Connectors, battery management system boards, and battery packs

Abstract

The present disclosure provides a connector, a battery management system circuit board, and a battery pack. A connector mounted on a printed circuit board includes: a first layer, including connector holes, spark gaps, and conductor wires, the connector holes having an array structure of two or more columns and allowing connector pins to be inserted therein, the spark gap between a first connector hole among the plurality of connector holes and a ground of the printed circuit board, the conductor wire having an end connected to a second connector hole among the plurality of connector holes, the conductor wire being arranged between the ground of the printed circuit board and the second connector hole; and a second layer stacked on a surface of the first layer, the second layer including a plurality of connector holes vertically spaced apart from and corresponding to the plurality of connector holes of the first layer and a spark gap between a connector hole corresponding to the second connector hole of the first layer among the plurality of connector holes of the second layer and the ground of the printed circuit board.

Description

Technical Field

[0001] Embodiments relate to a multi-layer connector structure including a spark gap. Background Art

[0002] The electrostatic discharge (ESD) test for connectors is a test that applies ESD to protruding connector pins to check for damage, failure, etc. of the circuit board. Generally, in order to protect against ESD, an ESD capacitor and a transient voltage suppressor (TVS) are added to each connector pin or a connector spark gap is provided. Specifically, conventional connectors with spark gaps include connectors of a (1-Layer) structure. Therefore, on a circuit board including a connector having a structure with two or more columns, conductor lines overlap in the circuit design. This causes difficulties in circuit design and makes it difficult to adopt such a spark gap. Summary of the invention

[0003] An embodiment includes a connector mounted on a printed circuit board, the connector comprising a first layer. The first layer comprises: a plurality of connector holes having an array structure of two or more columns, allowing connector pins to be inserted therein; a spark gap between at least one first connector hole among the plurality of connector holes and a ground of the printed circuit board; and a conductor line having an end connected to at least one second connector hole among the plurality of connector holes, the conductor line being arranged between the ground of the printed circuit board and the at least one second connector hole. The connector also comprises a second layer stacked on a surface of the first layer, the second layer comprising: a plurality of connector holes vertically spaced apart from and corresponding to the plurality of connector holes of the first layer; and a spark gap between a connector hole among the plurality of connector holes of the second layer corresponding to the at least one second connector hole of the first layer and the ground of the printed circuit board.

[0004] The connector may further include a third layer stacked with the first and second layers. The third layer may include a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer and the plurality of connector holes of the second layer and corresponding to the plurality of connector holes of the first layer and the plurality of connector holes of the second layer.

[0005] The third layer may include a spark gap between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the third layer and a ground of the printed circuit board.

[0006] The connector may further include a fourth layer stacked with the first layer, the second layer, and the third layer. The fourth layer may include a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer, the plurality of connector holes of the second layer, and the plurality of connector holes of the third layer and corresponding to the plurality of connector holes of the first layer, the plurality of connector holes of the second layer, and the plurality of connector holes of the third layer.

[0007] The fourth layer may include a spark gap between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the fourth layer and a ground of the printed circuit board.

[0008] The spark gap may include a gap between each of the connector holes having an electrostatic discharge protection function and a ground of the printed circuit board.

[0009] The spark gap may include a gap between a ground protrusion connected to a ground of the printed circuit board and a hole protrusion protruding from the connector hole in a shape corresponding to the ground protrusion.

[0010] The ground protrusion portion and the hole protrusion portion may each include a copper foil layer in a triangular patch shape facing each other.

[0011] A battery management system circuit board may include the connector.

[0012] The battery management system circuit board may also include a third layer stacked with the first layer and the second layer, the third layer including a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer and the plurality of connector holes of the second layer and corresponding to the plurality of connector holes of the first layer and the plurality of connector holes of the second layer.

[0013] The third layer may include a spark gap between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the third layer and a ground of the printed circuit board.

[0014] The battery management system circuit board may also include a fourth layer stacked with the first layer, the second layer and the third layer, the fourth layer including a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer, the plurality of connector holes of the second layer and the plurality of connector holes of the third layer and corresponding to the plurality of connector holes of the first layer, the plurality of connector holes of the second layer and the plurality of connector holes of the third layer.

[0015] The fourth layer may include a spark gap between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the fourth layer and a ground of the printed circuit board.

[0016] The spark gap may include a gap between each of the connector holes having an electrostatic discharge protection function and a ground of the printed circuit board.

[0017] The spark gap may include a gap between a ground protrusion connected to a ground of the printed circuit board and a hole protrusion protruding from the connector hole in a shape corresponding to the ground protrusion.

[0018] The ground protrusion portion and the hole protrusion portion may each include a copper foil layer in a triangular patch shape facing each other.

[0019] A battery pack may include the battery management system circuit board.

[0020] An embodiment includes a multilayer connector, which includes: a first printed circuit board layer, having a first plurality of connector holes in an array structure of two or more columns and allowing connector pins to be inserted therein; a first conductive member, coupled to the first printed circuit board layer at one or more first connector holes in the first plurality of connector holes, the first conductive member being spaced apart from a second conductive member connected to a ground of the first printed circuit board layer to produce a first spark gap; a second printed circuit board layer, stacked on a surface of the first printed circuit board layer, the second printed circuit board layer having a second plurality of connector holes spaced apart and aligned vertically with the first plurality of connector holes; and a third conductive member, coupled to the second printed circuit board layer at one or more second connector holes in the second plurality of connector holes, the third conductive member being spaced apart from a fourth conductive member connected to a ground of the second printed circuit board layer to produce a second spark gap.

[0021] The multilayer connector may also include: a third printed circuit board layer stacked with the first printed circuit board layer and the second printed circuit board layer, the third printed circuit board layer including a third plurality of connector holes vertically spaced apart and aligned with the first plurality of connector holes and the second plurality of connector holes; and a fifth conductive member coupled to the third printed circuit board layer at one or more of the third plurality of connector holes, the fifth conductive member being spaced apart from a grounded sixth conductive member connected to the third printed circuit board layer to produce a third spark gap.

[0022] The multilayer connector may also include: a fourth printed circuit board layer stacked with the first printed circuit board layer, the second printed circuit board layer and the third printed circuit board layer, the fourth printed circuit board layer including a fourth plurality of connector holes vertically spaced apart and aligned with the first plurality of connector holes, the second plurality of connector holes and the third plurality of connector holes; and a seventh conductive member coupled to the fourth printed circuit board layer at one or more fourth connector holes among the fourth plurality of connector holes, the seventh conductive member being spaced apart from an eighth conductive member connected to ground on the fourth printed circuit board layer to produce a fourth spark gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Features will become apparent to those skilled in the art by describing in detail exemplary embodiments with reference to the accompanying drawings, in which:

[0024] Figure 1 is a view for describing a connector according to an embodiment of the present disclosure;

[0025] Figure 2 and Figure 3 schematically illustrates a connector according to an embodiment of the present disclosure; and

[0026] Figure 4 is a view for describing a spark gap according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0027] In the accompanying drawings, the sizes of layers and regions may be exaggerated or reduced for clarity of illustration. It will also be understood that if a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or there may be intervening layers. In addition, it will be understood that if a layer is referred to as being "below" another layer, it can be directly below, or there may be one or more intervening layers. In addition, it will be understood that if a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or there may be one or more intervening layers. The same reference numerals refer to the same elements throughout.

[0028] Expressions such as “at least one of,” if preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

[0029] In the following embodiments, the X-axis, Y-axis, and Z-axis are not limited to the three axes on the orthogonal coordinate system and can be interpreted in a broad sense including them. For example, the X-axis, Y-axis, and Z-axis can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other.

[0030] Figure 1 2 is a view for describing a connector according to an embodiment of the present disclosure.

[0031] Reference Figure 1 , showing an example of a connector of a (1-Layer) structure. For example, the connector may include connector pins inserted therein and arranged in a 2-column array structure.

[0032] The connector may include a plurality of connector holes 10 having a 2-row array structure, into which connector pins may be inserted.

[0033] Reference Figure 1, the connector may include a spark gap 20 between at least one first connector hole 11 among the plurality of connector holes 10 and a ground 60 of the printed circuit board.

[0034] The connector may include a conductor wire 50 having an end connected to at least one second connector hole 12 of the plurality of connector holes 10. For example, referring to Figure 1 , the conductor wire 50 can be connected to the at least one second connector hole 12 and thus electrically connected to the connector pin. In the case where a connector having a structure of two or more rows includes the conductor wire 50, applying the spark gap 20 may be difficult due to the arrangement of the conductor wire 50. For example, referring to Figure 1 In the case of a connector having a structure of two or more columns, the conductor line 50 may be formed between the at least one second connector hole 12 and the ground 60 of the printed circuit board, so that the spark gap 20 may not be applied to the at least one second connector hole 12. In this case, if ESD is applied to the connector pin inserted into the connector hole 10 to which the spark gap 20 is not applied, the circuit board or components may be damaged by the ESD.

[0035] Figure 2 and Figure 3 A connector according to an embodiment of the present disclosure is schematically shown.

[0036] Reference Figure 2 , shows a connector including four layers according to an embodiment of the present disclosure. It will be understood that there may be more or fewer layers. Figure 3 , showing Figure 2 For example, referring to Figure 3 The partial section 45 of FIG. 4 shows connectors including spark gaps 20 in the second layer (2-Layer), the third layer (3-Layer), and the fourth layer (4-Layer) for the connector hole 10 in the first layer (1-Layer) to which the spark gap 20 is not applied.

[0037] In one layer of a connector including connector holes having a two or more row structure, connector holes 10 may be formed without applying spark gaps 20. However, a connector including a multi-layer structure according to an embodiment of the present disclosure may form spark gaps in another layer for connector holes 10 without applying spark gaps 20, thereby preventing damage caused by ESD.

[0038] Reference Figure 1 and Figure 2, the connector according to the embodiment of the present disclosure may be mounted on a printed circuit board. For example, a battery management system (BMS) circuit board according to the embodiment of the present disclosure may include a printed circuit board on which the connector according to the present disclosure is mounted. A battery pack according to the embodiment of the present disclosure may include a printed circuit board on which the connector according to the present disclosure is mounted.

[0039] The connector according to an embodiment of the present disclosure may include a first layer (1-Layer) and a second layer (2-Layer). Here, each of the first layer (1-Layer) and the second layer (2-Layer) may represent a layer of the connector. Each of the first layer (1-Layer) and the second layer (2-Layer) may also represent a layer of a printed circuit board. In this case, the connector according to an embodiment of the present disclosure may represent a connector of a structure in which two layers may be stacked.

[0040] The first layer (1-Layer) may include a plurality of connector holes 10 having an array structure of two or more columns and allowing connector pins to be inserted therein. Figure 1 and Figure 2 , the first layer (1-Layer) may include a plurality of connector holes 10 having a 2-column array structure and allowing connector pins to be inserted therein. However, the present disclosure is not limited thereto, and the connector according to an embodiment of the present disclosure may include a plurality of connector holes 10 having an array structure of two or more columns (such as three columns or four columns, etc.).

[0041] The first layer (1-Layer) may include a spark gap 20 between the at least one first connector hole 11 and the ground 60 of the printed circuit board. A detailed description of the spark gap 20 will be provided later.

[0042] The first layer (1-Layer) may include a conductor line 50 having an end portion connected to the at least one second connector hole 12. For example, the conductor line 50 may be a conductive pattern formed on a printed circuit board.

[0043] The second layer (2-Layer) may be arranged to be stacked on a surface of the first layer (1-Layer) (e.g., Figure 2 For example, referring to Figure 2 , the second layer (2-Layer) may be arranged in parallel with the first layer (1-Layer) in such a manner as to be stacked below the first layer (1-Layer). In other embodiments, the second layer (2-Layer) may be arranged in parallel with the first layer (1-Layer) in such a manner as to be stacked on the first layer (1-Layer).

[0044] The second layer (2-Layer) may include a plurality of connector holes 10 that are vertically spaced apart from the plurality of connector holes 10 of the first layer (1-Layer) and correspond to (e.g., are aligned with) the plurality of connector holes 10 of the first layer (1-Layer). Figure 2 , the second layer (2-Layer) may include a plurality of connector holes 10 spaced apart from and corresponding to the plurality of connector holes 10 of the first layer (1-Layer) in the Y-axis direction perpendicular to the first layer (1-Layer) (for example, if the X-axis is the main axis of the first layer (1-Layer)). For example, the plurality of connector holes 10 may be formed to penetrate the first layer (1-Layer) and the second layer (2-Layer). In this case, the connector pins may be inserted into the connector holes 10 penetrating the first layer (1-Layer) and the second layer (2-Layer).

[0045] The second layer (2-Layer) may include a spark gap 20 between a connector hole 10 corresponding to the at least one second connector hole 12 of the first layer (1-Layer) among the plurality of connector holes 10 of the second layer (2-Layer) and a ground 60 of the printed circuit board. Figure 2 and Figure 3 , the second layer (2-Layer) may include a spark gap 20 between the ground of the printed circuit board and the connector hole 10 of the second layer (2-Layer), and since the conductor line 50 is arranged between the ground 60 of the printed circuit board and the at least one second connector hole 12 of the first layer (1-Layer), the spark gap is not applied to the at least one second connector hole 12 of the first layer (1-Layer). More specifically, for the second connector hole 12 of the first layer (1-Layer) to which the spark gap is not applied due to the conductor line 50 being arranged between the ground 60 of the printed circuit board and the at least one second connector hole 12 of the first layer (1-Layer), the spark gap not included on the first layer (1-Layer) may be provided on the second layer (2-Layer).

[0046] The connector according to the embodiment of the present disclosure may further include a third layer (3-Layer). In this case, the connector according to the embodiment of the present disclosure may refer to a connector having a structure in which three layers including the first layer (1-Layer) to the third layer (3-Layer) may be stacked.

[0047] The third layer (3-Layer) may be arranged to be stacked with the first layer (1-Layer) and the second layer (2-Layer). Figure 2, the third layer (3-Layer) may be arranged in parallel with the first layer (1-Layer) and the second layer (2-Layer) in such a manner as to be stacked below the first layer (1-Layer) and the second layer (2-Layer). In other embodiments, the third layer (3-Layer) may be arranged in parallel with the first layer (1-Layer) and the second layer (2-Layer) in such a manner as to be stacked on the first layer (1-Layer) and the second layer (2-Layer).

[0048] The third layer (3-Layer) may include a plurality of connector holes 10 vertically spaced apart from and corresponding to the plurality of connector holes 10 of each of the first layer (1-Layer) and the second layer (2-Layer). Figure 2 , the third layer (3-Layer) may include a plurality of connector holes 10 spaced apart from and corresponding to the plurality of connector holes 10 in each of the first layer (1-Layer) and the second layer (2-Layer) in the Y-axis direction perpendicular to the first layer (1-Layer) and the second layer (2-Layer) (for example, if the main axis of the first layer (1-Layer) is the X-axis). For example, the plurality of connector holes 10 may be formed to penetrate the first layer (1-Layer), the second layer (2-Layer), and the third layer (3-Layer). In this case, the connector pins may be inserted into the connector holes 10 penetrating the first layer (1-Layer), the second layer (2-Layer), and the third layer (3-Layer).

[0049] The third layer (3-Layer) may include a spark gap 20 between a connector hole 10 corresponding to the at least one second connector hole 12 of the first layer (1-Layer) among the plurality of connector holes 10 of the third layer (3-Layer) and a ground 60 of the printed circuit board. Figure 2 and Figure 3, the third layer (3-Layer) may include a spark gap 20 between the ground 60 of the printed circuit board and the connector hole 10, and the spark gap 20 is not applied to the at least one second connector hole 12 of the first layer (1-Layer) because the conductor line 50 is arranged between the ground 60 of the printed circuit board and the at least one second connector hole 12 of the first layer (1-Layer). More specifically, for the second connector hole 12 of the first layer (1-Layer) to which the spark gap 20 is not applied because the conductor line 50 is arranged between the ground 60 of the printed circuit board and the at least one second connector hole 12 of the first layer (1-Layer), the spark gap 20 not included on the first layer (1-Layer) may be provided on the third layer (3-Layer). In this case, the spark gap 20 not provided on the first layer (1-Layer) may be provided on the second layer (2-Layer) and the third layer (3-Layer), thereby doubly preventing damage due to ESD.

[0050] The connector according to the embodiment of the present disclosure may further include a fourth layer (4-Layer). In this case, the connector according to the embodiment of the present disclosure may provide a connector having a structure in which four layers including the first layer (1-Layer) to the fourth layer (4-Layer) can be stacked.

[0051] The fourth layer (4-Layer) can be stacked with the first layer (1-Layer), the second layer (2-Layer) and the third layer (3-Layer). For example, refer to Figure 2 , the fourth layer (4-Layer) may be arranged in parallel with the first layer (1-Layer), the second layer (2-Layer) and the third layer (3-Layer) in such a manner as to be stacked below the first layer (1-Layer), the second layer (2-Layer) and the third layer (3-Layer). In other embodiments, the fourth layer (4-Layer) may be arranged in parallel with the first layer (1-Layer), the second layer (2-Layer) and the third layer (3-Layer) in such a manner as to be stacked on the first layer (1-Layer), the second layer (2-Layer) and the third layer (3-Layer).

[0052] The fourth layer (4-Layer) may include a plurality of connector holes 10 vertically spaced apart from and corresponding to the plurality of connector holes 10 of each of the first layer (1-Layer), the second layer (2-Layer), and the third layer (3-Layer). Figure 2, the fourth layer (4-Layer) may include a plurality of connector holes 10 spaced apart from and corresponding to the plurality of connector holes 10 of each of the first layer (1-Layer), the second layer (2-Layer), and the third layer (3-Layer) in the Y-axis direction perpendicular to the first layer (1-Layer), the second layer (2-Layer), and the third layer (3-Layer) (for example, if the main axis of the first layer is the X-axis). For example, the plurality of connector holes 10 may be formed to penetrate the first layer (1-Layer), the second layer (2-Layer), the third layer (3-Layer), and the fourth layer (4-Layer). In this case, the connector pins may be inserted into the connector holes 10 penetrating the first layer (1-Layer), the second layer (2-Layer), the third layer (3-Layer), and the fourth layer (4-Layer).

[0053] The fourth layer (4-Layer) may include a spark gap 20 between a connector hole 10 corresponding to the at least one second connector hole 12 of the first layer (1-Layer) among the plurality of connector holes 10 of the fourth layer (4-Layer) and a ground 60 of the printed circuit board. Figure 2 and Figure 3 , the fourth layer (4-Layer) may include a spark gap 20 between the ground 60 of the printed circuit board and the connector hole 10 of the fourth layer (4-Layer), and the spark gap is not applied to the at least one second connector hole 12 of the first layer (1-Layer) because the conductor line 50 is arranged between the ground 60 of the printed circuit board and the at least one second connector hole 12 of the first layer (1-Layer). More specifically, for the second connector hole 12 of the first layer (1-Layer) to which the spark gap 20 is not applied because the conductor line 50 is arranged between the ground 60 of the printed circuit board and the at least one second connector hole 12 of the first layer (1-Layer), the spark gap 20 not included on the first layer (1-Layer) may be provided on the fourth layer (4-Layer). In this case, the spark gap 20 not provided on the first layer (1-Layer) may be provided on the second layer (2-Layer), the third layer (3-Layer), and the fourth layer (4-Layer), thereby triply preventing damage due to ESD.

[0054] Figure 4 is a view for describing a spark gap according to an embodiment of the present disclosure.

[0055] Reference Figure 4 , the spark gap 20 according to the embodiment of the present disclosure may include a gap between the connector hole 10 having an ESD protection function and the ground 60 of the printed circuit board.

[0056] For example, refer to Figure 4 The spark gap 20 may include a gap between a ground protrusion 23 connected to a ground 60 of a printed circuit board and a hole protrusion 25 connected to the connector hole 10 in a shape corresponding to the ground protrusion 23 .

[0057] For example, the ground protrusion 23 and the hole protrusion 25 may each include a copper foil layer in a triangular patch shape facing or pointing to each other.

[0058] According to an embodiment of the present disclosure, if the connector hole 10 is surrounded by the conductor wire 50, the spark gap 20 may not be arranged on the first layer (1-Layer), so that the connector according to an embodiment of the present disclosure may include spark gaps 20 on the second layer (2-Layer) to the fourth layer (4-Layer), thereby preventing damage due to ESD.

[0059] Although the present disclosure has been described with reference to the examples shown in the accompanying drawings, it will be understood by those skilled in the art that various modifications and other equivalent examples may be made from the examples shown. Therefore, the true technical scope of the present disclosure should be defined by the technical spirit of the appended claims.

[0060] Those skilled in the art to which the present disclosure belongs will understand that the present disclosure can be implemented in different specific ways without departing from the technical spirit or essential features of the present disclosure. Therefore, the aforementioned embodiments should be interpreted as being merely illustrative and should not be interpreted as being restrictive in all aspects. For example, each element described as a single type can be implemented in a distributed manner, and similarly, the element described as distributed can be implemented as a combined type.

[0061] The scope of the present disclosure is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalents thereof should be construed as falling within the scope of the present disclosure.

[0062] According to the present disclosure, by applying a spark gap to a connector having a two or more column structure, resistance to chronic ESD problems can be enhanced and ESD reduction components such as ESD capacitors, TVS, etc. can be reduced. However, the scope of the present disclosure is not limited by these effects.

[0063] Example embodiments have been disclosed herein, and although specific terms may be employed, they are used and interpreted in a general and descriptive sense only, and not for purposes of limitation. In some cases, as will be apparent to one of ordinary skill in the art upon filing this application, unless specifically indicated otherwise, the features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with the features, characteristics, and / or elements described in conjunction with other embodiments. Therefore, it will be understood by those skilled in the art that various changes may be made in form and detail without departing from the spirit and scope of the invention as set forth in the appended claims.

[0064] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0132457 filed in the Korean Intellectual Property Office on October 5, 2023, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A connector mounted on a printed circuit board, the connector comprising: The first layer includes: A plurality of connector holes having an array structure of two or more columns, allowing connector pins to be inserted therein; a spark gap between at least one first connector hole of the plurality of connector holes and a ground of the printed circuit board; and a conductor line having an end connected to at least one second connector hole among the plurality of connector holes, the conductor line being arranged between the ground of the printed circuit board and the at least one second connector hole; and A second layer is stacked on a surface of the first layer, the second layer comprising: a plurality of connector holes vertically spaced apart from and corresponding to the plurality of connector holes of the first layer; and A spark gap is provided between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the second layer and the ground of the printed circuit board.

2. The connector according to claim 1 further includes a third layer stacked with the first layer and the second layer, the third layer including a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer and the plurality of connector holes of the second layer and corresponding to the plurality of connector holes of the first layer and the plurality of connector holes of the second layer.

3. The connector according to claim 2, wherein the third layer includes a spark gap between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the third layer and the ground of the printed circuit board.

4. The connector according to claim 2 further includes a fourth layer stacked with the first layer, the second layer and the third layer, the fourth layer including a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer, the plurality of connector holes of the second layer and the plurality of connector holes of the third layer and corresponding to the plurality of connector holes of the first layer, the plurality of connector holes of the second layer and the plurality of connector holes of the third layer.

5. The connector according to claim 4, wherein the fourth layer includes a spark gap between a connector hole corresponding to the at least one second connector hole of the first layer among the plurality of connector holes of the fourth layer and the ground of the printed circuit board. 6 . The connector according to claim 1 , wherein the spark gap comprises a gap between each of the connector holes having an electrostatic discharge protection function and the ground of the printed circuit board.

7. The connector according to claim 6, wherein the spark gap includes a gap between a ground protrusion connected to the ground of the printed circuit board and a hole protrusion protruding from the connector hole in a shape corresponding to the ground protrusion. 8 . The connector according to claim 7 , wherein the ground protrusion portion and the hole protrusion portion each include a copper foil layer in a triangular patch shape facing each other.

9. A battery management system circuit board, comprising the connector according to claim 1.

10. The battery management system circuit board according to claim 9 further includes a third layer stacked with the first layer and the second layer, the third layer including a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer and the plurality of connector holes of the second layer and corresponding to the plurality of connector holes of the first layer and the plurality of connector holes of the second layer.

11. The battery management system circuit board of claim 10, wherein the third layer includes a spark gap between a connector hole among the plurality of connector holes of the third layer corresponding to the at least one second connector hole of the first layer and the ground of the printed circuit board.

12. The battery management system circuit board according to claim 11 further includes a fourth layer stacked with the first layer, the second layer and the third layer, the fourth layer including a plurality of connector holes vertically spaced apart from the plurality of connector holes of the first layer, the plurality of connector holes of the second layer and the plurality of connector holes of the third layer and corresponding to the plurality of connector holes of the first layer, the plurality of connector holes of the second layer and the plurality of connector holes of the third layer.

13. The battery management system circuit board of claim 12, wherein the fourth layer includes a spark gap between a connector hole among the plurality of connector holes of the fourth layer corresponding to the at least one second connector hole of the first layer and the ground of the printed circuit board. 14 . The battery management system circuit board of claim 9 , wherein the spark gap comprises a gap between each of the connector holes having an electrostatic discharge protection function and the ground of the printed circuit board.

15. The battery management system circuit board of claim 14, wherein the spark gap comprises a gap between a ground protrusion connected to the ground of the printed circuit board and a hole protrusion protruding from the connector hole in a shape corresponding to the ground protrusion. 16 . The battery management system circuit board of claim 15 , wherein the ground protrusion and the hole protrusion each include a copper foil layer in a triangular patch shape facing each other.

17. A battery pack comprising the battery management system circuit board according to any one of claims 9 to 16.

18. A multilayer connector, comprising: a first printed circuit board layer having a first plurality of connector holes in an array structure of two or more columns and allowing connector pins to be inserted therein; a first conductive member coupled to the first printed circuit board layer at one or more first connector holes of the first plurality of connector holes, the first conductive member being spaced apart from a grounded second conductive member connected to the first printed circuit board layer to create a first spark gap; a second printed circuit board layer stacked on a surface of the first printed circuit board layer, the second printed circuit board layer having a second plurality of connector holes vertically spaced apart and aligned with the first plurality of connector holes; as well as A third conductive member is coupled to the second printed circuit board layer at one or more of the second plurality of connector holes, the third conductive member being spaced apart from a grounded fourth conductive member connected to the second printed circuit board layer to create a second spark gap.

19. The multilayer connector according to claim 18, further comprising: a third printed circuit board layer stacked with the first printed circuit board layer and the second printed circuit board layer, the third printed circuit board layer comprising a third plurality of connector holes vertically spaced apart and aligned with the first plurality of connector holes and the second plurality of connector holes; as well as A fifth conductive member is coupled to the third printed circuit board layer at one or more third connector holes of the third plurality of connector holes, the fifth conductive member being spaced apart from a grounded sixth conductive member connected to the third printed circuit board layer to create a third spark gap.

20. The multilayer connector according to claim 19, further comprising: a fourth printed circuit board layer stacked with the first printed circuit board layer, the second printed circuit board layer, and the third printed circuit board layer, the fourth printed circuit board layer comprising a fourth plurality of connector holes vertically spaced apart and aligned with the first plurality of connector holes, the second plurality of connector holes, and the third plurality of connector holes; as well as A seventh conductive member is coupled to the fourth printed circuit board layer at one or more fourth connector holes of the fourth plurality of connector holes, the seventh conductive member being spaced apart from an eighth conductive member connected to ground of the fourth printed circuit board layer to create a fourth spark gap.

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