Lifting device for semiconductor processing equipment and semiconductor processing equipment

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and discloses a lifting device for semiconductor processing equipment and semiconductor processing equipment. The lifting device for semiconductor processing equipment comprises a base and a gantry, and the gantry is arranged on the upper end surface of the base; the lifting component comprises a driving screw rotatably connected to the gantry, and a rotation auxiliary mechanism comprises two groups of rotating support components rotatably connected to the lifting platform. Through the structure of the driving screw being slidably connected to the lifting platform, combined with the precise drive of a first driving motor, the lifting platform is lifted and lowered along the gantry. The rotation auxiliary mechanism realizes the smooth rotation of the rotating disk through the cooperation of two groups of telescopic shafts and a second driving motor, and can dynamically adjust the axis angle of the rotating disk when the lifting platform moves, thereby ensuring the stability of the rotating platform at different heights. The telescopic shaft provides additional support to the lifting platform while realizing the rotation function, thereby further enhancing the stability of the platform during lifting and rotating processing.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a lifting device for semiconductor processing equipment and semiconductor processing equipment. Background Art

[0002] With the rapid development of the semiconductor industry, the precision and efficiency of semiconductor manufacturing processes are constantly improving, especially in the processing of silicon wafers, the requirements for equipment are becoming increasingly stringent. In semiconductor equipment, lifting and rotation functions are important mechanical operation requirements, especially in processes such as epitaxial growth, etching, and thin film deposition. Precise control of the position, lifting, and rotation of silicon wafers is crucial to improving product quality and production efficiency. Therefore, the development of more efficient, stable, and precise lifting devices has become a key technology in the field of semiconductor processing equipment.

[0003] However, in existing semiconductor manufacturing equipment, a lifting device that uses a cylinder and a slide rail structure is generally used, and the lifting and rotation mechanisms of traditional lifting devices usually work independently. Therefore, in actual operation, the coordination between the lifting process and the rotation process required by the process is poor, which can easily lead to unstable equipment operation, and then cause slight offsets and uneven rotations during silicon wafer processing, thereby affecting the processing accuracy and yield of the final product.

[0004] Therefore, it is necessary to provide a lifting device for semiconductor processing equipment and semiconductor processing equipment to solve the problem of unstable operation of the above equipment. Summary of the invention

[0005] The main purpose of the present invention is to provide a lifting device for semiconductor processing equipment and semiconductor processing equipment, aiming to solve the technical problems mentioned in the above background technology.

[0006] The present invention adopts the following technical solutions:

[0007] A lifting device for semiconductor processing equipment, comprising:

[0008] A base and a gantry, wherein the gantry is arranged on the upper end surface of the base;

[0009] A lifting assembly, comprising a driving screw rotatably connected to the gantry, the driving screw extending along the height direction of the gantry, the bottom end of the driving screw connected to the output shaft of the first driving motor, and the driving screw threadedly connected to the lifting platform, the lifting platform is slidably connected to the gantry through the driving screw;

[0010] The rotation auxiliary mechanism includes two groups of rotation support components rotatably connected to the lifting platform, the rotation support components include a telescopic shaft, the bottom end of the telescopic shaft is rotatably connected to the base, the two groups of telescopic shafts are connected to the output shaft of the second drive motor, and the top ends of the two groups of telescopic shafts are provided with rotating disks, and the rotating disks are used to clamp and rotate silicon wafers, wherein when the lifting platform slides along the gantry, the angle between the axis of the telescopic shaft and the axis of the drive screw increases or decreases.

[0011] Furthermore, there are two driving screws, which are rotatably connected to the opposite sides of the gantry respectively, and the bottom end of the driving screw is fixedly connected to a first sprocket, the outer side of the first sprocket is connected to a driving chain, and the two first sprockets are both arranged on the inner side of the driving chain, and the driving chain is connected to the output shaft of the first driving motor.

[0012] Furthermore, a support member is provided on the upper end surface of the base, and the support member is rotatably connected to a transition sprocket, the transition sprocket is connected to the drive chain, the transition sprocket penetrates the base and is fixedly connected to a transmission pulley, the output shaft of the first drive motor is fixedly connected to a drive pulley, and a drive belt is provided on the outer side of the transmission pulley and the drive pulley, wherein the diameter of the transmission pulley is larger than the diameter of the drive pulley.

[0013] Further, a bracket is fixedly connected to the bottom end of the first driving motor, the bracket is fixedly connected to the base, the driving pulley is arranged below the bracket, and the driving pulley and the transmission pulley are arranged on the same horizontal plane;

[0014] The bracket is provided with an adjusting sprocket on one side facing the driving chain, the adjusting sprocket is connected to the driving chain, the bottom end of the adjusting sprocket is connected to an adjusting block, the adjusting block is provided with a plurality of waist-shaped holes, and the adjusting block is fixedly connected to the base through the waist-shaped holes.

[0015] Further, the telescopic shaft comprises an outer shaft and an inner shaft, the outer shaft is provided with a sliding cavity, the inner shaft is slidably connected to the sliding cavity, the inner diameter of the sliding cavity is equal to the outer diameter of the inner shaft, and an elastic member is connected between the inner shaft and the bottom wall of the sliding cavity;

[0016] The outer shaft is provided with a limiting hole along the sliding cavity, and the inner shaft is penetrated by a sliding connection piece, and the sliding connection piece is slidably connected with the limiting hole.

[0017] Furthermore, both ends of the telescopic shaft are connected with universal joints, the outer shaft is connected to the rotating disk through the universal joints, and the inner shaft is connected to the output shaft of the second drive motor through the universal joints, so that when the axis of the telescopic shaft and the axis of the driving screw change, the axis of the rotating disk remains parallel to the axis of the driving screw.

[0018] Furthermore, a connecting seat is also provided on the upper end surface of the base, the connecting seat is rotatably connected to a second sprocket, the inner shaft is fixedly connected to the second sprocket via the universal joint, the base is also rotatably connected to a rotating sprocket, and the second sprocket and the outer side of the rotating sprocket are connected to a rotating chain;

[0019] The output shaft of the second driving motor is connected to a gearbox, the output shaft of the gearbox and the bottom end of the rotating sprocket are both connected to synchronous wheels, and the outer sides of the two synchronous wheels are connected to synchronous belts.

[0020] Further, the upper end surface of the rotating sprocket is connected to a first gear coaxially arranged with the rotating sprocket, one side of the first gear is connected to a second gear, and the upper end surface of the second gear is fixedly connected to an auxiliary rotating rod coaxially arranged with the driving screw;

[0021] The auxiliary rotating rod penetrates the lifting platform, and the auxiliary rotating rod sleeve is provided with a clamping turntable and a thrust bearing, the bottom end of the thrust bearing is fixedly connected to the lifting platform, the rotating end of the thrust bearing is fixedly connected to the clamping turntable, and the inner side of the rotating end of the thrust bearing is fixedly connected to the auxiliary rotating rod.

[0022] Furthermore, a hydrodynamic bearing is provided on the upper end surface of the lifting platform, and the upper end surface of the hydrodynamic bearing is connected to a supporting plate coaxially arranged with the hydrodynamic bearing, and the distance from the axis of the supporting plate to the outer side of the rotating plate is equal to the distance from the axis of the supporting plate to the outer side of the pressing turntable.

[0023] Furthermore, a locking block is fixedly connected to one side of the gantry close to the driving screw, and the upper end surface of the locking block is flush with the upper end surface of the driving screw;

[0024] A visual inspection module is provided on one side of the gantry. When the upper end surface of the lifting platform abuts against the locking block, the upper end surface of the carrier plate enters the scanning area of ​​the visual inspection module, so that the visual inspection module scans the silicon wafer.

[0025] The present invention also proposes a semiconductor processing equipment, including the lifting device of the semiconductor processing equipment as described above, and also including a processing chamber and a reaction chamber, the lifting device is arranged in the processing chamber, the reaction chamber is arranged above the lifting device, and a robotic arm is also arranged on one side of the lifting device to transfer silicon wafers.

[0026] Beneficial effects:

[0027] In the present invention, by setting a structure in which a driving screw is slidably connected to the lifting platform, combined with the precise drive of the first driving motor, the lifting platform can realize stable and high-precision lifting movement along the gantry. The rotation auxiliary mechanism realizes the smooth rotation of the rotating disk through the cooperation of two sets of telescopic shafts and the second driving motor, and can dynamically adjust the axial angle of the rotating disk when the lifting platform moves, ensuring the stability of the rotating platform at different heights. At the same time, the telescopic shaft provides additional support to the lifting platform while realizing the rotation function, further enhancing the stability of the platform lifting process, effectively ensuring the stability and precision of the silicon wafer during rotation processing, and enabling the lifting and rotation processes to be coordinated and carried out simultaneously, thereby improving the overall operating performance and processing accuracy of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of a lifting device for semiconductor processing equipment of the present invention;

[0029] Figure 2 is a schematic structural diagram of a rotary support assembly of the present invention;

[0030] Figure 3 It is a partial structural schematic diagram of the lifting assembly of the present invention;

[0031] Figure 4 is a structural schematic diagram of the rotation assist mechanism of the present invention;

[0032] Figure 5 It is a schematic diagram of the overall structure of a lifting device of a semiconductor processing equipment according to the present invention in another direction;

[0033] Among them: 1. base; 2. gantry; 3. lifting assembly; 301. driving screw; 302. first driving motor; 303. lifting platform; 304. first sprocket; 305. driving chain; 306. support; 307. transition sprocket; 308. driving pulley; 309. driving pulley; 310. driving belt; 311. bracket; 312. adjusting sprocket; 313. adjusting block; 4. rotation auxiliary mechanism; 410. rotating support assembly; 411. telescopic shaft; 4 12. Rotating disk; 413. Outer shaft; 414. Inner shaft; 415. Limiting hole; 416. Sliding connector; 417. Universal joint; 418. Second sprocket; 420. Second drive motor; 430. Rotating sprocket; 440. Rotating chain; 450. Gearbox; 460. Synchronous wheel; 470. Synchronous belt; 480. First gear; 490. Auxiliary rotating rod; 500. Pressing against the rotating disk; 510. Thrust bearing; 6. Carrying disk; 7. Locking block; 8. Visual inspection module.

[0034] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0035] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] Reference Figures 1 to 5 The present invention proposes a lifting device for semiconductor processing equipment, comprising: a base 1 and a gantry 2, wherein the gantry 2 is arranged on the upper end surface of the base 1; a lifting assembly 3, comprising a driving screw 301 rotatably connected to the gantry 2, wherein the driving screw 301 is extended along the height direction of the gantry 2, wherein the bottom end of the driving screw 301 is connected to the output shaft of a first driving motor 302, and the driving screw 301 is threadedly connected to a lifting platform 303, wherein the lifting platform 303 is slidably connected to the gantry 2 via the driving screw 301; a rotation auxiliary mechanism 4, comprising Two groups of rotating support assemblies 410 are rotatably connected to the lifting platform 303, and the rotating support assembly 410 includes a telescopic shaft 411. The bottom end of the telescopic shaft 411 is rotatably connected to the base 1. The two groups of telescopic shafts 411 are connected to the output shaft of the second drive motor 420, and the top ends of the two groups of telescopic shafts 411 are provided with a rotating disk 412, and the rotating disk 412 is used to clamp and rotate the silicon wafer. When the lifting platform 303 slides along the gantry 2, the angle between the axis of the telescopic shaft 411 and the axis of the drive screw 301 increases or decreases.

[0040] In the above embodiment, the gantry 2 is firmly arranged on the upper end surface of the base 1, serving as a support and guide frame for the overall structure, and providing a stable foundation for the precise movement of the lifting device. The lifting assembly 3 is rotatably connected to the gantry 2 through the driving screw 301, and the driving screw 301 extends along the height direction of the gantry 2, and its bottom end is connected to the output shaft of the first driving motor 302. Driven by the first driving motor 302, the driving screw 301 can generate rotational motion in the axial direction, and at the same time, the threaded lifting platform 303 can achieve smooth sliding along the height direction of the gantry 2 through the rotational motion, which not only makes the lifting motion more stable, but also realizes high-precision positioning of the lifting platform 303 through the threaded transmission characteristics of the screw, thereby meeting the stringent requirements of semiconductor processing for silicon wafer position adjustment.

[0041] On the basis of the lifting platform 303, the rotation auxiliary mechanism 4 provides further support for the lifting platform 303 through two sets of rotation support components 410. The two sets of rotation support components 410 are respectively connected to the lifting platform 303 in rotation, and the bottom end of the telescopic shaft 411 is connected to the base 1 in rotation, and the top end thereof clamps the silicon wafer through the rotating disk 412. The design of the rotating disk 412 enables the silicon wafer to achieve stable rotation during the processing, and the telescopic shaft 411 is connected to the output shaft of the second drive motor 420, and the precise rotation control of the shaft is achieved through the drive of the motor.

[0042] When the lifting platform 303 slides along the gantry 2, the axis of the telescopic shaft 411 will be dynamically adjusted according to the position of the platform, and the angle formed with the axis of the driving screw 301 will increase or decrease. The dynamic adjustment mechanism enables the rotating disk 412 to always maintain a good balance state, thereby avoiding the problem of uneven rotation due to height changes. At the same time, the telescopic shaft 411 not only provides rotation support, but also forms a certain structural support for the lifting platform 303, making the lifting platform 303 more stable during movement, further improving the overall operational reliability of the device.

[0043] In practical applications, the device achieves high-precision operation of silicon wafers during lifting and rotating processes through the coordinated work of the lifting assembly 3 and the rotation auxiliary mechanism 4. The stable movement of the lifting platform 303 combined with the precise rotation of the rotating disk 412 enables silicon wafers to perform process operations such as epitaxial growth, thin film deposition or etching in a preset posture, effectively improving processing accuracy and product yield. In addition, the dynamically adjusted rotating support mechanism ensures the processing consistency of silicon wafers at different heights, avoiding the problem of silicon wafer offset or rotation instability caused by the structural limitations of traditional equipment.

[0044] To summarize, by setting up a structure in which the driving screw 301 is slidably connected with the lifting platform 303, combined with the precise drive of the first driving motor 302, the lifting platform 303 can realize stable and high-precision lifting movement along the gantry 2. The rotation auxiliary mechanism 4 realizes the smooth rotation of the rotating disk 412 through the cooperation of two sets of telescopic shafts 411 and the second driving motor 420, and can dynamically adjust the axial angle of the rotating disk 412 when the lifting platform 303 moves, ensuring the stability of the rotating platform at different heights. At the same time, the telescopic shaft 411 provides additional support to the lifting platform 303 while realizing the rotation function, further enhancing the stability of the platform lifting process, effectively ensuring the stability and precision of the silicon wafer during rotation processing, and enabling the lifting and rotation processes to be coordinated and carried out simultaneously, thereby improving the overall operating performance and processing accuracy of the equipment.

[0045] refer to Figure 1 and Figure 3 In one embodiment, the number of the driving screws 301 is two, and the two driving screws 301 are rotatably connected to the opposite sides of the gantry 2 respectively, and the bottom end of the driving screw 301 is fixedly connected to a first sprocket 304, and the outer side of the first sprocket 304 is connected to a driving chain 305, and the two first sprockets 304 are both arranged on the inner side of the driving chain 305, and the driving chain 305 is connected to the output shaft of the first driving motor 302.

[0046] In the above embodiment, the number of the driving lead screws 301 is two, which are respectively installed on both sides of the inner side of the gantry 2, and the rotation connection with the gantry 2 through the bearing ensures the smooth lifting of the lifting platform 303. The bottom of each driving lead screw 301 is firmly connected to a first sprocket 304, and the two first sprockets 304 are arranged on the inner side of a driving chain 305. The driving chain 305 connects the two sprockets tightly in series to form a coordinated power transmission system. The driving chain 305 is directly connected to the output shaft of the first driving motor 302, and the power provided by the first driving motor 302 is accurately transmitted to the two sprockets through the chain, thereby driving the two driving lead screws 301 to rotate synchronously. The efficient transmission of power is achieved, and the stability and accuracy of the lifting platform 303 during the lifting process are also ensured, avoiding the lifting error caused by uneven power or transmission lag, and further improving the precision of silicon wafer processing and the overall performance of the equipment.

[0047] In one example, a support member 306 is provided on the upper end surface of the base 1, and the support member 306 is rotatably connected to a transition sprocket 307, and the transition sprocket 307 is connected to the drive chain 305. The transition sprocket 307 penetrates the base 1 and is fixedly connected to a transmission pulley 308, and the output shaft of the first drive motor 302 is fixedly connected to a drive pulley 309, and a drive belt 310 is provided on the outer side of the drive pulley 308 and the drive pulley 309, wherein the diameter of the drive pulley 308 is larger than the diameter of the drive pulley 309.

[0048] refer to Figure 3 and Figure 5 In the above embodiment, a support member 306 is installed on the upper surface of the base 1, and a bearing is perforated in the support member 306 so that the support member 306 can be rotatably connected to a transition sprocket 307, and the transition sprocket 307 is connected to the drive chain 305 to ensure the transmission of power. The transition sprocket 307 penetrates the base 1 and is fixedly connected to the transmission pulley 308. A driving pulley 309 is fixedly connected to the output shaft of the first drive motor 302, and a driving belt 310 is sleeved between the driving pulley 309 and the driving pulley 308 to achieve power output. The diameter of the driving pulley 308 is larger than the diameter of the driving pulley 309, so that the power can be effectively decelerated and torque-increased during the transmission process, thereby ensuring the stability and reliability of the lifting platform 303 during the lifting process.

[0049] refer to Figure 3 In one embodiment, the bottom end of the first driving motor 302 is fixedly connected with a bracket 311, the bracket 311 is fixedly connected to the base 1, the driving pulley 309 is arranged below the bracket 311, and the driving pulley 309 and the transmission pulley 308 are arranged on the same horizontal plane;

[0050] The bracket 311 is provided with an adjusting sprocket 312 on one side facing the driving chain 305, and the adjusting sprocket 312 is connected to the driving chain 305. The bottom end of the adjusting sprocket 312 is connected to an adjusting block 313, and the adjusting block 313 is provided with a plurality of waist-shaped holes. The adjusting block 313 is fixedly connected to the base 1 through the waist-shaped holes.

[0051] In the above embodiment, the first driving motor 302 is mounted on the bracket 311, and the bracket 311 is fastened to the base 1, ensuring the overall stability of the driving system. The driving pulley 309 is arranged below the bracket 311, that is, the first driving motor 302 is inverted, and the driving pulley 309 and the transmission pulley 308 are in the same horizontal plane, which optimizes the power transmission path and reduces energy loss. An adjusting sprocket 312 is arranged on the side of the bracket 311 close to the chain, and the adjusting sprocket 312 is connected to the driving chain 305 to provide fine adjustment for the transmission system. The bottom end of the adjusting sprocket 312 is connected to the adjusting block 313, and a plurality of waist-shaped holes are provided on the adjusting block 313. The waist-shaped holes allow the adjusting block 313 to move within a certain range, and are fixedly connected to the base 1 through fasteners such as bolts. By adjusting the position of the adjusting block 313 in the waist-shaped hole, the tension of the driving chain 305 is changed, thereby optimizing the operating efficiency and stability of the entire lifting device.

[0052] refer to Figure 2 In one embodiment, the telescopic shaft 411 includes an outer shaft 413 and an inner shaft 414, the outer shaft 413 is provided with a sliding cavity, the inner shaft 414 is slidably connected to the sliding cavity, the inner diameter of the sliding cavity is equal to the outer diameter of the inner shaft 414, and an elastic member is connected between the inner shaft 414 and the bottom wall of the sliding cavity;

[0053] The outer shaft 413 is provided with a limiting hole 415 along the sliding cavity, and the inner shaft 414 is penetrated by a sliding connection member 416 , and the sliding connection member 416 is slidably connected with the limiting hole 415 .

[0054] In the above embodiment, the telescopic shaft 411 includes an outer shaft 413 and an inner shaft 414. The sliding cavity provided inside the outer shaft 413 provides a precise sliding track for the inner shaft 414. The inner diameter of the sliding cavity matches the outer diameter of the inner shaft 414, which reduces friction, improves the smoothness of sliding, and does not cause looseness. The elastic member connected between the top of the inner shaft 414 and the bottom wall of the sliding cavity is preferably configured as a compression spring, which gives the inner shaft 414 a certain buffering capacity, and can maintain a stable motion trajectory when subjected to external forces. The limiting hole 415 provided on the outer shaft 413 cooperates with the sliding connector 416 provided on the inner shaft 414, which not only limits the excessive movement of the inner shaft 414 and keeps the inner shaft 414 and the outer shaft 413 rotating synchronously, but also ensures the precise sliding of the inner shaft 414 within a predetermined range, so that the telescopic shaft 411 can be precisely adjusted according to actual needs.

[0055] In one embodiment, both ends of the telescopic shaft 411 are connected to universal joints 417, the outer shaft 413 is connected to the rotating disk 412 through the universal joints 417, and the inner shaft 414 is connected to the output shaft of the second driving motor 420 through the universal joints 417, so that when the axis of the telescopic shaft 411 and the axis of the driving screw 301 change, the axis of the rotating disk 412 remains parallel to the axis of the driving screw 301.

[0056] In the above embodiment, the flexibility of the universal joint 417 ensures that even if the angle between the axis of the telescopic shaft 411 and the axis of the driving screw 301 changes, the axis of the rotating disk 412 can always remain parallel to the axis of the driving screw 301. The outer shaft 413 is connected to the rotating disk 412 through the universal joint 417, and the inner shaft 414 is indirectly connected to the output shaft of the second driving motor 420 through the universal joint 417, so that the inner shaft 414 can rotate under the drive of the second driving motor 420 and then drive the outer shaft 413 to rotate and drive the rotating disk to rotate.

[0057] refer to Figure 1 , Figure 2 and Figure 5 In one embodiment, the upper end surface of the base 1 is further provided with a connecting seat, the connecting seat is rotatably connected to the second sprocket 418, the inner shaft 414 is fixedly connected to the second sprocket 418 through the universal joint 417, the base 1 is further rotatably connected to a rotating sprocket 430, and the outer sides of the second sprocket 418 and the rotating sprocket 430 are connected to a rotating chain 440;

[0058] The output shaft of the second driving motor 420 is connected to a gearbox 450 , the output shaft of the gearbox 450 and the bottom end of the rotating sprocket 430 are both connected to synchronous wheels 460 , and the outer sides of the two synchronous wheels 460 are connected to synchronous belts 470 .

[0059] In the above embodiment, the connecting seat is installed on the upper end surface of the base 1, and is used to support the second sprocket 418. The connecting seat rotates with the second sprocket 418 through a bearing. Furthermore, the inner shaft 414 is connected to the second sprocket 418 through a universal joint 417. A rotating sprocket 430 is also provided on the base 1. The rotating sprocket 430 is connected to the second sprocket 418 through a rotating chain 440, forming a stable transmission system.

[0060] The output shaft of the second drive motor 420 is adjusted in speed and torque through the gearbox 450 to meet specific drive requirements. The output shaft of the gearbox 450 and the bottom end of the rotating sprocket 430 are both equipped with synchronous wheels 460 of the same diameter. The synchronous belts 470 on the outside of the two synchronous wheels 460 ensure the synchronous movement between the synchronous wheels 460, which not only enhances the stability of the transmission, but also effectively reduces the vibration and noise caused by the asynchronism.

[0061] refer to Figure 4 In one embodiment, the upper end surface of the rotating sprocket 430 is connected to a first gear 480 coaxially arranged with the rotating sprocket 430, a second gear is connected to one side of the first gear 480, and the upper end surface of the second gear is fixedly connected to an auxiliary rotating rod 490 coaxially arranged with the driving screw 301;

[0062] The auxiliary rotating rod 490 penetrates the lifting platform 303, and the auxiliary rotating rod 490 is provided with a clamping turntable 500 and a thrust bearing 510, the bottom end of the thrust bearing 510 is fixedly connected to the lifting platform 303, the rotating end of the thrust bearing 510 is fixedly connected to the clamping turntable 500, and the inner side of the rotating end of the thrust bearing 510 is fixedly connected to the auxiliary rotating rod 490.

[0063] In the above embodiment, the upper end of the rotating sprocket 430 is connected to a first gear 480 coaxially arranged therewith. One side of the first gear 480 is tightly connected to the second gear, and the meshing between the two is accurate and correct, so as to realize the smooth transmission of power. The upper end surface of the second gear is firmly fixedly connected to an auxiliary rotating rod 490 coaxially arranged with the driving screw 301. The auxiliary rotating rod 490 penetrates the lifting platform 303 and is sleeved with a tight rotating disk 500 and a thrust bearing 510. The bottom end of the thrust bearing 510 is fixed on the lifting platform 303, and its rotating end is connected to the tight rotating disk 500, which not only ensures the stability of the auxiliary rotating rod 490 during the rotation process, but also effectively reduces the loss caused by friction. At the same time, the inner side of the rotating end of the thrust bearing 510 is fixedly connected to the auxiliary rotating rod 490, so that the rotating end of the thrust bearing 510 can rotate under the drive of the auxiliary rotating rod 490, thereby driving the tight rotating disk 500 to rotate.

[0064] refer to Figure 1 In one embodiment, a hydrodynamic bearing is disposed on the upper end surface of the lifting platform 303, and the upper end surface of the hydrodynamic bearing is connected to a supporting plate 6 coaxially arranged with the hydrodynamic bearing, and the distance from the axis of the supporting plate 6 to the outer side of the rotating plate 412 is equal to the distance from the axis of the supporting plate 6 to the outer side of the pressing turntable 500.

[0065] In the above embodiment, the hydrodynamic bearing maintains the rotational balance between the carrier plate 6, the rotating plate 412 and the abutting turntable 500. The coaxial arrangement of the carrier plate 6 and the hydrodynamic bearing ensures the stability of the load during the lifting process and reduces the vibration caused by the offset. At the same time, the distance from the axis of the carrier plate 6 to the outside of the rotating plate 412 and the outside of the abutting turntable 500 is equal, so that when the silicon wafer rotates with the axis of the carrier plate 6, it can be rotated by the fit of the rotating plate 412 and the abutting turntable 500. Not only does it optimize the mechanical structure of the lifting platform 303, but it also makes the application of the lifting device in semiconductor processing equipment more flexible and can adapt to the processing requirements of workpieces of different sizes and weights.

[0066] refer to Figure 1 In one embodiment, a locking block 7 is fixedly connected to one side of the gantry 2 close to the driving screw 301, and the upper end surface of the locking block 7 is flush with the upper end surface of the driving screw 301;

[0067] A visual inspection module 8 is provided on one side of the gantry 2. When the upper end surface of the lifting platform 303 abuts against the locking block 7, the upper end surface of the carrier plate 6 enters the scanning area of ​​the visual inspection module 8, so that the visual inspection module 8 scans the silicon wafer.

[0068] In the above embodiment, the locking block 7 is fixedly connected to one side of the gantry 2 close to the driving screw 301, and its upper end surface remains flush with the upper end surface of the driving screw 301, ensuring that the lifting platform 303 can accurately abut against the locking block 7 when it rises to the specified position, thereby achieving stable positioning of the lifting platform 303.

[0069] At the same time, when the upper end surface of the lifting platform 303 abuts against the locking block 7, the upper end surface of the carrier plate 6 just enters the scanning range of the visual inspection module 8. The visual inspection module 8 can scan the silicon wafer with high precision and quickly and accurately detect the size, shape and surface defects of the silicon wafer, thereby ensuring the quality of the silicon wafer during the semiconductor processing process.

[0070] The present invention also provides a semiconductor processing equipment, including the lifting device of the semiconductor processing equipment as described above, and also including a processing chamber and a reaction chamber, the lifting device is arranged in the processing chamber, the reaction chamber is arranged above the lifting device, and a robotic arm is also arranged on one side of the lifting device to transfer silicon wafers.

[0071] In the above embodiment, the semiconductor processing equipment integrates the aforementioned lifting device to form an efficient and precise processing system. The processing chamber provides a closed and clean environment for silicon wafer processing, reducing the interference of external factors on the processing process. The reaction chamber is located above the lifting device and is used to perform process steps such as epitaxial growth, thin film deposition or etching.

[0072] The layout of the lifting device in the processing chamber ensures that the silicon wafer can be accurately processed at different heights. When the silicon wafer is placed on the lifting platform 303, the lifting assembly 3 will start working according to the preset program, and the driving screw 301 will rotate under the drive of the first driving motor 302, and the lifting height of the lifting platform 303 will be accurately controlled through the chain transmission system. In this process, the smooth rotation of the driving screw 301 and the efficient transmission of the chain jointly ensure the stability and accuracy of the lifting platform 303.

[0073] At the same time, the rotation auxiliary mechanism 4 also plays an important role. After the second drive motor 420 adjusts the speed and torque through the gearbox 450, it drives the rotating sprocket 430 to rotate through the synchronous belt 470 and the synchronous wheel 460 system, thereby driving the second sprocket 418 to rotate. The second sprocket 418 is connected to the inner shaft 414 of the telescopic shaft 411 through the universal joint 417, and the outer shaft 413 of the telescopic shaft 411 is fixedly connected to the rotating disk 412. Therefore, when the second drive motor 420 is working, it will drive the rotating disk 412 to rotate smoothly, realizing the rotation operation of the silicon wafer during the processing process.

[0074] The setting of the robotic arm further improves the automation level of the equipment. The robotic arm can accurately grasp, move and place the silicon wafer during the processing, reducing the need for manual intervention. When the silicon wafer completes the current processing step, the robotic arm will take it out from the lifting platform 303 and then send it to the next processing station or perform other necessary processing.

[0075] In summary, the semiconductor processing equipment forms an efficient, precise and automated processing system by integrating key components such as lifting devices, processing chambers, reaction chambers and robotic arms. The system can meet the high-precision and high-quality requirements of silicon wafers in the semiconductor processing process, and improve the processing efficiency and product yield.

[0076] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A lifting device for semiconductor processing equipment, characterized in that: include: A base (1) and a gantry (2), wherein the gantry (2) is arranged on the upper end surface of the base (1); A lifting assembly (3), comprising a driving screw (301) rotatably connected to the gantry (2), the driving screw (301) extending in a height direction of the gantry (2), the bottom end of the driving screw (301) connected to an output shaft of a first driving motor (302), and the driving screw (301) being threadedly connected to a lifting platform (303), the lifting platform (303) being slidably connected to the gantry (2) via the driving screw (301); A rotation auxiliary mechanism (4), comprising two groups of rotation support assemblies (410) rotatably connected to the lifting platform (303), the rotation support assemblies (410) comprising telescopic rotating shafts (411), the bottom ends of the telescopic rotating shafts (411) being rotatably connected to the base (1), the two groups of telescopic rotating shafts (411) being connected to the output shaft of the second drive motor (420), and the top ends of the two groups of telescopic rotating shafts (411) being provided with rotating disks (412), the rotating disks (412) being used to clamp and rotate silicon wafers, wherein when the lifting platform (303) slides along the gantry (2), the angle between the axis of the telescopic rotating shaft (411) and the axis of the drive lead screw (301) increases or decreases; There are two driving screws (301), and the two driving screws (301) are rotatably connected to opposite sides of the gantry (2), and the bottom end of the driving screw (301) is fixedly connected to a first sprocket (304), and the outer side of the first sprocket (304) is connected to a driving chain (305), and the two first sprockets (304) are both arranged on the inner side of the driving chain (305), and the driving chain (305) is connected to the output shaft of the first driving motor (302).

2. A lifting device for semiconductor processing equipment according to claim 1, characterized in that: A support member (306) is provided on the upper end surface of the base (1); the support member (306) is rotatably connected to a transition sprocket (307); the transition sprocket (307) is connected to the drive chain (305); the transition sprocket (307) penetrates the base (1) and is fixedly connected to a drive pulley (308); the output shaft of the first drive motor (302) is fixedly connected to a drive pulley (309); a drive belt (310) is sleeved on the outer sides of the drive pulley (308) and the drive pulley (309); wherein the diameter of the drive pulley (308) is greater than the diameter of the drive pulley (309).

3. A lifting device for semiconductor processing equipment according to claim 2, characterized in that: The bottom end of the first driving motor (302) is fixedly connected to a bracket (311), the bracket (311) is fixedly connected to the base (1), the driving pulley (309) is arranged below the bracket (311), and the driving pulley (309) and the transmission pulley (308) are arranged on the same horizontal plane; An adjusting sprocket (312) is provided on one side of the bracket (311) facing the driving chain (305), the adjusting sprocket (312) being connected to the driving chain (305), an adjusting block (313) being connected to the bottom end of the adjusting sprocket (312), the adjusting block (313) being provided with a plurality of waist-shaped holes, and the adjusting block (313) being fixedly connected to the base (1) via the waist-shaped holes.

4. The lifting device of a semiconductor processing equipment according to claim 1, characterized in that: The telescopic rotating shaft (411) comprises an outer shaft (413) and an inner shaft (414); the outer shaft (413) is provided with a sliding cavity; the inner shaft (414) is slidably connected to the sliding cavity; the inner diameter of the sliding cavity is equal to the outer diameter of the inner shaft (414); an elastic member is connected between the inner shaft (414) and the bottom wall of the sliding cavity; The outer shaft (413) is provided with a limiting hole (415) along the sliding cavity, and the inner shaft (414) is provided with a sliding connection piece (416), and the sliding connection piece (416) is slidably connected to the limiting hole (415).

5. The lifting device of semiconductor processing equipment according to claim 4, characterized in that: Both ends of the telescopic rotating shaft (411) are connected to universal joints (417); the outer shaft (413) is connected to the rotating disk (412) via the universal joint (417); and the inner shaft (414) is connected to the output shaft of the second driving motor (420) via the universal joint (417), so that when the axis of the telescopic rotating shaft (411) and the axis of the driving lead screw (301) change, the axis of the rotating disk (412) remains parallel to the axis of the driving lead screw (301).

6. A lifting device for semiconductor processing equipment according to claim 5, characterized in that: The upper end surface of the base (1) is also provided with a connecting seat, the connecting seat is rotatably connected to a second sprocket (418), the inner shaft (414) is fixedly connected to the second sprocket (418) via the universal joint (417), the base (1) is also rotatably connected to a rotating sprocket (430), and the outer sides of the second sprocket (418) and the rotating sprocket (430) are connected to a rotating chain (440); The output shaft of the second drive motor (420) is connected to a gearbox (450), the output shaft of the gearbox (450) and the bottom end of the rotating sprocket (430) are both connected to synchronous wheels (460), and the outer sides of the two synchronous wheels (460) are connected to synchronous belts (470).

7. The lifting device of semiconductor processing equipment according to claim 6, characterized in that: The upper end surface of the rotating sprocket (430) is connected to a first gear (480) coaxially arranged with the rotating sprocket (430), one side of the first gear (480) is connected to a second gear, and the upper end surface of the second gear is fixedly connected to an auxiliary rotating rod (490) coaxially arranged with the driving screw (301); The auxiliary rotating rod (490) penetrates the lifting platform (303), and the auxiliary rotating rod (490) is provided with a pressing rotating disk (500) and a thrust bearing (510), the bottom end of the thrust bearing (510) is fixedly connected to the lifting platform (303), the rotating end of the thrust bearing (510) is fixedly connected to the pressing rotating disk (500), and the inner side of the rotating end of the thrust bearing (510) is fixedly connected to the auxiliary rotating rod (490).

8. The lifting device of semiconductor processing equipment according to claim 7, characterized in that: The upper end surface of the lifting platform (303) is provided with a hydrodynamic bearing, and the upper end surface of the hydrodynamic bearing is connected to a carrier plate (6) coaxially arranged with the hydrodynamic bearing, and the distance from the axis of the carrier plate (6) to the outer side of the rotating disk (412) is equal to the distance from the axis of the carrier plate (6) to the outer side of the pressing rotating disk (500).

9. The lifting device of semiconductor processing equipment according to claim 8, characterized in that: A locking block (7) is fixedly connected to a side of the gantry (2) close to the driving screw (301), and an upper end surface of the locking block (7) is flush with an upper end surface of the driving screw (301); A visual inspection module (8) is provided on one side of the gantry (2), and when the upper end surface of the lifting platform (303) abuts against the locking block (7), the upper end surface of the carrier plate (6) enters the scanning range of the visual inspection module (8), so that the visual inspection module (8) scans the silicon wafer.

10. A semiconductor processing equipment, characterized in that: A lifting device for semiconductor processing equipment comprising the following claim 1 , further comprising a processing chamber and a reaction chamber, wherein the lifting device is arranged in the processing chamber, the reaction chamber is arranged above the lifting device, and a robotic arm is also arranged on one side of the lifting device to transfer silicon wafers.

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