder 345. The separation portion is provided between the joint portion 341 and the housing 151, and is separated from the joint portion 341 in the inner direction along the upper surface 75a, and is further away from the upper surface 75a than the joint portion 341 in the Z direction orthogonal to the upper surface 75a. The inner surface 321 is separated from the end edge 311a of the pad 311 in the inner direction. That is, the upper surface 75a is not covered by the covering layer 77 and is exposed between the end edge 311a of the pad 311 in the inner direction and the inner surface 321. Therefore, a space S5 in which the cleaning liquid C can flow can be formed between the end edge 311a of the pad 311 in the inner direction and the inner surface 321, and between the separation portion 342 and the upper surface 75a. In other words, the spaces S4 and S5 between the separation portion 342 and the FPC 18 are set larger, and the cleaning liquid C can easily flow in the spaces S4 and S5. Therefore, the HDD 10 of this embodiment can prevent substances that may contaminate the HDD 10 , such as flux, from remaining in the spaces S4 and S5 between the separation portion 342 and the FPC 18 , and can further prevent the substances that may contaminate the HDD 10 from causing problems such as head crashes.

[0189] The wire 340 is disposed between the joint portion 341 and the separation portion 342, and has a middle portion 343 extending obliquely relative to the upper surface 75a. The inner surface 321 is separated from the end of the middle portion 343 in the inner direction. As a result, the spaces S4 and S5 between the middle portion 343 and the FPC 18 are set larger, and the cleaning liquid C can easily flow in the spaces S4 and S5. Therefore, the HDD 10 of this embodiment can suppress the substances that may contaminate the HDD 10 from remaining in the spaces S4 and S5 between the middle portion 343 and the FPC 18, and can further suppress the substances that may contaminate the HDD 10 from causing adverse conditions such as head collision.

[0190] At least a portion of the edge 321a of the inner surface 321 in the inner direction is located between the upper surface 75a and the housing 151. In other words, at least a portion of the edge 321a of the exposure hole 320 in the inner direction is covered by the housing 151. That is, the inner direction is a direction from the joint 341 toward the inner side of the relay connector 302 in the direction along the upper surface 75a. In addition, the spaces S4 and S5 between the separation portion 342 and the FPC 18 are provided between the housing 151 and the FPC 18. The HDD 10 of this embodiment can set the spaces S4 and S5 between the housing 151 and the FPC 18 to be larger, and can suppress the substances that may contaminate the HDD 10 from remaining in the spaces S4 and S5 between the separation portion 342 and the FPC 18.

[0191] The edge 311b of the pad 311 in the outer direction opposite to the inner direction is covered with the cover layer 77. Thus, for example, when the edge 311b of the pad 311 in the outer direction is connected to a wiring, it is possible to suppress solder from adhering to the wiring.

[0192] In the above description, inhibition is defined as, for example, preventing the occurrence of a phenomenon, action or influence, or reducing the degree of a phenomenon, action or influence. In addition, in the above description, restriction is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a specified range and preventing movement or rotation beyond the specified range.

[0193] Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their variations are included in the scope and purpose of the invention, and are included in the invention described in the scope of the patent claim and the scope equivalent thereto.

Claims

1. A disk device comprising: disk; A magnetic head configured to read and write information relative to the magnetic disk; A flexible printed circuit board electrically connected to the magnetic head; An electronic component mounted on the flexible printed circuit board; and The wall has a higher rigidity than the flexible printed circuit board and is mounted on the flexible printed circuit board. The flexible printed circuit board comprises a first surface facing the electronic component across a gap, a second surface located on the opposite side of the first surface and facing the wall, a first layer including the first surface, a second layer covering the first surface, and a pad provided on the first surface, and a first through hole is provided on the flexible printed circuit board, the first through hole is opened on the first surface and the second surface and communicates with the gap, A second through hole is provided on the wall, the second through hole penetrates the wall and communicates with the first through hole. The electronic component comprises a housing and a metal component provided on the housing. A fifth through hole is provided on the second layer, the fifth through hole penetrates the second layer to expose the first surface and the pad, the second layer has a third surface where the fifth through hole opens, and an inner surface of the fifth through hole extending between the first surface and the third surface, The metal member has a joint portion joined to the pad via solder.

2. The disk device according to claim 1, wherein The metal component has a separation portion, which is provided between the joint portion and the housing, and is separated from the joint portion in a first direction along the first surface and away from the first surface in a direction orthogonal to the first surface than the joint portion. The inner surface is separated from an end portion of the pad in the first direction.

3. The disk device according to claim 1 or 2, wherein: The metal component has an intermediate portion, which is disposed between the joining portion and the separating portion and extends obliquely with respect to the first surface. The inner surface is separated from an end portion of the intermediate portion in the first direction.

4. The disk device according to any one of claims 1 to 3, wherein: At least a portion of an end portion of the inner surface in the first direction is located between the first surface and the housing.

5. The disk device according to claim 1 or 2, wherein: An end portion of the pad in a second direction opposite to the first direction is covered by the second layer.

6. A disk device comprising: disk; A magnetic head configured to read and write information relative to the magnetic disk; A flexible printed circuit board having a first layer, a pad disposed on a surface of the first layer, and a second layer covering the surface, wherein an exposure hole is disposed on the flexible printed circuit board, the exposure hole penetrates the second layer to expose the surface and the pad, and the flexible printed circuit board is electrically connected to the magnetic head; The electronic component comprises a housing and a metal component provided on the housing, and is mounted on the flexible printed circuit board. The metal component comprises: a joining portion joined to the pad via solder; and a separating portion provided between the joining portion and the housing, separated from the joining portion in a direction along the surface in a first direction along the surface, and further away from the surface than the joining portion in a direction orthogonal to the surface. An inner surface of the exposure hole is separated from an end portion of the pad in the first direction.

7. The disk device according to claim 6, wherein The metal component has a middle portion, which is disposed between the joining portion and the separating portion and extends obliquely with respect to the surface. The inner surface is separated from an end portion of the intermediate portion in the first direction.

8. The disk device according to claim 6 or 7, wherein: At least a portion of an end portion of the inner surface in the first direction is located between the surface and the housing.

9. The disk device according to claim 6, wherein: An end portion of the pad in a second direction opposite to the first direction is covered by the second layer.

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