Water cooling plate with micro-channel structure

Abstract

The invention discloses a water cooling plate with a micro-channel structure. The water cooling plate comprises a cover plate and a channel cavity plate, a cavity is formed in the runner cavity plate; inner partition plates for dividing the cavity into a plurality of heat exchange cavities are arranged in the cavity, and a confluence opening is formed in each inner partition plate; a flow guide block is arranged in each heat exchange cavity; the left side and the right side of the flow guide block in each heat exchange cavity are each provided with a heat exchange mechanism, each heat exchange mechanism comprises two sets of heat exchange fins, a confluence channel is formed between the two sets of heat exchange fins of each heat exchange mechanism, and each set of heat exchange fins are provided with a plurality of flow guide gaps communicating the flow guide channels with the confluence channel. And the cover plates are two plate bodies which are respectively fixed on the upper surface and the lower surface of the runner cavity plate and cover the cavity. Cooling and heat exchange can be carried out on a plurality of power semiconductor devices at the same time, the flow channel structure adopts series-parallel-series-parallel... series, the temperature difference of the power semiconductor devices at the water inlet and the water outlet is prevented from being too large, the hidden danger of uneven flow distribution is reduced, the space utilization rate is high, the cooling efficiency is high, and cooling is rapid.

Description

Technical Field

[0001] The invention belongs to the technical field of heat exchange of power semiconductor devices, and in particular relates to a water cooling plate with a micro-channel structure. Background Art

[0002] Power semiconductor devices (such as MOSFET, IGBT, etc.) are core components for power conversion and circuit control in electronic devices. They are widely used in the electronic and electrical industry, covering almost all electronic industry chains. They are widely used in automobiles, charging piles, power generation, consumer electronics, rail transit, energy storage, aerospace and military fields. The power semiconductor industry is in a rapid development stage. The dual drive of technological innovation and market demand has brought broad development space for the industry.

[0003] Power semiconductor devices will generate high heat losses during the conduction and switching processes. As the temperature rises, the electrical performance of semiconductor devices will degrade. Long-term high-temperature operation will accelerate the aging of the device and reduce its service life. In addition, excessive temperature will also trigger the system's protection mechanism and affect the continuous operation of the equipment. Therefore, heat exchange and cooling treatment is required to enable it to operate within a stable temperature range.

[0004] After searching, the patent with application number 202420210680.9 discloses a water-cooled plate for high-power heating tubes. The water-cooled plate can only cool down two heating modules at the same time and needs to design a separate flow channel structure. The cooling water in the copper tube is only used for diversion, and the space utilization rate of the water-cooled plate is low. The patent with application number 202322405222.9 discloses a composite metal water-cooled plate. The heat exchange fins of the water-cooled plate are installed on the outside of the water-cooled plate. The heat is directly transferred to the air through the fins and does not directly contact the cooling water. Therefore, the heat exchange efficiency will be greatly reduced. The patent with application number 202122281650.6 discloses a power module water-cooled plate heat exchange device. A plurality of diverter water ports are arranged on the substrate of the heat exchange device, which can effectively avoid uneven heat exchange at the inlet and outlet. However, too many diverter water ports will cause uneven flow distribution when the flow channel structure is designed or blocked. The patent with application number 202111544443.3) discloses a water-cooled plate, the fins and substrate of which are manufactured as one piece, so it is difficult to reduce the thickness and spacing of the fins in terms of process, and the cooling effect on high-power module devices is not obvious.

[0005] In addition, for high-power semiconductor devices, the cooling efficiency of water-cooled plates with ordinary structures is not high and it is difficult to effectively cool them down. Summary of the invention

[0006] In order to solve the above problems, the object of the present invention is to provide a microchannel structure water cooling plate with high space utilization, uniform cooling water flow distribution, high cooling efficiency and rapid temperature reduction.

[0007] The purpose of the present invention is achieved through the following technical solutions.

[0008] A microchannel structure water-cooling plate, comprising a cover plate and a channel cavity plate; the channel cavity plate is provided with a cavity penetrating the upper and lower surfaces thereof, and a water inlet and a water outlet are provided at both ends of the channel cavity plate, which are connected to the two ends of the cavity one by one; at least one inner partition plate is provided in the cavity, the inner partition plate divides the cavity into a plurality of heat exchange cavities, and each inner partition plate is provided with a confluence port connecting two adjacent heat exchange cavities; a guide block is provided in each heat exchange cavity, and the front and rear ends of the guide block do not contact each other with the inner wall of the heat exchange cavity where it is located, and a guide channel is formed; in each heat exchange cavity, A heat exchange mechanism is provided on each of the left and right sides of the guide block in the heat cavity, each heat exchange mechanism includes two groups of heat exchange fins, and there is a confluence channel between the two groups of heat exchange fins of the heat exchange mechanism. Each group of heat exchange fins has a plurality of guide gaps that connect the guide channels with the confluence channels. The confluence channel located in the middle of the cavity is also connected to the confluence port, while the confluence channels located at both ends of the cavity are respectively connected to the water inlet and the water outlet; the cover plate is two plates that are respectively fixed on the upper and lower surfaces of the flow channel cavity plate and cover the cavity, and the heat exchange fins and the guide blocks are respectively in contact with the inner wall of the cover plate.

[0009] Furthermore, in order to limit the position and flow rate of cooling water entering and exiting the heat dissipation area, an inlet guide plate and an outlet guide plate are respectively installed at both ends of the cavity; wherein, an inlet flow channel connecting the water inlet and the cavity is formed between the inlet guide plate and the inner wall of the cavity, and an outlet flow channel connecting the water outlet and the cavity is formed between the outlet guide plate and the inner wall of the cavity.

[0010] Furthermore, the cover plate includes an outer plate and an inner plate, wherein the outer plate is a circular plate fixed on the flow channel cavity plate; the inner plate is pressed against the flow channel cavity plate by the outer plate, and the inner wall of the inner plate abuts against the heat exchange fins.

[0011] Furthermore, the number of the heat exchange fins, the inner partition plates, and the guide blocks changes according to the number of the heating modules. A group of heat exchange fins can exchange heat for at most two upper and lower heating modules. The number of heat source modules on one side of the cover plate is 4n, where n is a natural number greater than or equal to 1. Therefore, there are at least 4n groups of heat exchange fins, at least n-1 inner partition plates, and at least n guide blocks (40).

[0012] The purpose of the present invention is achieved through the following technical solutions: The present invention has high space utilization, uniform cooling water flow distribution, high cooling efficiency and rapid temperature reduction; the microchannel structure water cooling plate can cool and exchange heat for multiple power semiconductor devices at the same time, and the channel structure adopts: series-parallel-series-parallel...series, which can reduce pressure loss, avoid excessive temperature difference between the power semiconductor devices at the inlet and outlet, and reduce the hidden danger of uneven flow distribution. The heat exchange fins are manufactured separately from the base plate and fixedly installed by welding, so that the fins have a denser structural feature, and the heat exchange effect is better for high-power semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The structure of the present invention is further described in detail below in conjunction with the accompanying drawings.

[0014] Figure 1 This is a schematic structural diagram of the microchannel structure water cooling plate of the present invention.

[0015] Figure 2 This is an exploded view of the water-cooling plate with a microchannel structure according to the present invention.

[0016] Figure 3 It is an exploded view of the flow channel cavity plate of the present invention.

[0017] Figure 4 It is a schematic diagram of the heat exchange fin structure of the present invention.

[0018] Figure 5 for Figure 3 A partial enlarged schematic diagram of the installation method of the heat exchange fins.

[0019] Figure 6 It is a cross-sectional schematic diagram of the guide block of the present invention.

[0020] As shown in the figure: 10-cover plate, 11-outer plate, 12-outer plate fixing hole, 13-inner plate, 14-inner plate positioning hole, 20-flow channel cavity plate, 21-cavity plate positioning column, 22-cavity plate fixing hole, 23-water inlet, 24-water outlet, 25-water inlet guide plate, 26-water outlet guide plate, 27-first inner partition plate, 28-second inner partition plate, 30-heat exchange fins, 40-guide block, 41-first guide block, 42-second guide block, 43-third guide block. DETAILED DESCRIPTION

[0021] The following is an explanation of the implementation of the present invention by specific specific embodiments. People familiar with the technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that the structures, proportions, sizes, etc. drawn in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and so on quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. It should be noted that the terms "include", "comprise" or any other variants are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements inherent to such process, method, article or device. Example 1

[0024] like Figure 1-6 As shown, this embodiment provides a micro-channel structure water-cooling plate, including a cover plate 10, a channel cavity plate 20, heat exchange fins 30, and a guide block 40.

[0025] The flow channel cavity plate 20 is a flat plate, and a cavity is provided in the flow channel cavity plate 20 which runs through its upper and lower surfaces, and a water inlet 23 and a water outlet 24 which are connected one-to-one with the two ends of the cavity are respectively provided at the two ends of the front side of the flow channel cavity plate 20, wherein the water inlet 23 is located on the left side of the flow channel cavity plate 20 and is connected to the left end of the cavity, and a water inlet nozzle is installed on the water inlet 23, and the water inlet nozzle is connected to the water outlet end of the external cooling system, and the water outlet 24 is located on the right side of the flow channel cavity plate 20 and is connected to the right end of the cavity, and a water outlet nozzle is installed on the water outlet 24, and the water outlet nozzle is connected to the water inlet end of the external cooling system.

[0026] Two inner partition plates are longitudinally arranged in the cavity of the flow channel cavity plate 20, namely, the first inner partition plate 27 and the second inner partition plate 28, which are fixed in the cavity as a whole, and the inner partition plates divide the cavity into three heat exchange chambers, namely, the first heat exchange chamber, the second heat exchange chamber and the third heat exchange chamber, the first heat exchange chamber is located on the left side of the cavity and connected to the water inlet 23, the second heat exchange chamber is located in the middle of the cavity, and the third heat exchange chamber is located on the right side of the cavity and connected to the water outlet 24. Each inner partition plate is provided with a confluence port connecting two adjacent heat exchange chambers, and the confluence port is located in the middle of the inner partition plate.

[0027] A guide block 40 is longitudinally arranged in each heat exchange cavity, namely a first guide block 41, a second guide block 42, and a third guide block 43. The first guide block 41 is located in the first heat exchange cavity, the second guide block 42 is located in the second heat exchange cavity, and the third guide block 43 is located in the third heat exchange cavity. The front and rear ends of the guide block 40 do not contact the inner wall of the heat exchange cavity where it is located, and form two guide channels located on the front and rear sides of the guide block 40. The two guide channels are arranged on both sides of the confluence.

[0028] A heat exchange mechanism is provided on the left and right sides of the guide block in each heat exchange cavity, each heat exchange mechanism includes two groups of heat exchange fins 30, and there is a confluence channel between the two groups of heat exchange fins 30 of the heat exchange mechanism. Each group of heat exchange fins 30 includes at least one heat exchange fin 30, and each heat exchange fin 30 is composed of multiple layers of fin plates arranged in parallel with each other. The adjacent fin plates do not contact each other, thereby forming a plurality of guide gaps in each heat exchange fin 30. The guide gaps are arranged longitudinally, and the guide gaps connect the two guide channels in each heat exchange cavity with the confluence channel in the middle. The confluence channel located in the middle of the cavity is aligned with the confluence port near it and is connected to each other. The leftmost confluence channel in the heat exchange cavity on the left side of the cavity is connected to the water inlet 23, and the rightmost confluence channel in the heat exchange cavity on the right side of the cavity is connected to the water outlet 24.

[0029] The cover plate 10 is two plates respectively fixed on the upper and lower surfaces of the flow channel cavity plate 20 to cover the cavity.

[0030] The upper and lower surfaces of the heat exchange fins 30 and the upper and lower surfaces of the guide blocks 40 are respectively in contact with the inner walls of the two cover plates 10. The left and right sides of the heat exchange fins 30 are respectively in contact with the inner wall of the heat exchange cavity and the guide blocks 40.

[0031] The power semiconductor device is installed on the outer wall of the cover plate 10. The power semiconductor device transfers heat to the cover plate 10, and then the cover plate 10 conducts it to the heat exchange fins 30. The heat exchange fins 30 exchange heat with the continuously flowing cooling water to cool down, and the cooling water is used to take the heat out to the external cooling system for cooling.

[0032] In actual application, the cooling water flowing out of the cooling system enters the confluence channel on the left side of the first heat exchange cavity at the left end of the cavity through the water inlet 23. The cooling water is blocked by the first guide block 41 and is divided into two streams, which respectively enter the two groups of heat exchange fins 30 on the left side of the first heat exchange cavity from the confluence channel on the left side of the first heat exchange cavity. Then, it flows along the guide gaps of the two groups of heat exchange fins 30 to the guide channels at the front and rear ends of the first guide block 41, and then flows through the guide channels to the two groups of heat exchange fins 30 on the right side of the first guide block 41. Then, it flows along the guide gaps of the two groups of heat exchange fins 30 to converge in the confluence channel on the right side of the first guide block 41 (between the two groups of heat exchange fins 30). The cooling water passes through the heat exchange fins 30. 0, the heat on the heat exchange fins 30 will be taken away by the cooling water through forced convection, and then the cooling water gathered in the confluence channel on the right side of the first guide block 41 flows to the confluence port in the middle of the first inner partition plate 27, and is re-converged into one stream under the guidance of the confluence port in the middle of the first inner partition plate 27, and then continues to enter the confluence channel on the left side of the second heat exchange chamber and is divided into two streams by the second guide block 42, repeating the previous flow mode, alternating diversion and convergence in the second heat exchange chamber and the third heat exchange chamber in turn to achieve heat dissipation for the heat dissipating fins, and after the cooling water has forced convection to dissipate heat for all the heat dissipating fins, it finally converges into one stream in the right confluence channel of the rightmost heat exchange chamber and flows out from the water outlet 24. Example 2

[0033] In order to limit the position and flow rate of cooling water entering and exiting the heat dissipation area, this embodiment is configured as follows based on Embodiment 1.

[0034] like Figure 3 As shown, a water inlet guide plate 25 and a water outlet guide plate 26 are respectively installed at both ends of the cavity; wherein, a water inlet flow channel connecting the water inlet 23 and the cavity is formed between the water inlet guide plate 25 and the inner wall of the cavity, and the water outlet end of the water inlet flow channel is located in the middle of the leftmost heat exchange cavity and is connected to the left converging channel of the leftmost heat exchange cavity. When cooling water enters from the water inlet 23, it is guided into the cavity by the water inlet guide plate 25, and the water inlet guide plate 25 limits the cooling water from entering the heat dissipation cavity. The position and flow rate of the area (control the flow rate by controlling the width of the water inlet channel); a water outlet channel connecting the water outlet 24 and the cavity is formed between the water outlet guide plate 26 and the inner wall of the cavity, and the water inlet end of the water outlet channel is located in the middle of the rightmost heat exchange cavity and is connected to the right confluence channel of the rightmost heat exchange cavity. The water is guided to flow out of the cavity by the water outlet guide plate 26, and the water outlet guide plate 26 is used to limit the position and flow rate of the cooling water flowing out of the heat dissipation area (control the flow rate by controlling the width of the water outlet channel). Example 3

[0035] In order to facilitate the positioning and fixing of the flow channel cavity plate 20 and the guide block 40 and the installation of the power semiconductor device, this embodiment is configured as follows based on the first or second embodiment.

[0036] like Figure 2 As shown, the cover plate 10 includes an outer plate 11 and an inner plate 13, wherein the outer plate 11 is a circular plate fixed on the flow channel cavity plate 20, and the outer plate 11 is respectively provided with outer plate fixing holes 12 at the four corners, and the corresponding flow channel cavity plate 20 is provided with a cavity plate fixing hole 22, the position and size of the outer plate fixing hole 12 correspond to the cavity plate fixing hole 22, and the outer plate 11 is fixed to the flow channel cavity plate 20 by bolts passing through the outer plate fixing hole 12 and the cavity plate fixing hole 22; the inner plate 13 is pressed against the flow channel cavity plate 20 by the outer plate 11, and the inner wall of the inner plate 13 is in contact with the heat exchange fin 30 (upper surface or lower surface), and a plurality of inner plate positioning holes 14 are provided on the inner plate 13.

[0037] Cavity plate positioning columns 21 are provided on the upper and lower surfaces of the flow channel cavity plate 20 (the surface in contact with the inner plate 13), and four cavity plate positioning columns 21 are evenly provided on each of the upper and lower surfaces of the flow channel cavity plate 20. Guide block positioning columns 44 are provided on the upper and lower surfaces of the guide block 40 (the surface in contact with the inner plate 13), and a guide block positioning column 44 is provided at the front and rear ends of the upper and lower surfaces of each guide block 40, and a plurality of inner plate positioning holes 14 corresponding to the cavity plate positioning columns 21 and the guide block positioning columns 44 are provided on each inner plate 13. The cavity plate positioning columns 21 and the guide block positioning columns 44 are respectively sleeved and passed through the corresponding inner plate positioning holes 14 on the inner plate 13 on the same side, and then extend into the inner hole (the square hole in the middle) of the outer plate 11. In order to facilitate the installation of power semiconductor devices, the cavity plate positioning columns 21 and the guide block positioning columns 44 are provided with internal threads for installing power semiconductor devices.

[0038] The size and position of the heat sink fins 30 are specifically determined by the heat source position of the power semiconductor device. Therefore, when the size and position of the power semiconductor device changes, the size and position of the heat sink fins 30, the cavity structure of the cavity plate 20, and the position of the inner plate positioning hole 14 can be changed to adapt. Example 4

[0039] To facilitate sealing, this embodiment is configured as follows based on the third embodiment.

[0040] Sealing rubber sleeves are provided on both ends of the cavity plate positioning column 21 and the guide block positioning column 44 , and sealing rubber rings are provided between the outer plate 11 and the inner plate 13 and between the inner plate 13 and the flow channel cavity plate 20 . Example 5

[0041] In order to improve the heat exchange efficiency, this embodiment is configured as follows based on any one of the embodiments 1-4.

[0042] Each set of heat exchange fins 30 is composed of two upper and lower heat exchange fins 30. The upper and lower sides of each set of heat exchange fins 30 can be respectively installed with two upper and lower heating modules. The length and width of the heat exchange fins 30 are equal to the heating module. Example 6

[0043] The difference between this embodiment and embodiment 2 is that.

[0044] The number of heat exchange fins 30, inner partitions, and guide blocks 40 is not limited to the number specified in the above embodiment according to the number of heating modules. The number of heat exchange fins 30, inner partitions, and guide blocks 40 is changed according to the number of heating modules. A group of heat exchange fins 30 can exchange heat with two upper and lower heating modules at most. The number of heat source modules on one side of the cover plate 10 is 4n (n is a natural number greater than or equal to 1), then there are at least 4n groups of heat exchange fins 30, at least n-1 inner partitions, at least n guide blocks 40, and at least n heat exchange chambers.

[0045] In actual application, the cooling water flowing out of the cooling system enters the water inlet guide plate 25 through the water inlet 23, and is guided by the water inlet guide plate 25 into the confluence channel on the left side of the heat exchange cavity at the leftmost end of the cavity. The cooling water is blocked by the guide block in the heat exchange cavity and is divided into two streams, which respectively enter the confluence channel on the left side of the heat exchange cavity into the two groups of heat exchange fins 30 on the left side of the heat exchange cavity, and then flow along the guide gaps between the two groups of heat exchange fins 30 into the guide channels at the front and rear ends of the guide block, and then flow from the guide channel to the two groups of heat exchange fins 30 on the right side of the guide block, and then flow along the guide gaps between the two groups of heat exchange fins 30 to converge in the confluence channel on the right side of the guide block 41 (between the two groups of heat exchange fins 30). The cooling water passes through When the guide gap of the heat exchange fin 30 is filled, the heat on the heat exchange fin 30 will be taken away by the cooling water through forced convection, and then the cooling water gathered in the confluence channel on the right side of the guide block flows to the confluence port in the middle of the inner partition plate, and is re-converged into one stream under the guidance of the confluence port in the middle of the inner partition plate, and then continues to enter the confluence channel on the left side of the next heat exchange chamber and is divided into two streams by the guide block therein, repeating the previous flow mode, alternating diversion and convergence in subsequent heat exchange chambers to achieve heat dissipation for the heat dissipating fins. After the cooling water has forced convection to dissipate heat to all the heat exchange fins, it finally converges into one stream in the right confluence channel of the rightmost heat exchange chamber, is guided into the water outlet 24 by the outlet guide plate 26, and flows out from the water outlet 24.

[0046] Other aspects of the present invention that are not described in detail are all conventional techniques known to those skilled in the art.

[0047] It should be noted that the terms "comprises", "includes" or any other variations are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0048] The protection scope of the present invention is not limited to the technical solutions disclosed in the specific implementation methods. Any modifications, equivalent replacements, improvements, etc. made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A microchannel structure water cooling plate, comprising a cover plate (10) and a channel cavity plate (20); characterized in that: The flow channel cavity plate (20) is provided with a cavity penetrating the upper and lower surfaces thereof, and a water inlet (23) and a water outlet (24) are provided at both ends of the flow channel cavity plate (20) and are connected one-to-one with the two ends of the cavity; At least one inner partition plate is provided in the cavity to divide the cavity into a plurality of heat exchange cavities, and each inner partition plate is provided with a confluence port connecting two adjacent heat exchange cavities; A guide block (40) is provided in each heat exchange cavity, and the front and rear ends of the guide block (40) are not in contact with the inner wall of the heat exchange cavity where it is located, and a guide channel is formed; A heat exchange mechanism is provided on the left and right sides of the guide block in each heat exchange cavity, each heat exchange mechanism comprises two groups of heat exchange fins (30), a confluence channel is provided between the two groups of heat exchange fins (30) of the heat exchange mechanism, each group of heat exchange fins (30) has a plurality of confluence gaps connecting the confluence channels with the confluence channels, the confluence channels located in the middle of the cavity are also connected to the confluence port, and the confluence channels located at both ends of the cavity are respectively connected to the water inlet (23) and the water outlet (24); The cover plate (10) is composed of two plates respectively fixed to the upper and lower surfaces of the flow channel cavity plate (20) and sealing the cavity; the heat exchange fins (30) and the guide blocks (40) are respectively in contact with the inner wall of the cover plate (10).

2. The microchannel structure water cooling plate according to claim 1, characterized in that: An inlet guide plate (25) and an outlet guide plate (26) are respectively installed at both ends of the cavity; a water inlet flow channel connecting the water inlet (23) and the cavity is formed between the inlet guide plate (25) and the inner wall of the cavity, and a water outlet flow channel connecting the water outlet (24) and the cavity is formed between the outlet guide plate (26) and the inner wall of the cavity.

3. The microchannel structure water cooling plate according to claim 1, characterized in that: The cover plate (10) comprises an outer plate (11) and an inner plate (13), wherein the outer plate (11) is a circular plate fixed on the flow channel cavity plate (20); the inner plate (13) is pressed against the flow channel cavity plate (20) by the outer plate (11), and the inner wall of the inner plate (13) abuts against the heat exchange fins (30).

4. The microchannel structure water cooling plate according to claim 3, characterized in that: A cavity plate positioning column (21) is provided on the surface of the flow channel cavity plate (20) in contact with the inner plate (13); a guide block positioning column (44) is provided on the surface of the guide block (40) in contact with the inner plate (13); a plurality of inner plate positioning holes (14) corresponding to the cavity plate positioning columns (21) and the guide block positioning columns (44) are provided on the inner plate (13); the cavity plate positioning columns (21) and the guide block positioning columns (44) are respectively sleeved and passed through the corresponding inner plate positioning holes (14) and then extend into the inner hole of the outer plate (11).

5. The microchannel structure water cooling plate according to claim 4, characterized in that: The cavity plate positioning column (21) and the guide block positioning column (44) are both provided with internal threads for mounting power semiconductor devices.

6. The microchannel structure water cooling plate according to claim 4, characterized in that: The cavity plate positioning column (21) and the guide block positioning column (44) are both provided with sealing rubber sleeves, and sealing rubber rings are provided between the outer plate (11) and the inner plate (13) and between the inner plate (13) and the flow channel cavity plate (20).

7. The microchannel structure water cooling plate according to claim 1, characterized in that: Each group of heat exchange fins (30) comprises two upper and lower heat exchange fins (30) combined, and each heat exchange fin (30) is composed of multiple layers of fin plates, with a flow guide gap formed between two adjacent fin plates.

8. The microchannel structure water cooling plate according to claim 7, characterized in that: The left and right sides of the heat exchange fin (30) are respectively in contact with the inner wall of the heat exchange cavity and the guide block (40).

9. The microchannel structure water cooling plate according to claim 1, characterized in that: The confluence port is arranged in the middle of the inner partition plate.

10. The microchannel structure water cooling plate according to any one of claims 1 to 9, characterized in that: The number of the heat exchange fins (30), the inner partition plates, and the guide blocks (40) varies according to the number of the heat modules. A group of heat exchange fins (30) can exchange heat for at most two upper and lower heat modules. The number of heat source modules on one side of the cover plate (10) is 4n, where n is a natural number greater than or equal to 1. Therefore, there are at least 4n groups of heat exchange fins (30), at least n-1 inner partition plates, and n guide blocks (40).

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