Baking equipment for PCB production

Abstract

The invention discloses baking equipment for PCB production, and the equipment comprises a baking device which comprises a baking box. The conveying device comprises a conveying belt and a plate clamping mechanism arranged on the conveying belt, the conveying belt penetrates through the baking box and is provided with a parallel section and a sinking section in the material conveying direction, the sinking section is arranged outside the baking box, the end, close to the parallel section, of the conveying belt is the upper plate end of the PCB, and the end, close to the sinking section, of the conveying belt is the lower plate end of the PCB; the plurality of clamping plate mechanisms are arranged at intervals in the direction from the parallel section to the sinking section, and the clamping plate mechanisms are used for clamping PCBs to be baked; the cleaning device is arranged below the sinking section, the cleaning device comprises a cleaning tank used for containing cleaning liquid, the clamping plate mechanism located on the sinking section can enter the cleaning tank, and the cleaning liquid in the cleaning tank can completely soak and clean the clamping plate mechanism entering the cleaning tank.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board production, and in particular to a baking device used for PCB board production. Background Art

[0002] The baking equipment for circuit ink production needs to use a chuck to vertically clamp the plate during the production process, and continuously bake the plate through chain conveying. That is, after the PCB board is coated with ink on the board surface, it is necessary to use a conveying device to clamp the PCB board and send it into the baking equipment for the baking process. Due to the pursuit of board utilization, the process edge width of the panel is small, and it is impossible to achieve normal margin retention during coating, resulting in the chuck often clamping into the ink coating area. When the ink is baked off the board, there is ink residue residue in the clamping teeth of the chuck, resulting in the risk of falling and adhering to the board surface during the cycle operation, thereby causing adverse effects such as product open circuit or residual copper, seriously affecting the reliability of the product. Therefore, in order to keep the chuck clean, the production line needs to stop production to clean the chuck and keep the chuck clean. However, once the production is restarted, the chuck will soon stick to the ink again to form ink residue garbage. Therefore, under the high requirements of product quality, it is impossible to achieve continuous and stable production of the production line. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a baking device for PCB board production, which can clean the chuck online by setting a cleaning mechanism, so that the PCB board can maintain continuous and stable production without regular shutdown to clean the chuck, effectively improving the production efficiency and ensuring the production quality of the product.

[0004] A baking device for PCB board production according to an embodiment of the present invention includes: Baking devices, including baking ovens; The conveying device includes a conveyor belt and a clamping plate mechanism arranged on the conveyor belt. The conveyor belt passes through the baking oven. The conveyor belt is provided with a parallel section and a sinking section along the conveying direction of the material. The sinking section is arranged outside the baking oven. One end close to the parallel section is an upper board end of the PCB board, and one end close to the sinking section is a lower board end of the PCB board. A plurality of clamping plate mechanisms are arranged at intervals along the direction from the parallel section to the sinking section. The clamping plate mechanisms are used to clamp the PCB board that has been coated and is to be baked. The cleaning device is arranged below the sinking section. The cleaning device comprises a cleaning tank for containing cleaning liquid. The clamping mechanism located at the sinking section can enter the cleaning tank. The cleaning liquid in the cleaning tank can completely immerse and clean the clamping mechanism entering the cleaning tank.

[0005] According to an embodiment of the present invention, a baking device for PCB board production has at least the following beneficial effects: in the PCB (printed circuit board) manufacturing process, baking the PCB board after coating is an important step. Therefore, the present application proposes a baking device with a cleaning device, which can perform online cleaning of the clamping mechanism used to clamp the PCB board, and can ensure the cleanliness of the clamping mechanism, and avoid the residual ink of the clamping mechanism affecting the subsequent board surface processing quality of the PCB board, thereby improving the coating quality and production efficiency of the PCB board.

[0006] Specifically, the conveying device is used for continuous conveying of PCB boards, wherein the clamping mechanism on the conveying device clamps the PCB that has completed coating and is waiting for baking to enter the baking equipment for baking. When the PCB is baked, the conveying device brings the PCB that has completed baking to the lower plate position, the clamping mechanism releases the PCB, the conveying device continues to rotate, and conveys the clamping mechanism that has unloaded the PCB board to the cleaning device for soaking and cleaning. After the cleaning device removes the ink on the clamping mechanism, the conveying device conveys the clamping mechanism that has completed cleaning to the loading end of the parallel section, and clamps the PCB that has completed coating and is waiting for baking again to enter the baking equipment for the baking process.

[0007] Furthermore, in order to further ensure that the clamping mechanism can smoothly enter the cleaning tank, one end of the conveying device close to the cleaning mechanism is set as a sinking section. That is, the conveying device is divided into a parallel section and a sinking section, the parallel section and the sinking section are set at an angle, and the cleaning tank is set below the sinking section. Through the sinking design, on the one hand, it is avoided that the PCB board on the parallel section interferes with the cleaning tank, and on the other hand, it can ensure that the clamping mechanism is completely immersed in the cleaning tank.

[0008] The baking equipment for PCB board production of the present application can not only realize the automatic loading and unloading, coating and baking of PCB, but also can perform online cleaning of the clamping mechanism used to clamp the PCB board. Workers do not need to stop the machine regularly to disassemble and clean the clamping mechanism, thereby realizing continuous and stable production of the production line and effectively improving production efficiency. At the same time, the clamping mechanism is cleaned in time by the cleaning device, which can ensure the processing quality of the PCB board and avoid the adverse effects of residual ink on the clamping mechanism on the PCB board.

[0009] According to an embodiment of the present invention, a baking device for PCB board production includes a cleaning tank containing cleaning liquid and a drying mechanism mounted above the cleaning tank. The clamping mechanism located in the sinking section can enter the cleaning tank. The cleaning liquid in the cleaning tank can completely immerse and clean the clamping mechanism entering the cleaning tank. The drying mechanism is used to dry the clamping mechanism that has been cleaned.

[0010] According to a baking device for PCB board production according to an embodiment of the present invention, the drying mechanism includes a first bracket and a blowing assembly, the first bracket is fixed on the cleaning tank, the blowing assembly is installed on the first bracket, and the blowing assembly passes through the middle of the conveying device.

[0011] According to a baking device for PCB board production according to an embodiment of the present invention, the blowing assembly includes a second bracket and a blowing nozzle arranged on the second bracket, a plurality of blowing nozzles are arranged at intervals along the radial direction of the second bracket, and the blowing nozzles are arranged corresponding to the clamping mechanism.

[0012] According to a baking device for PCB board production according to an embodiment of the present invention, the drying mechanism also includes a water absorbing member, which is arranged between the blowing assembly and the clamping mechanism, and the water absorbing member is used to absorb liquid blown out from the clamping mechanism by the blowing mechanism.

[0013] According to a baking device for PCB board production according to an embodiment of the present invention, an ultrasonic device is arranged in a cleaning tank.

[0014] According to a baking device for PCB board production according to an embodiment of the present invention, the cleaning tank is also provided with a liquid supply device, the liquid supply device includes a liquid inlet and a liquid discharge port arranged on the cleaning tank and a liquid supply mechanism arranged outside the cleaning tank, and the liquid supply mechanism is connected to the liquid inlet through a pipeline.

[0015] According to a baking device for PCB board production according to an embodiment of the present invention, a liquid level monitor is provided in the cleaning tank, and the liquid level monitor is electrically connected to the liquid supply mechanism.

[0016] According to a baking device for PCB board production according to an embodiment of the present invention, the cleaning device also includes a lifting bracket, and the cleaning tank is installed on the lifting bracket. The lifting bracket can drive the cleaning tank away from or close to the clamping mechanism.

[0017] According to an embodiment of the present invention, a baking device for PCB board production is further provided with a lower plate device, and the lower plate device is arranged at one end close to the sinking section.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 This is a schematic structural diagram of a baking device for PCB board production according to an embodiment of the present invention; Figure 2 It is a diagram of the installation structure of the conveying device and the cleaning tank according to an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a drying mechanism according to an embodiment of the present invention; Figure 4 Schematic diagram of the structure of the splint structure according to an embodiment of the present invention.

[0020] Description of reference numerals: Conveying device 100; parallel section 110; sinking section 120; Clamping mechanism 200; third bracket 210; clamping head 220; Cleaning device 300; cleaning tank 310; liquid inlet 311; liquid outlet 312; ultrasonic mechanism 320; liquid level monitor 330; lifting bracket 340; main frame 350; universal wheel 351; Drying mechanism 400; first bracket 410; second bracket 420; air blowing nozzle 430; water absorbing member 440; Baking device 500. DETAILED DESCRIPTION

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0022] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In the description of the invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of the first or the second, it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] Reference Figures 1 to 4The embodiment of the present invention provides a baking device for PCB board production, including a baking device 500, including a baking box; a conveying device 100, including a conveyor belt and a clamping plate mechanism 200 arranged on the conveyor belt, the conveyor belt passes through the baking box, and the conveyor belt is provided with a parallel section 110 and a sinking section 120 along the conveying direction of the material, the sinking section 120 is arranged outside the baking box, the end close to the parallel section 110 is the upper plate end of the PCB board, and the end close to the sinking section 120 is the lower plate end of the PCB board At the end, a plurality of clamping mechanisms 200 are arranged at intervals along the direction from the parallel section 110 to the sinking section 120, and the clamping mechanisms 200 are used to clamp the PCB board that has been coated and is to be baked; a cleaning device 300 is arranged below the sinking section 120, and the cleaning device 300 includes a cleaning tank 310 for accommodating cleaning liquid, and the clamping mechanism 200 located in the sinking section 120 can enter the cleaning tank 310, and the cleaning liquid in the cleaning tank 310 can completely immerse and clean the clamping mechanism 200 entering the cleaning tank 310.

[0026] In the PCB (printed circuit board) manufacturing process, coating is an important step. Therefore, the present application proposes a baking device with a cleaning device 300, which can perform online cleaning of the clamping mechanism 200 for clamping the PCB board, and can ensure the cleanliness of the clamping mechanism 200, and avoid the residual ink of the clamping mechanism 200 affecting the subsequent board surface processing quality of the PCB board, thereby improving the coating quality and production efficiency of the PCB board.

[0027] Specifically, the conveying device 100 is used for continuous conveying of PCB boards, wherein the clamping mechanism 200 on the conveying device 100 clamps the PCB to be baked and enters the baking equipment for baking. When the PCB is baked, the conveying device 100 brings the baked PCB to the lower plate position, the clamping mechanism 200 releases the PCB, the conveying device 100 continues to rotate, and conveys the clamping mechanism 200 that has unloaded the PCB board to the cleaning device 300 for soaking and cleaning. After the cleaning device 300 removes the residual ink on the clamping mechanism 200, the conveying device 100 conveys the clamping mechanism 200 that has completed cleaning to the loading end of the parallel section 110, clamps the PCB to be baked again and enters the baking equipment for the baking process.

[0028] Furthermore, in order to further ensure that the clamping mechanism 200 can smoothly enter the cleaning tank 310, one end of the conveying device 100 close to the cleaning mechanism is provided as a sinking section 120. That is, the conveying device 100 is divided into a parallel section 110 and a sinking section 120, and the parallel section 110 and the sinking section 120 are provided at an angle, and the cleaning tank 310 is provided below the sinking section 120. Through the sinking design, on the one hand, the PCB board on the parallel section 110 is prevented from interfering with the cleaning tank 310, and on the other hand, the clamping mechanism 200 can be ensured to be completely immersed in the cleaning tank 310.

[0029] When the clamping mechanism 200 that has finished unloading enters the cleaning tank 310, the cleaning liquid in the cleaning tank 310 completely immerses the clamping mechanism 200 at that part, and the immersion time can be selected to be 50-60 seconds. After the immersion cleaning is completed, the conveying device 100 is started, and the clamping mechanism 200 that has finished cleaning is circulated and transported to the parallel section 110 again, ready to clamp the next PCB board to be baked.

[0030] The baking equipment of the present application can not only realize automatic loading and unloading and baking of PCBs, but also perform online cleaning of the clamping mechanism 200 used to clamp the PCB board. Workers do not need to stop the machine regularly to disassemble and clean the clamping mechanism 200, thereby achieving continuous and stable production of the production line and effectively improving production efficiency. At the same time, the cleaning device 300 is used to clean the clamping mechanism 200 in a timely manner, which can ensure the processing quality of the PCB board and avoid the adverse effects of residual ink on the clamping mechanism 200 on the PCB board.

[0031] According to some embodiments of the present application, the cleaning device 300 includes a cleaning tank 310 for containing cleaning liquid and a drying mechanism 400 mounted above the cleaning tank 310. The splint mechanism 200 located in the sinking section 120 can enter the cleaning tank 310. The cleaning liquid in the cleaning tank 310 can completely immerse and clean the splint mechanism 200 entering the cleaning tank 310. The drying mechanism 400 is used to dry the splint mechanism 200 that has completed cleaning.

[0032] Further, as shown in the figure, the drying mechanism 400 includes a first bracket 410 and a blowing assembly, the first bracket 410 is fixed on the cleaning tank 310, the blowing assembly is installed on the first bracket 410, and the blowing assembly passes through the middle of the conveying device 100. Specifically, the blowing assembly includes a second bracket 420 and a blowing nozzle 430 arranged on the second bracket 420, a plurality of blowing nozzles 430 are arranged at intervals along the radial direction of the second bracket 420, and the blowing nozzles 430 are arranged corresponding to the clamping mechanism 200. The blowing nozzles 430 are connected to an air supply machine arranged outside, and the air supply machine provides an air source for the blowing nozzles 430.

[0033] It is understandable that when the clamping mechanism 200 that has completed immersion cleaning is transported out of the cleaning tank 310, the air nozzle 430 blows air toward the clamping mechanism 200 to dry the cleaning liquid on the clamping mechanism 200 to avoid affecting the subsequent clamping of the PCB and causing adverse effects on the PCB surface due to the residual cleaning liquid.

[0034] As a preferred solution, the air blowing nozzles 430 on the second bracket 420 may be arranged in multiple rows along the height direction of the second bracket 420 to improve the drying efficiency.

[0035] Further, as a preferred solution, as shown in the figure, the air blowing nozzles 430 are arranged at intervals along the width direction of the conveying device 100 and correspond to the clamping mechanism 200. Specifically, the conveying device 100 is a chain conveyor belt, and the clamping mechanism 200 is composed of a third bracket 210 and a chuck 220 arranged on the third bracket 210, and a plurality of chucks 220 are arranged at intervals along the width direction of the conveying device 100. Among them, the number of the air blowing nozzles 430 is the same as the number of the chucks 220, and the positions of the air blowing nozzles 430 and the chucks 220 correspond. When the chucks 220 that have been cleaned are conveyed out of the cleaning tank 310, the conveying device 100 is paused, and the air blowing nozzles 430 output high-pressure and clean gas toward the chucks 220 to air dry the cleaning liquid on the chucks 220.

[0036] Furthermore, the parallel section 110 and the sinking section 120 of the conveying device 100 can realize the directional transmission of the conveying device 100 through a phase-changing gear transmission structure.

[0037] Furthermore, if Figure 1 As shown, the water absorbent member 440 is arranged between the blowing assembly and the clamping mechanism 200. The water absorbent member 440 is used to absorb the liquid blown out from the clamping mechanism 200 by the blowing assembly to prevent the cleaning liquid blown out by the blowing nozzle 430 from splashing onto the PCB board, causing adverse effects on the board surface of the PCB and causing it to be scrapped.

[0038] Specifically, the absorbent member 440 may be made of corrosion-resistant absorbent cotton.

[0039] According to some embodiments of the present application, an ultrasonic mechanism 320 is provided in the washing tank, and the ultrasonic mechanism 320 is used to improve the cleaning cleanliness of the chuck 220 .

[0040] According to some embodiments of the present application, the cleaning tank 310 is further provided with a liquid supply device, which includes a liquid inlet 311, a liquid outlet 312 and a liquid supply mechanism (not shown) provided on the cleaning tank 310, and the liquid supply mechanism (not shown) is connected to the liquid inlet 311 through a pipeline. Furthermore, a liquid level monitor 330 is provided in the cleaning tank 310, and the liquid level monitor 330 is electrically connected to the liquid supply mechanism (not shown).

[0041] It can be understood that when the cleaning liquid in the cleaning tank 310 drops to a preset minimum liquid level, the liquid level monitor 330 feeds back information to the liquid supply mechanism (not shown in the figure), and the liquid supply mechanism (not shown in the figure) starts to input cleaning liquid into the cleaning tank 310 until the liquid level in the cleaning tank 310 returns to the original preset maximum liquid level, thereby preventing the liquid level from being too low and affecting the immersion cleaning effect of the splint mechanism 200.

[0042] According to some embodiments of the present application, the cleaning tank 310 is installed on the lifting bracket 340, and the lifting bracket 340 can drive the cleaning tank 310 away from or close to the clamping mechanism. The lifting bracket 340 drives the cleaning tank 310 to move in the longitudinal direction, and adjusts the position of the cleaning tank 310 relative to the conveying device 100 to ensure that the clamping mechanism 200 can be completely immersed in the cleaning liquid in the cleaning tank 310, and fully cleaned, thereby ensuring the cleanliness of the clamping mechanism 200.

[0043] Furthermore, the lifting bracket 340 is installed on the main frame 350 , wherein a universal wheel 351 is provided at the bottom of the main frame 350 , and the position of the cleaning tank 310 can be adjusted according to the position of the sinking section 120 through the universal wheel 351 .

[0044] According to some embodiments of the present application, the lower plate device (not shown) is disposed at one end close to the sinking section 120. Specifically, the lower plate device (not shown) is disposed between the cleaning tank 310 and the discharge end of the baking oven.

[0045] The baked PCB is separated from the clamping mechanism 200 by a lower plate device (not shown), and the clamping mechanism 200 immediately enters the cleaning tank 310 for cleaning after unloading the PCB.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0047] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A baking device for PCB board production, characterized in that: include: Baking devices, including baking ovens; A conveying device, comprising a conveyor belt and a clamping plate mechanism arranged on the conveyor belt, wherein the conveyor belt passes through the baking oven, and the conveyor belt is provided with a parallel section and a sinking section along the conveying direction of the material, wherein the sinking section is arranged outside the baking oven, and one end close to the parallel section is an upper board end of the PCB board, and one end close to the sinking section is a lower board end of the PCB board, and a plurality of the clamping plate mechanisms are arranged at intervals along the direction from the parallel section to the sinking section, and the clamping plate mechanism is used to clamp the PCB board to be baked; The cleaning device is arranged below the sinking section, and the cleaning device comprises a cleaning tank for accommodating cleaning liquid. The clamping mechanism located at the sinking section can enter the cleaning tank, and the cleaning liquid in the cleaning tank can completely immerse and clean the clamping mechanism entering the cleaning tank.

2. The baking equipment for PCB board production according to claim 1, characterized in that: The cleaning device includes a cleaning tank for containing cleaning liquid and a drying mechanism mounted above the cleaning tank. The clamping mechanism located in the sinking section can enter the cleaning tank. The cleaning liquid in the cleaning tank can completely immerse and clean the clamping mechanism entering the cleaning tank. The drying mechanism is used to dry the clamping mechanism that has been cleaned.

3. A baking device for PCB board production according to claim 2, characterized in that: The drying mechanism comprises a first bracket and a blowing assembly, wherein the first bracket is fixed on the cleaning tank, the blowing assembly is installed on the first bracket, and the blowing assembly passes through the middle of the conveying device.

4. The baking equipment for PCB board production according to claim 3 is characterized in that: The blowing assembly includes a second bracket and a blowing nozzle arranged on the second bracket, a plurality of the blowing nozzles are arranged at intervals along the radial direction of the second bracket, and the blowing nozzles are arranged corresponding to the clamping plate mechanism.

5. The baking equipment for PCB board production according to claim 3, characterized in that: The drying mechanism further comprises a water absorbing member, which is arranged between the air blowing assembly and the clamping mechanism, and is used for absorbing the liquid blown out from the clamping mechanism by the air blowing mechanism.

6. The baking equipment for PCB board production according to claim 1, characterized in that: An ultrasonic device is arranged in the cleaning tank.

7. The baking equipment for PCB board production according to claim 1, characterized in that: The cleaning tank is also provided with a liquid supply device, which includes a liquid inlet and a liquid outlet arranged on the cleaning tank and a liquid supply mechanism arranged outside the cleaning tank, and the liquid supply mechanism is connected to the liquid inlet through a pipeline.

8. The baking equipment for PCB board production according to claim 7, characterized in that: A liquid level monitor is arranged in the cleaning tank, and the liquid level monitor is electrically connected to the liquid supply mechanism.

9. The baking equipment for PCB board production according to claim 1, characterized in that: The cleaning device further comprises a lifting bracket, the cleaning tank is mounted on the lifting bracket, and the lifting bracket can drive the cleaning tank away from or close to the clamping plate mechanism.

10. The baking equipment for PCB board production according to claim 1, characterized in that: A lower plate device is also provided, and the lower plate device is arranged at one end close to the sinking section.

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