One-way heat conduction device for micro heating element and processing method thereof

Abstract

The present application discloses a one-way heat conduction device for a micro-heating element and a processing method thereof, and relates to the field of heat dissipation technology of electrical components. The one-way heat conduction device for a micro-heating element comprises a heat conduction cavity, the heat conduction cavity is a flat structure, the heat conduction cavity has two opposite main sides, the side wall of the heat conduction cavity close to one of the main sides is used as the bottom wall, and the side wall of the heat conduction cavity close to the other main side is used as the top wall, and the heat conduction cavity contains a liquid-gas phase change medium; the inner side of the heat conduction cavity is provided with a plurality of liquid wicks, the liquid wicks have loose pores, the two ends of the liquid wicks are respectively connected to the bottom wall and the top wall of the heat conduction cavity, and the cross-sectional size of the liquid wicks gradually decreases in the direction away from the bottom wall. The present application can improve the heat dissipation effect of micro-heating elements in electronic products.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology for electrical components, and in particular to a one-way heat conduction device for a micro-heating element and a processing method thereof. Background Art

[0002] With the vigorous development of high technology, electronic products are becoming more intelligent and complex. The size of electronic components (especially micro-heating components represented by chips) of electronic products is becoming smaller and smaller, and the density per unit area is getting higher and higher. The direct impact of this situation is that the heat generated by electronic products during operation is increasing. If there is no good heat dissipation method to remove the heat generated by electronic components in time, excessive temperature will cause phenomena such as electron ionization and thermal stress in electronic components, resulting in reduced overall stability of electronic components, and even shortening the life of electronic components. Therefore, how to remove this heat to avoid overheating of micro-heating components has always been an issue that cannot be ignored.

[0003] The related art discloses a high heat dissipation LED circuit board, which includes a heat dissipation base layer, an insulating heat conductive layer and a circuit layer arranged in sequence from bottom to top, wherein the heat dissipation base layer is a metal plate, and a plurality of cone-shaped protrusions are arranged on its upper surface; two crossed heat transfer strips are arranged on the top of the cone-shaped protrusions. The cone-shaped protrusions extending into the insulating heat conductive layer increase the contact area between the heat dissipation base layer and the insulating heat conductive layer, thereby improving the heat conduction efficiency between the heat dissipation base layer and the insulating heat conductive layer.

[0004] In the above technologies, the heat dissipation of electronic devices is mainly achieved through heat conduction between the heat conductor and the heat sink, and the heat dissipation effect is relatively limited. Summary of the invention

[0005] In order to improve the heat dissipation effect of micro-heating elements in electronic products, the present application provides a unidirectional heat conduction device for micro-heating elements and a processing method thereof.

[0006] The one-way heat conduction device for a micro-heating element and the processing method thereof provided in this application adopt the following technical solutions: A one-way heat conduction device for a micro-heating element comprises a heat conduction cavity, which is a flat structure and has two opposite main side surfaces. The side wall of the heat conduction cavity close to one of the main side surfaces serves as a bottom wall, and the side wall of the heat conduction cavity close to the other main side surface serves as a top wall. A liquid-gas phase change medium is contained in the heat conduction cavity. A plurality of liquid wicks are arranged on the inner side of the heat conduction cavity, and the liquid wicks have loose pores. The two ends of the liquid wicks are respectively connected to the bottom wall and the top wall of the heat conduction cavity, and the cross-sectional size of the liquid wicks gradually decreases in the direction away from the bottom wall.

[0007] By adopting the above technical solution, when the one-way heat conduction device is used, the bottom wall of the heat conduction cavity is made to fit the surface of the micro-heating element. The heat generated by the micro-heating element acts on the liquid-gas phase change medium in the heat conduction cavity through the bottom wall of the heat conduction cavity. The liquid liquid-gas phase change medium absorbs heat and evaporates into a gaseous state, and dissipates heat outward through the top wall of the heat conduction cavity, so that the gaseous liquid-gas phase change medium condenses into a liquid state on the top wall of the heat conduction cavity. Since the liquid absorbent core has loose pores, the condensed liquid-gas phase change medium can flow from the small end of the liquid absorbent core to the large end of the liquid absorbent core under capillary action, so that the liquid-gas phase change medium is enriched on the side of the inner side of the heat conduction cavity close to the bottom wall. In the above process, the one-way heat conduction device uses the liquid-gas phase change medium to absorb the heat generated by the micro-heating element, which can improve the heat transfer efficiency of the one-way heat conduction device, thereby increasing the heat dissipation efficiency of the one-way heat conduction device.

[0008] Optionally, the inner surface of the bottom wall of the heat-conducting cavity is provided with a rough hydrophilic texture.

[0009] By adopting the above technical solution, a rough hydrophilic texture is provided on the inner surface of the heat-conducting cavity, so that the hydrophilic texture can adsorb the liquid-gas phase change medium through capillary action, so that the liquid-gas phase change medium at the large end of the liquid absorption can flow to the bottom wall of the heat-conducting cavity under the action of capillary action, so that the contact area between the liquid-gas phase change medium and the bottom wall of the heat-conducting cavity is increased, and the heat absorption efficiency of the liquid-gas phase change medium is improved, which is beneficial to improve the heat dissipation efficiency of the one-way heat-conducting device.

[0010] Optionally, the inner cavity of the heat-conducting cavity is in a vacuum state.

[0011] By adopting the above technical solution, the inner cavity of the heat-conducting cavity is made into a vacuum state, so that the liquid-gas box variable medium in the heat-conducting cavity is easier to evaporate.

[0012] Optionally, the heat-conducting cavity is provided with an exhaust channel, one end of the exhaust channel is provided with a connecting hole, the other end of the exhaust channel is through-set, the connecting hole is connected to the inner cavity of the heat-conducting cavity, the aperture of the connecting hole is smaller than the cross-sectional size of the exhaust channel, the exhaust channel is provided with a movable sealing plug for blocking the connecting hole, and the heat-conducting cavity is provided with a sealing member for sealing the exhaust channel.

[0013] By adopting the above technical solution, after the heat-conducting cavity is processed and formed, the inner cavity of the heat-conducting cavity is evacuated through the exhaust channel. During this process, the movable sealing plug leaves the connecting hole under the push of the airflow; after the vacuuming action is completed, the movable sealing plug presses against the edge of the connecting hole under the pressure of the outside air, and then the exhaust hole is sealed with a seal to keep the exhaust channel and the inner cavity of the heat-conducting cavity closed.

[0014] Optionally, a hydrophobic layer is provided on the inner side surface of the top wall of the heat-conducting cavity, and the hydrophobic layer is provided with a guide channel. The inner surface of the top wall of the heat-conducting cavity is exposed through the guide channel, and the small end of the wick is located in the guide channel.

[0015] By adopting the above technical solution, the liquid-gas phase change medium that absorbs heat and evaporates into gas is condensed into liquid on the top wall of the heat-conducting cavity. The liquid liquid-gas phase change medium adheres to the top wall of the heat-conducting cavity. The material of the hydrophobic layer on the top wall of the heat-conducting cavity can repel the liquid liquid-gas phase change medium, so that the liquid liquid-gas phase change medium flows concentratedly to the guide groove of the hydrophobic layer, so that the liquid liquid-gas phase change medium is easier to flow to the liquid absorption core, which is beneficial to improving the circulation efficiency of the liquid-gas phase change medium.

[0016] Optionally, the liquid absorbent core is a truncated cone structure, the large end of the liquid absorbent core is connected to the bottom wall of the heat-conducting cavity, and the small end of the liquid absorbent core is connected to the top wall of the heat-conducting cavity.

[0017] By adopting the above technical solution, the liquid wick is configured in a truncated cone shape, the structure is relatively balanced, and it is easy to process.

[0018] Optionally, a plurality of spacers arranged in parallel and at intervals are provided on the bottom wall of the heat-conducting cavity, the spacers have loose pores, and a spacing margin is left between the spacers and the top wall of the heat-conducting cavity.

[0019] By adopting the above technical solution, the spacer can absorb liquid gas phase change medium, so that the effective volume of the liquid gas phase change medium is increased. The spacer is arranged in a strip structure, so that the continuity of the spacer along the inner side of the bottom wall of the heat conduction cavity is stronger, so that the spacer has a larger storage space than the liquid absorbent core.

[0020] Optionally, the liquid wick is integrally connected to the bottom wall of the heat-conducting cavity.

[0021] By adopting the above technical solution, the liquid absorbent core is connected to the bottom wall of the heat-conducting cavity, so that the materials of the liquid absorbent core and the bottom plate are continuous, so that the heat of the heat-conducting cavity can be more easily transferred to the liquid absorbent core, and the liquid-gas phase change medium absorbed and stored in the liquid absorbent core can accelerate the heat absorption and evaporation, which is beneficial to improve the overall heat conduction efficiency of the heat-conducting device.

[0022] Optionally, a plurality of positioning pits are provided on the inner side surface of the top wall of the heat-conducting cavity, and the positioning pits are arranged one-to-one corresponding to the liquid absorbent core, and the small end of the liquid absorbent core is inserted into the positioning pit; a silica gel filler layer is provided between the small end of the liquid absorbent core and the positioning pit.

[0023] By adopting the above technical solution, the small end of the liquid absorbent core is inserted into the positioning groove, which is conducive to eliminating the gap between the small end of the liquid absorbent core and the top wall of the heat conduction cavity along the axial direction of the liquid absorbent core, so that the liquid-gas phase change medium condensed on the top wall of the heat conduction cavity is easier to adhere to the surface of the liquid absorbent core. The silica gel filler layer can fill the gap between the small end of the liquid absorbent core and the inner wall of the positioning groove, reduce the situation of liquid liquid-gas phase change medium being retained in the positioning groove, and make the liquid-gas phase change medium in the heat conduction cavity fully play the role of heat conduction.

[0024] The processing method of the one-way heat conduction device for a micro-heating element described in any of the above items comprises the following steps: forming a bottom plate used as the bottom wall of the heat conduction cavity by 3D printing, and integrally printing a liquid wick on the bottom plate, and reserving a groove on the inner side of the bottom plate; forming a cover plate used as the top wall of the heat conduction cavity by machining; splicing the cover plate and the bottom plate, pouring liquid-gas phase change medium into the groove reserved on the bottom plate, sealing the space between the cover plate and the bottom plate, and combining the cover plate and the bottom plate to form a heat conduction cavity.

[0025] By adopting the above technical solution, the bottom plate and the liquid wick of the heat-conducting cavity are formed by 3D printing, which is conducive to simplifying the processing procedures of the bottom plate and the liquid wick. The cover plate is processed by machining, which is conducive to controlling the roughness of the top wall of the heat-conducting cavity, so that the liquid-gas phase change medium condensed on the top wall of the heat-conducting cavity is easier to flow.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: When the one-way heat transfer device is used, the liquid gas phase change medium absorbs heat and evaporates into gas, and the gaseous liquid gas phase change medium condenses into liquid on the top wall of the heat transfer cavity. Because the liquid wick has loose pores, the condensed liquid gas phase change medium can flow from the small end of the liquid wick to the large end of the liquid wick under the capillary action, so that the liquid gas phase change medium is enriched on the side of the inner side of the heat transfer cavity close to the bottom wall. Using the liquid gas phase change medium to absorb the heat generated by the micro heating element can improve the heat dissipation efficiency.

[0027] The liquid wick is connected to the bottom wall of the heat conduction cavity, so that the materials of the liquid wick and the bottom plate are continuous, so that the heat of the heat conduction cavity can be more easily transferred to the liquid wick, and the liquid-gas phase change medium absorbed and stored in the liquid wick can accelerate the heat absorption and evaporation, which is beneficial to improve the overall heat conduction efficiency of the heat conduction device.

[0028] The bottom plate and the liquid wick of the heat-conducting cavity are formed by 3D printing, which is conducive to simplifying the processing procedures of the bottom plate and the liquid wick. The cover plate is processed by machining, which is conducive to controlling the roughness of the top wall of the heat-conducting cavity, so that the liquid-gas phase change medium condensed on the top wall of the heat-conducting cavity is easier to flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a cross-sectional view of a one-way heat conduction device for a micro-heat generating element according to Embodiment 1.

[0030] Figure 2 It is a schematic diagram of the separation state between the bottom plate and the cover plate in Example 1.

[0031] Figure 3 It is a flow chart of the processing method of the one-way heat conduction device for the micro-heating element in Example 1.

[0032] Figure 4 It is a schematic diagram used to illustrate the air extraction channel in Example 2.

[0033] Figure 5 It is a flow chart of the processing method of the one-way heat conduction device for the micro-heating element in Example 2.

[0034] Figure 6 It is a schematic diagram used to illustrate the positioning groove in Example 3.

[0035] Figure 7 It is a schematic diagram of the inner side surface of the cover plate in Example 3.

[0036] Description of reference numerals: 1. Heat-conducting cavity; 11. Bottom plate; 111. Groove; 12. Cover plate; 121. Positioning pit; 122. Silica gel packing layer; 123. Hydrophobic layer; 1231. Guide channel; 13. Main side; 2. Liquid-absorbing core; 3. Spacer; 4. Air extraction channel; 41. Connecting hole; 42. Movable sealing plug; 43. Sealing element; 44. Limiting protrusion. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-7 This application is described in further detail. Example 1

[0038] The present application embodiment discloses a one-way heat conduction device for a micro-heating element. Figure 1 and Figure 2 The one-way heat conduction device for a micro-heating element includes a heat conduction cavity 1, and the heat conduction cavity 1 is a flat rectangular structure as a whole. The inner cavity of the heat conduction cavity 1 is in a vacuum state. The heat conduction cavity 1 includes a bottom plate 11 and a cover plate 12. The surface of the bottom plate 11 away from the cover plate 12 and the surface of the cover plate 12 away from the bottom plate 11 serve as two main side surfaces 13 of the heat conduction cavity 1. A groove 111 is formed inwardly on one side of the bottom plate 11 close to the cover plate 12. The bottom wall of the groove 111 serves as the bottom wall of the heat conduction cavity 1. The main part of the cover plate 12 corresponding to the groove 111 serves as the top wall of the heat conduction cavity 1. The heat conduction cavity 1 is filled with a liquid-gas phase change medium, and the liquid-gas phase change medium does not fill the heat conduction cavity 1, forming a vacuum state.

[0039] The liquid-gas phase change medium can be ionized water, distilled water, or a hydrophilic solvent such as alcohol or methanol whose boiling point is lower than that of water.

[0040] The inner surface of the bottom wall of the heat-conducting cavity 1 is provided with a rough hydrophilic texture. The inner side of the heat-conducting cavity 1 is provided with a plurality of liquid-absorbing cores 2 and a plurality of spacers 3, and the liquid-absorbing cores 2 and spacers 3 are integrally connected with the bottom plate 11.

[0041] In another embodiment, the absorbent core 2 and the spacer bars 3 may be configured as a separate structure with the bottom plate 11, and a plurality of absorbent cores 2 and a plurality of spacer bars 3 may be connected in series to form a grid structure using rods.

[0042] The wick 2 and the spacers 3 both have loose pores. The wicks 2 are evenly distributed in the heat-conducting cavity 1 in a square array. The wick 2 is a truncated cone or prism structure. The large end of the wick 2 is connected to the bottom wall of the heat-conducting cavity 1, and the small end of the wick 2 is connected to the top wall of the heat-conducting cavity 1, that is, the cross-sectional size of the wick 2 gradually decreases in the direction away from the bottom wall. Multiple spacers 3 are arranged in parallel and spaced apart, and each spacer 3 is located between two adjacent rows of wicks 2. A spacing margin is left between the spacers 3 and the top wall of the heat-conducting cavity 1.

[0043] The working principle of the one-way heat-conducting device for the micro-heating element in the embodiment of the present application is as follows: when the one-way heat-conducting device is used, the bottom wall of the heat-conducting cavity 1 is made to fit the surface of the micro-heating element. The heat generated by the micro-heating element acts on the liquid-gas phase-change medium in the heat-conducting cavity 1. The liquid liquid-gas phase-change medium absorbs heat and evaporates into a gaseous state, and dissipates heat outward through the top wall of the heat-conducting cavity 1, so that the gaseous liquid-gas phase-change medium condenses into a liquid state on the top wall of the heat-conducting cavity 1. Since the liquid-absorbent core 2 has loose pores, the condensed liquid-gas phase-change medium can flow from the small end of the liquid-absorbent core 2 to the large end of the liquid-absorbent core 2 under capillary action, so that the liquid-gas phase-change medium is enriched on the side of the inner side of the heat-conducting cavity 1 close to the bottom wall. In the above process, the one-way heat-conducting device uses the liquid-gas phase-change medium to absorb the heat generated by the micro-heating element, which can improve the heat transfer efficiency of the one-way heat-conducting device, thereby increasing the heat dissipation efficiency of the one-way heat-conducting device.

[0044] This embodiment also discloses a method for processing the above-mentioned one-way heat conduction device for a micro-heating element, referring to Figure 3 , including the following steps: Step 1, forming a bottom plate 11 used as the bottom wall of the heat-conducting cavity 1 by 3D printing, and integrally printing a liquid-absorbing core 2 and a spacer bar 3 on the bottom plate 11, and reserving a groove 111 on the inner side of the bottom plate 11; Step 2, forming a cover plate used as the top wall of the heat-conducting cavity 1 by machining; Step 3, assemble the cover plate 12 and the base plate 11, pour liquid-gas phase change medium into the groove 111 reserved on the base plate 11, and seal the space between the cover plate 12 and the base plate 11 by 3D printing in a vacuum environment, so that the cover plate 12 and the base plate 11 are combined to form a heat conduction cavity 1.

[0045] In this embodiment, the cover plate can also be formed by stamping and cutting. In step 3, the bottom plate 11 and the cover plate 12 can also be sealed by laser welding, ultrasonic welding or resistance welding.

[0046] In this embodiment, the bottom plate 11 and the liquid wick 2 of the heat-conducting cavity 1 are formed by 3D printing, which is conducive to simplifying the processing procedures of the bottom plate 11 and the liquid wick 2. The cover plate of the heat-conducting cavity 1 is processed by machining or stamping, which is conducive to controlling the roughness of the top wall of the heat-conducting cavity 1, so that the liquid-gas phase change medium condensed on the top wall of the heat-conducting cavity 1 is easier to flow. In step 3 of this embodiment, by sealing the cover plate 12 and the bottom plate 11 in a vacuum environment, a negative pressure can be formed inside the heat-conducting cavity 1. Example 2

[0047] The structure of the one-way heat conduction device for the micro-heating element in this embodiment is different from that in the first embodiment.

[0048] Reference Figure 4 The bottom plate 11 of the heat-conducting cavity 1 is provided with an exhaust channel 4, the length direction of the exhaust channel 4 is parallel to the main side surface 13 of the heat-conducting cavity 1, one end of the exhaust channel 4 is provided with a connecting hole 41, and the other end of the exhaust channel 4 is through-set, the connecting hole 41 and the inner hole of the exhaust channel 4 are both circular holes, the connecting hole 41 is connected to the inner cavity of the heat-conducting cavity 1, the aperture of the connecting hole 41 is smaller than the inner diameter of the exhaust channel 4, and the exhaust channel 4 is provided with a movable sealing plug 42 for blocking the connecting hole 41. The movable sealing plug 42 is a sphere, the diameter of the sphere is larger than the inner diameter of the connecting hole 41, and smaller than the inner diameter of the connecting hole 41, and the inner wall of the exhaust channel 4 is provided with a limiting convex point 44 for preventing the movable sealing plug 42 from escaping from the exhaust channel 4. The heat-conducting cavity 1 is provided with a sealing member 43 for blocking the exhaust channel 4, the material of the sealing member 43 is the same as that of the bottom plate 11, and the sealing member 43 and the bottom plate 11 are sealed by welding.

[0049] The above-mentioned processing method of the one-way heat conduction device for micro-heating element is referred to Figure 5 , including the following steps: Step 1, forming a bottom plate 11 used as the bottom wall of the heat-conducting cavity 1 by 3D printing, and integrally printing a liquid-absorbing core 2 and a spacer bar 3 on the bottom plate 11, and reserving a groove 111 on the inner side of the bottom plate 11; Step 2, forming a cover plate used as the top wall of the heat-conducting cavity 1 by machining; Step 3, assembling the cover plate 12 and the bottom plate 11, pouring liquid-gas phase change medium into the groove 111 reserved on the bottom plate 11, and sealing the space between the cover plate 12 and the bottom plate 11 by 3D printing, so that the cover plate 12 and the bottom plate 11 are combined to form a heat conduction cavity 1; Step 4, evacuate the inner cavity of the heat-conducting cavity 1 through the exhaust channel 4. During this process, the movable sealing plug 42 leaves the connecting hole 41 under the push of the air flow; after the vacuuming action is completed, the movable sealing plug 42 presses against the edge of the connecting hole 41 under the pressure of the external air, and then the exhaust hole is sealed with the sealing member 43, so that the exhaust channel 4 and the inner cavity of the heat-conducting cavity 1 remain closed. Example 3

[0050] The structure of the one-way heat conduction device for the micro-heating element in this embodiment is different from that in the first embodiment.

[0051] Reference Figure 6 The difference between this embodiment and embodiment 1 is that a plurality of positioning pits 121 are provided on the inner side of the top wall of the heat-conducting cavity 1. The positioning pits 121 are arranged one by one with the liquid absorbent core 2. The small end of the liquid absorbent core 2 is inserted into the positioning pit 121, which is conducive to eliminating the gap between the small end of the liquid absorbent core 2 and the top wall of the heat-conducting cavity 1 along the axial direction of the liquid absorbent core 2. The positioning groove is filled with silicone filler, which is adhered and fixed to the inner wall of the positioning pit 121. The small end of the liquid absorbent core 2 squeezes the silicone filler, so that a silicone filler layer 122 is formed between the small end of the liquid absorbent core 2 and the positioning pit 121. The silicone filler layer 122 can fill the gap between the small end of the liquid absorbent core 2 and the inner wall of the positioning pit 121, reducing the situation where the liquid-gas phase change medium in the liquid state is retained in the positioning pit 121.

[0052] Reference Figure 7 In this embodiment, a hydrophobic layer 123 is provided on the inner side surface of the top wall of the heat-conducting cavity 1, and the hydrophobic layer 123 is provided with a guide channel 1231. The inner surface of the top wall of the heat-conducting cavity 1 is exposed through the guide channel 1231, and the positioning groove 121 is located in the guide channel 1231, that is, the small end of the liquid-absorbing core 2 is located in the guide channel 1231.

[0053] The liquid liquid-gas phase change medium is attached to the top wall of the heat conducting cavity 1. The material of the hydrophobic layer 123 on the top wall of the heat conducting cavity 1 can repel the liquid liquid-gas phase change medium, so that the liquid liquid-gas phase change medium flows to the guide channel 1231 of the hydrophobic layer 123, so that the liquid liquid-gas phase change medium is easier to flow to the liquid wick 2, which is beneficial to improving the circulation efficiency of the liquid-gas phase change medium. Example 4

[0054] The difference between this embodiment and the first embodiment is that in the processing method of the one-way heat conduction device for a micro-heating element in this embodiment, step 3 does not need to perform the sealing processing of the cover plate and the bottom plate 11 in a vacuum environment.

[0055] In step 3 of this embodiment, during the sealing process of the cover plate and the bottom plate 11, the heat-conducting cavity 1 is heated to make the liquid-gas conversion medium in the heat-conducting cavity 1 partially evaporate and occupy the space in the heat-conducting cavity 1. When the heat-conducting cavity 1 is sealed, the gaseous liquid-gas conversion medium condenses, so that a vacuum state is formed in the heat-conducting cavity 1. Example 5

[0056] The difference between this embodiment and embodiment 1 is that in the processing method of the one-way heat conduction device for a micro-heating element in this embodiment, a groove 111 is reserved on the cover plate in step 1, and the groove 111 does not need to be reserved on the inner side of the base plate 11, or the grooves 111 can be reserved on the cover plate and the base plate 11 respectively.

[0057] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A one-way heat conduction device for a micro heating element, characterized in that: The invention comprises a heat-conducting cavity (1), wherein the heat-conducting cavity (1) is a flat structure, and has two opposite main side surfaces (13). The side wall of the heat-conducting cavity (1) close to one of the main side surfaces (13) serves as a bottom wall, and the side wall of the heat-conducting cavity (1) close to the other main side surface (13) serves as a top wall. The heat-conducting cavity (1) contains a liquid-gas phase change medium. A plurality of liquid wicks (2) are provided on the inner side of the heat-conducting cavity (1), and the liquid wicks (2) have loose pores. The two ends of the liquid wicks (2) are respectively connected to the bottom wall and the top wall of the heat-conducting cavity (1), and the cross-sectional dimensions of the liquid wicks (2) gradually decrease in a direction away from the bottom wall.

2. The one-way heat conduction device for a micro heating element according to claim 1, characterized in that: The inner surface of the bottom wall of the heat-conducting cavity (1) is provided with a rough hydrophilic texture.

3. The one-way heat conduction device for a micro heating element according to claim 1, characterized in that: The inner cavity of the heat-conducting cavity (1) is in a vacuum state.

4. The one-way heat conduction device for a micro-heating element according to claim 1, characterized in that: The heat-conducting cavity (1) is provided with an exhaust duct (4), one end of the exhaust duct (4) is provided with a connecting hole (41), the other end of the exhaust duct (4) is through-set, the connecting hole (41) is connected with the inner cavity of the heat-conducting cavity (1), the aperture of the connecting hole (41) is smaller than the cross-sectional size of the exhaust duct (4), a movable sealing plug (42) for blocking the connecting hole (41) is provided in the exhaust duct (4), and the heat-conducting cavity (1) is provided with a sealing member (43) for blocking the exhaust duct (4).

5. The one-way heat conduction device for a micro heating element according to claim 1, characterized in that: A hydrophobic layer (123) is provided on the inner side surface of the top wall of the heat-conducting cavity (1), and the hydrophobic layer (123) is provided with a flow-guiding channel (1231). The inner surface of the top wall of the heat-conducting cavity (1) is exposed through the flow-guiding channel (1231), and the small end of the liquid-absorbing core (2) is located in the flow-guiding channel (1231).

6. The one-way heat conduction device for a micro-heating element according to claim 1, characterized in that: The liquid absorbent core (2) is a truncated cone structure; the large end of the liquid absorbent core (2) is connected to the bottom wall of the heat-conducting cavity (1); and the small end of the liquid absorbent core (2) is connected to the top wall of the heat-conducting cavity (1).

7. The one-way heat conduction device for a micro-heating element according to claim 1, characterized in that: The bottom wall of the heat-conducting cavity (1) is provided with a plurality of spacers (3) arranged in parallel and at intervals, the spacers (3) having loose pores, and a spacing margin is left between the spacers (3) and the top wall of the heat-conducting cavity (1).

8. The one-way heat conduction device for a micro-heating element according to claim 1, characterized in that: The liquid absorbing core (2) is integrally connected to the bottom wall of the heat conducting cavity (1).

9. The one-way heat conduction device for a micro-heating element according to claim 1, characterized in that: The inner side surface of the top wall of the heat-conducting cavity (1) is provided with a plurality of positioning grooves (121), the positioning grooves (121) being arranged in one-to-one correspondence with the liquid absorbent core (2), and the small end of the liquid absorbent core (2) is inserted into the positioning groove (121); a silica gel filler layer (122) is provided between the small end of the liquid absorbent core (2) and the positioning groove (121).

10. The method for processing a one-way heat conduction device for a micro-heating element according to any one of claims 1 to 9, characterized in that: The steps include: A bottom plate (11) used as the bottom wall of the heat-conducting cavity (1) is formed by 3D printing, and a liquid-absorbing core (2) is integrally printed on the bottom plate (11), and a groove (111) is reserved on the inner side surface of the bottom plate (11); Forming a cover plate (12) serving as a top wall of the heat-conducting cavity (1) by machining; The cover plate (12) and the bottom plate (11) are assembled, a liquid-gas phase change medium is poured into a groove (111) reserved on the bottom plate (11), and the space between the cover plate (12) and the bottom plate (11) is sealed, so that the cover plate (12) and the bottom plate (11) are combined to form a heat conduction cavity (1).

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