Display panel, method for manufacturing display panel, and display device

Abstract

The present invention provides a display panel, a method for preparing a display panel, and a display device, comprising: a display area and a bending area on one side of the display area; in the bending area, the display panel comprises a substrate, a first organic layer, a first wiring layer, and a second organic layer; the first organic layer is arranged on one side of the substrate, the second organic layer is arranged on a side of the first organic layer away from the substrate, and the first wiring layer is arranged between the first organic layer and the second organic layer; the thickness of the first organic layer in the bending area is less than the thickness in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness in the display area. Different thicknesses of the first organic layer and the second organic layer are used to adjust the equilibrium position of the compressive stress below the metal wiring and the tensile stress above the metal wiring, so that the equilibrium position is as close to the metal wiring as possible, thereby reducing the risk of metal wiring breakage in the bending area.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) has great development potential in the display field due to its advantages of rich colors and fast response.

[0003] There are a large number of metal traces transmitting signals in the border area of ​​OLED display panels. The width of the lower border is reduced by bending. However, due to the different intrinsic stresses of each film layer, the metal traces in the bending area may break abnormally, thus affecting the display quality of the OLED. Summary of the invention

[0004] The present invention provides a display panel, a method for manufacturing the display panel and a display device, which reduce the risk of metal wiring disconnection in a bending area.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, comprising: a display area and a bending area located at one side of the display area;

[0006] In the bending area, the display panel includes a substrate, a first organic layer, a first wiring layer and a second organic layer; the first organic layer is arranged on one side of the substrate, the second organic layer is arranged on a side of the first organic layer away from the substrate, and the first wiring layer is arranged between the first organic layer and the second organic layer; the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area.

[0007] Optionally, an absolute value of a difference between a thickness of the first organic layer in the bending area and a thickness of the first organic layer in the display area is negatively correlated with a bending radius of the bending area.

[0008] Optionally, when the bending radius of the bending zone is less than a first preset radius, the thickness of the first organic layer in the bending zone is less than the thickness of the first organic layer in the display zone, or the thickness of the first organic layer in the bending zone is less than the thickness of the first organic layer in the display zone and the thickness of the second organic layer in the bending zone is less than the thickness of the second organic layer in the display zone;

[0009] When the bending radius of the bending zone is greater than the second preset radius, the thickness of the second organic layer in the bending zone is less than the thickness of the second organic layer in the display area, or the thickness of the first organic layer in the bending zone is less than the thickness of the first organic layer in the display area and the thickness of the second organic layer in the bending zone is less than the thickness of the second organic layer in the display area; the first preset radius is less than the second preset radius.

[0010] Optionally, the display panel includes a stress release layer, the stress release layer is arranged on a side of the second organic layer away from the substrate, and the stress release layer is used to release the bending stress of the first wiring layer;

[0011] Optionally, the stress release layer includes stress release holes, and the stress release holes are arranged at intervals;

[0012] Optionally, the stress release layer includes stress release grooves, and the stress release grooves are arranged at intervals;

[0013] Optionally, the stress release layer includes stress release holes and stress release grooves; the stress release holes and the stress release grooves are arranged at intervals;

[0014] Optionally, the bending region further includes a protective adhesive layer, and the protective adhesive layer is arranged on a side of the stress release layer away from the substrate.

[0015] Optionally, the display area includes a pixel driving circuit layer, a first planarization layer, a second planarization layer, a second wiring layer and a light-emitting functional layer;

[0016] The pixel driving circuit layer is arranged on one side of the substrate, the first planarization layer is arranged on a side of the pixel driving circuit layer away from the substrate, the second wiring layer is arranged on a side of the first planarization layer away from the substrate, the second planarization layer is arranged on a side of the second wiring layer away from the substrate, and the light emitting function layer is arranged on a side of the second planarization layer away from the substrate; the light emitting function layer is electrically connected to the pixel driving circuit layer through the second wiring layer;

[0017] Preferably, the first planarization layer is disposed in the same layer as the first organic layer; and the second planarization layer is disposed in the same layer as the second organic layer.

[0018] Optionally, the first routing layer and the second routing layer are arranged on the same layer.

[0019] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, wherein the display panel comprises: a display area, and a bending area arranged on one side of the display area;

[0020] A first organic layer, a first wiring layer, and a second organic layer are formed in sequence on one side of the substrate in the bending area along a thickness direction away from the substrate; wherein the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area.

[0021] Optionally, when forming the first organic layer, the organic material of the first organic layer is exposed in the bending area using a grayscale mask so that the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, and or when forming the second organic layer, the organic material of the second organic layer is exposed in the bending area using the grayscale mask so that the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area.

[0022] Optionally, after preparing the second organic layer, the method further comprises:

[0023] preparing a stress release layer, wherein the stress release layer is disposed on a side of the second organic layer away from the substrate, and the stress release layer releases the bending stress of the first wiring layer;

[0024] Optionally, the stress release layer includes stress release holes, and the stress release holes are arranged at intervals;

[0025] Optionally, the stress release layer includes stress release grooves, and the stress release grooves are arranged at intervals;

[0026] Optionally, the stress release layer includes stress release holes and stress release grooves; the stress release holes and the stress release grooves are arranged at intervals.

[0027] In a third aspect, an embodiment of the present invention further provides a display device, comprising the display panel described in any embodiment of the present invention.

[0028] The technical solution provided by the embodiment of the present invention is to arrange a first organic layer and a second organic layer on the relative surfaces of the first wiring layer in the bending area, wherein the thickness of the first organic layer in the bending area is less than the thickness in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness in the display area, and the different thicknesses of the first organic layer and the second organic layer are utilized to achieve the adjustment of the equilibrium position of the compressive stress below the metal wiring and the tensile stress above the metal wiring, so that the equilibrium position is as close to the metal wiring as possible, thereby reducing the risk of metal wiring breakage in the bending area. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of a structure of a bending state of a bending zone provided by an embodiment of the present invention;

[0031] Figure 3 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention;

[0032] Figure 4 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention;

[0033] Figure 5 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention;

[0034] Figure 6 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention;

[0036] Figure 8 A schematic flow chart of a method for manufacturing a display panel is provided for an embodiment of the present invention;

[0037] Fig. 9 A schematic flow chart of another method for manufacturing a display panel is provided for an embodiment of the present invention;

[0038] Fig.10 A schematic flow chart of another method for manufacturing a display panel is provided for an embodiment of the present invention;

[0039] Fig.11 A schematic flow chart of another method for manufacturing a display panel is provided for an embodiment of the present invention;

[0040] Fig.12 A schematic flow chart of another method for manufacturing a display panel is provided for an embodiment of the present invention;

[0041] Fig.13 A schematic flow chart of another method for manufacturing a display panel is provided for an embodiment of the present invention;

[0042] Fig.14 A schematic flow chart of a method for manufacturing a display panel is provided for an embodiment of the present invention;

[0043] Fig.15 A schematic diagram for verifying the thickness of an organic planar layer is provided for an embodiment of the present invention;

[0044] Fig.16 A schematic diagram of a cross-sectional structure of a first grayscale mask is provided for an embodiment of the present invention;

[0045] Fig.17A schematic cross-sectional structure diagram of a second grayscale mask is provided for an embodiment of the present invention;

[0046] Fig.18 A structural schematic diagram of a display device is provided for an embodiment of the present invention. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] Usually, a large number of metal traces are provided in the frame of an OLED display panel. When forming a module of an OLED display panel, a bending method is adopted to reduce the width of the frame. In the related technology, usually, the thickness of the organic layer on the metal trace in the bending area is consistent in different areas of the panel. Therefore, at different bending radii, due to the different intrinsic stresses of adjacent film layers of the metal trace, the metal trace will form a larger tensile stress or compressive stress on one side. As the bending radius decreases, the stress on the metal trace after bending increases. When it exceeds the upper limit of the metal trace material, it leads to an abnormal problem of trace breakage.

[0049] In view of this, Figure 1 A schematic diagram of a display panel according to an embodiment of the present invention is shown in FIG. Figure 1 In the bending area 120, the display panel includes a substrate 130, a first organic layer 140, a first wiring layer 160 and a second organic layer 150; the first organic layer 140 is arranged on one side of the substrate 130, the second organic layer 150 is arranged on a side of the first organic layer 140 away from the substrate 130, and the first wiring layer 160 is arranged between the first organic layer 140 and the second organic layer 150; the first wiring layer 160 is arranged between the first organic layer 140 and the second organic layer 150; the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110, and the thickness of the second organic layer 150 in the bending area 120 is less than the thickness of the second organic layer 150 in the display area 110.

[0050] Specifically, the display panel includes a display area 110 and a bending area 120, the bending area 120 is arranged on one side of the display area 110, the display panel includes a substrate 130, in the display area 110, a pixel driving circuit layer, a first planarization layer 141, a second wiring layer 161, a second planarization layer 151 and a light-emitting functional layer 170 are arranged on one side of the substrate 130, the pixel driving circuit layer includes a pixel driving circuit, a transistor 180 and a capacitor are arranged in the pixel driving circuit, the first planarization layer 141 is arranged on the side of the pixel driving circuit layer away from the substrate 130, and the second wiring layer 161 is arranged on the side of the pixel driving circuit layer away from the substrate 130. The first planarization layer 141 is disposed on a side away from the substrate 130, the second planarization layer 151 is disposed on a side away from the substrate 130 of the second wiring layer 161, the light-emitting functional layer 170 is disposed on a side away from the substrate 130 of the second planarization layer 151, the light-emitting functional layer 170 includes an anode layer 171, a light-emitting layer 172 and a cathode layer 173, the anode layer 171 is disposed on the second planarization layer 151, a pixel definition layer 190 is disposed on the anode layer 171, the pixel definition layer 190 includes a pixel opening, the light-emitting layer 172 is disposed in the pixel opening, and the cathode layer 173 is disposed on the light-emitting layer 172. Among them, the anode layer 171 is used as an anode, the cathode layer 173 is used as a cathode, and the light-emitting layer 172 in the pixel opening forms a light-emitting device. The anode is electrically connected to the drain of the transistor 180, wherein the electrical connection can be achieved by providing a first through-hole structure in the first planarization layer 141, the metal in the second wiring layer 161 is electrically connected to the drain of the transistor through the first through-hole structure, a second through-hole structure is provided on the second planarization layer 151, the second through-hole structure can expose the metal connection area in the second wiring layer 161, and the anode is electrically connected to the second wiring layer 161 through the second through-hole structure. The pixel driving circuit layer can thus drive the correspondingly connected light-emitting device.

[0051] The light-emitting layer 172 can generally be formed by evaporation, and the light-emitting functional layer 170 can also include an electron transport layer and a hole transport layer for balancing electrons and holes, and an electron injection layer and a hole injection layer for enhancing the injection of electrons and holes. When the light-emitting device is driven by an electric field, electrons are injected from the cathode into the electron transport layer, and holes are injected from the anode into the hole transport layer. Electrons migrate to the light-emitting layer through the electron transport layer, and holes migrate to the light-emitting layer through the hole transport layer, so that electrons and holes meet in the light-emitting layer, forming excitons and exciting the light-emitting molecules, and emitting visible light through radiation.

[0052] The bending area 120 can be bent, and when the bending area 120 is bent, the wiring of the display area 110 can be bent to the back of the display panel, wherein the substrate 130 at the position of the bending area 120 is a flexible substrate 130, such as a polyimide substrate 130. In the bending area 120, a first organic layer 140, a first wiring layer 160, and a second organic layer 150 are stacked on one side of the substrate 130, wherein the first wiring layer 160 includes a plurality of metal wirings, and the metal wirings are used for signal transmission between the driving chip and or the flexible circuit board and the display area 110. Exemplarily, the first organic layer 140 and the first planarization layer 141 can be arranged in the same layer, and during the manufacturing process, the first planarization layer 141 covers the pixel driving circuit layer and extends to the bending area 120. The first wiring layer 160 and the second wiring layer 161 can also be arranged in the same layer, and during the manufacturing process, the second wiring layer 161 and the first wiring layer 160 can be formed simultaneously by patterning the same conductive layer. The second organic layer 150 and the second planarization layer 151 may be provided in the same layer. During the manufacturing process, the second planarization layer 151 covers the second wiring layer 161 and extends to the bending region 120 , thereby reducing the manufacturing steps in the manufacturing process.

[0053] Figure 2 A schematic diagram of a bending state of a bending zone provided in an embodiment of the present invention, see Figure 2 In the bending area 120, the metal trace 162 is between the first organic layer 140 and the second organic layer 150. When bending, the first organic layer 140 and the second organic layer 150 can generate compressive stress F1 and tensile stress F2 on the metal trace 162. In an ideal state, when the neutral point A of the resultant force of the compressive stress F1 and the tensile stress F2 is on the metal trace 162, the stress on the metal trace 162 is minimal. Therefore, combined with Figure 2 In some embodiments, by performing a resultant force analysis on the bending state at a certain bending radius, the resultant force neutral point A is located at the lower film layer of the metal trace 162, that is, the resultant force neutral point A is located at the film layer of the metal trace 162 close to the substrate 130. In other words, the metal trace 162 is subjected to a large tensile stress F2. Therefore, it is necessary to adjust the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150 so that the resultant force neutral point A is close to or located at the metal trace 162. In the embodiment of the present invention, the thickness d1 of the first organic layer 140 in the bending area is less than the thickness d2 of the first planarization layer 141 in the display area, and the thickness d3 of the second organic layer 150 in the bending area is less than the thickness d4 of the second planarization layer 151 in the display area. In other words, by reducing the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150, the resultant force neutral point A is closer to the metal trace 162. When the bending area 120 is in a bent state for a long time, the bending stress of the metal trace 162 can be reduced, thereby reducing the risk of disconnection of the metal trace 162 .

[0054] The materials of the first organic layer 140 and the second organic layer 150 may include one or more of polyacryl resin, polyimide resin, polyamide resin, siloxane resin, acryl resin and epoxy resin. In the process of manufacturing the first organic layer 140 and the second organic layer 150 in the bending area 120, a gray tone mask (GTM) may be used, while a conventional mask may be used in the display area. Therefore, the thickness of the organic layer in the bending area 120 can be reduced while the thickness d1 of the first planarization layer 141 and the thickness d4 of the second planarization layer 151 in the display area 110 remain unchanged, so that the thickness of the first organic layer 140 in the bending area 120 is less than that in the display area 110 and the thickness of the second organic layer 150 in the bending area 120 is less than that in the display area 110, thereby reducing the risk of disconnection of the metal wiring 162 in the bending area 120, while ensuring the flatness of the display area 110 and ensuring that the display effect of the display area 110 is not affected.

[0055] Based on the above embodiments, Figure 3 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 3 The first wiring layer 160 is disposed between the first organic layer 140 and the second organic layer 150 ; the thickness of the first organic layer 140 in the bending area 120 is less than the thickness in the display area 110 .

[0056] Specific, combined Figure 2 In some embodiments, by analyzing the resultant force of the bending state at a certain bending radius, the resultant force neutral point A is located at the lower film layer of the metal wiring 162, that is, the resultant force neutral point A is located at the film layer of the metal wiring 162 close to the substrate 130. In other words, the tensile stress F2 of the metal wiring 162 is relatively large, and the thickness of the first organic layer 140 can be adjusted to adjust the resultant force neutral point A. See Figure 3 The thickness d1 of the first organic layer 140 in the bending region is less than the thickness d2 of the first planarization layer 141 in the display region. By reducing the thickness d1 of the first organic layer 140, the neutral point A of the resultant force is closer to or located at the metal wiring 162. Therefore, when the bending region 120 is in a bending state for a long time, the bending stress of the metal wiring 162 can be reduced, thereby reducing the risk of disconnection of the metal wiring 162.

[0057] In the process of manufacturing the first organic layer 140 in the bending area 120, a grayscale mask (GTM) can be used, while a conventional mask can be used in the display area. Therefore, while keeping the thickness of the first planarization layer 141 in the display area 110 unchanged, the thickness of the organic layer in the bending area 120 can be reduced, so that the thickness of the first organic layer 140 in the bending area 120 is less than that in the display area 110, thereby reducing the risk of broken metal wiring 162 in the bending area 120, while ensuring the flatness of the display area 110 and ensuring that the display effect of the display area 110 is not affected.

[0058] Based on the above embodiments, Figure 4 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 4 The first wiring layer 160 is disposed between the first organic layer 140 and the second organic layer 150 , and the thickness of the second organic layer 150 in the bending area 120 is less than the thickness in the display area 110 .

[0059] Specifically, by analyzing the resultant force of the bending state at a certain bending radius, the resultant force neutral point A is located at the upper film layer of the metal trace 162, that is, the resultant force neutral point A is located at the film layer of the metal trace 162 away from the substrate 130. In other words, the compressive stress F1 on the metal trace 162 is relatively large. The resultant force neutral point A is adjusted by adjusting the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150. Figure 4 The thickness d3 of the second organic layer 150 in the bending region is less than the thickness d4 of the second planarization layer 151 in the display region. By reducing the thickness d3 of the second organic layer 150, the neutral point A of the resultant force is closer to or located at the metal wiring 162. Therefore, when the bending region 120 is in a bending state for a long time, the bending stress of the metal wiring 162 can be reduced, thereby reducing the risk of disconnection of the metal wiring 162.

[0060] Among them, a gray tone mask (GTM) can be used in the process of manufacturing the second organic layer 150 in the bending area 120, and a conventional mask can be used in the display area. Therefore, the thickness of the organic layer in the bending area 120 can be reduced while keeping the thickness d4 of the second planarization layer 151 in the display area 110 unchanged, so that the thickness of the second organic layer 150 in the bending area 120 is less than that in the display area 110, thereby achieving the goal of reducing the risk of disconnection of the metal wiring 162 in the bending area 120 while ensuring the flatness of the display area 110 and ensuring that the display effect of the display area 110 is not affected.

[0061] The technical solution provided by the embodiment of the present invention is to arrange a first organic layer and a second organic layer on relative surfaces of the first wiring layer in the bending area, wherein the thickness of the first organic layer in the bending area is less than the thickness in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness in the display area. Different thicknesses of the first organic layer and the second organic layer are utilized to adjust the equilibrium position of the compressive stress below the metal wiring and the tensile stress above the metal wiring, so that the equilibrium position is as close to the metal wiring as possible, thereby reducing the risk of metal wiring breakage in the bending area.

[0062] Optionally, the absolute value of the difference between the thickness of the first organic layer 140 in the bending zone 120 and the thickness of the first organic layer 140 in the display area 110 is negatively correlated with the bending radius of the bending zone. In some embodiments, as the bending radius of the bending zone 120 decreases, the bending angle will increase accordingly, the deformation degree of the bending zone 120 will also increase accordingly, the position of the resultant neutral point A will gradually move inwardly of the bending center, and the stress on the metal trace 162 in the bending zone 120 will become greater and greater. Therefore, the resultant neutral point A can be made closer to / located at the metal trace 162 by reducing the thickness d1 of the first organic layer 140. In other words, when the resultant neutral point A is at the lower film layer of the metal trace 162, the thickness of the first organic layer 140 in the bending zone 120 can be reduced, that is, the absolute value of the difference between the thickness of the first organic layer 140 in the bending zone 120 and the thickness of the first organic layer 140 in the display area 110 is increased.

[0063] In some embodiments, the resultant neutral point A can also be adjusted by reducing the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150 so that the resultant neutral point A is closer to the metal wiring 162. However, when the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150 are reduced, the thickness that can be allowed to be reduced by the second organic layer 150 also becomes smaller. At this time, the first organic layer 140 plays a major role in adjusting the resultant neutral point A. When the second organic layer 150 plays a role in adjusting the position of the resultant neutral point A, it can also play a protective and supporting role for the side of the metal wiring 162 close to the second organic layer 150.

[0064] Based on the above embodiment, optionally, when the bending radius of the bending area 120 is less than the first preset radius, the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110, or the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110 and the thickness of the second organic layer in the bending area 120 is less than the thickness of the second organic layer in the display area 110; when the bending radius of the bending area 120 is greater than the second preset radius, the thickness of the second organic layer in the bending area 120 is less than the thickness of the second organic layer in the display area 110, or the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110 and the thickness of the second organic layer in the bending area 120 is less than the thickness of the second organic layer in the display area 110;

[0065] Specifically, as the bending radius of the bending zone 120 decreases, the position of the resultant force neutral point A will gradually move inwardly toward the center of the bend. Therefore, there is at least a first preset radius. When the bending radius of the bending zone 120 is less than the first preset radius, the resultant force neutral point A will be offset to the film layer on the side of the metal wiring 162 close to the substrate 130. In the design of the display panel, the bending angle of the bending zone 120 can be known. Therefore, when the bending radius of the bending zone 120 is less than the first preset radius, the resultant force neutral point A can be made closer to / located at the metal wiring 162 by reducing the thickness d1 of the first organic layer 140. The position of the resultant force neutral point A can also be adjusted by simultaneously reducing the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150, so that the resultant force neutral point A is closer to the metal wiring 162.

[0066] Similarly, as the bending radius of the bending zone 120 increases, the position of the resultant neutral point A will gradually move to the outside of the bending center. Therefore, there is at least a second preset radius. When the bending radius of the bending zone 120 is greater than the first preset radius, the resultant neutral point A will be offset to the film layer on the side of the metal wiring 162 away from the substrate 130. In the design of the display panel, the bending angle of the bending zone 120 can be known. Therefore, when the bending radius of the bending zone 120 is greater than the second preset radius, the resultant neutral point A can be made closer to / located at the metal wiring 162 by reducing the thickness d3 of the second organic layer 150. The position of the resultant neutral point A can also be adjusted by reducing the thickness d1 of the first organic layer 140 and the thickness d3 of the second organic layer 150 at the same time, so that the resultant neutral point A is closer to the metal wiring 162. Here, the first preset radius is smaller than the second preset radius.

[0067] Similarly, there is at least a bending radius range between the first preset radius and the second preset radius, and when the bending radius of the bending area 120 is within the bending radius range, the resultant neutral point A is close to / located at the metal wiring 162. At this time, the thickness of the first organic layer 140 and the second organic layer 150 can be fine-tuned according to factors such as the thickness of the display panel and the interlayer wiring. No specific limitation is made here.

[0068] Figure 5 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 5 The display panel includes a stress release layer 191 . The stress release layer 191 is disposed on a side of the second organic layer 150 away from the substrate 130 . The stress release layer 191 is used to release the bending stress of the first wiring layer 160 .

[0069] Specifically, the stress release layer 191 is disposed on the second organic layer 150, and a deformation notch for stress release may be disposed on the stress release layer 191. When the bending area is bent, the stress release layer 191 releases the stress of the underlying film layer through the deformation notch on the surface. Exemplarily, the stress release layer 191 may include stress release holes 192 that penetrate the stress release layer 191, wherein the stress release holes 192 are arranged at intervals, and the stress release holes 192 are used to release the stress of the metal traces 162 in the bent state. In terms of the manufacturing process, the stress release layer 191 may be prepared simultaneously with the pixel definition layer 190 in the display area 110. The pixel definition layer 190 provides a pixel opening in the display area, and the stress release layer 191 provides a stress release hole 192 through the bending area 120. The opening sizes of the pixel opening and the stress release hole 192 may be the same or different, and there is no specific limitation here. In some embodiments, the stress release layer 191 includes stress release grooves 193 arranged at intervals. Figure 6 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 6 , using the stress release groove 193 to release the stress of the bent metal trace 162. In some embodiments, the stress release layer 191 includes stress release holes 192 and stress release grooves 193 arranged at intervals. Figure 7 A schematic diagram of the structure of another display panel provided by an embodiment of the present invention is shown in FIG. Figure 7 The stress of the bent metal trace 162 is released by using the alternately arranged stress release holes 192 and the stress release grooves 193 .

[0070] In some embodiments, the bending zone 120 also includes a protective glue 410, and the protective glue layer 410 is arranged on the side of the stress release layer 191 away from the substrate 130; the protective glue layer 410 can be a UV glue, which provides protection for the outer layer of the bending zone 120, avoids shrinkage of the corners of the outer film layer, and further improves the bending toughness of the display panel of the bending zone 120.

[0071] Combination Figure 1 The display panel includes a display area 110 and a bending area 120, the bending area 120 is arranged on one side of the display area 110, the display panel includes a substrate 130, in the display area 110, a pixel driving circuit layer, a first planarization layer 141, a second wiring layer 161, a second planarization layer 151 and a light-emitting functional layer 170 are arranged on one side of the substrate 130, the pixel driving circuit layer includes a pixel driving circuit, a transistor and a capacitor are arranged in the pixel driving circuit, the first planarization layer 141 is arranged on the side of the pixel driving circuit layer away from the substrate 130, and the second wiring layer 161 is arranged on the second planarization layer 151. A planarization layer 141 is disposed on a side away from the substrate 130, a second planarization layer 151 is disposed on a side away from the substrate 130 of the second wiring layer 161, a light-emitting functional layer 170 is disposed on a side away from the substrate 130 of the second planarization layer 151, and the light-emitting functional layer 170 includes an anode layer 171, a light-emitting layer 172, and a cathode layer 173. The anode layer 171 is disposed on the second planarization layer 151, and a pixel definition layer 190 is disposed on the anode layer 171. The pixel definition layer 190 includes a pixel opening, and a light-emitting layer 172 is disposed in the pixel opening, and a cathode layer 173 is disposed on the light-emitting layer 172. The anode layer 171 is used as an anode, the cathode layer 173 is used as a cathode, and the light-emitting layer 172 in the pixel opening forms a light-emitting device. The anode layer 171 is electrically connected to the drain of the transistor 180, wherein the electrical connection can be achieved by setting a first through-hole structure in the first planarization layer 141, and the metal in the second wiring layer 161 is electrically connected to the drain of the transistor through the first through-hole structure, and a second through-hole structure is set on the second planarization layer 151, and the second through-hole structure can expose the metal connection area in the second wiring layer 161, and the anode layer 171 is electrically connected to the second wiring layer 161 through the second through-hole structure, so that the pixel driving circuit layer can drive the correspondingly connected light-emitting device.

[0072] The light-emitting layer 172 can generally be formed by evaporation, and the light-emitting functional layer 170 can also include an electron transport layer and a hole transport layer for balancing electrons and holes, and an electron injection layer and a hole injection layer for enhancing the injection of electrons and holes. When the light-emitting device is driven by an electric field, electrons are injected from the cathode into the electron transport layer, and holes are injected from the anode into the hole transport layer. Electrons migrate to the light-emitting layer 172 through the electron transport layer, and holes migrate to the light-emitting layer 172 through the hole transport layer, so that electrons and holes meet in the light-emitting layer 172, forming excitons and exciting the light-emitting molecules, and emitting visible light through radiation.

[0073] The first wiring layer 160 in the bending area 120 includes a plurality of metal wirings 162, and the metal wirings 162 are used for signal transmission between the driving chip and / or the flexible circuit board and the display area 110. The first organic layer 140 and the first planarization layer 141 can be arranged in the same layer. During the manufacturing process, the first planarization layer 141 covers the pixel driving circuit layer and extends to the bending area 120. The first wiring layer 160 and the second wiring layer 161 can also be arranged in the same layer. During the manufacturing process, the second wiring layer 161 and the first wiring layer 160 can be formed simultaneously by patterning the same conductive layer. The second organic layer 150 and the second planarization layer 151 can be arranged in the same layer. During the manufacturing process, the second planarization layer 151 covers the second wiring layer 161 and extends to the bending area 120, thereby reducing the manufacturing steps in the manufacturing process.

[0074] The embodiment of the present invention also provides a method for preparing a display panel, Figure 1 , Figure 3 and Figure 4 , wherein the display panel includes: a display area 110, and a bending area 120 on one side of the display area 110;

[0075] The preparation method of the display panel includes: forming a first organic layer 140, a first wiring layer 160 and a second organic layer 150 in sequence on one side of the substrate 130 in the bending area 120 away from the thickness direction of the substrate 130; wherein the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110, and / or the thickness of the second organic layer 150 in the bending area 120 is less than the thickness of the second organic layer 150 in the display area 110.

[0076] Specifically, the substrate 130 adopts a flexible substrate 130. When preparing the first organic layer 140 and / or the second organic layer 150, the organic material corresponding to the bending area 120 can use a mask plate with a first transmittance, and the organic material corresponding to the display area 110 can use a mask plate with a second transmittance. The first transmittance is greater than the second transmittance. Therefore, after the organic material is exposed, the organic film thickness of the bending area 120 will be smaller than the organic film thickness of the display area 110. According to the design requirements of the film thickness of the first organic layer 140 and the second organic layer 150 in the bending area 120, a display panel structure is achieved in which the thickness of the first organic layer 140 in the bending area 120 is smaller than the thickness in the display area 110, and / or the thickness of the second organic layer 150 in the bending area 120 is smaller than the thickness in the display area 110, while ensuring the flatness of the display area and the display effect of the display area.

[0077] Based on the above embodiments, Figure 8 A schematic diagram of a method for manufacturing a display panel is provided in accordance with an embodiment of the present invention. Figure 8 ,include:

[0078] S110, forming a first organic layer 140 on one side of the substrate 130, wherein the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110;

[0079] S120, forming a first wiring layer 160 on a side of the first organic layer 140 away from the substrate 130;

[0080] S130 , forming a second organic layer 150 on a side of the first wiring layer 160 away from the substrate 130 .

[0081] Fig. 9 A schematic diagram of a process for preparing another display panel is provided for an embodiment of the present invention. Fig. 9 ,include:

[0082] S210, forming a first organic layer 140 on one side of the substrate 130;

[0083] S220, forming a first wiring layer 160 on a side of the first organic layer 140 away from the substrate 130;

[0084] S230 , forming a second organic layer 150 on a side of the first wiring layer 160 away from the substrate 130 , wherein a thickness of the second organic layer 150 in the bending region 120 is smaller than a thickness of the second organic layer 150 in the display region 110 .

[0085] Fig.10 A schematic diagram of a process for preparing another display panel is provided for an embodiment of the present invention. Fig.10 ,include:

[0086] S310, forming a first organic layer 140 on one side of the substrate 130, wherein the thickness of the first organic layer 140 in the bending area 120 is less than the thickness of the first organic layer 140 in the display area 110;

[0087] S320, forming a first wiring layer 160 on a side of the first organic layer 140 away from the substrate 130;

[0088] S330 , forming a second organic layer 150 on a side of the first wiring layer 160 away from the substrate 130 , wherein a thickness of the second organic layer 150 in the bending region 120 is smaller than a thickness of the second organic layer 150 in the display region 110 .

[0089] Fig.11 A schematic flow chart of another method for manufacturing a display panel is provided for an embodiment of the present invention. The display panel includes: a display area 110, and a bending area 120 on one side of the display area 110, Figure 1 , Figure 3 and Figure 4 , see Fig.11 ,include:

[0090] S410, preparing a pixel driving circuit layer on one side of the substrate;

[0091] Specifically, the pixel driving circuit layer includes a pixel driving circuit, in which transistors and capacitor devices are arranged. The pixel driving circuit may be a 2T1C, 7T1C or 8T1C type pixel driving circuit.

[0092] S420, preparing a first planarization layer on a side of the pixel driving circuit layer away from the substrate;

[0093] Specifically, the first organic layer 140 of the bending area 120 and the first planarization layer 141 of the display area 110 can be arranged in the same layer. During the manufacturing process, the first planarization layer 141 covers the pixel driving circuit layer and extends to the bending area 120. According to the design requirements of the first organic layer 140 of the bending area 120, the organic material corresponding to the bending area 120 can use a mask plate with a first transmittance, and the organic material corresponding to the display area 110 can use a mask plate with a second transmittance. The first transmittance is greater than the second transmittance. Therefore, after the organic material is exposed, the thickness of the organic film in the bending area 120 can be smaller than the thickness of the organic film in the display area 110.

[0094] S430, preparing a second wiring layer on a side of the first planarization layer away from the substrate;

[0095] Specifically, the second routing layer 161 includes routing within the display panel, such as power voltage lines, scanning signal lines, data signal lines, light control signal lines, etc. The first routing layer 160 and the second routing layer 161 in the bending area 120 can also be set on the same layer. During the manufacturing process, the second routing layer 161 and the first routing layer 160 can be formed at the same time by patterning the same conductive layer.

[0096] S440, preparing a second flat layer on a side of the second wiring layer away from the substrate;

[0097] Specifically, the second organic layer 150 of the bending area 120 and the second planarization layer 151 of the display area 110 can be arranged in the same layer. During the manufacturing process, the second planarization layer 151 covers the pixel driving circuit layer and extends to the bending area 120. According to the design requirements of the second organic layer 150 of the bending area 120, the organic material corresponding to the bending area 120 can use a mask plate with a first transmittance, and the organic material corresponding to the display area 110 can use a mask plate with a second transmittance. The first transmittance is greater than the second transmittance. Therefore, after the organic material is exposed, the thickness of the organic film in the bending area 120 can be smaller than the thickness of the organic film in the display area 110.

[0098] S450, preparing a light-emitting functional layer on a side of the second planar layer away from the substrate;

[0099] The light-emitting functional layer 170 includes an anode layer 171, a light-emitting layer 172 and a cathode layer 173. The anode layer 171 is arranged on the second planarization layer 151. The pixel definition layer 190 is arranged on the anode layer 171. The pixel definition layer 190 includes a pixel opening. The light-emitting layer 172 is arranged in the pixel opening. The cathode layer 173 is arranged on the light-emitting layer 172. The anode layer 171 is used as an anode, and the cathode layer 173 is used as a cathode to form a light-emitting device with the light-emitting layer 172 in the pixel opening. The anode is electrically connected to the drain of the transistor 180. The electrical connection can be achieved by setting a first through-hole structure in the first planarization layer 141, and the metal in the second wiring layer 161 is electrically connected to the drain of the transistor through the first through-hole structure. A second through-hole structure is arranged on the second planarization layer 151. The second through-hole structure can expose the metal connection area in the second wiring layer 161. The anode is electrically connected to the second wiring layer 161 through the second through-hole structure. The pixel driving circuit layer can thus drive the correspondingly connected light-emitting device.

[0100] Based on the above embodiments, Fig.12 A schematic diagram of a process for preparing another display panel is provided for an embodiment of the present invention. Fig.12 ,include:

[0101] S510, forming a first organic layer 140 on one side of the substrate 130, and exposing an organic material of the first organic layer 140 in the bending area 120 using a grayscale mask, so that the thickness of the first organic layer 140 in the bending area 120 is smaller than the thickness in the display area 110;

[0102] Specifically, the grayscale mask can realize a partial light transmission function during the exposure process. The grayscale mask is a grid structure with gaps between the grids. The incident light can be diffracted through the gaps between the grids to the organic material to realize exposure. Therefore, a grayscale mask can be used when exposing the organic material in the bending area 120 to improve the transmittance of the incident light, while a conventional mask is used when exposing the organic material in the display area 110, so that the transmittance of the mask in the bending area 120 and the mask in the display area 110 is different. The grayscale mask used in the bending area 120 has a first transmittance, and the conventional mask used in the display area 110 has a second transmittance. The first transmittance is greater than the second transmittance. Therefore, after the organic material is exposed, the thickness of the organic film in the bending area 120 will be less than the thickness of the organic film in the display area 110. Therefore, according to the design requirements of the film thickness of the first organic layer 140 in the bending area 120, the thickness of the first organic layer 140 in the bending area 120 is less than that in the display area 110, while ensuring the flatness of the display area and the display effect of the display area.

[0103] S520, forming a first wiring layer 160 on a side of the first organic layer 140 away from the substrate 130;

[0104] S530 , forming a second organic layer 150 on a side of the first wiring layer 160 away from the substrate 130 .

[0105] Fig.13 A schematic diagram of a process for preparing another display panel is provided for an embodiment of the present invention. Fig.13 ,include:

[0106] S610, forming a first organic layer 140 on one side of the substrate 130;

[0107] S620, forming a first wiring layer 160 on a side of the first organic layer 140 away from the substrate 130;

[0108] S630 , forming a second organic layer 150 on a side of the first wiring layer 160 away from the substrate 130 , and exposing the organic material of the second organic layer 150 in the bending area 120 using a grayscale mask, so that the thickness of the second organic layer 150 in the bending area 120 is less than the thickness in the display area 110 .

[0109] Specifically, the grayscale mask can realize a partial light transmission function during the exposure process. The grayscale mask is a grid structure with gaps between the grids. The incident light can be diffracted through the gaps between the grids to the organic material to realize exposure. Therefore, a grayscale mask can be used when exposing the organic material in the bending area 120 to improve the transmittance of the incident light, while a conventional mask is used when exposing the organic material in the display area 110, so that the transmittance of the mask in the bending area 120 and the mask in the display area 110 is different. The grayscale mask used in the bending area 120 has a first transmittance, and the conventional mask used in the display area 110 has a second transmittance. The first transmittance is greater than the second transmittance. Therefore, after the organic material is exposed, the thickness of the organic film in the bending area 120 will be less than the thickness of the organic film in the display area 110. Therefore, according to the design requirements of the film thickness of the second organic layer 150 in the bending area 120, the thickness of the second organic layer 150 in the bending area 120 is less than that in the display area 110, while ensuring the flatness of the display area and the display effect of the display area.

[0110] Fig.14 A schematic diagram of a process for preparing another display panel is provided for an embodiment of the present invention. Fig.14 ,include:

[0111] S710, forming a first organic layer 140 on one side of the substrate 130, and exposing an organic material of the first organic layer 140 in the bending area 120 using a grayscale mask, so that the thickness of the first organic layer 140 in the bending area 120 is smaller than the thickness in the display area 110;

[0112] S720, forming a first wiring layer 160 on a side of the first organic layer 140 away from the substrate 130;

[0113] S730 , forming a second organic layer 150 on a side of the first wiring layer 160 away from the substrate 130 , and exposing the organic material of the second organic layer 150 in the bending area 120 using a grayscale mask, so that the thickness of the second organic layer 150 in the bending area 120 is less than the thickness in the display area 110 .

[0114] Furthermore, in order to verify that the use of a grayscale mask in the bending region 120 can reduce the thickness of the corresponding organic material, Fig.15 A schematic diagram for verifying the thickness of an organic planar layer is provided for an embodiment of the present invention, see Fig.15 By designing a grid-shaped mask at the edge of the organic planar layer 810, the edge of the organic planar layer is not completely exposed, and the edge tilt angle α of the organic planar layer is measured to reflect the thickness change of the organic planar layer. By using a conventional mask to expose the edge of the organic planar layer, the edge tilt angle α of the organic planar layer can be measured to be 29.7°.

[0115] Fig.16 A schematic diagram of a cross-sectional structure of a first grayscale mask is provided for an embodiment of the present invention. Fig.16 , the cross-sectional pattern of the grid in the first grayscale mask is a rectangle, wherein the length f of the rectangle width is the same as the spacing g between the grids. Exemplarily, the length f of the rectangle width of the first grayscale mask and the spacing g between the grids are set to 0.8 μm, the height h of the grids is 10 μm, and the edge tilt angle α of the organic planar layer is measured to be 21.2°; the length f of the rectangle width of the second first grayscale mask and the spacing g between the grids are set to 1 μm, the height h of the grids is 10 μm, and the edge tilt angle α of the organic planar layer is measured to be 21.1°; the length f of the rectangle width of the third first grayscale mask and the spacing g between the grids are set to 1.2 μm, the height h of the grids is 10 μm, and the edge tilt angle α of the organic planar layer is measured to be 23°; the length f of the rectangle width of the fourth first grayscale mask and the spacing g between the grids are set to 1.4 μm, the height h of the grids is 10 μm, and the edge tilt angle α of the organic planar layer is measured to be 14.9°

[0116] Fig.17 A schematic diagram of a cross-sectional structure of a second grayscale mask is provided for an embodiment of the present invention. Fig.17, the cross-sectional figure of the grid in the second grayscale mask is a trapezoid, wherein the spacing c between the bottom sides of adjacent trapezoids is the same as the length a of the upper side of the trapezoid; the spacing d between the upper sides of adjacent trapezoids is the same as the length b of the bottom side of the trapezoid; illustratively, the spacing c between the bottom sides of adjacent trapezoids of the first second grayscale mask and the length a of the upper side of the trapezoid are set to 0.8 μm, the spacing d between the upper sides of adjacent trapezoids and the length b of the bottom side of the trapezoid are set to 1.0 μm, the height e of the grid is 10 μm, and the edge inclination angle α of the organic planar layer is measured to be 13.4°; the spacing c between the bottom sides of adjacent trapezoids of the second second grayscale mask and the length a of the upper side of the trapezoid are set to 1.0 μm, the spacing d between the upper sides of adjacent trapezoids and the length b of the bottom side of the trapezoid are set to 1.0 μm, The length b is set to 1.2μm, the height e of the grid is 10μm, and the edge tilt angle α of the organic flat layer is measured to be 14°; the spacing c between the bottom edges of adjacent trapezoids and the length a of the upper edge of the trapezoid of the third second grayscale mask is set to 1.2μm, the spacing d between the upper edges of adjacent trapezoids and the length b of the bottom edge of the trapezoid is set to 1.4μm, the height e of the grid is 10μm, and the edge tilt angle α of the organic flat layer is measured to be 15.3°; the spacing c between the bottom edges of adjacent trapezoids and the length a of the upper edge of the trapezoid of the fourth second grayscale mask is set to 0.8μm, the spacing d between the upper edges of adjacent trapezoids and the length b of the bottom edge of the trapezoid is set to 1.0μm, the height e of the grid is 5μm, and the edge tilt angle α of the organic flat layer is measured to be 21.2°. Table 1 is a comparison of the tilt angle data of the first grayscale mask and the second grayscale mask with the conventional mask after exposure, see Table 1.

[0117] Table 1 is a comparison of the tilt angle data after exposure of the first grayscale mask, the second grayscale mask and the conventional mask

[0118]

[0119] From the data comparison, it can be seen that using the grid structure in the grayscale mask to expose organic materials can reduce the film thickness formed by the organic material compared to the conventional mask, meeting the application requirements. In addition, the application cost of the grayscale mask is lower than that of the halftone mask (HTM), and it has more cost advantages.

[0120] Based on the above embodiment, optionally, after preparing the second organic layer 150, the method further includes:

[0121] Prepare a stress release layer 191, which is disposed on a side of the second organic layer 150 away from the substrate 130, and is used to release the bending stress of the first wiring layer 160;

[0122] Specifically, the stress release layer 191 is disposed on the second organic layer 150, and a deformation notch for stress release may be disposed on the stress release layer 191. When the bending area is bent, the stress release layer 191 releases the stress of the lower film layer through the deformation notch on the surface. Exemplarily, the stress release layer 191 may include stress release holes 192 that penetrate the stress release layer 191, wherein the stress release holes 192 are arranged at intervals, and the stress release holes 192 are used to release the stress of the metal trace 162 in the bent state. In terms of the manufacturing process, the stress release layer 191 may be prepared simultaneously with the pixel definition layer 190 in the display area 110. The pixel definition layer 190 in the display area 110 is etched to form a pixel opening, and the stress release layer 191 in the bending area 120 is etched to form a stress release hole 192. The opening sizes of the pixel opening and the stress release hole 192 may be the same or different, and there is no specific limitation here. In some embodiments, the stress release layer 191 includes stress release grooves 193 arranged at intervals. In the manufacturing process, the stress release layer 191 can be prepared simultaneously with the pixel definition layer 190 in the display area 110. According to different etching times, pixel openings are formed in the pixel definition layer 190 in the display area 110, and stress release grooves 193 are formed in the stress release layer 191 in the bending area 120. In some embodiments, the stress release layer 191 includes stress release holes 192 and stress release grooves 193 arranged at intervals. In the manufacturing process, the stress release layer 191 can be prepared simultaneously with the pixel definition layer 190 in the display area 110. According to different etching times, pixel openings are formed in the pixel definition layer 190 in the display area 110, and stress release grooves 193 are formed in the stress release layer 191 in the bending area 120.

[0123] Fig.18 A schematic diagram of a display device is provided for an embodiment of the present invention. Fig.18 , including the display panel 10 of any embodiment of the present invention. Fig.18 The display device shown is only for illustration, wherein the display device may include: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, and any other product or component with a display function, which is not limited here. The specific beneficial effects of the display panel 10 have been described in detail in the above embodiment, and the display device has the same beneficial effects as the above display panel, so it will not be repeated here.

[0124] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display panel, characterized in that: include: A display area and a bending area located on one side of the display area; In the bending area, the display panel includes a substrate, a first organic layer, a first wiring layer and a second organic layer; the first organic layer is arranged on one side of the substrate, the second organic layer is arranged on a side of the first organic layer away from the substrate, and the first wiring layer is arranged between the first organic layer and the second organic layer; the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area.

2. A display panel according to claim 1, characterized in that: An absolute value of a difference between a thickness of the first organic layer in the bending region and a thickness of the first organic layer in the display region is negatively correlated with a bending radius of the bending region.

3. A display panel according to claim 2, characterized in that: When the bending radius of the bending area is less than the first preset radius, the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, or the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area and the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area; When the bending radius of the bending area is greater than the second preset radius, the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area, or the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area and the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area; The first preset radius is smaller than the second preset radius.

4. The display panel according to claim 1, characterized in that: The display panel comprises a stress release layer, the stress release layer is arranged on a side of the second organic layer away from the substrate, and the stress release layer is used to release the bending stress of the first wiring layer; Preferably, the stress release layer comprises stress release holes, and the stress release holes are arranged at intervals; Preferably, the stress release layer comprises stress release grooves, and the stress release grooves are arranged at intervals; Preferably, the stress release layer includes stress release holes and stress release grooves; The stress release holes and the stress release grooves are arranged at intervals; Preferably, the bending area further comprises a protective adhesive layer, and the protective adhesive layer is arranged on a side of the stress release layer away from the substrate.

5. The display panel according to claim 4, characterized in that: The display area includes a pixel driving circuit layer, a first planarization layer, a second planarization layer, a second wiring layer and a light-emitting functional layer; The pixel driving circuit layer is arranged on one side of the substrate, the first planarization layer is arranged on a side of the pixel driving circuit layer away from the substrate, the second wiring layer is arranged on a side of the first planarization layer away from the substrate, the second planarization layer is arranged on a side of the second wiring layer away from the substrate, and the light emitting function layer is arranged on a side of the second planarization layer away from the substrate; the light emitting function layer is electrically connected to the pixel driving circuit layer through the second wiring layer; Preferably, the first planarization layer is disposed in the same layer as the first organic layer; and the second planarization layer is disposed in the same layer as the second organic layer.

6. The display panel according to claim 5, characterized in that: The first routing layer and the second routing layer are arranged on the same layer.

7. A method for preparing a display panel, the display panel comprising: A display area, and a bending area arranged on one side of the display area; characterized in that, A first organic layer, a first wiring layer, and a second organic layer are formed in sequence on one side of the substrate in the bending area along a thickness direction away from the substrate; wherein the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, and / or the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area.

8. The method for preparing a display panel according to claim 7, characterized in that: When forming the first organic layer, the organic material of the first organic layer is exposed in the bending area using a grayscale mask so that the thickness of the first organic layer in the bending area is less than the thickness of the first organic layer in the display area, and or when forming the second organic layer, the organic material of the second organic layer is exposed in the bending area using the grayscale mask so that the thickness of the second organic layer in the bending area is less than the thickness of the second organic layer in the display area.

9. The method for preparing a display panel according to claim 7, characterized in that: After preparing the second organic layer, the method further comprises: preparing a stress release layer, wherein the stress release layer is disposed on a side of the second organic layer away from the substrate, and the stress release layer releases the bending stress of the first wiring layer; Preferably, the stress release layer comprises stress release holes, and the stress release holes are arranged at intervals; Preferably, the stress release layer comprises stress release grooves, and the stress release grooves are arranged at intervals; Preferably, the stress release layer comprises stress release holes and stress release grooves; the stress release holes and the stress release grooves are arranged at intervals.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 6.

Images