Socket assembly and substrate

Abstract

The invention provides a socket assembly and a substrate obtained by studying an inner layer wiring arrangement. A plurality of wires among the plurality of first inner layer wires (134) are led out toward the second electrode row (L2) when viewed from the depth direction (Dd), and a plurality of wires among the plurality of second inner layer wires (134) are led out toward the first electrode row (L1) when viewed from the depth direction (Dd).

Description

Technical Field

[0001] The invention relates to a socket assembly and a substrate. Background Art

[0002] For example, US11177596B1 discloses a board end connector.

[0003] The board-side connector is fixed to the circuit board by inserting the plurality of plugging members of the housing into a jack of the circuit board.

[0004] When a hole (opening) such as a socket is formed in a circuit substrate as in US Pat. No. 11177596B1, it is necessary to consider the layout of inner layer wiring (pattern) formed in the inner layer of the circuit substrate.

[0005] Therefore, an object of the present invention is to provide a socket assembly and a substrate obtained by studying the inner layer wiring layout. Summary of the invention

[0006] In order to solve the above problems, the socket assembly and the substrate of the present invention adopt the following methods.

[0007] 14. The socket assembly of claim 13, wherein the connector has a first surface and a second surface that is a back surface of the first surface; and a connector that is mounted on the connector and allows an external module to be inserted along a first direction that is substantially orthogonal to the first surface, wherein a direction that is orthogonal to the first direction is set as a second direction, and a direction that is orthogonal to the first direction and the second direction is set as a third direction, wherein the connector includes: a plurality of contact pins that contact the external module; and a housing that holds the plurality of contact pins, wherein the plurality of contact pins constitute: a first pin group that is arranged in a row along the second direction; and a second pin group that is arranged in a row along the second direction and is spaced apart from the first pin group in the third direction, wherein the connector includes: a plurality of electrodes that are arranged on the first surface and used to mount each of the contact pins; and a plurality of inner wirings that are formed on the first surface. The inner layer between one surface and the second surface, and is connected to each of the electrodes via a via hole, the plurality of electrodes constitute: a first electrode column, which is arranged in a row along the second direction, and is used to install the contact pins included in the first pin group; and a second electrode column, which is arranged in a row along the second direction and is configured at a distance from the first electrode column in the third direction, and is used to install the contact pins included in the second pin group, the plurality of inner layer wirings include: a plurality of first inner layer wirings, which are connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner layer wirings, which are connected to the plurality of electrodes included in the second electrode column, when viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode column, and when viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column.

[0008] According to the socket assembly of this embodiment, the number of inner wirings that must be led out to the outer region can be reduced by intentionally leading the inner wirings out to the region between the first electrode array and the second electrode array, thereby ensuring an area for providing openings and the like in the outer region.

[0009] The second mode of the present invention relates to a socket assembly, in which, in the first mode, the plurality of contact pins constitute: a third pin group, which is arranged in a row along the second direction; and a fourth pin group, which is arranged in a row along the second direction and is arranged at a distance from the third pin group in the third direction, and the plurality of electrodes constitute: a third electrode column, which is arranged in a row along the second direction and is used to install the contact pins included in the third pin group; and a fourth electrode column, which is arranged in a row along the second direction and is arranged at a distance from the third electrode column in the third direction and is used to install the contact pins included in the fourth pin group, and the first electrode column and the second electrode column are arranged between the third electrode column and the fourth electrode column in the third direction.

[0010] According to the socket assembly according to this aspect, the third electrode array and the fourth electrode array can be provided in the outer region.

[0011] The third aspect of the present invention relates to a socket assembly, in which, in the first aspect, the connector has a plurality of protrusions, which are fixed to the shell and protrude along the first direction, the substrate has a plurality of through holes, which are formed in a manner of penetrating from the first surface to the second surface for the protrusions to be inserted, and the through holes are arranged on extension lines of the first electrode column and / or the second electrode column along the second direction.

[0012] According to the socket assembly according to this aspect, the inner layer wiring can be led out without interfering with the through hole.

[0013] The fourth aspect of the present invention relates to a socket assembly, in which, in the second aspect, the connector has a plurality of protrusions, which are fixed to the shell and protrude along the first direction, the substrate has a plurality of through holes, which are formed in a manner of penetrating from the first surface to the second surface for the protrusions to be inserted, and the through holes are arranged on extension lines of the first electrode column or the third electrode column, and the second electrode column or the fourth electrode column along the second direction.

[0014] According to the socket assembly according to this aspect, the inner layer wiring can be led out without interfering with the through hole.

[0015] A fifth aspect of the present invention relates to a socket assembly according to any one of the first to fourth aspects, wherein the first inner layer wiring is led out for each electrode pair of the electrodes adjacent in the second direction, and the second inner layer wiring is led out for each electrode pair of the electrodes adjacent in the second direction.

[0016] According to the socket assembly according to this aspect, the inner layer wiring can be led out for each of the adjacent electrode pads corresponding to the high-speed signal pair (differential pair).

[0017] The socket assembly involved in the sixth aspect of the present invention, in any one aspect from the first aspect to the fifth aspect, in the substrate, the distance along the first direction from the electrode to the first inner layer wiring is a distance at which the electrode and the first inner layer wiring are not electrically coupled, and the distance along the first direction from the electrode to the second inner layer wiring is a distance at which the electrode and the second inner layer wiring are not electrically coupled.

[0018] According to the socket assembly according to this aspect, it is possible to suppress the generation of stubs at overlapping portions of electrodes and inner-layer wiring, thereby improving transmission characteristics.

[0019] A seventh aspect of the present invention provides the socket assembly according to the sixth aspect, wherein a distance from the electrode to the first inner wiring along the first direction is greater than or equal to 0.5 mm, and a distance from the electrode to the second inner wiring along the first direction is greater than or equal to 0.5 mm.

[0020] According to the socket assembly according to this aspect, it is possible to suppress the generation of stubs at overlapping portions of the electrodes and the inner wiring, thereby improving transmission characteristics.

[0021] The socket assembly involved in the eighth aspect of the present invention, in any one of the first aspect to the seventh aspect, the substrate has a through opening, which is formed in a manner of penetrating from the first surface to the second surface, and the through opening extends along the second direction in a manner parallel to the first electrode column and / or the second electrode column in an area where the inner layer wiring is not formed.

[0022] According to the socket assembly of this aspect, the opening area of ​​the through opening can be ensured to be large, and the air passing through the heat sink can be smoothly guided to the external space.

[0023] A ninth aspect of the present invention relates to a socket assembly according to the eighth aspect, wherein the through opening is formed in a region farther from the second electrode array than the first electrode array in the third direction and / or is formed in a region farther from the first electrode array than the second electrode array in the third direction.

[0024] According to the socket assembly of this aspect, the opening area of ​​the through opening can be ensured to be large, and the air passing through the heat sink can be smoothly guided to the external space.

[0025] The socket assembly involved in the tenth aspect of the present invention, in any one aspect of the first aspect to the ninth aspect, the shell of the connector has a convex portion protruding along the first direction, the substrate has a concave portion for the convex portion to be embedded, the through hole of the substrate is arranged on the side of the first electrode column and the side of the second electrode column along the second direction, and the concave portion of the substrate is arranged between the through hole arranged on the side of the first electrode column and the through hole arranged on the side of the second electrode column in the third direction.

[0026] According to the socket assembly according to this aspect, the connector can be positioned at a predetermined position by fitting the convex portion of the housing into the concave portion of the substrate.

[0027] The socket assembly involved in the eleventh aspect of the present invention, in any one of the first to tenth aspects, the connector has a metal shell covering the shell, a plurality of protrusions are formed on the shell, and are fixed by welding in a state of being inserted into the through hole, the shell has a step portion on the outer peripheral surface, and the edge of the shell facing the substrate abuts against the step portion of the shell.

[0028] According to the socket assembly of this aspect, the housing is pressed into the shell, and the movement of the housing in the direction away from the substrate along the first direction is restricted. As a result, the resistance of the connector to insertion and removal with respect to the external module is improved.

[0029] The socket assembly involved in the twelfth aspect of the present invention, in any one of the first aspect to the eleventh aspect, includes a plurality of cages, each of which is defined with at least one port for accommodating the external module, and each of the cages is fixed to the substrate in a state of accommodating the connector mounted on the substrate, and is arranged in a manner of being spaced apart from each other in at least any one of the second direction and the third direction.

[0030] According to the socket assembly involved in this aspect, if the cages are spaced apart, the area where the cages and the connectors attached to the cages are not mounted is located on the substrate between the cages. Therefore, the area of ​​the substrate can be used for the layout of the inner wiring. As a result, the inner wiring from the connector attached to each cage to the ASIC can be shortened, and the transmission characteristics can be improved.

[0031] The thirteenth aspect of the present invention relates to a substrate for installing an external connector, wherein the external connector is for an external module to be inserted along a first direction and has a plurality of contact pins, a direction orthogonal to the first direction is set as a second direction, and a direction orthogonal to the first direction and the second direction is set as a third direction, the substrate comprising: a plurality of electrodes, which are arranged on a first surface and are used to install each of the contact pins; and a plurality of inner layer wirings, which are formed in an inner layer between the first surface and a second surface which is the back side of the first surface, and are connected to each of the electrodes via vias, the plurality of electrodes constituting: a first electrode column, which is arranged along the second direction The plurality of inner layer wirings include: a plurality of first inner layer wirings connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner layer wirings connected to the plurality of electrodes included in the second electrode column, when viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode column, and when viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a perspective view of the socket assembly and the optical module according to the first embodiment (when the optical module is removed).

[0033] Figure 2 It is a perspective view of the receptacle assembly and the optical module according to the first embodiment (when the optical module is inserted).

[0034] Figure 3 It is a perspective view of the socket assembly (cage omitted) and the optical module according to the first embodiment.

[0035] Figure 4 It is an exploded perspective view of the socket assembly (cage omitted) according to the first embodiment.

[0036] Figure 5 It is a perspective view of the connector according to the first embodiment.

[0037] Figure 6 It is an exploded perspective view of the connector according to the first embodiment.

[0038] Figure 7 It is a top view of the surface layer of the substrate according to the first embodiment.

[0039] Figure 8 yes Figure 3 A partial enlarged view of part A.

[0040] Fig. 9It is a plan view of the inner layer of the substrate according to the first embodiment.

[0041] Fig.10 This is a partial cross-sectional view of the socket assembly according to the first embodiment (a plane perpendicular to the width direction is regarded as a cross section).

[0042] Fig.11 It is a front view showing the configuration of the cage.

[0043] Fig.12 It is an exploded perspective view showing the configuration of the cage.

[0044] Fig.13 It is a front view showing the arrangement of a cage as a comparative example.

[0045] Fig.14 It is a perspective view of a connector according to a second embodiment.

[0046] Fig.15 It is an exploded perspective view of the connector according to the second embodiment.

[0047] Fig.16 It is a top view of the surface layer of the substrate according to the second embodiment.

[0048] Fig.17 It is a plan view of the inner layer of the substrate according to the second embodiment.

[0049] Description of Reference Numerals

[0050] 10 optical module (external module) 11 module substrate (external module substrate) 12 Radiator 100 Socket Assembly

[0051] 110, 110', 110" cage 111 cylinder

[0052] 112 flange portion 120 connector

[0053] 121 housing 121a convex part

[0054] 121b step portion 121c step portion

[0055] 122 contact pin 122a mounting portion

[0056] 123 housing 123a protruding terminal (protruding portion)

[0057] 130 substrate 130a first surface

[0058] 130b second surface 131 electrode pad

[0059] 132 through hole 133 via hole

[0060] 134 pattern (inner wiring) 135 through opening

[0061] 136 recess 138ASIC

[0062] 220 connector 221 housing

[0063] 221X Outer shell 221Y Inner shell

[0064] 221b Step portion 221c Step portion

[0065] 222 contact pin 223 housing

[0066] 223a protruding terminal (protruding portion) 230 substrate

[0067] 231 electrode pad 232 through hole

[0068] 234 pattern (inner wiring) 235 through opening

[0069] 236 concave G1 first pin group G2 second pin group G3 third pin group

[0070] G4 Fourth pin group L1 First electrode row

[0071] L2 second electrode row L3 third electrode row

[0072] L4 fourth electrode row DETAILED DESCRIPTION

[0073] A socket assembly according to a first embodiment and a second embodiment of the present invention will be described with reference to the drawings.

[0074] In addition, when the direction of inserting / removing the optical module is set as the insertion / removal direction Die, the depth direction Dd (first direction) is consistent with the insertion / removal direction Die, the width direction Dw (second direction) is orthogonal to the depth direction Dd, and the height direction Dh (third direction) is orthogonal to the depth direction Dd and the width direction Dw.

[0075] However, the insertion and extraction direction Die, the depth direction Dd, the width direction Dw, and the height direction Dh are used to assist understanding of the description, and do not limit the actual posture.

[0076] In addition, in the cage assembly and the various components or elements that constitute these cage assemblies, the part, end, edge or surface close to the substrate is referred to as the "rear", "rear end", "rear edge", or "back side", and the part, end, edge or surface away from the substrate is referred to as the "front", "front end", "front edge", or "front side".

[0077] (First Embodiment)

[0078] (About basic structure)

[0079] like Figure 1 and Figure 2 As shown, the receptacle assembly 100 is a device to which an optical module 10 (external module) is connected. The optical module 10 is a module based on a form factor such as QSFP-DD, OSFP, or OSFP-XD.

[0080] like Figure 1 , Figure 2 and Figure 3 As shown, the socket assembly 100 includes a cage 110 , a connector 120 and a substrate 130 .

[0081] like Figure 2 As shown, the cage 110 is a component for accommodating the connector 120 and the optical module 10 , and is fixed to the first surface 130 a of the substrate 130 , which is the front surface.

[0082] In addition, the back surface of the substrate 130 is set as the second surface 130b (see Fig.10 ).

[0083] like Figure 1 and Figure 2 As shown, the cage 110 includes a cylinder 111 and a flange 112. The cylinder 111 is a square cylinder-shaped portion including four walls, and defines a space (port Sp) for accommodating the connector 120 and the optical module 10.

[0084] The flange 112 is provided at the base end of two walls facing each other in the width direction Dw among the four walls included in the cylinder 111. Fastening components such as screws or bolts are inserted into the flange 112. The inserted fastening components are fixed in threaded holes formed on a back plate (not shown) provided on the second surface 130b of the base plate 130, or penetrate through holes formed in the back plate to clamp the base plate 130 and the back plate between nuts (not shown) for fastening. In this way, the cage 110 is fixed to the base plate 130.

[0085] like Figure 3 and Figure 4 As shown, the connector 120 is a component into which the module substrate 11 included in the optical module 10 is inserted, and is fixed to the first surface 130 a of the substrate 130 .

[0086] The connector 120 is electrically connected to the substrate 130 , and has a function of relaying between the module substrate 11 and the substrate 130 .

[0087] like Figure 5 and Figure 6 As shown, the connector 120 includes a housing 121 , a plurality of contact pins 122 and a shell 123 .

[0088] The housing 121 is a substantially rectangular parallelepiped member that holds the plurality of contact pins 122 and has insulating properties.

[0089] The plurality of contact pins 122 are elongated members having conductivity. The plurality of contact pins 122 constitute a first pin group G1 and a second pin group G2. The first pin group G1 is a group (set) in which a plurality of contact pins 122 are arranged in a row at a certain pitch along the width direction Dw. On the other hand, the second pin group G2 is a group (set) in which the remaining contact pins 122 are arranged in a row at a certain pitch along the width direction Dw, and is arranged at a distance in the height direction Dh relative to the first pin group G1.

[0090] The housing 123 is a part embedded in the housing 121 in a manner covering the periphery of the housing 121, and is made of metal. The housing 123 is formed by, for example, bending a thin plate of a predetermined shape into a square tube shape. A plurality of protruding terminals 123a (protruding portions) are provided at the rear end of the housing 123. Each protruding terminal 123a is a slender portion protruding along the depth direction Dd and toward the substrate 130.

[0091] like Figure 4 and Figure 7 As shown, the substrate 130 is a component on which the connector 120 is mounted, and an ASIC is disposed on the second surface 130 b of the substrate 130 .

[0092] like Figure 7 As shown, the substrate 130 has a plurality of electrode pads 131. In addition, a plurality of through holes 132 are formed in the substrate 130.

[0093] The electrode pad 131 is a portion connected to the mounting portion 122 a of the contact pin 122 included in the connector 120 .

[0094] The electrode pads 131 correspond one-to-one to the contact pins 122. Therefore, the plurality of electrode pads 131 constitute a first electrode column L1 corresponding to the first stitch group G1 and a second electrode column L2 corresponding to the second stitch group G2.

[0095] The first electrode array L1 is a group (set) of electrode pads 131 arranged in a row at a certain interval along the width direction Dw. On the other hand, the second electrode array L2 is a group (set) of the remaining electrode pads 131 arranged in a row at a certain interval along the width direction Dw, and is arranged at a distance in the height direction Dh relative to the first electrode array L1.

[0096] The through hole 132 is a hole into which the protruding terminal 123a of the housing 123 of the connector 120 is inserted (see Figure 8 ).

[0097] The inner peripheral surface of the through hole 132 is plated.

[0098] The number of through holes 132 corresponds to the number of protruding terminals 123a. Figure 7 As shown, in the case of this embodiment, the number of through holes 132 is four.

[0099] Two through holes 132 among the four through holes are arranged on both sides of the first electrode column L1 in the width direction Dw. In other words, the two through holes 132 are arranged on the extension line of the first electrode column L1 along the width direction Dw.

[0100] The remaining two through holes 132 are disposed on both sides of the second electrode column L2 in the width direction Dw. In other words, the two through holes 132 are disposed on the extension line of the second electrode column L2 along the width direction Dw.

[0101] When the connector 120 is mounted on the substrate 130, solder paste is printed on the land of the through hole 132, and the target component is heated using a heating device such as a reflow oven while the protruding terminal 123a of the connector 120 is inserted into the through hole 132, so that the solder paste flows into the through hole 132. Then, the protruding terminal 123a is soldered to the through hole 132 by cooling the target component.

[0102] In addition, when the connector 120 is installed on the substrate 130, solder paste is printed on the electrode pad 131, and the mounting portion 122a of the contact pin 122 is placed on the electrode pad 131. The target component is heated using a heating device such as a reflow furnace, and then the target component is cooled, whereby the mounting portion 122a (contact pin 122) is soldered to the electrode pad 131.

[0103] In this way, the connector 120 is mounted on the substrate 130 .

[0104] like Fig. 9 As shown, the substrate 130 further has a pattern 134 (inner layer wiring).

[0105] The pattern 134 is disposed in a layer (inner layer) between the first surface 130a and the second surface 130b, such as Fig.10 As shown, the substrate 130 is connected to the electrode pad 131 via a via hole 133 extending in the thickness direction of the substrate 130. In addition, the thickness direction of the substrate 130 coincides with the depth direction Dd.

[0106] like Fig. 9 As shown, the pattern 134 is led out, for example, according to the adjacent electrode pads 131 corresponding to the high-speed signal pair (differential pair).

[0107] In the pattern 134 (first inner layer wiring) connected to the first electrode array L1, some pairs of the pairs of patterns 134 led out according to each differential pair are led out toward the second electrode array L2 when viewed from the depth direction Dd, and then extend along the width direction Dw after changing the direction by approximately 90 degrees. On the other hand, the remaining pairs of the pairs of patterns 134 led out according to each differential pair are led out toward the side opposite to the side where the second electrode array L2 is located when viewed from the depth direction Dd, and then extend along the width direction Dw after changing the direction by approximately 90 degrees.

[0108] In the pattern 134 (second inner layer wiring) connected to the second electrode array L2, some pairs of the pairs of patterns 134 led out according to each differential pair are led out toward the first electrode array L1 when viewed from the depth direction Dd, and then extend along the width direction Dw after changing the direction by approximately 90 degrees. On the other hand, the remaining pairs of the pairs of patterns 134 led out according to each differential pair are led out toward the side opposite to the side where the first electrode array L1 is located when viewed from the depth direction Dd, and then extend along the width direction Dw after changing the direction by approximately 90 degrees.

[0109] By leading out the pattern 134 as described above, the pattern 134 does not interfere with the through-hole 132 located on substantially the same straight line as the first electrode column L1 and the second electrode column L2 .

[0110] In addition, by intentionally leading some patterns 134 to the area between the first electrode array L1 and the second electrode array L2 (hereinafter referred to as the "inner area"), the number of patterns 134 that must be led to the outer area can be reduced. As a result, the area for providing the opening and the like in the outer area can be ensured. Here, the outer area refers to an area farther from the second electrode array L2 than the first electrode array L1 in the height direction Dh, and an area farther from the first electrode array L1 than the second electrode array L2 in the height direction Dh. In short, the outer area refers to an area located outside the inner area in the height direction Dh.

[0111] For example, a through opening 135 is formed in the outer region of the substrate 130 .

[0112] The through opening 135 is a quadrilateral opening extending in the width direction Dw in parallel with the first electrode array L1 and the second electrode array L2 , and penetrates from the first surface 130 a to the second surface 130 b of the substrate 130 .

[0113] The through opening 135 is used to pass the heat sink 12 (see Figure 2 ) is directed toward a hole in the external space adjacent to the second surface 130b.

[0114] As described above, by designing the lead-out method of the pattern 134 to ensure a larger area of ​​the outer region, the opening area of ​​the through opening 135 can be ensured to be larger, and the air passing through the heat sink 12 can be smoothly guided to the external space.

[0115] like Fig.10 As shown, the pattern 134 is connected to the electrode pad 131 via the via hole 133 .

[0116] At this time, the distance d along the thickness direction of the substrate 130 from the lower surface of the electrode pad 131 to the upper surface of the pattern 134 is a distance at which the electrode pad 131 and the pattern 134 are not electrically coupled without passing through the via 133 (a distance at which the electrode pad 131 and the pattern 134 are not directly electrically coupled). As a specific example, the distance d is greater than 0.5 mm, preferably greater than 0.7 mm.

[0117] In this way, by ensuring that the distance d is equal to or longer than a certain length, the generation of a stub can be prevented.

[0118] Here, the stub will be described.

[0119] exist Fig.10 In FIG. 1 , the solid arrows represent the normal flow of electrical signals, and the dashed arrows represent the flow of electrical signals when the electrode pad 131 is electrically coupled to the pattern 134 without via the via 133 .

[0120] First of all, Fig. 9 The B part shown corresponds to Fig.10 The combination of the mounting portion 122a, the electrode pad 131, the via 133 and the pattern 134 of the contact pin 122 on the left is described. The via 133 is connected to a portion of the electrode pad 131 located near the end of the mounting portion 122a extending toward the outer area. In addition, the pattern 134 extends in the same direction as the extension direction of the mounting portion 122a. Therefore, the direction of the current flowing through the mounting portion 122a or the electrode pad 131 is the same as the direction of the electrical signal flowing through the pattern 134 (strictly speaking, the portion near the beginning of the pattern 134).

[0121] Next, for Fig. 9 The C part shown corresponds to Fig.10The combination of the mounting portion 122a, the electrode pad 131, the via 133 and the pattern 134 of the contact pin 122 on the right side is described. The via 133 is connected to a portion of the electrode pad 131 located near the end of the mounting portion 122a extending toward the outer area. In addition, the pattern 134 extends in a direction opposite to the extension direction of the mounting portion 122a. Therefore, the direction of the current flowing through the mounting portion 122a or the electrode pad 131 is opposite to the direction of the electrical signal flowing through the pattern 134 (strictly speaking, the portion near the beginning of the pattern 134), and the mounting portion 122a or the electrode pad 131 overlaps with the pattern 134 when viewed from the depth direction Dd.

[0122] Here, assuming that the electrode pad 131 is electrically coupled to the pattern 134 without passing through the via 133 (see the dotted arrow), the mounting portion 122a, the electrode pad 131, the via 133, a portion of the pattern 134 overlapping with the mounting portion 122a, or a portion of the pattern 134 overlapping with the electrode pad 131 becomes a short stub.

[0123] (Regarding connector positioning)

[0124] like Figure 6 As shown, a plurality of protrusions 121 a are provided on the housing 121 .

[0125] The convex portion 121 a is a portion protruding toward the substrate 130 , and is provided at the lower portion of the housing 121 and at both sides in the width direction Dw.

[0126] exist Figure 6 In the case of , the shape of the convex portion 121a is a cylindrical shape. However, the shape of the convex portion 121a is not limited to a cylindrical shape, and may be a shape other than the cylindrical shape (for example, a prism shape).

[0127] On the other hand, Figure 4 and Figure 7 As shown, a plurality of recesses 136 are provided on the substrate 130 .

[0128] The recessed portion 136 is a depression for fitting the convex portion 121a provided on the housing 121. Therefore, the shape of the recessed portion 136 matches the shape of the convex portion 121a.

[0129] The depth of the recess 136 is such that it does not reach the pattern 134 .

[0130] Each recessed portion 136 is disposed between each through-hole 132 located on the side of the first electrode column L1 and each through-hole 132 located on the side of the second electrode column L2 in the height direction Dh.

[0131] like Figure 8As shown, when the connector 120 is placed on the first surface 130 a of the substrate 130 , the convex portion 121 a of the housing 121 is fitted into the concave portion 136 of the substrate 130 , whereby the connector 120 is positioned at a predetermined position.

[0132] The “predetermined position” mentioned here refers to a position where the protruding terminals 123 a of the housing 123 are inserted into the through holes 132 of the substrate 130 and the mounting portions 122 a of the contact pins 122 are in contact with the electrode pads 131 of the substrate 130 .

[0133] (About the step portion of the connector)

[0134] like Figure 6 As shown, a step portion 121 b and a step portion 121 c are provided on the side surface of the housing 121 of the connector 120 .

[0135] The step portion 121 b is a portion of both side surfaces of the housing 121 perpendicular to the height direction Dh that protrudes outward / enlarges, and has an upward surface perpendicular to the depth direction Dd.

[0136] The step portion 121 c is a portion of both side surfaces of the housing 121 perpendicular to the width direction Dw that protrudes outward / enlarges, and has an upward surface perpendicular to the depth direction Dd.

[0137] like Figure 5 As shown, a portion of the edge of the housing 123 facing the substrate 130 abuts against the surface of the step portion 121 b and the surface of the step portion 121 c .

[0138] like Figure 8 As shown, the housing 123 is fixed to the through hole 132 of the substrate 130 via the protruding terminal 123a, so that the case 121 is pressed into the housing 123 and is restricted from moving away from the substrate 130 in the depth direction Dd. As a result, the resistance of the connector 120 to insertion and removal of the optical module 10 is improved.

[0139] (About cage configuration)

[0140] Figure 1 The cage 110 is defined with one port Sp.

[0141] However, the form of the cage 110 is not limited thereto, and may also be, for example, Fig.11 The upper and lower parts of the cage 110' may be defined with 2×2 ports Sp, or the upper and lower parts of the cage 110" may be defined with 2×1 ports Sp.

[0142] exist Fig.11In this case, the cage 110 ′ and the cage 110 ″ fixed to the first surface 130 a of the substrate 130 are arranged along the width direction Dw above and below the ASIC 138 arranged on the second surface 130 b of the substrate 130 when the substrate 130 is viewed from the front.

[0143] Specifically, if Fig.11 and Fig.12 As shown, a plurality of cages 110 ′ are arranged in a spaced manner along the width direction Dw, and two cages 110 ″ are arranged in a spaced manner relative to the cages 110 ′ on both sides of the combination including the plurality of cages 110 ′.

[0144] The reason for providing a gap between the cages 110 ′ and 110 ′ or between the cages 110 ′ and 110 ″ along the width direction Dw is as follows.

[0145] That is, for example, if a space is provided between cages 110' and cages 110', the area where cages 110' and connectors 120 attached to these cages 110' are not installed is located on the substrate 130 between cages 110' and cages 110'. Therefore, these areas of the substrate 130 can be used for arranging patterns 134. As a result, the pattern 134 connected from the connector 120 attached to each cage 110' to the ASIC 138 can be shortened, and the transmission characteristics can be improved. The same applies to the space between cages 110' and cages 110".

[0146] If there is no spacing between the cages 110' and 110' or between the cages 110' and 110", as in the comparative example Fig.13 As shown, it is necessary to use the area of ​​the substrate 130 located at the periphery of the integrated cage frame 110"' to arrange the pattern 134. Fig.11 Compared with the same shape, the pattern 134 will become longer.

[0147] Alternatively, the same intervals may be provided in the height direction Dh.

[0148] In addition, the number of ports defined by the cage is not limited thereto, and for example, a cage defining 2×2 ports or another cage defining 2×4 ports may be used. In this case, the cage defining 2×2 ports is arranged on both sides of the cage defining 2×4 ports with a gap relative to the cage.

[0149] (Second Embodiment)

[0150] In this embodiment, the shapes of the connector 120 and the substrate 130 are different from those in the first embodiment, but the other structures are the same.

[0151] Therefore, the same structure is denoted by a different reference numeral in the hundreds digit, and the description thereof is omitted.

[0152] like Fig.14 and Fig.15 As shown, the connector 220 includes a housing 221 , a plurality of contact pins 222 and a shell 223 .

[0153] The housing 221 includes an outer housing 221X and an inner housing 221Y, and holds a plurality of contact pins 222. In addition, step portions 221b and 221c are provided on the side surfaces of the outer housing 221X.

[0154] In addition to the first pin group G1 and the second pin group G2 held in the inner housing 221Y, the plurality of contact pins 222 also constitute a third pin group G3 and a fourth pin group G4 held in the outer housing 221X. The third pin group G3 is a group (set) in which a plurality of contact pins 222 are arranged in a row at a certain interval along the width direction Dw. On the other hand, the fourth pin group G4 is a group (set) in which a plurality of contact pins 222 are arranged in a row at a certain interval along the width direction Dw.

[0155] The third stitch group G3 and the fourth stitch group G4 are arranged outside the first stitch group G1 and the second stitch group G2.

[0156] In other words, the first stitch group G1 and the second stitch group G2 are arranged so as to be sandwiched by the third stitch group G3 and the fourth stitch group G4 in the height direction Dh.

[0157] like Fig.16 and Fig.17 As shown, in addition to the first electrode column L1 corresponding to the first stitch group G1 and the second electrode column L2 corresponding to the second stitch group G2, the plurality of electrode pads 231 further constitute a third electrode column L3 corresponding to the third stitch group G3 and a fourth electrode column L4 corresponding to the fourth stitch group G4.

[0158] The third electrode array L3 is a group (set) of electrode pads 231 arranged in a row at a certain pitch along the width direction Dw. The fourth electrode array L4 is a group (set) of electrode pads 231 arranged in a row at a certain pitch along the width direction Dw.

[0159] The third electrode array L3 and the fourth electrode array L4 are disposed in the outer area of ​​the first electrode array L1 and the second electrode array L2.

[0160] In other words, the first electrode array L1 and the second electrode array L2 are disposed in the inner region of the third electrode array L3 and the fourth electrode array L4.

[0161] Two through holes 232 of the four through holes are arranged on both sides of the first electrode array L1 or the third electrode array L3 in the width direction Dw. In other words, the two through holes 232 are arranged on the extension line of the first electrode array L1 or the third electrode array L3 along the width direction Dw. Fig.16 and Fig.17 In the embodiment, the two through holes 232 are arranged on the extension line of the third electrode column L3.

[0162] The remaining two through holes 232 are arranged on both sides of the second electrode array L2 or the fourth electrode array L4 in the width direction Dw. In other words, the two through holes 232 are arranged on the extension line of the second electrode array L2 or the fourth electrode array L4 along the width direction Dw. Fig.16 and Fig.17 In the embodiment, the two through holes 232 are arranged on the extension line of the fourth electrode column L4.

[0163] Among the patterns 234 connected to the first electrode array L1 , the pairs of patterns 234 led out for each differential pair are led out toward the second electrode array L2 when viewed from the depth direction Dd, and then change direction by approximately 90 degrees to extend along the width direction Dw.

[0164] Among the patterns 234 connected to the second electrode array L2 , the pairs of patterns 234 led out for each differential pair are led out toward the first electrode array L1 when viewed from the depth direction Dd, and then change direction by approximately 90 degrees and extend along the width direction Dw.

[0165] Thus, by intentionally extending the pattern 234 to the inner region between the first electrode array L1 and the second electrode array L2 , it is possible to ensure an area for providing the through opening 235 or the third electrode array L3 and the fourth electrode array L4 in the outer region.

Claims

1. A socket assembly, characterized in that: include: a substrate including a first surface and a second surface which is a back surface of the first surface; as well as a connector mounted on the substrate and allowing an external module to be inserted along a first direction substantially orthogonal to the first surface, A direction perpendicular to the first direction is set as a second direction, and a direction perpendicular to the first direction and the second direction is set as a third direction, The connector comprises: a plurality of contact pins that contact the external module; and a housing which holds a plurality of said contact pins, The plurality of contact pins are composed of: a first pin group arranged in a row along the second direction; and a second pin group arranged in a row along the second direction and spaced apart from the first pin group in the third direction. The substrate comprises: a plurality of electrodes, which are arranged on the first surface and are used to mount the contact pins; and a plurality of inner layer wirings formed in an inner layer between the first surface and the second surface and connected to each of the electrodes via via holes, The plurality of electrodes are composed of: a first electrode column arranged in a column along the second direction, for mounting the contact pins included in the first pin group; and a second electrode column arranged in a column along the second direction and spaced apart from the first electrode column in the third direction, for mounting the contact pins included in the second pin group. The plurality of inner wirings include: a plurality of first inner wirings connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner wirings connected to the plurality of electrodes included in the second electrode column. When viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode array. When viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column.

2. The socket assembly according to claim 1, characterized in that: The plurality of contact pins are composed of: a third pin group arranged in a row along the second direction; and a fourth pin group arranged in a row along the second direction and arranged at a distance from the third pin group in the third direction. The plurality of electrodes are composed of: a third electrode column arranged in a row along the second direction, for mounting the contact pins included in the third pin group; and a fourth electrode column arranged in a row along the second direction and spaced apart from the third electrode column in the third direction, for mounting the contact pins included in the fourth pin group. The first electrode column and the second electrode column are arranged between the third electrode column and the fourth electrode column in the third direction.

3. The socket assembly according to claim 1, characterized in that: The connector has a plurality of protrusions, which are fixed to the housing and protrude along the first direction. The substrate has a plurality of through holes, the plurality of through holes being formed so as to penetrate from the first surface to the second surface and into which the protrusion is inserted, The through holes are arranged on extension lines of the first electrode columns and the second electrode columns along the second direction.

4. The socket assembly according to claim 2, characterized in that: The connector has a plurality of protrusions, which are fixed to the housing and protrude along the first direction. The substrate has a plurality of through holes, the plurality of through holes being formed so as to penetrate from the first surface to the second surface and into which the protrusion is inserted, The through holes are arranged on extension lines of the first electrode column or the third electrode column and the second electrode column or the fourth electrode column along the second direction.

5. The socket assembly according to claim 1, characterized in that: The first inner layer wiring is led out according to each electrode pair of the electrodes adjacent to each other in the second direction. The second inner layer wiring is led out for each electrode pair of the electrodes adjacent to each other in the second direction.

6. The socket assembly according to claim 1, characterized in that: In the substrate, The distance from the electrode to the first inner wiring along the first direction is a distance at which the electrode and the first inner wiring are not electrically coupled. A distance from the electrode to the second inner layer wiring along the first direction is a distance at which the electrode and the second inner layer wiring are not electrically coupled.

7. The socket assembly according to claim 6, characterized in that: The distance from the electrode to the first inner layer wiring along the first direction is 0.5 mm or more, A distance from the electrode to the second inner layer wiring along the first direction is 0.5 mm or more.

8. The socket assembly according to claim 1, wherein: The substrate has a through opening formed so as to penetrate from the first surface to the second surface. The through openings extend along the second direction in a region where the inner layer wiring is not formed so as to be parallel to the first electrode column and / or the second electrode column.

9. The socket assembly according to claim 8, characterized in that: The through opening is formed in a region farther from the second electrode column than the first electrode column in the third direction and / or is formed in a region farther from the first electrode column than the second electrode column in the third direction.

10. The socket assembly according to claim 1, characterized in that: The housing of the connector has a convex portion protruding along the first direction, The substrate has a recessed portion into which the protruding portion is embedded. The through holes of the substrate are arranged on the sides of the first electrode column and the second electrode column along the second direction. The recessed portion of the substrate is disposed in the third direction between the through hole disposed on the side of the first electrode array and the through hole disposed on the side of the second electrode array.

11. The socket assembly according to claim 3 or 4, characterized in that: The connector has a metal shell covering the housing. A plurality of protrusions are formed on the housing, The housing has a step portion on the outer peripheral surface. An edge of the housing facing the substrate abuts against the step portion of the case.

12. The socket assembly according to claim 1, wherein: comprising a plurality of cages, the cages being defined with at least one port for accommodating the external module, Each of the cages is fixed to the substrate in a state of accommodating the connector mounted on the substrate, The cages are arranged to be spaced apart from each other in at least one of the second direction and the third direction.

13. A substrate, characterized in that: The substrate is used to mount an external connector, the external connector is used to insert an external module along a first direction and has a plurality of contact pins. A direction perpendicular to the first direction is set as a second direction, and a direction perpendicular to the first direction and the second direction is set as a third direction, The substrate comprises: a plurality of electrodes disposed on the first surface for mounting the contact pins; and a plurality of inner layer wirings formed in an inner layer between the first surface and a second surface which is a back surface of the first surface, and connected to each of the electrodes via via holes; The plurality of electrodes are composed of: a first electrode column arranged in a column along the second direction; and a second electrode column arranged in a column along the second direction and spaced apart from the first electrode column in the third direction. The plurality of inner wirings include: a plurality of first inner wirings connected to the plurality of electrodes included in the first electrode column; and a plurality of second inner wirings connected to the plurality of electrodes included in the second electrode column. When viewed from the first direction, some of the plurality of first inner layer wirings are led out toward the second electrode array. When viewed from the first direction, some of the plurality of second inner layer wirings are led out toward the first electrode column.

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