Power device packaging structure and preparation method thereof

Abstract

The embodiment of the invention discloses a power device packaging structure and a preparation method thereof. The power device packaging structure comprises a heat dissipation substrate; a chip; the chip is arranged on one side of the heat dissipation substrate; a pin; one end of each pin is connected with the heat dissipation substrate; bonding a lead; the bonding wires are used for connecting the chip and the pins; a circuit carrier; the circuit carrier is arranged on one side, far away from the chip, of the heat dissipation substrate; a package; the heat dissipation substrate, the chip, one end of each pin, the bonding lead and the circuit carrier are all arranged in the packaging body; and the other end of the pin is arranged outside the packaging body. According to the technical scheme provided by the embodiment of the invention, the internal circuit consisting of the chip, the pins, the bonding wires and the circuit carrier is insulated and isolated from the application end plate through the circuit carrier, and an insulating sheet does not need to be additionally arranged during application and installation, so that the heat dissipation performance of the power device is improved, the working efficiency is improved, and the packaging cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device packaging, and in particular to a power device packaging structure and a preparation method thereof. Background Art

[0002] Transistor Outline (TO) series packages are currently commonly used in the industry. Taking TO-247 as an example, the chip is placed on the heat sink, and the chip is connected to the pins through bonding wires to form an electrical circuit. However, this type of package has the following problems: the chip is mounted on the heat sink, and the heat sink is connected to the pins, causing the heat sink to be charged. During the use of the device, the back of the device will be attached to the application end plate (or heat sink), which is generally grounded, causing the pins to be grounded as well, making the product unusable.

[0003] A common solution in the prior art is to add an insulating sheet to the end plate or apply insulating glue on the back of the device for installation to achieve a partition effect.

[0004] However, the prior art method of adding an insulating sheet to the application end plate or applying insulating glue to the back of the device results in additional materials between the device and the application end, increases costs, and reduces heat dissipation capacity. Summary of the invention

[0005] The present invention provides a power device packaging structure and a preparation method thereof, so as to solve the problems of increased packaging cost and reduced heat dissipation capability.

[0006] According to one aspect of the present invention, a power device packaging structure is provided, the power device packaging structure comprising:

[0007] Heat dissipation substrate;

[0008] Chip; the chip is arranged on one side of the heat dissipation substrate;

[0009] Pin; one end of the pin is connected to the heat dissipation substrate;

[0010] Bonding wires; Bonding wires are used to connect chips and pins;

[0011] Circuit carrier; the circuit carrier is arranged on a side of the heat dissipation substrate away from the chip;

[0012] Package body; the heat dissipation substrate, chip, one end of the pin, bonding wire and circuit carrier are all arranged in the package body; the other end of the pin is arranged outside the package body.

[0013] Optionally, the circuit carrier includes an insulating substrate, a first metal plate and a second metal plate; the first metal plate is arranged on the side of the heat dissipation substrate away from the chip; the insulating substrate is arranged on the side of the first metal plate away from the heat dissipation substrate; the second metal plate is arranged on the side of the insulating substrate away from the first metal plate.

[0014] Optionally, the first metal plate includes a copper plate; the second metal plate includes a copper plate; and the insulating substrate includes a ceramic substrate.

[0015] Optionally, the power device packaging structure further includes: a thermally conductive adhesive layer;

[0016] The first metal plate and the second metal plate are both connected to the insulating substrate through a thermally conductive adhesive layer; the chip is connected to the heat dissipation substrate through a thermally conductive adhesive layer; and the first metal plate is connected to the heat dissipation substrate through a thermally conductive adhesive layer.

[0017] Optionally, the thermally conductive adhesive layer includes a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

[0018] Optionally, the circuit carrier is insulated and isolated from the heat dissipation substrate via an insulating substrate.

[0019] Optionally, the heat dissipation substrate and the pins are configured as an integrated frame structure, and the other end of the pins passes through the package body.

[0020] Optionally, a projection area of ​​the circuit carrier on the package body is smaller than a projection area of ​​the heat dissipation substrate on the package body.

[0021] Optionally, the projection areas of the first metal plate and the second metal plate on the heat dissipation substrate are the same, and are both smaller than the projection area of ​​the insulating substrate on the heat dissipation substrate.

[0022] According to another aspect of the present invention, a method for preparing a power device packaging structure is provided, the method for preparing a power device packaging structure comprising:

[0023] Providing a heat dissipation substrate;

[0024] Connect one end of the pin to the heat dissipation substrate by welding;

[0025] Solder the chip on one side of the heat dissipation substrate;

[0026] Soldering the circuit carrier on the side of the heat dissipation substrate away from the chip;

[0027] Electrically connect the chip to one end of the pin through a bonding wire;

[0028] The heat dissipation substrate, the chip, one end of the pin, the bonding wire and the circuit carrier are placed in an injection mold and sealed to form a package body, and the other end of the pin is placed outside the package body.

[0029] The technical solution of the embodiment of the present invention is to set a power device packaging structure, including a heat dissipation substrate, a chip, a pin, a bonding lead, a circuit carrier and a package body, the chip is arranged on one side of the heat dissipation substrate, the chip and the pin are connected by a bonding lead, the heat dissipation substrate, the chip, one end of the pin, the bonding lead and the circuit carrier are all arranged in the package body, and the other end of the pin passes through the package body and is arranged outside the package body. The heat generated by the chip when working is quickly conducted away by the heat dissipation substrate, the temperature of the chip is reduced, and the reliability and stability of the power device are improved. The circuit carrier is arranged on the side of the heat dissipation substrate away from the chip, so that the heat dissipation substrate and the pin can maintain an integrated structural design, and the heat dissipation performance of the power device packaging structure is improved. The circuit carrier is arranged on the side of the heat dissipation substrate away from the chip, such as an insulating substrate with metal on both sides. The metal side can realize the wiring of auxiliary devices of the circuit, and then electrically connected with the chip. The internal insulation of the power device can be realized through the insulating substrate, and the internal circuit composed of the chip, the pin, the bonding lead and the circuit carrier is insulated and isolated from the application end plate through the circuit carrier, which saves the link of installing an insulating sheet during application installation, improves the operation efficiency, and reduces the packaging cost.

[0030] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 is a side anatomical schematic diagram of a power device packaging structure provided according to an embodiment of the present invention;

[0033] Figure 2 is a front anatomical schematic diagram of a power device packaging structure provided according to an embodiment of the present invention;

[0034] Figure 3 is a side anatomical schematic diagram of another power device packaging structure provided according to an embodiment of the present invention;

[0035] Figure 4 The present invention is a flowchart of a method for preparing a power device packaging structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] Figure 1 It is a side anatomical schematic diagram of a power device packaging structure provided according to an embodiment of the present invention. Figure 2 FIG. 1 is a front anatomical schematic diagram of a power device packaging structure provided according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, the power device packaging structure includes: a heat dissipation substrate 10; a chip 20; the chip 20 is arranged on one side of the heat dissipation substrate 10; a pin 30; one end of the pin 30 is connected to the heat dissipation substrate 10; a bonding wire 40; the bonding wire 40 is used to connect the chip 20 and the pin 30; a circuit carrier 50; the circuit carrier 50 is arranged on a side of the heat dissipation substrate 10 away from the chip 20; a package body 60; the heat dissipation substrate 10, the chip 20, one end of the pin 30, the bonding wire 40 and the circuit carrier 50 are all arranged in the package body 60; the other end of the pin 30 is arranged outside the package body 60.

[0039] In an embodiment of the present invention, the heat dissipation substrate 10 serves as the main heat dissipation channel of the power device packaging structure, which quickly conducts away the heat generated by the chip 20 when it is working, reduces the temperature of the chip 20, and improves the reliability and stability of the power device. The material of the heat dissipation substrate 10 can be selected from materials with high thermal conductivity, such as copper, aluminum and other metals or their alloys. The chip 20 is the core part of the power device and has functions such as realizing specific power conversion or amplification. For example, the chip 20 is used in the power management circuit to change the voltage, and the chip 20 is used in the power amplifier to amplify the signal. The chip 20 is fixed to the heat dissipation substrate 10 by welding or pasting, etc., to ensure that good thermal contact is formed between the chip 20 and the heat dissipation substrate 10, so as to facilitate the heat dissipation of the chip 20.

[0040] The pin 30 is used to realize the electrical connection between the power device and the external circuit, and realize the function of transmitting signals or power supply. One end of the pin 30 can be connected to the heat dissipation substrate 10 by metallized vias or direct welding to realize the electrical connection and mechanical fixation between the heat dissipation substrate 10 and the pin 30. The other end of the pin 30 extends out of the package body 60 and is connected to the external circuit board. The bonding wire 40 is used to establish an electrical connection between the chip 20 and the pin 30, connecting the electrode on the chip 20 with the pin 30, so that the chip 20 can transmit and interact with the external circuit. The bonding wire 40 can be made of metal wire, such as gold wire or aluminum wire. Exemplarily, one end of the bonding wire 40 can be welded to the electrode of the chip 20 by a bonding process, and the other end of the bonding wire 40 can be welded to the pin 30. The circuit carrier 50 provides a support and electrical connection basis for the chip 20, and can also integrate some auxiliary circuit elements, such as resistors or capacitors, to improve the function of the power device.

[0041] The circuit carrier 50 can be a printed circuit board, or an insulating substrate with metal on both sides. The metal side can realize the wiring of auxiliary devices of the circuit, and then electrically connect with the chip 20. The internal insulation of the power device can be realized through the insulating substrate. The internal circuit composed of the chip 20, the pin 30, the bonding wire 40 and the circuit carrier 50 is insulated and isolated from the application end plate through the circuit carrier 50, eliminating the link of installing an insulating sheet during application installation. The circuit carrier 50 is arranged on the side of the heat dissipation substrate 10 away from the chip 20, which can ensure the integrated frame design of the power device packaging structure. The heat dissipation substrate 10 and the pin 40 maintain an integrated structure, and improve the heat dissipation performance of the power device packaging structure. The package body 60 is used to protect the internal heat dissipation substrate 10, the chip 20, one end of the pin 30, the bonding wire 40 and the circuit carrier 50, and prevent them from being affected by physical impact, moisture or dust and other factors in the external environment, so as to ensure the normal operation of the power device. The material of the package body 60 includes but is not limited to plastic or ceramic, which plays a role in protecting internal components and insulation.

[0042] The technical solution of the embodiment of the present invention is to set a power device packaging structure, including a heat dissipation substrate, a chip, a pin, a bonding lead, a circuit carrier and a package body, the chip is arranged on one side of the heat dissipation substrate, the chip and the pin are connected by a bonding lead, the heat dissipation substrate, the chip, one end of the pin, the bonding lead and the circuit carrier are all arranged in the package body, and the other end of the pin passes through the package body and is arranged outside the package body. The heat generated by the chip when working is quickly conducted away by the heat dissipation substrate, the temperature of the chip is reduced, and the reliability and stability of the power device are improved. The circuit carrier is arranged on the side of the heat dissipation substrate away from the chip, so that the heat dissipation substrate and the pin can maintain an integrated structural design, and the heat dissipation performance of the power device packaging structure is improved. The circuit carrier is arranged on the side of the heat dissipation substrate away from the chip, such as an insulating substrate with metal on both sides. The metal side can realize the wiring of auxiliary devices of the circuit, and then electrically connected with the chip. The internal insulation of the power device can be realized through the insulating substrate, and the internal circuit composed of the chip, the pin, the bonding lead and the circuit carrier is insulated and isolated from the application end plate through the circuit carrier, which saves the link of installing an insulating sheet during application installation, improves the operation efficiency, and reduces the packaging cost.

[0043] Based on the technical solution of the above invention embodiment, Figure 1 Optionally, the circuit carrier 50 includes an insulating substrate 502, a first metal plate 501 and a second metal plate 503; the first metal plate 501 is arranged on a side of the heat dissipation substrate 10 away from the chip 20; the insulating substrate 502 is arranged on a side of the first metal plate 501 away from the heat dissipation substrate 10; the second metal plate 503 is arranged on a side of the insulating substrate 502 away from the first metal plate 501.

[0044] In an embodiment of the present invention, the first metal plate 501 is arranged on the side of the heat dissipation substrate 10 away from the chip 20, and is in close contact with the heat dissipation substrate 10, which can effectively conduct and diffuse the heat transferred from the heat dissipation substrate 10, and play a role in auxiliary heat dissipation. The first metal plate 501 can also provide circuit connection for the chip 20 and other components. The first metal plate 501 can be electrically connected to the circuit outside the package body 60 to ensure signal transmission and power supply. The insulating substrate 502 is arranged between the first metal plate 501 and the second metal plate 503 to achieve electrical insulation, prevent short circuits between the upper and lower metal plates, and ensure the normal operation of the circuit. The insulating substrate 502 has good insulation performance and can withstand a certain voltage, ensuring the safety of the power device in a high-voltage working environment. The second metal plate 503 can be used as a signal transmission layer for transmitting signals between the chip 20 and the external circuit, and can also play a role in electromagnetic shielding to reduce the impact of external electromagnetic interference on the internal circuit.

[0045] Based on the technical solution of the above invention embodiment, Figure 1Optionally, the first metal plate 501 includes a copper plate; the second metal plate 503 includes a copper plate; and the insulating substrate 502 includes a ceramic substrate.

[0046] In the embodiment of the present invention, the circuit carrier 50 can be configured as a double-sided copper-clad ceramic substrate, that is, the first metal plate 501 and the second metal plate 503 are both copper plates, and the insulating substrate 502 is a ceramic substrate. The ceramic substrate and the copper plates on both sides are configured as an integrated structure, which can not only achieve electrical connection with the chip 20, but also achieve insulation isolation with the application end plate through the ceramic substrate.

[0047] Figure 3 FIG. 1 is a side anatomical schematic diagram of another power device packaging structure provided according to an embodiment of the present invention. Figure 3 As shown, the power device packaging structure also includes: a thermally conductive adhesive layer 70; the first metal plate 501 and the second metal plate 503 are both connected to the insulating substrate 502 through the thermally conductive adhesive layer 70; the chip 20 is connected to the heat dissipation substrate 10 through the thermally conductive adhesive layer 70; the first metal plate 501 is connected to the heat dissipation substrate 10 through the thermally conductive adhesive layer 70.

[0048] In the embodiment of the present invention, the thermally conductive adhesive layer 70 needs to have high thermal conductivity, good adhesion and thermal stability. The first metal plate 501 and the second metal plate 503 are both connected to the insulating substrate 502 through the thermally conductive adhesive layer 70, so that the insulating substrate 502, the first metal plate 501 and the second metal plate 503 form an integrated structure, ensuring that the components are firmly connected and have good thermal conductivity. The chip 20 is connected to the heat dissipation substrate 10 through the thermally conductive adhesive layer 70 to ensure that the chip 20 is firmly bonded to the heat dissipation substrate 10, preventing the chip 20 from being displaced or falling off due to external forces such as vibration and impact during operation. At the same time, the high thermal conductivity of the thermally conductive adhesive layer 70 is used to transfer the heat generated by the chip 20 during operation to the heat dissipation substrate 10, and then the heat dissipation of the chip 20 is performed through the heat dissipation substrate 10.

[0049] Based on the technical solution of the above invention embodiment, Figure 3 Optionally, the thermally conductive adhesive layer 70 includes a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

[0050] In the embodiment of the present invention, the thermally conductive adhesive layer 70 can be a highly thermally conductive adhesive material such as solder paste or sintered silver paste. When setting the thermally conductive adhesive layer 70, it is necessary to select a highly thermally conductive adhesive material according to requirements such as bonding strength, thermal conductivity, temperature resistance and corrosion resistance, construction process and cost.

[0051] Based on the technical solution of the above invention embodiment, Figure 1 Optionally, the circuit carrier 50 is insulated and isolated from the heat dissipation substrate 10 through an insulating substrate 502 .

[0052] In the embodiment of the present invention, the circuit carrier 50 includes an insulating substrate 502, which may be a ceramic substrate. The ceramic substrate has a high heat dissipation coefficient, good heat dissipation performance and is an insulating material. The internal insulation of the power device can be achieved through the insulating substrate 502. The internal circuit composed of the chip 20, the pins 30, the bonding wires 40 and the circuit carrier 50 is insulated and isolated from the application end plate through the insulating substrate 502, which eliminates the need to install an insulating sheet during application installation, thereby reducing the packaging cost.

[0053] Based on the technical solution of the above invention embodiment, Figure 1 Optionally, the heat dissipation substrate 10 and the pin 30 are configured as an integrated frame structure, and the other end of the pin 30 passes through the package body 60 .

[0054] In the embodiment of the present invention, the heat dissipation substrate 10 and the pin 30 are set as an integrated frame structure, which improves the stability of the power device packaging structure and reduces the difficulty of installation. The other end of the pin 30 passes through the packaging body 60 and is electrically connected to other components or circuits.

[0055] Based on the technical solution of the above invention embodiment, Figure 1 Optionally, a projection area of ​​the circuit carrier 50 on the package body 60 is smaller than a projection area of ​​the heat dissipation substrate 10 on the package body 60 .

[0056] In the embodiment of the present invention, the circuit carrier 50 is arranged on the side of the heat dissipation substrate 10 away from the chip 20 and is located in the middle part of the heat dissipation substrate 10 to prevent the presence of contaminants on the surface of the circuit carrier 50 and the occurrence of creepage, which causes the circuit carrier 50 to be polarized and cause insulation failure.

[0057] Based on the technical solution of the above invention embodiment, Figure 1 Optionally, the projection areas of the first metal plate 501 and the second metal plate 503 on the heat dissipation substrate 10 are the same, and are both smaller than the projection area of ​​the insulating substrate 502 on the heat dissipation substrate 10 .

[0058] In the embodiment of the present invention, the projection area of ​​the first metal plate 501 and the second metal plate 503 on the heat dissipation substrate 10 is smaller than the projection area of ​​the insulating substrate 502 on the heat dissipation substrate 10, ensuring that the first metal plate 501 and the second metal plate 503 on both sides are insulated and isolated by the insulating substrate 502, thereby improving the reliability of the power device packaging structure.

[0059] Figure 4This is a flow chart of a method for preparing a power device packaging structure according to an embodiment of the present invention. This embodiment can be applied to preparing a power device packaging structure. The method for preparing a power device packaging structure can be performed by a preparation device for a power device packaging structure. The preparation device for a power device packaging structure can be implemented in the form of hardware and / or software. Figure 4 As shown, the method for preparing the power device packaging structure includes:

[0060] S110, providing a heat dissipation substrate.

[0061] Specifically, the heat dissipation substrate may be a metal heat dissipation frame. Exemplarily, a copper heat dissipation frame is provided.

[0062] S120, connecting one end of the pin to the heat dissipation substrate by welding.

[0063] Specifically, one end of the pin is connected to the heat dissipation substrate through a welding process, so that the pin and the heat dissipation substrate form an integrated structure, thereby improving the heat dissipation capacity of the power device packaging structure. One end of the pin is connected to the heat dissipation substrate through welding to achieve electrical connection and mechanical fixation between the heat dissipation substrate and the pin.

[0064] S130, soldering a chip on one side of the heat dissipation substrate.

[0065] Specifically, solder paste, tin sheet or tin wire is applied to one side of the heat dissipation substrate, and the chip is soldered to the heat dissipation substrate through a soldering process. When the chip is working, the heat generated by the chip can be quickly conducted away through the heat dissipation substrate, thereby reducing the temperature of the chip and improving the reliability and stability of the power device.

[0066] S140, welding a circuit carrier on a side of the heat dissipation substrate away from the chip.

[0067] Specifically, on the side of the heat dissipation substrate away from the chip, solder materials such as solder paste, tin sheet or tin wire are applied, and the circuit carrier is soldered to the heat dissipation substrate through a welding process. The circuit carrier can be an insulating substrate with metal on both sides. The metal and the insulating substrate can also be connected through a welding process. The metal side can realize the wiring of auxiliary devices of the circuit, and then be electrically connected to the chip. The internal insulation of the power device can be realized through the insulating substrate. The internal circuit composed of the chip, pins, bonding wires and circuit carrier is insulated and isolated from the application end plate through the circuit carrier, which eliminates the step of installing an insulating sheet during application installation, improves operating efficiency and reduces packaging costs.

[0068] S150, electrically connecting the chip to one end of the pin via a bonding wire.

[0069] Specifically, bonding wires are used to establish electrical connections between the chip and the pins, connecting the electrodes on the chip to the pins, so that the chip can transmit signals and interact with external circuits.

[0070] S160, placing the heat dissipation substrate, the chip, one end of the pin, the bonding wire and the circuit carrier in an injection mold to form a package body, and placing the other end of the pin outside the package body.

[0071] Specifically, the heat dissipation substrate, chip, one end of the pin, bonding wire and circuit carrier are assembled according to the pre-designed design, and then a suitable injection mold is selected, and the mold is cleaned and lubricated to ensure that the mold surface is smooth and free of impurities, so as to ensure the smooth progress of the injection molding process and the surface quality of the formed package. The injection molding process includes mold closing, plastic injection, pressure holding and cooling. When the plastic solidifies, the formed package is taken out of the mold to complete the demoulding process, and the demoulding package is inspected to remove defects such as flash or burrs. Injection molding can achieve efficient and reliable packaging of power devices and provide good protection for the components in the package.

[0072] The technical solution of the embodiment of the present invention is to set a preparation method of a power device packaging structure, by providing a heat dissipation substrate, one end of the pin is connected to the heat dissipation substrate by welding, so that the pin and the heat dissipation substrate form an integrated structure, and the heat dissipation capacity of the power device packaging structure is improved. The chip is welded on one side of the heat dissipation substrate. When the chip is working, the heat generated by the chip can be quickly conducted away through the heat dissipation substrate, thereby reducing the temperature of the chip and improving the reliability and stability of the power device. A circuit carrier is welded on the side of the heat dissipation substrate away from the chip, such as an insulating substrate covered with metal on both sides. The metal side can realize the wiring of auxiliary devices of the circuit, and then electrically connected to the chip. The internal insulation of the power device can be realized through the insulating substrate, and the internal circuit composed of the chip, pins, bonding wires and circuit carrier is insulated and isolated from the application end plate through the circuit carrier, eliminating the step of installing an insulating sheet during application installation, improving work efficiency and reducing packaging costs. The chip is electrically connected to one end of the pin through the bonding wire, so that the chip can transmit and interact with the external circuit. The heat dissipation substrate, chip, one end of the pin, bonding wire and circuit carrier are placed in an injection mold and sealed to form a package body, and the other end of the pin is placed outside the package body. The injection molding method can achieve efficient and reliable packaging of power devices and provide good protection for the components in the package body.

[0073] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0074] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A power device packaging structure, characterized in that: include: Heat dissipation substrate; Chip; the chip is arranged on one side of the heat dissipation substrate; Pins; One end of the pin is connected to the heat dissipation substrate; Bonding wires; the bonding wires are used to connect the chip and the pins; A circuit carrier; the circuit carrier is arranged on a side of the heat dissipation substrate away from the chip; A package body; the heat dissipation substrate, the chip, one end of the pin, the bonding wire and the circuit carrier are all arranged in the package body; the other end of the pin is arranged outside the package body.

2. The power device packaging structure according to claim 1, characterized in that: The circuit carrier includes an insulating substrate, a first metal plate and a second metal plate; the first metal plate is arranged on a side of the heat dissipation substrate away from the chip; the insulating substrate is arranged on a side of the first metal plate away from the heat dissipation substrate; and the second metal plate is arranged on a side of the insulating substrate away from the first metal plate.

3. The power device packaging structure according to claim 2, characterized in that: The first metal plate includes a copper plate; the second metal plate includes a copper plate; and the insulating substrate includes a ceramic substrate.

4. The power device packaging structure according to claim 2, characterized in that: Also includes: Thermally conductive adhesive layer; The first metal plate and the second metal plate are both connected to the insulating substrate via a thermally conductive adhesive layer; The chip is connected to the heat dissipation substrate via a thermally conductive adhesive layer; The first metal plate is connected to the heat dissipation substrate via a thermally conductive adhesive layer.

5. The power device packaging structure according to claim 4, characterized in that: The thermally conductive adhesive layer includes a tin thermally conductive adhesive layer or a sintered silver paste thermally conductive adhesive layer.

6. The power device packaging structure according to claim 2, characterized in that: The circuit carrier is insulated and isolated from the heat dissipation substrate through the insulating substrate.

7. The power device packaging structure according to claim 1, characterized in that: The heat dissipation substrate and the pins are arranged as an integrated frame structure, and the other end of the pins passes through the packaging body.

8. The power device packaging structure according to claim 1, characterized in that: The projected area of ​​the circuit carrier on the package body is smaller than the projected area of ​​the heat dissipation substrate on the package body.

9. The power device packaging structure according to claim 2, characterized in that: The projection areas of the first metal plate and the second metal plate on the heat dissipation substrate are the same, and are both smaller than the projection area of ​​the insulating substrate on the heat dissipation substrate.

10. A method for preparing a power device packaging structure, characterized in that: include: Providing a heat dissipation substrate; Connecting one end of the pin to the heat dissipation substrate by welding; Soldering a chip on one side of the heat dissipation substrate; Soldering a circuit carrier on a side of the heat dissipation substrate away from the chip; Electrically connecting the chip to one end of the pin via a bonding wire; The heat dissipation substrate, the chip, one end of the pin, the bonding wire and the circuit carrier are placed in an injection mold and sealed to form a package body, and the other end of the pin is placed outside the package body.

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