Electronic packaging method, electronic packaging structure, optical coupler and electronic equipment

Abstract

The present application is applicable to the field of semiconductor devices, and provides an electronic packaging method, an electronic packaging structure, an optical coupler and an electronic device. The electronic packaging method includes providing a fixing member; arranging a first electronic component and a second electronic component on the fixing member, wherein the first electronic component is used to couple with the second electronic component, the first electronic component has a first contact, and the second electronic component has a second contact; providing a first lead frame and a second lead frame; arranging the fixing member on at least one of the first lead frame and the second lead frame, and electrically connecting the first contact to the first lead frame, and electrically connecting the second contact to the second lead frame. The present application ensures that the relative position between the first electronic component and the second electronic component does not change by first fixing the first electronic component and the second electronic component on the fixing member, and then fixing the fixing member on at least one of the first lead frame and the second lead frame, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor devices, and in particular relates to an electronic packaging method, an electronic packaging structure, an optical coupler and an electronic device. Background Art

[0002] Optocoupler is also called photoelectric isolator or optocoupler, or optocoupler for short. It is a device that uses light as a medium to transmit electrical signals. It usually includes a transmitter and a receiver encapsulated in the same tube shell. The transmitter and the receiver are infrared transmitter chip and output photosensitive chip respectively. When the input end is powered by an electric signal, the infrared transmitter chip emits light, and the output photosensitive chip generates photocurrent after receiving the light, which flows out from the output end, thereby realizing the conversion of electricity, light and electricity. Optocouplers are widely used in digital circuits because of their small size, long life, no contact, strong anti-interference ability, high insulation strength between output and input, and one-way signal transmission.

[0003] In the process of preparing the optocoupler package, the optocoupler package needs to first fix one of the transmitter and the receiver, and then align it with the other before plastic sealing. However, this packaging method requires fixing the transmitter and the receiver separately, while taking into account that their relative positions will not change, which makes the packaging process complicated, the process difficult, and the production efficiency low. Summary of the invention

[0004] The embodiment of the present application provides an electronic packaging method, which aims to solve the problem of low production efficiency caused by complex packaging process and high process difficulty of existing electronic packaging structures.

[0005] The embodiment of the present application is implemented by providing an electronic packaging method, comprising:

[0006] providing a fixing member;

[0007] The first electronic component and the second electronic component are arranged on the fixing member, the first electronic component is used to couple with the second electronic component, the first electronic component has a first contact point, and the second electronic component has a second contact point;

[0008] providing a first lead frame and a second lead frame;

[0009] The fixing member is arranged on at least one of the first lead frame and the second lead frame, and the first contact point is electrically connected to the first lead frame, and the second contact point is electrically connected to the second lead frame.

[0010] Further, the step of arranging the first electronic component and the second electronic component on the fixing member includes:

[0011] The first electronic component and the second electronic component are arranged to face each other.

[0012] Furthermore, the fixing member is a transparent substrate, and the transparent substrate has a first surface and a second surface arranged opposite to the first surface;

[0013] The step of placing the first electronic component and the second electronic component on the fixture includes:

[0014] The first electronic component is arranged on the first surface, and the second electronic component is arranged on the second surface, the first electronic component and the second electronic component are arranged opposite to each other, the first electronic component is a light emitting component, and the second electronic component is a light receiving component;

[0015] The step of arranging the fixing member on at least one of the first lead frame and the second lead frame comprises:

[0016] The transparent substrate is disposed on at least one of the first lead frame and the second lead frame.

[0017] Furthermore, the first contact and the first lead frame, as well as the second contact and the second lead frame, are electrically connected via bonding wires.

[0018] Furthermore, the first lead frame and the second lead frame are both placed on the same plane.

[0019] In a second aspect, the present application further provides an electronic packaging structure, comprising:

[0020] a first electronic component having a first contact;

[0021] a second electronic component having a second contact;

[0022] A fixing member, on which the first electronic component and the second electronic component are both arranged, and the first electronic component is used to couple with the second electronic component;

[0023] a first lead frame; and

[0024] a second lead frame;

[0025] The fixing member is arranged on at least one of the first lead frame and the second lead frame, the first contact point is electrically connected to the first lead frame, and the second contact point is electrically connected to the second lead frame.

[0026] Further, the first electronic component is arranged opposite to the second electronic component.

[0027] Further, the fixing member is a transparent substrate, the transparent substrate has a first surface and a second surface arranged opposite to the first surface, the first surface is provided with a first mounting position, the second surface is provided with a second mounting position, and the second mounting position is arranged opposite to the first mounting position;

[0028] The first electronic component is a light-emitting component, and the light-emitting component is arranged at a first installation position;

[0029] The second electronic component is a light receiving component, and the light receiving component is arranged at the second installation position;

[0030] The transparent substrate is arranged on at least one of the first lead frame and the second lead frame.

[0031] Furthermore, at least one of the first lead frame and the second lead frame is provided with an arched portion, and the fixing member is mounted on the arched portion.

[0032] Furthermore, it also includes a shell, which is used to plastic-encapsulate the first electronic component, the second electronic component and the fixing piece, and the first lead frame and the second lead frame both partially extend out of the shell.

[0033] Furthermore, the first contact and the first lead frame, as well as the second contact and the second lead frame, are electrically connected via bonding wires.

[0034] Furthermore, the first lead frame and the second lead frame are both placed on the same plane.

[0035] In a third aspect, the present application also provides an optical coupler, comprising the electronic packaging structure as described above.

[0036] In a fourth aspect, the present application also provides an electronic device, comprising the electronic packaging structure as described above.

[0037] Beneficial effects of the present application: The electronic packaging method provided by the present application includes providing a fixing member; setting a first electronic component and a second electronic component on the fixing member, the first electronic component is used to couple with the second electronic component, the first electronic component has a first contact, and the second electronic component has a second contact; providing a first lead frame and a second lead frame; setting a fixing member on at least one of the first lead frame and the second lead frame, and electrically connecting the first contact to the first lead frame, and electrically connecting the second contact to the second lead frame. The present application ensures that the relative position between the first electronic component and the second electronic component does not change by first fixing the first electronic component and the second electronic component on the fixing member, and then fixing the fixing member on at least one of the first lead frame and the second lead frame, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a flow chart of an embodiment of the electronic packaging method provided by the present application;

[0039] Figure 2 It is a structural schematic diagram of an embodiment of the electronic packaging structure provided by the present application;

[0040] Figure 3 It is a structural schematic diagram of a fixing member fixed to a lead frame in one embodiment of an electronic packaging structure provided by the present application;

[0041] Figure 4It is a structural schematic diagram of another embodiment of the electronic packaging structure provided by the present application, in which a fixing member is fixed to a lead frame;

[0042] Figure 5 It is a schematic structural diagram of an embodiment of the electronic packaging structure provided by the present application including a housing.

[0043] Explanation of reference numerals: 100 - first electronic component, 200 - second electronic component, 300 - fixing member, 400 - first lead frame, 500 - second lead frame, 600 - bonding wire, 700 - housing. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0045] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference values ​​and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0050] The electronic packaging method provided by the present application includes providing a fixing member; setting a first electronic component and a second electronic component on the fixing member, the first electronic component is used to couple with the second electronic component, the first electronic component has a first contact, and the second electronic component has a second contact; providing a first lead frame and a second lead frame; setting the fixing member on at least one of the first lead frame and the second lead frame, and electrically connecting the first contact to the first lead frame, and electrically connecting the second contact to the second lead frame. The present application ensures that the relative position between the first electronic component and the second electronic component does not change by first fixing the first electronic component and the second electronic component on the fixing member, and then fixing the fixing member on at least one of the first lead frame and the second lead frame, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency.

[0051] like Figures 1 to 5 As shown, an embodiment of the present application provides an electronic packaging method, comprising:

[0052] S1100, providing a fixing member;

[0053] The electronic packaging method provided in the present application is used to package an electronic component, wherein the fixing member 300 can be regarded as a base of the electronic component for supporting other components.

[0054] S1200, disposing a first electronic component and a second electronic component on a fixing member, wherein the first electronic component is used to couple with the second electronic component, the first electronic component has a first contact point, and the second electronic component has a second contact point;

[0055] After the fixture 300 is provided, the first electronic component 100 and the second electronic component 200 are further provided and fixed on the fixture 300 to fix the positions of the first electronic component 100 and the second electronic component 200 and couple the first electronic component 100 and the second electronic component 200.

[0056] Optionally, the first electronic component 100 and the second electronic component 200 may be optical coupling components (such as light emitting elements and light receiving elements), inductors or capacitors, etc., which can achieve coupling between the two. In other words, the first electronic component 100 and the second electronic component 200 may be optically coupled, electromagnetically coupled, or energy coupled, without limitation. In other words, the electronic components formed by the first electronic component 100 and the second electronic component 200 may be optical couplers, inductors, transformers, capacitors, etc.

[0057] In some embodiments, the first electronic component 100 and the second electronic component 200 may be fixed to the fixing member 300 by adhesive, and the adhesive includes but is not limited to epoxy resin or other materials with adhesive properties.

[0058] Optionally, the first electronic component 100 has a first contact, which can be regarded as a pad of the first electronic component 100. Similarly, the second electronic component 200 has a second contact, which can be regarded as a pad of the second electronic component 200 for welding with an external circuit or other structural components to achieve electrical connection.

[0059] It should be noted that the number of the first contacts is greater than or equal to 1. For an optical coupling device, the number of the first contacts is two, and for an inductor, the number of the first contacts is also two. Of course, the number of the first electronic components 100 on the fixing member 300 can also be multiple, and the number of the corresponding first contacts is also multiple.

[0060] S1300, providing a first lead frame and a second lead frame;

[0061] S1400, disposing a fixing member on at least one of the first lead frame and the second lead frame, and electrically connecting the first contact point to the first lead frame, and electrically connecting the second contact point to the second lead frame.

[0062] After the first electronic component 100 and the second electronic component 200 are disposed on the fixture 300 , a first lead frame 400 and a second lead frame 500 are further provided. The first lead frame 400 and the second lead frame 500 refer to lead terminals of electronic components for electrical connection with an external circuit.

[0063] In some embodiments, the first lead frame 400 and the second lead frame 500 are both placed on the same plane to facilitate electrical connection with an external circuit.

[0064] During implementation, the fixing member 300 may be fixedly connected to the first lead frame 400 , or may be fixedly connected to the second lead frame 500 , or may be fixedly connected to both the first lead frame 400 and the second lead frame 500 .

[0065] The first contact is electrically connected to the first lead frame 400 , and the second contact is electrically connected to the second lead frame 500 . For example, the first contact is welded to the first lead frame 400 , and the second contact is welded to the second lead frame 500 .

[0066] As a possible implementation manner, solder such as solder paste may be further provided on the first contact and the second contact to facilitate welding connection between the contacts and the corresponding lead frames.

[0067] In some possible embodiments, the first contact point is electrically connected to the first lead frame 400 via a bonding wire 600 . Similarly, the second contact point is electrically connected to the second lead frame 500 via a bonding wire 600 .

[0068] It should be noted that the above method steps can be executed in the order of S1100 to S1400. Of course, they can also be executed in a non-order order, for example, first executing step S1300 and then executing step S1100, which will not be elaborated herein.

[0069] The electronic packaging method provided by the present application includes providing a fixing member 300; setting a first electronic component 100 and a second electronic component 200 on the fixing member 300, wherein the first electronic component 100 is used to couple with the second electronic component 200, the first electronic component 100 has a first contact, and the second electronic component 200 has a second contact; providing a first lead frame 400 and a second lead frame 500; setting the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, and electrically connecting the first contact with the first lead frame 400, and electrically connecting the second contact with the second lead frame 500. The present application ensures that the relative position between the first electronic component 100 and the second electronic component 200 does not change by first fixing the first electronic component 100 and the second electronic component 200 on the fixing member 300, and then fixing the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency.

[0070] In some embodiments, the step of placing the first electronic component 100 and the second electronic component 200 on the fixture 300 includes:

[0071] The first electronic component 100 and the second electronic component 200 are disposed opposite to each other.

[0072] The relative arrangement of the first electronic component 100 and the second electronic component 200 means that the positions of the first electronic component 100 and the second electronic component 200 at least partially overlap. For example, the first electronic component 100 is located on the first side surface of the fixing member 300, and the second electronic component 200 is located on the second side surface of the fixing member 300. Then, the projection of the first electronic component 100 on the second side surface of the fixing member 300 at least partially overlaps with the second electronic component 200, and preferably completely overlaps.

[0073] Through the above arrangement, the coupling degree between the first electronic component 100 and the second electronic component 200 can be ensured, and the energy loss can be reduced.

[0074] In some embodiments, the fixing member 300 is a transparent substrate having a first surface and a second surface disposed opposite to the first surface;

[0075] The step of placing the first electronic component 100 and the second electronic component 200 on the fixture 300 includes:

[0076] The first electronic component 100 is disposed on the first surface, and the second electronic component 200 is disposed on the second surface. The first electronic component 100 and the second electronic component 200 are disposed opposite to each other. The first electronic component 100 is a light-emitting component, and the second electronic component 200 is a light-receiving component.

[0077] The step of arranging the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500 includes:

[0078] The transparent substrate is disposed on at least one of the first lead frame 400 and the second lead frame 500 .

[0079] The electronic packaging method provided in the present application is used to package an optocoupler, wherein the first electronic component 100 is a light-emitting component, for example, the first electronic component 100 is a light-emitting diode or other components that can emit light, and the second electronic component 200 is a light-receiving component, for example, the second electronic component 200 is a photoresistor, a photodiode or a phototransistor.

[0080] The fixing member 300 adopts a transparent substrate, so that the light emitted by the light-emitting component can pass through the fixing member 300 and be transmitted to the light-receiving component, thereby realizing optical coupling between the light-emitting component and the light-receiving component.

[0081] Optionally, the transparent substrate includes at least one of a silicone material, an epoxy material, glass and sapphire.

[0082] Optionally, taking the light-emitting component as an example, the light-emitting diode generates light with a peak emission wavelength from 370nm to 490nm. For example, the wavelength of light emitted by the light-emitting diode is 370nm, 380nm, 390nm, 400nm, 410nm, 420nm, 430nm, 440nm, 450nm, 460nm or any value from 370nm to 490nm, without limitation.

[0083] In some embodiments, the present application further provides an electronic packaging structure, including:

[0084] A first electronic component 100 having a first contact;

[0085] A second electronic component 200 having a second contact;

[0086] A fixing member 300, on which the first electronic component 100 and the second electronic component 200 are both arranged, and the first electronic component 100 is used to couple with the second electronic component 200;

[0087] A first lead frame 400; and

[0088] A second lead frame 500;

[0089] The fixing member 300 is disposed on at least one of the first lead frame 400 and the second lead frame 500 , the first contact point is electrically connected to the first lead frame 400 , and the second contact point is electrically connected to the second lead frame 500 .

[0090] In implementation, the electronic packaging structure provided in the present application refers to a structure of an electronic component, wherein the fixing member 300 can be regarded as a base of the electronic component for supporting other components, for example, the fixing member 300 can support the first electronic component 100 and the second electronic component 200.

[0091] The first electronic component 100 and the second electronic component 200 are fixed to both sides of the fixing member 300 so that the first electronic component 100 and the second electronic component 200 are coupled.

[0092] Optionally, the first electronic component 100 and the second electronic component 200 may be optically coupled, electromagnetically coupled, or energy coupled, without limitation. For example, the first electronic component 100 and the second electronic component 200 may be optically coupled (e.g., a light emitting element and a light receiving element), inductors, capacitors, or other components that can achieve coupling between the two, without limitation.

[0093] In some embodiments, the first electronic component 100 and the second electronic component 200 may be fixed to the fixing member 300 by adhesive, and the adhesive includes but is not limited to epoxy resin or other materials with adhesive properties.

[0094] Optionally, the first electronic component 100 has a first contact, which can be regarded as a pad of the first electronic component 100. Similarly, the second electronic component 200 has a second contact, which can be regarded as a pad of the second electronic component 200 for welding with an external circuit or other structural components to achieve electrical connection.

[0095] The electronic packaging structure further includes a first lead frame 400 and a second lead frame 500 , wherein the first lead frame 400 and the second lead frame 500 are lead terminals of the electronic component for electrically connecting to an external circuit.

[0096] In some embodiments, the first lead frame 400 and the second lead frame 500 are both placed on the same plane to facilitate electrical connection with an external circuit.

[0097] During implementation, the fixing member 300 may be fixedly connected to the first lead frame 400 , or may be fixedly connected to the second lead frame 500 , or may be fixedly connected to both the first lead frame 400 and the second lead frame 500 .

[0098] The first contact is electrically connected to the first lead frame 400 , and the second contact is electrically connected to the second lead frame 500 . For example, the first contact is welded to the first lead frame 400 , and the second contact is welded to the second lead frame 500 .

[0099] As a possible implementation manner, solder such as solder paste may be further provided on the first contact and the second contact to facilitate welding connection between the contacts and the corresponding lead frames.

[0100] In some possible embodiments, the first contact point is electrically connected to the first lead frame 400 via a bonding wire 600 . Similarly, the second contact point is electrically connected to the second lead frame 500 via a bonding wire 600 .

[0101] The electronic packaging method provided by the present application includes providing a fixing member 300; setting a first electronic component 100 and a second electronic component 200 on the fixing member 300, wherein the first electronic component 100 is used to couple with the second electronic component 200, the first electronic component 100 has a first contact, and the second electronic component 200 has a second contact; providing a first lead frame 400 and a second lead frame 500; setting the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, and electrically connecting the first contact with the first lead frame 400, and electrically connecting the second contact with the second lead frame 500. The present application ensures that the relative position between the first electronic component 100 and the second electronic component 200 does not change by first fixing the first electronic component 100 and the second electronic component 200 on the fixing member 300, and then fixing the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency.

[0102] In some embodiments, the first electronic component 100 is disposed opposite to the second electronic component 200 .

[0103] The relative arrangement of the first electronic component 100 and the second electronic component 200 means that the positions of the first electronic component 100 and the second electronic component 200 at least partially overlap. For example, the first electronic component 100 is located on the first side surface of the fixing member 300, and the second electronic component 200 is located on the second side surface of the fixing member 300. Then, the projection of the first electronic component 100 on the second side surface of the fixing member 300 at least partially overlaps with the second electronic component 200, and preferably completely overlaps.

[0104] Through the above arrangement, the coupling degree between the first electronic component 100 and the second electronic component 200 can be ensured, and the energy loss can be reduced.

[0105] In some embodiments, the fixing member 300 is a transparent substrate, the transparent substrate has a first surface and a second surface arranged opposite to the first surface, the first surface is provided with a first mounting position, the second surface is provided with a second mounting position, and the second mounting position is arranged opposite to the first mounting position;

[0106] The first electronic component 100 is a light-emitting component, and the light-emitting component is arranged at a first installation position;

[0107] The second electronic component 200 is a light receiving component, and the light receiving component is arranged at the second installation position;

[0108] The transparent substrate is disposed on at least one of the first lead frame 400 and the second lead frame 500 .

[0109] The electronic packaging structure provided in the present application is an optocoupler, wherein the first electronic component 100 is a light-emitting component, for example, the first electronic component 100 is a light-emitting diode or other components that can emit light, and the second electronic component 200 is a light-receiving component, for example, the second electronic component 200 is a photoresistor, a photodiode or a phototransistor.

[0110] The fixing member 300 adopts a transparent substrate, so that the light emitted by the light-emitting component can pass through the fixing member 300 and be transmitted to the light-receiving component, thereby realizing optical coupling between the light-emitting component and the light-receiving component.

[0111] Optionally, the transparent substrate includes at least one of a silicone material, an epoxy material, glass and sapphire.

[0112] Optionally, taking the light-emitting component as an example, the light-emitting diode generates light with a peak emission wavelength from 370nm to 490nm. For example, the wavelength of light emitted by the light-emitting diode is 370nm, 380nm, 390nm, 400nm, 410nm, 420nm, 430nm, 440nm, 450nm, 460nm or any value from 370nm to 490nm, without limitation.

[0113] In some embodiments, at least one of the first lead frame 400 and the second lead frame 500 is provided with an arched portion, and the fixing member 300 is mounted on the arched portion.

[0114] The arched portion can better support the fixing member 300 , so that the fixing member 300 , the first electronic component 100 and the second electronic component 200 are suspended in the air, which is convenient for wiring and welding.

[0115] In some embodiments, the present application also provides a housing 700 , which is used to encapsulate the first electronic component 100 , the second electronic component 200 and the fixing member 300 , and the first lead frame 400 and the second lead frame 500 both partially extend out of the housing 700 .

[0116] In practice, the housing 700 may be made of plastic, which is inexpensive and can be freely shaped.

[0117] Optionally, the housing 700 may also be made of a combination of aluminum alloy and plastic, wherein the aluminum alloy material has good mechanical properties and corrosion resistance, which can ensure the stability and corrosion resistance of electronic components in high temperature and high pressure environments, and also has good thermal conductivity, so that the electronic components can quickly dissipate heat during use and are not prone to overheating.

[0118] In some embodiments, one end of the first pin rack 400 and the second pin rack 500 both extend out of the outer shell 700. Since the outer shell 700 has a certain thickness, the free ends of the first pin rack 400 and the second pin rack 500 away from the outer shell 700 can be bent and cut so that the free ends of the pin racks are flush with the outer surface of the outer shell 700. In this way, the free ends of the pin racks can be better electrically connected to the pads on the PCB (Printed Circuit Board) or the lines of other circuits.

[0119] As a possible implementation, the free end of the pin rack can also be designed to extend beyond the outer surface of the housing 700. When the electronic component is installed on the circuit board, the free end of the pin rack is electrically connected to the pad of the circuit board and props up the housing 700 to ensure that the electronic component has sufficient heat dissipation space.

[0120] In some optional embodiments, the present application also provides an optical coupler, including the electronic packaging structure as described above.

[0121] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the optical coupler described above can refer to the corresponding structure and implementation principle in the aforementioned embodiments, and will not be repeated here.

[0122] The electronic packaging method provided by the present application includes providing a fixing member 300; setting a first electronic component 100 and a second electronic component 200 on the fixing member 300, wherein the first electronic component 100 is used to couple with the second electronic component 200, the first electronic component 100 has a first contact, and the second electronic component 200 has a second contact; providing a first lead frame 400 and a second lead frame 500; setting the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, and electrically connecting the first contact with the first lead frame 400, and electrically connecting the second contact with the second lead frame 500. The present application ensures that the relative position between the first electronic component 100 and the second electronic component 200 does not change by first fixing the first electronic component 100 and the second electronic component 200 on the fixing member 300, and then fixing the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency.

[0123] In some optional embodiments, the present application also provides an electronic device, including the electronic packaging structure as described above.

[0124] During implementation, electronic equipment includes but is not limited to communication equipment, smart devices, power supplies, or related devices such as automotive electrical equipment, medical equipment, and household appliances, without specific limitation.

[0125] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the electronic device described above can refer to the corresponding structure and implementation principle in the aforementioned embodiments, and will not be repeated here.

[0126] The electronic packaging method provided by the present application includes providing a fixing member 300; setting a first electronic component 100 and a second electronic component 200 on the fixing member 300, wherein the first electronic component 100 is used to couple with the second electronic component 200, the first electronic component 100 has a first contact, and the second electronic component 200 has a second contact; providing a first lead frame 400 and a second lead frame 500; setting the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, and electrically connecting the first contact with the first lead frame 400, and electrically connecting the second contact with the second lead frame 500. The present application ensures that the relative position between the first electronic component 100 and the second electronic component 200 does not change by first fixing the first electronic component 100 and the second electronic component 200 on the fixing member 300, and then fixing the fixing member 300 on at least one of the first lead frame 400 and the second lead frame 500, thereby simplifying the packaging process, reducing the difficulty of the packaging process, and improving production efficiency.

[0127] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An electronic packaging method, characterized in that: include: providing a fixing member; Disposing a first electronic component and a second electronic component on the fixing member, wherein the first electronic component is used to couple with the second electronic component, the first electronic component has a first contact point, and the second electronic component has a second contact point; providing a first lead frame and a second lead frame; The fixing member is disposed on at least one of the first lead frame and the second lead frame, and the first contact is electrically connected to the first lead frame, and the second contact is electrically connected to the second lead frame.

2. The electronic packaging method according to claim 1, characterized in that: The step of arranging the first electronic component and the second electronic component on the fixing member comprises: The first electronic component and the second electronic component are arranged to face each other.

3. The electronic packaging method according to claim 1, characterized in that: The fixing member is a transparent substrate, and the transparent substrate has a first surface and a second surface arranged opposite to the first surface; The step of arranging the first electronic component and the second electronic component on the fixing member comprises: The first electronic component is disposed on the first surface, and the second electronic component is disposed on the second surface, the first electronic component and the second electronic component are disposed opposite to each other, the first electronic component is a light emitting component, and the second electronic component is a light receiving component; The step of arranging the fixing member on at least one of the first lead frame and the second lead frame comprises: The transparent substrate is disposed on at least one of the first lead frame and the second lead frame.

4. The electronic packaging method according to claim 1, characterized in that: The first contact and the first lead frame, as well as the second contact and the second lead frame, are electrically connected via bonding wires.

5. The electronic packaging method according to claim 1, characterized in that: The first lead frame and the second lead frame are both placed on the same plane.

6. An electronic packaging structure, characterized in that: include: a first electronic component having a first contact; a second electronic component having a second contact; A fixing member, the first electronic component and the second electronic component are both arranged on the fixing member, and the first electronic component is used to couple with the second electronic component; a first lead frame; and a second lead frame; The fixing member is disposed on at least one of the first lead frame and the second lead frame, the first contact point is electrically connected to the first lead frame, and the second contact point is electrically connected to the second lead frame.

7. The electronic packaging structure according to claim 6, characterized in that: The first electronic component is disposed opposite to the second electronic component.

8. The electronic packaging structure according to claim 6, characterized in that: The fixing member is a transparent substrate, the transparent substrate has a first surface and a second surface arranged opposite to the first surface, the first surface is provided with a first mounting position, the second surface is provided with a second mounting position, and the second mounting position is arranged opposite to the first mounting position; The first electronic component is a light-emitting component, and the light-emitting component is arranged at the first mounting position; The second electronic component is a light receiving component, and the light receiving component is arranged at the second mounting position; The transparent substrate is disposed on at least one of the first lead frame and the second lead frame.

9. The electronic packaging structure according to claim 6, characterized in that: At least one of the first lead frame and the second lead frame is provided with an arched portion, and the fixing member is mounted on the arched portion.

10. The electronic packaging structure according to claim 6, characterized in that: It also includes a shell, which is used to plastic-encapsulate the first electronic component, the second electronic component and the fixing member, and the first lead frame and the second lead frame both partially extend out of the shell.

11. The electronic packaging structure according to claim 6, characterized in that: The first contact and the first lead frame, as well as the second contact and the second lead frame, are electrically connected via bonding wires.

12. The electronic packaging structure according to claim 6, characterized in that: The first lead frame and the second lead frame are both placed on the same plane.

13. An optical coupler, characterized in that: The electronic packaging structure comprises the electronic packaging structure as claimed in any one of claims 6 to 12.

14. An electronic device, characterized in that: The electronic packaging structure comprises the electronic packaging structure as claimed in any one of claims 6 to 12.

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