Stress testing device, equipment and system

Abstract

The invention relates to a stress test device, equipment and system, and a wireless transmission module of the equipment is used for receiving a collection instruction from an upper computer, and transmitting the collection instruction to a stress test module; a plurality of stress acquisition channels are arranged in the stress test module, a strain gauge is arranged in each stress acquisition channel, the stress test module is used for determining the stress acquisition channel needing to be activated and a corresponding measurement range according to an acquisition instruction, and the strain gauges in the activated stress acquisition channels are used for acquiring stress data of a measured object and transmitting the stress data to the calibration module; the calibration module is used for determining calibration parameters according to the measurement range, calibrating the stress data by using the calibration parameters to obtain calibrated stress data, and transmitting the calibrated stress data to the wireless transmission module; and the wireless transmission module transmits calibrated stress data to an upper computer in a wireless transmission mode, and the strain gauge sensor can be applied to various signal acquisition and different strain gauge sensors.

Description

Technical Field

[0001] The present application relates to the field of wireless acquisition equipment, and in particular to a stress testing device, equipment and system. Background Art

[0002] With the continuous development of wireless communication technology, in the field of wireless acquisition devices and equipment, the increasing complexity of industrial sites has put forward higher requirements for wireless acquisition equipment, especially the acquisition of stress is often carried out in harsh environments, involving the acquisition of multiple signals and the application of different sensors.

[0003] However, existing stress acquisition devices often have complex structures and single functions, are difficult to apply to a variety of signal acquisition and different sensors, and have complex wiring and high power consumption. Summary of the invention

[0004] The present application provides a stress testing device, equipment and system to solve the technical problems that existing stress testing devices are often complex in structure and single in function, difficult to apply to multiple signal acquisition and different sensors, and have complex wiring and high power consumption.

[0005] In a first aspect, the present application provides a stress testing device, the device comprising: a wireless transmission module, a stress testing module, a calibration module and a power supply module;

[0006] The power supply module is connected to the wireless transmission module, the stress testing module and the calibration module, and is used to supply power to the wireless transmission module, the stress testing module and the calibration module;

[0007] The wireless transmission module is connected to the stress testing module, and is used to receive the acquisition instruction from the host computer in a wireless transmission manner, and transmit the acquisition instruction to the stress testing module;

[0008] The stress testing module is connected to the calibration module, and a plurality of stress acquisition channels are arranged in the stress testing module, each of which is provided with a strain gauge. The stress testing module is used to determine the stress acquisition channel to be activated and its corresponding measurement range according to the acquisition instruction, collect stress data of the object under test within the measurement range by using the strain gauge in the activated stress acquisition channel, and transmit the stress data and the measurement range to the calibration module;

[0009] The calibration module is connected to the wireless transmission module, and is used to determine calibration parameters according to the measurement range, calibrate the stress data using the calibration parameters to obtain calibrated stress data, and transmit the calibrated stress data to the wireless transmission module;

[0010] The wireless transmission module is used to transmit the calibrated stress data to the host computer in a wireless transmission manner.

[0011] In a possible implementation, the stress testing module further includes: a microcontroller unit and an analog-to-digital converter;

[0012] The microcontroller unit is connected to the analog-to-digital converter, each of the stress acquisition channels and the calibration module, and is used to transmit the stress signal of the object under test acquired within the measurement range by the strain gauge in the activated stress acquisition channel to the analog-to-digital converter;

[0013] The analog-to-digital converter is used to receive the stress signal transmitted by the micro control unit, convert the stress signal into a digital signal to obtain stress data, and transmit the stress data to the micro control unit;

[0014] The micro control unit is used to transmit the stress data to the calibration module.

[0015] In a possible implementation manner, the stress testing module is used to receive the acquisition instruction transmitted by the wireless transmission module, and parse the acquisition instruction to obtain acquisition data, wherein the acquisition data includes the activation parameter and range corresponding to each of the stress acquisition channels;

[0016] Determining whether to activate the corresponding stress collection channel according to the activation parameter corresponding to each stress collection channel;

[0017] The measurement range corresponding to each stress collection channel is determined according to the measurement range corresponding to each stress collection channel.

[0018] In a possible implementation manner, the stress testing module is used to determine to activate the stress acquisition channel when an activation parameter corresponding to the stress acquisition channel is greater than a preset activation threshold;

[0019] When the activation parameter corresponding to the stress acquisition channel is less than or equal to a preset activation threshold, it is determined not to activate the stress acquisition channel.

[0020] In a possible implementation manner, the calibration module includes: an internal resistance switch, an external resistance switch, an internal resistor, an external resistor, and a calibration unit;

[0021] The calibration unit is connected to the internal resistance switch and the external resistance switch respectively, and is used to control the internal resistance switch and the external resistance switch according to the calibration parameter;

[0022] The internal resistor switch is used to connect or disconnect the internal resistor under the control of the calibration unit; wherein the resistance value of the internal resistor is fixed;

[0023] The external resistor switch is used to connect or disconnect the external resistor under the control of the calibration unit; wherein the resistance value of the external resistor is determined according to the measurement range corresponding to the strain gauge.

[0024] In a possible implementation, the device further includes: a storage module;

[0025] The storage module is connected to the calibration module and the stress testing module;

[0026] The storage module is used to store the calibrated stress data obtained by the calibration module;

[0027] The stress testing module is used to receive a data reading instruction from the wireless transmission module, read the stress data from the storage module according to the data reading instruction, and transmit the read stress data to the wireless transmission module.

[0028] In a possible implementation manner, the wireless transmission module is further used to receive a working mode conversion instruction from the host computer in a wireless transmission manner, and transmit the working mode conversion instruction to the stress testing module;

[0029] The stress test module is used to set its own working mode according to the working mode conversion instruction, and the working mode is: active mode, idle mode or sleep mode.

[0030] In a possible implementation manner, the wireless transmission module is further used to receive an acquisition mode conversion instruction from the host computer in a wireless transmission manner, and transmit the acquisition mode conversion instruction to the stress testing module;

[0031] The stress test module is used to set its own acquisition mode according to the acquisition mode conversion instruction, and the acquisition mode is: continuous acquisition mode, periodic acquisition mode or response acquisition mode.

[0032] In a second aspect, the present application provides a stress testing device, comprising:

[0033] A housing and a stress testing device as described in any one of the first aspects;

[0034] The wireless transmission module, the stress testing module and the power supply module in the stress testing device are arranged inside the housing; the calibration module is connected to the housing;

[0035] The calibration module in the stress testing device is detachably connected to the shell.

[0036] In a third aspect, the present application provides a stress acquisition system, including: the stress testing device, strain gauge, gateway and host computer as described in the second aspect;

[0037] The host computer is used to send a collection instruction to the stress testing device through the gateway in a wireless transmission manner;

[0038] The stress testing device collects stress data of the object under test through the strain gauge according to the collection instruction, calibrates the stress data to obtain calibrated stress data, and transmits the calibrated stress data to the host computer through the gateway in a wireless transmission manner;

[0039] The host computer is used to receive and display the calibrated stress data.

[0040] The above technical solution provided by the embodiment of the present application has the following advantages over the prior art: the embodiment of the present application provides a stress testing device, which includes a wireless transmission module, a stress testing module, a calibration module and a power supply module, the wireless transmission module is used to receive an acquisition instruction from a host computer, and transmit the acquisition instruction to the stress testing module; a plurality of stress acquisition channels are provided in the stress testing module, each of which is provided with a strain gauge, which is used to determine the stress acquisition channel to be activated and its corresponding measurement range according to the acquisition instruction, and to collect the stress data of the measured object using the strain gauge in the activated stress acquisition channel and transmit it to the calibration module; the calibration module is used to determine the calibration parameters according to the measurement range, calibrate the stress data using the calibration parameters to obtain the calibrated stress data, and transmit the calibrated stress data to the wireless transmission module; the wireless transmission module transmits the calibrated stress data to the host computer in a wireless transmission mode. This method realizes that different stress acquisition channels use different types of strain gauges, and the measurement range of different stress acquisition channels is adjustable, which can be applied to a variety of signal acquisition measurement environments and different strain gauge sensors, thereby improving the measurement efficiency of the stress acquisition device. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0043] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0044] Figure 1 A schematic diagram of the structure of a stress testing device provided in an embodiment of the present application;

[0045] Figure 2 A schematic diagram of the structure of a calibration board provided in an embodiment of the present application;

[0046] Figure 3 A schematic diagram of a working mode of a stress testing device provided in an embodiment of the present application;

[0047] Figure 4 A schematic diagram of a stress acquisition system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0049] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0050] In order to solve the technical problems that existing stress acquisition devices are often complex in structure and single in function, difficult to apply to multiple signal acquisition and different sensors, and have complex wiring and high power consumption, the present application provides a stress testing device, equipment and system, which can realize the use of different types of strain gauges for different stress acquisition channels. At the same time, the measurement range of different stress acquisition channels is adjustable, and can be applied to multiple signal acquisition measurement environments and different strain gauge sensors, thereby improving the measurement efficiency of the stress acquisition equipment.

[0051] Figure 1 A schematic diagram of a stress testing device provided in an embodiment of the present application is shown in FIG. Figure 1As shown, the device includes a stress testing device and a housing 10 , and the stress testing device includes a wireless transmission module 11 , a stress testing module 14 , a calibration module 12 and a power supply module 13 .

[0052] See also Figure 1 The structural diagram of the stress testing device shown in the figure, wherein a stress testing device is provided inside the housing 10, and the stress testing device includes a wireless transmission module 11, a stress testing module 14, a calibration module 12 and a power module 13. It should be noted that the calibration module 12 in the stress testing device is detachably connected to the housing 10. The stress testing device in the above stress testing device will be described in detail below.

[0053] The power module 13 in the stress testing device is connected to the wireless transmission module 11, the stress testing module 14 and the calibration module 12. In one embodiment, the power module 13 is used to supply power to the wireless transmission module 11, the stress testing module 14 and the calibration module 12. Specifically, the power module 13 includes a battery and a battery box, and the battery box is used to store the battery. The stress testing device provides power to each module in the stress testing device through the battery, and does not need to be powered by plugging in, which is convenient for remote carrying and measuring stress data. In the absence of an external power supply, stress data in the current environment can still be measured and collected normally.

[0054] In one embodiment, the stress testing module 14 in the stress testing device is connected to the calibration module 12, and a strain gauge is provided inside the stress testing module 14. The stress testing module 14 determines the stress acquisition channel to be activated and its corresponding measurement range according to the acquisition instruction transmitted by the wireless transmission module 11, and uses the strain gauge in the activated stress acquisition channel to collect stress data of the object under test within the measurement range, and transmits the stress data and the measurement range to the calibration module 12.

[0055] A strain gauge is a sensor that can convert the strain (mechanical deformation) of an object into an electrical quantity (usually a change in resistance). The strain gauge in the embodiment of the present application is a sensor, and the stress testing device in the embodiment of the present application is applicable to various types of strain gauges, that is, the stress testing device in the present application can be applied to various sensors.

[0056] The strain gauge inside the stress testing module 14 can be connected externally, and the user can select different types of strain gauges to connect. As a possible implementation method, the strain gauge is pasted on the object to be tested and connected to the stress acquisition channel. When the object is deformed, the strain gauge will produce the same deformation. At this time, the stress data generated by the deformation is measured through the stress acquisition channel connected to the strain gauge.

[0057] The stress test module 14 is internally provided with a plurality of stress acquisition channels, each of which can be connected to different types of strain gauges. The measurement range of each stress acquisition channel can be controlled by the host computer. When the user uses the device to collect stress data, he can choose to activate a stress acquisition channel with a suitable measurement range to collect stress data, or specify the measurement range corresponding to each stress acquisition channel.

[0058] As a possible implementation method, the wireless transmission module 11 transmits the acquisition instructions issued by the upper computer to the stress testing module 14. The stress testing module 14 parses the acquisition instructions to obtain calibration parameters and range information, sets the measurement range of each stress acquisition channel according to the range information, and confirms whether to activate the corresponding stress acquisition channel for collecting stress data of the object under test according to the calibration parameters.

[0059] In one embodiment, an activation threshold may be preset. When the activation parameter is greater than the preset activation threshold, the stress collection channel is activated. When the activation parameter is less than or equal to the preset activation threshold, the stress collection channel is not activated.

[0060] For example, if the stress testing module 14 has two stress acquisition channels, the preset activation threshold is 10, and the acquisition instruction received from the host computer has two range information and two activation parameter information, wherein the two range information are 1-5 and 5-10 respectively, and the two activation parameters corresponding to the two range information are 1 and 11 respectively, then, the range of one stress acquisition channel in the stress testing module 14 is set to 1-5, and the activation parameter 1 is less than the preset activation threshold 10, and the stress acquisition channel is not activated. The range of the other stress acquisition channel is set to 5-10, and the activation parameter 11 is greater than the preset activation threshold 10, and the stress acquisition channel is activated, and the strain gauge is connected to the stress acquisition channel to collect stress data of the object under test.

[0061] After the stress testing module 14 uses the activated stress acquisition channel to collect stress data of the object under test, it transmits the collected stress data and the measurement range of the current stress channel to the calibration module 12 for calibration. The calibration module 12 will be described in detail in the form of an embodiment below and will not be repeated here.

[0062] In one embodiment, the stress test module 14 further includes a microcontroller unit and an analog-to-digital converter. The microcontroller unit is the main control unit of the stress test module 14, connected to the analog-to-digital converter, each stress acquisition channel and the calibration module 12, and is used to transmit the stress signal of the object under test collected within the measurement range by the strain gauge in the activated stress acquisition channel to the analog-to-digital converter. The analog-to-digital converter is used to receive the stress signal transmitted by the microcontroller unit, convert the stress signal into a digital signal, obtain stress data, and transmit the stress data to the microcontroller unit. The microcontroller unit transmits the received stress data and the measurement range corresponding to the strain gauge to the calibration module 12 for calibration.

[0063] As a possible implementation, the microcontroller transmits the stress signal of the object under test collected by the strain gauge in the activated stress collection channel within the measurement range to the analog-to-digital converter, wherein the stress signal collected by the strain gauge in the stress collection channel is in the form of resistance or voltage. The analog-to-digital converter converts the stress signal into a digital signal to obtain stress data, and then transmits the stress data obtained after the conversion to the microcontroller, and finally the microcontroller transmits the stress data to the calibration module 12.

[0064] For example, if the strain signal of the object under test collected by the strain gauge in the activated stress acquisition channel within the measuring range is 5V, the analog-to-digital converter converts the 5V stress signal into a digital signal 0100110 to obtain stress data, and then transmits the obtained stress data to the micro control unit, and the micro control unit transmits the obtained stress data to the calibration module 12.

[0065] The wireless transmission module 11 in the stress testing device is connected to the stress testing module 14, and is used to receive the acquisition instructions from the host computer by wireless transmission, and transmit the acquisition instructions to the stress testing module 14. The wireless transmission module 11 is also connected to the calibration module 12, and is used to receive the stress data calibrated by the calibration module 12, and transmit the calibrated stress data to the host computer by wireless transmission.

[0066] As a possible implementation, the wireless transmission module 11 includes an antenna, and the antenna is used to transmit instructions and data. For example, the wireless transmission module 11 receives an acquisition instruction from the host computer through the antenna, and transmits the acquisition instruction to the stress testing module 14, and can also transmit the stress data calibrated by the calibration module 12 to the host computer through the antenna.

[0067] In one embodiment, the stress testing device further includes a storage module for storing the stress data calibrated by the calibration module 12 .

[0068] As a possible implementation, the storage module is connected to the calibration module 12 and the stress testing module 14, and is used to store the stress data obtained after calibration by the calibration module 12, and when the stress testing module 14 receives a data reading instruction, the stored calibrated stress data is submitted to the stress testing module 14. The stress testing module 14 receives the data reading instruction from the host computer transmitted through the wireless transmission module 11, and reads the stored calibrated stress data from the storage module.

[0069] It should be noted here that when the host computer and the wireless transmission module 11 are disconnected, the calibrated stress data stored in the storage module is still retained. When the data reading instruction transmitted by the host computer through the wireless transmission module 11 is received again, the calibrated stress data is submitted to the stress testing module 14, and the stress testing module 14 transmits the read calibrated stress data to the wireless transmission module 11.

[0070] The embodiment of the present application provides a stress testing device, which includes a wireless transmission module 11, a stress testing module 14, a calibration module 12 and a power supply module 13, wherein the wireless transmission module 11 is used to receive an acquisition instruction from a host computer and transmit the acquisition instruction to the stress testing module 14; the stress testing module 14 is provided with a plurality of stress acquisition channels, each of which is provided with a strain gauge, which is used to determine the stress acquisition channel to be activated and its corresponding measurement range according to the acquisition instruction, and to collect stress data of the object under test by using the strain gauge in the activated stress acquisition channel and transmit it to the calibration module 12; the calibration module 12 is used to determine the calibration parameters according to the measurement range, calibrate the stress data by using the calibration parameters to obtain the calibrated stress data, and transmit the calibrated stress data to the wireless transmission module 11; the wireless transmission module 11 transmits the calibrated stress data to the host computer by wireless transmission. This method realizes that different stress acquisition channels use different types of strain gauges, and the measurement range of different stress acquisition channels is adjustable, which can be applied to a variety of signal acquisition measurement environments and different strain gauge sensors, thereby improving the measurement efficiency of the stress acquisition device.

[0071] Figure 2 A schematic diagram of the structure of a calibration board provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, the calibration board includes four internal resistance switches 20 , one external resistance switch 21 , an internal resistor 22 , an external resistor 23 and a calibration unit 24 .

[0072] See also Figure 2As shown, ON and OFF respectively represent the two states of the internal resistor switch 20 being connected and disconnected, and the external resistor switch 21 is in the form of a button. Pressing the button represents that the external resistor switch 21 is connected, and not pressing the button represents that the external resistor switch 21 is disconnected. There may also be other types of switches to control the connection and disconnection of the internal resistor 22 and the external resistor 23, and the embodiments of the present application are not limited to this.

[0073] The calibration plate is a standard reference tool used to calibrate instruments and equipment. During daily use, the calibration plate may be deformed, scratched, cracked, worn, etc. due to vibration, bumps, large changes in temperature and humidity, etc., causing it to be unable to perform its calibration function normally. At this time, a new calibration plate needs to be replaced.

[0074] The embodiment of the present application provides a detachable link between the calibration board and the stress testing device. As a possible implementation method, the calibration board and the stress testing device are connected or disconnected by plugging in and out. In addition, the calibration board and the stress testing device can also be disassembled and connected by other methods.

[0075] The calibration module 12 receives the stress data transmitted by the stress test module 14, calibrates the stress data using the calibration board, and transmits the calibrated data to the host computer. In one embodiment, the calibration unit 24 in the calibration module 12 is respectively connected to the internal resistor switch 20 and the external resistor switch 21, wherein the resistance value of the internal resistor 22 is fixed, and the resistance value of the external resistor 23 is determined according to the measurement range corresponding to the strain gauge. Specifically, the calibration unit 24 determines the calibration parameters according to the above measurement range, and uses the calibration parameters to control the connection and disconnection of the internal resistor 22 and the external resistor 23, see Figure 2 The schematic diagram of the calibration board structure shown in the figure is Figure 2 The four internally connected resistance switches 20 are respectively referred to as SW1, SW2, SW3, and SW4.

[0076] As a possible implementation method, the calibration unit 24 determines the appropriate number and type of strain gauges based on the measurement accuracy of the stress data of the object under test, and determines the resistance value of the external resistor 23 based on the measurement range of the strain gauge and the resistance value of the internal resistor 22, and controls the connectivity status of each internal resistor switch 20 and the external resistor switch 21 according to the calibration parameters.

[0077] There are three configurations for the number of strain gauges, namely, 1 strain gauge, 2 strain gauges, and 4 strain gauges. The more strain gauges there are, the higher the measurement accuracy and calibration requirements are. Generally, in the configuration mode of 4 strain gauges, SW1, SW2, and SW3 are all in a connected state, SW4 is in a disconnected state, the external resistor switch 21 is open, and the external resistor 23 is in a connected state; in the configuration mode of 2 strain gauges, SW1 is in a connected state, SW2, SW3, and SW4 are in a disconnected state, the external resistor switch 21 is open, and the external resistor 23 is in a connected state; in the configuration mode of 1 strain gauge, SW1, SW2, SW3, and SW4 are in a disconnected state, the external resistor switch 21 is open, and the external resistor 23 is in a connected state. In the configuration mode of 1 strain gauge, SW1, SW2, SW3, and SW4 are in a disconnected state, the external resistor switch 21 is open, and the external resistor 23 is in a connected state. The calibration unit 24 controls the connection state of each internal resistor switch 20 and the external resistor switch 21 according to the calibration parameters, that is, controls the configuration mode of the strain gauge.

[0078] For example, assuming that the calibration unit 24 determines based on the calibration parameters that SW1, SW2, and SW3 are currently connected, that is, the three internal resistors 22 are connected, the external resistor switch 21 is open, and the external resistor 23 is connected. This is a configuration mode of four strain gauges, where the total resistance of the three internal resistors is 1kΩ, and the measurement range of the strain gauge is 1-5. Then, based on the resistance of the internal resistors and the measurement range of the strain gauge, an external resistor with a resistance of 499kΩ is connected in parallel. The calibration unit 24 records the node voltage value V2 actually measured in this configuration mode, and calculates the node theoretical voltage value V0 according to the following formula:

[0079]

[0080] Among them, R in the above formula (1) G Represents the total resistance of the internal resistor, for example, 1000; R S represents the resistance value of the external resistor, for example, 499000; GF represents the gauge factor, for example, it can be 2; V S represents the bridge excitation voltage, a constant; BF represents the bridge factor, which can be, for example, 4. The bridge factor is equal to the number of strain gauges in the current configuration mode. The node theoretical voltage value V0 is calculated according to the above formula (1).

[0081] The calibration coefficient is calculated based on the theoretical voltage value calculated above and the actually measured node voltage value recorded by the calibration unit 24 using the following formula (2):

[0082]

[0083] Among them, in the above formula (2) represents the calibration coefficient; V2 represents the node voltage value actually measured, and V0 represents the node theoretical voltage value calculated according to the above formula (1).

[0084] The calibration unit 24 uses the calibration coefficient calculated by the above formula (2) to calculate the calibrated stress data using the following formula.

[0085]

[0086] In the above formula (3), slope represents the slope; offset represents the bias; and range represents the + Indicates the upper limit of the range of the analog-to-digital converter; Range - Indicates the lower limit of the analog-to-digital converter range; gain indicates gain; N indicates the resolution of the analog-to-digital converter; Indicates the calibration coefficient; V S represents the bridge excitation voltage, a constant; bits represents the stress data before calibration; v′ represents the stress data after calibration; the calibrated stress data can be obtained by calculating using the above formula (3).

[0087] In one embodiment, the calibration module 12 calibrates the stress data according to the calibration parameters to obtain the calibrated stress data ε′ and transmits the calibrated stress data ε′ to the host computer through the wireless transmission module 11 .

[0088] The calibration module 12 provided in the embodiment of the present application is detachably linked to the stress testing device, and the calibration board connected to the stress testing device can be replaced at any time, which is convenient for selecting a suitable calibration board to calibrate the collected data, thereby improving the calibration rate of the stress testing device.

[0089] Figure 3 A schematic diagram of a working mode of a stress testing device provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, the stress test device includes three different working modes, namely active mode, idle mode and sleep mode.

[0090] In one embodiment, the wireless transmission module 11 receives the working mode conversion instruction from the host computer in a wireless transmission manner, and transmits the working mode conversion instruction to the stress testing device. The stress testing module 14 in the stress testing device receives the working mode conversion instruction and switches the working mode according to the instruction, wherein the working mode of the stress testing device is one of the following three working modes: activation mode, idle mode and sleep mode.

[0091] In the activation mode, the stress test device performs stress testing and acquisition operations, and the node status indicator flashes green at a frequency of once per second.

[0092] In idle mode, the stress test device detects whether a working mode conversion instruction is received every preset time period, and can be converted to active mode or sleep mode. In this mode, the node status indicator light flashes red at a frequency of once per second.

[0093] In sleep mode, the stress test device is in a low power state. In this mode, the stress test device consumes very little power and will periodically check whether there is an idle command. When an idle command is received, it will switch to idle mode. In this mode, the node status indicator flashes blue at a frequency of once per second.

[0094] Different working modes are switched through a variety of working mode conversion instructions. In the active mode, the stress test device is in a normal working state. In the idle mode, the stress test device is in a suspended state. In the sleep mode, the stress test device is in an extremely low power sleep state. In this mode, the stress test device will turn off the stress test function, but still retain related data so as to quickly restore the working state. This method significantly reduces power consumption by turning off the functions of the device in the idle mode and the sleep mode, thereby extending the battery life and the service life of the device. At the same time, it can quickly restore to the active mode through the idle mode, thereby improving the use efficiency of the device.

[0095] In one embodiment, the wireless transmission module 11 receives the acquisition mode conversion instruction from the host computer by wireless transmission, and transmits the acquisition mode conversion instruction to the stress testing device. The stress testing module 14 in the stress testing device receives the acquisition mode conversion instruction and switches the acquisition mode according to the instruction, wherein the acquisition mode of the stress testing device is one of the following three acquisition modes: continuous acquisition mode, periodic acquisition mode and response acquisition mode.

[0096] In the continuous acquisition mode, the stress test device will continuously perform stress acquisition operations. In the periodic acquisition mode, the stress test device will periodically perform stress acquisition operations according to the preset time interval. The response acquisition mode means that the stress test device starts to perform stress acquisition operations due to a certain event triggering it.

[0097] By switching between a variety of acquisition modes to meet different acquisition needs and apply to a variety of stress acquisition and testing environments, the measurement performance of the stress testing device is improved while enhancing the user experience.

[0098] Figure 4 A schematic diagram of a stress acquisition system provided in an embodiment of the present application mainly includes a strain gauge, a stress testing device, a gateway and a host computer, see Figure 4 As shown, a stress testing device is integrated on the stress testing equipment.

[0099] The host computer refers to a computer system that plays a leading role in a control system, mainly responsible for monitoring, issuing instructions, data collection, processing and analysis, and user interaction. The host computer in this application can be a tablet or laptop with computer system functions. A gateway is a network device that can connect two different networks so that they can communicate with each other.

[0100] The host computer in the stress acquisition system provided in the embodiment of the present application sends an acquisition instruction to the stress testing device through a gateway in a wireless transmission manner. The stress testing device collects stress data of the object under test through the strain gauge according to the acquisition instruction, calibrates the stress data to obtain calibrated stress data, and transmits the calibrated stress data to the host computer through the gateway. The host computer receives the calibrated stress data and displays it.

[0101] The stress acquisition system provided in the embodiment of the present application realizes remote interaction between the host computer and the stress testing equipment. The stress testing equipment can realize wireless remote measurement and transmission of stress and can remotely measure stress data without wiring. In addition, the stress testing equipment can be applied to various complex environments, meet various signal acquisition requirements and a variety of sensors, further improve the measurement performance of the stress testing device, and reduce power consumption.

[0102] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0103] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a general hardware platform, and of course, by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0104] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0105] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A stress testing device, characterized in that: include: Wireless transmission module, stress test module, calibration module and power supply module; The power supply module is connected to the wireless transmission module, the stress testing module and the calibration module, and is used to supply power to the wireless transmission module, the stress testing module and the calibration module; The wireless transmission module is connected to the stress testing module, and is used to receive the acquisition instruction from the host computer in a wireless transmission manner, and transmit the acquisition instruction to the stress testing module; The stress testing module is connected to the calibration module, and a plurality of stress acquisition channels are arranged in the stress testing module, each of which is provided with a strain gauge. The stress testing module is used to determine the stress acquisition channel to be activated and its corresponding measurement range according to the acquisition instruction, collect stress data of the object under test within the measurement range by using the strain gauge in the activated stress acquisition channel, and transmit the stress data and the measurement range to the calibration module; The calibration module is connected to the wireless transmission module, and is used to determine calibration parameters according to the measurement range, calibrate the stress data using the calibration parameters to obtain calibrated stress data, and transmit the calibrated stress data to the wireless transmission module; The wireless transmission module is used to transmit the calibrated stress data to the host computer in a wireless transmission manner.

2. The device according to claim 1, characterized in that The stress test module also includes: a micro control unit and an analog-to-digital converter; The microcontroller unit is connected to the analog-to-digital converter, each of the stress acquisition channels and the calibration module, and is used to transmit the stress signal of the object under test acquired within the measurement range by the strain gauge in the activated stress acquisition channel to the analog-to-digital converter; The analog-to-digital converter is used to receive the stress signal transmitted by the micro control unit, convert the stress signal into a digital signal to obtain stress data, and transmit the stress data to the micro control unit; The micro control unit is used to transmit the stress data to the calibration module.

3. The device according to claim 1, characterized in that The stress testing module is used to receive the acquisition instruction transmitted by the wireless transmission module, and parse the acquisition instruction to obtain acquisition data, wherein the acquisition data includes the activation parameters and range corresponding to each of the stress acquisition channels; Determining whether to activate the corresponding stress collection channel according to the activation parameter corresponding to each stress collection channel; The measurement range corresponding to each stress collection channel is determined according to the measurement range corresponding to each stress collection channel.

4. The method according to claim 3, characterized in that: The stress testing module is used to determine to activate the stress acquisition channel when the activation parameter corresponding to the stress acquisition channel is greater than a preset activation threshold; When the activation parameter corresponding to the stress acquisition channel is less than or equal to a preset activation threshold, it is determined not to activate the stress acquisition channel.

5. The device according to claim 1, characterized in that The calibration module comprises: an internal resistance switch, an external resistance switch, an internal resistor, an external resistor and a calibration unit; The calibration unit is connected to the internal resistance switch and the external resistance switch respectively, and is used to control the internal resistance switch and the external resistance switch according to the calibration parameter; The internal resistor switch is used to connect or disconnect the internal resistor under the control of the calibration unit; wherein the resistance value of the internal resistor is fixed; The external resistor switch is used to connect or disconnect the external resistor under the control of the calibration unit; wherein the resistance value of the external resistor is determined according to the measurement range corresponding to the strain gauge.

6. The device according to claim 1, characterized in that The device also includes: a storage module; The storage module is connected to the calibration module and the stress testing module; The storage module is used to store the calibrated stress data obtained by the calibration module; The stress testing module is used to receive a data reading instruction from the wireless transmission module, read the stress data from the storage module according to the data reading instruction, and transmit the read stress data to the wireless transmission module.

7. The device according to claim 1, characterized in that The wireless transmission module is also used to receive the working mode conversion instruction from the host computer in a wireless transmission manner, and transmit the working mode conversion instruction to the stress testing module; The stress test module is used to set its own working mode according to the working mode conversion instruction, and the working mode is: active mode, idle mode or sleep mode.

8. The device according to claim 1, characterized in that The wireless transmission module is also used to receive the acquisition mode conversion instruction from the host computer in a wireless transmission manner, and transmit the acquisition mode conversion instruction to the stress testing module; The stress test module is used to set its own acquisition mode according to the acquisition mode conversion instruction, and the acquisition mode is: continuous acquisition mode, periodic acquisition mode or response acquisition mode.

9. A stress testing device, characterized in that: include: A housing and a stress testing device as claimed in any one of claims 1 to 8; The wireless transmission module, the stress testing module and the power supply module in the stress testing device are arranged inside the housing; the calibration module is connected to the housing; The calibration module in the stress testing device is detachably connected to the shell.

10. A stress acquisition system, characterized in that: include: The stress testing device, strain gauge, gateway and host computer as claimed in claim 9; The host computer is used to send a collection instruction to the stress testing device through the gateway in a wireless transmission manner; The stress testing device collects stress data of the object under test through the strain gauge according to the collection instruction, calibrates the stress data to obtain calibrated stress data, and transmits the calibrated stress data to the host computer through the gateway in a wireless transmission manner; The host computer is used to receive and display the calibrated stress data.

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