Integrated X light source equipment with mixed heat dissipation function

Abstract

The invention, which relates to the high-voltage X-ray source field, discloses a hybrid heat dissipation integrated X-ray source device comprising an X-ray tube, an electronic control unit, a filament circuit, a high-voltage circuit and a heat dissipation module. The heat dissipation module comprises a heat-conducting medium and a heat pump heat-conducting material; the X-ray tube is driven by a filament circuit and a high-voltage circuit, the X-ray tube is grounded at a single end, and a high-voltage output loop GND is connected with complete machine equipment GND; the single end of the X-ray tube is grounded and is directly contacted with the heat-conducting medium of the heat dissipation module and the heat-conducting material of the heat pump; and the electronic control unit is connected with the X-ray tube and is used for receiving the X-ray feedback detection signal, carrying out comprehensive calculation and comparison and selecting a corresponding heat dissipation medium and a corresponding heat dissipation mode according to a calculation result of the electronic control unit. A'heat pump 'heat conduction material and a single-end grounded high-voltage output mode are adopted, and an internal electronic control unit is combined, so that closed-loop control and multiple protection functions are realized, and the heat dissipation performance and the safety of the equipment are effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of high-voltage X-ray sources, and in particular to an integrated X-ray source device with mixed heat dissipation, which is particularly suitable for the fields of heat dissipation, protection and electrical safety of high-power, compact integrated X-ray tubes. Background Art

[0002] Existing integrated X-ray source equipment usually adopts traditional heat dissipation methods, including natural air cooling or heat dissipation through oil pump plus transformer oil. Although these methods can effectively dissipate heat in low-power applications, the heat dissipation performance is often insufficient for high-power, high-performance small integrated X-ray source equipment. The heat dissipation capacity of natural air cooling is limited, and the heat dissipation method of oil pump plus transformer oil makes the equipment larger and heavier.

[0003] In addition, in traditional integrated X-ray source equipment, the high-voltage output terminals are high voltage, and an insulating medium is required, which is not conducive to the heat dissipation of the X-ray tube to a certain extent. Moreover, since the high-voltage output floating ground has a greater safety hazard, it may bring risks to the equipment's operating stability and safety of use.

[0004] Existing radiation source protection measures usually rely on the radiation output feedback signal for software control protection. However, this solution has a slow response. Once the feedback signal line is abnormal, the control circuit cannot respond effectively, which can easily cause instantaneous damage to the power supply or X-ray tube. As a result, traditional radiation sources have the risk of slow feedback response and failure of protection functions under abnormal conditions, seriously affecting the life and safety of the equipment.

[0005] Therefore, a new type of integrated X-ray source equipment is needed that can effectively improve heat dissipation performance, reduce equipment size, enhance electrical safety, and provide a faster and more reliable protection solution. Summary of the invention

[0006] In view of this, the purpose of the present invention is to overcome the shortcomings of the prior art and provide an integrated X-ray source device with hybrid heat dissipation. By improving the heat dissipation system and high-voltage output protection measures, the portability, safety and reliability of the device are improved. A new type of "heat pump" thermal conductive material and a single-end grounded high-voltage output method are adopted, and an internal electronic control unit is combined to achieve closed-loop control and multiple protection functions, thereby effectively improving the heat dissipation performance and safety of the equipment.

[0007] In order to achieve the above object, the present invention provides the following technical solutions:

[0008] The present invention provides an integrated X-ray source device with mixed heat dissipation, including an X-ray tube, an electronic control unit, a filament circuit, a high-voltage circuit and a heat dissipation module;

[0009] The heat dissipation module includes a heat conducting medium and a heat pump heat conducting material;

[0010] The X-ray tube is driven by a filament circuit and a high-voltage circuit. The X-ray tube is single-ended grounded and the high-voltage output circuit GND is connected to the GND of the whole device. The X-ray tube is single-ended grounded and directly contacts the heat-conducting medium of the heat dissipation module and the heat-conducting material of the heat pump.

[0011] The electronic control unit is connected to the X-ray tube and is used to receive the X-ray feedback detection signal and perform comprehensive calculation and comparison, and select the corresponding heat dissipation medium and heat dissipation method according to the calculation result of the electronic control unit.

[0012] As a further solution of the present invention, the output high voltage of the X-ray tube adopts anode grounding, and the anode is directly in contact with the heat-conducting medium. Anode grounding can optimize the heat dissipation of the X-ray tube, so that the anode is directly in contact with the heat-conducting medium, and the heat dissipation capacity of the X-ray tube is enhanced. At the same time, the high-voltage output forms a loop through GND, which reduces the interference to the front stage of the control and reduces the safety risk caused by the high-voltage floating ground.

[0013] As a further solution of the present invention, the filament circuit and the high voltage circuit are isolated from the ray output of the X-ray tube by transformers, thereby reducing the high voltage output and electromagnetic interference between circuits and improving electrical safety.

[0014] As a further solution of the present invention, the heat conducting medium in the heat dissipation module is a liquid or solid heat conducting medium, and the heat pump heat conducting material is combined with the liquid or solid heat conducting medium to perform mixed heat dissipation on the X-ray tube.

[0015] As a further solution of the present invention, when the electronic control unit selects the corresponding heat dissipation medium and heat dissipation method according to the calculation results of the electronic control unit, when the calculated value of the comprehensive calculation is lower than the set operating state, liquid or solid heat-conducting medium is used for heat dissipation; when the calculated value is higher than the set operating state, heat-conducting medium and heat pump heat-conducting material are used simultaneously for heat dissipation.

[0016] As a further solution of the present invention, the heat pump thermal conductive material includes a cold end in the high-energy zone, a heat pump material and a hot end in the low-energy zone. The heat pump material is a semiconductor heat dissipation material, and the cold end and the hot end are aluminum sheets. Based on the Peltier effect, when electrons flow through the semiconductor material, the electron energy potential changes, and they change from a high-energy state to a low-energy state to release heat and increase the temperature, and change from a low-energy state to a high-energy state to absorb heat and cool down. By adding a DC power supply to the semiconductor heat pump material, the heat in the high-energy zone can be quickly transferred to the low-energy zone to achieve efficient heat dissipation.

[0017] As a further solution of the present invention, the hot end of the low-energy zone in the heat pump thermal conductive material is also provided with an auxiliary convection heat dissipation device, which is a fan. In order to ensure the heat dissipation effect and the life of the semiconductor heat pump material, the low-energy zone uses a fan for air convection heat dissipation.

[0018] As a further solution of the present invention, the electronic control unit includes a filament pre-stage circuit control unit, a high-voltage pre-stage circuit control unit, a signal feedback detection unit and an interruption protection unit. The filament pre-stage circuit control unit is used to control the drive of the filament pre-stage circuit, the high-voltage pre-stage circuit control unit is used to control the drive of the high-voltage pre-stage circuit, the signal feedback detection unit is used to monitor the feedback signals from the X-ray tube, the filament pre-stage circuit and the high-voltage pre-stage circuit, and the interruption protection unit is used to respond to interruption requests and send protection signals based on the expected settings and parameter monitoring comprehensive evaluation.

[0019] As a further solution of the present invention, the high-voltage circuit includes a high-voltage pre-stage circuit, an isolation boost module and a voltage doubling module. The isolation boost module and the voltage doubling module are the high-voltage parts. The high-voltage part is isolated from the high-voltage pre-stage circuit by a transformer. The high-voltage pre-stage circuit is connected to the electronic control unit through a high-voltage pre-stage protection unit, and effective power protection is performed on the high-voltage circuit and the X-ray tube part to ensure the safety of the equipment.

[0020] As a further solution of the present invention, the filament circuit includes a filament pre-stage circuit and a filament isolation transformer module. The filament pre-stage circuit adopts a half-bridge inverter structure, and the filament circuit and the X-ray tube part are electrically isolated through the filament isolation transformer module. The filament pre-stage circuit is connected to the electronic control unit through a filament pre-stage protection unit, and effective power protection is performed on the filament circuit and the X-ray tube part to ensure the safety of the equipment.

[0021] As a further solution of the present invention, the integrated X-ray source equipment with hybrid heat dissipation also includes a signal sampling, filtering and monitoring module, which is connected to the X-ray tube and to the high-voltage circuit, filament circuit and signal feedback detection unit of the electronic control unit, and is used to collect operating status of the high-voltage part, such as ray voltage, ray current, ray tube temperature, etc.

[0022] As a further solution of the present invention, the high-voltage pre-stage protection unit and the filament pre-stage protection unit can set constant current output and main power lock protection according to actual needs, and cooperate with the electronic control unit to effectively ensure the main power operation stability of the high-voltage circuit, the filament circuit and the X-ray tube part and the equipment safety; the high-voltage pre-stage protection unit and the filament pre-stage protection unit have the same structure, and the high-voltage pre-stage protection unit includes a power current acquisition unit, a current setting unit, a power comparison unit, a fault latch unit, a signal switching and amplification unit, a power control chip and a power circuit voltage monitoring unit; the power current acquisition unit is connected to the first power comparison unit and the second power comparison unit of the power comparison unit respectively, and the first power comparison unit The first current setting unit of the current setting unit is connected to compare and generate a fault trigger result. If the power control chip is in a fault trigger state, the main power circuit collected by the power current collection unit will enter the constant current mode to limit power operation; the second power comparison unit is connected to the second current setting unit of the current setting unit, and is used to compare and generate a fault trigger result. The comparison result is passed through the fault latch unit and the fault is self-latched. The latched fault state can be transmitted to the electronic control unit to trigger protection, and the circuit is locked after a number of delays; the latched fault state is simultaneously passed through the signal transfer amplification unit, and the main power drive circuit is quickly locked and controlled according to the fault state. This process can realize the setting of the power current by the first current setting unit, the power of the main power circuit is locked, and the equipment is protected.

[0023] As a further solution of the present invention, the first power comparison unit is also connected to a PI correction unit, the first power comparison unit is connected to a fault latch unit, the fault latch unit is connected to a power control driver chip via a signal switching and amplifying unit, the second power comparison unit is connected to a power control driver chip via a power control chip, the fault latch unit is connected to an interrupt protection unit of an electronic control unit, the power circuit voltage monitoring unit is connected to a signal feedback detection unit of the electronic control unit, and is used for real-time feedback to the signal feedback detection unit inside the electronic control unit to realize power circuit voltage monitoring.

[0024] In the above technical solution, the present invention provides an integrated X-ray source device with mixed heat dissipation, which has the following beneficial effects:

[0025] 1. The present invention adopts a mixed heat dissipation method of "heat pump" thermal conductive materials and traditional liquid and solid thermal conductive media, and can flexibly select heat dissipation media and heat dissipation methods according to different operating conditions. For example, in a low-power operating state, only solid (or liquid) heat dissipation media can meet the heat dissipation needs; while in a high-power operating state, solid or liquid thermal conductive media and "heat pump" thermal conductive materials are used for heat dissipation at the same time, giving full play to their respective advantages to achieve efficient heat dissipation of the X-ray tube. This flexible heat dissipation solution enables the equipment to maintain good heat dissipation effects under various working conditions, effectively avoiding problems such as equipment overheating and performance degradation due to poor heat dissipation.

[0026] 2. The present invention uses semiconductor heat dissipation materials as "heat pump" thermal conductive materials, which have many significant advantages. Semiconductor heat dissipation materials are small in size and will not significantly increase the volume and weight of the equipment, which is conducive to the miniaturization design of integrated X-ray source equipment; they have low noise and will not produce obvious noise interference during the heat dissipation process, providing better comfort for the equipment's use environment; they have excellent heat dissipation performance, and based on the Peltier effect, they can quickly and efficiently transfer heat from high-energy areas to low-energy areas to achieve precise temperature control; they have low costs, and compared to some traditional high-efficiency heat dissipation solutions, semiconductor heat dissipation materials are more competitive in cost, which helps to reduce the overall manufacturing cost of the equipment. In addition, by adding a DC power supply to the semiconductor heat pump material, heat transfer can be carried out continuously and stably, further enhancing the reliability and stability of heat dissipation.

[0027] 3. Aiming at the problem of high temperature rise in the low-energy zone of semiconductor heat pump materials, the present invention adopts a fan for air convection heat dissipation. This heat dissipation method is simple and effective, and can dissipate the heat generated in the low-energy zone in time, avoiding heat accumulation that causes performance degradation or damage of semiconductor heat pump materials, thereby extending the service life of semiconductor heat pump materials and ensuring the long-term stable operation of the entire heat dissipation system.

[0028] 4. The present invention adopts the anode unipolar grounding method for high-voltage output, so that the anode is directly in contact with the heat-conducting medium, which not only enhances the heat dissipation capacity of the X-ray tube, but also effectively reduces the safety risks caused by high-voltage floating. It solves the problem that the high-voltage floating may cause accidental electric shock accidents or electromagnetic interference to peripheral equipment during the operation of the equipment. The high-voltage part is connected to the GND of the whole equipment through anode grounding, forming a stable grounding loop, making the equipment safer and more reliable under high-voltage operation, reducing the safety hazards caused by high-voltage problems, and providing better safety protection for operators and peripheral equipment.

[0029] 5. Reduced electromagnetic interference. By using transformers to isolate the filament pre-stage circuit and the high-voltage pre-stage circuit from the ray output, this isolation method can significantly reduce the electromagnetic interference between the high-voltage output and the pre-stage circuit. In traditional X-ray light source equipment, the electromagnetic interference between the high-voltage circuit and the control circuit may cause problems such as control signal distortion and equipment malfunction, affecting the normal operation of the equipment. The present invention effectively shields electromagnetic interference through transformer isolation, ensures the accurate transmission of control signals and the stable operation of the equipment, improves the electromagnetic compatibility of the equipment, enables it to work stably in a complex electromagnetic environment, and further enhances the safety and reliability of the equipment.

[0030] 6. The present invention has a closed-loop control and protection mechanism. Based on the closed-loop control of the internal electronic control unit, the present invention adds protection functions for the filament pre-stage circuit and the high-voltage pre-stage circuit. The electronic control unit can receive feedback monitoring signals from the X-ray tube, the filament pre-stage circuit, the high-voltage pre-stage circuit, etc. in real time, and comprehensively evaluate the operating status of the equipment according to the expected settings and parameter monitoring. When an abnormal situation is detected, such as the power current exceeds the set value, the power circuit voltage is abnormal, etc., the electronic control unit can respond to the interrupt request in time, send a protection signal, and take corresponding power-limited constant current output, main power circuit lock protection and other measures to avoid equipment damage due to abnormal wiring, power supply and X-ray tube abnormalities, etc., effectively improving the operating reliability and anti-interference ability of the equipment.

[0031] 7. The present invention realizes circuit topology optimization. For small integrated X-ray sources, the present invention optimizes the filament circuit topology and improves the traditional push-pull scheme into a half-bridge inverter topology. The improved circuit structure is more concise, and components such as electronic switching devices, drive circuits, and transformers are simplified, which not only reduces the complexity and failure rate of the circuit, but also improves the stability and reliability of the circuit. The half-bridge inverter topology is more suitable for the filament drive requirements of small integrated X-ray sources, and can achieve efficient filament heating and drive control in a limited space, providing a strong guarantee for the long-term stable operation of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0033] Figure 1 This is a schematic diagram of the heat dissipation principle of a heat pump material of an integrated X-ray source device with mixed heat dissipation according to the present invention.

[0034] Figure 2This is a control block diagram of an electronic control unit in an integrated X-ray source device with hybrid heat dissipation according to the present invention.

[0035] Figure 3 This is a block diagram of a front-stage protection circuit in an integrated X-ray source device with hybrid heat dissipation according to the present invention. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be preferably described in detail below in conjunction with the accompanying drawings.

[0037] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0038] like Figures 1 to 3 As shown, an embodiment of the present invention provides an integrated X-ray source device with hybrid heat dissipation, including an X-ray tube 40, an electronic control unit 10, a filament circuit 30, a high-voltage circuit 20 and a heat dissipation module 70. The heat dissipation module 70 includes a heat-conducting medium 71 and a heat pump heat-conducting material 72; the X-ray tube 40 is driven by the filament circuit 30 and the high-voltage circuit 20, the X-ray tube 40 is single-ended grounded and the high-voltage output circuit GND is connected to the GND of the whole device; the X-ray tube 40 is single-ended grounded and directly contacts the heat-conducting medium 71 and the heat pump heat-conducting material 72 of the heat dissipation module 70; the electronic control unit 10 is connected to the X-ray tube 40, and is used to receive the X-ray feedback detection signal and perform comprehensive calculation and comparison, and select the corresponding heat dissipation medium and heat dissipation method according to the calculation result of the electronic control unit 10.

[0039] In this embodiment, the output high voltage of the X-ray tube 40 is grounded by the anode, and the anode is directly in contact with the heat-conducting medium 71. The anode grounding can optimize the heat dissipation of the X-ray tube, so that the anode is directly in contact with the heat-conducting medium 71, and the heat dissipation capacity of the X-ray tube 40 is enhanced. At the same time, the high-voltage output forms a loop through GND, which reduces the interference to the front stage of the control and reduces the safety risk caused by the high-voltage floating ground.

[0040] The present invention adopts the anode unipolar grounding method for high-voltage output, so that the anode is directly in contact with the heat-conducting medium 71, which not only enhances the heat dissipation capacity of the X-ray tube 40, but also effectively reduces the safety risks caused by high-voltage floating. The problem that the high-voltage floating may cause accidental electric shock accidents or electromagnetic interference to peripheral equipment during operation of the equipment is solved. The high-voltage part is connected to the GND of the whole equipment through anode grounding, forming a stable grounding loop, making the equipment safer and more reliable under high-voltage operation, reducing the safety hazards caused by high-voltage problems, and providing better safety protection for operators and peripheral equipment.

[0041] The filament circuit 30 and the high voltage circuit 20 are respectively isolated by transformers relative to the ray output of the X-ray tube 40, so as to reduce the electromagnetic interference between the high voltage output and the circuits and improve the electrical safety. The heat conduction medium 71 in the heat dissipation module 70 is a liquid or solid heat conduction medium, and the heat pump heat conduction material 72 is combined with the liquid or solid heat conduction medium to perform mixed heat dissipation on the X-ray tube 40.

[0042] In this embodiment, when the electronic control unit 10 selects the corresponding heat dissipation medium and heat dissipation method according to the calculation result of the electronic control unit 10, when the calculated value of the comprehensive calculation is lower than the set operating state, liquid or solid heat conductive medium is used for heat dissipation; when the calculated value is higher than the set operating state, heat conductive medium 71 and heat pump heat conductive material 72 are used for heat dissipation at the same time.

[0043] The present invention adopts a mixed heat dissipation method of "heat pump" thermal conductive materials and traditional liquid and solid thermal conductive media, and can flexibly select heat dissipation media and heat dissipation methods according to different operating conditions. For example, in a low-power operating state, only solid (or liquid) heat dissipation media can meet the heat dissipation needs; while in a high-power operating state, solid or liquid thermal conductive media 71 and "heat pump" thermal conductive materials are used for heat dissipation at the same time, giving full play to their respective advantages to achieve efficient heat dissipation of the ray tube. This flexible heat dissipation solution enables the equipment to maintain good heat dissipation effects under various working conditions, effectively avoiding problems such as equipment overheating and performance degradation due to poor heat dissipation.

[0044] Among them, the heat pump thermal conductive material 72 includes a cold end 721 in the high-energy zone, a heat pump material and a hot end 722 in the low-energy zone. The heat pump material is a semiconductor heat dissipation material, and the cold end 721 and the hot end 722 are aluminum sheets. Based on the Peltier effect, when electrons flow through the semiconductor material, the electron energy potential changes, and they change from a high-energy state to a low-energy state to release heat and increase the temperature, and change from a low-energy state to a high-energy state to absorb heat and cool down. By adding a DC power supply to the semiconductor heat pump material, the heat in the high-energy zone can be quickly transferred to the low-energy zone to achieve efficient heat dissipation.

[0045] The present invention uses semiconductor heat dissipation materials as "heat pump" thermal conductive materials, which have many significant advantages. Semiconductor heat dissipation materials are small in size and will not significantly increase the volume and weight of the equipment, which is conducive to the miniaturization design of integrated X-ray source equipment; they have low noise and will not produce obvious noise interference during the heat dissipation process, providing better comfort for the use environment of the equipment; they have excellent heat dissipation performance, based on the Peltier effect, they can quickly and efficiently transfer heat from high-energy areas to low-energy areas to achieve precise temperature control; they have low costs, and compared with some traditional high-efficiency heat dissipation solutions, semiconductor heat dissipation materials are more competitive in cost, which helps to reduce the overall manufacturing cost of the equipment. In addition, by adding a DC power supply to the semiconductor heat pump material, heat transfer can be carried out continuously and stably, further enhancing the reliability and stability of heat dissipation.

[0046] In this embodiment, the hot end 722 of the low-energy zone in the heat pump thermal conductive material 72 is also provided with an auxiliary convection heat dissipation device 73, which is a fan. To ensure the heat dissipation effect and the life of the semiconductor heat pump material, the low-energy zone uses a fan for air convection heat dissipation.

[0047] In order to solve the problem of high temperature rise in the low-energy zone of semiconductor heat pump materials, the present invention adopts a fan for air convection heat dissipation. This heat dissipation method is simple and effective, and can dissipate the heat generated in the low-energy zone in time, avoiding heat accumulation that causes performance degradation or damage of semiconductor heat pump materials, thereby extending the service life of semiconductor heat pump materials and ensuring the long-term stable operation of the entire heat dissipation system.

[0048] In this embodiment, the electronic control unit 10 includes a high-voltage pre-stage circuit control unit 11, a filament pre-stage circuit control unit 12, a signal feedback detection unit 13 and an interruption protection unit 14. The high-voltage pre-stage circuit control unit 11 is used to control the drive of the high-voltage pre-stage circuit 21, the filament pre-stage circuit control unit 12 is used to control the drive of the filament pre-stage circuit 31, the high-voltage pre-stage circuit control unit 11 is used to control the drive of the high-voltage pre-stage circuit 21, the signal feedback detection unit 13 is used to monitor the feedback signals from the X-ray tube 40, the filament pre-stage circuit 31 and the high-voltage pre-stage circuit 21, and the interruption protection unit 14 is used to respond to interruption requests and send protection signals according to the expected settings and parameter monitoring comprehensive evaluation.

[0049] The high-voltage circuit 20 includes a high-voltage front-stage circuit 21, an isolation boost module 22 and a voltage doubling module 23. The isolation boost module 22 and the voltage doubling module 23 are high-voltage parts. The high-voltage part is isolated from the high-voltage front-stage circuit 21 by a transformer. The high-voltage front-stage circuit 21 is connected to the electronic control unit 10 through a high-voltage front-stage protection unit 62, and effective power protection is performed on the high-voltage circuit 20 and the X-ray tube 40 to ensure the safety of the equipment.

[0050] The filament circuit 30 includes a filament pre-stage circuit 31 and a filament isolation transformer module 32. The filament pre-stage circuit 31 adopts a half-bridge inverter structure. The filament circuit 30 and the X-ray tube 40 are electrically isolated through the filament isolation transformer module 32. The filament pre-stage circuit 31 is connected to the electronic control unit 10 through a filament pre-stage protection unit 61, and effective power protection is performed on the filament circuit 30 and the X-ray tube 40 to ensure equipment safety.

[0051] The present invention has a closed-loop control and protection mechanism. Based on the closed-loop control of the internal electronic control unit 10, the present invention adds the protection function of the filament pre-stage circuit 31 and the high-voltage pre-stage circuit 21. The electronic control unit 10 can receive feedback monitoring signals from the X-ray tube 40, the filament pre-stage circuit 31 and the high-voltage pre-stage circuit 21 in real time, and comprehensively evaluate the operating status of the equipment according to the expected settings and parameter monitoring. When an abnormal situation is detected, such as the power current exceeds the set value, the power circuit voltage is abnormal, etc., the electronic control unit 10 can respond to the interrupt request in time, send a protection signal, and take corresponding power-limited constant current output, main power circuit lock protection and other measures to avoid equipment damage caused by abnormal wiring, power supply and X-ray tube abnormalities, etc., and effectively improve the operating reliability and anti-interference ability of the equipment.

[0052] In this embodiment, the integrated X-ray source device with hybrid heat dissipation also includes a signal sampling, filtering and monitoring module 50, which is connected to the X-ray tube 40, and is connected to the high-voltage circuit 20, the filament circuit 30 and the signal feedback detection unit 13 of the electronic control unit 10, and is used to collect the operating status of the high-voltage part, such as the radiation voltage, radiation current, radiation tube temperature, etc.

[0053] The present invention reduces electromagnetic interference. By using transformer isolation between the filament pre-stage circuit 31 and the high-voltage pre-stage circuit 21 and the ray output, this isolation method can significantly reduce the electromagnetic interference between the high-voltage output and the pre-stage circuit. In traditional X-ray light source equipment, the electromagnetic interference between the high-voltage circuit 20 and the control circuit may cause problems such as control signal distortion and equipment malfunction, affecting the normal operation of the equipment. The present invention effectively shields electromagnetic interference through transformer isolation, ensures the accurate transmission of control signals and the stable operation of the equipment, improves the electromagnetic compatibility of the equipment, enables it to work stably in a complex electromagnetic environment, and further enhances the safety and reliability of the equipment.

[0054] The high-voltage front-stage protection unit 62 and the filament front-stage protection unit 61 can set constant current output and main power lock protection according to actual needs, and cooperate with the electronic control unit 10 to effectively ensure the main power operation stability and equipment safety of the high-voltage circuit 20, the filament circuit 30 and the X-ray tube 40; the high-voltage front-stage protection unit 62 and the filament front-stage protection unit 61 have the same structure, and the high-voltage front-stage protection unit 62 includes a power current acquisition unit 6211, a current setting unit, a power comparison unit, a fault latch unit 6242, a signal switching and amplification unit 6243, a power control chip 6251 and a power circuit voltage monitoring unit 6212; the power current acquisition unit 6211 is respectively connected to the first power comparison unit 6231 and the second power comparison unit 6232 of the power comparison unit, and the first power comparison Unit 6231 is connected to the first current setting unit 6221 of the current setting unit, and is used to compare and generate a fault trigger result. If the power control chip 6251 is in a fault trigger state, the main power circuit collected by the power current acquisition unit 6211 will enter the constant current mode to limit power operation; the second power comparison unit 6232 is connected to the second current setting unit 6222 of the current setting unit, and is used to compare and generate a fault trigger result. The comparison result is passed through the fault latch unit 6242 and the fault is self-latched. The latched fault state can be transmitted to the electronic control unit 10 to trigger protection, and the circuit is locked after a number of delays; the latched fault state is simultaneously passed through the signal transfer amplification unit, and the main power drive circuit is quickly locked and controlled according to the fault state. This process can realize the setting of the power current by the first current setting unit 6221, the power of the main power circuit is locked, and the equipment is protected.

[0055] In this embodiment, the first power comparison unit 6231 is also connected to a PI correction unit 6241, the first power comparison unit 6231 is connected to a fault latch unit 6242, the fault latch unit 6242 is connected to a power control driver chip 6252 via a signal switching and amplifying unit 6243, the second power comparison unit 6232 is connected to a power control driver chip 6252 via a power control chip 6251, the fault latch unit 6242 is connected to an interrupt protection unit 14 of an electronic control unit 10, the power circuit voltage monitoring unit 6212 is connected to a signal feedback detection unit 13 of the electronic control unit 10, and is used for real-time feedback to the signal feedback detection unit 13 inside the electronic control unit 10, so as to realize power circuit voltage monitoring.

[0056] The present invention realizes circuit topology optimization. For a small integrated X-ray source, the present invention optimizes the filament circuit 30 topology and improves the traditional push-pull scheme into a half-bridge inverter topology. The improved circuit structure is more concise, and components such as electronic switching devices, drive circuits, and transformers are simplified, which not only reduces the complexity and failure rate of the circuit, but also improves the stability and reliability of the circuit. The half-bridge inverter topology is more suitable for the filament drive requirements of a small integrated X-ray source, and can achieve efficient filament heating and drive control in a limited space, providing a strong guarantee for the long-term stable operation of the equipment.

[0057] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "the" and "the" used in the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0058] It should be understood that although the terms first, second, third, etc. may be used in the present invention to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated X-ray source device with mixed heat dissipation, characterized in that: It includes an X-ray tube, an electronic control unit, a filament circuit, a high-voltage circuit and a heat dissipation module; The heat dissipation module includes a heat conducting medium and a heat pump heat conducting material; The X-ray tube is driven by a filament circuit and a high-voltage circuit. The X-ray tube is single-ended grounded and the high-voltage output circuit GND is connected to the GND of the whole device. The X-ray tube is single-ended grounded and directly contacts the heat-conducting medium of the heat dissipation module and the heat-conducting material of the heat pump. The electronic control unit is connected to the X-ray tube and is used to receive the X-ray feedback detection signal and perform comprehensive calculation and comparison, and select the corresponding heat dissipation medium and heat dissipation method according to the calculation result of the electronic control unit.

2. The integrated X-ray source device with hybrid heat dissipation according to claim 1, characterized in that: The output high voltage of the X-ray tube adopts anode grounding, the anode is directly in contact with the heat-conducting medium, and the high voltage output forms a loop through GND.

3. The integrated X-ray source device with hybrid heat dissipation according to claim 2, characterized in that: The filament circuit and the high voltage circuit are isolated from the ray output of the X-ray tube by transformers.

4. The integrated X-ray source device with hybrid heat dissipation according to claim 1, characterized in that: The heat conducting medium in the heat dissipation module is a liquid or solid heat conducting medium, and the heat pump heat conducting material is combined with the liquid or solid heat conducting medium to perform mixed heat dissipation on the X-ray tube.

5. The integrated X-ray source device with hybrid heat dissipation according to claim 4, characterized in that: When the electronic control unit selects the corresponding heat dissipation medium and heat dissipation method according to the calculation results of the electronic control unit, when the calculated value of the comprehensive calculation is lower than the set operating state, liquid or solid heat-conducting medium is used for heat dissipation; when the calculated value is higher than the set operating state, heat-conducting medium and heat pump heat-conducting material are used for heat dissipation at the same time.

6. The integrated X-ray source device with hybrid heat dissipation according to claim 5, characterized in that: The heat pump thermal conductive material comprises a cold end in a high energy zone, a heat pump material and a hot end in a low energy zone. The heat pump material is a semiconductor heat dissipation material, and the cold end and the hot end are aluminum sheets.

7. The integrated X-ray source device with hybrid heat dissipation according to claim 6, characterized in that: The hot end of the low-energy zone in the heat pump thermal conductive material is also provided with an auxiliary convection heat dissipation device, which is a fan.

8. The integrated X-ray source device with hybrid heat dissipation according to claim 5, characterized in that: The electronic control unit includes a filament pre-stage circuit control unit, a high-voltage pre-stage circuit control unit, a signal feedback detection unit and an interruption protection unit. The filament pre-stage circuit control unit is used to control the drive of the filament pre-stage circuit, the high-voltage pre-stage circuit control unit is used to control the drive of the high-voltage pre-stage circuit, the signal feedback detection unit is used to monitor the feedback signals from the X-ray tube, the filament pre-stage circuit and the high-voltage pre-stage circuit, and the interruption protection unit is used to respond to interruption requests and send protection signals according to the expected settings and parameter monitoring comprehensive evaluation.

9. The integrated X-ray source device with hybrid heat dissipation according to claim 8, characterized in that: The high-voltage circuit includes a high-voltage front-stage circuit, an isolation boost module and a voltage doubling module. The isolation boost module and the voltage doubling module are the high-voltage part. The high-voltage part is isolated from the high-voltage front-stage circuit by a transformer. The high-voltage front-stage circuit is connected to the electronic control unit through a high-voltage front-stage protection unit.

10. The integrated X-ray source device with hybrid heat dissipation according to claim 9, characterized in that: The filament circuit comprises a filament pre-stage circuit and a filament isolation transformer module. The filament pre-stage circuit adopts a half-bridge inverter structure. The filament pre-stage circuit is connected to an electronic control unit through a filament pre-stage protection unit.

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