Vapor chamber and electronic equipment

Abstract

The embodiment of the invention provides a vapor chamber and electronic equipment, and relates to the technical field of vapor chambers, the vapor chamber comprises a heat conduction assembly, one end of the heat conduction assembly along a first direction is used for contacting with a heat source; the first cover plate covers the end, away from the heat source, of the heat conduction assembly, an evaporation cavity and a heat dissipation cavity used for allowing steam to flow are formed between the first cover plate and the heat conduction assembly, the heat dissipation cavity surrounds the outer side of the evaporation cavity, and at least part of the orthographic projection of the evaporation cavity in the first direction coincides with the heat source; the heat dissipation cavity is divided into at least two sub-cavities which are sequentially arranged on the peripheral side of the evaporation cavity in a surrounding mode through the separation assembly, the sub-cavities communicate with the evaporation cavity, steam entering the evaporation cavity can be guided through the sub-cavities to be diffused in different directions, the distribution uniformity of the steam in the heat dissipation cavity is improved, and therefore the temperature uniformity of the vapor chamber is improved.

Description

Technical Field

[0001] The present application relates to the technical field of vapor chambers, and in particular to a vapor chamber and an electronic device. Background Art

[0002] The ultra-thin heat spreader is a light and efficient two-phase heat transfer element, including an evaporation end at the heat source and a condensation end far away from the heat source. The evaporation end at the heat source absorbs heat, causing the liquid working fluid to vaporize rapidly and taking away a large amount of heat at the same time; the vaporized working fluid will diffuse from the high-pressure evaporation end to the low-pressure condensation end, and the gaseous working fluid will release heat at the condensation end, causing the gaseous working fluid to condense and transform into liquid working fluid, which will flow back to the evaporation area under the action of the capillary wick to form a gas-liquid circulation, which can effectively solve the heat dissipation problem of electronic equipment.

[0003] In actual applications, the heat dissipation space for installing the heat spreader in electronic equipment is limited, and the heat source for the electronic equipment to dissipate heat is not necessarily located in the center of the heat dissipation space. This causes the evaporation end to deviate from the center of the heat spreader, causing the relative distance between the evaporation end and the condensation end to change. The steam tends to flow to the condensation end which is relatively short, causing uneven steam diffusion, thereby reducing the temperature equalization effect of the heat spreader. Summary of the invention

[0004] The embodiments of the present application provide a vapor chamber and an electronic device to achieve the effect of improving the uniformity of vapor diffusion in the vapor chamber.

[0005] In a first aspect, an embodiment of the present application provides a vapor chamber, comprising:

[0006] A heat-conducting component, wherein one end of the heat-conducting component along a first direction is used to contact a heat source;

[0007] a first cover plate, the first cover plate being arranged to cover an end of the heat-conducting component away from the heat source, an evaporation chamber and a heat dissipation chamber for steam flow being provided between the first cover plate and the heat-conducting component, the heat dissipation chamber being arranged around the outside of the evaporation chamber, and an orthographic projection of the evaporation chamber in the first direction at least partially overlapping with the heat source;

[0008] A partition component is provided, wherein the partition component divides the heat dissipation chamber into at least two sub-cavities which are sequentially arranged around the circumference of the evaporation chamber, and the sub-cavities are communicated with the evaporation chamber.

[0009] In a possible implementation, the partition assembly includes at least two partitions, and the partitions extend radially from the evaporation chamber toward an edge of the heat dissipation chamber, so that the sub-cavity is provided between adjacent partitions.

[0010] In a possible implementation, it further includes a flow intercepting member. The two ends of the flow intercepting member along the first direction are respectively connected to the first cover plate and the heat conducting component, and cooperate with the first cover plate and the heat conducting component to form the evaporation chamber;

[0011] At least one connection port is provided on the flow intercepting member between adjacent partition members, and the connection port communicates the evaporation chamber and the corresponding sub-chamber.

[0012] In a possible implementation, the total length of the connection ports communicating with the same sub-chamber on the outer peripheral side of the flow intercepting member is positively correlated with the area of the positive projection of the sub-chamber in the first direction.

[0013] In a possible implementation, the total length of all the connection ports communicating with the sub-chamber on the outer peripheral side of the flow intercepting member is:

[0014]

[0015] Wherein, is the total length of all the connection ports communicating with the nth sub-chamber on the outer peripheral side of the flow intercepting member; is the area of the positive projection of the ith sub-chamber in the first direction, is the total length of all the connection ports communicating with the ith sub-chamber on the outer peripheral side of the flow intercepting member, is the area of the positive projection of the nth sub-chamber in the first direction, n≥2, i≥1.

[0016] In a possible implementation, the size of the connection port gradually decreases from the evaporation chamber to the sub-chamber.

[0017] In a possible implementation, the shape of the flow intercepting member is adapted to the shape of the heat source, and the distance between the edge of the positive projection of the evaporation chamber in the first direction and the edge of the heat source is less than or equal to 0.5 mm.

[0018] In a possible implementation, a flow guiding member is arranged in the sub-chamber, and the flow guiding member extends radially from the edge of the evaporation chamber towards the edge of the heat dissipation chamber.

[0019] In a possible implementation, heat conducting columns are arranged in the sub-chamber, and the heat conducting columns are connected to the first cover plate.

[0020] In a possible implementation, the heat conducting component includes:

[0021] A second cover plate, which is connected to the first cover plate;

[0022] A capillary structure, which is connected to the second cover plate, and there is a heat dissipation cavity and an evaporation cavity between the capillary structure and the first cover plate.

[0023] In a possible implementation manner, the separation component is fixed on the first cover plate, and one side of the separation component facing away from the first cover plate is in contact with the capillary structure.

[0024] In a second aspect, an embodiment of the present application provides an electronic device, including a device body and the heat pipe described in any one of the first aspects, and the heat pipe is used to dissipate heat from the device body.

[0025] In the heat pipe and the electronic device provided by the embodiments of the present application, by providing a heat conduction component, a first cover plate and a separation component, the first cover plate is covered on one end of the heat conduction component away from the heat source, and a heat dissipation cavity and an evaporation cavity are formed between the first cover plate and the heat conduction component. At the same time, the heat dissipation cavity surrounds the evaporation cavity, and the evaporation cavity faces the heat source. When the heat dissipated by the heat source is conducted to the heat conduction component, the liquid working medium in the corresponding area can quickly evaporate into steam and enter the evaporation cavity. The separation component divides the heat dissipation cavity into at least two sub-cavities that are sequentially arranged around the circumference of the evaporation cavity. The gas in the evaporation cavity can enter the corresponding sub-cavity through the area connected to different sub-cavities, so that the steam diffuses in the sub-cavity and reaches different positions in the sub-cavity, and contacts the first cover plate for condensation. Therefore, when the heat source does not contact the central area of the heat conduction component, the steam in the evaporation cavity can still be restricted by the sub-cavity and move synchronously into different sub-cavities, contact different positions of the first cover plate for condensation, so as to effectively improve the uniformity of steam diffusion and reduce the influence of the heat source position on the temperature uniformity of the heat pipe. Description of the Drawings

[0026] The drawings here are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0027] Figure 1 It is a schematic structural diagram of the first cover plate in the heat pipe provided by the embodiment of the present application;

[0028] Figure 2 It is a schematic structural diagram of the heat pipe provided by the embodiment of the present application;

[0029] Figure 3 It is a schematic diagram of the first setting manner of the separation component in the heat pipe provided by the embodiment of the present application;

[0030] Figure 4 It is a schematic diagram of the second setting manner of the separation component in the heat pipe provided by the embodiment of the present application;

[0031] Figure 5Schematic diagram of the third setting method of the partition component in the heat pipe provided by the embodiment of the present application;

[0032] Figure 6 Schematic diagram of the fourth setting method of the partition component in the heat pipe provided by the embodiment of the present application;

[0033] Figure 7 Schematic diagram of the first implementation manner of the flow interceptor in the heat pipe provided by the embodiment of the present application;

[0034] Figure 8 Schematic diagram of the second implementation manner of the flow interceptor in the heat pipe provided by the embodiment of the present application;

[0035] Figure 9 Schematic diagram of the third implementation manner of the flow interceptor in the heat pipe provided by the embodiment of the present application;

[0036] Figure 10 Schematic diagram of the implementation manner of the heat conduction component in the heat pipe provided by the embodiment of the present application;

[0037] Figure 11 Schematic diagram of another implementation manner of the first cover plate in the heat pipe provided by the embodiment of the present application.

[0038] Reference numerals:

[0039] 110 - heat conduction component, 111 - second cover plate, 112 - capillary structure, 120 - first cover plate, 130 - partition component, 140 - evaporation chamber, 150 - sub - cavity, 160 - flow interceptor, 161 - connection port, 170 - flow guide component.

[0040] Through the above - mentioned drawings, specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0041] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numerals in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0042] As described in the background art, the heat dissipation space available for installing a vapor chamber in a general electronic device is limited, which results in a restricted relative position between the vapor chamber and the heat source that dissipates heat from the electronic device. The position where the vapor chamber contacts the heat source of some electronic devices is not the central area of the vapor chamber, which poses a severe challenge to the normal performance of the heat dissipation performance of the vapor chamber.

[0043] The position of the evaporation end changes with the change of the heat source position. When the heat source no longer contacts the central area of the vapor chamber, the evaporation end is no longer in the central area of the vapor chamber, resulting in a change in the relative distance between the evaporation end and the condensation end (i.e., the low-temperature area). Here, the condensation end can be the side of the vapor chamber facing away from the heat source.

[0044] When the relative distance between the evaporation end and the condensation end is short, the steam flow resistance is small, and the steam tends to diffuse towards the condensation end with a shorter relative distance. When the relative distance between the evaporation end and the condensation end is long, the steam flow resistance is large, and the steam is not easily diffused towards this end. Therefore, when the evaporation end is not in the central area of the vapor chamber, most of the steam diffuses towards the condensation end with a shorter relative distance from the evaporation end, resulting in more steam in some areas and very little steam in some areas, leading to uneven steam diffusion, deterioration of the temperature uniformity of the vapor chamber, and difficulty for the vapor chamber to effectively exert its heat dissipation capacity.

[0045] In response to this, the present application provides a vapor chamber, with at least two sub-chambers wound around the periphery of the evaporation chamber corresponding to the heat source. The sub-chambers limit the diffusion of steam, reduce the amount of steam diffusing towards the condensation end with a shorter relative distance, and increase the amount of steam diffusing towards the condensation end with a longer relative distance. Thus, centered on the evaporation chamber, the evaporation chamber is evenly dispersed into different sub-chambers, and diffuses to different positions in the sub-chambers for condensation, enhancing the heat transfer efficiency and improving the temperature uniformity of the vapor chamber.

[0046] The technical solution of the present application and how the technical solution of the present application solves the above technical problems will be described in detail below with specific embodiments. These several specific embodiments below can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the drawings.

[0047] The embodiments of the present application provide a vapor chamber. Please refer to Figure 1 and Figure 2 as shown, including a heat conduction component 110, a first cover plate 120, and a partition component 130.

[0048] The heat conduction component 110 is along the first direction ( Figure 2The first end of the heat conducting component 110 along the X direction in the first direction is used to contact the heat source to conduct heat with the heat source to reduce the temperature of the heat source. The second end of the heat conducting component 110 along the first direction is used to connect with the first cover plate 120, and a heat dissipation cavity and an evaporation cavity 140 are provided between the first cover plate 120 and an end of the heat conducting component 110 away from the heat source, and the heat dissipation cavity is surrounded by the outside of the evaporation cavity 140.

[0049] The orthographic projection of the evaporation chamber 140 in the first direction at least partially overlaps with the heat source, for example, the orthographic projection of the evaporation chamber 140 in the first direction completely overlaps with the heat source, or at least partially extends outside the heat source, or only partially overlaps with the heat source. Of course, it is preferable that the orthographic projection of the heat source in the first direction is completely in the evaporation chamber 140. At this time, when the heat spreader contacts the heat source, the area corresponding to the heat source is completely covered by the evaporation chamber 140. When the working medium is converted into steam through heat exchange in the area where the heat source is located, the steam will first enter the evaporation chamber 140. The partition assembly 130 is located in the heat dissipation chamber and divides the heat dissipation chamber into at least two sub-cavities 150. All sub-cavities 150 are sequentially arranged around the periphery of the evaporation chamber 140 and are each connected to the evaporation chamber 140, so that the evaporation chamber 140 diffuses into each sub-cavity 150 for condensation.

[0050] It should be noted that the heat conducting component 110 and the first cover plate 120 are both made of materials with good thermal conductivity, so that the working fluid inside the heat conducting component 110 can effectively exchange heat with the heat source, and at the same time transfer the heat of the working fluid to the external environment through the first cover plate 120, so that the working fluid is condensed into liquid and circulated.

[0051] Specifically, when the working fluid is liquid, it can flow in the heat conductive component 110, and perform heat exchange in the contact area with the heat source, evaporate into steam, and then the steam enters the evaporation chamber 140, and respectively enters the sub-cavities 150 that are sequentially arranged around the evaporation chamber 140, so that the steam is restricted by the sub-cavities 150 in different areas of the heat dissipation chamber, and moves toward the sub-cavity 150 away from the evaporation chamber 140 to gradually condense into liquid, and then the liquid moves back to the corresponding area of ​​the heat source in the heat conductive component 110 for heat exchange and circulation to reduce the temperature of the heat source. In this process, even if the evaporation chamber 140 and the heat source are not in the central area of ​​the heat conductive component 110, the movement range of the steam can be limited by the sub-areas, thereby improving the uniformity of the steam distribution in the heat dissipation chamber, thereby improving the temperature uniformity of the heat spreader.

[0052] In some embodiments, see Figure 1 As shown, the partition assembly 130 includes at least two partitions, and the partitions extend radially from the evaporation chamber 140 toward the edge of the heat dissipation chamber, so that a sub-cavity 150 is provided between adjacent partitions.

[0053] Among them, the shape of the evaporation chamber 140 can be set according to the shape of the heat source, and the arrangement of the partition can be adjusted according to the shape of the evaporation chamber 140, that is, the number and position of the partitions can be adaptively adjusted according to the shape of the evaporation chamber 140 and the position of the evaporation chamber 140 relative to the heat conduction component 110, so as to improve the uniformity of steam diffusion.

[0054] Exemplarily, as Figure 6 and Figure 2 shown, the heat source is circular and the evaporation chamber 140 is cylindrical. At this time, the first end of the partition in the first direction is connected to the first cover plate 120, the second end in the first direction is in contact with the heat conduction component 110, and the extension line of the partition passes through the center of the evaporation chamber 140. The number of partitions can be 2, 3, 4 or more. They can be evenly arranged around the circumference of the evaporation chamber 140, or arranged around the outside of the evaporation chamber 140 at different intervals.

[0055] When the shape of the heat source is polygonal, the number of partitions can be any value, but generally the number of formed sub-chambers 150 is greater than or equal to the number of sides of the heat source, so as to improve the uniformity of steam diffusion.

[0056] Exemplarily, as Figure 3 and Figure 4 shown, the heat source is rectangular and the evaporation chamber 140 is a rectangular columnar structure. At this time, the extension line of the partition passes through the center of the evaporation chamber 140. For example, the extension line of the partition extends along the diagonal of the evaporation chamber 140, or the extension line of the partition passes through the middle position of the side of the evaporation chamber 140, or the partition includes both of the above at the same time.

[0057] Exemplarily, as Figure 5 shown, the heat source is pentagonal and the evaporation chamber 140 is a pentagonal columnar structure. At this time, the extension line of the partition extends from the intersection of two adjacent sides of the evaporation chamber 140 to the center of the evaporation chamber 140.

[0058] It should be noted that the above examples are only for illustration, not for limitation. No matter what the shapes of the heat source and the evaporation chamber 140 are, as long as the partition can divide the heat dissipation chamber surrounding the outside of the evaporation chamber 140 into multiple sub-chambers 150.

[0059] Of course, the partition can be a sheet structure, a columnar structure, or other structures, as long as one end of the partition is connected to the first cover plate 120, the other end is connected to the heat conduction component 110, the heat dissipation chamber is divided into different sub-chambers 150, and the adjacent sub-chambers 150 cannot communicate at the partition.

[0060] In some embodiments, when one end of the partition is connected to or adjacent to the edge of the evaporation chamber 140 and the other end extends towards the edge of the heat dissipation chamber, the volume of the sub-chamber 150 generally gradually increases in the direction away from the evaporation chamber 140. At this time, it is convenient for the steam to diffuse to the end of the sub-chamber 150 far from the evaporation chamber 140, assisting in the uniform diffusion of the steam.

[0061] Taking the heat dissipation chamber as a rectangle as an example, in this extension manner of the partition, the heat dissipation chamber can be divided into multiple sub-chambers 150 wound around the circumference of the evaporation chamber 140, and one end of each sub-chamber 150 away from the evaporation chamber 140 extends to the edge of the heat dissipation chamber.

[0062] It should be noted that the partition may not extend radially around the evaporation chamber 140, but can be designed into a more complex shape, as long as one end of the sub-chamber 150 adjacent to the evaporation chamber 140 can be arranged in sequence along the circumference of the evaporation chamber 140.

[0063] In some embodiments, please refer to Figure 1 、 Figure 2 、 Figure 7 、 Figure 8 and Figure 9 As shown in, the heat pipe also includes a current-limiting member 160. The two ends of the current-limiting member 160 in the first direction are respectively connected to the first cover plate 120 and the heat conduction component 110, and cooperate with the first cover plate 120 and the heat conduction component 110 to form the evaporation chamber 140.

[0064] One end of the partition is connected to the current-limiting member 160 to divide the heat dissipation chamber into at least two independent sub-chambers 150. Among them, at least one connection port 161 is provided between adjacent partitions of the current-limiting member 160. The connection port 161 communicates the evaporation chamber 140 and the corresponding sub-chamber 150, so that the steam in the evaporation chamber 140 can enter the corresponding sub-chamber 150 through the connection port 161. And the sub-chambers 150 are independently arranged, which can prevent the steam entering the sub-chamber 150 from diffusing towards other sub-chambers 150. Of course, the connection port 161 corresponding to the same sub-chamber 150 can be one or more, and can be specifically adjusted according to the actual situation. Among them, the connection port 161 can penetrate the current-limiting member 160 in the first direction, or can only occupy a part of the current-limiting member 160 in the first direction, but it is advisable that the height of each connection port 161 in the first direction is the same.

[0065] Specifically, it is advisable that the distance between the edge of the orthographic projection of the evaporation chamber 140 in the first direction (i.e., the position where the inner surface of the current-limiting member 160 is orthographically projected in the first direction) and the edge of the heat source (i.e., the position where the outer surface of the heat source is orthographically projected in the first direction) is less than or equal to 0.5 mm, which is convenient for the steam to diffuse into the sub-chamber 150 and does not affect the conversion of the liquid working medium into gas and entering the evaporation chamber 140.

[0066] Exemplarily, the orthographic projection of the intercepting member 160 in the first direction surrounds the periphery of the heat source, and the linear distance between the position of the orthographic projection of the inner surface of the intercepting member 160 in the first direction and the position of the orthographic projection of the outer surface of the heat source in the first direction is 0.05 mm (i.e., the distance in the direction perpendicular to the outer surface of the heat source), or the two just coincide.

[0067] It should be noted that the intercepting member 160 can be a ring-shaped integral body, or a ring-shaped structure formed by splicing a plurality of separately arranged partition sheets or partition columns, etc. This embodiment does not limit it here.

[0068] Furthermore, in order to further improve the uniformity of the steam distribution in the heat dissipation cavity, when the heights of the connection ports 161 in the first direction are the same, the total length of the connection ports 161 communicated with the same sub-cavity 150 on the outer peripheral side of the intercepting member 160 is positively correlated with the area of the orthographic projection of the sub-cavity 150 in the first direction, that is, the larger the area of the corresponding first cover plate 120 of the sub-cavity 150, the larger the total size of its corresponding connection ports 161, so that the steam entering the sub-cavity 150 increases accordingly, thereby improving the uniformity of the steam distribution.

[0069] Specifically, after determining the total length of all the connection ports 161 corresponding to the i-th sub-cavity 150 on the outer peripheral side of the intercepting member 160 the total length of the connection ports 161 corresponding to the remaining sub-cavities 150 on the outer peripheral side of the intercepting member 160 can be determined according to the following equation:

[0070]

[0071] wherein, is the total length of all the connection ports 161 communicated with the n-th sub-cavity 150 on the outer peripheral side of the intercepting member 160; is the area of the orthographic projection of the i-th sub-cavity 150 in the first direction, is the total length of all the connection ports 161 communicated with the i-th sub-cavity 150 on the outer peripheral side of the intercepting member 160, is the area of the orthographic projection of the n-th sub-cavity 150 in the first direction.

[0072] Specifically, assuming that the total area of the orthographic projection of the heat dissipation cavity in the first direction is S, and n partition members divide the heat dissipation cavity into n sub-cavities 150. At this time, the sum of the areas of the orthographic projections of all the sub-cavities 150 in the first direction is equal to S, and the areas of the orthographic projections of the sub-cavities 150 in the first direction are successively , , ……, , ……, (n ≥ 2, i ≥ 1); the total length on the outer peripheral side of the intercepting member 160 of all the connection ports 161 connected to the same sub-chamber 150 is , , ……, , ……, .

[0073] After determining the setting method of the partition member, the S corresponding to each sub-chamber 150 can be determined. Taking the i-th sub-chamber 150 as a reference, determine the and Then, the d values corresponding to other sub-chambers 150 can be determined according to the above equations, that is , , , ……, .

[0074] The length of the intercepting member 160 corresponding to each sub-chamber 150 is , , ……, , ……, ; the total length of the intercepting member 160 on the circumferential side corresponding to each sub-chamber 150 except for the connection ports 161 is , , ……, , ……, , where the intercepting member 160 is correspondingly provided with m connection ports 161 for each sub-chamber 150, m ≥ 1, and the length of the connection port 161 on the circumferential side of the intercepting member 160 is , , ……, (the lengths of adjacent connection ports 161 can be equal or unequal), where is the minimum length of the m-th connection port 161 on the circumferential side of the intercepting member 160, , and , then the number of connection ports 161 and the length of a single connection port 161 can be determined according to the actual situation, as long as the total length requirement of all connection ports 161 is satisfied.

[0075] Among them, in order to prevent the vapor chamber from deforming or collapsing at the intercepting member 160 and being unable to effectively isolate the evaporation chamber 140, can be kept at a certain length, and the specific value can be determined according to the actual situation.

[0076] Exemplarily, such as Figure 1 and Figure 7As shown, the heat source is rectangular, and the current intercepting member 160 is also a rectangular ring structure. There are 4 partition members, which are connected to the current intercepting member 160 at the intersection of adjacent sides of the current intercepting member 160. At the same time, the partition members extend away from the evaporation chamber 140 along the diagonal direction of the current intercepting member 160, dividing the heat dissipation chamber into 4 sub-chambers 150. The areas corresponding to the 4 sub-chambers 150 are respectively , , , .

[0077] Assume is the largest. Taking as the reference, the length of the current intercepting member 160 corresponding to the sub-chamber 150 corresponding to is b, the total length of the solid part of the current intercepting member 160 except the connection port 161 is c, the solid part of the current intercepting member 160 can be divided into h sub-parts, and the length of each sub-part is , , ……, , where the lengths of the sub-parts in the area corresponding to the same sub-chamber 150 can all be equal, partially equal, or all unequal. There are m connection ports, m≥1, h = m + 1 (at this time, for the connection port 161 corresponding to this sub-chamber 150, there are sub-parts of the current intercepting member 160 in the area corresponding to this sub-chamber 150 on both sides) or h = m (at this time, for the connection port 161 corresponding to this sub-chamber 150, one end of the connection port 161 uses the partition member that divides this sub-chamber 150 as one side wall, or one end of the connection port 161 uses a sub-part of the current intercepting member 160 of another sub-chamber 150 adjacent to this sub-chamber 150 as one side wall); the total length of the connection ports 161 is d, d = b - c, and the length of a single connection port 161 is less than or equal to b - c;

[0078] The total length of the connection ports 161 corresponding to , The total length of the connection ports 161 corresponding to , The total length of the connection ports 161 corresponding to .

[0079] In some embodiments, the connection port 161 can be of any shape, such as triangular, rectangular, circular, diamond-shaped, or elliptical, etc. This embodiment does not limit it here.

[0080] Furthermore, the size of the connection port 161 gradually decreases from the evaporation chamber 140 to the sub-chamber 150.

[0081] Exemplarily, in the second direction perpendicular to the first direction, the cross-section of the connection port 161 can be trumpet-shaped, with a smaller width at the end facing the evaporation chamber 140 and a larger width at the end facing the heat dissipation chamber. At this time, the flow intercepting member 160 can include a plurality of connection segments, and the connection port 161 is formed between adjacent connection segments. Each connection segment can be a structure similar to a trapezoid.

[0082] Of course, the connection port 161 can also be of other shapes. This way can increase the air pressure of the steam entering the heat dissipation chamber from the evaporation chamber 140 through the connection port 161, and assist the steam to quickly diffuse in the sub-chamber 150.

[0083] In some embodiments, an auxiliary structure can also be added in the sub-chamber 150 to guide the steam flow to improve the heat dissipation effect. The structures include but are not limited to the following two methods:

[0084] Exemplarily, as Figure 1 and Figure 11 shown, a flow guiding member 170 is arranged in the sub-chamber 150. The flow guiding member 170 extends radially from the edge of the evaporation chamber 140 towards the heat dissipation chamber to further divide the sub-chamber 150 into a plurality of chambers, and guide the steam to flow in the corresponding chambers for condensation.

[0085] Among them, a plurality of flow guiding members 170 can be arranged. The included angle between adjacent flow guiding members 170 can be the same or different, and can be specifically selected according to the actual situation. And the lengths of adjacent flow guiding members 170 can also be determined according to the actual situation. However, when arranging the flow guiding member 170, generally there is a certain gap between the flow guiding member 170 and the flow intercepting member 160 to avoid affecting the steam from entering the sub-chamber 150.

[0086] Exemplarily, heat conducting columns are arranged in the sub-chamber 150. The heat conducting columns can be made of metal or other materials with good heat conducting ability, and the heat conducting columns are connected to the first cover plate 120 to exchange heat with the first cover plate 120. Of course, a plurality of heat conducting columns can also be arranged in the sub-chamber 150, and this embodiment does not limit it here.

[0087] In some embodiments, please refer to Figure 1 and Figure 10 shown, the heat conducting assembly 110 includes a second cover plate 111 and a capillary structure 112. The second cover plate 111 is connected to the first cover plate 120, the capillary structure 112 is connected to the second cover plate 111, and there are a heat dissipation chamber and an evaporation chamber 140 between the capillary structure 112 and the first cover plate 120.

[0088] Among them, the capillary structure 112 can be a metal mesh, metal felt, groove channel, and metal porous material (such as copper mesh, stainless steel mesh, copper felt, or copper powder) laid on the side of the first cover plate 120 away from the heat source. The first cover plate 120 and the second cover plate 111 can be made of pure metal materials or alloy materials, such as stainless steel, aluminum alloy, copper alloy, etc. The thickness of the first cover plate 120 and the second cover plate 111 in the first direction is usually greater than or equal to 0.05 mm to have a certain strength.

[0089] The partition and the throttling member 160 are both in contact with the capillary structure 112 and are also connected to the first cover plate 120 to separate the sub-chamber 150 and the evaporation chamber 140.

[0090] During use, the liquid working medium is located in the capillary structure 112 and flows along the capillary structure 112 to exchange heat with the heat source. After the heat exchange, the liquid working medium evaporates into steam. The steam entering the evaporation chamber 140 enters the sub-chamber 150 along the connection port 161, diffuses and condenses into a liquid in the sub-chamber 150. The liquid drops on the capillary structure 112 and moves along the capillary structure 112 to the area where the heat source is located for circulation, reducing the temperature of the heat source.

[0091] It should be noted that as Figure 10 and Figure 11 shown, the partition and the throttling member 160 can be welded to the first cover plate 120 or integrally formed with the first cover plate 120. This embodiment does not limit it here. In order to avoid affecting the movement of the liquid working medium in the capillary structure 112, the partition and the throttling member 160 are only connected to the side of the capillary structure 112 away from the second cover plate 111 and do not cut off the capillary structure 112.

[0092] The embodiment of the present application also provides an electronic device, which includes a device body and the heat pipe in the above embodiment. The heat pipe is used to dissipate heat for the device body.

[0093] Specifically, the area of the second cover plate 111 of the heat pipe corresponding to the evaporation chamber 140 is in contact with the heat source of the device body, and heat is dissipated for the heat source through the phase change of the working medium in the heat pipe. The structure of the heat pipe and the change mode of the working medium have been described in the above embodiment, and will not be elaborated here in this embodiment.

[0094] Finally, it should be noted that: After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily think of other embodiments of the present invention. The present invention is intended to cover any variations, uses, or adaptations of the present invention, which follow the general principles of the present invention and include the common general knowledge or conventional technical means in the technical field not disclosed in the present invention. It is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is only limited by the appended claims.

Claims

1. A heat sink, characterized in that: include: A heat-conducting component (110), wherein one end of the heat-conducting component (110) along a first direction is used to contact a heat source; a first cover plate (120), the first cover plate (120) being arranged to cover an end of the heat-conducting component (110) away from the heat source, an evaporation chamber (140) and a heat dissipation chamber for steam flow being provided between the first cover plate (120) and the heat-conducting component (110), the heat dissipation chamber being arranged outside the evaporation chamber (140), and an orthographic projection of the evaporation chamber (140) in the first direction at least partially overlapping with the heat source; A partition component (130), wherein the partition component (130) divides the heat dissipation chamber into at least two sub-cavities (150) which are sequentially arranged around the circumference of the evaporation chamber (140), and the sub-cavities (150) are connected to the evaporation chamber (140).

2. The vapor chamber according to claim 1, characterized in that: The partition assembly (130) comprises at least two partitions, and the partitions extend radially from the evaporation chamber (140) toward the edge of the heat dissipation chamber, so that the sub-cavity (150) is provided between adjacent partitions.

3. The heat sink according to claim 2, characterized in that: It also comprises a shutoff member (160), wherein two ends of the shutoff member (160) along the first direction are respectively connected to the first cover plate (120) and the heat conducting component (110), and cooperate with the first cover plate (120) and the heat conducting component (110) to form the evaporation chamber (140); The shut-off member (160) is provided with at least one connecting port (161) between adjacent partitions, and the connecting port (161) is in communication with the evaporation chamber (140) and the corresponding sub-chamber (150).

4. The heat sink according to claim 3, characterized in that: The total length of the connection port (161) communicating with the same sub-cavity (150) on the outer peripheral side of the shut-off member (160) is positively correlated with the area of ​​the orthographic projection of the sub-cavity (150) in the first direction.

5. The vapor chamber according to claim 4, characterized in that: The total length of all the connection ports (161) communicating with the sub-cavity (150) on the outer peripheral side of the shut-off member (160) is: in, is the total length of all the connection ports (161) communicating with the nth sub-cavity (150) on the outer peripheral side of the shut-off member (160); is the area of ​​the orthographic projection of the i-th sub-cavity (150) in the first direction, is the total length of all the connection ports (161) communicating with the i-th sub-cavity (150) on the outer peripheral side of the shut-off member (160), is the area of ​​the orthographic projection of the nth sub-cavity (150) in the first direction, n≥2, i≥1.

6. The vapor chamber according to claim 3, characterized in that: The size of the connecting port (161) gradually decreases from the evaporation chamber (140) to the sub-chamber (150).

7. The vapor chamber according to claim 3, characterized in that: The shape of the shut-off member (160) is adapted to the shape of the heat source, and the distance between the edge of the orthographic projection of the evaporation chamber (140) in the first direction and the edge of the heat source is less than or equal to 0.5 mm.

8. The vapor chamber according to claim 1, characterized in that: A flow guide (170) is arranged in the sub-cavity (150), and the flow guide (170) extends radially from the evaporation cavity (140) towards the edge of the heat dissipation cavity.

9. The vapor chamber according to claim 1, characterized in that: A heat-conducting column is arranged in the sub-cavity (150), and the heat-conducting column is connected to the first cover plate (120).

10. The vapor chamber according to any one of claims 1 to 9, characterized in that: The heat conducting component (110) comprises: A second cover plate (111), the second cover plate (111) being connected to the first cover plate (120); A capillary structure (112), wherein the capillary structure (112) is connected to the second cover plate (111), and the heat dissipation chamber and the evaporation chamber (140) are provided between the capillary structure (112) and the first cover plate (120).

11. The vapor chamber according to claim 10, characterized in that: The partition component (130) is fixed on the first cover plate (120), and a side of the partition component (130) facing away from the first cover plate (120) is in contact with the capillary structure (112).

12. An electronic device, characterized in that: The invention comprises a device body and a heat spreader as described in any one of claims 1 to 11, wherein the heat spreader is used to dissipate heat for the device body.

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