An inverter heat dissipation structure and its design method

Abstract

The application discloses an inverter heat dissipation structure and a design method thereof. The inverter heat dissipation structure comprises a fan, a heat radiator and a fan box. The height of the fan box is greater than the height of the heat radiator, so that the fan box is connected with one side of the heat radiator through an inclined top plate. The fan is installed in the fan box. The area of the top plate corresponding to the fan is a flow guide area, and the top plate is provided with heat dissipation holes in the area outside the flow guide area. The design method is used for designing the inverter heat dissipation structure. The application has the beneficial effects that the application can efficiently utilize the loss airflow caused by the inclination of the top plate without reducing the required airflow of the main area, thereby increasing the working efficiency of the fan, reducing the noise, and cooling the nearby heat source area.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and in particular to an inverter heat dissipation structure and its design method. Background Technology

[0002] With the continuous development of the electronics industry, the size of electronic devices is decreasing while power consumption is gradually increasing. In order to solve the heat dissipation problem of devices, fans and heat sinks are increasingly used for heat dissipation of electronic devices. At the same time, due to factors such as structure, noise, EMC and safety regulations, fans are usually fixed in a fan box.

[0003] In inverters, due to their high power consumption, large-volume fans are needed for cooling. However, large-volume fans are generally tall. If a heatsink of the same height is used, it will severely reduce the heat dissipation efficiency of the heatsink and increase the pressure loss in the flow channel. Therefore, the conventional practice is to tilt the top plate of the fan box at a certain angle so that the outlet height of the fan box is consistent with the height of the heatsink.

[0004] However, in actual use, it has been found that tilting the top plate not only reduces the efficiency of the fan, but also creates eddies near the top plate of the fan box, resulting in a loss of fan airflow and preventing the fan from working in the high-efficiency range. In severe cases, it can increase the noise of the fan. Summary of the Invention

[0005] One objective of this application is to provide an inverter heat dissipation structure that can solve at least one of the defects in the aforementioned background art.

[0006] Another objective of this application is to provide a design method for an inverter heat dissipation structure that can solve at least one of the defects in the above-mentioned background art.

[0007] To achieve at least one of the above objectives, the technical solution adopted in this application is as follows: an inverter heat dissipation structure, including a fan, a heat sink, and a fan housing; the height of the fan housing is greater than the height of the heat sink, so that the fan housing is connected to one side of the heat sink through an inclined top plate; the fan is installed in the fan housing, the area of ​​the top plate corresponding to the fan is a flow guiding area, and the top plate is provided with heat dissipation holes in the area outside the flow guiding area.

[0008] Preferably, the flow guiding area is rectangular, and the heat dissipation holes are disposed in two heat dissipation areas on both sides of the flow guiding area along the width direction of the top plate.

[0009] Preferably, the flow guiding area is rectangular, and the heat dissipation holes are disposed in two heat dissipation areas on both sides of the flow guiding area along the broadband direction of the top plate, and in a heat dissipation area on the upper side of the flow guiding area along the height direction of the top plate.

[0010] Preferably, a single heat dissipation hole is provided in a single heat dissipation area, and the area of ​​the heat dissipation hole is greater than 50% of the area of ​​a single side area.

[0011] Preferably, the distance from the edge of the heat dissipation hole near the flow guide area to the flow guide area is 5% to 10% of the width of the flow guide area, and the distance from the edge of each heat dissipation hole to the edge of the top plate is greater than or equal to the thickness of the top plate.

[0012] Preferably, a plurality of heat dissipation holes are arranged in a single heat dissipation area, and the total area of ​​all the heat dissipation holes is greater than 30% of the area of ​​a single side area.

[0013] Preferably, the plurality of heat dissipation holes are arranged in at least one group; the distance from the edge of each heat dissipation hole to the edge of the top plate and to the edge of the flow guiding area is greater than or equal to the thickness of the top plate; the distance between the edges of two adjacent groups of heat dissipation holes is greater than or equal to the thickness of the top plate.

[0014] A design method for an inverter heat dissipation structure includes the following design steps: selecting the tilt angle of the top plate according to the structural and installation dimensions of the heat sink and fan; projecting the fan onto the top plate after selecting the tilt angle to divide the airflow guiding area; and opening heat dissipation holes that meet the structural strength requirements of the top plate in other areas according to the divided airflow guiding area.

[0015] Preferably, the formula for calculating the inclination angle K of the top plate is: K = arctan[(ZS) / (LBH)];

[0016] In the formula, Z represents the distance between the fan and the heat sink, S represents the distance from the heat sink fins to the edge of the substrate, L represents the height of the fan, B represents the thickness of the heat sink substrate, and H represents the height of the heat sink fins.

[0017] When selecting the tilt angle of the top plate, the value of Z is adjusted so that the tilt angle K of the top plate is within the range of 45° to 90°.

[0018] Preferably, the specific division of the flow guide area includes the following process: projecting the fan hub onto the top plate to obtain an elliptical first projection surface; increasing the major axis of the first projection surface by 20% to 50% and using it as the diameter to draw a circle around the center of the first projection surface to obtain a second projection surface; drawing tangents to the second projection surface along the width and height directions of the top plate, and the area where the tangents intersect is the flow guide area.

[0019] Compared with the prior art, the beneficial effects of this application are as follows:

[0020] This application can efficiently utilize the lost airflow caused by the tilt of the ceiling without reducing the airflow required in the main area. This not only increases the working efficiency of the fan and reduces noise, but also cools the nearby heat source area. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the internal structure of the inverter in this application.

[0022] Figure 2 This is a partial schematic diagram of the fan delivering cooling airflow to the heat sink in this application.

[0023] Figure 3 This is a schematic diagram of one example of a single heat dissipation hole in a single-sided area of ​​this application.

[0024] Figure 4 A schematic diagram of another example of a single heat dissipation hole in a single-sided area in this application.

[0025] Figure 5 This is a schematic diagram of one example of a structure in which multiple heat dissipation holes are opened on one side of the application.

[0026] Figure 6 A schematic diagram of another example of a single-sided area with multiple heat dissipation holes in this application.

[0027] Figure 7 This is a schematic diagram illustrating the design steps of the inverter heat dissipation structure in this application.

[0028] In the figure: fan box 100, top plate 110, airflow guide area 111, heat dissipation hole 112, first projection surface 121, offset projection surface 122, second projection surface 123, fan 200, heat sink 300, base plate 310, fins 320, power board 400. Detailed Implementation

[0029] The present application will now be further described in conjunction with specific embodiments. It should be noted that, in the description of this specification, the use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0030] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0031] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0034] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0035] To facilitate understanding of the technical solution of this application, a brief description of the heat dissipation structure of a traditional inverter will be provided below. For example... Figure 1 and Figure 2 As shown, a traditional inverter heat dissipation structure includes a fan 200, a heat sink 300, and a fan housing 100. When selecting the fan 200 and heat sink 300, it is often impossible to ensure they have equal heights, and based on their heat dissipation efficiency, the fan 200 is usually taller than the heat sink 300. To ensure that the cooling airflow output by the fan 200 is primarily concentrated in the area corresponding to the fins 320 of the heat sink 300, the fan housing 100 for mounting the fan 200 is connected to the base plate 310 of the heat sink 300 via an inclined top plate 110. This top plate 110 forms a guide channel to direct most of the cooling airflow output by the fan 200 to the fins 320 of the heat sink 300.

[0036] However, the airflow output by fan 200 to the area directly opposite the top plate 110 (corresponding to) Figure 2 Analysis (using a thick dashed line) reveals that the inclined top plate 110 directs some airflow downwards and some upwards. Due to gaps between the fan 200 and the fan housing 100 during installation, especially at the top of the fan housing 100, these gaps cause the upward-directed airflow from the top plate 110 to flow back to the fan 200's inlet area, creating a localized airflow circulation zone. This localized airflow circulation zone disrupts the normal operation of the fan 200, reducing its efficiency and increasing its noise. Therefore, the technical solution of this application optimizes the heat dissipation efficiency of the fan 200 through structural design of the top plate 110.

[0037] One aspect of this application provides an inverter heat dissipation structure, such as Figure 1 As shown, one preferred embodiment includes a fan 200, a heatsink 300, and a fan housing 100. The height of the fan housing 100 is greater than the height of the heatsink 300, so that the fan housing 100 is connected to one side of the heatsink 300 via an inclined top plate 110. The fan 200 is mounted on the fan housing 100, and the area of ​​the top plate 110 corresponding to the fan 200 is a guide zone 111. The area of ​​the top plate 110 outside the guide zone 111 is provided with ventilation holes 112.

[0038] Understandably, the main function of the guide zone 111 on the top plate 110 is to guide the airflow from the fan 200 towards the top plate 110. The airflow from the fan 200 towards the top plate 110 can be considered a concentrated airflow column. When this airflow column contacts the top plate 110, the airflow velocity within the column is reduced due to the obstruction caused by the top plate 110, and it disperses outwards along the edge of the airflow column. At this time, the airflow velocity in the lower region of the airflow column near the radiator 300 is much lower than the airflow velocity of the portion of the airflow from the fan 200 directly opposite the radiator 300. Therefore, according to Bernoulli's principle, the airflow in the lower part of the airflow column will flow downwards towards the radiator 300 under pressure. The airflow in the upper part of the airflow column and the airflow dispersing along the width of the top plate 110 can flow out through the ventilation holes 112 opened in the area of ​​the top plate 110 excluding the guide zone 111, thereby avoiding the formation of local airflow circulation zones. This allows for efficient utilization of the airflow loss caused by the tilt of the top plate 110 without reducing the required airflow in the main area, which not only increases the working efficiency of the fan 200 but also reduces the working noise of the fan 200.

[0039] Meanwhile, those skilled in the art should understand that the function of the heat sink 300 is to transfer the heat generated by the power board 400 in the inverter from the inside to the outside during operation, and then dissipate it under the action of the cooling airflow of the fan 200. Specifically, the heat sink 300 includes a substrate 310 and fins 320; one side of the substrate 310 is used to mount the power board 400, and the other side of the substrate 310 is used to mount the fins 320. During the operation of the power board 400, the substrate 310 can absorb the heat generated by the power board 400 and transfer it to the fins 320. In the technical solution of this application, due to the opening of the heat dissipation hole 112, part of the airflow generated by the fan 200 can be output to the area of ​​the power board 400 along the heat dissipation hole 112, thereby dissipating heat from the heat source area formed by the power board 400.

[0040] It should be noted that in order to ensure that the airflow overflowing from the heat dissipation hole 112 to the power board 400 area can stably dissipate heat from the power board 400, a corresponding guide hole can also be opened on the side of the inverter housing opposite to the heat dissipation hole 112, so that a circulating heat dissipation channel can be formed between the heat dissipation hole 112 and the guide hole.

[0041] In this embodiment, as Figure 1As shown, the number of fans 200 used for inverter cooling is generally multiple, and these fans 200 can be arranged at equal intervals along the width of the top plate 110. This divides the top plate 110 into multiple local areas corresponding to each fan 200 along its width. Each local area has a corresponding airflow guide area 111 for each fan 200, and the remaining area within each local area, excluding the airflow guide area 111, is provided with heat dissipation holes 112. This ensures that all fans 200 can maximize their operating efficiency and reduce noise while maintaining a constant airflow.

[0042] It is understandable that the specific shape of the guide zone 111 can be rectangular or elliptical. For example... Figures 3 to 6 As shown, in this embodiment, the shape of the guide area 111 is preferably rectangular.

[0043] It should be understood that the fan 200 used for inverter cooling is generally an axial fan, meaning that the cross-sectional shape of the airflow blown by the fan 200 should theoretically be circular. Since the top plate 110 is inclined to the airflow direction of the fan 200, the contact area between the airflow blown by the fan 200 and the top plate 110 should theoretically be elliptical. However, the airflow of the fan 200 during actual operation is affected by various factors, such as interference from adjacent fans 200, causing the cross-sectional shape of the airflow to deviate from the theoretical shape. Therefore, in this embodiment, the guide area 111 is set as rectangular to increase the guide area.

[0044] In this embodiment, when the heat dissipation hole 112 is opened in the top plate 110, an excessively large opening area will reduce the airflow through the heat sink 300, thereby increasing the thermal risk of the inverter, and may also affect the structural strength of the top plate 110; therefore, the size and location of the heat dissipation hole 112 can be designed according to the specific area of ​​the airflow guiding area 111 located in the top plate 110. Specifically, as Figures 3 to 6 As shown, the airflow guiding area 111 of the top plate 110 corresponding to the fan 200 is generally located in the middle and lower part of the top plate 110. There are two main ways to limit the specific setting area of ​​the heat dissipation hole 112 based on the specific location of the airflow guiding area 111, which will be described in detail below.

[0045] Structure 1: such as Figures 3 to 6 As shown, if the top plate 110 is located in the upper part of the flow guiding area 111 and the heat dissipation hole 112 can meet the structural strength requirements of the top plate 110, then for the entire top plate 110, the heat dissipation hole 112 can be set in two heat dissipation areas on both sides of the flow guiding area 111 along the broadband direction of the top plate 110, and in the heat dissipation area above the flow guiding area 111 along the height direction of the top plate 110.

[0046] Structure 2: If the top plate 110 is located in the upper part of the flow guiding area 111 and the heat dissipation hole 112 cannot meet the structural strength requirements of the top plate 110, then the top plate 110 in the upper part of the flow guiding area 111 will not have heat dissipation holes 112. In this case, for the entire top plate 110, the heat dissipation holes 112 are set in two heat dissipation areas on both sides of the flow guiding area 111 along the width direction of the top plate 110.

[0047] It is understood that both of the above structures can meet the requirements of this application, and the specific choice can be made based on the specific installation structure of the top plate 110 and the fan 200. Whether the heat dissipation hole 112 meets the structural strength requirements of the top plate 110 also depends on the opening form of the heat dissipation hole 112, which will be described in detail below.

[0048] In this embodiment, the heat dissipation hole 112 can be opened in various ways, and will be explained in detail below through two specific examples.

[0049] Example 1: such as Figure 3 and Figure 4 As shown, a single heat dissipation hole 112 is provided in a single heat dissipation area, and the area of ​​the heat dissipation hole 112 is greater than 50% of the area of ​​a single side area.

[0050] Specifically, the design requirement for the heat dissipation holes 112 is to maximize the area of ​​the heat dissipation holes 112 while ensuring the structural strength of the top plate 110. For Example 1 above, to ensure the structural strength of the top plate 110, the distance F from the edge of the heat dissipation hole 112 near the flow guide area 111 to the flow guide area 111 needs to be 5% to 10% of the width of the flow guide area 111. This prevents the structural reduction caused by the hollowing out of the heat dissipation holes 112 from affecting the flow guide area 111. Simultaneously, the distance from the edge of each heat dissipation hole 112 to the edge of the top plate 110 is greater than or equal to the thickness of the top plate 110.

[0051] It is understandable that, such as Figure 3 and Figure 4 As shown, taking the heat dissipation holes 112 on both sides of the top plate 110 along the width direction of the guide zone 111 as an example, the distance from the edge of the heat dissipation hole 112 to the edge of the top plate 110 mainly includes the spacing P1 in the width direction of the top plate 110 and the spacing P2 in the height direction of the top plate 110. Therefore, when designing the heat dissipation hole 112, it is necessary to simultaneously satisfy that both P1 and P2 are greater than or equal to the thickness requirement of the top plate 110; if this is not satisfied, the form of opening a single heat dissipation hole 112 on one side is abandoned, and the following example two of the heat dissipation hole 112 opening form is selected.

[0052] It should be noted that for the heat dissipation hole 112 to be opened in the upper area of ​​the flow guide area 111 in the aforementioned structure two, P2 needs to be greater than twice the thickness of the sheet metal; that is, the distance from the edge of the heat dissipation hole 112 located in the upper area of ​​the flow guide area 111 to the upper edge of the top plate 110 and the upper edge of the flow guide area 111 both need to be greater than the thickness of the top plate 110; if this cannot be met, structure two cannot be set up and only structure one mentioned above can be used.

[0053] Example 2: such as Figure 5 and Figure 6 As shown, a single heat dissipation area is provided with a plurality of heat dissipation holes 112 arranged in a row, and the total area of ​​all heat dissipation holes 112 is greater than 30% of the area of ​​a single side area.

[0054] Specifically, for Example 2 above, in order to ensure the structural strength of the top plate 110, the multiple heat dissipation holes 112 are arranged in at least one group; the distance from the edge of each heat dissipation hole 112 to the edge of the top plate 110 and to the edge of the flow guiding area 111 is greater than or equal to the thickness of the top plate 110; the distance between the edges of two adjacent groups of heat dissipation holes 112 is greater than or equal to the thickness of the top plate 110.

[0055] It is understandable that the area of ​​the heat dissipation hole 112 in Example 2 is much smaller than that in Example 1. Therefore, the multiple heat dissipation holes 112 in Example 2 can form a dense heat dissipation structure. Thus, the hollow structure formed by a single heat dissipation hole 112 has a limited effect on reducing the strength of the top plate 110, and will be further weakened by the connection area between adjacent heat dissipation holes 112. Therefore, in Example 2, there is no need to design an offset for the spacing between the heat dissipation hole 112 and the flow guiding area 111; it is sufficient to include a spacing greater than or equal to the thickness of the top plate 110.

[0056] In this embodiment, the heat dissipation hole 112 that can achieve the above-mentioned heat dissipation function can have various specific structural shapes, such as Figures 3 to 6 As shown, ellipses, circles, and polygons can be used. Specifically, for Example 1 above, as... Figure 3 and Figure 4 As shown, since there is only one heat dissipation hole 112 on each side, the shape of the heat dissipation hole 112 is preferably rectangular or elliptical in order to maximize the area of ​​the heat dissipation hole 112. Regarding Example 2 above, as... Figure 5 and Figure 6 As shown, in order to ensure that the distribution of multiple heat dissipation holes 112 is uniform, the shape of the heat dissipation holes 112 is preferably circular or regular polygonal.

[0057] It is understandable that the shape of the heat dissipation holes 112 in different areas can be the same or different; provided that the structural strength of the top plate 110 is satisfied, the shape design of the heat dissipation holes 112 can be any combination.

[0058] Another aspect of this application provides a design method for an inverter heat dissipation structure, such as Figure 7 As shown, the design includes the following steps: The tilt angle of the top plate 110 is selected based on the structural and installation dimensions of the heat sink 300 and the fan 200. The fan 200 is projected onto the top plate 110 after the selected tilt angle, thus dividing the airflow guiding area 111. Based on the divided airflow guiding area 111, ventilation holes 112 that meet the structural strength requirements of the top plate 110 are opened in other areas of the top plate 110.

[0059] It is understandable that the airflow guiding area 111 is mainly obtained by projecting the structural dimensions of the fan 200. The specific position of the airflow guiding area 111 on the top plate 110 is affected by the tilt angle of the top plate 110. Therefore, the tilt angle of the top plate 110 needs to be determined before dividing the airflow guiding area 111. The tilt angle of the top plate 110 is mainly affected by the structural and installation dimensions of the fan 200 and the heatsink 300; therefore, the tilt angle of the top plate 110 can be selected based on the structural and installation dimensions of the fan 200 and the heatsink 300.

[0060] Specifically, such as Figure 2 As shown, the height of fan 200 is L, the thickness of fan 200 is W, the distance between fan 200 and heat sink 300 is Z, the height of fin 320 of heat sink 300 is H, the thickness of base plate 310 of heat sink 300 is B, and the distance from fin 320 of heat sink 300 to the edge of base plate 310 is S.

[0061] From the above geometric dimensions, we can obtain: tanK=(ZS) / (LHB); then the formula for calculating the inclination angle K of the top plate 110 is: K=arctan[(ZS) / (LBH)].

[0062] Based on the experience of those skilled in the art, the tilt angle K of the top plate 110 is generally within the range of 45° to 90°; if the tilt angle K is less than 45°, the working efficiency of the fan 200 will be greatly reduced. Therefore, with the structural dimensions of the fan 200 and the heat sink 300 already fixed, the tilt angle K of the top plate 110 is adjusted by adjusting the distance Z between the fan 200 and the heat sink 300. It should be noted that the value of the distance Z between the fan 200 and the heat sink 300 is generally Z = (1~3)W.

[0063] In this embodiment, the specific division of the guide zone 111 includes the following process: projecting the hub of the fan 200 onto the top plate 110 to obtain an elliptical first projection surface 121 (e.g., Figures 3 to 6(The solid-lined elliptical region shown). By increasing the major axis of the first projection plane 121 by 20% to 50% and using this as the diameter, a circle is drawn around the center of the first projection plane 121 to obtain the second projection plane 123 (as shown). Figures 3 to 6 (The solid-lined circular area shown). Tangents are drawn to the second projection plane 123 along the width and height directions of the top plate 110; the intersection of these tangents forms the guide zone 111 (e.g., ...). Figures 3 to 6 (The dotted-line area shown).

[0064] It is understandable that there are various specific implementation methods for increasing the major axis of the first projection surface 121 by 20% to 50%. For example, the length of the major axis of the first projection surface 121 can be directly increased; alternatively, the first projection surface 121 can be offset by an offset distance of 10% to 25% of the major axis of the first projection surface 121, thereby obtaining an elliptical offset projection surface 122 (e.g., Figures 3 to 6 (The dashed elliptical region shown in the figure) is then used as the diameter to draw a circle around its own center to obtain the desired second projection surface 123.

[0065] It should be understood that when projecting the fan 200 onto the top plate 110, the outer contour of the fan 200 can also be used for projection. However, considering that the outer contour shape of the fan 200 is not necessarily a complete circle due to the helical structure of the fan blades, the projected structure may be discontinuous. Since the hub of the fan 200 is a complete circular structure, its projection onto the top plate 110 will necessarily be a complete ellipse. Therefore, in this embodiment, the hub of the fan 200 is preferred for projection. Because the cross-sectional dimension of the airflow path generated by the fan 200 is larger than the hub size, in order to ensure that most of the airflow generated by the fan 200 can be guided to the area of ​​the heat sink 300, the first projection surface 121 needs to be offset. The specific offset size is related to the fan blade size of the fan 200, and those skilled in the art can choose according to actual needs. It is sufficient to ensure that more than 85% of the airflow output by the fan 200 that is blocked by the top plate 110 is located within the guiding area 111.

[0066] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A design method of an inverter heat dissipation structure, the inverter heat dissipation structure comprising a fan, a heat sink, and a fan box; a height of the fan box is greater than a height of the heat sink, so that the fan box is connected with one side of the heat sink through an inclined top plate; characterized in that, The fan is installed in the fan box, and the area of the top plate corresponding to the fan is a flow guide area, and the top plate is provided with heat dissipation holes in the area outside the flow guide area; the specific design includes the following processes: The inclination angle of the top plate is selected according to the structural size and mounting size of the heat sink and the fan; The fan profile of the top plate after the selected inclination angle is projected, and then the flow guide area is divided; According to the divided flow guide area, heat dissipation holes meeting the structural strength requirements of the top plate are opened in other areas of the top plate; The specific division of the flow guide area includes the following processes: The hub of the fan is projected to the top plate to obtain an elliptical first projection surface; After increasing the major axis of the first projection surface by 20% to 50%, the diameter is taken as a circle around the center of the first projection surface to obtain a second projection surface; The tangent lines of the second projection surface along the width direction and the height direction of the top plate are tangent, and the intersection area of the tangent lines is the flow guide area.

2. The design method of the inverter heat radiation structure according to claim 1, wherein The flow guide area is rectangular, and the heat dissipation holes are arranged in two heat dissipation areas on both sides of the flow guide area along the width direction of the top plate.

3. The design method of the inverter heat radiation structure according to claim 1, wherein The flow guide area is rectangular, and the heat dissipation holes are arranged in two heat dissipation areas on both sides of the flow guide area along the width direction of the top plate, and in a heat dissipation area above the flow guide area along the height direction of the top plate.

4. The design method of the inverter heat radiation structure according to claim 2 or 3, wherein A single heat dissipation hole is arranged in a single heat dissipation area, and the area of the heat dissipation hole is greater than 50% of the area of the single-sided area.

5. The design method of the inverter heat radiation structure according to claim 4, wherein The distance from the edge of the heat dissipation hole close to the edge of the flow guide area to the flow guide area is 5% to 10% of the width of the flow guide area, and the distance from the edge of each heat dissipation hole to the edge of the top plate is greater than or equal to the thickness of the top plate.

6. The design method of the inverter heat radiation structure according to claim 2 or 3, wherein A plurality of heat dissipation holes arranged in a single heat dissipation area, and the total area of all heat dissipation holes is greater than 30% of the area of the single-sided area.

7. The method of designing an inverter heat sink structure of claim 6, wherein, The plurality of heat dissipation holes are arranged in at least one group; the distance from the edge of each heat dissipation hole to the edge of the top plate and to the edge of the flow guide area is greater than or equal to the thickness of the top plate; the edge spacing between adjacent two groups of heat dissipation holes is greater than or equal to the thickness of the top plate.

8. The method of designing an inverter heat sink structure of claim 1, wherein, The inclination angle K of the top plate is calculated as K=arctan[(Z-S) / (L-B-H)]; In the formula, Z represents the distance between the fan and the heat sink, S represents the distance from the fin of the heat sink to the edge of the base plate, L represents the height of the fan, B represents the thickness of the base plate of the heat sink, and H represents the height of the fin of the heat sink; When the inclination angle of the top plate is selected, the value of Z is adjusted so that the inclination angle K of the top plate is within the range of 45° to 90°.

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