Binding material heat treatment device and binding material heat treatment method

Abstract

The invention relates to an adhesive material heat treatment device and an adhesive material heat treatment method. The adhesive material heat treatment device and the adhesive material heat treatment method can perform heat treatment on adhesive materials such as flux or solder paste coated on semiconductor substrates or package materials. The adhesive material heat treatment apparatus may include: a process chamber in which an input port through which a substrate or a package is input is formed on one side, a discharge port through which the substrate or the package is discharged is formed on the other side, and a processing space is formed therein; and an illumination-type heating device formed in the process chamber and generating light to heat the adhesive material applied to the substrate or the package such that the adhesive material is fused to the substrate or the package.

Description

Technical Field

[0001] The present invention relates to an adhesive material heat treatment device and an adhesive material heat treatment method, and more specifically, to an adhesive material heat treatment device and an adhesive material heat treatment method that can heat treat adhesive materials such as flux or solder paste applied to semiconductor substrates or packaging materials. Background Art

[0002] In order to bond semiconductor material components such as semiconductor substrates, packages, or printed circuit boards, bonding materials such as flux or solder paste may be applied.

[0003] An adhesive material applied to a semiconductor material such as a semiconductor substrate, a package, or a printed circuit board may be firmly fused to the substrate using a heat treatment process such as a reflow process, during which fumes or various foreign substances may occur.

[0004] Conventional adhesive material heat treatment devices use electric heating or hot air to heat treat substrates or packages in a heat treatment chamber in the form of an oven. Summary of the invention

[0005] [Technical issues]

[0006] However, conventional heat treatment devices using electric heating or hot air have many problems such as reduced energy efficiency and uneven heating of substrates or packages due to inability to accurately control temperature.

[0007] The purpose of the present invention is to provide a bonding material heat treatment device and bonding material heat treatment method that improves energy efficiency by using a light heating device, accurately controls the light heating temperature of a lamp by using a pulse wave, and uniformly heats a substrate or a package material by using a thermal imaging camera and an illuminance sensor at the same time, in order to solve various problems including the above-mentioned problems. However, these technical problems are only exemplary and do not limit the scope of the present invention.

[0008] [Technical solution]

[0009] An adhesive material heat treatment device based on the concept of the present invention for solving the above-mentioned problems may include: a process chamber, having an inlet for inputting a substrate or a package on one side, an outlet for discharging the substrate or the package on the other side and a processing space formed inside; and a light-irradiation heating device, formed in the process chamber and generating light to heat the adhesive material applied to the substrate or the package so that the adhesive material is melted to the substrate or the package.

[0010] According to the present invention, the light irradiation heating device may include IPL (Intense Pulsed Light).

[0011] According to the present invention, a light-irradiation heating device may include: a module shell, which forms a accommodating space inside; a xenon lamp, which is formed in the accommodating space and generates light in a pulsed form; a reflecting plate, which reflects light in a direction toward a substrate or a package; and a light-transmitting plate, which is formed on the lower surface of the module shell, transmits light so that the light is irradiated in a direction toward the substrate or the package, and protects the xenon lamp from foreign matter.

[0012] The embodiment according to the present invention may further include an illumination distance adjustment device that can move the illumination heating device forward and backward in a direction toward the substrate or the package to adjust the illumination distance from the illumination heating device to the substrate or the package.

[0013] According to an embodiment of the present invention, a sliding guide member may be formed inside the process chamber to allow the light-irradiating heating device to be separated and withdrawn from the process chamber in a sliding manner using a management door formed on the other side of the process chamber in order to clean or manage the light-irradiating heating device.

[0014] Embodiments according to the present invention may further include a thermal imaging camera that captures thermal images of the substrate or package, thereby monitoring the heating state of the substrate or package.

[0015] The embodiment according to the present invention may further include an illumination sensor for measuring the illumination of reflected light on the substrate or the package so as to monitor the amount of light emitted by the light-illuminating heating device.

[0016] The embodiment according to the present invention may further include a CCD camera for photographing the accommodation space so as to monitor the internal state of the process chamber.

[0017] According to the present invention, a process chamber may include: a chamber body, in which a plurality of independent processing areas are formed and light-irradiation heating devices are arranged in parallel to the independent processing areas, and a plurality of inlets are formed to introduce substrates or packages into the independent processing areas, and a plurality of outlets are formed to discharge substrates or packages from the independent processing areas; one or more barrier walls are formed between the independent processing areas and partially or completely block between the light-irradiation heating devices; and a fume exhaust line is formed on the upper part of the chamber body and exhausts the fume generated when the adhesive material applied to the substrate or package is melt-bonded.

[0018] According to the present invention, the process chamber may include: a foreign matter discharge line formed at the lower portion of the chamber body and discharging foreign matter generated when the adhesive material applied to the substrate or package is melt-bonded; and a foreign matter collection device disposed on the foreign matter discharge line and collecting foreign matter.

[0019] According to an embodiment of the present invention, the process chamber may further include an inert gas supply device formed on the chamber body and supplying an inert gas to the inside of the chamber body.

[0020] According to an embodiment of the present invention, it may also include: a substrate alignment device, which is formed in the processing space of the process chamber and aligns the substrate or package so that the substrate or package is located at a specified position, wherein the substrate alignment device also includes: an alignment pin device, which selectively presses the side of the substrate or package to align the substrate or package; a vacuum adsorption head, which vacuum adsorbs the aligned substrate or package; a head lifting device, which lifts the vacuum adsorption head to a heating position; and a head cooling device, which is set to the vacuum adsorption head to cool the substrate or package.

[0021] According to an embodiment of the present invention, it may also include: a first transport device formed in the processing space of the process chamber, and transporting the substrate or package from the input port to the substrate alignment device; and a second transport device formed in the processing space of the process chamber, and transporting the substrate or package from the substrate alignment device to the discharge port.

[0022] According to the present invention, the first transport device may be a magnet conveyor that rotates the transport roller using a driving magnet that rotates around a driving shaft and a driven magnet that rotates around a driven shaft in a non-contact manner.

[0023] According to the present invention, the first transport device may include a lower linear motor transporting the substrate or package along a lower guide member disposed at a lower level and an upper linear motor transporting the substrate or package along an upper guide member formed above the lower linear motor.

[0024] According to the present invention, the first transport device may be a transport robot that distributes substrates or packages introduced from an introduction port to a plurality of independent processing areas.

[0025] According to an embodiment of the present invention, it may also include: a first conveyor, which is fixedly formed along a first direction and transports substrates or packages; and a second conveyor, which is formed to move in a second direction using a linear motor and can receive substrates or packages from the first conveyor and distribute them to multiple input ports formed in the process chamber.

[0026] According to an embodiment of the present invention, it may also include: a third conveyor, which is formed to move in the second direction using a linear motor and can receive substrates or packages from multiple discharge ports formed in the process chamber; and a fourth conveyor, which is fixedly formed along the first direction and transports the substrates or packages received from the third conveyor.

[0027] A method for heat treating an adhesive material according to the spirit of the present invention for solving the above-mentioned problems comprises: step (a), preparing a process chamber having an inlet on one side for inputting a substrate or a package, an outlet on the other side for discharging the substrate or the package and forming a processing space inside; and step (b), using light from a light-irradiating heating device to heat the adhesive material applied to the substrate or the package transported to the process chamber, and to fuse the adhesive material to the substrate or the package.

[0028] The adhesive material heat treatment device according to the spirit of the present invention to solve the above-mentioned problems includes: a process chamber, which forms an inlet for inputting a substrate or a package on one side, an outlet for discharging the substrate or the package on the other side and forms a processing space inside; and a light-irradiation heating device, which is formed in the process chamber and generates light to heat the adhesive material applied to the substrate or the package so that the adhesive material is melted to the substrate or the package. The light-irradiation heating device includes IPL (Intense Pulsed Light). The light-irradiation heating device includes: a module housing, which forms a accommodating space inside; a xenon lamp, which is formed in the accommodating space and generates light in a pulsed form; a reflective plate, which reflects light in a direction toward the substrate or the package; and a light-transmitting plate, which is formed on the lower surface of the module housing, transmits light so that the light is irradiated in a direction toward the substrate or the package, and protects the xenon lamp from foreign matter. According to an embodiment of the present invention, the invention also includes: a lighting distance adjustment device, which can move the lighting heating device forward and backward in a direction toward the substrate or the package to adjust the lighting distance from the lighting heating device to the substrate or the package; a sliding guide member, which can be formed inside the process chamber to enable the lighting heating device to be separated and withdrawn from the process chamber in a sliding manner using a management door formed on the other side of the process chamber in order to clean or manage the lighting heating device; a thermal imaging camera, which can take thermal images of the substrate or the package to monitor the heating state of the substrate or the package; and an illumination sensor, which measures the illumination of the reflected light on the substrate or the package to monitor the light emission of the lighting heating device. The process chamber also includes: a chamber body, in which a plurality of independent processing areas are formed and a light-irradiation heating device is arranged in parallel to the independent processing area, and a plurality of inlets are formed to introduce substrates or packages into the independent processing areas, and a plurality of outlets are formed to discharge substrates or packages from the independent processing areas; one or more barrier walls are formed between the independent processing areas and partially or completely block between the light-irradiation heating devices; a fume exhaust line is formed at the upper part of the chamber body and exhausts the fume generated when the adhesive material applied to the substrate or package is melt-bonded; a foreign matter exhaust line is formed at the lower part of the chamber body and exhausts foreign matter generated when the adhesive material applied to the substrate or package is melt-bonded; a foreign matter collection device is arranged on the foreign matter exhaust line and collects foreign matter; and an inert gas supply device is formed on the chamber body and provides inert gas to the inside of the chamber body. According to an embodiment of the present invention, it also includes: a substrate alignment device is formed in the processing space of the process chamber and aligns the substrate or package so that the substrate or package is located at a specified position. The substrate alignment device also includes: an alignment pin device, which selectively presses the side of the substrate or package to align the substrate or package; a vacuum adsorption head, which vacuum adsorbs the aligned substrate or package; a head lifting device, which lifts the vacuum adsorption head to a heating position; and a head cooling device, which is set to the vacuum adsorption head to cool the substrate or package.According to an embodiment of the present invention, it further includes: a first transport device formed in the processing space of the process chamber, and transporting the substrate or package from the input port to the substrate alignment device; and a second transport device formed in the processing space of the process chamber, and transporting the substrate or package from the substrate alignment device to the discharge port. According to an embodiment of the present invention, it further includes: a first conveyor fixedly formed along a first direction, and transporting the substrate or package; a second conveyor formed to move in a second direction using a linear motor, receiving the substrate or package from the first conveyor and distributing it to a plurality of input ports formed in the process chamber; a third conveyor formed to move in the second direction using a linear motor, and can receive the substrate or package from a plurality of discharge ports formed in the process chamber; and a fourth conveyor fixedly formed along the first direction, and transporting the substrate or package received from the third conveyor.

[0029] [Beneficial Effects]

[0030] Effects of the above-mentioned embodiments of the present invention include: energy efficiency can be improved by using an IPL (Intense Pulsed Light) light-irradiation heating device; a high-output pulse wave of a broadband spectrum wavelength in a very short time can be used to accurately and quickly control the light heating temperature of the lamp; a thermal imaging camera and an illuminance sensor can be used simultaneously to uniformly heat a substrate or package; a magnet conveyor can be used to suppress the generation of foreign matter, and productivity can be improved without transportation delays, wherein the transportation delay includes arranging a plurality of light-irradiation heating devices partially isolated by a barrier wall in parallel or arranging the transport device in a single layer or multiple layers, etc.; a head cooling device can be used after light heating to prevent the degradation of the substrate or package; since the heat treatment process is relatively simple, the heat treatment process can be quickly performed; the amount of electricity and the use of inert gases such as nitrogen can be reduced; it is conducive to the large area of ​​the substrate or package; the volume of the equipment can be reduced; the light irradiation distance can be made uniform, so that light heating can be performed uniformly; a sliding guide member can be used to make the management and application of the light-irradiation heating device easy. Of course, the scope of the present invention is not limited to these effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a perspective view showing an apparatus for heat treating an adhesive material according to some embodiments of the present invention.

[0032] Figure 2 It is shown Figure 1 A plan cross-sectional view of a bonding material heat treatment device.

[0033] Figure 3 It is shown Figure 1 A side cross-sectional view of a substrate alignment state of an adhesive material heat treatment apparatus.

[0034] Figure 4 It is shown Figure 3 A side sectional view of a bonding material heat treatment apparatus in a light heating state.

[0035] Figure 5 It is shown Figure 1 A stereoscopic view of a sliding guide member of an adhesive material heat treatment apparatus.

[0036] Figure 6 It is shown Figure 1 A perspective view of a magnet conveyor of an apparatus for heat treating adhesive materials.

[0037] Figure 7 2 is a plan cross-sectional view showing an apparatus for heat treating an adhesive material according to some other embodiments of the present invention.

[0038] Figure 8 1 is a side cross-sectional view showing an adhesive material heat treatment apparatus according to still other embodiments of the present invention.

[0039] Fig. 9 It is shown Figure 8 A front cross-sectional view of a device for heat treating adhesive materials.

[0040] Fig.10 It is shown Figure 8 A three-dimensional view of a device for heat treating adhesive materials.

[0041] Fig.11 is a flowchart illustrating a method for heat treating an adhesive material according to an embodiment of the present invention.

[0042] [Explanation of Reference Numerals]

[0043] I: first direction

[0044] II: Second Direction

[0045] III: Third Direction

[0046] S: Substrate

[0047] 10: Process chamber

[0048] 10a: Input port

[0049] 10b: Drain outlet

[0050] 10c: Management Gate

[0051] 11: Cavity body

[0052] 12: Barrier Wall

[0053] 13: Smoke exhaust line

[0054] 14: Foreign matter discharge line

[0055] 15: Foreign matter collection device

[0056] 16: Inert gas supply device

[0057] 20: Light heating device

[0058] 21: Module housing

[0059] 22: Xenon lamp

[0060] 23: Reflector

[0061] 24: Translucent board

[0062] 30: Lighting distance adjustment device

[0063] 40: Sliding guide member

[0064] 50: Thermal imaging camera

[0065] 60: Illuminance sensor

[0066] 70: CCD camera

[0067] 80: Substrate alignment device

[0068] 81: Alignment pin device

[0069] 82: Vacuum adsorption head

[0070] 83: Head lifting device

[0071] 84: Head cooling device

[0072] 90: Transport device

[0073] 91: First transport device

[0074] S1: drive shaft

[0075] M1: driving magnet

[0076] S2: driven shaft

[0077] M2: driven magnet

[0078] R: Transport roller

[0079] MC: Magnet Conveyor

[0080] 1FG: Lower guide member

[0081] 1FM: Lower linear motor

[0082] 2FG: Upper guide member

[0083] 2FM: Upper Linear Motor

[0084] FR: Frame

[0085] RB: Transport Robot

[0086] 92: Second transport device

[0087] CV1: First conveyor

[0088] CV2: Second conveyor

[0089] LM: Linear Motor

[0090] CV3: Third conveyor

[0091] CV4: Fourth conveyor

[0092] 100, 200, 300: Adhesive material heat treatment device DETAILED DESCRIPTION

[0093] Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0094] The embodiments of the present invention are provided to more completely illustrate the present invention to those of ordinary skill in the art. The following embodiments may be changed into various forms, and the scope of the present invention is not limited to the following embodiments. On the contrary, these embodiments make the present invention more substantial and complete, and are provided to fully convey the spirit of the present invention to those skilled in the art. In addition, for convenience and clear description, the thickness or size of each layer in the drawings is exaggerated.

[0095] The terms used in the specification are used to describe specific embodiments and do not limit the present invention. As used in this specification, unless the context clearly indicates otherwise, the singular form may include the plural form. As used herein, "comprise" and / or "comprising" means the existence of the mentioned shapes, numbers, steps, operations, components and / or combinations thereof, and does not exclude the existence or addition of one or more other shapes, numbers, steps, operations, components and / or combinations thereof.

[0096] Hereinafter, embodiments of the present invention are described with reference to the accompanying drawings which briefly illustrate preferred embodiments of the present invention. In the accompanying drawings, it is expected that the shapes shown will be deformed due to manufacturing techniques and / or tolerances. Therefore, embodiments of the present invention should not be interpreted as being limited to the specific shapes within the regions shown in this specification, but include shape variations caused by, for example, manufacturing.

[0097] Figure 1 is a perspective view showing an adhesive material heat treatment apparatus 100 according to some embodiments of the present invention. Figure 2 It is shown Figure 1A plan cross-sectional view of an adhesive material heat treatment apparatus 100 . Figure 3 It is shown Figure 1 A side cross-sectional view of a bonding material heat treatment apparatus 100 showing a substrate alignment state. Figure 4 It is shown Figure 3 A side cross-sectional view of an adhesive material heat treatment apparatus 100 in a light heating state.

[0098] Here, the first direction I, the second direction II, and the third direction III are directions orthogonal to each other in a three-dimensional space. The first direction I may be the direction of a main path for transporting the substrate S and performing a heat treatment process, the second direction II may be a direction on the left or right side of the first direction I and horizontally perpendicular to the first direction I at 90 degrees, and the third direction III may be a direction on the upper or lower side of the first direction I and vertically perpendicular to the first direction I at 90 degrees. For example, the first direction I, the second direction II, and the third direction III may be the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.

[0099] First, if Figures 1 to 3 As shown, an adhesive material heat treatment device 100 according to some embodiments of the present invention may generally include a process chamber 10 and a light-irradiation heating device 20 .

[0100] For example, the process chamber 10 may be a box-shaped structure having an inlet 10a for inputting a substrate S or a package on one side, an outlet 10b for discharging the substrate S or the package on the other side, and a processing space formed inside.

[0101] The process chamber 10 may be formed by assembling various types and forms of vertical members, horizontal members, inclined members, panel members, etc., which have sufficient strength and durability to support the light-irradiating heating device 20 and other devices formed therein.

[0102] For example, the process chamber 10 may include a chamber body 11, a barrier wall 12, a smoke exhaust line 13, a foreign matter exhaust line 14, a foreign matter collection device 15 disposed on the foreign matter exhaust line 14 and collecting foreign matter, and an inert gas supply device 16 formed on the chamber body 11 and supplying an inert gas to the interior of the chamber body 11.

[0103] For example, a plurality of independent processing areas are formed inside the chamber body 11, and light-irradiating heating devices 20 are arranged in parallel in the independent processing areas. A plurality of inlets 10a are formed to allow substrates S or packages to be introduced into the independent processing areas, and a plurality of outlets 10b can be formed to allow substrates S or packages to be discharged from the independent processing areas.

[0104] For example, five independent processing areas are formed in the chamber body 11, and a total of five light-irradiation heating devices 20 can be arranged in the five independent processing areas. However, the number of these independent processing areas or the number of light-irradiation heating devices 20 can be applied to various numbers according to process conditions, equipment specifications or process environment, etc.

[0105] For example, the barrier wall 12 is formed between the independent processing areas so that various fumes and foreign matter generated by the heat treatment process do not invade the adjacent independent processing areas, and the barrier wall 12 can be a wall structure that partially blocks between the light-irradiation heating devices 20.

[0106] However, such a blocking wall 12 is not limited to partially blocking between the light-irradiating heating devices 20, and may completely block the independent processing areas.

[0107] For example, the smoke exhaust line 13 is formed at the upper portion of the chamber body 11 to exhaust volatile gas. The smoke exhaust line 13 may be a gas exhaust pipe or a gas exhaust duct for exhausting smoke generated when the adhesive material applied to the substrate S or the package is heated and welded.

[0108] For example, the foreign matter discharge line 14 is formed at the lower part of the cavity body 11 to discharge fallen foreign matter, and the foreign matter discharge line 14 can be a foreign matter discharge pipe or a foreign matter discharge conduit or other structure that discharges foreign matter generated during the heating and welding process of the adhesive material applied to the substrate S or the package.

[0109] For example, the foreign matter collecting device 15 is provided to the foreign matter discharge line 14, and a filter or a trapping device that collects foreign matter may be applied.

[0110] For example, the inert gas supply device 16 is formed in the chamber body 11 and may be a structure such as a gas supply pipe or a gas supply pipeline that supplies an inert gas such as nitrogen or argon to the inside of the chamber body 11 .

[0111] However, the process chamber 10 is not necessarily limited to the drawings, and various forms or types of chamber structures may be applicable.

[0112] In addition, the light-irradiation heating device 20 according to the embodiment of the present invention is formed in the process chamber 10 and may be an optical device that generates light to heat an adhesive material applied to the substrate S or a package so that the adhesive material is fused to the substrate S or the package.

[0113] For example, the light irradiation heating device 20 may use IPL (Intense Pulsed Light) capable of accurately and rapidly controlling the light heating temperature of the lamp using a high-output pulse wave in a very short time with a broadband spectrum wavelength.

[0114] The IPL type illumination heating device 20 using a xenon lamp or other lamp generates light with specific parameters (such as light intensity, pulse width, number of pulses and pulse interval, etc.), and such parameters can be combined in various ways according to the type of adhesive material, the amount of adhesive material, the composition of the adhesive material or the composition ratio of the adhesive material. The illumination time can be from several seconds to several tens of seconds. More preferably, the illumination time can be shortened to about 30 seconds to about 50 seconds. If the illumination time is too short, the adhesive material may not be sintered, and if the time is too long, the adhesive material may be over-fused. Therefore, the illumination time can be adjusted within an appropriate range.

[0115] The light can be emitted at 0.1 joule (J) / cm per pulse. 2 To tens of joules (J) / cm 2 The light sintering energy can be irradiated dozens to hundreds of times per second. More preferably, the light irradiation energy can be several joules (J) / cm 2 If it is too large, it may increase process costs or overload the lamp. Therefore, the lighting energy can be adjusted to the above range.

[0116] The voltage during light irradiation may be 100 V to 200 V. If the voltage is too low, sufficient energy cannot be generated for the heat treatment process, and thus the conductivity of the bonding material cannot be fully realized. If the voltage is too high, the substrate S or the package may be damaged or the shape of the bonding material may be deformed. Therefore, the voltage may be adjusted to the above range.

[0117] Therefore, the heat treatment process that takes more than 300 seconds in a conventional electric heating device or a hot air electric heating device can be shortened to about 30 to 50 seconds, thereby dramatically improving energy efficiency and productivity.

[0118] More specifically, if Figure 3 As shown, the light-irradiation heating device 20 may include: a module shell 21, which forms a containing space inside; a xenon lamp 22, which is formed in the containing space and generates light in a pulsed form; a reflecting plate 23, which reflects light in a direction toward the substrate S or the package; and a light-transmitting plate 24, which is formed on the lower surface of the module shell 21, protects the xenon lamp 22 from foreign matter, and light can pass through the light-transmitting plate 24, thereby irradiating in a direction toward the substrate S or the package.

[0119] In addition, if Figure 3As shown, the adhesive material heat treatment device 100 according to some embodiments of the present invention may also include: a light distance adjustment device 30, which can move the light-irradiating heating device 20 forward and backward in the direction toward the substrate S or the package to adjust the light distance from the light-irradiating heating device 20 to the substrate S or the package; a thermal imaging camera 50, which can take thermal images of the substrate S or the package, so as to monitor the heating state of the substrate S or the package; an illumination sensor 60, which measures the illumination of the reflected light on the substrate S or the package, so as to monitor the light emission of the light-irradiating heating device 20; a CCD camera 70, which takes pictures of the accommodating space, so as to monitor the internal state of the process chamber 10; and a substrate alignment device 80, which is formed in the processing space of the process chamber 10 and aligns the substrate S or the package to be located at a specified position.

[0120] More specifically, the substrate alignment device 80 may include: an alignment pin device 81, which selectively presses the side of the substrate S or the package to align the substrate S or the package; a vacuum adsorption head 82, which vacuum adsorbs the aligned substrate S or the package; a head lifting device 83, which lifts the vacuum adsorption head 82 to a heating position; and a head cooling device 84, which is set to the vacuum adsorption head 82 to cool the substrate S or the package.

[0121] Therefore, if Figure 3 As shown, after the side of the substrate S or the package is selectively pressed by the alignment pin device 81 to align the substrate S or the package to a specified position, as shown in FIG. Figure 4 As shown, after the vacuum adsorption head 82 vacuum adsorbs the aligned substrate S or package, the head lifting device 83 lifts the vacuum adsorption head 82 to the heating position, and the substrate S or package can be heated by radiant heat using the light-irradiation heating device 20.

[0122] At this time, the head cooling device 84 may be used to cool the substrate S or the package to prevent damage to the substrate S or the package due to overheating.

[0123] Next, the thermal imaging camera 50 and the illuminance sensor 60 can be used to monitor the heating state of the substrate S or the package while monitoring the light emission of the light-illuminating device 20, and based on these monitoring results, the light-illuminating distance adjusting device 30 can be used to adjust the light-illuminating distance from the light-illuminating heating device 20 to the substrate S or the package, thereby uniformly heating the substrate S or the package.

[0124] During the heat treatment process, the CCD camera 70 may be used to monitor the internal state of the process chamber 10 .

[0125] On the other hand, the bonding material heat treatment apparatus 100 according to some embodiments of the present invention may further include a transport device 90 for transporting the substrate S or the package within the process chamber 10 .

[0126] For example, Figure 3 and Figure 4 As shown, the transport device 90 may include: a first transport device 91, which is formed in the processing space of the process chamber 10 and transports the substrate S or the package from the input port 10a to the substrate alignment device 80; and a second transport device 92, which is formed in the processing space of the process chamber 10 and transports the substrate S or the package from the substrate alignment device 80 to the discharge port 10b.

[0127] Therefore, if the substrate S or the package is put into the interior of the process chamber 10 through the input port 10a, it is transported to the substrate alignment device 80 by the first transport device 91 and after alignment, it can be heated by the light-irradiating heating device 20. After the heating, the substrate S or the package can be transported from the substrate alignment device 80 to the discharge port 10b by the second transport device 92, and then discharged to the outside of the process chamber 10.

[0128] On the other hand, Figures 1 to 4 As shown, the adhesive material heat treatment device 100 according to some embodiments of the present invention may also include: a first conveyor CV1, which is fixedly formed along the first direction I and transports the substrate S or the package; and a second conveyor CV2, which is formed to move in the second direction II using a linear motor LM, and can receive the substrate S or the package from the first conveyor CV1 and distribute it to a plurality of input ports 10a formed in the process chamber 10; a third conveyor CV3, which is formed to move in the second direction II using a linear motor LM, and can receive the substrate S or the package from a plurality of discharge ports 10b formed in the process chamber 10; and a fourth conveyor CV4, which is fixedly formed along the first direction I and transports the substrate S or the package received from the third conveyor CV3.

[0129] Therefore, even if the path for discharging the substrate S or package is one in the previous process, the second conveyor CV2 can be used to distribute and transport the substrate S or package to multiple input ports 10a, and the third conveyor CV3 can be used to receive the substrate S or package from multiple discharge ports 10b to connect to the subsequent process.

[0130] Figure 5 It is shown Figure 1 1 is a perspective view of a sliding guide member 40 of an adhesive material heat treatment apparatus 100.

[0131] For example, Figure 5 As shown, in order to clean or manage the light-irradiating heating device 20, a sliding guide member 40 can be formed inside the process chamber 10 so that the light-irradiating heating device 20 can be separated and withdrawn from the process chamber 10 in a sliding manner using a management door 10c formed on the other side of the process chamber 10.

[0132] However, the slide guide member 40 is not necessarily limited to the drawings, and various forms and types of guide members that can be attached and detached may be applied.

[0133] Figure 6 It is shown Figure 1 A perspective view of a magnet conveyor MC of the adhesive material heat treatment apparatus 100.

[0134] like Figure 6 As shown, the first transport device 91 may be a magnet conveyor MC that rotates the transport roller R using a driving magnet M1 that rotates around a driving shaft S1 and a driven magnet M2 that rotates around a driven shaft S2 in a non-contact manner.

[0135] Here, the driven shaft S2 and the driven magnet M2 can be formed inside the process chamber 10, and the driving shaft S1 and the driving magnet M1 can be set outside the process chamber 10, so that power can be transmitted in a non-contact manner, or the driven shaft S2, the driven magnet M2, the driving shaft S1 and the driving magnet M1 can all be formed inside the process chamber 10.

[0136] Therefore, the magnet conveyor MC of the non-contact power transmission method can fundamentally prevent the generation of foreign matter due to wear and tear, and can also prevent the contamination of the interior of the process chamber 10.

[0137] Figure 7 2 is a plan cross-sectional view showing an adhesive material heat treatment apparatus 200 according to some other embodiments of the present invention.

[0138] like Figure 7 As shown, the first transport device 91 of the adhesive material heat treatment device 200 according to some other embodiments of the present invention may be a transport robot RB that distributes the substrate S or package introduced from the introduction port 10a to a plurality of independent processing areas.

[0139] Therefore, if the substrate S or the package is put into the interior of the process chamber 10 through the input port 10a, it is transported to the substrate alignment device 80 by the transport robot RB and after alignment, it can be heated by the light heating device 20, and the substrate S or the package that has finished heating can be transported from the substrate alignment device 80 to the discharge port 10b by the second transport device 92 configured as another transport robot RB, so as to be discharged to the outside of the process chamber 10.

[0140] Figure 8 2 is a side cross-sectional view showing an adhesive material heat treatment apparatus 300 according to still other embodiments of the present invention. Fig. 9 It is shown Figure 8 A front cross-sectional view of an adhesive material heat treatment apparatus 300 . Fig.10 It is shown Figure 8 A three-dimensional view of an adhesive material heat treatment device 300.

[0141] like Figures 8 to 10 As shown, according to some other embodiments of the adhesive material heat treatment device 300 of the present invention, the first transport device 91 may include a lower linear motor 1FM for transporting the substrate S or the package along a lower guide member 1FG set in the lower layer, and an upper linear motor 2FM for transporting the substrate S or the package along an upper guide member 2FG supported by a frame FR and formed above the lower linear motor 1FM.

[0142] Therefore, if Figures 8 to 10 As shown, according to some other embodiments of the adhesive material heat treatment device 300 of the present invention, a large number of substrates S or packages can be heat treated because multiple substrates S or packages can be transported through a multi-layer path while selectively heating the substrates S or packages using a liftable light-illumination heating device 20.

[0143] Therefore, according to the embodiment of the present invention, not only can the throughput be maximized by increasing the number of processed substrates S or packages, but also the space availability can be improved because the volume of the equipment can be reduced.

[0144] In addition, energy efficiency can be improved by using an IPL (intense pulse light) light heating device 20; a high-output pulse wave with a broadband spectrum wavelength in a very short time can be used to accurately and quickly control the light heating temperature of the lamp; a thermal imaging camera 50 and an illuminance sensor 60 can be used simultaneously to uniformly heat the substrate S or the package; a magnet conveyor MC can be used to suppress the generation of foreign matter, and productivity can be improved without transportation delays, where transportation delays include arranging multiple light heating devices 20 partially isolated by a barrier wall 12 in parallel or arranging the transport device 90 in a single layer or multiple layers, etc.; a head cooling device 84 can be used after light heating to prevent degradation of the substrate S or the package; since the heat treatment process is relatively simple, the heat treatment process can be carried out quickly; the amount of electricity and the use of inert gases such as nitrogen can be reduced; it is beneficial to the large area of ​​the substrate S or the package; the volume of the equipment can be reduced; the illumination distance can be made uniform, so that light heating can be performed uniformly; a sliding guide member 40 can be used to make the management and application of the light heating device 20 easy.

[0145] Fig.11 is a flow chart illustrating a method of heat treating a bonding material according to some embodiments of the present invention.

[0146] like Figures 1 to 11As shown, the adhesive material heat treatment method according to some embodiments of the present invention includes: step (a), preparing a process chamber 10 with an inlet 10a formed on one side to input the substrate S or the package, an outlet 10b formed on the other side to discharge the substrate S or the package and a processing space formed therein; and step (b), using light from a light-irradiating heating device 20 to heat the adhesive material coated on the substrate S or the package transported to the process chamber 10, and melting the adhesive material to the substrate S or the package.

[0147] Although the present invention is described with reference to the embodiments shown in the accompanying drawings, this is only exemplary, and it should be understood that a person skilled in the art may make various modifications and other equivalent embodiments. Therefore, the true technical protection scope of the present invention should be defined by the technical concept of the scope of the claims attached to the patent.

Claims

1. A bonding material heat treatment device, comprising: A process chamber, having an inlet for inputting a substrate or a package formed on one side, an outlet for discharging the substrate or the package formed on the other side and a processing space formed inside; as well as A light-irradiation heating device is formed in the process chamber and generates light to heat the adhesive material applied to the substrate or the package so that the adhesive material is fused to the substrate or the package.

2. The adhesive material heat treatment device according to claim 1, wherein: The light-irradiation heating device includes intense pulsed light.

3. The adhesive material heat treatment device according to claim 2, wherein: The light-irradiation heating device comprises: A module housing, forming a receiving space inside; a xenon lamp formed in the containing space and generating light in a pulsed form; a reflective plate that reflects the light in a direction toward the substrate or the package; and A light-transmitting plate is formed on the lower surface of the module housing, transmits the light so that the light is irradiated in a direction toward the substrate or the package, and protects the xenon lamp from foreign matter.

4. The bonding material heat treatment device according to claim 1, further comprising: An illumination distance adjusting device is provided for moving the illumination heating device forward and backward in a direction toward the substrate or the package to adjust an illumination distance from the illumination heating device to the substrate or the package.

5. The bonding material heat treatment device according to claim 1, further comprising: In order to clean or manage the light-irradiating heating device, a sliding guide member is formed inside the process chamber so that the light-irradiating heating device can be separated and withdrawn from the process chamber in a sliding manner using a management door formed on the other side of the process chamber.

6. The bonding material heat treatment device according to claim 1, further comprising: A thermal imaging camera is used to capture thermal images of the substrate or the package, thereby being able to monitor the heating state of the substrate or the package.

7. The bonding material heat treatment device according to claim 1, further comprising: An illumination sensor measures the illumination of reflected light on the substrate or the package to monitor the amount of light emitted by the light-illuminating heating device.

8. The bonding material heat treatment device according to claim 1, further comprising: A CCD camera is used to photograph the containing space so as to monitor the internal state of the process chamber.

9. The adhesive material heat treatment device according to claim 1, wherein: The process chamber comprises: A chamber body, in which a plurality of independent processing areas are formed and the light-irradiation heating device is arranged in parallel to the independent processing areas, and a plurality of the input ports are formed to introduce the substrate or the package into the independent processing areas, and a plurality of the discharge ports are formed to discharge the substrate or the package from the independent processing areas; One or more barrier walls formed between the independent treatment areas and partially or entirely blocking between the light-irradiated heating devices; and A smoke exhaust line is formed at an upper portion of the chamber body and exhausts smoke generated when the adhesive material applied to the substrate or the package is welded.

10. The adhesive material heat treatment device according to claim 9, wherein: The process chamber comprises: a foreign matter discharge line formed at a lower portion of the chamber body and discharging foreign matter generated when the adhesive material applied to the substrate or the package is melt-bonded; and A foreign matter collecting device is provided on the foreign matter discharging line and collects the foreign matter.

11. The adhesive material heat treatment device according to claim 10, wherein: The process chamber further comprises: An inert gas supply device is formed on the chamber body and supplies an inert gas to the interior of the chamber body.

12. The bonding material heat treatment device according to claim 1, further comprising: A substrate alignment device is formed in the processing space of the process chamber and aligns the substrate or the package so that the substrate or the package is located at a specified position, wherein: The substrate alignment device comprises: an alignment pin device that selectively presses the side of the substrate or the package to align the substrate or the package; A vacuum adsorption head for vacuum adsorption of the aligned substrate or the package; A head lifting device, which lifts the vacuum adsorption head to a heating position; and A head cooling device is provided to the vacuum adsorption head to cool the substrate or the package.

13. The bonding material heat treatment device according to claim 12, further comprising: a first transport device formed in the processing space of the process chamber and transporting the substrate or the package from the input port to the substrate alignment device; as well as A second transport device is formed in the processing space of the process chamber and transports the substrate or the package from the substrate alignment device to the discharge port.

14. The adhesive material heat treatment device according to claim 13, wherein: The first transport device is a magnet conveyor that uses a driving magnet that rotates around a driving shaft and a driven magnet that rotates around a driven shaft in a non-contact manner to rotate a transport roller.

15. The adhesive material heat treatment device according to claim 13, wherein: The first transport device includes a lower linear motor that transports the substrate or the package along a lower guide member disposed at a lower level and an upper linear motor that transports the substrate or the package along an upper guide member formed above the lower linear motor.

16. The adhesive material heat treatment device according to claim 13, wherein: The first transport device is a transport robot that distributes the substrate or the package introduced from the introduction port to a plurality of independent processing areas.

17. The bonding material heat treatment device according to claim 1, further comprising: a first conveyor fixedly formed along a first direction and transporting the substrate or the package; as well as The second conveyor is formed to move in the second direction using a linear motor and is capable of receiving the substrates or the packages from the first conveyor and distributing the substrates or the packages to the plurality of input ports formed in the process chamber.

18. The bonding material heat treatment device according to claim 17, further comprising: a third conveyor formed to move in a second direction using a linear motor and capable of receiving the substrate or the package from the plurality of discharge ports formed in the process chamber; as well as A fourth conveyor is fixedly formed along the first direction and transports the substrate or the package received from the third conveyor.

19. A method for heat treating a bonding material, comprising: Step (a), preparing a process chamber having an inlet formed on one side for inputting a substrate or a package, an outlet formed on the other side for discharging the substrate or the package and a processing space formed inside; as well as Step (b) is to heat the adhesive material applied to the substrate or the package transported to the process chamber using light from a light-irradiating heating device, and to fuse the adhesive material to the substrate or the package.

20. A bonding material heat treatment device, comprising: A process chamber, having an inlet for inputting a substrate or a package formed on one side, an outlet for discharging the substrate or the package formed on the other side and a processing space formed inside; as well as A light-irradiation heating device is formed in the process chamber and generates light to heat the adhesive material applied to the substrate or the package so that the adhesive material is fused to the substrate or the package, wherein: The light-irradiation heating device comprises an intense pulsed light, The light-irradiation heating device comprises: A module housing, forming a receiving space inside; a xenon lamp formed in the containing space and generating light in a pulsed form; a reflective plate that reflects the light in a direction toward the substrate or the package; and a light-transmitting plate formed on the lower surface of the module housing, transmitting the light so that the light is irradiated in a direction toward the substrate or the package, and protecting the xenon lamp from foreign matter; an illumination distance adjusting device, which moves the illumination heating device forward and backward in a direction toward the substrate or the package so as to be able to adjust the illumination distance from the illumination heating device to the substrate or the package; a sliding guide member, formed inside the process chamber so that the light-irradiation heating device can be separated and withdrawn from the process chamber in a sliding manner by using a management door formed on the other side of the process chamber in order to clean or manage the light-irradiation heating device; a thermal imaging camera for capturing thermal images of the substrate or the package, thereby being able to monitor a heating state of the substrate or the package; and An illumination sensor measures the illumination of the reflected light on the substrate or the package, thereby monitoring the light emission of the light-illuminating heating device, wherein: The process chamber further comprises: A chamber body, in which a plurality of independent processing areas are formed and the light-irradiation heating device is arranged in parallel to the independent processing areas, and a plurality of the input ports are formed to introduce the substrate or the package into the independent processing areas, and a plurality of the discharge ports are formed to discharge the substrate or the package from the independent processing areas; One or more barrier walls formed between the independent treatment areas and partially or entirely blocking between the light-irradiated heating devices; a smoke exhaust line formed at an upper portion of the chamber body and exhausting smoke generated when the adhesive material applied to the substrate or the package is welded; a foreign matter discharge line formed at a lower portion of the chamber body and configured to discharge foreign matter generated when the adhesive material applied to the substrate or the package is melt-bonded; a foreign matter collecting device, which is disposed on the foreign matter discharge line and collects the foreign matter; and an inert gas supply device formed on the chamber body and supplying an inert gas into the interior of the chamber body; A substrate alignment device is formed in the processing space of the process chamber and aligns the substrate or the package so that the substrate or the package is located at a specified position. Wherein, the substrate alignment device further comprises: an alignment pin device that selectively presses the side of the substrate or the package to align the substrate or the package; A vacuum adsorption head for vacuum adsorption of the aligned substrate or the package; A head lifting device, for lifting the vacuum adsorption head to a heating position; A head cooling device, provided to the vacuum adsorption head to cool the substrate or the package; a first transport device formed in the processing space of the process chamber and transporting the substrate or the package from the input port to the substrate alignment device; and a second transport device formed in the processing space of the process chamber and transporting the substrate or the package from the substrate alignment device to the discharge port; a first conveyor fixedly formed along a first direction and transporting the substrate or the package; A second conveyor, formed to move in a second direction using a linear motor, capable of receiving the substrate or the package from the first conveyor and distributing it to a plurality of the input ports formed in the process chamber; a third conveyor formed to move in the second direction using a linear motor and capable of receiving the substrate or the package from the plurality of discharge ports formed in the process chamber; and A fourth conveyor is fixedly formed along the first direction and transports the substrate or the package received from the third conveyor.

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