Marking equipment, marking method and packaging system

Abstract

The invention discloses marking equipment, a marking method and a packaging system, and the equipment comprises a conveying device which comprises a conveying module and a load mechanism for bearing a semiconductor device; by means of the conveying module, the loading mechanism is suitable for being sequentially transferred to the feeding station, the machining station and the discharging station in the first horizontal direction. The marking device comprises a marking mechanism, a dust blocking cover, a dust blowing mechanism and a dust suction mechanism, wherein the dust blowing mechanism and the dust suction mechanism are arranged on the dust blocking cover. The feeding unit comprises a first storage device and a first circulation device; the discharging unit comprises a second storage device and a second circulation device; wherein the dust blocking cover is located above the conveying device, and a window is formed in the bottom of the dust blocking cover. When the conductor device is transferred to the processing station, the loading mechanism is blocked below the window, and the window is suitable for covering the semiconductor device. By means of the structure, the dust blocking cover prevents dust from diffusing all around, the probability that the dust escapes from the action range of the dust collection mechanism is reduced, the effect of the dust collection mechanism is stabilized, and the air cleanliness is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a marking device, method and packaging system. Background Art

[0002] For example, semiconductor packaging processes for substrates such as COB, SIP, and CoWoS require laser marking (Marking / Labeling) of substrates and / or bare crystals (Die), chips such as ASICs, etc., to mark pins, etc. Most existing marking equipment has a complex structure and is difficult to achieve full automation.

[0003] Furthermore, dust is generated during the marking process of substrates and / or chips. To ensure air cleanliness, the marking equipment includes a dust removal mechanism.

[0004] For example, Chinese invention patent CN202310643629.7 discloses a marking device, which includes a conveying mechanism, a marking mechanism, a first dust removal mechanism, a second dust removal mechanism and a dust extraction mechanism. Specifically, the first dust removal mechanism, the marking mechanism, and the second dust removal mechanism are arranged in sequence along the conveying direction of the conveying mechanism, and the dust extraction mechanism is arranged below the marking mechanism. However, after the marking is completed, the dust is dispersed to the surroundings due to the influence of the second dust removal mechanism (air knife). The second dust removal mechanism and the dust extraction mechanism are arranged along the above-mentioned conveying direction, and dust can easily escape from the action range of the dust extraction mechanism, causing the air cleanliness to deteriorate.

[0005] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. Summary of the invention

[0006] The object of the present invention is to provide a marking device, method and packaging system to improve the cleanliness at the marking station.

[0007] The object of the present invention is to achieve the following technical solution: a marking device, comprising:

[0008] The conveying device includes a conveying module and a loading mechanism for supporting semiconductor devices; through the conveying module, the loading mechanism is suitable for sequentially transferring to a loading station, a processing station, and an unloading station along a first horizontal direction;

[0009] A marking device, suitable for marking the semiconductor device in the processing station with a laser, comprising a marking mechanism, a dust cover, and a dust blowing mechanism and a dust suction mechanism provided on the dust cover;

[0010] The loading unit includes a first storage device for storing semiconductor devices to be manufactured and a first transfer device; the semiconductor devices to be manufactured are transferred from the first storage device to the loading mechanism by means of the first transfer device;

[0011] The unloading unit includes a second storage device for storing the manufactured semiconductor devices and a second transfer device; the manufactured semiconductor devices are transferred from the loading mechanism to the second storage device by the second transfer device;

[0012] Wherein, the dust cover is located above the conveying device and has a window at the bottom; when the loading mechanism supporting the semiconductor device is in the processing station, the loading mechanism is blocked under the window, and the window is suitable for covering the semiconductor device.

[0013] Furthermore, the dust suction mechanism includes a first dust suction head; the first dust suction head and the dust blowing mechanism are arranged at the window and are relatively deployed along a second horizontal direction perpendicular to the first horizontal direction, so that the first dust suction head and the dust blowing mechanism form a processing area sufficient to avoid semiconductor devices; when the loading mechanism is in the processing station, the semiconductor device is located in the processing area and is adjacent to the first dust suction head and the dust blowing mechanism.

[0014] Furthermore, the marking device includes a brush roller mechanism; the number of the brush roller mechanisms is two, and they are respectively arranged on both sides of the dust cover along the first horizontal direction to clean the semiconductor devices before and after processing; the dust suction mechanism includes a second dust suction head corresponding to the brush roller mechanism one by one.

[0015] Furthermore, the conveying device includes a lifting module arranged between the loading mechanism and the conveying module, and the lifting module is suitable for lifting / lowering the loading mechanism in a vertical direction.

[0016] Furthermore, the loading mechanism comprises:

[0017] A carrier, including a platform for supporting a semiconductor device;

[0018] A first clamp, movably connected to the carrier, two in number, arranged relatively to each other along the second horizontal direction;

[0019] A linkage assembly, movably disposed on the carrier;

[0020] A second lifting drive member is drivingly connected to the linkage assembly;

[0021] The second lifting drive member is suitable for pushing / pulling the linkage assembly, so that the linkage assembly is suitable for pulling the first clamp to move it closer to the platform to restrict the semiconductor device, or away from the platform to release the semiconductor device.

[0022] Furthermore, the first clamp includes a special-shaped plate located above the platform and used to contact the semiconductor device; when the loading mechanism is in the processing station, the special-shaped plates of the first clamp are respectively located directly below the first dust suction head and the dust blowing mechanism, and the special-shaped plate gradually increases in height from the contact portion with the semiconductor device to the relative portion of the contact portion along the second horizontal direction.

[0023] Furthermore, the first material storage device and the second material storage device have similar structures, and the first material storage device comprises:

[0024] A first base frame, one side of which is open along the first horizontal direction;

[0025] an anti-slip device, provided on the opposite side of the first base frame along the first horizontal direction;

[0026] A material box, detachably mounted on the first base frame, suitable for allowing a plurality of semiconductor devices to be stacked and arranged therein;

[0027] The lock is arranged on the first base frame, and is suitable for blocking the open side of the first base frame 310 to stabilize the material box relative to the first base frame; when unsealed, the material box is suitable for moving relative to the first base frame along the first horizontal direction.

[0028] Furthermore, the first circulation device and the second circulation device have similar structures, and the first circulation device includes:

[0029] Transfer module;

[0030] A third base frame connected to the transfer module;

[0031] an adjusting mechanism, provided on the third base frame, comprising a first deployment member, a second deployment member and an adjusting assembly, wherein the first deployment member and the second deployment member are relatively deployed along the second horizontal direction; through the adjusting assembly, the first deployment member and the second deployment member are suitable for moving toward or away from each other;

[0032] The second clamp comprises a first clamping member, a second clamping member and a linear driving member, wherein the number of the linear driving members is two, which are respectively arranged on the first deployment member and the second deployment member, and are transmission-connected with the first clamping member and the second clamping member;

[0033] A pressing head, provided on the third base frame, located between the first clamping member and the second clamping member, and suitable for contacting the semiconductor device to prevent the semiconductor device from warping and deforming;

[0034] The bottom surface of the pressure head is depressed in a vertical direction to form a suction hole, and the suction nozzle is arranged at the suction hole.

[0035] The present invention provides a marking method, comprising the following steps:

[0036] S100, loading the semiconductor device to be manufactured into the first material storage device;

[0037] S200, the loading mechanism is transferred to the loading station by the conveying module; the semiconductor device to be manufactured is transferred from the first storage device to the loading mechanism by the first transfer device;

[0038] S300, the loading mechanism is transferred to the processing station by the conveying module;

[0039] S400, the marking mechanism marks the semiconductor device with a laser; the dust blowing mechanism and the dust collecting mechanism cooperate to clean dust generated by the marking;

[0040] S500, after the processing is completed, the loading mechanism is transferred to the unloading station through the conveying module;

[0041] S600, the manufactured semiconductor devices are transferred from the loading mechanism to the second storage device by means of a second transfer device.

[0042] Furthermore, the present invention provides a packaging system, including the aforementioned marking device.

[0043] Compared with the prior art, the present invention has the following beneficial effects: when the semiconductor device is transferred to the processing station, the loading mechanism is sealed under the bottom window of the dust cover, and the window is suitable for covering the semiconductor device, so that the marking mechanism can process the semiconductor device through the window, so that the dust cover can prevent dust from spreading around, reduce the probability of dust escaping the dust collection mechanism, stabilize the effectiveness of the dust collection mechanism, and ensure air cleanliness. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a structural schematic diagram of the marking device of the present invention.

[0045] Figure 2 It is a schematic diagram of the installation of the conveying device and the marking device in the present invention.

[0046] Figure 3 It is a structural schematic diagram of the marking device in the present invention.

[0047] Figure 4 It is a schematic diagram of the exploded structure of the second vacuum head and the brush roller mechanism in the present invention.

[0048] Figure 5 It is a cross-sectional schematic diagram of the dust box in the present invention.

[0049] Figure 6 It is a schematic diagram of the interior of the dust box of the present invention.

[0050] Figure 7It is a schematic diagram of the structure when the load mechanism in the present invention restricts the semiconductor device.

[0051] Figure 8 It is a schematic structural diagram of the load mechanism in the present invention when releasing the semiconductor device.

[0052] Fig. 9 It is a schematic diagram of the decomposed structure of the load mechanism in the present invention.

[0053] Fig.10 It is a schematic diagram of the exploded structure of the first clamp in the present invention.

[0054] Fig.11 It is a schematic structural diagram of the first material storage device in the present invention.

[0055] Fig.12 It is a structural diagram of the second deployment structure in the present invention.

[0056] Fig.13 It is a structural schematic diagram of the lock in the present invention.

[0057] Fig.14 It is a structural schematic diagram of the second base frame in the present invention.

[0058] Fig.15 It is a structural schematic diagram of the lock core structure in the present invention.

[0059] Fig.16 It is a schematic diagram of the structure of the lock when it is unsealed in the present invention.

[0060] Fig.17 It is a schematic diagram of the structure of the lock in the present invention when blocking.

[0061] Fig.18 It is a schematic diagram of the structure of the first circulation device in the present invention.

[0062] Fig.19 It is a schematic structural diagram of the clamping part in the present invention.

[0063] Fig. 20 yes Fig.19 Schematic diagram of the structure in another direction.

[0064] Description of reference numerals:

[0065] 100, marking device; 110, marking mechanism; 111, exciter; 120, dust blowing mechanism; 131, first dust suction head; 1311, first dust suction port; 132, second dust suction head; 1321, first side; 1322, second side; 140, dust cover; 141, window; 142, scanning port; 150, brush roller mechanism; 151, first box body; 1511, interface; 1512, second dust suction port; 152, brush roller; 153, rotating drive member; 154, first lifting drive member; 161, dust box; 1611, dust collecting chamber; 161 2. Cavity; 1613. Second box body; 1614. Door body; 1615. Inspection port; 1616. First side plate; 1617. Second side plate; 1618. Cover plate; 162. Fan; 163. Interceptor; 1641. Support plate; 1642. Limit plate; 1643. First channel; 1644. Screw; 1645. First knob; 165. First bracket; 166. First sensing element; 200. Conveying device; 210. Conveying module; 220. Loading mechanism; 221. Carrier; 2211. Platform; 2212. First substrate;

[0066] 2213, first block; 2214, bayonet; 222, first fixture; 2221, pivot;

[0067] 2222, actuating member; 2223, special-shaped plate; 2224, collar; 2225, second hole groove;

[0068] 223, linkage assembly; 2231, linkage plate; 2232, linkage member; 2233, linkage device; 2234, first hole slot; 2235, slide rail assembly; 224, second lifting drive member; 230, lifting module; 300, first material storage device; 310, first base frame; 311, second base plate; 312, top perimeter; 313, column; 314, second deployment structure; 3141, third base plate; 3142, second channel; 3143, stopper; 3144, second hole; 320, anti-slip device; 321, translocation plate; 322, stopper; 330, material box; 340, lock; 341, lock core structure; 3411, lock pin; 3412, insert; 3413, second block; 3414, third block; 342, second base frame; 3421, third hole; 3422, third channel; 3423, third hole slot; 3424, deployment plate; 3425, first a base; 3426, a second base; 343, a hand brake; 344, a spring; 3451, a second sensing element; 3452, a third sensing element; 350, a feeding mechanism; 400, a first circulation device; 410, a transfer module; 420, a third base; 421, a first guide structure; 4211, a rod; 4212, a kit; 422, a second frame; 423, a second guide structure; 430, a second fixture; 431, a first Clamping member; 432, second clamping member; 433, linear drive member; 440, adjustment mechanism; 441, first deployment member; 442, second deployment member; 443, adjustment assembly; 4431, third base; 4432, screw rod; 4433, nut; 4434, second knob; 450, pressure head; 451, adsorption hole; 460, suction nozzle; 500, second storage device; 600, second circulation device; 700, semiconductor device. DETAILED DESCRIPTION

[0069] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0070] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0071] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0072] See also Figures 1 to 3 As shown, the marking device corresponding to a preferred embodiment of the present invention is suitable for laser micro-machining a semiconductor device formed by connecting a chip to a substrate. Of course, in other embodiments, the marking device is also suitable for processing other electronic components, and the present invention is not limited here. It can be understood that the marking device is mainly described based on the semiconductor device formed by connecting a chip to a substrate.

[0073] Specifically, the marking equipment includes: a conveying device 200, a marking device 100, a loading unit and an unloading unit. Among them, the conveying device 200 includes a conveying module 210 and a loading mechanism 220 that supports the semiconductor device 700; through the conveying module 210, the loading mechanism 220 is suitable for sequentially transferring to the loading station, the processing station and the unloading station along the first horizontal direction. The loading unit includes a first storage device 300 and a first circulation device 400 for storing the semiconductor device 700 to be manufactured; through the first circulation device 400, the semiconductor device 700 to be manufactured is transferred from the first storage device 300 to the loading mechanism 220. The unloading unit includes a second storage device 500 and a second circulation device 600 for storing the semiconductor device 700; through the second circulation device 600, the manufactured semiconductor device 700 is transferred from the loading mechanism 220 to the second storage device 500.

[0074] The marking device 100 includes a marking mechanism 110, a dust blowing mechanism 120 and a dust suction mechanism. The marking mechanism 110 is suitable for marking the semiconductor device 700 in the processing station with a laser, and the dust blowing mechanism 120 and the dust suction mechanism are suitable for cleaning dust generated by marking.

[0075] Indeed, the dust blowing mechanism 120 may cause dust to escape, or even escape the range of the dust collecting mechanism. Therefore, to ensure air cleanliness, preferably, the marking device 100 includes a dust cover 140. Specifically, the dust blowing mechanism 120 and the dust collecting mechanism are arranged on the dust cover 140, and the dust cover 140 is located above the conveying device 200 and has a window 141 at the bottom, so that when the loading mechanism 220 supporting the semiconductor device 700 is in the processing station, the loading mechanism 220 is blocked below the window 141, and the window 141 is suitable for covering the semiconductor device 700.

[0076] By means of the dust cover 140, when the semiconductor device 700 is transferred to the processing station, the loading mechanism 220 is suitable for being sealed under the bottom window 141 of the dust cover 140. In addition, the window 141 is suitable for covering the semiconductor device 700. In this way, the marking mechanism 110 can process the semiconductor device 700 through the window 141, and the dust cover 140 prevents dust from spreading around, reducing the probability of dust escaping from the action range of the dust collection mechanism, stabilizing the effectiveness of the dust collection mechanism, and ensuring air cleanliness.

[0077] For further information, see Figures 2 to 3 As shown, the dust collection mechanism includes a first dust collection head 131. Specifically, the first dust collection head 131 and the dust blowing mechanism 120 are arranged at the window 141 and are arranged relatively along a second horizontal direction perpendicular to the first horizontal direction, so that the first dust collection head 131 and the dust blowing mechanism 120 form a processing area sufficient to avoid the semiconductor device 700. Specifically, when the loading mechanism 220 is in the processing station, the semiconductor device 700 is located in the above-mentioned processing area and is close to the first dust collection head 131 and the dust blowing mechanism 120, so that the first dust collection head 131 and the dust blowing mechanism 120 can reliably act on the semiconductor device 700, and dust is difficult to disperse from the dust shield 140.

[0078] In this embodiment, the dust blowing mechanism 120 is specifically a strip-shaped wind knife structure, and its length direction is parallel to the first horizontal direction. The first dust suction head 131 is specifically a hollow shell, and a first dust suction port 1311 is provided on the side of the first dust suction head 131 opposite to the dust blowing mechanism 120. The first dust suction port 1311 is also specifically a strip-shaped structure, and its length direction is parallel to the first horizontal direction. The side of the first dust suction head 131 away from the dust blowing mechanism 120 can be connected to a dust suction pipeline to provide suction to the first dust suction head 131.

[0079] Preferably, the first vacuum head 131 and the dust blowing mechanism 120 extend along the first horizontal direction to both sides of the dust cover 140 so that their action range covers the window 141. In this way, the loading mechanism 220 only needs to correspond to the above-mentioned processing area and be blocked below the window 141, thereby reducing the size requirements of the loading mechanism 220.

[0080] Furthermore, the marking mechanism 110 is specifically a laser structure, which includes an exciter 111 located above the dust cover 140. A scanning port 142 corresponding to the exciter 111 is provided on the top of the dust cover 140. The light beam emitted by the exciter 111 can reach the semiconductor device 700 through the scanning port 142 and the window 141 to mark the chip or substrate.

[0081] In this embodiment, the marking mechanism 110 is preferably a dual optical path based on two exciters 111. Of course, there are two scanning ports 142, which correspond to the exciters 111 one by one, so as to avoid interference between the light beams emitted by the two exciters 111.

[0082] Furthermore, the semiconductor device 700 to be manufactured may be contaminated, and the manufactured semiconductor device 700 may be contaminated with dust that is difficult to be cleaned by the dust blowing mechanism 120. Therefore, as a preferred embodiment, the marking device 100 includes a brush roller mechanism 150 located above the loading mechanism 220. Specifically, there are two brush roller mechanisms 150, which are respectively arranged on both sides of the dust shield 140 along the first horizontal direction to clean the semiconductor device 700 before and after processing. Preferably, the dust suction mechanism includes a second dust suction head 132 corresponding to the brush roller mechanism 150 to absorb the contaminated dust and dust removed from the semiconductor device 700 by the brush roller mechanism 150.

[0083] Specifically, see Figure 4 As shown, the brush roller mechanism 150 includes a first box body 151, a brush roller 152, a rotating drive member 153 and a first lifting drive member 154. An interface 1511 is provided at the bottom of the first box body 151, and the brush roller 152 is rotatably arranged inside the first box body 151, so that when cleaning the semiconductor device 700, a part of the brush roller 152 is exposed from the interface 1511 to the first box body 151 to contact the chip or substrate. Indeed, preferably, the rotation pivot of the brush roller 152 is parallel to the second horizontal direction. The rotating drive member 153 is arranged in the first box body 151 and is connected to the brush roller 152 in a transmission manner, specifically an electric motor, so that the brush roller 152 rotates. The first lifting drive member 154 is arranged between the first box body 151 and the dust cover 140, and is suitable for driving the first box body 151 to approach or move away from the semiconductor device 700 in the vertical direction, specifically a pneumatic cylinder or an electric cylinder.

[0084] Specifically, the semiconductor device 700 is transferred to the bottom of the brush roller mechanism 150 by the conveying module 210; then, the first box body 151 is lowered by the first lifting drive member 154, and the brush roller 152 contacts the chip or substrate; then, the brush roller 152 is rotated by the rotating drive member 153 to remove stains and dust from the semiconductor device 700 before and after processing; of course, after cleaning, the brush roller mechanism 150 is reset.

[0085] Furthermore, the first box body 151 is provided with a second suction port 1512 on one radial side of the brush roller 152, and the second suction head 132 is connected to the second suction port 1512, so that the stains removed by the brush roller 152 can be introduced into the second suction head 132 through the second suction port 1512. The second suction head 132 is specifically a hollow cover body to block the second suction port 1512. More specifically, the second suction head 132 has a first side 1321 and a second side 1322, and its internal hollow size gradually expands from the first side 1321 to the second side 1322, so that the stains and dust introduced into the second suction head 132 flow smoothly to the suction line. Indeed, the second side 1322 is suitable for connecting with the suction line to provide suction to the second suction head 132.

[0086] For further information, see Figure 2 , Figure 5 as well as Figure 6 As shown, the marking device 100 includes an attraction mechanism connected to the dust suction mechanism, the attraction mechanism includes a dust box 161 and a fan 162, and an interceptor 163 is provided inside the dust box 161. The interceptor 163 is suitable for dividing the inside of the dust box 161 into a dust collecting chamber 1611 and a cavity 1612. Indeed, through the dust suction pipeline, the first dust suction head 131 and the second dust suction head 132 are both connected to the dust collecting chamber 1611; through the dust extraction pipeline, the fan 162 is connected to the cavity 1612.

[0087] Preferably, the dust box 161 includes a second box body 1613 and a door body 1614. A side of the second box body 1613 is provided with an inspection port 1615 suitable for loading and unloading the interceptor 163 and cleaning the inside of the dust box 161. Of course, the door body 1614 is movably connected to the second box body 1613 by a hinge or the like to open or close the inspection port 1615.

[0088] Furthermore, the second box body 1613 is specifically a square body. More specifically, the first side panels 1616, the second side panels 1617, and the cover panel 1618 that are opposite to each other are enclosed to form the second box body 1613. The first dust suction head 131 and the second dust suction head 132 are connected to a first side panel 1616 through a dust suction pipeline; the fan 162 is connected to another first side panel 1616 through a dust extraction pipeline; the inspection port 1615 is provided on a second side panel 1617; and the interceptor 163 is detachably provided between the two first side panels 1616.

[0089] Preferably, a first deployment structure suitable for accurately positioning the interceptor 163 is provided inside the second box body 1613 to stabilize the effectiveness of the interceptor 163. Specifically, the first deployment structure includes a support plate 1641 and a limit plate 1642 disposed between the two first side plates 1616. Indeed, the support plate 1641 and the limit plate 1642 are disposed parallel to each other. A dust collecting chamber 1611 is formed between the interceptor 163 and the first side plate 1616 close to the limit plate 1642, and a cavity 1612 is formed between the interceptor 163 and the first side plate 1616 close to the support plate 1641. More specifically, the support plate 1641 is disposed parallel to the first side plate 1616, and is parallel to the second side plates 1617 and the second cover plates 1618.

[0090] 1618 is close-fitting and has air vents, so that air can only flow through the air vents.

[0091] 1642 is deployed parallel to the first side plate 1616, there are two of them, and they are respectively arranged on the two cover plates 1618 and are in close contact with the two second side plates 1617, so that the first groove 1643 is formed between the support plate 1641 and the two limiting plates 1642 to guide the interceptor 163 to be deployed inside the second box body 1613.

[0092] Preferably, the first deployment structure includes a screw 1644. The screw 1644 is connected to the first side plate 1616 near the limiting plate 1642, one end of the screw 1644 is located in the dust collecting chamber 1611, and the other end is exposed to the second box body 1613 and is provided with a first knob 1645, so that the position of one end of the screw 1644 in the dust collecting chamber 1611 is changed by the first knob 1645, so that the interceptor 163 is tightly against the support plate 1641. Of course, the number of screws 1644 is several to ensure that the interceptor 163 is evenly stressed.

[0093] Preferably, a first bracket 165 corresponding to the screw rod 1644 is provided inside the dust collecting chamber 1611. The first bracket 165 is suitable for supporting the screw rod 1644 at one end inside the dust collecting chamber 1611 to stabilize the deployment of the screw rod 1644. Specifically, the first bracket 165 is provided with a first hole, and the screw rod 1644 passes through the first hole at one end inside the dust collecting chamber 1611.

[0094] Furthermore, the dust chamber 1611 is full of dirt and dust but has not been cleaned, or the interceptor 163 is blocked, so the dust box 161 includes a first sensing element 166 disposed on the second box body 1613. The first sensing element 166 is two in number, and is used to sense the air pressure inside the dust chamber 1611 and the cavity 1612, respectively, so as to alarm when the air pressure difference between the dust chamber 1611 and the cavity 1612 reaches a critical limit, and remind the operator to clean the dust chamber 1611.

[0095] Further, as a preferred embodiment, please refer to Figure 2 As shown, the conveying device 200 includes a lifting module 230 disposed between the load mechanism 220 and the conveying module 210. Specifically, the load mechanism 220 is located at the processing station, and then the lifting module 230 is adapted to lift / drop the load mechanism 220 in the vertical direction, so that it is closer to the window 141 to block the window 141, or away from the window 141 to facilitate passing through the dust cover 140.

[0096] Preferably, the conveying module 210 is specifically a linear module based on two output ends, the number of the loading mechanisms 220 is two, and they correspond to the two output ends one by one, and a lifting module 230 is provided between each loading mechanism 220 and its corresponding output end. Specifically, by means of the lifting module 230, the two loading mechanisms 220 are suitable for shifting along the vertical direction to be displaced in the first horizontal direction, so that the two loading mechanisms 220 reciprocate along the first horizontal direction without interfering with each other, so as to improve the productivity of the marking equipment.

[0097] For further information, see Figures 7 to 10As shown, the loading mechanism 220 includes a carrier 221, a first clamp 222, a linkage assembly 223 and a second lifting drive 224. Specifically, the carrier 221 is connected to the lifting module 230 in a transmission manner, including a platform 2211. There are two first clamps 222, which are arranged relatively along the second horizontal direction and are both movably connected to the carrier 221. The linkage assembly 223 can be movably arranged on the carrier 221 and is connected to the second lifting drive 224 in a transmission manner. Specifically, the semiconductor device 700 is placed on the platform 2211, and then the second lifting drive 224 is suitable for pushing / pulling the linkage assembly 223, so that the linkage assembly 223 pulls the two first clamps 222 to move them closer to the platform 2211 to restrict the semiconductor device 700, or away from the platform 2211 to release the semiconductor device 700. Indeed, the two first clamps 222 are suitable for contacting the edge of the substrate to restrict the semiconductor device 700, so that the semiconductor device 700 is stabilized on the platform 2211, rarely displaced or deformed, thereby stabilizing the processing effect. Furthermore, through the linkage component 223, a second lifting drive 224 is sufficient to make the two first clamps 222 move synchronously, reducing the manufacturing cost of the loading mechanism 220.

[0098] Furthermore, the linkage assembly 223 includes a linkage plate 2231, a linkage member 2232 and a linkage device 2233. Specifically, the linkage plate 2231 is movably connected to the carrier 221, is roughly L-shaped, and is provided with a first hole groove 2234. One end of the linkage member 2232 is connected to the first clamp 222, and the other end is provided with a linkage device 2233. The linkage device 2233 is specifically a cam bearing, which is movably arranged inside the first hole groove 2234. Indeed, the number of the first clamps 222 is two, and correspondingly, the number of the linkage members 2232 is also two, which are respectively connected to the two first clamps 222; the number of the linkage devices 2233 is also two, which are respectively arranged on the two linkage members 2232.

[0099] More specifically, the rotation pivots of the two first clamps 222 are parallel to the first horizontal direction. The first hole groove 2234 is formed by being recessed from the surface of one side of the linkage plate 2231 along the first horizontal direction, and is in a strip shape, and its length direction is parallel to the second horizontal direction. Indeed, the linkage assembly 223 includes a slide rail assembly 2235 arranged between the linkage plate 2231 and the carrier 221. The slide rail assembly 2235 is arranged in the vertical direction so that the linkage plate 2231 can be lifted and lowered relative to the carrier 221. Correspondingly, the second lifting drive member 224 is suitable for pushing / pulling the linkage plate 2231 in the vertical direction, and is specifically a pneumatic cylinder or an electric cylinder.

[0100] Specifically, the second lifting drive member 224 pulls down the linkage plate 2231, and then, through the first hole groove 2234, the two linkage devices 2233 move toward each other, so that the end of the second linkage member 2232 connected to the first clamp 222 is tilted upward to pull the first clamp 222 down, and then move it closer to the platform 2211; correspondingly, the second lifting drive member 224 pushes up the linkage plate 2231, and then, through the first hole groove 2234, the two linkage devices 2233 move back to back, so that the end of the linkage member 2232 connected to the first clamp 222 is sunk to pull the first clamp 222 up, and then move it away from the platform 2211.

[0101] In this embodiment, the platform 2211 is specifically a rectangular platform adapted to the semiconductor device 700, with its length direction parallel to the first horizontal direction and its width direction parallel to the second horizontal direction. Indeed, the two first clamps 222 are disposed on both sides of the platform 2211 along the width direction, so that the two first clamps 222 are suitable for contacting the longer side edges of the substrate to ensure that the semiconductor device 700 is stable on the platform 2211.

[0102] Further, the first clamp 222 includes a pivot 2221, an actuator 2222 and a special-shaped plate 2223. Specifically, there are two pivots 2221, which are rotatably arranged on both sides of the carrier 221 along the first horizontal direction. Indeed, the two pivots 2221 are arranged on a straight line parallel to the first horizontal direction, and the axes of the two pivots coincide with it. The actuator 2222 is strip-shaped, with rings 2224 at both ends, and the two rings 2224 are respectively connected to the two pivots 2221. The special-shaped plate 2223 is located above the platform 2211 and connected to the actuator 2222, and is used to contact the edge of the substrate to limit the semiconductor device 700. The linkage component 223 is located on one side of the carrier 221 along the first horizontal direction, and the linkage 2232 is connected to its adjacent pivot 2221. Preferably, the special-shaped plate 2223 extends to both sides of the platform 2211 along the first horizontal direction so as to fully contact the longer side edges of the substrate to ensure that the semiconductor device 700 is stabilized on the platform 2211 .

[0103] Specifically, when the loading mechanism 220 is in the processing station, the carrier 221 is blocked below the window 141. Indeed, the two shaped plates 2223 and the platform 2211 are suitable for cooperating to block below the window 141. Preferably, the two shaped plates 2223 are respectively located directly below the first dust suction head 131 and the dust blowing mechanism 120, and the shaped plates 2223 are gradually raised from the contact portion with the substrate to the contact portion with the actuator 2222, so that the shaped plates 2223 are suitable for guiding the airflow to ensure that the first dust suction head 131 and the dust blowing mechanism 120 cover the semiconductor device 700.

[0104] Further, the carrier 221 includes a first substrate 2212 and a first block 2213, and the platform 2211 and the first block 2213 are both arranged on the first substrate 2212. Specifically, there are two first blocks 2213, which are relatively arranged on both sides of the platform 2211 along the second horizontal direction. The first clamps 222 correspond to the first blocks 2213 one by one, and the two first clamps 222 are rotatably connected to the two first blocks 2213 respectively. Preferably, the platform 2211 is detachably arranged on the first substrate 2212, and the two first blocks 2213 are suitable for changing their positions along the second horizontal direction. Specifically, when the carrier 221 is compatible with semiconductor devices 700 of different sizes, it is only necessary to replace the platform 2211 that is adapted thereto, and change the positions of the two first blocks 2213 to allow the two first clamps 222 to fully contact the edge of the substrate.

[0105] Further, the carrier 221 includes a plurality of latches 2214 suitable for accurately positioning the semiconductor device 700. Specifically, the latches 2214 are connected to the platform 2211 and / or the first block 2213, and are raised relative to the platform 2211. Indeed, a plurality of latches 2214 are dispersedly arranged on the platform 2211 to surround the periphery of the semiconductor device 700. More specifically, the shaped plate 2223 is provided with a second hole 2225. The second hole 2225 is suitable for avoiding the latches 2214 so as not to hinder the shaped plate 2223 from approaching the platform 2211.

[0106] For further information, see Figure 1 and Fig.11 As shown, the first storage device 300 and the second storage device 500 are respectively arranged at two ends of the conveying module 210 along the first horizontal direction. Indeed, in this embodiment, the first storage device 300 and the second storage device 500 have similar structures. Therefore, the marking device is mainly described based on the first storage device 300.

[0107] See also Fig.11 As shown, the first storage device 300 includes a first base frame 310, an anti-slip device 320, a material box 330 and a lock 340. Specifically, the first base frame 310 is open on one side along the first horizontal direction, and the anti-slip device 320 is arranged on the opposite side of the first base frame 310 along the first horizontal direction. The material box 330 is detachably arranged on the first base frame 310, suitable for allowing a plurality of semiconductor devices 700 to be stacked and arranged therein. The lock 340 is arranged on the first base frame 310, suitable for blocking the open side of the first base frame 310, so that the material box 330 is stable relative to the first base frame 310. Indeed, when the lock 340 is unsealed, the material box 330 is suitable for moving relative to the first base frame 310 along the first horizontal direction.

[0108] Furthermore, the first storage device 300 includes a feeding mechanism 350. The feeding mechanism 350 is disposed below the first base frame 310. Correspondingly, the top and bottom of the material box 330 are both open, so that the feeding mechanism 350 is suitable for pushing up the semiconductor device 700 inside the material box 330 so that the first circulation device 400 can obtain the top semiconductor device 700 therein. Of course, the feeding mechanism 350 is a conventional structure in the art, and the present invention will not be repeated here.

[0109] Further, the first base frame 310 includes a second base plate 311, a top perimeter 312, and a column 313 connected therebetween. Preferably, the second base plate 311 is provided with a second deployment structure 314 suitable for accurately positioning the material box 330. Of course, the number of the second deployment structures 314 is several to expand the material storage capacity of the first base frame 310. In this embodiment, the number of the second deployment structures 314 is two, which are spaced apart on the second base plate 311 along the second horizontal direction.

[0110] See also Fig.12 As shown, the second deployment structure 314 includes a third substrate 3141 and a second groove 3142. Specifically, the second groove 3142 is formed by being recessed along the vertical direction from the top surface of the third substrate 3141, and extends to both sides of the third substrate 3141 along the first horizontal direction to guide the material box 330 to be deployed on the first base frame 310. Of course, the spacing between the two sides of the second groove 3142 along the second horizontal direction is not less than the width of the material box 330. More specifically, a plurality of blocking columns 3143 are relatively deployed on both sides of the second groove 3142 along the second horizontal direction. Of course, the blocking columns 3143 are raised relative to the third substrate 3141 to prevent the material box 330 from derailing the second groove 3142 along the second horizontal direction. It can be understood that the second groove 3142 is provided with a second hole 3144. The second hole 3144 is suitable for avoiding the feeding mechanism 350, and the third substrate 3141 does not hinder the feeding mechanism 350 from pushing up the semiconductor device 700 inside the material box 330.

[0111] The anti-slip device 320 includes a translocation plate 321 and a baffle 322. Specifically, the translocation plate 321 is movably disposed on the top periphery 312, and the baffle 322 is connected to the translocation plate 321. Indeed, the baffle 322 is suitable for moving along the first horizontal direction with the translocation plate 321 to approach or move away from the lock 340, so as to block the material boxes 330 of different sizes.

[0112] More specifically, a slide rail deployed along the first horizontal direction is provided between the top enclosure 312 and the translocation plate 321. Of course, there are two slide rails, which are respectively provided on both sides of the top enclosure 312 along the second horizontal direction to ensure that the translocation plate 321 moves stably and smoothly. The baffle 322 is provided at the bottom of the translocation plate 321, and the plate surface is perpendicular to the first horizontal direction, corresponding to the second deployment structure 314 one by one. Of course, when the material box 330 is stable relative to the first base frame 310, the contact portion between the plate surface of the baffle 322 and one side of the material box 330 extends at least to the middle section of the side in the vertical direction to ensure that the baffle 322 firmly seals the material box 330.

[0113] See also Figures 13 to 17 As shown, the lock 340 includes a lock core structure 341, a second base frame 342 and a hand brake 343. Specifically, the lock core structure 341 is connected to the hand brake 343, and includes a lock pin 3411 and a plug core 3412 fixed relatively thereto and arranged parallel to each other. The second base frame 342 is connected to the first base frame 310, and is provided with a third hole 3421, a third groove 3422 and a third hole groove 3423. The lock pin 3411 is rotatably disposed in the third hole 3421, and one end of the plug core 3412 is movably disposed in the third groove 3422. Indeed, when the lock pin 3411 rotates, the plug core 3412 moves along the third groove 3422. More specifically, there are two third holes 3423, which are respectively disposed at both ends of the third groove 3422. Specifically, when the insert 3412 is inserted into a third hole 3423 at one end of the third groove 3422, the hand switch 343 is locked to block the open side of the first base frame 310; when the insert 3412 is inserted into another third hole 3423 at one end of the third groove 3422, the hand switch 343 is unlocked to unseal.

[0114] More specifically, the second base 342 includes a deployment plate 3424, a first base 3425 and a second base 3426. The deployment plate 3424 is connected to the first base 310; the first base 3425 and the second base 3426 are both connected to the deployment plate 3424, and are relatively deployed along the first horizontal direction, respectively located on the open side of the first base 310 and near the anti-slip device 320. The third hole 3421 and the third groove 3422 are both formed by being recessed along the first horizontal direction from the surface of the first base 3425 facing away from the second base 3426. Indeed, the outer diameter of the locking pin 3411 is not larger than the inner diameter of the third hole 3421, the third groove 3422 is specifically arc-shaped, and the outer diameter of the insert 3412 is not larger than the inner diameter of the third hole groove 3423.

[0115] More specifically, the locking pin 3411 and the insert 3412 are relatively fixed by the second block 3413. The locking pin 3411 passes through the third hole 3421, and one end away from the second base 3426 is connected to the hand brake 343. When one end of the insert 3412 is inserted into a third hole 3423 at the third channel 3422, the other end is suitable for changing its position along the first horizontal direction to abut against the second base 3426. Preferably, when the hand brake 343 is locked, it is suitable for blocking the middle section of one side of the material box 330 along the vertical direction to firmly block the material box 330.

[0116] Preferably, the locking pin 3411 abuts against one end of the second base 3426 and is connected to the third block 3414. The spring 344 surrounds the locking pin 3411 and is disposed between the third block 3414 and the first base 3425. Specifically, when one end of the plug core 3412 moves in the third groove 3422, the spring 344 is compressed and deformed. Indeed, the second block 3413 is suitable for transmitting the restoring force of the spring 344 along the first horizontal direction to affect the plug core 3412, so that one end of the plug core 3412 appropriately contacts the third groove 3422 and is suitable for smooth movement so as to be inserted into the third hole 3423.

[0117] Preferably, the second sensing element 3451 is arranged on the third hole groove 3423, and is suitable for sensing the insert 3412 when the hand brake 343 is locked; the third sensing element 3452 is arranged on the second base 3426, and is suitable for sensing the locking pin 3411 when the locking pin 3411 is against the second base 3426; so that the operator can know the status of the lock 340 and prevent mistakes.

[0118] For further information, see Figures 18 to 20 As shown, in this embodiment, the first circulation device 400 and the second circulation device 600 have similar structures. Therefore, the marking device is mainly described based on the first circulation device 400.

[0119] The first circulation device 400 includes a transfer module 410 and a clamping portion provided on the transfer module 410. Specifically, the clamping portion includes a third base frame 420 connected to the transfer module 410 and a second clamp 430 provided on the third base frame 420. Through the transfer module 410, the second clamp 430 is suitable for transfer to dock with the first storage device 300, obtain the semiconductor device 700, and transfer it to the loading mechanism 220. In this embodiment, the loading station and the unloading station are respectively arranged with the first storage device 300 and the second storage device 500 at intervals along the second horizontal direction, so that the transfer module 410 does not need a linear module arranged along the first horizontal direction, and the design is simplified.

[0120] Further, the second clamp 430 includes a first clamp 431 , a second clamp 432 and a linear drive 433 . Specifically, by means of the linear drive 433 , the first clamp 431 and the second clamp 432 are adapted to move toward or away from each other to obtain or release the semiconductor device 700 .

[0121] It is true that the semiconductor devices 700 are of different sizes, so in order to improve the flexibility of the second clamp 430, or to extend the stroke of the linear drive member 433, the manufacturing burden of the second clamp 430 is increased. Therefore, the clamping part includes an adjustment mechanism 440 disposed on the third base frame 420. Specifically, the adjustment mechanism 440 includes a first deployment member 441, a second deployment member 442 and an adjustment assembly 443. The first deployment member 441 and the second deployment member 442 are relatively disposed along the second horizontal direction, and the linear drive member 433 is disposed on the first deployment member 441 and / or the second deployment member 442, and is transmission-connected to the first clamping member 431 and / or the second clamping member 432. By adjusting the component 443, the first deployment member 441 and the second deployment member 442 are adapted to move toward or away from each other, so that the linear drive member 433 is displaced, thereby changing the distance between the first clamping member 431 and the second clamping member 432. In this way, there is no need to extend the stroke of the linear drive member 433, and the second clamp 430 is still compatible with semiconductor devices 700 of different sizes. Preferably, there are two linear drive members 433, which are respectively arranged on the first deployment member 441 and the second deployment member 442, and are transmission-connected with the first clamping member 431 and the second clamping member 432.

[0122] Further, the third base frame 420 includes a first guide structure 421 and a second bracket 422. Specifically, the first guide structure 421 includes a rod 4211 and a set 4212. More specifically, the length direction of the rod 4211 is parallel to the second horizontal direction. The set 4212 is movably arranged on the rod 4211, and the number is two, which are respectively connected to the first deployment member 441 and the second deployment member 442. The second bracket 422 is connected to the rod 4211 and is arranged between the first deployment member 441 and the second deployment member 442.

[0123] The first deployment member 441 and the second deployment member 442 are similar in structure and are strip-shaped, and their length direction is parallel to the first horizontal direction. Preferably, there are two first guide structures 421, which are respectively arranged at both ends of the first deployment member 441 and the second deployment member 442 along the first horizontal direction to reinforce the third base frame 420.

[0124] Specifically, the first clamping member 431 and the second clamping member 432 are both located between the first deployment member 441 and the second deployment member 442. A second guiding structure 423 is respectively provided between the first clamping member 431 and the first deployment member 441 and between the second clamping member 432 and the second deployment member 442. Of course, the second guiding structure 423 is similar to the first guiding structure 421, and the present invention will not be repeated here.

[0125] Further, the adjustment assembly 443 includes a third base 4431, a screw rod 4432, a nut 4433 and a second knob 4434. Specifically, the third base 4431 is connected to the second bracket 422. The length direction of the screw rod 4432 is parallel to the second horizontal direction, and is rotatably arranged on the third base 4431, and a second knob 4434 is arranged at one end. More specifically, the screw rod 4432 includes a first part and a second part, and the threads of the two parts are opposite. There are two nuts 4433, which surround the first part and the second part respectively, and are connected to the first deployment member 441 and the second deployment member 442. Specifically, by means of the second knob 4434, the two nuts 4433 are suitable for moving toward or away from each other along the screw rod 4432, so that the first deployment member 441 and the second deployment member 442 move toward or away from each other. Preferably, the clamping part includes a pressure head 450 arranged on the third base 420. Specifically, the pressing head 450 is disposed at the bottom of the second bracket 422 , between the first clamping member 431 and the second clamping member 432 , and is strip-shaped, with its length direction parallel to the first horizontal direction, suitable for contacting the semiconductor device 700 to prevent it from warping and deformation.

[0126] Indeed, the semiconductor devices 700 are stacked and arranged in the material box 330, and are in direct contact with each other. Therefore, in order to prevent the adjacent semiconductor devices 700 from being damaged by friction, electrostatic discharge (ESD), etc., an isolation material (such as a backing paper) is often arranged between the adjacent semiconductor devices 700. Therefore, preferably, the adsorption hole 451 is formed by being recessed in the vertical direction from the bottom surface of the pressure head 450, and the suction nozzle 460 is arranged therein. The suction nozzle 460 is suitable for stimulating negative pressure inside the adsorption hole 451, so that the pressure head 450 adsorbs the isolation material, and the clamping part removes it.

[0127] Furthermore, the present invention provides a marking method, comprising the following steps:

[0128] S100, the semiconductor device 700 to be manufactured is loaded into the first storage device 300;

[0129] In this step, the lock 340 is unsealed, and the material box 330 fully loaded with semiconductor devices 700 to be manufactured is deployed on the first base frame 310 from the open side of the first base frame 310; then, the lock 340 blocks the open side of the first base frame 310 to stabilize the material box 330 relative to the first base frame 310.

[0130] S200, the loading mechanism 220 is transferred to the loading station by the conveying module 210; the semiconductor device 700 to be manufactured is transferred from the first storage device 300 to the loading mechanism 220 by the first transfer device 400;

[0131] In this step, the second fixture 430 is transferred to dock with the first storage device 300 by the transfer module 410 to obtain the semiconductor device 700 to be manufactured; then, the second fixture 430 is transferred to the loading station by the conveying module 210 to transfer the semiconductor device 700 to be manufactured to the loading mechanism 220.

[0132] S300, the loading mechanism 220 is transferred to the processing station through the conveying module 210;

[0133] In this step, the loading mechanism 220 is transferred to a lower portion of a brush roller mechanism 150 by the conveying module 210 ; the brush roller mechanism 150 cleans the semiconductor device 700 to be manufactured or any dirt thereon before processing.

[0134] S400, the marking mechanism 110 marks the semiconductor device 700 with a laser; the dust blowing mechanism 120 and the dust collecting mechanism cooperate to clean the dust generated by the marking.

[0135] S500, after processing is completed, the loading mechanism 220 is transferred to the unloading station through the conveying module 210;

[0136] In this step, the loading mechanism 220 is transferred to the bottom of another brush roller mechanism 150 by the conveying module 210; the brush roller mechanism 150 cleans the semiconductor device 700 after processing or the dust that is difficult to be cleaned by the dust blowing mechanism 120.

[0137] S600 , the manufactured semiconductor device 700 is transferred from the loading mechanism 220 to the second storage device 500 by the second transfer device 600 .

[0138] Furthermore, the present invention provides a packaging system for connecting a bare die to a substrate to form a semiconductor device, including a die bonding device (not shown), the aforementioned marking device, and a bonding device (not shown).

[0139] When working, first use the die bonding equipment to pick up the bare die from the cut single wafer and connect it to the substrate; then use the marking equipment to mark the pins; finally, use the bonding equipment to achieve electrical connection between the bare die and the substrate based on the pins.

[0140] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A marking device, characterized in that: include: A conveying device (200) comprises a conveying module (210) and a loading mechanism (220) for supporting a semiconductor device (700); By means of the conveying module (210), the loading mechanism (220) is suitable for sequentially transferring to the loading station, the processing station, and the unloading station along the first horizontal direction; A marking device (100) is suitable for marking a semiconductor device (700) in the processing station by laser, comprising a marking mechanism (110), a dust cover (140), and a dust blowing mechanism (120) and a dust suction mechanism provided on the dust cover (140); The loading unit comprises a first material storage device (300) for storing the semiconductor device (700) to be manufactured and a first circulation device (400); the semiconductor device (700) to be manufactured is transferred from the first material storage device (300) to the loading mechanism (220) by means of the first circulation device (400); The unloading unit comprises a second material storage device (500) for storing the manufactured semiconductor devices (700) and a second transfer device (600); the manufactured semiconductor devices (700) are transferred from the loading mechanism (220) to the second material storage device (500) via the second transfer device (600); The dust cover (140) is located above the conveying device (200) and has a window (141) at the bottom. When the loading mechanism (220) supporting the semiconductor device (700) is in the processing station, the loading mechanism (220) is blocked below the window (141), and the window (141) is suitable for covering the semiconductor device (700).

2. The marking device according to claim 1, characterized in that: The dust suction mechanism comprises a first dust suction head (131); the first dust suction head (131) and the dust blowing mechanism (120) are arranged at the window (141) and are arranged relative to each other along a second horizontal direction perpendicular to the first horizontal direction, so that a processing area sufficient to avoid the semiconductor device (700) is formed between the first dust suction head (131) and the dust blowing mechanism (120); when the loading mechanism (220) is in the processing station, the semiconductor device (700) is located in the processing area and is adjacent to the first dust suction head (131) and the dust blowing mechanism (120).

3. The marking device according to claim 2, characterized in that: The marking device (100) comprises a brush roller mechanism (150); the brush roller mechanism (150) is two in number and is respectively arranged on both sides of the dust cover (140) along the first horizontal direction to clean the semiconductor device (700) before and after processing; the dust suction mechanism comprises a second dust suction head (132) corresponding one-to-one to the brush roller mechanism (150).

4. The marking device according to claim 1, characterized in that: The conveying device (200) comprises a lifting module (230) arranged between the loading mechanism (220) and the conveying module (210), and the lifting module (230) is suitable for lifting / lowering the loading mechanism (220) in a vertical direction.

5. The marking device according to claim 2, characterized in that: The loading mechanism (220) comprises: A carrier (221), comprising a platform (2211) for supporting a semiconductor device (700); A first clamp (222) is movably connected to the carrier (221), two in number, and arranged relatively along the second horizontal direction; A linkage assembly (223) movably disposed on the carrier (221); A second lifting drive member (224) is drivingly connected to the linkage assembly (223); The second lifting drive member (224) is suitable for pushing / pulling the linkage assembly (223), so that the linkage assembly (223) is suitable for pulling the first clamp (222) to move it closer to the platform (2211) to restrict the semiconductor device (700), or away from the platform (2211) to release the semiconductor device (700).

6. The marking device according to claim 5, characterized in that: The first clamp (222) includes a special-shaped plate (2223) located above the platform (2211) and used for contacting the semiconductor device (700); when the loading mechanism (220) is in the processing station, the special-shaped plates (2223) of the first clamp (222) are respectively located directly below the first dust suction head (131) and the dust blowing mechanism (120), and the special-shaped plate (2223) gradually increases in height from the contact portion with the semiconductor device (700) to the relative portion of the contact portion along the second horizontal direction.

7. The marking device according to claim 1, characterized in that: The first material storage device (300) and the second material storage device (500) have similar structures. The first material storage device (300) comprises: A first base frame (310), one side of which is open along the first horizontal direction; An anti-slip device (320) is provided on the opposite side of the first base frame (310) along the first horizontal direction; A material box (330) is detachably mounted on the first base frame (310) and is suitable for allowing a plurality of semiconductor devices (700) to be stacked and arranged therein; The lock (340) is arranged on the first base frame (310) and is suitable for sealing the open side of the first base frame (310) so that the material box (330) is stable relative to the first base frame (310); when unsealed, the material box (330) is suitable for moving relative to the first base frame (310) along the first horizontal direction.

8. The marking device according to claim 1, characterized in that: The first circulation device (400) and the second circulation device (600) have similar structures. The first circulation device (400) comprises: Transfer module (410); A third base frame (420) connected to the transfer module (410); The adjusting mechanism (440) is arranged on the third base frame (420), and comprises a first deployment member (441), a second deployment member (442) and an adjusting assembly (443); the first deployment member (441) and the second deployment member (442) are relatively deployed along the second horizontal direction; by means of the adjusting assembly (443), the first deployment member (441) and the second deployment member (442) are suitable for moving toward or away from each other; The second clamp (430) comprises a first clamping member (431), a second clamping member (432) and a linear driving member (433), wherein the number of the linear driving members (433) is two, which are respectively arranged on the first deployment member (441) and the second deployment member (442), and are transmission-connected with the first clamping member (431) and the second clamping member (432); A pressing head (450) is provided on the third base frame (420), located between the first clamping member (431) and the second clamping member (432), and is suitable for contacting the semiconductor device (700) to prevent the semiconductor device from warping and deforming; The bottom surface of the pressure head (450) is recessed in a vertical direction to form a suction hole (451), and the suction nozzle (460) is disposed at the suction hole (451).

9. A marking method, characterized in that: The steps include: S100, loading the semiconductor device (700) to be manufactured into the first material storage device (300); S200, the loading mechanism (220) is transferred to the loading station by means of a conveying module (210); the semiconductor device (700) to be manufactured is transferred from the first storage device (300) to the loading mechanism (220) by means of a first transfer device (400); S300, the loading mechanism (220) is transferred to the processing station by the conveying module (210); S400, the marking mechanism (110) marks the semiconductor device (700) with a laser, and the dust blowing mechanism (120) and the dust collecting mechanism cooperate to clean dust generated by the marking; S500, after the processing is completed, the loading mechanism (220) is transferred to the unloading station by the conveying module (210); S600, the manufactured semiconductor device (700) is transferred from the loading mechanism (220) to the second storage device (500) by means of the second transfer device (600).

10. A packaging system, characterized in that: Comprising a marking device as described in any one of claims 1 to 8.

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