Vertical wafer cleaning device

Abstract

The embodiment of the present application provides a vertical wafer cleaning device, comprising: a box body, a processing chamber is provided in the box body, and a drain outlet is provided on the bottom plate of the box body; a drain net, the drain net is arranged at the drain outlet; a chuck, the chuck is arranged in the processing chamber to vertically clamp the wafer, and the plane where the chuck is located is parallel to the vertical plane; an anti-splash device, located above the drain outlet and covering the drain outlet, the anti-splash device includes two fixed blocks, which are detachably arranged in the box body, and at least one guide plate, which is arranged between the two fixed blocks, the projection of the wafer clamping position on the vertical plane is located in the projection area of ​​the guide plate on the vertical plane, and there is a first angle between the plane where the guide plate is located and the vertical plane, so as to catch and guide the droplets dripping from the wafer to the drain outlet; a maintenance door is arranged on the side wall of the box body opposite to the anti-splash device, which is used to maintain the anti-splash device. The embodiment of the present application provides a vertical wafer cleaning device, which can effectively prevent the residual liquid on the surface of the wafer from dripping and sticking back to the surface of the wafer.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of wafer cleaning technology, and in particular to a vertical wafer cleaning device. Background Art

[0002] Currently, wafer cleaning can be performed by a vertical wafer post-processing device, namely a vertical wafer cleaning device. A processing chamber is provided in the box of the vertical wafer cleaning device.

[0003] The wafer cleaning is done by the robot holding the wafer and before it enters the processing chamber, the wafer is directly above the processing chamber. Then the robot drives the wafer to move downward synchronously to transport the wafer to the processing station in the processing chamber of the vertical wafer cleaning device, and the wafer can then be fixed by the chuck and other wafer clamping mechanisms in the processing chamber. After the position of the wafer is fixed, the robot releases the wafer and leaves the processing chamber, and then the process components in the processing chamber process the wafer. After the process is completed, the wafer is taken away by the robot and leaves the processing chamber.

[0004] However, there may be residual liquid on the wafer surface from the previous processing device. Due to gravity, the liquid will gather along the wafer surface to the bottom of the wafer and drip onto the bottom plate of the vertical wafer post-processing device box. After the wafer is processed, liquid may remain on the wafer surface during the process of being taken out of the processing chamber by the robot. The liquid will also drip onto the bottom plate of the vertical wafer post-processing device box. After the liquid drips, it is easy to splash a large number of small droplets, and the direction of the splashing small droplets is random, which will cause pollution to the environment inside the box and reduce the wafer cleaning effect. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a vertical wafer cleaning device, which can effectively prevent residual liquid on the surface of the wafer from dripping and contaminating the environment inside the chamber such as the chuck, and then sticking back to the surface of the wafer.

[0006] According to the first aspect of the present application, a vertical wafer cleaning device is provided, comprising: a box body, wherein a processing chamber is provided in the box body, and a drain outlet is provided on the bottom plate of the box body; a drain net, wherein the drain net is arranged at the drain outlet; a chuck, wherein the chuck is arranged in the processing chamber to vertically clamp the wafer, and the plane where the chuck is located is parallel to the vertical plane; an anti-splash device, which is located above the drain outlet and covers the drain outlet, and the anti-splash device comprises two fixed blocks, which are detachably arranged in the box body, and at least one guide plate, which is arranged between the two fixed blocks, and the projection of the wafer clamping position on the vertical plane is located within the projection area of ​​the guide plate on the vertical plane, and the plane where the guide plate is located has a first angle with the vertical plane to catch and guide the droplets dripping from the wafer to the drain outlet; a maintenance door is provided on the side wall of the box body opposite to the anti-splash device for maintaining the anti-splash device.

[0007] Optionally, the upper end face of the guide plate is parallel to the vertical plane, the lower end face of the guide plate is parallel to the horizontal plane, and the projection of the lower end face of the guide plate on the vertical plane is located within the projection area of ​​the fixed block on the vertical plane.

[0008] Optionally, the fixing block is detachably arranged in the box body through a horizontally arranged sliding groove.

[0009] Optionally, the anti-splash device includes a plurality of guide plates, and the plurality of guide plates are all arranged between the two fixed blocks. The plurality of guide plates are parallel to each other, and the end surfaces of the lower portions of the plurality of guide plates are all located in the same plane.

[0010] Optionally, a rotating shaft is provided at the vertical center position of the guide plate, and the guide plate is rotatably set on the fixed block via the rotating shaft; multiple guide plates are connected in series via a horizontally arranged cross bar, and the cross bar is arranged in the accommodating cavity of the fixed block so that the inclination angle of the guide plate can be adjusted via the cross bar.

[0011] Optionally, the anti-splash device includes a door panel adapted to the maintenance door, the door panel is fixedly connected to the fixed block, the door panel includes a locking piece arranged in a guide hole, the locking piece has a locking position engaged with the cross bar and an open position away from the cross bar; the side wall of the maintenance door is provided with a locking buckle corresponding to the position of the locking piece, which is used to fix the locking piece in the locking position to lock the fixed block and the cross bar.

[0012] Optionally, the first angle is between 10° and 45°.

[0013] Optionally, the first angle is between 20° and 35°.

[0014] Optionally, the parallel spacing between two adjacent guide plates is between 3 mm and 20 mm.

[0015] Optionally, the projections of two adjacent guide plates on the horizontal plane at least partially overlap, and the width of the overlapping projection area is greater than or equal to 1 mm.

[0016] The vertical wafer cleaning device provided in the embodiment of the present application has the following beneficial effects:

[0017] 1. The anti-splash device is located above the drain outlet of the bottom plate of the vertical wafer cleaning device and has at least one guide plate, which can make the liquid droplets fall on the guide plate of the anti-splash device, and try to avoid the liquid from directly dripping on the bottom plate of the vertical wafer cleaning device and causing back splashing.

[0018] 2. There is a first angle between the plane where the guide plate is located and the vertical plane, that is, the guide plate is inclined, so that when the liquid drips onto the guide plate, the guide plate can catch the droplets and prevent splashing, thereby avoiding splashing onto the chuck and other structures. In addition, the liquid can be guided to the drain port through the guide plate to avoid polluting the environment in the processing chamber.

[0019] 3. After the wafer is cleaned in the processing chamber of the vertical wafer cleaning device, liquid will remain on the surface of the wafer. The residual liquid on the surface of the wafer can also drip onto the anti-splash device. Therefore, the anti-splash device can also prevent the droplets dripping after the wafer is cleaned from splashing onto structures such as the chuck.

[0020] 4. The anti-splash device is in contact with liquid for a long time, which is prone to corrosion or accumulation of pollutants. A maintenance door is provided on the side wall of the box facing the anti-splash device to facilitate maintenance and replacement of the anti-splash device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a cross-sectional schematic diagram of a vertical wafer cleaning device;

[0023] Figure 2 is a cross-sectional schematic diagram of a vertical wafer cleaning device according to the present application;

[0024] Figure 3 is a cross-sectional view of an embodiment of the anti-splash device according to the present application;

[0025] Figure 4 is a cross-sectional view of another embodiment of the liquid splash prevention device according to the present application;

[0026] Figure 5 It is a schematic diagram of the locking cross bar and the fixing block according to the present application.

[0027] Description of reference numerals:

[0028] Wafer vertical cleaning device 1000;

[0029] Anti-splash device 100; fixed block 10; accommodating chamber 11; guide plate 20; door plate 30; locking member 31; cross bar 40;

[0030] Box body 200; processing chamber 210; bottom plate 220; drain port 230; maintenance door 240;

[0031] Drainage net 300; chuck 400; chuck motor 500;

[0032] Retaining ring 600; Robotic arm 700. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0034] As mentioned above, wafer cleaning can currently be done by vertical wafer post-processing equipment, such as Figure 1 The vertical wafer cleaning device 1000 shown in the figure is used for cleaning. The housing 200 of the vertical wafer cleaning device 1000 has a processing chamber 210 therein.

[0035] The wafer cleaning is performed by the robot holding the wafer and entering the processing chamber 210, and the wafer is directly above the processing chamber 210. Then the robot drives the wafer to move downward synchronously to transport the wafer to the processing station in the processing chamber 210 of the vertical wafer cleaning device 1000, and the wafer can then be fixed by the chuck 400 and other wafer clamping mechanisms in the processing chamber 210. After the position of the wafer is fixed, the robot releases the wafer and leaves the processing chamber 210, and then the process components in the processing chamber 210 perform process processing on the wafer. After the process processing is completed, the wafer is taken away by the robot and leaves the processing chamber 210.

[0036] However, there may be residual liquid on the wafer surface from the previous processing device. Figure 1 and Figure 2 The W in the figure represents the wafer. Due to gravity, the liquid will gather along the surface of the wafer to the bottom of the wafer and drip onto the bottom plate 220 of the vertical wafer post-processing device box 200; after the wafer is processed, liquid may remain on the surface of the wafer when it is taken away from the processing chamber 210 by the robot, and the liquid will also drip onto the bottom plate 220 of the vertical wafer post-processing device box 200. After the liquid drips, a large number of small droplets are easily splashed, and the direction of the splashing small droplets is random, which will cause pollution to the environment in the box 200, thereby reducing the wafer cleaning effect.

[0037] Therefore, the present invention proposes a vertical wafer cleaning device 1000. Figure 2As shown, it includes a box body 200, a drainage net 300, a chuck 400, a chuck motor 500, a splash-proof device 100, a retaining ring 600 and a robot arm 700. The box body 200 has a processing chamber 210, and the bottom plate 220 of the box body 200 is provided with a drainage port 230, and the drainage port 230 can make the liquid remaining on the wafer drip to the bottom of the processing chamber 210 and then be discharged through the drainage port 230. The drainage net 300 is set to the drainage port 230. The residual particulate matter in the waste liquid after the wafer is cleaned can be filtered through the drainage net 300. The chuck 400 is set to the processing chamber 210 to vertically clamp the wafer, and the plane where the chuck 400 is located is parallel to the vertical plane. The chuck motor 500 is set to the outer wall of the box body 200, and the output shaft of the chuck motor 500 extends through the wall of the box body 200 toward the processing chamber 210 to connect with the chuck 400 and drive the chuck 400 to rotate along the rotation axis of the output shaft of the chuck motor 500. The rotation axis of the output shaft of the chuck motor 500 is perpendicular to the vertical plane.

[0038] A splash-proof device 100 is provided at the bottom of the processing chamber 210 inside the vertical wafer cleaning device 1000. Therefore, when liquid drips on the wafer, it can be prevented from dripping directly onto the bottom plate 220 of the processing chamber 210 of the vertical wafer cleaning device 1000, but can drip onto the splash-proof device 100, and the splash-proof device 100 can prevent the splashed liquid droplets from sticking back to the wafer after the liquid drips. A maintenance door 240 is provided on the side wall of the box body opposite to the splash-proof device 100 for maintaining the splash-proof device.

[0039] Below is the instruction manual attached Figure 3-Figure 5 The anti-splash device 100 of the present application is described in detail. Figure 3-Figure 5 As shown, according to the splash-proof device 100 of the present invention, the splash-proof device 100 is located above the drain port 230 of the bottom plate 220 of the vertical wafer cleaning device 1000 and covers the drain port 230. The vertical wafer cleaning device 1000 is used to vertically clean the wafer. The splash-proof device 100 covers the drain port 230, so that the droplets dripping on the wafer can be guided to the drain port 230 through the splash-proof device 100 to be discharged. It is prevented that the droplets of liquid splashing are contaminated on other structures in the vertical wafer cleaning device 1000.

[0040] like Figure 3 and Figure 4As shown, the anti-splash device 100 includes two fixed blocks 10 and at least one guide plate 20. The projection of the wafer clamping position on the vertical plane is located within the projection area of ​​the guide plate on the vertical plane, which can make the liquid droplets fall on the guide plate 20 of the anti-splash device 100, and prevent the liquid from directly dripping on the bottom plate 220 of the wafer vertical cleaning device 1000. The two fixed blocks 10 are detachably arranged in the box body 200. When the anti-splash device 100 is maintained through the maintenance door 240, the fixed blocks 10 can be removed and the anti-splash device 100 can be taken out of the box body. The anti-splash device 100 is in contact with liquid for a long time, which is prone to corrosion or accumulation of pollutants. The side wall of the box body is provided with a maintenance door 240 at a position opposite to the anti-splash device 100, which is convenient for maintenance and replacement of the anti-splash device 100.

[0041] The two fixing blocks 10 can be used to fix the guide plate 20. Specifically, the two fixing blocks 10 are parallel to each other. Figure 3 and Figure 4 As shown, at least one guide plate 20 is arranged between the two fixed blocks 10, and is vertically connected to the inner wall surfaces of the two fixed blocks 10. Therefore, the guide plate 20 is perpendicular to both fixed blocks 10 at the same time, that is, the plane where the guide plate 20 is located can form a variety of angles with the horizontal plane, and the end faces of the two ends of the guide plate 20 in the left and right directions are respectively vertically connected to the two fixed blocks 10. It should be noted here that the horizontal plane in this article is a plane perpendicular to the direction of gravity in physics and daily life. The vertical plane mentioned in this article is a plane perpendicular to the horizontal plane.

[0042] Herein, at least one means that the number of guide plates 20 is one or more, which can be one or more, for example, two or more.

[0043] Furthermore, if Figure 3 and Figure 4 As shown, there is a first angle between the plane where the guide plate 20 is located and the vertical plane, so as to catch and guide the droplets dripping from the wafer to the drain port 230. The vertical plane can be as follows Figure 3 The first angle can be as shown by the line L1 in FIG. Figure 3As shown by the angle Z in . The plane where the guide plate 20 is located has a first angle with the vertical plane, that is, the guide plate 20 is inclined, so that when the liquid drips onto the guide plate 20, the contact surface between the liquid and the guide plate 20 has an inclined angle. Compared with the form in which the liquid directly drips onto the bottom plate 220 of the box 200 at an angle of 90°, the guide plate 20 having a first angle with the vertical plane can guide the droplets dripping from the wafer to hit the surface of the guide plate 20 at an angle closer to tangent, and catch the droplets, thereby preventing sputtering caused by a nearly vertical impact angle and avoiding contamination of the environment in the processing chamber 210. The droplets can pass through the gaps between the guide plates 20 and flow to the drain port 230 for drainage, thereby ensuring that liquid will not accumulate in the anti-splash device, so that it can continue to play the anti-splash function.

[0044] The droplets will no longer splash back to the chuck 400 and other locations, and will not pollute the environment within the processing chamber 210, thereby preventing the wafer from being placed on the chuck 400 and being contaminated by liquid droplets splashed on the chuck 400. The movement of the chuck will cause the pollutants in the droplets to float into the air and stick back to the wafer, thereby polluting the surface of the wafer and reducing the wafer cleaning effect.

[0045] Correspondingly, as mentioned above, after the wafer is cleaned in the processing chamber 210 of the vertical wafer cleaning device 1000, liquid will remain on the surface of the wafer. The residual liquid on the surface of the wafer can also drip onto the anti-splash device 100. Therefore, the anti-splash device 100 can also prevent the droplets dripping after the wafer is cleaned from splashing onto structures such as the chuck 400.

[0046] According to the wafer vertical cleaning device 1000 of the present invention, a splash-proof device 100 is provided in the chamber, which is located above the drain outlet 230 of the bottom plate 220 of the wafer vertical cleaning device 1000 and has at least one guide plate 20, so that liquid droplets can fall on the guide plate 20 of the splash-proof device 100, and liquid can be prevented from directly falling on the bottom plate 220 of the wafer vertical cleaning device 1000 and causing back-splashing. There is a first angle between the plane where the guide plate 20 is located and the vertical plane, that is, the guide plate 20 is arranged to be inclined, so that when liquid drips onto the guide plate 20, the guide plate 20 can guide the droplets dripping from the wafer to hit the surface of the guide plate 20 at an angle that is closer to a tangent, and catch the droplets, thereby preventing sputtering caused by a nearly vertical impact angle and avoiding contamination of the environment in the processing chamber 210. The droplets can pass through the gaps between the guide plates 20 and flow to the drain port 230 for discharge, thereby ensuring that liquid will not accumulate in the splash-proof device, so that it can continue to perform the splash-proof function; the splash-proof device can be easily maintained and replaced through the maintenance door 240, thereby ensuring the splash-proof effect.

[0047] The droplets will no longer splash back to the chuck 400 and other locations, and will not pollute the environment within the processing chamber 210, thereby preventing the wafer from being placed on the chuck 400 and being contaminated by liquid droplets splashed on the chuck 400. The movement of the chuck will cause the pollutants in the droplets to float into the air and stick back to the wafer, thereby polluting the surface of the wafer and reducing the wafer cleaning effect.

[0048] Correspondingly, as mentioned above, after the wafer is cleaned in the processing chamber 210 of the vertical wafer cleaning device 1000, liquid will remain on the surface of the wafer. The residual liquid on the surface of the wafer can also drip onto the anti-splash device 100. Therefore, the anti-splash device 100 can also prevent the droplets dripping after the wafer is cleaned from splashing onto structures such as the chuck 400.

[0049] like Figure 3 and Figure 4 As shown, the upper portion of the guide plate 20 extends toward the direction of the chuck 400, and the upper end surface of the guide plate 20 is parallel to the plane where the chuck 400 is located. Specifically, the plane where the chuck 400 is located is a vertical plane, the upper end surface of the guide plate 20 is located on the vertical plane, and the vertical planes where the two are located are parallel, so the droplets dripping from the wafer can be splashed by the splash-proof device 100. Prevent the liquid from splashing onto the surface of the chuck 400.

[0050] In some embodiments of the present invention, Figure 3 As shown, the upper portion of the guide plate 20 extends in a direction away from the chuck 400, and the end surface of the upper portion of the guide plate 20 is parallel to the plane where the chuck 400 is located. Figure 3 As shown, the direction in which the guide plate 20 extends deviates from the position of the chuck 400. Thus, the liquid droplets dripping from the wafer can still be prevented from sputtering by the anti-sputtering device 100.

[0051] The present invention is not limited to this, and relative to the two aforementioned orientations of the guide plate 20, the orientation of the guide plate 20 relative to the vertical plane can also be set to other inclined directions, according to the design requirements in the actual use process, while ensuring that the droplets dripping from the wafer can stably drip on the anti-splash device 100.

[0052] In some embodiments of the present invention, Figure 2As shown, the projection of the guide plate 20 of the anti-splash device 100 in the horizontal plane at least partially overlaps with the projection of the wafer clamped by the robot. That is, there is a height difference between the wafer clamped by the robot and the guide plate 20 in the height direction, and the wafer and the guide plate 20 partially overlap in the horizontal position. As a result, when the chuck 400 clamps the wafer, or when the wafer is located inside the processing chamber 210, the droplets dripping from the wafer can be received by the anti-splash device 100, and the liquid cannot drip directly on the bottom plate 220 of the processing chamber 210. Thereby, the anti-splash effect of the anti-splash device 100 is guaranteed.

[0053] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the end face of the upper part of the guide plate 20 is parallel to the vertical plane, and the end face of the lower part of the guide plate 20 is parallel to the horizontal plane. It should be noted here that the definition of the upper part and the lower part of the guide plate 20 in the text is that the side of the guide plate 20 facing upward is its upper part, and the side of the guide plate 20 facing downward is its lower part. In the anti-splash device 100 of the embodiment of the present invention, the guide plate 20 has a thickness, and the end of its upper part has an end face, and the end of its lower part also has an end face. And the end face of its upper part is parallel to the vertical plane.

[0054] Therefore, it can be understood that the upper end surface of the guide plate 20 is a vertical surface. Therefore, when the liquid drips on the wafer, if the position of the liquid dripping corresponds to the upper end surface of the guide plate 20, the liquid can drip onto the upward surface of the guide plate 20 at a closer tangent angle, or drip onto the upper end surface of the guide plate 20, thereby preventing splashing.

[0055] like Figure 3 and Figure 4 As shown, the projection of the lower end face of the guide plate 20 on the vertical plane is located within the projection area of ​​the fixed block 10 on the vertical plane. That is, the position of the lower part of the guide plate 20 does not exceed the lower edge of the fixed block 10. In addition, the lower end face of the guide plate 20 is also within the coverage area of ​​the vertical plane of the fixed block 10 and does not exceed the lower edge of the fixed block 10. Therefore, the overall structure of the anti-splash device 100 is supported by two fixed blocks 10, which can better ensure the stability of the anti-splash device 100 when in use.

[0056] The fixing block is detachably arranged in the box body through a horizontally arranged slide groove. When maintenance is performed through the maintenance door 240, the fixing block 10 and the guide plate 20 can be removed as a whole for maintenance.

[0057] In some embodiments of the present invention, Figure 3 and Figure 4As shown, the anti-splash device 100 includes a plurality of guide plates 20, which are all arranged between two fixed blocks 10, the plurality of guide plates 20 are parallel to each other, and the lower end surfaces of the plurality of guide plates 20 are all located in the same plane.

[0058] Specifically, the lower end surfaces of the plurality of guide plates 20 are located in the same plane, so the plurality of guide plates 20 are arranged at the same height. The plurality of guide plates 20 enable the anti-splash device 100 to perform anti-splash treatment on the liquid in a larger area. At the same time, the plurality of guide plates 20 are parallel to each other, so that when the liquid drips, it can stably drip on the upward surface of the guide plate 20 or the upper end surface of the guide plate 20, thereby improving the anti-splash effect.

[0059] See also Figure 4 A rotating shaft is provided at the vertical center position of the guide plate 20, and the guide plate 20 is rotatably arranged on the fixed block 10 through the rotating shaft; a plurality of guide plates 20 are connected in series through a horizontally arranged cross bar 40, and the cross bar 40 is arranged in the accommodating cavity 11 of the fixed block 10, so that the inclination angle of the guide plate 20 can be adjusted through the cross bar 40. By adjusting the inclination angle of the guide plate 20, the angle or overlap of the guide plate 20 can be adjusted according to the splashing direction of the liquid in the chamber, so as to achieve a better splash-proof effect.

[0060] Specifically, the anti-splash device 100 includes a door panel 30 adapted to the maintenance door 240, the door panel 30 is fixedly connected to the fixed block 10, and the door panel 30 includes a locking piece 31 arranged in a guide hole, the locking piece 31 has a locking position engaged with the cross bar 40 and an open position away from the cross bar 40; the side wall of the maintenance door 240 is provided with a locking buckle corresponding to the position of the locking piece 31, which is used to fix the locking piece 31 in the locking position to lock the fixed block 10 and the cross bar 40.

[0061] The locking member 31 may be movable or rotatable, both of which are within the protection scope of the present application. Figure 5 The mobile type is used as an example for explanation.

[0062] If the locking member 31 is a movable locking member 31, the guide hole can be a long strip guide hole parallel to the guide plate 20, and the end of the long strip guide hole of the locking member 31 away from the fixed block 10 is in the open position, and the end close to the fixed block 10 is in the locked position. Figure 5 As shown by the arrow in FIG. 1 , when in the locking position, the locking member 31 is engaged with the cross bar 40 and can be fixed by the locking buckle.

[0063] If the locking member 31 is a rotary locking member 31, the guide hole can be arc-shaped. The locking member 31 is in an open position at the end of the arc-shaped guide hole away from the fixed block 10, and is in a locked position after rotating to the end close to the fixed block 10. When in the locked position, the locking member 31 and the cross bar 40 can be limited by the card slot, and the locking member 31 can be fixed by the locking buckle.

[0064] In addition, while the locking member 31 is in limiting contact or clamped with the cross bar 40, it also passes through the fixed block 10 and is connected to the side wall of the box body. Therefore, the fixing block 10 and the cross bar 40 can be limited by the locking member 31 at the same time, which has a simple structure and is easy to operate.

[0065] In some embodiments of the present invention, Figure 3 , Figure 4 As shown, the angle of the first angle is between 10° and 45°. Specifically, the plurality of guide plates 20 are parallel to each other, and the first angle between each guide plate 20 and the vertical plane is between 10° and 45°, so that the projections of the plurality of guide plates 20 on the horizontal plane can partially overlap, so that the dripping droplets can drip on the upward surface of the guide plate 20 or the end surface of the upper part of the guide plate 20, thereby preventing the liquid from splashing onto the chuck 400 and other structures after dripping.

[0066] Among them, further, in some embodiments of the present invention, such as Figure 3 , Figure 4 As shown, the angle of the first angle can be further selected between 20° and 35° to ensure that the guide plate 20 has an inclined angle and the projections of two adjacent guide plates 20 on the horizontal plane overlap, preventing the dripping droplets from directly passing through the guide plate 20 and dripping onto the bottom plate 220 of the processing chamber 210.

[0067] In some embodiments of the present invention, Figure 3 , Figure 4 As shown, the parallel distance between two adjacent guide plates 20 is between 3 mm and 20 mm.

[0068] Specifically, as mentioned above, the plurality of guide plates 20 are parallel to each other, and there is a parallel spacing between two adjacent guide plates 20, which may be 3 mm to 20 mm. After dripping, the liquid may slide along the surface above the guide plate 20 to the bottom of the processing chamber 210 and be discharged.

[0069] If the parallel spacing between two adjacent guide plates 20 is greater than 20 mm, the projections of the two adjacent guide plates 20 on the horizontal plane do not overlap, which can be understood as there is a gap between the two adjacent guide plates 20 on the horizontal plane. Therefore, after the liquid drips, it may drip directly onto the bottom plate 220 of the processing chamber 210 through the gap.

[0070] Correspondingly, if the interval between two adjacent guide plates 20 is small, the multiple guide plates 20 are arranged more densely. After the liquid drips, due to the small horizontal spacing between the two adjacent guide plates 20, the liquid may slide downward along the upward surface of the guide plate 20, resulting in uneven liquid discharge. After the subsequent liquid drips, it collides with the previous liquid that has not been discharged, causing liquid splashing.

[0071] Among them, the setting of the horizontal spacing between two adjacent guide plates 20 can be further selected to be 5mm to 10mm, thereby ensuring that the liquid slides along the guide plate 20 to the bottom of the processing chamber 210 and is discharged after dripping, and also preventing the liquid discharge from being affected by the small parallel spacing between the two adjacent guide plates 20.

[0072] Those skilled in the art will appreciate that in geometry, two lines or two planes are called parallel when they do not have any common points on the plane or in space. For two parallel plates, the parallel distance between them can be measured by making a line perpendicular to one plate, which will pass through the other plate and be perpendicular to that plate. Since the two parallel plates each have an intersection with this line, the distance between the two intersections is the parallel distance between the two parallel plates. This definition is applicable not only to plane geometry, but also to space geometry, and is used to explicitly calculate and manipulate the distance between two parallel objects.

[0073] It should be noted here that Figure 3 , Figure 4 As shown in FIG. 1 , the parallel spacing refers to the distance between two parallel guide plates 20. A straight line perpendicular to the surface of one guide plate 20 is drawn on the guide plate 20. This straight line passes through the surface of the other guide plate 20 and is perpendicular to it. The surfaces of the two guide plates 20 each have an intersection with this straight line. The distance between the two intersections is the parallel spacing between the two parallel guide plates 20. The parallel spacing is as follows: Figure 2 and Figure 3 The spacing D is shown in the figure.

[0074] In some embodiments of the present invention, Figure 3 , Figure 4 As shown, the projections of two adjacent guide plates 20 on the horizontal plane at least partially overlap, and the width of the overlapping projection area is greater than or equal to 1 mm. Specifically, the projections of two adjacent guide plates 20 on the horizontal plane have overlapping parts, that is, Figure 3 , Figure 4The width of the overlapping portion of the projection area is greater than or equal to 1 mm, thereby ensuring that the droplets dripping from above will directly fall on the upward surface of the guide plate 20 or the upper end surface of the guide plate 20. This prevents the liquid from dripping directly onto the bottom plate 220 of the processing chamber 210. The width of the overlapping projection area is Figure 3 , Figure 4 The width of the area S is shown in .

[0075] Further, in some embodiments of the present invention, Figure 3 , Figure 4 As shown, the width of the overlapping projection area of ​​two adjacent guide plates 20 on the horizontal plane is between 2 mm and 5 mm. Specifically, the width of the projection of two adjacent guide plates 20 on the horizontal plane can be between 2 mm and 5 mm, so that the spacing between the two adjacent guide plates 20 can make the liquid dripping on the guide plate 20 slide smoothly to the bottom of the processing chamber 210 and be discharged. It can also ensure that the position where the liquid drips is on the guide plate 20.

[0076] In some embodiments of the present invention, the anti-splash device 100 has six guide plates 20, the width of the overlapping part of the projection of two adjacent guide plates 20 on the horizontal plane is 3 mm, the first angle between the guide plate 20 and the vertical plane is 30°, and the parallel spacing between two adjacent guide plates 20 is 5 mm. Therefore, the droplets dripping from the top will directly drip onto the surface of the guide plate 20 facing upward or the upper end surface of the guide plate 20. Instead of dripping directly onto the bottom plate 220 of the processing chamber 210. Since the liquid drips onto the surface of the guide plate 20 facing upward or the upper end surface of the guide plate 20 at an angle closer to the tangent, the splashing of the liquid when dripping can be prevented, and the liquid can smoothly pass through the gap between the two adjacent guide plates 20 and be discharged through the drainage structure at the bottom of the processing chamber 210, so that the gap between the two adjacent guide plates 20 is prevented from accumulating liquid and affecting the anti-splash effect.

[0077] In some embodiments of the present invention, Figure 3 , Figure 4 As shown, the guide plate 20 and the inner wall surfaces of the two fixed blocks 10 are connected by at least one of welding or bolting. Specifically, the connection between the guide plate 20 and the fixed block 10 can be welding, which can ensure a stable connection between the guide plate 20 and the fixed block 10, and ensure the overall strength and stability of the anti-splash device 100. The connection between the guide plate 20 and the fixed block 10 can also be bolted, that is, the anti-splash device 100 can be disassembled as a whole, which is convenient for transportation and storage, reduces the space occupied during storage, and can be replaced when a single fixed block 10 or guide plate 20 is damaged, reducing maintenance costs.

[0078] In addition, the connection between the fixing block 10 and the guide plate 20 may also be in the form of snap-on, plug-in, adhesive, etc., which can be designed according to actual use requirements.

[0079] like Figure 3 , Figure 4 As shown, the cross section of the guide plate 20 is a trapezoid. That is, as mentioned above, the upper end surface of the guide plate 20 is a plane parallel to the vertical plane. The lower end surface of the guide plate 20 is a plane parallel to the horizontal plane, so the guide plate 20 can guide the droplets dripping from above, and when the droplets drip to the upper end surface of the guide plate 20, the droplets drip to this position at an angle closer to the tangent, so the anti-sputtering effect can be achieved.

[0080] In some embodiments of the present invention, the guide plate 20 may be in the shape of a rectangular plate with thickness, and the length of the rectangular guide plate 20 may extend in a direction parallel to the diameter of the wafer and the horizontal plane.

[0081] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A vertical wafer cleaning device, characterized in that: include: A box body, wherein the box body has a processing chamber, and a bottom plate of the box body is provided with a drainage port; A drainage net, the drainage net is arranged at the drainage outlet; A chuck, the chuck is arranged in the processing chamber to vertically clamp the wafer, and the plane where the chuck is located is parallel to the vertical plane; an anti-splash device, located above the drain port and covering the drain port, the anti-splash device comprising two fixed blocks, detachably arranged in the box body, and at least one guide plate, arranged between the two fixed blocks, the projection of the wafer clamping position on the vertical plane is located within the projection area of ​​the guide plate on the vertical plane, and a first angle is formed between the plane where the guide plate is located and the vertical plane, so as to catch and guide the droplets dripping from the wafer to the drain port; A maintenance door is provided on the side wall of the box body opposite to the anti-splash device for maintaining the anti-splash device.

2. The vertical wafer cleaning device according to claim 1, characterized in that: The upper end surface of the guide plate is parallel to the vertical plane, the lower end surface of the guide plate is parallel to the horizontal plane, and the projection of the lower end surface of the guide plate on the vertical plane is located within the projection area of ​​the fixing block on the vertical plane.

3. The vertical wafer cleaning device according to claim 2, characterized in that: The fixing block is detachably arranged in the box body through a horizontally arranged sliding groove.

4. The vertical wafer cleaning device according to claim 2, characterized in that: The anti-splash device comprises a plurality of guide plates, which are all arranged between the two fixed blocks, are parallel to each other, and the end surfaces of the lower parts of the plurality of guide plates are all located in the same plane.

5. The vertical wafer cleaning device according to claim 4, characterized in that: A rotating shaft is arranged at the vertical center of the guide plate, and the guide plate is rotatably arranged on the fixed block via the rotating shaft; The plurality of guide plates are connected in series via a horizontally arranged cross bar, and the cross bar is arranged in the accommodating cavity of the fixed block so that the inclination angle of the guide plate can be adjusted via the cross bar.

6. The vertical wafer cleaning device according to claim 5, characterized in that: The anti-splash device comprises a door plate adapted to the maintenance door, the door plate is fixedly connected to the fixing block, the door plate comprises a locking member arranged in the guide hole, the locking member has a locking position engaged with the cross bar and an open position away from the cross bar; The side wall of the maintenance door is provided with a locking buckle at a position corresponding to the locking member, which is used to fix the locking member in a locking position to lock the fixing block and the cross bar.

7. The vertical wafer cleaning device according to any one of claims 1 to 6, characterized in that: The first angle is between 10° and 45°.

8. The vertical wafer cleaning device according to claim 7, characterized in that: The first angle is between 20° and 35°.

9. The vertical wafer cleaning device according to claim 7, characterized in that: The parallel distance between two adjacent guide plates is between 3 mm and 20 mm.

10. The vertical wafer cleaning device according to claim 9, characterized in that: The projections of two adjacent guide plates on the horizontal plane at least partially overlap, and the width of the overlapping projection area is greater than or equal to 1 mm.

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