Application of power amplifier circuit in electronic frequency division of Bluetooth headset

Abstract

The present invention relates to a circuit, and specifically discloses an application of a power amplifier circuit in the electronic frequency division of a Bluetooth headset, comprising a first Bluetooth audio input terminal and a second Bluetooth audio input terminal, the first Bluetooth audio input terminal is electrically connected to a first capacitor, a first resistor and a power amplifier integrated circuit in sequence, the power amplifier integrated circuit is electrically connected to a moving coil module, the second Bluetooth audio input terminal is electrically connected to a second capacitor, a second resistor and a power amplifier integrated circuit in sequence, the power amplifier integrated circuit is electrically connected to a moving iron module, the specification of the first capacitor is greater than that of the second capacitor, and the impedance of the first resistor is less than the impedance of the second resistor. The sound played can be balanced and full, and no harsh screaming sound is produced.

Description

Technical Field

[0001] The invention relates to a circuit, and in particular to an application of a power amplifier circuit in electronic frequency division of a Bluetooth headset. Background Art

[0002] At present, open Bluetooth headsets on the market generally use mono-channel amplifier chips, and the bass and treble are amplified with the same power at the same time. Therefore, when the amplifier chip of the headset using this circuit adjusts the volume, it is easy to be distorted because the bass and treble are amplified with the same power at the same time, and the high-frequency sound will produce a harsh screaming sound, causing discomfort to the user.

[0003] In view of this, it is necessary to develop an application of a power amplifier circuit in the electronic frequency division of a Bluetooth headset to solve the defects of the existing circuit. Summary of the invention

[0004] The purpose of the present invention is to provide an application of a power amplifier circuit in the electronic frequency division of a Bluetooth headset to solve the defects of the existing circuit.

[0005] According to one aspect of the present invention, there is provided an application of a power amplifier circuit in the electronic frequency division of a Bluetooth headset, comprising a first Bluetooth audio input terminal and a second Bluetooth audio input terminal, wherein the first Bluetooth audio input terminal is electrically connected in sequence to a first capacitor, a first resistor and a power amplifier integrated circuit, the power amplifier integrated circuit is electrically connected to a dynamic coil module, the second Bluetooth audio input terminal is electrically connected in sequence to a second capacitor, a second resistor and a power amplifier integrated circuit, the power amplifier integrated circuit is electrically connected to the dynamic iron module, the specification of the first capacitor is greater than the specification of the second capacitor, and the impedance of the first resistor is less than the impedance of the second resistor.

[0006] In some implementations, the specification of the first capacitor is 1.0 μF, the impedance of the first resistor is 10 KΩ, the specification of the second capacitor is 0.47 μF, and the impedance of the second resistor is 20 KΩ.

[0007] In some embodiments, a third resistor and a fourth resistor are also included, and the impedance of the third resistor and the fourth resistor are both 50KΩ. One end of the third resistor is electrically connected to one end of the first resistor, and the other end is electrically connected to one end of the moving coil module to form a parallel connection with the power amplifier integrated circuit. One end of the fourth resistor is electrically connected to one end of the second resistor, and the other end is electrically connected to one end of the moving iron module to form a parallel connection with the power amplifier integrated circuit.

[0008] In some embodiments, the power amplifier integrated circuit includes three op amps, namely a first op amp, a second op amp, a third op amp and a touch control module. The reverse input terminal of the first op amp is electrically connected to one end of the first resistor, the non-inverting input terminal of the first op amp is electrically connected to the non-inverting input terminal of the second op amp and the non-inverting input terminal of the third op amp respectively, the output terminal of the first op amp is electrically connected to one end of the moving coil module, the negative power terminal of the first op amp and the negative power terminal of the third op amp are electrically connected to the touch control module, the negative power terminal of the second op amp is also electrically connected to the touch control module, the output terminal of the third op amp is electrically connected to one end of the moving iron module, the output terminal of the second op amp is electrically connected to the other end of the moving iron module and the other end of the moving coil module, and the reverse input terminal of the second op amp is also electrically connected to the output terminal of the second op amp.

[0009] In some embodiments, the power amplifier integrated circuit also includes a bias generator, which is electrically connected to the non-inverting input terminal of the first op amp, the non-inverting input terminal of the second op amp, and the non-inverting input terminal of the third op amp, and the bias generator is also electrically connected to the touch control module.

[0010] In some implementations, the power amplifier integrated circuit further includes a switch module, and the switch module is electrically connected to the touch control module.

[0011] In some implementations, the first Bluetooth audio input terminal can input low-frequency audio, and the second Bluetooth audio input terminal can input mid-high-frequency audio.

[0012] The beneficial effects of the present invention are as follows: the circuit of the present invention can achieve a frequency division effect, specifically, the first Bluetooth audio input terminal can input a low frequency frequency, and the part connected to the first Bluetooth audio input terminal is amplified through the low impedance of the first resistor, the high capacitance of the first capacitor and the power amplifier integrated circuit, and the second Bluetooth audio input terminal can input a high frequency frequency, and the part connected to the second Bluetooth audio input terminal is amplified through the high impedance of the second resistor, the low capacitance of the second capacitor and the power amplifier circuit, thereby achieving a frequency division amplification effect.

[0013] Through the above-mentioned frequency division playback, the sound played back is balanced and full, and no harsh screaming sound is produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The present invention is a circuit schematic diagram of an application of a power amplifier circuit in an embodiment of the present invention in the electronic frequency division of a Bluetooth headset.

[0017] In the figure, 1-first Bluetooth audio input terminal; 2-second Bluetooth audio input terminal; 3-first capacitor; 4-first resistor; 51-first op amp; 52-second op amp; 53-third op amp; 54-touch module; 55-bias generator; 56-switch module; 6-moving coil module; 7-second capacitor; 8-second resistor; 9-moving iron module; 10-third resistor; 11-fourth resistor. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0020] Figure 1 The circuit schematically shows the application of a power amplifier circuit in an embodiment of the present invention in the electronic frequency division of a Bluetooth headset.

[0021] like Figure 1 As shown, an application of a power amplifier circuit in the electronic frequency division of a Bluetooth headset includes a first Bluetooth audio input terminal 1 and a second Bluetooth audio input terminal 2. The first Bluetooth audio input terminal 1 is electrically connected to a first capacitor 3, a first resistor 4 and a power amplifier integrated circuit in sequence, and the power amplifier integrated circuit is electrically connected to a moving coil module 6. The second Bluetooth audio input terminal 2 is electrically connected to a second capacitor 7, a second resistor 8 and a power amplifier integrated circuit in sequence, and the power amplifier integrated circuit is electrically connected to a moving iron module 9. The specification of the first capacitor 3 is greater than the specification of the second capacitor 7, and the impedance of the first resistor 4 is less than the impedance of the second resistor 8.

[0022] In this embodiment, the specification of the first capacitor 3 is 1.0μF, the impedance of the first resistor 4 is 10KΩ, the specification of the second capacitor 7 is 0.47μF, and the impedance of the second resistor 8 is 20KΩ. Therefore, through this setting, the low-frequency sound can be amplified by the first capacitor 3, the first resistor 4 and the power amplifier integrated circuit and released by the dynamic module, and the sound emitted is full, and the high-frequency sound can be amplified by the second capacitor 7, the second resistor 8 and the power amplifier integrated circuit and released by the dynamic module. Since the impedance of the second resistor is relatively large and the specification of the second capacitor is relatively small, the sound emitted can be not harsh.

[0023] like Figure 1 As shown, the present invention also includes a third resistor 10 and a fourth resistor 11, the impedance of the third resistor 10 and the fourth resistor 11 are both 50KΩ, one end of the third resistor 10 is electrically connected to one end of the first resistor 4, and the other end is electrically connected to one end of the moving coil module 6 to form a parallel connection with the power amplifier integrated circuit, and one end of the fourth resistor 11 is electrically connected to one end of the second resistor 8, and the other end is electrically connected to one end of the moving iron module 9 to form a parallel connection with the power amplifier integrated circuit. Therefore, the third resistor 10 and the fourth resistor 11 are feedback resistors, which can eliminate the influence of the bias current on the output voltage.

[0024] like Figure 1 As shown, the power amplifier integrated circuit includes three amplifiers, namely a first amplifier 51, a second amplifier 52, a third amplifier 53 and a touch module 54. The reverse input terminal of the first amplifier 51 is electrically connected to one end of the first resistor 4, the in-phase input terminal of the first amplifier 51 is electrically connected to the in-phase input terminal of the second amplifier 52 and the in-phase input terminal of the third amplifier 53, the output terminal of the first amplifier 51 is electrically connected to one end of the dynamic module 6, and the negative power terminal of the first amplifier 51 and the negative power terminal of the third amplifier 53 are electrically connected. The negative end of the power supply of the second operational amplifier 52 is also electrically connected to the touch control module 54, the output end of the third operational amplifier 53 is electrically connected to one end of the moving iron module 9, the output end of the second operational amplifier 52 is electrically connected to the other end of the moving iron module 9 and the other end of the moving coil module 6, the reverse input end of the second operational amplifier 52 is electrically connected to the output end, and in addition, the output end of the second operational amplifier 52 is also electrically connected to the touch control module 54, and the touch control module 54 can control the volume and change of the sound by touching and tapping.

[0025] like Figure 1 As shown, the power amplifier integrated circuit also includes a bias generator 55, which is electrically connected to the non-inverting input terminal of the first op amp 51, the non-inverting input terminal of the second op amp 52, and the non-inverting input terminal of the third op amp 53, and the bias generator 55 is also electrically connected to the touch module 54.

[0026] like Figure 1As shown, the power amplifier integrated circuit further includes a switch module 56 , which is electrically connected to the touch control module 54 . The switch of the touch control module 54 can be controlled by the switch module 56 so that the touch control module 54 is turned on or off as a whole.

[0027] The first Bluetooth audio input terminal 1 can input low-frequency audio, and the second Bluetooth audio input terminal 2 can input medium-high-frequency audio.

[0028] The circuit of the present invention can achieve the effect of frequency division, specifically as follows: the first Bluetooth audio input terminal 1 can input low-frequency audio, and the part connected to the first Bluetooth audio input terminal 1 is amplified by the low impedance of the first resistor 4, the high capacitance of the first capacitor 3, and the power amplifier integrated circuit; the second Bluetooth audio input terminal 2 can input high-frequency audio, and the part connected to the second Bluetooth audio input terminal 2 is amplified by the high impedance of the second resistor 8, the low capacitance of the second capacitor 7, and the power amplifier circuit, thereby achieving the effect of frequency division amplification. The bass frequency band in this embodiment is preset to 20Hz~160Hz, the mid-frequency band is preset to 160Hz~2500Hz, and the treble frequency band is preset to 2500Hz~20000Hz. In other embodiments, the bass frequency band, the mid-frequency band, and the treble frequency band can be adjusted according to actual conditions.

[0029] In addition, Table 1 shows a table of the mono power amplifier after frequency division of the present invention. Table 2 shows a table of the mono power amplifier before frequency division of the present invention. In the table, Hz is the unit of sound frequency, L_Sen (dB) is the volume of the sound played by the right ear, and R_Sen (dB) is the volume of the sound played by the left ear.

[0030] From the comparison of Table 1 and Table 2, we can draw the following conclusions: After frequency division, the sound played is balanced and full, and no harsh screaming sound is produced.

[0031]

[0032] Table 1

[0033]

[0034] Table 2

[0035] The present invention is not limited to the above-mentioned optional implementation modes. Anyone can derive other various forms of products under the inspiration of the present invention. However, no matter what changes are made in the shape or structure, all technical solutions that fall within the scope defined by the claims of the present invention fall within the protection scope of the present invention.

Claims

1. An application of a power amplifier circuit in the electronic frequency division of a Bluetooth headset, characterized in that: The invention comprises a first Bluetooth audio input terminal (1) and a second Bluetooth audio input terminal (2), wherein the first Bluetooth audio input terminal (1) is electrically connected in sequence to a first capacitor (3), a first resistor (4) and a power amplifier integrated circuit, wherein the power amplifier integrated circuit is electrically connected to a moving coil module (6), and the second Bluetooth audio input terminal (2) is electrically connected in sequence to a second capacitor (7), a second resistor (8) and a power amplifier integrated circuit, wherein the power amplifier integrated circuit is electrically connected to a moving iron module (9), wherein the specification of the first capacitor (3) is greater than that of the second capacitor (7), and the impedance of the first resistor (4) is less than that of the second resistor (8).

2. The application of the power amplifier circuit according to claim 1 in the electronic frequency division of Bluetooth headsets is characterized by: The specification of the first capacitor (3) is 1.0 μF, the impedance of the first resistor (4) is 10 KΩ, the specification of the second capacitor (7) is 0.47 μF, and the impedance of the second resistor (8) is 20 KΩ.

3. The application of the power amplifier circuit according to claim 2 in the electronic frequency division of a Bluetooth headset is characterized in that: It also includes a third resistor (10) and a fourth resistor (11), wherein the impedance of the third resistor (10) and the fourth resistor (11) are both 50KΩ, one end of the third resistor (10) is electrically connected to one end of the first resistor (4), and the other end is electrically connected to one end of the moving coil module (6) to form a parallel connection with the power amplifier integrated circuit, and one end of the fourth resistor (11) is electrically connected to one end of the second resistor (8), and the other end is electrically connected to one end of the moving iron module (9) to form a parallel connection with the power amplifier integrated circuit.

4. The application of the power amplifier circuit according to claim 3 in the electronic frequency division of Bluetooth headsets is characterized in that: The power amplifier integrated circuit comprises three operational amplifiers, namely a first operational amplifier (51), a second operational amplifier (52), a third operational amplifier (53) and a touch control module (54); the reverse input end of the first operational amplifier (51) is electrically connected to one end of the first resistor (4); the in-phase input end of the first operational amplifier (51) is electrically connected to the in-phase input end of the second operational amplifier (52) and the in-phase input end of the third operational amplifier (53); the output end of the first operational amplifier (51) is electrically connected to one end of the dynamic coil module (6); The negative power terminal of the first operational amplifier (51) and the negative power terminal of the third operational amplifier (53) are electrically connected to the touch control module (54), the negative power terminal of the second operational amplifier (52) is also electrically connected to the touch control module (54), the output terminal of the third operational amplifier (53) is electrically connected to one end of the moving iron module (9), the output terminal of the second operational amplifier (52) is electrically connected to the other end of the moving iron module (9) and the other end of the moving coil module (6), and the reverse input terminal of the second operational amplifier (52) is also electrically connected to the output terminal of the second operational amplifier (52).

5. Application of the power amplifier circuit according to claim 4 in electronic frequency division of Bluetooth headsets, characterized in that: The power amplifier integrated circuit also includes a bias generator (55), the bias generator (55) being electrically connected to the in-phase input terminal of the first operational amplifier (51), the in-phase input terminal of the second operational amplifier (52), and the in-phase input terminal of the third operational amplifier (53), and the bias generator (55) is also electrically connected to the touch control module (54).

6. Application of the power amplifier circuit according to claim 5 in electronic frequency division of Bluetooth headsets, characterized in that: The power amplifier integrated circuit also includes a switch module (56), and the switch module (56) is electrically connected to the touch control module (54).

7. Application of the power amplifier circuit according to claim 6 in electronic frequency division of Bluetooth headsets, characterized in that: The first Bluetooth audio input terminal (1) can input low-frequency audio, and the second Bluetooth audio input terminal (2) can input medium-high-frequency audio.

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