Display device

Abstract

The present invention provides a display device that suppresses moisture from invading the interior of the display device. The display device comprises: an interlayer insulating layer (102) disposed on a substrate (101); an organic EL array (160); a metal layer (203) connected to the organic EL array (160); a covering portion (210) disposed at a position outside the organic EL array (160) and inside the outer peripheral region (102a) of the interlayer insulating layer (102); a lower inorganic sealing layer (108a) continuously disposed from the organic EL array (160) to the outer peripheral region (102a) of the interlayer insulating layer (102); a resin sealing layer (108b) covering at least a portion of the lower inorganic sealing layer (108a); and an upper inorganic sealing layer (108c) continuously disposed from the resin sealing layer (108b) to the outer peripheral region (102a) of the interlayer insulating layer (102). At least a portion of an outer edge portion (203a) of the metal layer (203) has a conical cross-sectional shape that protrudes in a direction opposite to a direction toward a main surface (101c) of the substrate (101), and the outer edge portion (203a) is covered by a covering portion (210).

Description

Technical Field

[0001] The present invention relates to a display device having a plurality of organic EL (Electro Luminescence) elements. Background Art

[0002] In the past, an organic EL display panel having a plurality of organic EL elements is known. The organic EL element has a structure formed by stacking thin films of various materials, and is provided with a pixel electrode, an opposing electrode, and an organic light-emitting layer located between these electrodes formed on a TFT (thin film transistor) substrate. An electron transport layer is also provided between the pixel electrode and the opposing electrode. These layers sometimes contain materials whose light-emitting properties deteriorate if they react with moisture. In order to suppress the degradation of the display quality of the organic EL display panel, it is necessary to suppress the intrusion of moisture present in the external environment.

[0003] Patent Documents 1 and 2 disclose sealing structures for suppressing the intrusion of moisture present in the external environment in order to suppress degradation of the display quality of an organic EL display panel.

[0004] Prior art literature Patent Literature Patent Document 1: Japanese Patent Application Publication No. 2020-184426 Patent Document 2: Japanese Patent Application Publication No. 2020-119842 Summary of the invention Problems to be solved by the invention

[0005] However, in the structure of the display device described in the patent document, moisture may intrude into the interior of the display device.

[0006] The present invention provides a display device capable of suppressing moisture intrusion. Means for solving problems

[0007] A display device of the present invention includes: an interlayer insulating layer, which is arranged on one main surface side of the substrate and contains a resin material; an organic EL array, which is arranged on the interlayer insulating layer and contains a plurality of organic EL elements; a metal layer, which is on the interlayer insulating layer and connected to the organic EL array and arranged outside the organic EL array; a covering portion, which is arranged on the interlayer insulating layer at a position outside the organic EL array and inside the outer peripheral area of ​​the interlayer insulating layer; a lower inorganic sealing layer, which is continuously arranged from the organic EL array, the metal layer and the covering portion to the outer peripheral area of ​​the interlayer insulating layer to cover the organic EL array; An organic EL array, the metal layer and the covering portion; a resin sealing layer covering at least a portion of a lower inorganic sealing layer located on the organic EL array and the metal layer, and arranged at a position inner than the peripheral area of ​​the interlayer insulating layer; and an upper inorganic sealing layer covering the resin sealing layer and continuously arranged from the resin sealing layer to the peripheral area of ​​the interlayer insulating layer to overlap with the lower inorganic sealing layer in the peripheral area of ​​the interlayer insulating layer, at least a portion of the outer edge portion of the metal layer has a conical cross-sectional shape protruding in a direction opposite to the direction toward one main surface of the substrate, and the outer edge portion is covered by the covering portion. Effects of the Invention

[0008] According to the display device of the present invention, it is possible to suppress the intrusion of moisture into the interior of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a plan view schematically showing a display device of a comparative example. Figure 2 is a cross-sectional view of a display device according to a comparative example. Figure 3 This is an enlarged view showing an opening of a metal layer in a display device according to a comparative example. Figure 4 It is a plan view schematically showing a display device according to an embodiment. Figure 5 is a cross-sectional view of a display device according to an embodiment. Figure 6 This is an enlarged view of a covering portion provided at an outer edge portion of a metal layer of the display device according to the embodiment. Figure 7 This is an enlarged view of a covering portion of an opening provided in a metal layer of the display device according to the embodiment. Figure 8 It is a diagram showing another example of the covering portion of the opening provided in the metal layer of the display device according to the embodiment. Fig. 9 It is a plan view schematically showing a display device according to a modified example of the embodiment. Fig.10 It is a cross-sectional view of a display device according to a modified example of the embodiment. Fig.11 This is an enlarged view of a covering portion provided at an outer edge portion of a metal layer of a display device according to a modification of the embodiment. Fig.12 This is an enlarged view of a covering portion of an opening of a metal layer provided in a display device according to a modification of the embodiment. DETAILED DESCRIPTION

[0010] (Process of Completion of the Invention) Reference Figure 1 to Figure 3 The process leading to the completion of the present invention will be described.

[0011] Figure 1 1 is a plan view schematically showing a display device 1001 according to a comparative example. Figure 2 is a cross-sectional view of a display device 1001 according to a comparative example.

[0012] in addition, Figure 1 The diagram shows an organic EL array 560 and a metal layer 523 included in the display device 1001 as viewed from above. Figure 2 The display device 1001 Figure 1 The cross section of line II-II.

[0013] The display device 1001 of the comparative example includes a substrate 501 , an interlayer insulating layer 502 , a pixel electrode 503 , a bank 504 , a light-emitting layer 505 , a counter electrode 507 , a metal layer 523 , and a sealing layer 508 .

[0014] The substrate 501 includes a base material 501a and a TFT layer 501b formed on the base material 501a. The sealing layer 508 has a three-layer structure including a first sealing layer 508a made of silicon nitride (SiN), a second sealing layer 508b made of resin, and a third sealing layer 508c made of silicon nitride.

[0015] The metal layer 523 is a wiring layer connected to the pixel electrode 503 of the organic EL element 550 included in the organic EL array 560. In the same figure, a slit-shaped opening 523b is provided in the region of the metal layer 523 located outside the organic EL array 560. The opening 523b is provided to evaporate water contained in the interlayer insulating layer 502 during the manufacturing process of the display device 1001.

[0016] Figure 3 is an enlarged view showing the opening 523b of the metal layer 523 of the display device 1001 of the comparative example. Figure 1 An enlarged view of part III. Figure 3(a) is a top view, and (b) is a cross-sectional view viewed from the horizontal direction.

[0017] If the opening 523b is provided in the metal layer 523, when the first sealing layer 508a is formed on the opening 523b, a crack such as a break may be formed in the first sealing layer 508a (see Figure 3 (b)). If cracks are formed in the first sealing layer 508a, moisture may intrude through the cracks, thereby causing a problem of deterioration in the display quality of the display device 1001.

[0018] It is believed that the cracks such as the discontinuities are formed in the first sealing layer 508a because the cross-sectional shape of the opening 523b is an inverted cone. The inverted cone is formed on the side of the opening 523b because, when the opening 523b is formed by etching using a resist mask, the further away from the lower side of the resist mask, the more the etching liquid enters, and the greater the etching amount.

[0019] In addition, this is because, for example, when the metal layer 523 is composed of a stacked structure of an aluminum layer and a tungsten layer formed on the aluminum layer, since the etching rate of tungsten is slower than that of aluminum, the inner side surface of the tungsten layer protrudes toward the inside of the opening more than the inner side surface of the aluminum layer.

[0020] Therefore, when the first sealing layer 508a is formed on the inverted tapered opening 523b, a space not filled with the sealing material is formed at the corner of the bottom surface of the opening 523b, and the sealing material slides to form a crack like a break.

[0021] The cracks are formed not only in the opening 523b of the metal layer 523 but also in the outer edge 523a of the metal layer 523 having a tapered cross section. The outer edge 523a of the metal layer 523 is located near the air and moisture in the external environment easily enters.

[0022] On the other hand, in order to suppress the intrusion of moisture into the interior of the display device, the display device of the present invention has the following configuration.

[0023] Hereinafter, an embodiment of the display device of the present invention will be described with reference to the accompanying drawings. In addition, the embodiments described below all represent a specific example of the present invention. Therefore, the numerical values, constituent elements, configuration positions and connection methods of the constituent elements shown in the following embodiments are examples and are not intended to limit the present invention. Therefore, the constituent elements of the following embodiments that are not recorded in the independent claims are described as arbitrary constituent elements.

[0024] In each figure, the same reference numerals are attached to substantially the same components. In addition, each figure is a schematic diagram and does not necessarily strictly represent the size ratio of each part.

[0025] In this specification, the X direction, the Y direction, and the Z direction in each figure are respectively defined as the row direction, the column direction, and the thickness direction of the display device.

[0026] (Implementation Method) [Configuration of Display Device] Reference Figures 4 to 8 A display device according to an embodiment will be described.

[0027] Figure 4 It is a plan view schematically showing the display device 1 according to the embodiment.

[0028] In addition, the same figure shows a state where the upper sheet 110, adhesive layer 109, sealing layer 108, barrier member 115, etc. are removed from the display device 1, that is, a view of the organic EL array 160, metal layer 203, and covering portion 210 viewed from above. In addition, the same figure schematically depicts the configuration position and width of the covering portion 210.

[0029] Figure 4 The display device 1 shown is an example of an organic EL display panel, and has a rectangular shape when viewed from above. In this embodiment, a top emission type display device that emits light from the upper surface is described as an example.

[0030] Figure 5 is a cross-sectional view of the display device 1 . Figure 5 express Figure 4 The cross section of the VV line.

[0031] The display device 1 has an interlayer insulating layer 102 formed on the upper side of a substrate 101, and an organic EL array 160 formed on the upper side of the interlayer insulating layer 102. An adhesive layer 109 and a sheet 110 are sequentially stacked on the organic EL array 160. A blocking member 115 for blocking the adhesive layer 109 is provided outside the adhesive layer 109.

[0032] In the present embodiment, the inner side refers to the center side of the organic EL array 160 when viewed from the object to be compared, and the outer side refers to the side opposite to the center side of the organic EL array 160 when viewed from the object to be compared.

[0033] The substrate 101 is composed of a base material 101a as an insulating material and a TFT (Thin Film Transistor) layer 101b. A driving circuit composed of TFTs is formed on the TFT layer 101b. The TFT layer is composed of, for example, a channel, a gate insulating layer, a gate electrode, a protective layer, a source electrode, a drain electrode, and a passivation layer (not shown).

[0034] The display device 1 includes: a first region 10 including a central portion of the display device 1; and a second region 20 located outside the first region 10. The first region 10 is a region including a TFT layer 101b of a substrate 101, and has a rectangular shape. The second region 20 is a region where the TFT layer 101b is not formed, and has a photo frame shape. The second region 20 is provided with a plurality of wirings and terminals (not shown) for electrically connecting the TFT layer 101b to an external drive circuit.

[0035] In the first region 10 of the display device 1, a portion of the substrate 101, a portion of the interlayer insulating layer 102, the organic EL array 160, the bank 104, the metal layer 203, the cover 210, a portion of the sealing layer 108, a portion of the adhesive layer 109, and a portion of the sheet 110 are provided. In the second region 20, a portion of the substrate 101, a portion of the interlayer insulating layer 102, a portion of the sealing layer 108, a portion of the adhesive layer 109, a portion of the sheet 110, and a barrier member 115 are provided.

[0036] The substrate 101 has one main surface 101 c and another main surface 101 d opposite to the one main surface 101 c. The display device 1 is formed by stacking a plurality of layers on the one main surface 101 c of the substrate 101 .

[0037] The display device 1 includes the substrate 101, the interlayer insulating layer 102, the organic EL array 160, the bank 104, the metal layer 203, the cover 210 and the sealing layer 108. The display device 1 also includes an adhesive layer 109, a sheet 110 and a barrier member 115.

[0038] The interlayer insulating layer 102 is provided on one main surface 101c side of the substrate 101. The interlayer insulating layer 102 is a layer made of an insulating resin material. Examples of the resin material include acrylic resins, polyimide resins, siloxane resins, and phenolic resins. The interlayer insulating layer 102 is also a layer for flattening the step formed by the TFT layer 101b.

[0039] The interlayer insulating layer 102 is formed from the first region 10 to the second region 20 on the substrate 101. A peripheral groove 102b is formed in the interlayer insulating layer 102 in the second region 20 so as to surround the first region 10. Hereinafter, the interlayer insulating layer 102 provided in the second region 20 except for the peripheral groove 102b is referred to as the outer peripheral region 102a of the interlayer insulating layer 102.

[0040] The organic EL array 160 is provided in the first region 10 on the interlayer insulating layer 102. The organic EL array 160 is formed by a plurality of organic EL elements 150 arranged in a matrix. The organic EL array 160, for example, is formed by three organic EL elements 150 corresponding to respective colors of RGB (red, green, and blue) to form three sub-pixels, and one pixel is formed by combining these three sub-pixels. In addition, each pixel is not limited to three sub-pixels, and may also be formed by one sub-pixel composed of W (white) or four sub-pixels composed of RGBW.

[0041] Each organic EL element 150 includes a pixel electrode 103 , a light-emitting layer 105 , and a counter electrode 107 .

[0042] The pixel electrode 103 is an electrode that functions as an anode of the organic EL element 150. The pixel electrode 103 includes a metal layer made of a light-reflective metal material and is formed on the interlayer insulating layer 102. The pixel electrode 103 is provided corresponding to each pixel and is electrically connected to the TFT layer 101b via a connecting electrode. The pixel electrode 103 may be composed of a single metal layer or a structure in which a plurality of layers are stacked.

[0043] The light emitting layer 105 is provided on the pixel electrode 103. The light emitting layer 105 is formed of a polymer material or a low molecular material. The light emitting layer 105 is formed in the opening of the bank 104, and emits light of each color of R, G, and B through the recombination of holes and electrons.

[0044] The counter electrode 107 is an electrode that functions as a cathode of the organic EL element 150. The counter electrode 107 is formed of a light-transmitting conductive material. As a material for the counter electrode 107, for example, ITO, IZO, etc. are used. In addition, as a material for the counter electrode 107, a thin film of a metal such as silver, a silver alloy, aluminum, and an aluminum alloy can also be used. In addition, an electron transport layer or the like is formed between the light-emitting layer 105 and the counter electrode 107 (not shown).

[0045] The bank 104 has a frame-like partition shape and is provided on the pixel electrode 103 so as to surround the light-emitting layer 105 and the counter electrode 107 of the organic EL element 150. The bank 104 is formed of an insulating organic material such as acrylic resin, polyimide resin, novolac resin, or phenolic resin.

[0046] The metal layer 203 is provided on a portion of the interlayer insulating layer 102. The metal layer 203 is connected to the organic EL array 160 and is arranged outside the organic EL array 160. Specifically, the metal layer 203 is connected to the pixel electrode 103 of the organic EL element 150. The metal layer 203 of this embodiment is provided in the first region 10, and is not provided in the second region 20.

[0047] The metal layer 203 has a multilayer structure including, for example, an aluminum layer and a tungsten layer formed on the aluminum layer. The metal layer 203 is formed by a coating method, a sputtering method, a vacuum evaporation method, or the like. The metal layer 203 is formed of the same material as the pixel electrode 103. In addition, the metal layer 203 is formed on the same layer as the pixel electrode 103. The configuration of the metal layer 203 will be described in detail later.

[0048] The covering portion 210 is a portion added to the edge of the metal layer 203 and is provided on the interlayer insulating layer 102. The covering portion 210 is arranged outside the organic EL array 160 and inside the outer peripheral region 102a of the interlayer insulating layer 102. The covering portion 210 is provided in the first region 10, but not provided in the second region 20. The covering portion 210 is arranged outside the dam 104. The covering portion 210 is formed of the same material as the dam 104. In addition, the covering portion 210 is formed on the same layer as the dam 104. The structure of the covering portion 210 will be described in detail later.

[0049] The sealing layer 108 has a function of protecting the organic EL array 160, etc. The sealing layer 108 is composed of a light-transmitting lower inorganic sealing layer 108a, a resin sealing layer 108b, and an upper inorganic sealing layer 108c.

[0050] The lower inorganic sealing layer 108a is continuously provided from the organic EL array 160, the metal layer 203 and the covering portion 210 to the outer peripheral region 102a of the interlayer insulating layer 102 in a manner covering the organic EL array 160, the metal layer 203 and the covering portion 210. The lower inorganic sealing layer 108a is formed on both the first region 10 and the second region 20. The lower inorganic sealing layer 108a is formed of a thin film of silicon nitride (SiN).

[0051] The resin sealing layer 108b covers a portion of the lower inorganic sealing layer 108a, specifically, covers at least a portion of the lower inorganic sealing layer 108a located on the organic EL array 160 and the metal layer 203. The resin sealing layer 108b is provided at a position inside the peripheral region 102a of the interlayer insulating layer 102. More specifically, the resin sealing layer 108b is continuously provided to the region inside the outermost covering portion (first covering portion 211) in the covering portion 210. The resin sealing layer 108b is formed in the first region 10, and is not formed in the second region 20. The resin sealing layer 108b is formed of, for example, a fluorine-based, acrylic-based, epoxy-based, or silicone-based resin.

[0052] The upper inorganic sealing layer 108c covers the resin sealing layer 108b and is continuously provided from the resin sealing layer 108b to the peripheral region 102a of the interlayer insulating layer 102 so as to overlap with the lower inorganic sealing layer 108a in the peripheral region 102a of the interlayer insulating layer 102. The upper inorganic sealing layer 108c is formed on both the first region 10 and the second region 20. The upper inorganic sealing layer 108c is formed of a thin film of silicon nitride (SiN).

[0053] Thus, the upper inorganic sealing layer 108 c extends to the outer peripheral region 102 a of the interlayer insulating layer 102 , and the outer end of the upper inorganic sealing layer 108 c is in close contact with the outer end of the lower inorganic sealing layer 108 a .

[0054] The sheet 110 is a member that supplements the sealing performance of the display device 1. The sheet 110 is formed of a light-transmitting material such as a transparent resin film. An adhesive layer 109 is provided between the sheet 110 and the sealing layer 108. The adhesive layer 109 is a material for bonding the sheet 110 to the sealing layer 108, and is formed of, for example, a light-transmitting acrylic resin. The sheet 110 is positioned on the sealing layer 108 and is bonded to the sealing layer 108 via the adhesive layer 109.

[0055] In order to suppress the intrusion of moisture from the outside, the display device 1 of the present embodiment has the following configuration.

[0056] The covering portion 210 includes a plurality of covering portions, namely, a first covering portion 211, a second covering portion 212, and a third covering portion 213. The number of the covering portions 210 may be one or four or more.

[0057] The first covering portion 211 is located at the outermost side of the plurality of covering portions. The second covering portion 212 is located at an inner side than the first covering portion 211, and the third covering portion 213 is located at an inner side than the second covering portion. In other words, the second covering portion 212 is located at an outer side than the third covering portion 213, and the first covering portion 211 is located at an outer side than the second covering portion 212.

[0058] The first covering portion 211 and the second covering portion 212 each have a frame shape, and are provided on the interlayer insulating layer 102 so as to surround the organic EL array 160 and the metal layer 203 .

[0059] The outer edge 203a of the metal layer 203 is located at a position closer to the inside than the first covering portion 211. At least a part of the outer edge 203a of the metal layer 203 has a conical cross-sectional shape protruding in a direction opposite to the direction toward one main surface 101c of the substrate 101. In addition, the metal layer 203 of the present embodiment is not provided between the first covering portion 211 and the second covering portion 212. The outer edge 203a including the outer peripheral edge of the metal layer 203 is in contact with the inner side of the second covering portion 212, and is covered by the covering portion 210 (second covering portion 212) in contact with the outer edge 203a of the metal layer 203. That is, the second covering portion 212 covers the outer edge 203a of the metal layer 203.

[0060] In addition, the lower inorganic sealing layer 108 a , the resin sealing layer 108 b , and the upper inorganic sealing layer 108 c are sequentially stacked on the interlayer insulating layer 102 located between the first covering portion 211 and the second covering portion 212 .

[0061] Figure 6 This is an enlarged view of the covering portion 210 provided at the outer edge portion 203a of the metal layer 203 of the display device 1. Figure 4 An enlarged view of part VI of the same figure. (a) is a top view, and (b) is a cross-sectional view.

[0062] As shown in the figure, the outer edge 203a of the metal layer 203 is covered by the second covering portion 212. Specifically, the second covering portion 212 covers the corners and side surfaces of the outer edge 203a of the metal layer 203. The second covering portion 212 has a conical cross-sectional shape that protrudes in a direction opposite to the direction toward one main surface 101c of the substrate 101. In addition, the second covering portion 212 has a trapezoidal shape at a portion above the metal layer 203.

[0063] The metal layer 203 is inverted-cone-shaped at the side of the outer edge 203a, but the second covering portion 212 covers the corner and side of the outer edge 203a, and the two side surfaces on the upper side of the second covering portion 212 are in the shape of a positive cone. Therefore, it is possible to suppress cracks such as fractures from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the second covering portion 212. Thus, it is possible to suppress the intrusion of moisture from the outside.

[0064] Figure 7 This is an enlarged view of the covering portion 210 provided in the opening 203b of the metal layer 203 of the display device 1. Figure 4 An enlarged view of part VII of the same figure. (a) is a top view, and (b) is a cross-sectional view.

[0065] The metal layer 203 has an opening 203b at a position inside the outer edge 203a of the metal layer 203. In this example, the opening 203b is formed outside the organic EL array 160 and the bank 104 and inside the second covering portion 212. The opening 203b is provided in the metal layer 203 in order to allow moisture in the interlayer insulating layer 102 to be discharged upward through the opening 203b from the interlayer insulating layer 102 exposed from the opening 203b during firing after the bank and the light-emitting layer 105 are formed.

[0066] As shown in the figure, the opening 203b of the metal layer 203 is covered by the third covering portion 213. Specifically, the third covering portion 213 covers the corners and inner peripheral side surfaces of the opening 203b of the metal layer 203. The third covering portion 213 has a conical cross-sectional shape that protrudes in a direction opposite to the direction toward one main surface 101c of the substrate 101. In addition, the third covering portion 213 has a trapezoidal shape at a portion above the metal layer 203.

[0067] The metal layer 203 is inverted-cone-shaped at the side of the opening 203b, but the third covering portion 213 covers the corner and side of the opening 203b, and the upper two side surfaces of the third covering portion 213 are in the shape of a positive cone. Therefore, it is possible to suppress cracks such as fractures from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the third covering portion 213. Thus, it is possible to suppress the intrusion of moisture from the outside.

[0068] In the present embodiment, all the outer edge portions 203a and all the openings 203b are covered by the covering portion 210. Alternatively, the covering portion 210 may be formed in the openings 203b as shown below.

[0069] Figure 8 FIG. 2 is a diagram showing another example of the covering portion 210 provided in the opening 203 b of the metal layer 203 of the display device 1 .

[0070] As shown in the figure, the corner of the opening 203b of the metal layer 203 is covered by the third covering portion 213. The metal layer 203 is inverted cone shape on the side of the opening 203b, but the third covering portion 213 covers the corner of the opening 203b. In this way, the inverted cone surface can also be reduced. Therefore, it is possible to suppress the formation of cracks such as fractures in the lower inorganic sealing layer 108a arranged on the metal layer 203 and the third covering portion 213. Thus, it is possible to suppress the intrusion of moisture from the outside.

[0071] Thus, in this embodiment, the outer edge 203a or the opening 203b of the metal layer 203 is covered by the covering portion 210. In other words, the reverse tapered surface is reduced by the covering portion 210 on the surface where the lower inorganic sealing layer 108a is formed. Therefore, it is possible to suppress the formation of cracks in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the covering portion 210. Thus, it is possible to suppress the intrusion of moisture into the interior of the display device 1.

[0072] Next, an example of a method for forming the covering portion 210 is described. The covering portion 210 is formed simultaneously on the same layer as the dam 104 with the same material as the dam 104. The covering portion 210 is formed by uniformly applying a solution on the pixel electrode 103 and the interlayer insulating layer 102 using a spin coating method or the like, wherein the solution is formed by dissolving a phenolic resin in a solvent (for example, a mixed solvent of ethyl lactate and GBL). Then, the covering portion 210 is formed by performing pattern exposure and development, and then firing. The firing is performed, for example, at a temperature of 150° C. or more and 210° C. or less for 60 minutes. In addition, in the process of forming the covering portion 210, the surface of the covering portion 210 may be surface treated with a prescribed alkaline solution, water, an organic solvent, or the like, or plasma treated. Thus, a covering portion 210 having a conical cross-sectional shape protruding in a direction opposite to the direction toward one main surface 101c of the substrate 101 can be formed.

[0073] [Modification of the embodiment] Reference Fig. 9 and Fig.10 A display device 1A according to a modification of the embodiment will be described. In the modification, an example in which the outer edge portion 203 a of the metal layer 203 is covered with the first covering portion 211 will be described.

[0074] Fig. 9 It is a plan view schematically showing a display device 1A according to a modification of the embodiment.

[0075] In addition, the same figure shows a state where the upper sheet 110, adhesive layer 109, sealing layer 108, barrier member 115, etc. are removed from the display device 1A, that is, a view of the organic EL array 160, metal layer 203, and cover 210 viewed from above. In addition, the same figure schematically depicts the configuration position and width of the cover 210.

[0076] Fig. 9 The display device 1A shown is an example of an organic EL display panel, and has a rectangular shape when viewed from above. In this embodiment, a top emission type display device that emits light from the upper surface is also described as an example.

[0077] Fig.10It is a cross-sectional view of a display device 1A according to a modification of the embodiment. Fig.10 express Fig. 9 The cross section of line XX.

[0078] The display device 1A has an interlayer insulating layer 102 formed on the upper side of a substrate 101, and an organic EL array 160 formed on the upper side of the interlayer insulating layer 102. An adhesive layer 109 and a sheet 110 are sequentially stacked on the organic EL array 160. A blocking member 115 for blocking the adhesive layer 109 is provided outside the adhesive layer 109.

[0079] The display device 1A includes a substrate 101, an interlayer insulating layer 102, an organic EL array 160, a bank 104, a metal layer 203, a cover 210, and a sealing layer 108. In addition, the display device 1A includes an adhesive layer 109, a sheet 110, and a barrier member 115. The following description will focus on the differences from the embodiment.

[0080] In order to suppress the intrusion of moisture from the outside, a display device 1A according to a modified example has the following configuration.

[0081] The covering portion 210 includes a plurality of covering portions, namely, a first covering portion 211, a second covering portion 212, and a third covering portion 213. The number of the covering portions 210 may be one or four or more.

[0082] The first covering portion 211 is located at the outermost side of the plurality of covering portions. The second covering portion 212 is located inside the first covering portion 211, and the third covering portion 213 is located inside the second covering portion.

[0083] The first covering portion 211 has a frame shape and is provided on the interlayer insulating layer 102 so as to surround the organic EL array 160 and the metal layer 203 .

[0084] The outer edge 203a of the metal layer 203 is located at a position closer to the inside than the first covering portion 211. At least a part of the outer edge 203a of the metal layer 203 has a conical cross-sectional shape protruding in a direction opposite to the direction toward one main surface 101c of the substrate 101. In a modified example, the metal layer 203 is provided between the first covering portion 211 and the second covering portion 212. The outer edge 203a including the peripheral edge of the metal layer 203 is in contact with the inner side of the first covering portion 211, and is covered by the covering portion 210 (first covering portion 211) that contacts the outer edge 203a of the metal layer 203. That is, the first covering portion 211 covers the outer edge 203a of the metal layer 203.

[0085] In addition, no opening is provided in the metal layer 203 located between the first covering portion 211 and the second covering portion 212. In a modified example, the metal layer 203 is provided on the entire surface between the first covering portion 211 and the second covering portion 212. Specifically, no opening is provided in the region of the metal layer 203 200 μm inward from the first covering portion 211, and the metal layer 203 is provided on the entire surface of the region. The lower inorganic sealing layer 108a, the resin sealing layer 108b, and the upper inorganic sealing layer 108c are sequentially stacked on the metal layer 203 between the first covering portion 211 and the second covering portion 212.

[0086] Fig.11 This is an enlarged view of the covering portion 210 provided at the outer edge portion 203a of the metal layer 203 of the display device 1A. Fig. 9 The same figure is an enlarged view of the XI part of the embodiment. Figure 6 The structure is the same as that in which the second covering portion 212 is replaced by the first covering portion 211.

[0087] As shown in the figure, the outer edge 203a of the metal layer 203 is covered by the first covering portion 211. Specifically, the first covering portion 211 covers the corners and side surfaces of the outer edge 203a of the metal layer 203. The first covering portion 211 has a conical cross-sectional shape that protrudes in a direction opposite to the direction toward one main surface 101c of the substrate 101. In addition, the first covering portion 211 has a trapezoidal shape at a portion above the metal layer 203.

[0088] The metal layer 203 is inverted-cone-shaped at the side of the outer edge 203a, but the first covering portion 211 covers the corner and side of the outer edge 203a, and the upper two side surfaces of the first covering portion 211 are in the shape of a positive cone. Therefore, it is possible to suppress cracks such as fractures from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the first covering portion 211. Thus, it is possible to suppress the intrusion of moisture from the outside.

[0089] Fig.12 This is an enlarged view of the covering portion 210 provided in the opening 203b of the metal layer 203 of the display device 1A. Fig. 9 The same figure is an enlarged view of the XII part of the embodiment. Figure 7 The structure is the same as that after the third covering portion 213 is replaced by the second covering portion 212.

[0090] As shown in the figure, the opening 203b of the metal layer 203 is covered by the second covering portion 212. Specifically, the second covering portion 212 covers the corners and inner peripheral side surfaces of the opening 203b of the metal layer 203. The second covering portion 212 has a conical cross-sectional shape that protrudes in a direction opposite to the direction toward one main surface 101c of the substrate 101. In addition, the second covering portion 212 has a trapezoidal shape at a portion above the metal layer 203.

[0091] The metal layer 203 is inverted-cone-shaped at the side of the opening 203b, but the second covering portion 212 covers the corner and side of the opening 203b, and the upper two side surfaces of the second covering portion 212 are in the shape of a positive cone. Therefore, it is possible to suppress cracks such as fractures from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the second covering portion 212. Thus, it is possible to suppress the intrusion of moisture from the outside.

[0092] Thus, in the modified example, the outer edge 203a or the opening 203b of the metal layer 203 is also covered by the covering portion 210. Therefore, it is possible to suppress cracks from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the covering portion 210. This can suppress moisture from entering the interior of the display device 1A.

[0093] (summary) The display device of the present invention is exemplified below.

[0094] The display device of Example 1 comprises: a substrate 101; an interlayer insulating layer 102, which is provided on one main surface 101c of the substrate 101 and includes a resin material; an organic EL array 160, which is provided on the interlayer insulating layer 102 and includes a plurality of organic EL elements 150; a metal layer 203, which is provided on the interlayer insulating layer 102 and is connected to the organic EL array 160 and is provided outside the organic EL array 160; a covering portion 210, which is provided on the interlayer insulating layer 102 and is located outside the organic EL array 160 and inside the peripheral region 102a of the interlayer insulating layer 102; and a lower inorganic sealing layer 108a, which covers the organic EL array 160, the metal layer 203 and the covering portion 210. 10, and is continuously provided from the organic EL array 160, the metal layer 203, and the covering portion 210 to the outer peripheral region 102a of the interlayer insulating layer 102; the resin sealing layer 108b covers at least a portion of the lower inorganic sealing layer 108a located on the organic EL array 160 and the metal layer 203, and is provided at a position inside the outer peripheral region 102a of the interlayer insulating layer 102; and the upper inorganic sealing layer 108c covers the resin sealing layer 108b and is continuously provided from the resin sealing layer 108b to the outer peripheral region 102a of the interlayer insulating layer 102 in a manner of the outer peripheral region 102a and the lower inorganic sealing layer 108a of the interlayer insulating layer 102. At least a portion of the outer edge portion 203a of the metal layer 203 has a conical cross-sectional shape that protrudes in a direction opposite to the direction toward one main surface 101c of the substrate 101, and the outer edge portion 203a is covered by the covering portion 210.

[0095] Thus, since the outer edge portion 203a of the metal layer 203 is covered by the covering portion 210, cracks can be suppressed from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the covering portion 210. Thus, moisture can be suppressed from entering the interior of the display device.

[0096] The display device of Example 2 may be the display device described in Example 1, wherein the covering portion 210 has a tapered cross-sectional shape that protrudes in a direction opposite to a direction toward the one main surface 101 c of the substrate 101 .

[0097] Thus, by forming the covering portion 210 into a tapered cross-sectional shape, the lower inorganic sealing layer 108a can be formed without interruption on the metal layer 203 and the covering portion 210. Therefore, it is possible to suppress the formation of cracks in the lower inorganic sealing layer 108a. Thus, it is possible to suppress the intrusion of moisture into the interior of the display device.

[0098] The display device of Example 3 may be the display device described in Example 1 or 2, further comprising a bank 104 provided so as to surround the organic EL element 150. The covering portion 210 may be formed of the same material as that of the bank 104.

[0099] In this way, the bank 104 and the covering portion 210 can be formed simultaneously. Thus, there is no need to provide a new layer for forming the covering portion 210, and the covering portion 210 can be formed in a simple process. Thus, a display device capable of suppressing water intrusion in a simple process can be provided.

[0100] The display device of Example 4 may be the display device described in any one of Examples 1 to 3, comprising: a first region 10 including a TFT layer 101b of a substrate 101; and a second region 20 located outside the first region 10. When viewed from a direction perpendicular to the substrate 101, the outer edge portion 203a and the covering portion 210 of the metal layer 203 may be located in the first region 10, and the outer peripheral region 102a of the interlayer insulating layer 102 may be located in the second region 20.

[0101] Thus, by providing the outer edge 203a of the metal layer 203 in the first region 10, the outer edge 203a of the metal layer 203 can be kept away from the external environment. Thus, the portion where cracks may occur can be kept away from the external environment, and the formation of cracks can be suppressed. Thus, the intrusion of moisture into the interior of the display device can be suppressed.

[0102] The display device 1 of Example 5 may be the display device described in any one of Examples 1 to 4, wherein the covering portion 210 includes a first covering portion 211 located at the outermost side and a second covering portion 212 located inside the first covering portion 211. The outer edge portion 203a of the metal layer 203 is located inside the first covering portion 211 and is covered by the second covering portion 212.

[0103] Thus, since the outer edge 203a of the metal layer 203 is covered by the second covering portion 212, cracks can be suppressed from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the second covering portion 212. Thus, moisture can be suppressed from entering the display device 1.

[0104] The display device 1 of Example 6 may be the display device described in Example 5, wherein the metal layer 203 has an opening 203b located inside the outer edge 203a of the metal layer 203. The covering portion 210 further includes a third covering portion 213 located inside the second covering portion 212. The opening 203b of the metal layer 203 may also be covered by the third covering portion 213.

[0105] Thus, since the opening 203b of the metal layer 203 is covered by the third covering portion 213, cracks can be suppressed from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the third covering portion 213. Thus, moisture can be suppressed from entering the display device 1.

[0106] The display device 1 of Example 7 may be such that the metal layer 203 is not provided between the first covering portion 211 and the second covering portion 212 , and the lower inorganic sealing layer 108 a , the resin sealing layer 108 b , and the upper inorganic sealing layer 108 c are sequentially stacked on the interlayer insulating layer 102 .

[0107] For example, when an opening of the metal layer 203 is provided between the first covering portion 211 and the second covering portion 212, when the resin sealing layer 108b is formed by a wet film forming method such as an inkjet method, film formation using the wetting and spreading of the resin sealing material is hindered by the opening. In this example, since the metal layer 203 is not provided between the first covering portion 211 and the second covering portion 212, an opening is not provided, and film formation can be performed using the fluidity of the resin sealing material. As a result, the resin sealing layer 108b can be appropriately formed, and moisture intrusion into the interior of the display device 1 can be suppressed.

[0108] The display device 1A of Example 8 may be the display device described in any one of Examples 1 to 4, wherein the covering portion 210 includes a first covering portion 211 located at the outermost side and a second covering portion 212 located inside the first covering portion 211. The outer edge portion 203a of the metal layer 203 may be covered by the first covering portion 211.

[0109] Since the outer edge 203a of the metal layer 203 is covered by the first covering portion 211, cracks can be suppressed from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the first covering portion 211. This can suppress moisture from entering the display device 1A.

[0110] The display device 1A of Example 9 may be the display device described in Example 8, wherein the metal layer 203 has an opening 203 b at a location inside the outer edge portion 203 a of the metal layer 203 . The opening 203 b of the metal layer 203 may be covered by the second covering portion 212 .

[0111] Since the opening 203b of the metal layer 203 is covered by the second covering portion 212, cracks can be suppressed from forming in the lower inorganic sealing layer 108a disposed on the metal layer 203 and the second covering portion 212. Thus, moisture can be suppressed from entering the display device 1A.

[0112] The display device 1A of Example 10 may be the display device described in Example 9, wherein no opening is provided between the first covering portion 211 and the second covering portion 212, a metal layer 203 is provided on the entire surface between the first covering portion 211 and the second covering portion 212, and a lower inorganic sealing layer 108a, a resin sealing layer 108b and an upper inorganic sealing layer 108c are sequentially stacked on the metal layer 203.

[0113] For example, if an opening of the metal layer 203 is provided between the first covering portion 211 and the second covering portion 212, when the resin sealing layer 108b is formed by a wet film forming method such as an inkjet method, film formation using the wetting and spreading of the resin sealing material is hindered by the opening. In this example, since no opening is provided in the metal layer 203, film formation can be performed using the fluidity of the resin sealing material. Thus, the resin sealing layer 108b can be appropriately formed, and moisture can be suppressed from entering the interior of the display device 1A.

[0114] The display device 1A of Example 11 may be the display device described in Example 9 or 10, wherein no opening is provided in the region 200 μm inward from the first covering portion 211 of the metal layer 203 , and the metal layer 203 is provided over the entire surface of the region.

[0115] For example, if an opening of the metal layer 203 is provided in a region 200 μm inward from the first covering portion 211, when the resin sealing layer 108b is formed by a wet film forming method such as an inkjet method, film formation using the wetting and spreading of the resin sealing material is hindered by the opening. In this example, since no opening is provided in a region 200 μm inward from the metal layer 203, film formation can be performed using the fluidity of the resin sealing material. Thus, the resin sealing layer 108b can be appropriately formed, and moisture can be suppressed from entering the interior of the display device 1A.

[0116] (Other methods) The display device of the present invention has been described above based on the embodiments, but the present invention is not limited to the above embodiments. Various modifications that can be implemented by those skilled in the art without departing from the gist of the present invention and various devices in which the display device of the present invention is built are also included in the present invention.

[0117] The opening 203b shown in the embodiment has a slit shape, but is not limited thereto. For example, the opening may be a quadrilateral, an ellipse, or a circle.

[0118] For example, the organic EL element 150 can be formed by sequentially stacking a pixel electrode, a hole injection layer, an organic layer, an electron injection layer, and an opposing electrode. In addition, a hole transport layer can be formed between the hole injection layer and the organic layer. An electron transport layer can also be formed between the organic layer and the electron injection layer. In order to inhibit electrons from reaching the hole transport layer, an electron blocking layer can also be formed between the hole transport layer and the organic layer. Industrial Applicability

[0119] The display device of one embodiment of the present invention can be widely used in various electronic devices including televisions, personal computers, mobile phones, and other devices having display panels. Description of reference numerals:

[0120] 1. 1A: display device; 10: first region; 20: second region; 101: substrate; 101a: base material; 101b: TFT layer; 101c: one main surface; 101d: other main surface; 102: interlayer insulating layer; 102a: peripheral region; 102b: peripheral groove; 103: pixel electrode; 104: dam; 105: light-emitting layer; 107: counter electrode; 108: sealing layer; 108a: lower inorganic sealing layer; 108b: resin sealing layer; 108c: upper inorganic sealing layer; 109: adhesive layer; 110: sheet; 115: blocking member; 150: organic EL element; 160: organic EL array; 203: metal layer; 203a: outer edge; 203b: opening; 210, 211, 212, 213: covering portion.

Claims

1. A display device, characterized in that: have: substrate; an interlayer insulating layer, provided on one main surface side of the substrate, and comprising a resin material; An organic EL array, disposed on the interlayer insulating layer, comprising a plurality of organic EL elements; a metal layer, on the interlayer insulating layer, connected to the organic EL array and arranged outside the organic EL array; a covering portion, arranged on the interlayer insulating layer, at a position outside the organic EL array and inside the outer peripheral region of the interlayer insulating layer; A lower inorganic sealing layer is continuously provided from the organic EL array, the metal layer and the covering portion to the outer peripheral area of ​​the interlayer insulating layer to cover the organic EL array, the metal layer and the covering portion; a resin sealing layer covering at least a portion of the lower inorganic sealing layer located on the organic EL array and the metal layer, and disposed at an inner side than an outer peripheral region of the interlayer insulating layer; and an upper inorganic sealing layer covering the resin sealing layer and being continuously provided from the resin sealing layer to the peripheral region of the interlayer insulating layer so as to overlap with the lower inorganic sealing layer in the peripheral region of the interlayer insulating layer, At least a portion of an outer edge portion of the metal layer has a tapered cross-sectional shape that protrudes in a direction opposite to a direction toward one main surface of the substrate, and the outer edge portion is covered by the covering portion.

2. The display device according to claim 1, characterized in that The covering portion has a tapered cross-sectional shape that protrudes in a direction opposite to a direction toward one main surface of the substrate.

3. The display device according to claim 1, characterized in that The display device further includes a bank arranged to surround the organic EL element. The covering portion is formed of the same material as that of the dam.

4. The display device according to claim 1, characterized in that The display device comprises: a first region including a TFT layer of the substrate; and a second region located outside the first region. When viewed from a direction perpendicular to the substrate, The outer edge portion of the metal layer and the covering portion are located in the first region, The outer peripheral region of the interlayer insulating layer is located in the second region.

5. The display device according to any one of claims 1 to 4, characterized in that: The covering portion includes a first covering portion located at the outermost side and a second covering portion located at the inner side of the first covering portion. The outer edge portion of the metal layer is located inside the first covering portion and is covered by the second covering portion.

6. The display device according to claim 5, characterized in that: The metal layer has an opening at a location inside the outer edge of the metal layer. The covering portion further includes a third covering portion located on the inner side than the second covering portion. The opening of the metal layer is covered by the third covering portion.

7. The display device according to claim 5, characterized in that: The metal layer is not provided between the first covering portion and the second covering portion, and the lower inorganic sealing layer, the resin sealing layer, and the upper inorganic sealing layer are sequentially stacked on the interlayer insulating layer.

8. The display device according to any one of claims 1 to 4, characterized in that: The covering portion includes a first covering portion located at the outermost side and a second covering portion located at the inner side of the first covering portion. The outer edge portion of the metal layer is covered by the first covering portion.

9. The display device according to claim 8, characterized in that: The metal layer has an opening at a location inside the outer edge of the metal layer. The opening of the metal layer is covered by the second covering portion.

10. The display device according to claim 9, characterized in that: The opening is not provided between the first covering portion and the second covering portion, the metal layer is provided on the entire surface between the first covering portion and the second covering portion, and the lower inorganic sealing layer, the resin sealing layer and the upper inorganic sealing layer are sequentially stacked on the metal layer.

11. The display device according to claim 9, characterized in that The opening is not provided in a region of the metal layer 200 μm inward from the first covering portion, and the metal layer is provided on the entire surface of the region.

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