Radiator and chip device
By designing a radiator that includes a heat sink with an evaporation panel and a heat sink fin and a condenser tube arranged in a stacked manner, the problem of large space occupancy or poor heat dissipation effect in the prior art is solved, and the space efficiency and heat dissipation effect are achieved.
Patent Information
- Application Number
- CN202411878516.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2025-04-08
AI Technical Summary
The LTS split radiator in the prior art takes up a large space and has poor applicability, while the shovel-tooth heat pipe radiator has a small space but poor heat dissipation effect and complex structure.
A radiator is designed including an evaporation panel and a heat dissipation assembly. The evaporation panel has an evaporation chamber, a working fluid air outlet and a working fluid liquid inlet. The heat dissipation assembly consists of stacked heat dissipation fins and a condensation tube. The condensation tube is arranged between the heat dissipation fins, and the working fluid air outlet and the liquid inlet are respectively connected to both ends of the condensation tube.
The radiator has achieved the goal of small space and good heat dissipation effect, ensuring that the refrigeration working fluid changes from gaseous state to liquid state and re-enteres the evaporation chamber for refrigeration. The radiator is compact overall, easy to assemble, and has strong applicability.
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Figure CN119786464A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of heat sinks, and in particular to a heat sink and a chip device. Background Art
[0002] Traditional hash board chip cooling often uses LTS split radiators or skived-tooth heat pipe radiators.
[0003] In the process of implementing the present invention, the inventors found that there are at least the following problems in the prior art:
[0004] If an LTS split radiator is used, although the LTS split radiator has a good heat dissipation effect, it occupies a large space and has poor applicability; if a skived-tooth heat pipe radiator is used, although the skived-tooth heat pipe radiator occupies a small space when used, its heat dissipation effect is poor and its structure is more complicated. Summary of the invention
[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a heat sink and a chip device, wherein the heat sink occupies a small space and has a good heat dissipation effect.
[0006] In a first aspect, an embodiment of the present application provides a heat sink, comprising:
[0007] An evaporation panel having a first outer side surface and a second outer side surface opposite to each other, wherein the first outer side surface is used to be attached to a heat source to be cooled, and the evaporation panel is provided with an evaporation chamber and a working fluid gas outlet and a working fluid liquid inlet connected to the evaporation chamber;
[0008] The heat dissipation component includes stacked heat dissipation fins and condensation tubes, the heat dissipation fins are arranged on the second outer side surface, the condensation tubes are passed through each of the heat dissipation fins, and the two ends of the condensation tubes are respectively connected to the working medium gas outlet and the working medium liquid inlet, so as to receive the steam discharged from the evaporation chamber and transmit it back to the evaporation chamber.
[0009] According to some embodiments of the present invention, each of the heat dissipation fins is disposed in close contact with the second outer side surface or is disposed at a distance therefrom.
[0010] According to some embodiments of the present invention, a heat dissipation channel for airflow to pass through is defined between adjacent heat dissipation fins, wherein the airflow conveying direction of the heat dissipation channel is arranged parallel to the evaporation panel.
[0011] According to some embodiments of the present invention, a connection hole for the condenser tube to pass through is provided on the side of the heat dissipation fin, and a limiting sleeve is provided around the connection hole of the heat dissipation fin. The limiting sleeve is provided on the condenser tube and abuts against the side of the adjacent heat dissipation fin to form the heat dissipation channel between the adjacent heat dissipation fins.
[0012] According to some embodiments of the present invention, the heat dissipation fin is provided with a first flange and a second flange on two opposite sides, respectively, wherein the side surface of the first flange is fitted with the second outer side surface, and the edge of the second flange is fitted with the side surface of the adjacent heat dissipation fin, so as to form the heat dissipation channel between the adjacent heat dissipation fins.
[0013] According to some embodiments of the present invention, a plurality of condensers are provided and all are passed through the heat dissipation fins, and the condensers include a first condenser and a second condenser, the air inlet of the first condenser and the liquid outlet of the second condenser are provided on the same side, and the liquid outlet of the first condenser and the air inlet of the second condenser are provided on the same side.
[0014] According to some embodiments of the present invention, along the height direction of the evaporation panel when in use, the working fluid air outlet is arranged higher than the working fluid liquid inlet, so that the gaseous refrigerant in the evaporation chamber enters the condenser from the working fluid air outlet, and the liquid working fluid in the condenser enters the evaporation chamber from the working fluid liquid inlet.
[0015] According to some embodiments of the present invention, the heat dissipation component also includes a first diverter seat and a second diverter seat, and the first diverter seat and the second diverter seat are respectively connected to the two ends of the condenser, wherein the first diverter seat is provided with a first gas-liquid cavity connected to the working fluid gas outlet and the working fluid liquid inlet, and the second diverter seat is provided with a second gas-liquid cavity connected to the working fluid gas outlet and the working fluid liquid inlet, one end of the condenser is connected to the first gas-liquid cavity, and the other end is connected to the second gas-liquid cavity.
[0016] According to some embodiments of the present invention, the heat dissipation component also includes a first air inlet pipe, a first liquid outlet pipe, a second air inlet pipe and a second liquid outlet pipe, wherein at least two working fluid air outlets and two working fluid liquid inlets are provided, the first air inlet pipe connects one working fluid air outlet with the first gas-liquid cavity, and the first liquid outlet pipe connects one working fluid liquid inlet with the first gas-liquid cavity; the second air inlet pipe connects another working fluid air outlet with the second gas-liquid cavity, and the second liquid outlet pipe connects another working fluid liquid inlet with the second gas-liquid cavity.
[0017] According to some embodiments of the present invention, the heat dissipation assembly also includes a first diverter seat and a second diverter seat, and the first diverter seat and the second diverter seat are respectively connected to the two ends of the condenser, wherein the first diverter seat is provided with a first air collecting chamber connected to the working fluid air outlet, and the second diverter seat is provided with a first liquid collecting chamber connected to the working fluid liquid inlet, one end of the condenser is connected to the first air collecting chamber, and the other end is connected to the first liquid collecting chamber.
[0018] According to some embodiments of the present invention, the heat dissipation assembly further includes a third air inlet pipe and a third liquid outlet pipe, wherein the third air inlet pipe connects the working fluid air outlet with the first air collecting chamber, and the third liquid outlet pipe connects the working fluid liquid inlet with the first liquid collecting chamber.
[0019] According to some embodiments of the present invention, the heat dissipation assembly further includes a first shunt seat and a second shunt seat, the first shunt seat and the second shunt seat are respectively connected to the two ends of the condenser tube, wherein the first shunt seat is provided with a second gas collecting chamber connected to the working medium gas outlet and a second liquid collecting chamber connected to the working medium liquid inlet, and the second shunt seat is provided with a third gas collecting chamber connected to the working medium gas outlet and a third liquid collecting chamber connected to the working medium liquid inlet;
[0020] The condenser includes a first condenser and a second condenser, one end of the first condenser is connected to the second gas collecting chamber, and the other end is connected to the third liquid collecting chamber; one end of the second condenser is connected to the second liquid collecting chamber, and the other end is connected to the third gas collecting chamber.
[0021] According to some embodiments of the present invention, the heat dissipation component also includes a fourth air inlet pipe, a fourth liquid outlet pipe, a fifth air inlet pipe and a fifth liquid outlet pipe, wherein there are at least two working fluid air outlets and two working fluid liquid inlets, the fourth air inlet pipe connects one working fluid air outlet with the second air collecting chamber, and the fourth liquid outlet pipe connects one working fluid liquid inlet with the second liquid collecting chamber; the fifth air inlet pipe connects another working fluid air outlet with the third air collecting chamber, and the fifth liquid outlet pipe connects another working fluid liquid inlet with the third liquid collecting chamber.
[0022] According to some embodiments of the present invention, the second gas collecting chamber is arranged on one side of the first diverter seat, the second liquid collecting chamber is arranged on the other side of the first diverter seat, a first sealing cover for sealing the second gas collecting chamber is arranged on one side of the first diverter seat, and a second sealing cover for sealing the second liquid collecting chamber is arranged on the other side of the first diverter seat;
[0023] The third gas collecting chamber is arranged on one side of the second diverter seat, and the third liquid collecting chamber is arranged on the other side of the second diverter seat. A third sealing cover for sealing the third gas collecting chamber is arranged on one side of the second diverter seat, and a fourth sealing cover for sealing the third liquid collecting chamber is arranged on the other side of the second diverter seat.
[0024] According to some embodiments of the present invention, the first diverter seat and the second diverter seat are disposed on the second outer side surface or at two ends of the evaporation panel.
[0025] According to some embodiments of the present invention, along the upward direction of the evaporation panel when in use, the second outer side surface is divided into a first installation area and a second installation area, the air inlet pipe and the liquid outlet pipe of the heat dissipation assembly are arranged in the first installation area, and the heat dissipation fins are arranged in the second installation area.
[0026] According to some embodiments of the present invention, along the upward direction of the radiator when in use, the first diverter seat and the second diverter seat are divided into a first connection area and a second connection area on one side close to the heat sink fins, the air inlet pipe and the liquid outlet pipe of the heat sink assembly are connected to the first connection area, and the heat sink fins are arranged in the second connection area.
[0027] According to some embodiments of the present invention, one radiator is provided, or two or more radiators are provided, and a partition portion is provided on the inner side of the evaporation chamber along the height direction of the evaporation panel when in use, so as to divide the evaporation chamber into sub-cavities with the same number as the radiators, and each of the radiators is arranged one by one on the outer side of each of the sub-cavities.
[0028] In a second aspect, an embodiment of the present application provides a chip device, comprising the above-mentioned heat sink.
[0029] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages: the condenser tube is arranged through each heat dissipation fin. With such an arrangement, when the gaseous refrigerant passes through the condenser tube quickly, the heat dissipation fin can effectively cool the refrigerant in the condenser tube, so that the refrigerant changes from gas to liquid, and the refrigerant can be used for refrigeration after re-entering the evaporation chamber. At the same time, the heat dissipation fin and the condenser tube adopt the above-mentioned connection structure and are arranged on the second side. With such an arrangement, the evaporation panel and the heat dissipation component are compactly connected. More specifically, the evaporation panel and the heat dissipation component are equivalent to an integrated arrangement. The radiator occupies a small space when used and is easy to assemble. As can be seen from the above, the radiator adopts the above-mentioned structural form. The radiator not only takes into account the cooling effect of the heat dissipation component on the refrigerant to ensure the cooling effect of the radiator, but also ensures that the overall space occupied by the radiator is small. The user can easily assemble it in its application equipment, that is, the application equipment does not need to reserve a large space to install the radiator. Therefore, the radiator has strong applicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a schematic structural diagram of a first radiator at an angle according to an embodiment of the present invention;
[0031] Figure 2 It is a schematic structural diagram of the first radiator according to another angle of the embodiment of the present invention;
[0032] Figure 3 It is a schematic diagram of the exploded structure of the heat sink according to an embodiment of the present invention;
[0033] Figure 4 It is a schematic diagram of the structure of the heat dissipation fins and the condenser tube according to an embodiment of the present invention;
[0034] Figure 5 is a structural schematic diagram of a second radiator according to an embodiment of the present invention;
[0035] Figure 6 is a schematic structural diagram of a third radiator according to an embodiment of the present invention;
[0036] Figure 7 It is a schematic diagram of an exploded structure at an angle of the first shunt seat according to an embodiment of the present invention;
[0037] Figure 8 It is a schematic diagram of the exploded structure of the first shunt seat in another angle according to an embodiment of the present invention;
[0038] Fig. 9 It is a schematic diagram of an exploded structure at an angle of the second shunt seat according to an embodiment of the present invention;
[0039] Fig.10 FIG. 1 is a schematic diagram of the exploded structure of the second shunt seat according to an embodiment of the present invention from another angle.
[0040] The meanings of the reference numerals are as follows:
[0041] 100, evaporation panel; 110, evaporation chamber; 111, sub-chamber; 120, partition; 130, first outer side; 140, second outer side; 141, first installation area; 142, second installation area; 150, working fluid gas outlet; 160, working fluid liquid inlet; 200, heat dissipation assembly; 210, condenser; 211, first condenser; 212, second condenser; 220, heat dissipation fin; 221, first flange; 222, second flange; 223, heat dissipation channel; 224, limit sleeve; 230, first diverter seat; 231, first gas-liquid chamber; 232, first gas collecting chamber; 233, second gas collecting chamber; 234 , the second liquid collecting chamber; 235, the first sealing cover; 236, the second sealing cover; 240, the second diverter seat; 241, the second gas-liquid chamber; 242, the first liquid collecting chamber; 243, the third gas collecting chamber; 244, the third liquid collecting chamber; 237, the third sealing cover; 238, the fourth sealing cover; 251, the first connecting area; 252, the second connecting area; 261, the first air inlet pipe; 262, the first liquid outlet pipe; 263, the second air inlet pipe; 264, the second liquid outlet pipe; 271, the third air inlet pipe; 272, the third liquid outlet pipe; 281, the fourth air inlet pipe; 282, the fourth liquid outlet pipe; 283, the fifth air inlet pipe; 284, the fifth liquid outlet pipe. DETAILED DESCRIPTION
[0042] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0043] In the description of the present invention, it is necessary to understand that the descriptions involving orientations, such as up, down, front, back, upper, lower, etc., and the orientations or positional relationships indicated are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0044] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0045] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0046] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0047] The present invention will be further described in detail below in conjunction with the accompanying drawings.
[0048] See also Figure 1 to Figure 2, a heat sink provided by an embodiment of the present invention, includes an evaporation panel 100 and a heat dissipation assembly 200, wherein the evaporation panel 100 has a first outer side surface 130 and a second outer side surface 140 opposite to each other, the first outer side surface 130 is used to fit the heat source to be cooled, the evaporation panel 100 is provided with an evaporation chamber 110 and a working medium gas outlet 150 and a working medium liquid inlet 160 connected to the evaporation chamber 110; the heat dissipation assembly 200 includes a stacked heat dissipation fin 220 and a condenser 210 (refer to Figure 3 ), the heat dissipation fins 220 are arranged on the second outer side surface 140, and the condenser 210 is penetrated by each heat dissipation fin 220. The two ends of the condenser 210 are respectively connected to the working medium gas outlet 150 and the working medium liquid inlet 160, so as to receive the steam discharged from the evaporation chamber 110 and transmit it back to the evaporation chamber 110.
[0049] The working medium gas outlet 150 is used to supply the gaseous refrigerant to flow out of the evaporation chamber 110 , and the working medium liquid inlet 160 is used to supply the liquid refrigerant to flow into the evaporation chamber 110 .
[0050] In specific applications, after the liquid refrigerant changes from liquid to gas in the evaporation chamber 110, the gaseous refrigerant flows into the condenser 210 from the refrigerant gas outlet 150. When the gaseous refrigerant passes through the condenser 210, the gaseous refrigerant changes from gas to liquid, and according to the thermal siphon effect, under the action of gravity and pressure difference, the liquid refrigerant flows back into the evaporation chamber 110 through the refrigerant liquid inlet 160, so as to be used for cooling again.
[0051] Among them, the condenser tube 210 is arranged through each heat dissipation fin 220. With such an arrangement, when the gaseous refrigerant passes through the condenser tube 210 quickly, the heat dissipation fin 220 can effectively cool the refrigerant in the condenser tube 210, so that the refrigerant changes from gas to liquid, and the refrigerant can be used for cooling after re-entering the evaporation chamber 110. At the same time, the heat dissipation fin 220 and the condenser tube 210 adopt the above-mentioned connection structure and are arranged on the second side. With such an arrangement, the evaporation panel 100 and the heat dissipation component 200 are compactly connected. More specifically, the evaporation panel 100 and the heat dissipation component 200 are equivalent to an integrated arrangement. The radiator occupies a small space when used and is easy to assemble. As can be seen from the above, the radiator adopts the above-mentioned structural form. The radiator not only takes into account the cooling effect of the heat dissipation component 200 on the refrigerant to ensure the cooling effect of the radiator, but also ensures that the overall space occupied by the radiator is small. The user can conveniently assemble it in its application equipment, that is, the application equipment does not need to reserve a large space to install the radiator. Therefore, the applicability of the radiator is strong.
[0052] In some embodiments, reference Figure 1 and Figure 2, each heat dissipation fin 220 is arranged in a fit with the second outer side surface 140. Specifically, the edge of the heat dissipation fin 220 close to the second outer side surface 140 can be connected together by a brazing technology such as flame welding or high frequency welding. Of course, the two can also be connected together in other ways, or the two are only in a fit state and are not welded. The present application does not limit the specific connection method. It can be understood that each heat dissipation fin 220 is arranged in a fit with the second outer side surface 140, that is, the heat dissipation component 200 and the evaporation panel 100 are tightly integrated. As a result, the radiator occupies a small space when used, so that it can be more flexibly applied to various application equipment. In addition, the heat dissipation fin 220 is arranged in a fit with the evaporation panel 100, and the heat dissipation fin 220 can also be used for cooling the evaporation panel 100 to ensure the cooling effect of the refrigerant in the evaporation panel 100.
[0053] In other possible embodiments, the heat dissipation fins 220 and the second side surface may also be spaced apart, and the distance between the spaced apart is relatively small. The heat dissipation fins 220 and the evaporation panel 100 are also equivalent to an integrated setting. The radiator occupies a small space when used, and can be flexibly applied to various application equipment.
[0054] In some embodiments, reference Figure 3 and Figure 4 , a heat dissipation channel 223 for airflow is defined between adjacent heat dissipation fins 220, wherein the airflow conveying direction of the heat dissipation channel 223 is arranged parallel to the evaporation panel 100. In a specific application, the radiator is in a vertically placed state, and a vertically arranged heat dissipation channel 223 is defined between adjacent heat dissipation fins 220, so that the airflow generated from the outside can pass through the heat dissipation channel 223 from bottom to top, thereby quickly cooling the heat dissipation fins 220, and then the heat dissipation fins 220 can effectively cool the refrigerant in the condenser 210, so that the refrigerant changes from gas to liquid in the condenser 210.
[0055] Furthermore, the side of each heat dissipation fin 220 is provided with a connection hole for the condenser tube 210 to pass through, and the heat dissipation fin 220 is provided with a limiting sleeve 224 around the connection hole. When the heat dissipation fin 220 and the condenser tube 210 are assembled, the limiting sleeve 224 is sleeved on the condenser tube 210, and the end of the limiting sleeve 224 is against the side of the adjacent heat dissipation fin 220, thereby, the limiting sleeve 224 makes the adjacent heat dissipation fins 220 spaced apart, so that a heat dissipation channel 223 is formed between the adjacent heat dissipation fins 220 for airflow to pass through. It can be understood that through the setting of the limiting sleeve 224, when the heat dissipation fin 220 is assembled on the condenser tube 210, the limiting sleeve 224 can keep a certain distance between the adjacent heat dissipation fins 220, without the need to specially assemble a partition to separate two adjacent heat dissipation fins 220, thereby, the heat dissipation fin 220 and the condenser tube 210 are more convenient to assemble.
[0056] Furthermore, the heat dissipation fin 220 is provided with a first flange 221 and a second flange 222 on two opposite sides, and the first flange 221 and the second flange 222 are arranged on the same side, wherein the side surface of the first flange 221 is arranged in contact with the second outer side surface 140 (refer to Figure 1 ), the edge of the second flange 222 is arranged to fit the side of the adjacent heat dissipation fins 220, so that a heat dissipation channel 223 is formed between the adjacent heat dissipation fins 220. It can be understood that, through the arrangement of the first flange 221, the first flange 221 increases the contact area between the heat dissipation fins 220 and the evaporation panel 100, so that the heat dissipation fins 220 can better cool the evaporation panel 100; and, through the arrangement of the second flange 222, the second flange 222 can effectively seal the opening of the heat dissipation channel 223 away from the evaporation panel 100, so that the airflow passes through the heat dissipation channel 223 between the adjacent heat dissipation fins 220 from bottom to top, and then the heat dissipation fins 220 can be effectively cooled.
[0057] In some embodiments, reference Figure 6 A plurality of condenser tubes 210 are provided, and each condenser tube 210 is arranged in the left-right direction through the heat dissipation fins 220. The condenser tubes 210 include a first condenser tube 211 and a second condenser tube 212. The air inlet of the first condenser tube 211 and the liquid outlet of the second condenser tube 212 are arranged on the same side, and the liquid outlet of the first condenser tube 211 and the air inlet of the second condenser tube 212 are arranged on the same side. Therefore, the refrigerant in the first condenser tube 211 and the second condenser tube 212 flow in opposite directions. For example, the refrigerant in the first condenser tube 211 flows to the left, and the refrigerant in the second condenser tube 212 flows to the right.
[0058] It can be understood that the first condenser tube 211 and the second condenser tube 212 are arranged in the above manner, and the heat dissipation fins 220 on the left and right sides can be fully utilized to absorb the heat generated by the refrigerant, rather than the heat dissipation fins 220 on the left or the heat dissipation fins 220 on the right needing to absorb most of the heat. In this arrangement, when the airflow passes through the heat dissipation fins 220, it can fully take away the heat generated by the heat dissipation fins 220, so that the heat dissipation fins 220 can fully dissipate the heat of the refrigerant.
[0059] In some embodiments, reference Figure 1 and Figure 3, along the height direction of the evaporation panel 100 when in use, the working medium gas outlet 150 is arranged higher than the working medium liquid inlet 160. Specifically, relative to the bottom of the evaporation chamber 110, the position where the working medium gas outlet 150 is arranged is high enough, so that after the refrigerant is converted from gaseous to liquid, the gaseous refrigerant can flow out through the working medium gas outlet 150. The working medium liquid inlet 160 is arranged at the bottom of the evaporation chamber 110 or close to the bottom of the evaporation chamber 110, that is, the working medium liquid inlet 160 is located at the position of the liquid refrigerant in the evaporation chamber 110, so that the working medium liquid inlet 160 is used to supply the liquid refrigerant to flow into the evaporation chamber 110. With such an arrangement, after the refrigerant is converted into gaseous state in the evaporation chamber 110, the gaseous refrigerant flows into the condenser 210 from the working medium gas outlet 150. After the gaseous refrigerant changes into liquid in the condenser 210 , it can flow into the evaporation chamber 110 again from the refrigerant liquid inlet 160 , thereby realizing the recycling of the refrigerant.
[0060] In one possible embodiment, referring to Figure 5 The heat dissipation assembly 200 further includes a first shunt seat 230 and a second shunt seat 240 . The first shunt seat 230 and the second shunt seat 240 are disposed at two ends of the second outer side surface 140 or the evaporation panel 100 , and are respectively disposed at two ends of the condenser 210 . Among them, the first flow splitter 230 is provided with a first gas-liquid cavity 231 connected with the working medium gas outlet 150 and the working medium liquid inlet 160, thereby, the gaseous refrigerant can flow from the evaporation cavity 110 into the first gas-liquid cavity 231 through the working medium gas outlet 150, or the liquid refrigerant can flow from the first gas-liquid cavity 231 into the evaporation cavity 110 through the working medium liquid inlet 160; similarly, the second flow splitter 240 is provided with a second gas-liquid cavity 241 connected with the working medium gas outlet 150 and the working medium liquid inlet 160, thereby, the gaseous refrigerant can flow from the evaporation cavity 110 into the second gas-liquid cavity 241 through the working medium gas outlet 150, or the liquid refrigerant can flow from the second gas-liquid cavity 241 into the evaporation cavity 110 through the working medium liquid inlet 160. At the same time, one end of the condenser 210 is connected with the first gas-liquid cavity 231, and the other end is connected with the second gas-liquid cavity 241.
[0061] Specifically, the heat dissipation assembly 200 further includes a first air inlet pipe 261, a first liquid outlet pipe 262, a second air inlet pipe 263 and a second liquid outlet pipe 264, wherein at least two working medium air outlets 150 and working medium liquid inlets 160 are provided, and the first air inlet pipe 261 is connected between the evaporation panel 100 and the first diverter seat 230 to connect one working medium air outlet 150 with the first gas-liquid cavity 231. The first liquid outlet pipe 262 is connected between the evaporation panel 100 and the first diverter seat 230, and the first liquid outlet pipe 262 connects one working medium liquid inlet 160 with the first gas-liquid cavity 231. The second air inlet pipe 263 is connected between the evaporation panel 100 and the second diverter seat 240, and the second air inlet pipe 263 connects another working medium air outlet 150 with the second gas-liquid cavity 241. The second liquid outlet pipe 264 is connected between the evaporation panel 100 and the second flow divider seat 240 , and the second liquid outlet pipe 264 connects the other working medium liquid inlet 160 with the second gas-liquid chamber 241 .
[0062] Specifically, the gaseous refrigerant enters the first gas-liquid cavity 231 from the first air inlet pipe 261, and flows into each condenser 210 from the first gas-liquid cavity 231; similarly, the gaseous refrigerant enters the second gas-liquid cavity 241 from the second air inlet pipe 263, and flows into each condenser 210 from the second gas-liquid cavity 241. After the gaseous refrigerant becomes liquid in the condenser 210, according to the pressure conditions of the first gas-liquid cavity 231 and the second gas-liquid cavity 241, the liquid refrigerant may flow into the first gas-liquid cavity 231 and flow back into the evaporation cavity 110 from the first liquid outlet pipe 262, or the liquid refrigerant may flow into the second gas-liquid cavity 241 and flow back into the evaporation cavity 110 from the second liquid outlet pipe 264.
[0063] In another possible embodiment, referring to Figure 1 The heat dissipation assembly 200 further includes a first flow diverter seat 230 and a second flow diverter seat 240, which are arranged at the two ends of the second outer side surface 140 or the evaporation panel 100, and are respectively arranged at the two ends of the condenser tube 210. The first flow diverter seat 230 is provided with a first gas collecting chamber 232 connected to the working medium gas outlet 150, so that the gaseous refrigerant in the evaporation chamber 110 can flow from the evaporation chamber 110 into the first gas collecting chamber 232 through the working medium gas outlet 150; and the second flow diverter seat 240 is provided with a first liquid collecting chamber 242 connected to the working medium liquid inlet 160, so that the liquid refrigerant in the first liquid collecting chamber 242 can flow from the first liquid collecting chamber 242 into the evaporation chamber 110 through the working medium liquid inlet 160. One end of the condenser tube 210 is connected to the first gas collecting chamber 232, and the other end is connected to the first liquid collecting chamber 242.
[0064] Furthermore, the heat dissipation assembly 200 also includes a third air inlet pipe 271 and a third liquid outlet pipe 272, wherein the third air inlet pipe 271 is connected between the evaporation panel 100 and the first diverter seat 230, and is used to connect the working medium air outlet 150 with the first gas collecting chamber 232; the third liquid outlet pipe 272 is connected between the evaporation panel 100 and the second diverter seat 240, and is used to connect the working medium liquid inlet 160 with the first liquid collecting chamber 242.
[0065] Specifically, the gaseous refrigerant enters the first gas collecting chamber 232 from the third gas inlet pipe 271, and flows into each condenser tube 210 from the first gas collecting chamber 232. When the gaseous refrigerant passes through each condenser tube 210, the gaseous refrigerant is converted from gas to liquid, and flows into the first liquid collecting chamber 242 along the condenser tube 210. Then, the liquid refrigerant in the first liquid collecting chamber 242 flows into the evaporation chamber 110 through the second liquid outlet pipe 264, so that the refrigerant is circulated.
[0066] In other possible embodiments, refer to Figure 6 The heat dissipation assembly 200 further includes a first shunt seat 230 and a second shunt seat 240, which are arranged at the second outer side surface 140 or at both ends of the evaporation panel 100, and are respectively arranged to connect to both ends of the condenser tube 210. The first shunt seat 230 is provided with a second gas collecting chamber 233 connected to the working medium gas outlet 150 and a second liquid collecting chamber 234 connected to the working medium liquid inlet 160, so that the gaseous refrigerant can flow into the second gas collecting chamber 233 through the working medium gas outlet 150 and thus the evaporation chamber 110, and the liquid refrigerant can flow into the evaporation chamber 110 from the second liquid collecting chamber 234 through the working medium liquid inlet 160. The second flow divider 240 is provided with a third gas collecting chamber 243 connected to the working medium gas outlet 150 and a third liquid collecting chamber 244 connected to the working medium liquid inlet 160, so that the gaseous refrigerant can flow into the third gas collecting chamber 243 through the working medium gas outlet 150 and the evaporation chamber 110, and the liquid refrigerant can flow into the evaporation chamber 110 from the third liquid collecting chamber 244 through the working medium liquid inlet 160. At the same time, the condenser 210 includes a first condenser 211 and a second condenser 212, one end of the first condenser 211 is connected to the second gas collecting chamber 233, and the other end is connected to the third liquid collecting chamber 244; one end of the second condenser 212 is connected to the second liquid collecting chamber 234, and the other end is connected to the third gas collecting chamber 243.
[0067] Further, the heat dissipation assembly 200 further includes a fourth air inlet pipe 281, a fourth liquid outlet pipe 282, a fifth air inlet pipe 283 and a fifth liquid outlet pipe 284, wherein at least two working medium air outlets 150 and working medium liquid inlets 160 are provided, and the fourth air inlet pipe 281 is connected between the evaporation panel 100 and the first flow diverter seat 230 to connect one working medium air outlet 150 with the second gas collection chamber 233. The fourth liquid outlet pipe 282 is connected between the evaporation panel 100 and the first flow diverter seat 230 to connect one working medium liquid inlet 160 with the second liquid collection chamber 234. The fifth air inlet pipe 283 is connected between the evaporation panel 100 and the second flow diverter seat 240 to connect another working medium air outlet 150 with the third gas collection chamber 243. The fifth liquid outlet pipe 284 is connected between the evaporation panel 100 and the second flow divider seat 240 to connect the other working medium liquid inlet 160 with the third liquid collecting chamber 244 .
[0068] Specifically, in one cycle, the gaseous refrigerant flows from the evaporation chamber 110 into the second gas collecting chamber 233 through the fourth air inlet pipe 281, and flows from the second gas collecting chamber 233 into each first condenser tube 211. The gaseous refrigerant flows from the first condenser tube 211 to the third liquid collecting chamber 244. When passing through the first condenser tube 211, the refrigerant is converted from gas to liquid and flows into the third liquid collecting chamber 244. Then, the liquid refrigerant flows from the third liquid collecting chamber 244 into the evaporation chamber 110 through the fifth liquid outlet pipe 284, so as to realize the recycling of the refrigerant.
[0069] In another reverse cycle, the gaseous refrigerant flows from the evaporation chamber 110 into the third gas collecting chamber 243 through the fifth air inlet pipe 283, and flows from the third gas collecting chamber 243 into each second condenser tube 212. The gaseous refrigerant flows from the second condenser tube 212 to the second liquid collecting chamber 234, and when passing through the second condenser tube 212, the refrigerant is converted from gas to liquid and flows into the second liquid collecting chamber 234. Then, the liquid refrigerant flows from the second liquid collecting chamber 234 into the evaporation chamber 110 through the fourth liquid outlet pipe 282, so as to realize the recycling of the refrigerant.
[0070] It is understandable that the first condenser tube 211 and the second condenser tube 212 adopt opposite conveying directions, compared with all condenser tubes 210 adopting the same conveying direction, with such a configuration, the first diverter seat 230 can reduce the arrangement of the air inlet pipe to replace it with a liquid outlet pipe, and correspondingly, the second diverter seat 240 can reduce the arrangement of the liquid outlet pipe to replace it with an air inlet pipe. And because the air inlet pipe and the liquid outlet pipe are usually arranged in different areas, it effectively avoids arranging more air inlet pipes or liquid outlet pipes in the same area, thereby reducing the bending degree of the pipe, and further ensuring that the refrigerant can circulate smoothly.
[0071] Moreover, when the power of the heat source is inconsistent or the power distribution is uneven, the first condenser tube 211 and the second condenser tube 212 adopt opposite delivery methods to adjust the ratio of the air intake and condensation area on both sides. For example, the power on the right side is high and there is more steam, so the gas collecting cavity structure can be changed so that the gas on the right side can enter more condenser tubes 210 for condensation. There is less steam on the left side, so it can be allocated to fewer condenser tubes 210.
[0072] Further, refer to Figures 7 to 10 The second gas collecting chamber 233 is arranged on one side of the first diverter seat 230, the second liquid collecting chamber 234 is arranged on the other side of the first diverter seat 230, and a first sealing cover 235 for sealing the second gas collecting chamber 233 is arranged on one side of the first diverter seat 230, and a second sealing cover 236 for sealing the second liquid collecting chamber 234 is arranged on the other side of the first diverter seat 230; similarly, the third gas collecting chamber 243 is arranged on one side of the second diverter seat 240, and the third liquid collecting chamber 244 is arranged on the other side of the second diverter seat 240, and a third sealing cover 237 for sealing the third gas collecting chamber 243 is arranged on one side of the second diverter seat 240, and a fourth sealing cover 238 for sealing the third liquid collecting chamber 244 is arranged on the other side of the second diverter seat 240. As can be seen from the above, the first shunt seat 230 and the second shunt seat 240 adopt the above-mentioned structural form. The first shunt seat 230 and the second shunt seat 240 have a simple structure and are easy to manufacture. They can be easily manufactured using CNC equipment.
[0073] In some embodiments, reference Figure 1 and Figure 3 , along the upward direction of the evaporation panel 100 when in use, the second outer side surface 140 is divided into a first installation area 141 and a second installation area 142, the working medium gas outlet 150 and the working medium liquid inlet 160 are arranged in the first installation area 141, the air inlet pipe and the liquid outlet pipe of the heat dissipation assembly 200 are arranged in the first installation area 141 to communicate with the working medium gas outlet 150 and the working medium liquid inlet 160, and the heat dissipation fins 220 are arranged in the second installation area 142. In this way, the air inlet pipe and the liquid outlet pipe are easy to install and disassemble with the first diverter seat 230 and the second diverter seat 240, so as to facilitate the maintenance of the radiator; moreover, the air inlet pipe and the liquid outlet pipe are convenient to arrange, and the air inlet pipe and the liquid outlet pipe do not need to be extended in a complicated manner, so as to ensure that the refrigerant can flow smoothly along the air inlet pipe and the liquid outlet pipe, thereby ensuring the cooling efficiency of the radiator.
[0074] In some embodiments, reference Figure 1 and Figure 3, along the upward direction of the radiator when in use, the first shunt seat 230 and the second shunt seat 240 are divided into a first connection area 251 and a second connection area 252 on one side close to the heat dissipation fin 220, the air inlet pipe and the liquid outlet pipe of the heat dissipation assembly 200 are connected to the first connection area 251, and the heat dissipation fin 220 is arranged in the second connection area 252. With such an arrangement, the arrangement of the air inlet pipe and the liquid outlet pipe is more convenient, and the air inlet pipe and the liquid outlet pipe do not need to be extended in a more complicated manner, thereby ensuring that the refrigerant can flow smoothly along the air inlet pipe and the liquid outlet pipe, thereby ensuring the cooling efficiency of the radiator.
[0075] In some embodiments, reference Figure 1 and Figure 3 , two or more heat dissipation components 200 are provided, and a partition portion 120 is provided on the inner side of the evaporation chamber 110 along the height direction of the evaporation panel 100 when in use, so as to divide the evaporation chamber 110 into sub-cavities 111 of the same number as the heat dissipation components 200, and each radiator is arranged on the outside of each sub-cavity 111. In other embodiments, the heat dissipation component 200 can also be provided as one, which is specifically provided according to actual needs. It can be understood that the evaporation panel 100 is provided with multiple heat dissipation components 200 on the second side, and each heat dissipation component 200 and a corresponding sub-cavity 111 form a refrigeration system. Therefore, the evaporation panel 100 is provided with multiple independent refrigeration systems, so that each area of the first side of the evaporation panel 100 can effectively absorb heat from the heat source, thereby ensuring the heat dissipation effect of the radiator.
[0076] The present application also discloses a chip device, comprising the above-mentioned heat sink.
[0077] It is understandable that, referring to Figure 1 and Figure 3 The chip device adopts the above-mentioned radiator, and the condenser tube 210 is arranged through each heat dissipation fin 220. With such an arrangement, when the gaseous refrigerant passes through the condenser tube 210 quickly, the heat dissipation fin 220 can effectively cool the refrigerant in the condenser tube 210, so that the refrigerant changes from gas to liquid, and the refrigerant can be used for cooling after re-entering the evaporation chamber 110. At the same time, the heat dissipation fin 220 and the condenser tube 210 are arranged on the second side. With such an arrangement, the evaporation panel 100 and the heat dissipation component 200 are compactly connected. More specifically, the evaporation panel 100 and the heat dissipation component 200 are equivalent to an integrated arrangement. The radiator occupies a small space when used and is easy to assemble. As can be seen from the above, the radiator adopts the above-mentioned structural form. The radiator not only takes into account the cooling effect of the heat dissipation component 200 on the refrigerant to ensure the cooling effect of the radiator, but also ensures that the overall space occupied by the radiator is small, and the user can conveniently assemble it in its chip device, that is, the chip device does not need to reserve a large space to install the radiator, so the applicability of the radiator is strong.
[0078] The technical means disclosed in the scheme of the present invention are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical schemes composed of any combination of the above-mentioned technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also regarded as the protection scope of the present invention.
Claims
1. A radiator, characterized in that: include: An evaporation panel having a first outer side surface and a second outer side surface opposite to each other, wherein the first outer side surface is used to be attached to a heat source to be cooled, and the evaporation panel is provided with an evaporation chamber and a working fluid gas outlet and a working fluid liquid inlet connected to the evaporation chamber; The heat dissipation component includes stacked heat dissipation fins and condensation tubes, the heat dissipation fins are arranged on the second outer side surface, the condensation tubes are passed through each of the heat dissipation fins, and the two ends of the condensation tubes are respectively connected to the working medium gas outlet and the working medium liquid inlet, so as to receive the steam discharged from the evaporation chamber and transmit it back to the evaporation chamber.
2. The heat sink according to claim 1, characterized in that: Each of the heat dissipation fins is arranged in close contact with the second outer side surface or is arranged at a distance therefrom.
3. The heat sink according to claim 1, characterized in that: A heat dissipation channel for airflow to pass through is defined between adjacent heat dissipation fins, wherein the airflow conveying direction of the heat dissipation channel is arranged parallel to the evaporation panel.
4. The heat sink according to claim 3, characterized in that: The side of the heat dissipation fin is provided with a connection hole for the condenser tube to pass through, and the heat dissipation fin is provided with a limiting sleeve around the connection hole. The limiting sleeve is sleeved on the condenser tube and abuts against the side of the adjacent heat dissipation fin to form the heat dissipation channel between the adjacent heat dissipation fins.
5. The heat sink according to claim 3, characterized in that: The heat dissipation fin is provided with a first flange and a second flange on two opposite sides, wherein the side surface of the first flange is fitted with the second outer side surface, and the edge of the second flange is fitted with the side surface of the adjacent heat dissipation fin, so as to form the heat dissipation channel between the adjacent heat dissipation fins.
6. The heat sink according to claim 1, characterized in that There are multiple condensers and they are all passed through the heat dissipation fins. The condensers include a first condenser and a second condenser. The air inlet of the first condenser is arranged on the same side as the liquid outlet of the second condenser, and the liquid outlet of the first condenser is arranged on the same side as the air inlet of the second condenser.
7. The heat sink according to claim 1, characterized in that: Along the height direction of the evaporation panel when in use, the working medium gas outlet is arranged higher than the working medium liquid inlet, so that the gaseous refrigerant in the evaporation chamber enters the condenser tube from the working medium gas outlet, and the liquid working medium in the condenser tube enters the evaporation chamber from the working medium liquid inlet.
8. The heat sink according to claim 1, characterized in that The heat dissipation component also includes a first diverter seat and a second diverter seat, and the first diverter seat and the second diverter seat are respectively connected to the two ends of the condenser, wherein the first diverter seat is provided with a first gas-liquid cavity connected to the working fluid gas outlet and the working fluid liquid inlet, and the second diverter seat is provided with a second gas-liquid cavity connected to the working fluid gas outlet and the working fluid liquid inlet, one end of the condenser is connected to the first gas-liquid cavity, and the other end is connected to the second gas-liquid cavity.
9. The heat sink according to claim 8, characterized in that: The heat dissipation component also includes a first air inlet pipe, a first liquid outlet pipe, a second air inlet pipe and a second liquid outlet pipe, wherein there are at least two working fluid air outlets and two working fluid liquid inlets, the first air inlet pipe connects one working fluid air outlet with the first gas-liquid cavity, and the first liquid outlet pipe connects one working fluid liquid inlet with the first gas-liquid cavity; the second air inlet pipe connects another working fluid air outlet with the second gas-liquid cavity, and the second liquid outlet pipe connects another working fluid liquid inlet with the second gas-liquid cavity.
10. The heat sink according to claim 1, characterized in that The heat dissipation component also includes a first diverter seat and a second diverter seat, and the first diverter seat and the second diverter seat are respectively connected to the two ends of the condenser, wherein the first diverter seat is provided with a first gas collecting cavity connected to the working fluid gas outlet, and the second diverter seat is provided with a first liquid collecting cavity connected to the working fluid liquid inlet, one end of the condenser is connected to the first gas collecting cavity, and the other end is connected to the first liquid collecting cavity.
11. The heat sink according to claim 10, characterized in that The heat dissipation component also includes a third air inlet pipe and a third liquid outlet pipe, wherein the third air inlet pipe connects the working medium air outlet with the first air collecting chamber, and the third liquid outlet pipe connects the working medium liquid inlet with the first liquid collecting chamber.
12. The heat sink according to claim 1, characterized in that The heat dissipation assembly further includes a first shunt seat and a second shunt seat, wherein the first shunt seat and the second shunt seat are respectively connected to the two ends of the condenser tube, wherein the first shunt seat is provided with a second gas collecting cavity connected to the working medium gas outlet and a second liquid collecting cavity connected to the working medium liquid inlet, and the second shunt seat is provided with a third gas collecting cavity connected to the working medium gas outlet and a third liquid collecting cavity connected to the working medium liquid inlet; The condenser includes a first condenser and a second condenser, one end of the first condenser is connected to the second gas collecting chamber, and the other end is connected to the third liquid collecting chamber; one end of the second condenser is connected to the second liquid collecting chamber, and the other end is connected to the third gas collecting chamber.
13. The heat sink according to claim 12, characterized in that The heat dissipation component also includes a fourth air inlet pipe, a fourth liquid outlet pipe, a fifth air inlet pipe and a fifth liquid outlet pipe, wherein there are at least two working fluid air outlets and two working fluid liquid inlets, the fourth air inlet pipe connects one working fluid air outlet with the second air collecting chamber, the fourth liquid outlet pipe connects one working fluid liquid inlet with the second liquid collecting chamber; the fifth air inlet pipe connects another working fluid air outlet with the third air collecting chamber, and the fifth liquid outlet pipe connects another working fluid liquid inlet with the third liquid collecting chamber.
14. The heat sink according to claim 12, characterized in that The second gas collecting chamber is arranged on one side of the first flow diverter seat, and the second liquid collecting chamber is arranged on the other side of the first flow diverter seat. A first sealing cover for sealing the second gas collecting chamber is arranged on one side of the first flow diverter seat, and a second sealing cover for sealing the second liquid collecting chamber is arranged on the other side of the first flow diverter seat; The third gas collecting chamber is arranged on one side of the second diverter seat, and the third liquid collecting chamber is arranged on the other side of the second diverter seat. A third sealing cover for sealing the third gas collecting chamber is arranged on one side of the second diverter seat, and a fourth sealing cover for sealing the third liquid collecting chamber is arranged on the other side of the second diverter seat.
15. The radiator according to any one of claims 8 to 13, characterized in that: The first flow diverter seat and the second flow diverter seat are arranged on the second outer side surface or at two ends of the evaporation panel.
16. The radiator according to any one of claims 8 to 13, characterized in that: Along the upward direction of the evaporation panel when in use, the second outer side surface is divided into a first installation area and a second installation area, the air inlet pipe and liquid outlet pipe of the heat dissipation assembly are arranged in the first installation area, and the heat dissipation fins are arranged in the second installation area.
17. The heat sink according to claim 16, characterized in that Along the upward direction of the radiator when in use, the first diverter seat and the second diverter seat are divided into a first connection area and a second connection area on one side close to the heat dissipation fins, the air inlet pipe and the liquid outlet pipe of the heat dissipation assembly are connected to the first connection area, and the heat dissipation fins are arranged in the second connection area.
18. The heat sink according to claim 1, characterized in that One heat dissipation component is provided, or two or more heat dissipation components are provided. Along the height direction of the evaporation panel when in use, a partition portion is provided on the inner side of the evaporation chamber to divide the evaporation chamber into sub-cavities of the same number as the heat dissipation components, and each of the radiators is arranged one by one on the outer side of each of the sub-cavities.
19. A chip device, characterized in that: A heat sink comprising any one of claims 1 to 18.