Super-flexible packaging structure of perovskite photoelectric component and packaging method and application of super-flexible packaging structure

Abstract

The invention belongs to the technical field of photovoltaic cells, and relates to a super-flexible packaging structure of a perovskite photoelectric assembly and a packaging method and application of the super-flexible packaging structure, and the super-flexible packaging structure comprises a first packaging assembly and a second packaging assembly which are arranged on the surfaces of the two sides of a flexible module respectively; wherein the first packaging assembly comprises a cloth-based substrate, a first adhesive film and a first inorganic barrier layer which are arranged in a stacked manner; the second packaging assembly comprises a polymer film, a second adhesive film and a second inorganic barrier layer which are stacked; the first inorganic barrier layer and the second inorganic barrier layer are arranged on the surfaces of the two sides of the flexible module respectively; the flexible module is a perovskite module prepared based on a flexible conductive substrate. According to the super-flexible packaging structure provided by the invention, by virtue of a synergistic effect between the inorganic barrier layer and the adhesive film, the flexibility, the foldability and the portability of the packaging structure are remarkably improved while the water-oxygen barrier property and the weather resistance of the super-flexible packaging structure are ensured to be at an excellent level.

Description

Technical Field

[0001] The present invention belongs to the technical field of photovoltaic cells and relates to a perovskite photoelectric component, and in particular to an ultra-flexible packaging structure of a perovskite photoelectric component and a packaging method and application thereof. Background Art

[0002] Perovskite photovoltaic cells have shown great commercial application potential due to their excellent theoretical photoelectric conversion efficiency, simple preparation process and flexible preparation characteristics, especially in the fields of wearable devices and portable photovoltaics. However, the sensitivity of perovskite materials to moisture and oxygen and their lack of stability have put forward more stringent requirements on packaging technology.

[0003] At present, the packaging technology of perovskite photovoltaic modules is mainly divided into two categories: rigid packaging and flexible packaging. Among them, rigid packaging usually includes cover glass, substrate glass, edge sealant, adhesive film and module active layer (covering transparent electrode, electron transport layer, perovskite layer, hole transport layer, metal electrode and other functional layers). In contrast, flexible packaging includes a double-layer water and oxygen barrier film / layer (such as a polymer water and oxygen barrier film or a flexible glass layer), an adhesive film (such as POE, EVA, PVB film, etc.), an edge sealant (mostly butyl adhesive) and a flexible module (that is, a photovoltaic module with a perovskite active layer constructed on a flexible conductive substrate).

[0004] However, rigid packaging is not suitable for wearable devices due to its limited portability; although the water and oxygen barrier films commonly used in flexible packaging are mostly made of PET, PEN, CPI or their composite materials, they still need to balance weather resistance, water and oxygen barrier properties with flexibility, foldability and portability, and these characteristics are still insufficient in practical applications. In addition, flexible glass also needs to be improved in terms of softness and bending resistance, which affects the user experience of flexible perovskite photovoltaic products.

[0005] It can be seen that how to provide a packaging method for perovskite photovoltaic components that can improve the flexibility, foldability and portability of the packaging structure while ensuring its water and oxygen barrier properties and weather resistance are at excellent levels has become an urgent problem that technical personnel in this field need to solve. Summary of the invention

[0006] In view of the shortcomings of the prior art, the object of the present invention is to provide an ultra-flexible packaging structure of a perovskite optoelectronic component and a packaging method and application thereof. The ultra-flexible packaging structure, by means of the synergistic effect between the inorganic barrier layer and the adhesive film, significantly improves the flexibility, foldability and portability of the packaging structure while ensuring its water and oxygen barrier and weather resistance are at excellent levels.

[0007] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions: In a first aspect, the present invention provides an ultra-flexible packaging structure of a perovskite optoelectronic component, wherein the ultra-flexible packaging structure comprises a first packaging component and a second packaging component respectively disposed on two side surfaces of a flexible module.

[0008] Among them, the first packaging component includes a stacked cloth-based substrate, a first adhesive film and a first inorganic barrier layer; the second packaging component includes a stacked polymer film, a second adhesive film and a second inorganic barrier layer; the first inorganic barrier layer and the second inorganic barrier layer are respectively arranged on both side surfaces of the flexible module.

[0009] The flexible module is a perovskite module prepared based on a flexible conductive substrate.

[0010] Compared with traditional single packaging materials, the ultra-flexible packaging structure provided by the present invention relies on the extremely low water and oxygen permeability of the inorganic barrier layer and the adhesive film. Through the synergistic effect between the two, it effectively meets the stringent requirements of perovskite optoelectronic components for water and oxygen barrier properties. In addition, the cloth-based substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the packaging structure, fully meets the outdoor use requirements of photovoltaic products, and enhances the practicality and product competitiveness of perovskite optoelectronic components in wearable and portable applications.

[0011] Preferably, the materials of the first inorganic barrier layer and the second inorganic barrier layer independently include any one or a combination of at least two of metal oxides, non-metal oxides or nitrides, more preferably metal oxides, and even more preferably aluminum oxide.

[0012] Preferably, the thickness of the first inorganic barrier layer and the second inorganic barrier layer are independently 10-50 nm.

[0013] Preferably, the first adhesive film and the second adhesive film independently include any one of EVA (polyethylene-polyvinyl acetate copolymer) adhesive film, POE (polyolefin elastomer) adhesive film or PVB (polyvinyl butyral) adhesive film.

[0014] Preferably, the thickness of the first adhesive film and the second adhesive film are independently 0.01-0.7 mm.

[0015] Preferably, the polymer film comprises an ETFE (ethylene-tetrafluoroethylene copolymer) film.

[0016] Preferably, the polymer film has a thickness of 20-80 μm.

[0017] Preferably, the battery structure of the flexible module includes a pin structure or a nip structure.

[0018] In a second aspect, the present invention provides a packaging method for a perovskite photovoltaic component, wherein the packaging method is used to form an ultra-flexible packaging structure as described in the first aspect, and the packaging method comprises the following steps: (1) Depositing inorganic barrier layers on both side surfaces of the flexible module to obtain an intermediate module; (2) The cloth base substrate, the first adhesive film, the intermediate module, the second adhesive film and the polymer film are sequentially stacked and vacuum-laminated at high temperature to obtain an ultra-flexible packaging structure.

[0019] Preferably, the deposition method of the inorganic barrier layer in step (1) includes any one of atomic layer deposition, physical vapor deposition or chemical vapor deposition, and atomic layer deposition is further preferred.

[0020] Preferably, the deposition temperature of the atomic layer deposition is 100-150°C.

[0021] Preferably, the lamination temperature of the high-temperature vacuum lamination in step (2) is 100-140°C.

[0022] Preferably, the applied pressure of the high temperature vacuum lamination in step (2) is 40-80 kPa.

[0023] Preferably, the lamination time of the high-temperature vacuum lamination in step (2) is 10-30 minutes.

[0024] In a third aspect, the present invention provides a perovskite photovoltaic cell, wherein the optoelectronic component in the perovskite photovoltaic cell comprises the ultra-flexible packaging structure as described in the first aspect.

[0025] Compared with the prior art, the present invention has the following beneficial effects: Compared with traditional single packaging materials, the ultra-flexible packaging structure provided by the present invention relies on the extremely low water and oxygen permeability of the inorganic barrier layer and the adhesive film. Through the synergistic effect between the two, it effectively meets the stringent requirements of perovskite optoelectronic components for water and oxygen barrier properties. In addition, the cloth-based substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the packaging structure, fully meets the outdoor use requirements of photovoltaic products, and enhances the practicality and product competitiveness of perovskite optoelectronic components in wearable and portable applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an exploded diagram of the ultra-flexible packaging structure provided by the present invention.

[0027] Among them: 10 - first packaging component; 11 - cloth-based substrate; 12 - first adhesive film; 13 - first inorganic barrier layer; 20 - second packaging component; 21 - polymer film; 22 - second adhesive film; 23 - second inorganic barrier layer; 30 - flexible module. DETAILED DESCRIPTION

[0028] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0029] A certain embodiment of the present invention provides an ultra-flexible packaging structure of a perovskite optoelectronic component, wherein the ultra-flexible packaging structure includes a first packaging component and a second packaging component respectively arranged on two side surfaces of a flexible module.

[0030] Among them, the first packaging component includes a stacked cloth-based substrate, a first adhesive film and a first inorganic barrier layer; the second packaging component includes a stacked polymer film, a second adhesive film and a second inorganic barrier layer; the first inorganic barrier layer and the second inorganic barrier layer are respectively arranged on both side surfaces of the flexible module.

[0031] The flexible module is a perovskite module prepared based on a flexible conductive substrate.

[0032] Compared with traditional single packaging materials, the ultra-flexible packaging structure provided by the present invention relies on the extremely low water and oxygen permeability of the inorganic barrier layer and the adhesive film. Through the synergistic effect between the two, it effectively meets the stringent requirements of perovskite optoelectronic components for water and oxygen barrier properties. In addition, the cloth-based substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the packaging structure, fully meets the outdoor use requirements of photovoltaic products, and enhances the practicality and product competitiveness of perovskite optoelectronic components in wearable and portable applications.

[0033] It should be emphasized that the inorganic barrier layer and the adhesive film in the present invention cannot be used alone: ​​if the inorganic barrier layer is used alone, it is very susceptible to damage by a large amount of water and oxygen in the air, causing the packaging structure to lose its water and oxygen barrier properties; if the adhesive film is used alone, it also cannot meet the water and oxygen barrier requirements of the perovskite photovoltaic component. Therefore, the present invention uses both the inorganic barrier layer and the adhesive film, and with the synergistic effect between the two, it ultimately significantly improves the water and oxygen barrier properties of the packaging structure.

[0034] In certain embodiments, the materials of the first inorganic barrier layer and the second inorganic barrier layer independently include any one of metal oxides, non-metal oxides or nitrides, or a combination of at least two of them. Typical but non-limiting combinations include a combination of metal oxides and non-metal oxides, a combination of non-metal oxides and nitrides, a combination of metal oxides and nitrides, or a combination of metal oxides, non-metal oxides and nitrides. Metal oxides are more preferred, and aluminum oxide is even more preferred.

[0035] In some embodiments, the thickness of the first inorganic barrier layer and the second inorganic barrier layer are independently 10-50 nm, for example, 10 nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm or 50 nm, but are not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0036] In the present invention, the thickness of the first inorganic barrier layer and the second inorganic barrier layer needs to be limited to a reasonable range. When the thickness is less than 10nm, the water and oxygen barrier property of the packaging structure is significantly deteriorated; when the thickness is greater than 50nm, the deposition time is too long, and the long-term high temperature environment is likely to cause structural damage to the perovskite module.

[0037] In some embodiments, the first adhesive film and the second adhesive film independently include any one of EVA (polyethylene-polyvinyl acetate copolymer) adhesive film, POE (polyolefin elastomer) adhesive film or PVB (polyvinyl butyral) adhesive film.

[0038] In some embodiments, the thickness of the first adhesive film and the second adhesive film are independently 0.01-0.7 mm, for example, 0.01 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm or 0.7 mm, but are not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0039] In the present invention, the thickness of the first adhesive film and the second adhesive film is directly related to the flexibility. When the thickness exceeds 0.7 mm, the bendability of the adhesive film is not ideal.

[0040] In certain embodiments, the polymer film includes an ETFE (ethylene tetrafluoroethylene) film.

[0041] In some embodiments, the thickness of the polymer film is 20-80 μm, for example, it can be 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm or 80 μm, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0042] In some embodiments, the battery structure of the flexible module includes a pin structure or a nip structure.

[0043] In the present invention, the flexible module is a perovskite module prepared based on a flexible conductive substrate conventionally used in the art, that is, the ultra-flexible packaging structure provided by the present invention is suitable for any type of flexible module as long as the corresponding function of the flexible module can be achieved. Therefore, the specific structure of the flexible module is not particularly limited here.

[0044] An embodiment of the present invention further provides a packaging method for a perovskite photovoltaic component, wherein the packaging method is used to form the ultra-flexible packaging structure described in any of the above embodiments, and the packaging method comprises the following steps: (1) Depositing inorganic barrier layers on both side surfaces of the flexible module to obtain an intermediate module; (2) The cloth base substrate, the first adhesive film, the intermediate module, the second adhesive film and the polymer film are sequentially stacked and vacuum-laminated at high temperature to obtain an ultra-flexible packaging structure.

[0045] In some embodiments, the deposition method of the inorganic barrier layer in step (1) includes any one of atomic layer deposition, physical vapor deposition or chemical vapor deposition, and atomic layer deposition is more preferably used.

[0046] In some embodiments, the deposition temperature of the atomic layer deposition is 100-150°C, for example, it can be 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C or 150°C, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0047] In the present invention, the deposition temperature of the atomic layer deposition needs to be limited to a reasonable range. When the deposition temperature is lower than 100°C, the inorganic barrier layer obtained has many defects, thereby significantly reducing the water and oxygen barrier properties of the packaging structure; when the deposition temperature is higher than 150°C, it is easy to cause structural damage to the perovskite module.

[0048] In some embodiments, the lamination temperature of the high temperature vacuum lamination in step (2) is 100-140°C, for example, 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C or 140°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0049] In some embodiments, the applied pressure of the high temperature vacuum lamination in step (2) is 40-80 kPa, for example, 40 kPa, 45 kPa, 50 kPa, 55 kPa, 60 kPa, 65 kPa, 70 kPa, 75 kPa or 80 kPa, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0050] In some embodiments, the lamination time of the high temperature vacuum lamination in step (2) is 10-30 min, for example, it can be 10 min, 12 min, 14 min, 16 min, 18 min, 20 min, 22 min, 24 min, 26 min, 28 min or 30 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0051] A certain embodiment of the present invention further provides a perovskite photovoltaic cell, wherein the optoelectronic component of the perovskite photovoltaic cell comprises the ultra-flexible packaging structure described in any of the above embodiments.

[0052] The numerical range described in the present invention not only includes the point values ​​listed above, but also includes any point values ​​between the above numerical ranges that are not listed. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range. Example 1

[0053] This embodiment provides an ultra-flexible packaging structure of a perovskite photovoltaic component, such as Figure 1 As shown, the ultra-flexible packaging structure includes a first packaging component 10 and a second packaging component 20 respectively disposed on both side surfaces of a flexible module 30 .

[0054] Among them, the first packaging component 10 includes a stacked cloth-based substrate 11, a first adhesive film 12 and a first inorganic barrier layer 13; the second packaging component 20 includes a stacked polymer film 21, a second adhesive film 22 and a second inorganic barrier layer 23; the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are respectively arranged on both side surfaces of the flexible module 30; the flexible module 30 is a perovskite module prepared based on a flexible conductive substrate.

[0055] Specifically, the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are both made of aluminum oxide, and are both 20 nm thick; the first adhesive film 12 and the second adhesive film 22 are both EVA adhesive films, and are both 0.3 mm thick; the polymer film 21 is an ETFE high-transmittance film, and is 50 μm thick.

[0056] The battery structure of the flexible module 30 used in this embodiment is a pin structure, including a stacked PET conductive substrate, a hole transport layer (Meo-4PACZ), a perovskite layer, a passivation layer (F-PEAI), an electron transport layer (C60 and BCP), and an electrode layer (copper electrode).

[0057] This embodiment also provides a packaging method for a perovskite photovoltaic component, and the packaging method is used to form the above-mentioned ultra-flexible packaging structure, which specifically includes the following steps: (1) using an atomic layer deposition device to deposit inorganic barrier layers (a first inorganic barrier layer 13 and a second inorganic barrier layer 23) on both side surfaces of the flexible module 30, respectively, and controlling the deposition temperature to be 100° C. to obtain an intermediate module; (2) The cloth-based substrate 11, the first adhesive film 12, the intermediate module, the second adhesive film 22 and the polymer film 21 are stacked in order and subjected to high-temperature vacuum lamination in a vacuum laminator. The lamination temperature is controlled to be 120°C, the applied pressure is 60 kPa, and the lamination time is 20 min to obtain an ultra-flexible packaging structure. Example 2

[0058] This embodiment provides an ultra-flexible packaging structure of a perovskite photovoltaic component, such as Figure 1 As shown, the ultra-flexible packaging structure includes a first packaging component 10 and a second packaging component 20 respectively disposed on both side surfaces of a flexible module 30 .

[0059] Among them, the first packaging component 10 includes a stacked cloth-based substrate 11, a first adhesive film 12 and a first inorganic barrier layer 13; the second packaging component 20 includes a stacked polymer film 21, a second adhesive film 22 and a second inorganic barrier layer 23; the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are respectively arranged on both side surfaces of the flexible module 30; the flexible module 30 is a perovskite module prepared based on a flexible conductive substrate.

[0060] Specifically, the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are both made of aluminum oxide, and both have a thickness of 10 nm; the first adhesive film 12 and the second adhesive film 22 are both POE adhesive films, and both have a thickness of 0.1 mm; the polymer film 21 is an ETFE high-transmittance film, and has a thickness of 20 μm.

[0061] The battery structure of the flexible module 30 used in this embodiment is a pin structure, including a stacked PET conductive substrate, a hole transport layer (Meo-4PACZ), a perovskite layer, a passivation layer (F-PEAI), an electron transport layer (C60 and BCP), and an electrode layer (copper electrode).

[0062] This embodiment also provides a packaging method for a perovskite photovoltaic component, and the packaging method is used to form the above-mentioned ultra-flexible packaging structure, which specifically includes the following steps: (1) using an atomic layer deposition device to deposit inorganic barrier layers (a first inorganic barrier layer 13 and a second inorganic barrier layer 23) on both side surfaces of the flexible module 30, respectively, and controlling the deposition temperature to be 120° C. to obtain an intermediate module; (2) The cloth-based substrate 11, the first adhesive film 12, the intermediate module, the second adhesive film 22 and the polymer film 21 are stacked in order and subjected to high-temperature vacuum lamination in a vacuum laminator. The lamination temperature is controlled to be 100°C, the applied pressure is 40 kPa, and the lamination time is 30 min to obtain an ultra-flexible packaging structure. Example 3

[0063] This embodiment provides an ultra-flexible packaging structure of a perovskite photovoltaic component, such as Figure 1 As shown, the ultra-flexible packaging structure includes a first packaging component 10 and a second packaging component 20 respectively disposed on both side surfaces of a flexible module 30 .

[0064] Among them, the first packaging component 10 includes a stacked cloth-based substrate 11, a first adhesive film 12 and a first inorganic barrier layer 13; the second packaging component 20 includes a stacked polymer film 21, a second adhesive film 22 and a second inorganic barrier layer 23; the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are respectively arranged on both side surfaces of the flexible module 30; the flexible module 30 is a perovskite module prepared based on a flexible conductive substrate.

[0065] Specifically, the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are both made of aluminum oxide, and both have a thickness of 50 nm; the first adhesive film 12 and the second adhesive film 22 are both PVB adhesive films, and both have a thickness of 0.7 mm; the polymer film 21 is an ETFE high-transmittance film, and has a thickness of 80 μm.

[0066] The battery structure of the flexible module 30 used in this embodiment is a pin structure, including a stacked PET conductive substrate, a hole transport layer (Meo-4PACZ), a perovskite layer, a passivation layer (F-PEAI), an electron transport layer (C60 and BCP), and an electrode layer (copper electrode).

[0067] This embodiment also provides a packaging method for a perovskite photovoltaic component, and the packaging method is used to form the above-mentioned ultra-flexible packaging structure, which specifically includes the following steps: (1) using an atomic layer deposition device to deposit inorganic barrier layers (a first inorganic barrier layer 13 and a second inorganic barrier layer 23) on both side surfaces of the flexible module 30, respectively, and controlling the deposition temperature to be 150° C. to obtain an intermediate module; (2) The cloth-based substrate 11, the first adhesive film 12, the intermediate module, the second adhesive film 22 and the polymer film 21 are stacked in order and subjected to high-temperature vacuum lamination in a vacuum laminator. The lamination temperature is controlled to be 140°C, the applied pressure is 80 kPa, and the lamination time is 10 min to obtain an ultra-flexible packaging structure. Example 4

[0068] This embodiment provides an ultra-flexible packaging structure of a perovskite optoelectronic component and a packaging method thereof. Except that the materials of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are changed to titanium oxide, the remaining structures and conditions are the same as those in Example 1, so they are not described here. Example 5

[0069] This embodiment provides an ultra-flexible packaging structure of a perovskite optoelectronic component and a packaging method thereof. Except that the materials of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are changed to aluminum nitride, the remaining structures and conditions are the same as those in Example 1, so they are not described here. Example 6

[0070] This embodiment provides an ultra-flexible packaging structure of a perovskite optoelectronic component and a packaging method thereof. Except that the thickness of the first inorganic barrier layer 13 and the second inorganic barrier layer 23 are both changed to 8 nm, the remaining structures and conditions are the same as those in Example 1, so they are not described here in detail. Example 7

[0071] This embodiment provides an ultra-flexible packaging structure of a perovskite optoelectronic component and a packaging method thereof. Except that the thickness of the first adhesive film 12 and the second adhesive film 22 are both changed to 0.8 mm, the remaining structures and conditions are the same as those in Embodiment 1, and thus will not be described in detail here. Example 8

[0072] This embodiment provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except that the deposition temperature of the inorganic barrier layer in step (1) is changed to 80° C., the remaining steps and conditions are the same as those in Example 1, and thus are not described in detail here. Example 9

[0073] This embodiment provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except that the deposition temperature of the inorganic barrier layer in step (1) is changed to 160° C., the remaining steps and conditions are the same as those in Example 1, and thus are not described in detail here. Comparative Example 1

[0074] This comparative example provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except for removing only the first inorganic barrier layer 13, the remaining structures and conditions are the same as those of Example 1, so they are not described here in detail. Comparative Example 2

[0075] This comparative example provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except for removing only the second inorganic barrier layer 23, the remaining structures and conditions are the same as those of Example 1, so they are not described here in detail. Comparative Example 3

[0076] This comparative example provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except for directly removing the first inorganic barrier layer 13 and the second inorganic barrier layer 23, the remaining structures and conditions are the same as those in Example 1, so they are not described here in detail. Comparative Example 4

[0077] This comparative example provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except for removing only the first adhesive film 12, the remaining structures and conditions are the same as those of Example 1, so they are not described in detail here. Comparative Example 5

[0078] This comparative example provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except for removing only the second adhesive film 22, the remaining structures and conditions are the same as those of Example 1, so they are not described in detail here. Comparative Example 6

[0079] This comparative example provides an ultra-flexible packaging structure of a perovskite photovoltaic component and a packaging method thereof. Except for directly removing the first adhesive film 12 and the second adhesive film 22, the remaining structures and conditions are the same as those of Example 1, so they are not described in detail here. Performance Testing

[0080] In order to ensure the accuracy and comparability of the data, all encapsulated perovskite photovoltaic modules used in this test experiment were strictly selected from independent samples.

[0081] Water and oxygen barrier test: refer to standard IEC 61215.

[0082] Water and oxygen gradually corrode perovskite photovoltaic components, eventually leading to a decrease in photoelectric conversion efficiency. In particular, harsh environments with high humidity and high temperature will increase the water and oxygen permeability of organic materials, thereby accelerating the process of water and oxygen corrosion of the perovskite active layer. This test experiment is based on the above principle and aims to evaluate the effectiveness of different packaging structures in blocking water and oxygen penetration.

[0083] Conditions: Temperature: 85±2℃; Humidity: 85±2%RH; Duration: 1000h.

[0084] Evaluation indicators: photoelectric conversion efficiency attenuation rate (required to be less than 10%); appearance inspection (no obvious discoloration, whitening or yellowing, no obvious breakage or debonding).

[0085] Flexibility test: Reference standard IEC 61215.

[0086] The flexible photovoltaic module was subjected to repeated bending tests along a self-made cylinder with a bending radius of 5 mm (this bending radius is much lower than most standard requirements generally followed by the current flexible device industry, that is, the present invention adopts a more stringent flexibility testing method) and the number of bending times is 1000 times.

[0087] Evaluation indicators: Photoelectric conversion efficiency attenuation rate (required to be less than 10%); appearance inspection (no obvious cracking or debonding).

[0088] Weathering test: Reference standard IEC 61215.

[0089] The photovoltaic modules were placed under a xenon lamp (light wavelength range 300nm-1200nm) for irradiation testing. The light intensity was set to five times that of natural sunlight, and the irradiation duration exceeded 150h. This test condition is equivalent to simulating the light effects of 2.5 years in the outdoor environment.

[0090] Evaluation indicators: Appearance inspection (no obvious yellowing, cracking and powdering by visual inspection).

[0091] The above-mentioned water and oxygen barrier, flexibility and weather resistance tests were performed on the ultra-flexible packaging structures of the perovskite photovoltaic components obtained in Examples 1-9 and Comparative Examples 1-6, respectively. The relevant test results are shown in Table 1 below.

[0092] Table 1

[0093] From Table 1, we can see that: (1) By comparing Examples 1-3 with Example 6, it is found that when the atomic layer deposition (ALD) technology is used to deposit aluminum oxide as a water and oxygen barrier layer, the thickness of the inorganic barrier layer needs to be maintained within an appropriate range in order to exhibit excellent water and oxygen barrier properties.

[0094] (2) By comparing Example 1 with Examples 4-5, it is found that among aluminum oxide, titanium oxide and aluminum nitride deposited at 100°C, aluminum oxide exhibits better water and oxygen barrier properties; in contrast, aluminum nitride generally requires a higher deposition temperature to achieve the best water and oxygen barrier effect.

[0095] (3) By comparing Example 1 with Example 7, it is found that the thickness of the adhesive film has a direct impact on the bending performance of the package component. Specifically, the thicker the adhesive film made of the same material, the worse the bending performance of the component.

[0096] (4) By comparing Example 1 with Examples 8-9, it is found that the deposition temperature of the inorganic barrier layer has a significant effect on its water and oxygen barrier properties and photoelectric conversion efficiency: a deposition temperature that is too low will lead to incomplete precursor reaction, forming more defects, thereby weakening the water and oxygen barrier effect; although a deposition temperature that is too high has no adverse effect on its water and oxygen barrier properties, high temperature can easily cause the decomposition of the perovskite active layer, thereby adversely affecting the photoelectric conversion efficiency of the perovskite component.

[0097] (5) By comparing Example 1 with Comparative Examples 1-6, it is found that the use of either an inorganic barrier layer or an adhesive film alone cannot meet the strict requirements of the perovskite photovoltaic module for water and oxygen barrier. Only when the two are used in combination can a synergistic effect be produced to achieve the effect of "1+1>2". This synergistic effect mainly stems from two factors: first, the adhesive film fills the defects of the inorganic barrier layer during the lamination process, thereby further improving the water and oxygen barrier capacity; second, the inorganic barrier layer is easily damaged in an extreme water and oxygen environment, resulting in a decrease in its barrier performance, while the presence of the adhesive film provides additional protection. In addition, only when the inorganic barrier layer and the adhesive film are applied to both the front and back sides of the flexible module at the same time can the comprehensive requirements of the perovskite photovoltaic module for water and oxygen barrier be met.

[0098] It can be seen that compared with the traditional single packaging material, the ultra-flexible packaging structure provided by the present invention, relying on the extremely low water and oxygen permeability of the inorganic barrier layer and the adhesive film, effectively meets the stringent requirements of the perovskite optoelectronic components for water and oxygen barrier properties through the synergistic effect between the two. In addition, the cloth-based substrate and the polymer film have excellent flexibility and environmental stability, which significantly improves the flexibility, portability and weather resistance of the packaging structure, fully meets the outdoor use requirements of photovoltaic products, and enhances the practicality and product competitiveness of perovskite optoelectronic components in the field of wearable and portable applications.

[0099] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention are within the protection scope and disclosure scope of the present invention.

Claims

1. An ultra-flexible packaging structure of a perovskite optoelectronic component, characterized in that: The ultra-flexible packaging structure comprises a first packaging component and a second packaging component respectively arranged on two side surfaces of the flexible module; The first packaging component includes a stacked cloth substrate, a first adhesive film and a first inorganic barrier layer; the second packaging component includes a stacked polymer film, a second adhesive film and a second inorganic barrier layer; the first inorganic barrier layer and the second inorganic barrier layer are respectively arranged on both side surfaces of the flexible module; The flexible module is a perovskite module prepared based on a flexible conductive substrate.

2. The ultra-flexible packaging structure according to claim 1, characterized in that: The materials of the first inorganic barrier layer and the second inorganic barrier layer independently include any one or a combination of at least two of metal oxides, non-metal oxides or nitrides; And / or, the thickness of the first inorganic barrier layer and the second inorganic barrier layer are independently 10-50 nm.

3. The ultra-flexible packaging structure according to claim 1, characterized in that: The first adhesive film and the second adhesive film independently include any one of an EVA adhesive film, a POE adhesive film or a PVB adhesive film; And / or, the thickness of the first adhesive film and the second adhesive film are independently 0.01-0.7 mm.

4. The ultra-flexible packaging structure according to claim 1, characterized in that: The polymer film comprises an ETFE film; And / or, the polymer film has a thickness of 20-80 μm.

5. The ultra-flexible packaging structure according to any one of claims 1 to 4, characterized in that: The battery structure of the flexible module includes a pin structure or a nip structure.

6. A packaging method for a perovskite photovoltaic component, wherein the ultra-flexible packaging structure as claimed in any one of claims 1 to 5 is formed by using the packaging method, characterized in that: The packaging method comprises the following steps: (1) Depositing inorganic barrier layers on both side surfaces of the flexible module to obtain an intermediate module; (2) The cloth base substrate, the first adhesive film, the intermediate module, the second adhesive film and the polymer film are sequentially stacked and vacuum-laminated at high temperature to obtain an ultra-flexible packaging structure.

7. The packaging method according to claim 6, characterized in that: The deposition method of the inorganic barrier layer in step (1) includes any one of atomic layer deposition, physical vapor deposition or chemical vapor deposition.

8. The packaging method according to claim 7, characterized in that: The deposition temperature of the atomic layer deposition is 100-150°C.

9. The packaging method according to any one of claims 6 to 8, characterized in that: The lamination temperature of the high temperature vacuum lamination in step (2) is 100-140°C; and / or, the applied pressure of the high temperature vacuum lamination in step (2) is 40-80 kPa; And / or, the lamination time of the high temperature vacuum lamination in step (2) is 10-30 minutes.

10. A perovskite photovoltaic cell, characterized in that: The photovoltaic component in the perovskite photovoltaic cell comprises the ultra-flexible packaging structure as described in any one of claims 1-5.

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