A silicon wafer screen printing unloading device

Abstract

The present invention discloses a silicon wafer screen printing unloading device, which includes a conveying mechanism and a mounting frame; the mounting frame is horizontally located below the conveying mechanism, a limiting groove is formed in the part of the mounting frame located below the conveying mechanism, a strip-shaped plate is vertically slidably connected in the limiting groove, and a lifting mechanism is installed in the limiting groove for driving the strip-shaped plate to lift; a lifting platform is horizontally installed on the top of the strip-shaped plate, the lifting platform is perpendicular to the conveying mechanism, and a slope is provided on the top side of the lifting platform; a base platform is installed on the mounting frame, a rotating tube is rotatably connected to the base platform, a suction cup is installed at the end of the rotating tube, a motor and an air pump are installed on the base platform, the motor is used for driving the rotating tube to rotate, and the air pump is communicated with the rotating tube. The present invention can realize automatic unloading and enhance the unloading efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production, and particularly to a screen printing unloading device for silicon wafers. Background Art

[0002] Silicon wafer screen printing is a technology that transfers conductive pastes (such as silver paste, aluminum paste, etc.) onto the surface of silicon wafers through screen printing. Its basic principle is to use the mesh holes of the screen as a stencil for printing. The screen is usually made of materials such as nylon and polyester, with pre-designed patterns on it. When the squeegee moves on the screen with a certain pressure and speed, the conductive paste placed at one end of the screen is extruded by the squeegee and passes through the mesh holes of the screen, depositing on the surface of the silicon wafer, thereby forming a specific electrode pattern or other functional layers. After the silicon wafer is screen printed, it needs to be unloaded. Silicon wafer unloading is a key link in the silicon wafer processing process. The silicon wafer needs to be safely and efficiently unloaded from the processing equipment for subsequent packaging, inspection, or other processes. This process is directly related to the quality and production efficiency of the silicon wafer. For example, if the silicon wafer is damaged during the unloading process, such as chipping or scratching, it will increase the rejection rate of the silicon wafer, thereby increasing production costs. In current automated production, silicon wafers are usually transported by a conveying mechanism composed of two groups of parallel conveyor belts located on the same horizontal plane. How to automatically and efficiently unload the silicon wafers from this conveying mechanism is the design focus of the present invention. Summary of the Invention

[0003] To solve the technical problems existing in the background art, the present invention proposes a screen printing unloading device for silicon wafers.

[0004] A screen printing unloading device for silicon wafers proposed by the present invention includes a conveying mechanism and a mounting frame. The conveying mechanism includes a first conveyor belt and a second conveyor belt. The first conveyor belt and the second conveyor belt are located on the same horizontal plane and are parallel to each other. The silicon wafer is placed on the upper parts of the first conveyor belt and the second conveyor belt for conveying. The mounting frame is horizontally located below the conveying mechanism. A limiting groove is opened in the part of the mounting frame located below the conveying mechanism. A strip-shaped plate is vertically slidably connected in the limiting groove. A lifting mechanism is installed in the limiting groove for driving the strip-shaped plate to lift and lower.

[0005] A lifting table is horizontally installed at the top of the strip-shaped plate. The lifting table is perpendicular to the conveying mechanism. A groove is horizontally opened on the top side of the lifting table. The groove divides the lifting table into part A and part B. When the lifting table rises, the first conveyor belt is located in the groove. Part A is outside the conveyor belt, and part B is between the first conveyor belt and the second conveyor belt. A through groove is longitudinally opened in the middle of the front side of part A of the lifting table. A limiting block is fixedly connected to the top of the end of part A of the lifting table away from the conveying mechanism. A slope is provided on the top side of the lifting table, gradually sloping downward from part B to part A.

[0006] A mounting base is installed on the mounting frame. A rotating pipe is rotatably connected to the base. A suction cup is installed at the end of the rotating pipe. The axis of the rotating shaft of the rotating pipe is parallel to the conveying mechanism. When the rotating pipe rotates towards the conveying mechanism, the rotating pipe is located between the through grooves of the lifting table. At this time, the suction cup opens upward and is located below the upper surface of part A of the lifting table. A motor and an air pump are installed on the base. The motor is used to drive the rotation of the rotating pipe. The air pump is communicated with the rotating pipe.

[0007] Preferably, the lifting mechanism includes a toothed roller and a motor. The motor is used to drive the rotation of the toothed roller. A toothed rail is installed on one side of the strip-shaped plate. The toothed roller meshes with the toothed rail.

[0008] Preferably, a rubber pad is installed on the surface of the limiting block close to the conveying mechanism.

[0009] Preferably, the included angle between the upper surface of part A of the lifting table and the horizontal plane is between 10° and 20°.

[0010] Preferably, a plurality of rollers are installed on the top side of the lifting table.

[0011] Preferably, the axis of the rotating shaft of the rotating pipe divides the base into part C away from the conveying mechanism and part D close to the conveying mechanism. The upper surface of part C is a horizontal plane. The upper surface of part D is an inclined plane. The plane where the upper surface of part D is located is parallel to the plane where the upper surface of the lifting table is located. When the rotating pipe rotates above part C, the rotating pipe is horizontal and the suction cup opens downward. When the rotating pipe rotates above part D, the rotating pipe is inclined and located between the through grooves of part A of the lifting table and the suction cup opens upward.

[0012] Preferably, a plurality of groups of guide rods are vertically installed on the bottom side of part A of the lifting table. Each group of guide rods is slidably connected to the mounting frame.

[0013] In the present invention, for a silicon wafer screen printing unloading device proposed, during the conveying process of the silicon wafer, the silicon wafer is placed above the first conveyor belt and the second conveyor belt. When the lifting table rises, part B is located between the first conveyor belt and the second conveyor belt. The part of part B protruding from the first conveyor belt and the second conveyor belt can lift the silicon wafer, so that the silicon wafer is separated from the first conveyor belt and the second conveyor belt. Since the top side of the lifting table is inclined, the silicon wafer will slide down along the inclined slope and slide to part A of the lifting table until it slides to the limiting block and stops sliding, completing the process of separating the silicon wafer from the conveying mechanism and transferring it to the upper side of part A of the lifting table.

[0014] When the silicon wafer is transferred from the conveying mechanism to the upper side of the A part of the lifting table, the motor drives the rotating pipe to rotate. When the rotating pipe is located in the through groove of the lifting table, at this time, the air pump makes the suction cup generate suction through the rotating pipe, and fixes the silicon wafer to the suction cup.

[0015] The motor drives the rotating pipe to rotate, so that the rotating pipe rotates from the D part to the C part. At this time, the suction cup faces downwards, and the air pump adjusts the air pressure in the rotating pipe to separate the silicon wafer from the suction cup, and places the silicon wafer into the collection device to complete the unloading. At this time, the lifting table descends, the rotating pipe flips, and the above operations are cycled. The present invention can realize automatic unloading and improve the unloading efficiency.

[0016] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Brief Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the present invention;

[0018] Figure 2 It is a schematic structural diagram of the unloading structure of the present invention;

[0019] Figure 3 It is a schematic structural diagram of the lifting table in the present invention;

[0020] Figure 4 It is a schematic structural diagram of the base in the present invention;

[0021] Explanation of the reference numerals in the figure: 1. Mounting frame; 101. Limit groove; 102. Tooth roller; 2. Strip-shaped plate; 201. Tooth rail; 3. Lifting table; 301. Groove; 302. Roller; 303. Through groove; 304. Limit block; 305. Guide rod; 4. Base; 401. Rotating pipe; 402. Suction cup; 403. Motor; 404. Air pump; 5. Conveying mechanism; 501. First conveyor belt; 502. Second conveyor belt. Detailed Embodiment

[0022] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar symbols represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as limiting the present invention.

[0023] As Figures 1 - 4A silicon wafer screen printing unloading device shown in the figure includes a conveying mechanism 5 and a mounting frame 1. The conveying mechanism 5 includes a first conveyor belt 501 and a second conveyor belt 502. The first conveyor belt 501 and the second conveyor belt 502 are located on the same horizontal plane and are parallel to each other. The silicon wafer is placed on the upper parts of the first conveyor belt 501 and the second conveyor belt 502 for conveying. The mounting frame 1 is horizontally located below the conveying mechanism 5. A limiting groove 101 is opened in the part of the mounting frame 1 located below the conveying mechanism 5. A strip-shaped plate 2 is vertically slidably connected in the limiting groove 101. A lifting mechanism is installed in the limiting groove 101 for driving the strip-shaped plate 2 to lift and lower.

[0024] The mounting frame 1 has a part located below the conveying mechanism 5. The limiting groove 101 opened in this part can facilitate the positioning of the lifting and moving of the strip-shaped plate 2.

[0025] A lifting table 3 is horizontally installed at the top of the strip-shaped plate 2. The lifting table 3 is perpendicular to the conveying mechanism 5. A groove 301 is horizontally opened on the top side of the lifting table 3. The groove 301 divides the lifting table 3 into part A and part B. When the lifting table 3 rises, the first conveyor belt 501 is located in the groove 301. Part A is outside the conveyor belt, and part B is between the first conveyor belt 501 and the second conveyor belt 502. A through groove 303 is longitudinally opened in the middle of the front side of part A of the lifting table 3. A limiting block 304 is fixedly connected to the top of the end of part A of the lifting table 3 away from the conveying mechanism 5. A slope is provided on the top side of the lifting table 3, which gradually slopes downward from part B to part A.

[0026] During the conveying of the silicon wafer, the silicon wafer is placed on the upper parts of the first conveyor belt 501 and the second conveyor belt 502. When the lifting table 3 rises, part B is between the first conveyor belt 501 and the second conveyor belt 502. The part of part B protruding from the first conveyor belt 501 and the second conveyor belt 502 can lift the silicon wafer, so that the silicon wafer is separated from the first conveyor belt 501 and the second conveyor belt 502. Due to the inclined setting of the top side of the lifting table 3, the silicon wafer will slide down along the inclined slope and slide to part A of the lifting table 3 until it slides to the limiting block 304 and stops sliding, completing the process of separating the silicon wafer from the conveying mechanism 5 and transferring it to the upper side of part A of the lifting table 3.

[0027] A mounting base 4 is installed on the mounting frame 1. A rotating tube 401 is rotatably connected to the mounting base 4. A suction cup 402 is installed at the end of the rotating tube 401. The axis of the rotating shaft of the rotating tube 401 is parallel to the conveying mechanism 5. When the rotating tube 401 rotates towards the conveying mechanism 5, the rotating tube 401 is located between the through grooves 303 of the lifting table 3. At this time, the suction cup 402 opens upward and is located below the upper surface of part A of the lifting table 3. A motor 403 and an air pump 404 are installed on the mounting base 4. The motor 403 is used to drive the rotating tube 401 to rotate. The air pump 404 is communicated with the rotating tube 401.

[0028] When the silicon wafer is transferred from the conveying mechanism 5 and moves above the A part of the lifting table 3, the motor 403 drives the rotating tube 401 to rotate. When the rotating tube 401 is located in the through groove 303 of the lifting table 3, at this time, the air pump 404 generates suction through the rotating tube 401 to fix the silicon wafer to the suction cup 402.

[0029] The motor 403 drives the rotating tube 401 to rotate, so that the rotating tube 401 rotates from the D part to the C part. At this time, the suction cup 402 faces downward, and the air pump 404 adjusts the air pressure in the rotating tube 401 to separate the silicon wafer from the suction cup 402, and places the silicon wafer in the collection device to complete the unloading. At this time, the lifting table 3 descends, the rotating tube 401 flips, and the above operations are cycled. The present invention can realize automatic unloading and enhance the unloading efficiency.

[0030] Preferably, the lifting mechanism includes a toothed roller 102 and a motor 403. The motor 403 drives the toothed roller 102 to rotate. A toothed rail 201 is installed on one side of the strip plate 2, and the toothed roller 102 meshes with the toothed rail 201.

[0031] The motor 403 drives the toothed roller 102 to rotate, and controls the lifting of the strip plate 2 through meshing with the toothed rail 201, thereby controlling the lifting of the lifting table 3.

[0032] Preferably, a rubber pad is installed on the surface of the limiting block 304 close to the conveying mechanism 5, which can play a buffering role when the silicon wafer slides from the B part to the A part of the lifting table 3.

[0033] Preferably, the included angle between the upper surface of the A part of the lifting table 3 and the horizontal plane is between 10° and 20°. The inclination angle enables the silicon wafer to slide the lifting table 3 from the B part to the A part, and the impact force is minimized when the silicon wafer contacts the limiting block 304, thereby protecting the silicon wafer.

[0034] Preferably, a plurality of rollers 302 are installed on the top side of the lifting table 3, which can prevent the lower surface of the silicon wafer from being scratched and can reduce the frictional resistance between the silicon wafer and the lifting table 3.

[0035] Preferably, the axis of the rotating shaft of the rotating tube 401 divides the base 4 into a C part far from the conveying mechanism 5 and a D part close to the conveying mechanism 5. The upper surface of the C part is a horizontal plane, the upper surface of the D part is an inclined plane, and the plane where the upper surface of the D part is located is parallel to the plane where the upper surface of the lifting table 3 is located. When the rotating tube 401 rotates above the C part, the rotating tube 401 is horizontal and the opening of the suction cup 402 faces downward. When the rotating tube 401 rotates above the D part, the rotating tube 401 is inclined between the through grooves 303 of the A part of the lifting table 3 and the opening of the suction cup 402 faces upward.

[0036] When the silicon wafer slides from the B part of the lifting table 3 to the A part, the inclined surface of the D part can rotate the inclined angle of the pipe 401 to be exactly parallel to the inclined angle of the upper surface of the A part of the lifting table 3, so that the suction cup 402 can be located on the lower side of the silicon wafer, and the suction cup 402 can suck the silicon wafer.

[0037] Preferably, a plurality of groups of guide rods 305 are vertically installed on the bottom side of the A part of the lifting table 3, and each group of guide rods 305 is slidably connected to the mounting frame 1, which can ensure the stable movement of the lifting table 3 in the vertical direction.

[0038] It should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communicable with each other; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified or limited, a first feature being "on" or "under" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediate medium. Further, a first feature being "above", "over" and "on top of" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. A first feature being "under", "below" and "beneath" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is less than that of the second feature.

[0042] As mentioned above, the above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes should be covered by the protection scope of the present invention.

Claims

1. A silicon wafer screen printing unloading device, comprising a conveying mechanism (5) and a mounting frame (1), wherein the conveying mechanism (5) comprises a first conveying belt (501) and a second conveying belt (502), wherein the first conveying belt (501) and the second conveying belt (502) are located in the same horizontal plane and are parallel to each other, and the silicon wafer is placed on the first conveying belt (501) and the second conveying belt (502) to be transported; characterized in that: The mounting frame (1) is horizontally located below the conveying mechanism (5); a limiting groove (101) is provided on the portion of the mounting frame (1) located below the conveying mechanism (5); a strip plate (2) is vertically slidably connected in the limiting groove (101); a lifting mechanism is installed in the limiting groove (101) for driving the strip plate (2) to move up and down; A lifting platform (3) is horizontally installed on the top of the strip plate (2), and the lifting platform (3) is perpendicular to the conveying mechanism (5). A groove (301) is transversely opened on the top side of the lifting platform (3), and the groove (301) divides the lifting platform (3) into a part A and a part B. When the lifting platform (3) rises, the first conveyor belt (501) is located in the groove (301), the part A is located outside the conveyor belt, and the part B is located between the first conveyor belt (501) and the second conveyor belt (502). A through groove (303) is longitudinally opened in the middle of the front side of the part A. The top of the part A of the lifting platform (3) away from the conveying mechanism (5) is fixedly connected to a limiting block (304), and the top side of the lifting platform (3) is provided with a slope, which gradually slopes downward from the part B to the part A. A base (4) is installed on the mounting frame (1), and a rotating tube (401) is rotatably connected to the base (4). A suction cup (402) is installed at the end of the rotating tube (401), and the axis of the rotating shaft of the rotating tube (401) is parallel to the conveying mechanism (5). When the rotating tube (401) rotates toward the conveying mechanism (5), the rotating tube (401) is located between the through grooves (303) of the lifting platform (3). At this time, the suction cup (402) opens upward and is located below the upper surface of the A part of the lifting platform (3). A motor (403) and an air pump (404) are installed on the base (4), and the motor (403) is used to drive the rotating tube (401) to rotate, and the air pump (404) is connected to the rotating tube (401).

2. A silicon wafer screen printing unloading device according to claim 1, characterized in that: The lifting mechanism comprises a gear roller (102) and a motor (403), wherein the motor (403) is used to drive the gear roller (102) to rotate, a gear rail (201) is installed on one side of the strip plate (2), and the gear roller (102) and the gear rail (201) are meshed with each other.

3. The silicon wafer screen printing unloading device according to claim 1, characterized in that: A rubber pad is installed on one side of the limit block (304) close to the conveying mechanism (5).

4. The silicon wafer screen printing unloading device according to claim 1, characterized in that: The angle between the upper surface of the A part of the lifting platform (3) and the horizontal plane is between 10° and 20°.

5. The silicon wafer screen printing unloading device according to claim 1, characterized in that: A plurality of rollers (302) are installed on the top side of the lifting platform (3).

6. The silicon wafer screen printing unloading device according to claim 1, characterized in that: The axis of the rotating shaft of the rotating tube (401) divides the base (4) into a C portion away from the conveying mechanism (5) and a D portion close to the conveying mechanism (5); the upper surface of the C portion is a horizontal plane, and the upper surface of the D portion is an inclined plane; the plane where the upper surface of the D portion is located is parallel to the plane where the upper surface of the lifting platform (3) is located; when the rotating tube (401) rotates to above the C portion, the rotating tube (401) is horizontal and the opening of the suction cup (402) is downward; when the rotating tube (401) rotates to above the D portion, the rotating tube (401) is inclined and located between the through grooves (303) of the A portion of the lifting platform (3) and the opening of the suction cup (402) is upward.

7. The silicon wafer screen printing unloading device according to claim 1, characterized in that: A plurality of groups of guide rods (305) are vertically mounted on the bottom side of the A portion of the lifting platform (3), and each group of guide rods (305) is slidably connected to the mounting frame (1).

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