Method for manufacturing display device

Abstract

The present application relates to a method for manufacturing a display device. The method for manufacturing a display device includes: providing a display panel, the display panel including a first panel area, a second panel area, and a panel bending area located between the first panel area and the second panel area; providing a printed circuit board (PCB) to which a preliminary PCB adhesive layer and a release film are attached; bonding the PCB to the second panel area; and forming a PCB adhesive layer by removing the release film from the PCB. In the process of providing the PCB, the release film is attached to the PCB through the release film adhesive layer located between the release film and the PCB, the preliminary PCB adhesive layer includes a first part and a second part other than the first part, the first part corresponds to the PCB adhesive layer, and the release film adhesive layer is attached to the second part.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0131931, filed on October 4, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a display device and a method of manufacturing the same, and more particularly, to a display device and a method of manufacturing the same that reduce the possibility of defects occurring in a manufacturing process. Background Art

[0004] The display device can be used as various electronic devices. For example, the display device can be a mobile electronic device such as a smart phone. In order to increase the area of ​​the display surface while reducing the overall size of the electronic device, the electronic device can be a foldable electronic device in which the display surface is partially folded.

[0005] Moreover, the display device can receive information about an image and provide an image by using a display element of the display panel. In order to receive information about an image, a pad electrically connected to the display element can be arranged on an edge of the display panel, and the pad can be electrically connected to a bump of a printed circuit board. In order to minimize the area of ​​a visible non-display region, the display panel can be bent so that a portion of the display panel and the printed circuit board overlap another portion of the display panel, and then the printed circuit board can be attached to the other portion of the display panel. Summary of the invention

[0006] In such display devices of the related art, when an adhesive layer is formed to attach a printed circuit board to a display panel, byproducts protruding outside the adhesive layer may be generated, and these byproducts may cause post-processing defects and appearance defects.

[0007] One or more embodiments include a display device that reduces the possibility of defects occurring in a manufacturing process and a method of manufacturing the display device. However, the embodiments are examples and do not limit the scope of the present disclosure.

[0008] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the embodiments presented in the disclosure.

[0009] According to one or more embodiments, a method for manufacturing a display device includes: providing a display panel, the display panel including a first panel area, a second panel area, and a panel bending area between the first panel area and the second panel area, wherein a metal plate is attached below the first panel area of ​​the display panel; providing a printed circuit board, which is attached with a preliminary printed circuit board adhesive layer and a release film; bonding the printed circuit board to the second panel area; forming a printed circuit board adhesive layer by removing the release film from the printed circuit board; and attaching the printed circuit board below the metal plate by bending the panel bending area. In the process of providing the printed circuit board, the release film is attached to the printed circuit board through the release film adhesive layer between the release film and the printed circuit board, the preliminary printed circuit board adhesive layer includes a first portion and a second portion other than the first portion, the first portion corresponds to the printed circuit board adhesive layer, and the release film adhesive layer is attached to the second portion.

[0010] Forming the printed circuit board adhesive layer may include removing the release film adhesive layer from the printed circuit board by removing the release film from the printed circuit board.

[0011] Forming the printed circuit board adhesive layer may further include removing the second portion attached to the release film adhesive layer when removing the release film adhesive layer from the printed circuit board.

[0012] The first portion and the second portion may include the same material as each other

[0013] The first portion may include a first conductive adhesive layer, a second conductive adhesive layer, and a conductive nonwoven layer between the first conductive adhesive layer and the second conductive adhesive layer, and the second portion and the conductive nonwoven layer may include the same material as each other.

[0014] In the process of providing the printed circuit board, a first conductive adhesive layer of the preliminary printed circuit board adhesive layer may be attached to the printed circuit board.

[0015] In the process of providing the printed circuit board, the release film adhesive layer and the printed circuit board adhesive layer may be disposed on the same surface of the printed circuit board.

[0016] In the process of providing the printed circuit board, the release film adhesive layer may be arranged to be spaced apart from the first portion in a plan view.

[0017] In providing the printed circuit board, at least a portion of the release film adhesive layer may be arranged along an outer side of the first portion to surround at least a portion of the first portion in a plan view.

[0018] In the process of providing the printed circuit board, the preliminary printed circuit board adhesive layer may be arranged along an outer portion of the printed circuit board to surround at least a portion of the printed circuit board in a plan view.

[0019] Attaching the printed circuit board may include attaching a printed circuit board adhesive layer below the metal plate.

[0020] According to one or more embodiments, a display device includes: a display panel, including a first panel area, a second panel area, and a panel bending area located between the first panel area and the second panel area; a metal plate, arranged below the first panel area; a printed circuit board, bonded to the second panel area and arranged below the metal plate; a printed circuit board adhesive layer, located between the printed circuit board and the metal plate; and a residual adhesive layer, arranged on a surface of the printed circuit board that contacts the printed circuit board adhesive layer, wherein, in a plan view, the residual adhesive layer is arranged to be spaced apart from the printed circuit board adhesive layer.

[0021] In a plan view, at least a portion of the residual adhesive layer may be arranged along an outer side of the printed circuit board adhesive layer to surround at least a portion of the printed circuit board adhesive layer.

[0022] In a plan view, the printed circuit board adhesive layer may be arranged along an outer portion of the printed circuit board to surround at least a portion of the printed circuit board.

[0023] The first panel area may include a first non-folding area, a second non-folding area, and a foldable area between the first non-folding area and the second non-folding area, and the display device may be foldable at the foldable area.

[0024] The printed circuit board adhesive layer may include a first conductive adhesive layer, a second conductive adhesive layer, and a conductive nonwoven layer between the first conductive adhesive layer and the second conductive adhesive layer.

[0025] The first conductive adhesive layer may be located between the printed circuit board and the conductive nonwoven layer, and the second conductive adhesive layer may be located between the conductive nonwoven layer and the metal plate.

[0026] The conductive nonwoven layer may include voids.

[0027] The display device may further include: a lower protective layer disposed below the display panel; and a support layer located between the lower protective layer and the metal plate.

[0028] The display device may further include: a cover window disposed on the display panel; and an upper protective layer located between the display panel and the cover window.

[0029] Other aspects, features, and advantages of the present disclosure will become more apparent from the detailed description, claims, and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects, features and advantages of the embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a schematic perspective view of a display device in an unbent state according to an embodiment;

[0032] Figure 2 is a schematic perspective view of a display device according to an embodiment;

[0033] Figure 3 is a schematic plan view of a display panel included in a display device according to an embodiment;

[0034] Figure 4 is a schematic cross-sectional view of a display device in an unbent state according to an embodiment;

[0035] Figure 5 is a schematic cross-sectional view of a display device according to an embodiment;

[0036] Figure 6 is a schematic rear view of a display device according to an embodiment;

[0037] Figure 7 is a micrograph of a conductive nonwoven layer included in a display device according to an embodiment;

[0038] Figure 8 yes Figure 5 A schematic enlarged cross-sectional view of a region A of a display device;

[0039] Fig. 9 yes Figure 3 An equivalent circuit diagram of a pixel of a display panel;

[0040] Fig.10 is a schematic cross-sectional view of a display panel included in a display device according to an embodiment; and

[0041] Figures 11 to 16 is a diagram for describing a method of manufacturing a display device according to an embodiment. DETAILED DESCRIPTION

[0042] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein the same reference numerals refer to the same elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, embodiments are described below only by reference to the figures to explain aspects of this description. As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Throughout the disclosure, the expression "at least one of a, b, and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or variations thereof.

[0043] Since various modifications can be applied and one or more embodiments can be implemented, specific embodiments will be shown in the drawings and described in detail in the detailed description. The effects and features and methods of implementing them will be explained with reference to the embodiments described in detail below with reference to the drawings. However, the embodiments may have different forms and should not be interpreted as being limited to the descriptions set forth herein.

[0044] It will be understood that although the terms “first” and “second” may be used herein to describe various elements, these elements should not be limited by these terms and these terms are only used to distinguish one element from another.

[0045] As used herein, the singular form includes the plural form unless the context clearly indicates otherwise.

[0046] It will be understood that the terms “comprising,” “including,” and “having” may be used herein to indicate the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0047] In this specification, it will be understood that when an element (such as a layer, film, region or plate) is referred to as being "on" another element (such as a layer, film, region or plate), the element (such as a layer, film, region or plate) can be "directly on" the other element (such as a layer, film, region or plate) or may be indirectly on the other element (such as a layer, film, region or plate) with intervening elements.

[0048] It will be understood that when a layer, region, or element is referred to as being “connected to” another layer, region, or element, it may be “directly connected to” the other layer, region, or element, or may be “indirectly connected to” the other layer, region, or element with one or more intervening layers, regions, or elements. For example, it will be understood that when a layer, region, or element is referred to as being “electrically connected to” another layer, region, or element, it may be “directly electrically connected to” the other layer, region, or element and / or may be “indirectly electrically connected to” the other layer, region, or element with one or more intervening layers, regions, or elements.

[0049] In this specification, the x direction, y direction and z direction are not limited to the directions corresponding to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the x direction, y direction and z direction can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other. In this specification, the +x direction, +y direction and +z direction refer to the same directions as the x direction, y direction and z direction, respectively. The -x direction, -y direction and -z direction refer to the directions opposite to the x direction, y direction and z direction, respectively.

[0050] In this specification, when a certain embodiment can be implemented differently, a specific processing order can also be performed differently from the described order. As an example, two processes described successively can be performed substantially simultaneously, or can be performed in the reverse order of the described order.

[0051] When the expression "on a plane" or "in a plan view" is used herein, it may refer to when the target area is observed from above. That is, the expression "on a plane" or "in a plan view" used herein may refer to "when observed in a direction perpendicular to the substrate (z direction)".

[0052] Embodiments will now be described in detail below with reference to the accompanying drawings. When describing with reference to the accompanying drawings, identical or corresponding elements will be given the same reference numerals, and repeated descriptions of these elements will be omitted. For ease of description, the sizes of the elements in the accompanying drawings may be exaggerated. For example, since the sizes (e.g., thickness) of the elements in the accompanying drawings are arbitrarily interpreted for ease of explanation, the present disclosure is not limited to the following embodiments.

[0053] Figure 1 is a schematic perspective view of the display device 1 in an unbent state according to the embodiment. Figure 2 is a schematic perspective view of a display device 1 according to an embodiment. That is, Figure 2 It shows Figure 1 The display device 1 is in a bent state.

[0054] like Figure 1 and Figure 2 As shown in , the display device 1 may include a first area A1, a second area A2, and a bending area BA located between the first area A1 and the second area A2. In detail, the display device 1 may include the first area A1, the bending area BA outside the first area A1, and the second area A2 arranged on the opposite side of the first area A1 relative to the bending area BA.

[0055] The first area A1 may include a display area and a non-display area, and the second area A2 may include only a non-display area. Figure 2As shown in , the display device 1 is bent in the bending area BA, and accordingly, when viewed in the z direction, at least a portion of the second area A2 may overlap with the first area A1. In detail, the display device 1 may be bent in the bending area BA relative to a bending axis BAX extending in a first direction (e.g., the +x direction or the -x direction). Since the display device 1 is bent in the bending area BA, when the display device 1 is viewed in the -z direction, a portion of the non-display area may be prevented from being visible. Accordingly, the area of ​​the visible non-display area may be significantly reduced.

[0056] The display device 1 may include a first surface S1 and a second surface S2 opposite to the first surface S1. The display device 1 may display an image on the first surface S1. That is, the first surface S1 of the display device 1 may include a display surface. In detail, the first surface S1 of the first area A1 of the display device 1 may include a display surface. When the display device 1 is bent in the bending area BA, the second surface S2 of the first area A1 and the second surface S2 of the second area A2 may be arranged to face each other.

[0057] In addition, if Figure 1 and Figure 2 As shown in , the first area A1 may include a first non-folding area NFA1, a second non-folding area NFA2 and a foldable area FA. At least a portion of the display device 1 may be flexible, and when the flexible portion of the display device 1 is bent, the display device 1 may be folded. Accordingly, the display device 1 may include a folding area and a non-folding area provided on at least one side of the folding area and not folded. As used herein, "non-folding" means that a portion is not folded, and this includes a case where the portion is non-flexible and hard and therefore not folded, and a case where the portion is flexible but not folded. The first non-folding area NFA1 and the second non-folding area NFA2 may be non-folding areas, and the foldable area FA may be a flexible and foldable area.

[0058] When the display device 1 is in a state before being folded, the first non-folding area NFA1 and the second non-folding area NFA2 may be arranged to be spaced apart from each other in a second direction (e.g., +y direction or -y direction) intersecting the first direction (e.g., +x direction or -x direction). The first non-folding area NFA1 may be arranged to be spaced apart from the bending area BA, and the second non-folding area NFA2 may be arranged to be adjacent to the bending area BA.

[0059] The foldable area FA may be located between the first non-folding area NFA1 and the second non-folding area NFA2. In detail, one side of the foldable area FA may be adjacent to the first non-folding area NFA1, and the other side of the foldable area FA may be adjacent to the second non-folding area NFA2. The foldable area FA may extend in a direction intersecting a virtual straight line (e.g., a straight line parallel to the y direction) for connecting the first non-folding area NFA1 and the second non-folding area NFA2 to each other. When the display device 1 is in a state before being folded, the foldable area FA may extend in a first direction (e.g., the +x direction or the -x direction).

[0060] A folding line FL may be provided in the foldable area FA in a first direction (e.g., +x direction or -x direction) which is an extension direction of the foldable area FA. Accordingly, the display device 1 may be folded in the foldable area FA. The foldable area FA and the folding line FL of the foldable area FA may overlap with an area of ​​the display device 1 in which an image is displayed, and when the display device 1 is folded, the portion in which the image is displayed may be folded. That is, the display device 1 may display an image not only in a non-folding area but also in a folding area.

[0061] For ease of description, Figure 1 It is shown that the first non-folding area NFA1 and the second non-folding area NFA2 have the same or similar areas, and the display device 1 includes a foldable area FA, but one or more embodiments are not limited thereto. As another example, the first non-folding area NFA1 and the second non-folding area NFA2 may have different areas. Also, the display device 1 may include a plurality of foldable areas FA. In this case, the plurality of non-folding areas FA may be arranged to be spaced apart from each other, and each of the plurality of foldable areas FA may be located between the non-folding areas. Each foldable area FA may be folded based on a folding line FL, and a plurality of folding lines FL may be provided.

[0062] in addition, Figure 1 It is shown that the folding line FL passes through the center of the foldable area FA and the foldable area FA is linearly symmetrical with respect to the folding line FL, but one or more embodiments are not limited thereto. As another example, the folding line FL may be provided asymmetrically in the foldable area FA.

[0063] The display device 1 can be folded so that the first surface S1 of the first non-folding area NFA1 and the first surface S1 of the second non-folding area NFA2 face each other based on the folding line FL. In other words, when the foldable area FA of the display device 1 is bent, the first surface S1 of the first non-folding area NFA1 and the first surface S1 of the second non-folding area NFA2 can be arranged to face each other. Even when the display device 1 is folded, the foldable area FA can extend in a direction that intersects with a virtual straight line (e.g., a straight line parallel to the y direction) connecting the first non-folding area NFA1 and the second non-folding area NFA2 to each other. In detail, when the display device 1 is folded, the foldable area FA can extend in a first direction (e.g., +x direction or -x direction) that intersects with a virtual straight line (e.g., a straight line parallel to the y direction) connecting the first non-folding area NFA1 and the second non-folding area NFA2 to each other.

[0064] Moreover, the foldable area FA can be bent and then unfolded again. Accordingly, the display device 1 can be unfolded. As used herein, "unfolding" may refer to a situation in which the display device 1 is folded and then unfolded. That is, the display device 1 may be a foldable display device.

[0065] In addition, the term "folding" used herein means that the shape is not fixed but is transformed from an original shape to another shape, and may include a situation in which the display device 1 is folded, bent or bent along one or more specific lines (i.e., folding lines FL). Accordingly, when the display device 1 is folded, the first surface S1 of the first non-folding area NFA1 and the first surface S1 of the second non-folding area NFA2 are arranged parallel to each other and can therefore face each other, and the first surface S1 of the first non-folding area NFA1 and the first surface S1 of the second non-folding area NFA2 can be formed at a certain angle (e.g., an acute angle, a right angle, or an obtuse angle) with a foldable area FA therebetween.

[0066] Figure 3 1 is a schematic plan view of a display panel 10 included in a display device 1 according to an embodiment. Figure 3 is a schematic plan view showing a state in which the display panel 10 included in the display device 1 according to the embodiment is not bent. Figure 3 In the figure, for the convenience of description, a printed circuit board PCB included in the display device 1 according to the embodiment is also shown.

[0067] The display panel 10 can display an image. To this end, the display panel 10 may include a plurality of display elements, and the plurality of display elements may emit light. Accordingly, the display panel 10 may display an image by light emitted from a plurality of display elements. In an embodiment, the display element may include an organic light emitting diode including an organic emission layer. Alternatively, the display element may include a light emitting diode ("LED"). The size of the LED may be micrometer-scale or nanometer-scale. In an embodiment, for example, the LED may include a micro-LED. Alternatively, the LED may include a nanorod LED. The nanorod LED may include gallium nitride (GaN). In an embodiment, a color conversion layer may be arranged on top of the nanorod LED. The color conversion layer may include quantum dots. Alternatively, the display element may include a quantum dot LED including a quantum dot emission layer. Alternatively, the display element may include an inorganic LED including an inorganic semiconductor. A detailed description of each element included in the display panel 10 will be provided below.

[0068] As described above, the display device 1 may include a first area A1, a second area A2, and a bending area BA, and the first area A1 may include a first non-folding area NFA1, a second non-folding area NFA2, and a foldable area FA. Since the display device 1 includes the display panel 10, the area included in the display panel 10 may correspond to the area of ​​the display device 1.

[0069] like Figure 3 As shown in , the display panel 10 may include a first panel area 10A1, a second panel area 10A2, and a panel bending area 10BA located between the first panel area 10A1 and the second panel area 10A2. The first panel area 10A1 may correspond to the first area A1, and the panel bending area 10BA may correspond to the bending area BA. The second panel area 10A2 and the printed circuit board PCB may correspond to the second area A2. Therefore, repeated descriptions about this will be omitted.

[0070] In detail, the first panel area 10A1 may include a first panel non-folding area 10NFA1, a second panel non-folding area 10NFA2, and a panel foldable area 10FA. The first panel non-folding area 10NFA1 may correspond to the first non-folding area NFA1, and the second panel non-folding area 10NFA2 may correspond to the second non-folding area NFA2. The panel foldable area 10FA may correspond to the foldable area FA, and a panel folding line 10FL corresponding to the folding line FL may be provided in the panel foldable area 10FA.

[0071] The panel bending area 10BA can be based on the bending axis BAX (see Figure 2) is bent along a panel bending axis (not shown) corresponding to the first panel region 10A1. The second panel region 10A2 may overlap with at least a portion of the printed circuit board PCB. That is, at least a portion of the printed circuit board PCB may be disposed on the second panel region 10A2. Since the display panel 10 is bent in the panel bending region 10BA, at least a portion of the second panel region 10A2 and the printed circuit board PCB may overlap with the first panel region 10A1 when viewed in the z direction.

[0072] like Figure 3 As shown in , the display panel 10 may include a display area DA in which a plurality of pixels PX are arranged and a peripheral area PA located outside the display area DA. Each pixel PX of the display panel 10 is an area that can emit light of a predetermined color, and the display panel 10 can provide an image by using the light emitted from the pixel PX. For example, in an embodiment, each pixel PX can emit red light, green light, or blue light.

[0073] The display area DA is a region where images are provided, and may have a quadrilateral (eg Figure 3 In an embodiment, for example, the display area DA may have a rectangular shape in which the horizontal length is shorter than the vertical length, a rectangular shape in which the horizontal length is longer than the vertical length, or a square shape. Alternatively, the display area DA may have various shapes such as an elliptical shape or a circular shape.

[0074] The peripheral area PA is a non-display area that does not provide an image and may surround the entire display area DA. In detail, the pixels PX may not be arranged in the peripheral area PA, and a driver or the like for providing an electrical signal or power to the pixels PX may be arranged in the peripheral area PA. Figure 3 As shown in , the peripheral area PA may include a pad area PDA, and pads (not shown) may be arranged in the pad area PDA.

[0075] The display area DA may be arranged in the first panel area 10A1. A portion of the peripheral area PA may be arranged in the first panel area 10A1, another portion of the peripheral area PA may be arranged in the panel bending area 10BA, and another portion of the peripheral area PA may be arranged in the second panel area 10A2. In detail, the pad area PDA of the peripheral area PA may be arranged in the second panel area 10A2. In the pad area PDA, a plurality of pads may be arranged to be spaced apart from each other, and the pads may be electrically connected to a plurality of connection lines arranged in the peripheral area PA, respectively. The connection lines may connect signal lines (e.g., data lines DL (see Fig. 9 ) (or scan line SCL (see Fig. 9At least a portion of the printed circuit board PCB may be disposed on the second panel area 10A2, and because the pads of the pad area PDA are electrically connected to the bumps of the printed circuit board PCB, the display panel 10 may be electrically connected to the printed circuit board PCB.

[0076] The printed circuit board PCB may include a bendable flexible printed circuit board ("FPCB"), a rigid printed circuit board that is hard and therefore not easily bent, or a composite printed circuit board including both a rigid printed circuit board and an FPCB. In an embodiment, a power supplier and a scan driver for supplying a driving voltage to drive the pixels PX of the display panel 10 may be additionally arranged on the printed circuit board PCB. In another embodiment, a driving chip including driving elements (such as a data driving circuit) for driving the pixels PX of the display panel 10 may be mounted on the second panel area 10A2, and various types of driving elements for driving the driving chip may be mounted on the printed circuit board PCB.

[0077] Figure 4 is a schematic cross-sectional view of a display device 1 in an unbent state according to an embodiment, and Figure 5 is a schematic cross-sectional view of a display device 1 according to an embodiment. Figure 4 It is shown along Figure 1 A schematic cross-sectional view of a cross section of the display device 1 taken along line II', and Figure 5 It is shown along Figure 2 Schematic cross-sectional view of a section of the display device 1 taken along line II-II′.

[0078] refer to Figure 4 and Figure 5 The display device 1 may include a display panel 10, a cover window CW, an upper protective layer UPL, a lower protective layer LPL, a support layer SL, a metal plate MP, and a printed circuit board PCB. The display device 1 may further include a cover window adhesive layer CWa, an upper protective layer adhesive layer UPLa, a lower protective layer adhesive layer LPLa, a support layer adhesive layer SLa, a metal plate adhesive layer MPa, and a printed circuit board adhesive layer PCBa.

[0079] The display panel 10 may include a first panel surface 10S1 and a second panel surface 10S2. The first panel surface 10S1 may correspond to the first surface S1 of the display device 1 (see Figure 1 ), and the second panel surface 10S2 may correspond to the second surface S2 of the display device 1 (see Figure 1 That is, the first panel surface 10S1 of the display panel 10 may face the first surface S1 of the display device 1 (see Figure 1), and the second panel surface 10S2 of the display panel 10 may face the second surface S2 of the display device 1 (see Figure 1 ) in the same direction (eg, the −z direction). In other words, the display panel 10 may include a first panel surface 10S1 and a second panel surface 10S2 opposite to the first panel surface 10S1.

[0080] The display panel 10 may display an image on the first panel surface 10S1. That is, the first panel surface 10S1 of the display panel 10 may include a display surface. In detail, the first panel surface 10S1 of the first panel region 10A1 of the display panel 10 may include a display surface. When the display panel 10 is bent in the panel bending region 10BA, the second panel surface 10S2 of the first panel region 10A1 and the second panel surface 10S2 of the second panel region 10A2 may be arranged to face each other.

[0081] When the display panel 10 is in a state before being folded, the first panel non-folding area 10NFA1 and the second panel non-folding area 10NFA2 may be arranged to be spaced apart from each other in a second direction (e.g., +y direction or -y direction) intersecting with the first direction (e.g., +x direction or -x direction). The first panel non-folding area 10NFA1 may be arranged to be spaced apart from the panel bending area 10BA, and the second panel non-folding area 10NFA2 may be arranged to be adjacent to the panel bending area 10BA. The panel foldable area 10FA may be located between the first panel non-folding area 10NFA1 and the second panel non-folding area 10NFA2, and may extend in a first direction (e.g., +x direction or -x direction) intersecting with a virtual straight line (e.g., a straight line parallel to the y direction) connecting the first panel non-folding area 10NFA1 and the second panel non-folding area 10NFA2 to each other.

[0082] The panel folding line 10FL may be provided in the panel foldable area 10FA in a first direction (eg, +x direction or -x direction) which is an extending direction of the panel foldable area 10FA (see Figure 3 ). Accordingly, the display panel 10 can be folded in the panel foldable area 10FA. The display panel 10 can be folded so that the first panel surface 10S1 of the first panel non-folding area 10NFA1 and the first panel surface 10S1 of the second panel non-folding area 10NFA2 are aligned based on the panel folding line 10FL (see Figure 3In other words, when the panel foldable area 10FA of the display panel 10 is bent, the first panel surface 10S1 of the first panel non-folding area 10NFA1 and the first panel surface 10S1 of the second panel non-folding area 10NFA2 may be arranged to face each other.

[0083] The cover window CW may be arranged on the display panel 10. In detail, the cover window CW may be arranged on the first panel area 10A1 of the display panel 10. That is, the cover window CW may be arranged to cover the first panel surface 10S1 of the first panel area 10A1 of the display panel 10. The cover window CW may protect the first panel surface 10S1 of the first panel area 10A1 of the display panel 10.

[0084] The cover window CW may have a high transmittance to transmit light emitted from the display panel 10, and may have a small thickness to significantly reduce the weight of the display device 1. Furthermore, the cover window CW may have high strength and high hardness to protect the display panel 10 from external impacts. The cover window CW may include a flexible window. The cover window CW may protect the display panel 10 by being easily bent in response to an external force without breaking, etc. The cover window CW may include glass or plastic. In an embodiment, the cover window CW may include ultra-thin tempered glass ("UTG"), the hardness of which has been strengthened using a method such as chemical strengthening or thermal strengthening. In another embodiment, the cover window CW may include a polymer resin.

[0085] The upper protective layer UPL may be located between the display panel 10 and the cover window CW. The upper protective layer UPL may protect the display panel 10 and absorb external impact applied to the upper surface (in the +z direction) of the display panel 10. The upper protective layer UPL may include a plastic film containing a polymer resin. In an embodiment, for example, the upper protective layer UPL may include at least one of a polymer resin such as polyethylene terephthalate ("PET"), polybutylene terephthalate ("PBT"), polycarbonate ("PC"), polyethylene naphthalate ("PEN"), polystyrene ("PS"), polymethyl methacrylate ("PMMA"), polyvinyl chloride ("PVC"), polyether sulfone ("PES"), polypropylene ("PP"), and polyamide ("PA").

[0086] The lower protective layer LPL may be arranged on the second panel surface 10S2 of the display panel 10. In detail, the lower protective layer LPL may include a first lower protective layer LPL1 and a second lower protective layer LPL2. The first lower protective layer LPL1 may be arranged on the second panel surface 10S2 of the first panel region 10A1 of the display panel 10, and the second lower protective layer LPL2 may be arranged on the second panel surface 10S2 of the second panel region 10A2 of the display panel 10. In other words, when the display panel 10 is bent in the panel bending region 10BA, the second panel surface 10S2 of the first panel region 10A1 and the second panel surface 10S2 of the second panel region 10A2 are arranged to face each other, and accordingly, the first lower protective layer LPL1 may be arranged on the second panel surface 10S2 of the first panel region 10A1 of the display panel 10 (in the -z direction), and the second lower protective layer LPL2 may be arranged on the second panel surface 10S2 of the second panel region 10A2 of the display panel 10 (in the +z direction). The first and second lower protective layers LPL1 and LPL2 may be spaced apart from each other with the panel bending area 10BA therebetween. That is, since the lower protective layer LPL is not disposed on the second panel surface 10S2 of the panel bending area 10BA, the display panel 10 may be easily bent.

[0087] The lower protective layer LPL may protect the display panel 10 from external influences. In an embodiment, for example, the lower protective layer LPL may absorb physical impact from the outside, and the lower protective layer LPL may block foreign matter or moisture from penetrating into the display panel 10. In an embodiment, the lower protective layer LPL may include an organic insulating material such as PET, polyimide ("PI"), or urethane acrylate.

[0088] In some embodiments, the lower protective layer LPL may further include a material that blocks ultraviolet rays ("UV"). In an embodiment, for example, the lower protective layer LPL may include a base resin, a UV absorber, and inorganic particles. The UV absorber and the inorganic particles may be provided by being dispersed in the base resin. The base resin may include an acrylate resin, such as urethane acrylate. However, one or more embodiments are not limited thereto, and a base resin that is optically transparent and capable of dispersing the UV absorber and the inorganic particles may be used in the lower protective layer LPL without restriction. In an embodiment, for example, the UV absorber may include at least one of a benzotriazole compound, a benzophenone compound, a salicylic acid compound, a salicylate compound, a cyanoacrylate compound, a cinnamate compound, an oxalic acid anilide compound, a polystyrene compound, an azomethine compound, and a triazine compound.

[0089] The support layer SL may be disposed below the lower protective layer LPL. The support layer SL may be disposed below the lower protective layer LPL and support the display panel 10. Accordingly, the degree to which the center of the display panel 10 sags in the -z direction due to its weight is reduced, and thus, even when an external impact is applied, the display panel 10 is not easily damaged.

[0090] The supporting layer SL may include a folding pattern SLP. When the display device 1 is folded, the shape of the folding pattern SLP may be variable, or the length of the folding pattern SLP may be variable. Accordingly, the supporting layer SL may be folded more easily. In an embodiment, for example, the folding pattern SLP may be an opening provided in the supporting layer SL. In another embodiment, the folding pattern SLP may have an uneven shape. In another embodiment, the folding pattern SLP may include connectors rotatably connected to each other.

[0091] The support layer SL may include at least one of metal, glass, and plastic. In an embodiment, the support layer SL may include polyurethane. In another embodiment, the support layer SL may include carbon fiber reinforced plastic ("CFRP"). In an embodiment, the folding pattern SLP may include the same material as that of the support layer SL or a different material.

[0092] The metal plate MP may be arranged below the support layer SL. In detail, the metal plate MP may include a first metal plate MP1 and a second metal plate MP2, and the first metal plate MP1 and the second metal plate MP2 may be arranged to be separated from each other around the panel foldable area 10FA. In other words, the first metal plate MP1 and the second metal plate MP2 may be arranged to be separated from each other with the panel foldable area 10FA therebetween. That is, the first metal plate MP1 may be arranged below the first panel non-folding area 10NFA1, and the second metal plate MP2 may be arranged below the second panel non-folding area 10NFA2. The metal plate MP may absorb impacts from the outside and protect the display panel 10.

[0093] The metal plate MP may be a plate including a metal material. That is, the metal plate MP may include a metal material. The metal plate MP may include a metal or an alloy of at least two metals. In an embodiment, for example, the metal plate MP may include aluminum (Al), copper (Cu), iron (Fe), or chromium (Cr). However, one or more embodiments are not limited thereto.

[0094] In addition, the elastic member EM may be arranged below a portion of the supporting layer SL, which is arranged below the panel foldable area 10FA. In detail, the elastic member EM may cover the folding pattern SLP. The elastic member EM may improve the durability of the supporting layer SL. The elastic member EM may include thermoplastic polyurethane ("TPU").

[0095] In this case, each of the plurality of adhesive layers is located between elements of the display device 1, and accordingly, one element of the display device 1 may be attached to another element of the display device 1. In detail, the upper protective layer adhesive layer UPLa may be located between the display panel 10 and the upper protective layer UPL. The upper protective layer adhesive layer UPLa may attach the upper protective layer UPL to the display panel 10. The cover window adhesive layer CWa may be located between the upper protective layer UPL and the cover window CW. The cover window adhesive layer CWa may attach the cover window CW to the upper protective layer UPL.

[0096] Similarly, the lower protective layer adhesive layer LPLa may be located between the display panel 10 and the lower protective layer LPL. The lower protective layer adhesive layer LPLa may include a first lower protective layer adhesive layer PLa1 and a second lower protective layer adhesive layer PLa2. In detail, the first lower protective layer adhesive layer PLa1 may be located between the display panel 10 and the first lower protective layer LPL1, and the second lower protective layer adhesive layer PLa2 may be located between the display panel 10 and the second lower protective layer LPL2. The lower protective layer LPL may be attached to the second panel surface 10S2 of the display panel 10 via the lower protective layer adhesive layer LPLa in the form of a film.

[0097] Similarly, the supporting layer adhesive layer SLa may be located between the lower protective layer LPL and the supporting layer SL. In detail, the supporting layer adhesive layer SLa may be located between the first lower protective layer LPL1 and the supporting layer SL. The supporting layer adhesive layer SLa may attach the supporting layer SL to the first lower protective layer LPL1. The metal plate adhesive layer MPa may be located between the supporting layer SL and the metal plate MP. The metal plate adhesive layer MPa may include a first metal plate adhesive layer MPa1 and a second metal plate adhesive layer MPa2. In detail, the first metal plate adhesive layer MPa1 may be located between the supporting layer SL and the first metal plate MP1, and the second metal plate adhesive layer MPa2 may be located between the supporting layer SL and the second metal plate MP2. The metal plate adhesive layer MPa may attach the metal plate MP to the supporting layer SL.

[0098] The cover window adhesive layer CWa, the upper protective layer adhesive layer UPLa, the lower protective layer adhesive layer LPLa, the support layer adhesive layer SLa, and the metal plate adhesive layer MPa may include an adhesive member such as an optically clear adhesive ("OCA") or a pressure sensitive adhesive ("PSA"). However, one or more embodiments are not limited thereto.

[0099] like Figure 5 As shown in, in a state in which the panel bending area 10BA of the display panel 10 is bent, the second panel surface 10S2 of the first panel area 10A1 and the second panel surface 10S2 of the second panel area 10A2 can be arranged to face each other. Accordingly, in a state in which the panel bending area 10BA of the display panel 10 is bent, the second lower protective layer LPL2 of the second panel area 10A2 can be arranged together with the second panel area 10A2 below the first panel area 10A1 and the first lower protective layer LPL1. In an embodiment, the display panel 10 may further include a third lower protective layer adhesive layer LPLa3. The second lower protective layer LPL2 may be attached to the lower surface (in the -z direction) of the metal plate MP via the third lower protective layer adhesive layer LPLa3. The third lower protective layer adhesive layer LPLa3 may include an adhesive member such as OCA or PSA. In another embodiment, the third lower protective layer adhesive layer LPLa3 may be omitted.

[0100] In addition, in a state where the panel bending area 10BA of the display panel 10 is bent, a printed circuit board PCB at least partially overlapping the second panel area 10A2 may also be arranged below the first panel area 10A1 and the first lower protective layer LPL1. In a state where the panel bending area 10BA of the display panel 10 is bent, a printed circuit board adhesive layer PCBa may be located between the printed circuit board PCB and the metal plate MP.

[0101] Figure 6 is a schematic rear view of the display device 1 according to the embodiment. Figure 6 When viewed in the -z direction Figure 5 The display device 1 is a rear view of the display device 1. For ease of description, Figure 6 Also shown is a printed circuit board adhesive layer PCBa.

[0102] like Figure 6 As shown in , in a plan view, the printed circuit board adhesive layer PCBa can be arranged along the outer portion of the printed circuit board PCB to surround at least a portion of the printed circuit board PCB. In an embodiment, for example, the printed circuit board adhesive layer PCBa can be continuously arranged along the circumference of the printed circuit board PCB to form a closed loop.

[0103] refer to Figures 4 to 6In an embodiment, the printed circuit board adhesive layer PCBa may be a double-sided tape, specifically, a conductive double-sided tape. Accordingly, the printed circuit board PCB may be attached to the lower surface of the metal plate MP (in the -z direction) through the printed circuit board adhesive layer PCBa. In detail, the printed circuit board PCB may be attached to the lower surface of the second metal plate MP2 (in the -z direction) through the printed circuit board adhesive layer PCBa. The printed circuit board adhesive layer PCBa may compensate for the step formed by the second lower protective layer LPL2 on the lower surface of the second metal plate MP2 (in the -z direction). In this case, the printed circuit board adhesive layer PCBa may have a thickness sufficient to compensate for the step.

[0104] The printed circuit board adhesive layer PCBa may include a conductive nonwoven layer NWL and a first conductive adhesive layer Ca1 and a second conductive adhesive layer Ca2, which are respectively arranged on opposite sides of the conductive nonwoven layer NWL with the conductive nonwoven layer NWL therebetween. That is, the printed circuit board adhesive layer PCBa may include a first conductive adhesive layer Ca1, a second conductive adhesive layer Ca2, and a conductive nonwoven layer NWL located between the first conductive adhesive layer Ca1 and the second conductive adhesive layer Ca2.

[0105] The conductive nonwoven layer NWL may include a nonwoven fabric plated with a metal material such as Cu or nickel (Ni). That is, the conductive nonwoven layer NWL may have a structure in which the nonwoven fabric is plated with a metal material such as Cu or Ni. Figure 7 As shown in Figure 7 is a micrograph of the conductive nonwoven layer NWL included in the display device 1 according to the embodiment, the conductive nonwoven layer NWL may include a nonwoven fabric NW plated with a metal material such as Cu or Ni, and the conductive nonwoven layer NWL may have voids V in the nonwoven fabric NW. The specific gravity of the voids V of the conductive nonwoven layer NWL may vary according to the process performed when forming the conductive nonwoven layer NWL.

[0106] In an embodiment, the conductive nonwoven layer NWL may be a conductive nonwoven layer on which a calendering process has not been performed. Regarding the specific gravity of the voids V of the conductive nonwoven layer NWL, the specific gravity of the voids V of the conductive nonwoven layer NWL on which a calendering process has not been performed may be higher than the specific gravity of the voids V of the conductive nonwoven layer NWL on which a calendering process has been performed. Since the specific gravity of the voids V of the conductive nonwoven layer NWL is high, even when the rear surface of the printed circuit board PCB in contact with the printed circuit board adhesive layer PCBa has an uneven surface structure, the uneven surface structure can be alleviated by the voids V. That is, the surface structure of the printed circuit board PCB will not be transferred to the metal plate MP due to the voids V, and therefore, the deformation of the metal plate MP can be prevented. Accordingly, the phenomenon in which the deformation of the metal plate MP is regarded as a stain on the display device 1 can be prevented or reduced.

[0107] The first conductive adhesive layer Ca1 may be located between the conductive nonwoven layer NWL and the printed circuit board PCB. That is, the first conductive adhesive layer Ca1 may be in direct contact with one surface of the printed circuit board PCB. The second conductive adhesive layer Ca2 may be located between the conductive nonwoven layer NWL and the metal plate MP. In detail, the second conductive adhesive layer Ca2 may be located between the conductive nonwoven layer NWL and the second metal plate MP2. That is, the second conductive adhesive layer Ca2 may be in direct contact with one surface of the second metal plate MP2. The first conductive adhesive layer Ca1 and the second conductive adhesive layer Ca2 may include a conductive adhesive material. In an embodiment, the first conductive adhesive layer Ca1 and the second conductive adhesive layer Ca2 may be a film formed by dispersing metal particles including metal (e.g., gold (Au), silver (Ag), platinum (Pt) or Ni) in a synthetic resin. The synthetic resin may include materials such as epoxy resin, silicone, PI or polyurethane. However, one or more embodiments are not limited thereto.

[0108] The first conductive adhesive layer Ca1 may be electrically connected to a ground wiring (not shown) of the printed circuit board PCB. Accordingly, the printed circuit board adhesive layer PCBa may be configured to receive a ground voltage from the printed circuit board PCB and transmit the ground voltage to the metal plate MP. Accordingly, in the display device 1, an electrostatic path formed by electrically connecting the ground wiring, the printed circuit board adhesive layer PCBa, and the metal plate MP to each other may be provided.

[0109] Generally, static electricity generated during the manufacturing process or in the finished state of the display device may flow into the display device and cause malfunction or damage to the display device. In the case of the display device 1 according to the present embodiment, an electrostatic path formed by electrically connecting the ground wiring, the printed circuit board adhesive layer PCBa, and the metal plate MP to each other can be provided. Accordingly, even when static electricity flows into the display device 1 (for example, into the printed circuit board PCB), the static electricity can be released through the electrostatic path. Therefore, it is possible to effectively prevent the display device 1 from malfunctioning or being damaged due to static electricity.

[0110] like Figure 8 As shown in Figure 8 yes Figure 5 A schematic enlarged cross-sectional view of area A of the display device 1 of FIG. 1 , in which the panel bending area 10BA of the display panel 10 is bent, the residual adhesive layer RFa' may be located between the printed circuit board PCB and the second metal plate MP2. The residual adhesive layer RFa' may include a first residual adhesive layer RFa1' and a second residual adhesive layer RFa2'. In detail, the residual adhesive layer RFa' may be arranged on a surface of the printed circuit board PCB that contacts the printed circuit board adhesive layer PCBa. In other words, the residual adhesive layer RFa' may be arranged on the rear surface of the printed circuit board PCB. In a plan view, the residual adhesive layer RFa' may be arranged to be spaced apart from the printed circuit board adhesive layer PCBa. And, in a plan view, the residual adhesive layer RFa' may be arranged along the outside of the printed circuit board adhesive layer PCBa to surround at least a portion of the printed circuit board adhesive layer PCBa. A detailed description of the residual adhesive layer RFa' will be provided below.

[0111] Furthermore, although not shown, the panel bending area 10BA (see Figure 5 ) is arranged on the bending protection layer. For details, refer to Figure 5, the bending protection layer can be arranged on the first panel surface 10S1 of the panel bending area 10BA. The bending protection layer can protect the bent display panel 10 from external impacts, and can support the display panel 10 to maintain a good shape when the display panel 10 is bent. In addition, since the bending protection layer is provided, the stress applied to the panel bending area 10BA of the display panel 10 can be significantly reduced. When the stacked structure including the display panel 10 is bent, compressive stress or tensile stress can be applied to a part of the stacked structure according to its position. There may be a neutral plane in the stacked structure, which is a position where the compressive stress or tensile stress is 0 (zero). That is, when the stacked structure including the display panel 10 is bent, compressive stress can be applied to the inside of the neutral plane, and tensile stress can be applied to the outside of the neutral plane. As the distance from the neutral plane increases, greater compressive stress or tensile stress can be applied to a part of the stacked structure. The bending protection layer can move the neutral plane in the stacked structure including the display panel 10. That is, by properly adjusting the thickness and / or modulus of the bending protection layer, the stress applied to the panel bending area 10BA of the display panel 10 can be adjusted. Accordingly, there may be no stress applied to the display panel 10, and even if there is stress, the stress may be significantly reduced.

[0112] Fig. 9 yes Figure 3 The equivalent circuit diagram of a pixel PX of the display panel 10 is shown in FIG. Fig. 9 As shown in , one pixel PX may correspond to one display element, and the display element may be electrically connected to the pixel circuit PC. Fig. 9 In the figure, an organic light emitting diode OLED is shown as a display element.

[0113] The pixel circuit PC may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. The second transistor T2 as a switching transistor may be connected to a scan line SCL and a data line DL, may be turned on in response to a switching signal input from the scan line SCL, and may be configured to transmit a data signal input from the data line DL to the first transistor T1. One end of the storage capacitor Cst may be electrically connected to the second transistor T2, and the other end of the storage capacitor Cst may be electrically connected to a driving voltage line PL, and the storage capacitor Cst may store a voltage corresponding to a difference between a voltage received from the second transistor T2 and a driving power supply voltage ELVDD supplied to the driving voltage line PL.

[0114] The first transistor T1 as a driving transistor may be connected to the driving voltage line PL and the storage capacitor Cst, and may be configured to control the magnitude of the driving current flowing from the driving voltage line PL through the organic light emitting diode OLED in response to the value of the voltage stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light with a certain brightness according to the driving current. The counter electrode 313 (see Fig.10 ) can receive the electrode power supply voltage ELVSS.

[0115] Fig. 9 It is explained that the pixel circuit PC includes two transistors and one storage capacitor, but one or more embodiments are not limited thereto. As another example, the number of transistors or the number of capacitors may be variously changed according to the design of the pixel circuit PC.

[0116] Fig.10 is a schematic cross-sectional view of a display panel 10 included in a display device 1 according to an embodiment. In detail, Fig.10 is shown along Figure 3 Schematic cross-sectional view of a cross section of the display panel 10 taken along line III-III′.

[0117] like Fig.10 As shown in , the display panel 10 may include a substrate 100, a pixel circuit layer 200, a display element layer 300, and an encapsulation layer 400. The substrate 100 may include glass, metal, or a polymer resin. The substrate 100 may be flexible or bendable. In this case, the substrate 100 may include, for example, a polymer resin (such as PES, polyacrylate, polyetherimide, PEN, PET, polyphenylene sulfide, polyarylate, PI, PC, or cellulose acetate propionate). Various modifications may be made to the substrate 100. In an embodiment, for example, the substrate 100 may have a multilayer structure including two layers and an isolation layer, the two layers including the above-mentioned polymer resin, and the isolation layer including an inorganic material (for example, silicon oxide (SiO X ), silicon nitride (SiN X ) or silicon oxynitride (SiO X N Y ) etc.) and is located between the two layers.

[0118] The pixel circuit layer 200 may be disposed on the substrate 100. The pixel circuit layer 200 may include a thin film transistor TFT, an inorganic insulating layer IIL, and an organic insulating layer OIL. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. The inorganic insulating layer IIL may include a gate insulating layer IIL1, a first interlayer insulating layer IIL2, and a second interlayer insulating layer IIL3. For ease of explanation, Fig.10Only one thin film transistor TFT is shown in FIG. 1 , and the thin film transistor TFT may correspond to the aforementioned first transistor T1 (see Fig. 9 ).

[0119] The semiconductor layer Act may be disposed on the substrate 100. The semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, may include an oxide semiconductor, or may include an organic semiconductor, etc. In an embodiment, the semiconductor layer Act may include a channel region and a source region and a drain region respectively disposed on opposite sides of the channel region.

[0120] The gate insulating layer IIL1 may be disposed on the semiconductor layer Act and the substrate 100. The gate insulating layer IIL1 may include a layer such as SiO X 、SiN X 、SiO X N Y 、Alumina (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ) inorganic insulating material. ZnO x It may include zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0121] The gate electrode GE may be disposed on the gate insulating layer IIL1. That is, since the gate insulating layer IIL1 is located between the semiconductor layer Act and the gate electrode GE, insulation between the semiconductor layer Act and the gate electrode GE may be ensured. In a plan view, the gate electrode GE may overlap with a channel region of the semiconductor layer Act. The gate electrode GE may include a low-resistance metal material. In an embodiment, the gate electrode GE may include a conductive material including molybdenum (Mo), Al, Cu, or titanium (Ti), and may have a single-layer or multi-layer structure including the foregoing conductive materials.

[0122] The first interlayer insulating layer IIL2 may be disposed on the gate electrode GE and the gate insulating layer IIL1. The first interlayer insulating layer IIL2 may include, for example, SiO X 、SiN X 、SiO X N Y 、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO xInorganic insulating materials.

[0123] The source electrode SE and the drain electrode DE may be disposed on the first interlayer insulating layer IIL2. The source electrode SE and the drain electrode DE may be connected to the semiconductor layer Act through contact holes defined in the gate insulating layer IIL1 and the first interlayer insulating layer IIL2, respectively. At least one of the source electrode SE and the drain electrode DE may include a conductive material including Mo, Al, Cu, or Ti, and may have a single-layer or multi-layer structure including the foregoing conductive materials. In an embodiment, at least one of the source electrode SE and the drain electrode DE may have a multi-layer structure of Ti / Al / Ti.

[0124] The second interlayer insulating layer IIL3 may be disposed on the source electrode SE, the drain electrode DE, and the first interlayer insulating layer IIL2. The second interlayer insulating layer IIL3 may include, for example, SiO X 、SiN X 、SiO X N Y 、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO x Inorganic insulating materials.

[0125] The organic insulating layer OIL may be disposed on the second interlayer insulating layer IIL3. The organic insulating layer OIL may substantially planarize the top of the pixel circuit layer 200. The organic insulating layer OIL may include an organic material such as acrylic acid, benzocyclobutene ("BCB"), or hexamethyldisiloxane ("HMDSO"). Fig.10 The organic insulating layer OIL is shown to include a single layer, but various modifications may be made. In an embodiment, for example, the organic insulating layer OIL may include a plurality of layers.

[0126] The display element layer 300 may be disposed on the pixel circuit layer 200. The display element layer 300 may include a display element 310 and a pixel defining layer 320. The display element 310 may be electrically connected to a thin film transistor TFT. The display element 310 may include an organic light emitting diode including, for example, a pixel electrode 311, a counter electrode 313, and an intermediate layer 312 provided therebetween and including an emission layer. When the display element 310 is electrically connected to the thin film transistor TFT, it can be understood that the pixel electrode 311 of the organic light emitting diode is electrically connected to the thin film transistor TFT.

[0127] The pixel electrode 311 may be electrically connected to the thin film transistor TFT by contacting one of the source electrode SE and the drain electrode DE through a contact hole defined in the second interlayer insulating layer IIL3 and the organic insulating layer OIL. The pixel electrode 311 may include an indium tin oxide ("ITO"), indium zinc oxide ("IZO"), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide ("IGO"), or aluminum zinc oxide ("AZO"). In another embodiment, the pixel electrode 311 may include a reflective layer including Ag, magnesium (Mg), Al, Pt, palladium (Pd), Au, Ni, neodymium (Nd), iridium (Ir), Cr, or any compound thereof. In another embodiment, the pixel electrode 311 may further include a layer above and / or below the reflective layer, the layer including ITO, IZO, ZnO, or In 2 O 3 .

[0128] The pixel defining layer 320 may cover the edge of the pixel electrode 311. The pixel defining layer 320 may define a pixel opening therein, and the pixel opening may overlap with the pixel electrode 311 in a plan view. The pixel opening may define an emission area of ​​light emitted from the display element 310. The pixel defining layer 320 may include an organic insulating material and / or an inorganic insulating material. In some embodiments, the pixel defining layer 320 may include a light blocking material.

[0129] The intermediate layer 312 may be disposed on the pixel electrode 311 and the pixel defining layer 320. The intermediate layer 312 may include a low molecular weight material or a polymer material. When the intermediate layer 312 includes a low molecular weight material, the intermediate layer 312 may have a structure in which a hole injection layer ("HIL"), a hole transport layer ("HTL"), an emission layer ("EML"), an electron transport layer ("ETL"), and an electron injection layer ("EIL") are stacked in a single or composite structure. The intermediate layer 312 may be formed using vacuum deposition. When the intermediate layer 312 includes a polymer material, the intermediate layer 312 may have a structure including HTL and EML. In this case, the HTL may include poly (3,4-ethylenedioxythiophene) ("PEDOT"), and the EML may include a polymer material such as a poly (p-phenylene vinylene) ("PPV")-based material or a polyfluorene-based material. The intermediate layer 312 may be formed using screen printing, inkjet printing, or laser induced thermal imaging ("LITI"). The intermediate layer 312 is not necessarily limited thereto. The intermediate layer 312 may have various structures, and may include an integrated layer on the plurality of pixel electrodes 311 , or may include layers patterned to correspond to each of the plurality of pixel electrodes 311 .

[0130] The counter electrode 313 may be disposed on the intermediate layer 312 and the pixel defining layer 320. The counter electrode 313 may be integrally formed as a single body across a plurality of organic light emitting diodes and correspond to a plurality of pixel electrodes 311. The counter electrode 313 may include a material such as ITO, In 2 O 3 The counter electrode 313 may include a light-transmitting conductive layer of Mg or IZO, and may further include a semi-transmitting layer including a metal such as Al, Mg, or Ag. In an implementation, for example, the counter electrode 313 may include a semi-transmitting layer including Mg or Ag.

[0131] Since each display element 310 may be easily damaged by external moisture or oxygen, the encapsulation layer 400 may cover and protect the display element 310. Fig.10 As shown in , the encapsulation layer 400 may include a first inorganic encapsulation layer 410 , an organic encapsulation layer 420 , and a second inorganic encapsulation layer 430 .

[0132] The first inorganic encapsulating layer 410 may cover the counter electrode 313 and include SiO X 、SiN X and / or SiO X N Y Other layers such as a capping layer may be located between the first inorganic encapsulation layer 410 and the counter electrode 313. Since the first inorganic encapsulation layer 410 is formed along the structure below it, the upper surface of the first inorganic encapsulation layer 410 may be uneven, such as Fig.10 . The organic encapsulation layer 420 may cover the first inorganic encapsulation layer 410. Unlike the first inorganic encapsulation layer 410, the upper surface of the organic encapsulation layer 420 may be substantially flat. The organic encapsulation layer 420 may include one or more materials selected from PET, PEN, PC, PI, polyethylene sulfonate, polyoxymethylene, polyarylate, and HMDSO. The second inorganic encapsulation layer 430 may cover the organic encapsulation layer 420 and include SiO X 、SiN X and / or SiO X N Y .

[0133] Accordingly, since the encapsulation layer 400 includes the first inorganic encapsulation layer 410, the organic encapsulation layer 420, and the second inorganic encapsulation layer 430, even when cracks are generated in the encapsulation layer 400, due to the multi-layer structure, the cracks are not connected between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420 or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. Therefore, the formation of a path through which external moisture or oxygen, etc. penetrates into the display panel 10 can be prevented or significantly reduced.

[0134] Figures 11 to 16is a diagram for describing a method of manufacturing a display device according to an embodiment. Fig.11 , Fig.14 , Fig.15 and Fig.16 In order to facilitate the description, we will Figure 2 The method of manufacturing the display device is described by referring to the cross section of the display device 1 taken along the line II-II'. Figures 11 to 16 When describing the method for manufacturing a display device according to an embodiment, Figures 1 to 10 Reference numerals that are the same as those in the reference numerals in FIG. Figures 1 to 10 The components are the same as those in , and their repeated description will be omitted.

[0135] First, if Fig.11 As shown in , a display panel 10 may be provided. When providing the display panel, the display panel 10 may be flat, and a portion of the display panel 10 may not be bent. In an embodiment, for example, the display panel 10 may include a first panel area 10A1, a second panel area 10A2, and a panel bending area 10BA. The panel bending area 10BA may be located between the first panel area 10A1 and the second panel area 10A2, and the panel bending area 10BA of the display panel 10 may not be bent.

[0136] When providing the display panel, the display panel 10 may have a metal plate MP attached below the first panel area 10A1. In detail, the lower protective layer LPL may be arranged below the display panel 10, the supporting layer SL may be arranged below the lower protective layer LPL, and the metal plate MP may be arranged below the supporting layer SL. That is, the first lower protective layer LPL1 to which the first lower protective layer adhesive layer LPLa1 is attached may be attached to the second panel surface 10S2 of the first panel area 10A1 of the display panel 10, and the second lower protective layer LPL2 to which the second lower protective layer adhesive layer LPLa2 is attached may be attached to the second panel surface 10S2 of the second panel area 10A2 of the display panel 10. The supporting layer SL to which the supporting layer adhesive layer SLa is attached may be attached to the first lower protective layer LPL1, and the elastic member EM may be attached to the supporting layer SL to cover the folding pattern SLP of the supporting layer SL overlapping the panel foldable area 10FA. The first metal plate MP1 to which the first metal plate adhesive layer MPa1 is attached may be attached to a portion of the support layer SL overlapping with the first panel non-folding area 10NFA1 of the display panel 10, and the second metal plate MP2 to which the second metal plate adhesive layer MPa2 is attached may be attached to a portion of the support layer SL overlapping with the second panel non-folding area 10NFA2 of the display panel 10. That is, the metal plate MP may be attached to the lower side of the first panel area 10A1.

[0137] Moreover, the upper protective layer UPL may be arranged on the display panel 10, and the cover window CW may be arranged on the upper protective layer ULL. The upper protective layer UPL to which the upper protective layer adhesive layer UPLa is attached may be attached to the first panel surface 10S1 of the first panel area 10A1 of the display panel 10, and the cover window CW to which the cover window adhesive layer CWa is attached may be attached to the upper protective layer UPL.

[0138] Next, if Fig.12 As shown in , a printed circuit board PCB may be provided. A preliminary printed circuit board adhesive layer PPCBa may be attached to one surface of the printed circuit board PCB. In detail, the preliminary printed circuit board adhesive layer PPCBa may be attached to the rear surface of the printed circuit board PCB. When the printed circuit board PCB is bonded to the second panel area 10A2 of the display panel 10, the rear surface of the printed circuit board PCB may be a surface of the printed circuit board PCB that contacts the second panel area 10A2. That is, the rear surface of the printed circuit board PCB may be a surface in which bumps of the printed circuit board PCB to be connected to the pads of the second panel area 10A2 are arranged. In other words, the rear surface of the printed circuit board PCB may be a surface of the printed circuit board PCB facing the display panel 10.

[0139] In a plan view, the preliminary printed circuit board adhesive layer PPCBa may be arranged along an outer portion of the printed circuit board PCB to surround at least a portion of the printed circuit board PCB. In an embodiment, for example, the preliminary printed circuit board adhesive layer PPCBa may be continuously arranged along the periphery of the printed circuit board PCB to form a closed loop.

[0140] like Fig.13 As shown in Fig.13 It is along Fig.12 A schematic cross-sectional view of a printed circuit board PCB, a preliminary printed circuit board adhesive layer PPCBa, a release film RF and a release film adhesive layer RFa taken along line IV-IV' of FIG. The preliminary printed circuit board adhesive layer PPCBa may include a first portion PPCBa1 and a second portion PPCBa2. The first portion PPCBa1 may be a portion of the preliminary printed circuit board adhesive layer PPCBa that is similar to the above reference Figure 1 and Fig.10 The first portion PPCBa1 may be a portion corresponding to the printed circuit board adhesive layer PCBa described above, and the second portion PPCBa2 may be a portion of the preliminary printed circuit board adhesive layer PPCBa other than the first portion PPCBa1. That is, in a plan view, the first portion PPCBa1 may be arranged along an outer portion of the printed circuit board PCB to surround at least a portion of the printed circuit board PCB. In an embodiment, for example, the first portion PPCBa1 may be continuously arranged along the periphery of the printed circuit board PCB to form a closed loop.

[0141] The first part PPCBa1 may include a conductive nonwoven layer NWL' and a first conductive adhesive layer Ca1' and a second conductive adhesive layer Ca2', the first conductive adhesive layer Ca1' and the second conductive adhesive layer Ca2' being arranged on opposite sides of the conductive nonwoven layer NWL', respectively, with the conductive nonwoven layer NWL' therebetween. That is, the first part PPCBa1 may include a first conductive adhesive layer Ca1', a second conductive adhesive layer Ca2', and a conductive nonwoven layer NWL' between the first conductive adhesive layer Ca1' and the second conductive adhesive layer Ca2'. The conductive nonwoven layer NWL', the first conductive adhesive layer Ca1', and the second conductive adhesive layer Ca2' of the first part PPCBa1 may correspond to the printed circuit board adhesive layer PCBa (see Figure 4 ) of the conductive nonwoven layer NWL (see Figure 4 )、first conductive adhesive layer Ca1 (see Figure 4 ) and a second conductive adhesive layer Ca2 (see Figure 4 ).

[0142] In detail, the conductive nonwoven layer NWL' may include a nonwoven fabric plated with a metal material such as Cu or Ni. That is, the conductive nonwoven layer NWL' may have a structure in which the nonwoven fabric is plated with a metal material such as Cu and Ni. The conductive nonwoven layer NWL' may include a nonwoven fabric plated with a metal material such as Cu or Ni, and the conductive nonwoven layer NWL' may have voids in the conductive nonwoven fabric.

[0143] The first conductive adhesive layer Ca1' may be located between the conductive nonwoven layer NWL' and the printed circuit board PCB. That is, the first conductive adhesive layer Ca1' may be in direct contact with one surface of the printed circuit board PCB, and the first conductive adhesive layer Ca1' may be attached to the printed circuit board PCB. The second conductive adhesive layer Ca2' may be arranged opposite to the first conductive adhesive layer Ca1' with the conductive nonwoven layer NWL' therebetween. That is, the second conductive adhesive layer Ca2' may be in direct contact with one surface of the release film RF.

[0144] The first conductive adhesive layer Ca1' and the second conductive adhesive layer Ca2' may include a conductive adhesive material. In an embodiment, the first conductive adhesive layer Ca1' and the second conductive adhesive layer Ca2' may be a film formed by dispersing metal particles including metal (e.g., Au, Ag, Pt, or Ni) in a synthetic resin. The synthetic resin may include a material such as epoxy resin, silicone, PI, or polyurethane. However, one or more embodiments are not limited thereto.

[0145] The second part PPCBa2 may be connected to the first part PPCBa1, and the second part PPCBa2 and the first part PPCBa1 may include the same material as each other. In detail, the second part PPCBa2 may be connected to the conductive nonwoven layer NWL', and the second part PPCBa2 and the conductive nonwoven layer NWL' may include the same material as each other. That is, the second part PPCBa2 may include a nonwoven fabric plated with a metal material such as Cu or Ni. That is, the second part PPCBa2 may be integrally formed into a single body with the conductive nonwoven layer NWL' of the first part PPCBa1.

[0146] Typically, the printed circuit board adhesive layer PCBa (see Figure 4 ) of the conductive nonwoven layer NWL (see Figure 4 ) can be formed by cutting a fabric into a preset shape using a cutting tool or the like, the fabric comprising a nonwoven fabric plated with a metal material. However, when the fabric is cut into a preset shape by using a cutting tool or the like, the fabric may not be accurately cut, and the portion of the fabric that needs to be cut may remain uncut. Alternatively, the fabric can be accurately cut into a preset shape so that a linear object existing in the preset shape during cutting may protrude to the outside of the preset shape in a subsequent process. That is, byproducts (such as burrs) produced by cutting may exist on the outside of the conductive nonwoven layer cut into the preset shape. The second part PPCBa2 may be a byproduct produced by cutting. In other words, the second part PPCBa2 may be a byproduct produced by cutting the fabric into the shape of a conductive nonwoven layer NWL, the fabric comprising a nonwoven fabric plated with a metal material.

[0147] The release film RF can be attached to one surface of the printed circuit board PCB. In detail, the release film RF can be attached to the rear surface of the printed circuit board PCB through the release film adhesive layer RFa. That is, the release film adhesive layer RFa and the preliminary printed circuit board adhesive layer PPCBa can be attached to the same surface as each other. Accordingly, the release film adhesive layer RFa can be located between the printed circuit board PCB and the release film RF. As described below, the printed circuit board PCB can be formed by the preliminary printed circuit board adhesive layer PPCBa. In other words, the release film adhesive layer RFa and the printed circuit board adhesive layer PCBa can be arranged on the same surface of the printed circuit board PCB.

[0148] The release film RF may be attached to the same surface as one surface of the printed circuit board PCB to which the printed circuit board adhesive layer PCBa is attached. In detail, the release film RF may cover the printed circuit board adhesive layer PCBa attached to the printed circuit board PCB, and may also cover a portion of one surface of the printed circuit board PCB to which the printed circuit board adhesive layer PCBa is not attached. Accordingly, the release film RF may protect the printed circuit board adhesive layer PCBa before being attached to the metal plate MP, and may protect one surface of the printed circuit board PCB to which the release film RF is attached.

[0149] The release film RF may include a plastic film including a polymer resin. In an embodiment, for example, the release film RF may include at least one of polymer resins such as PET, PBT, PC, PEN, PS, PMMA, PVC, PES, PP, and PA. In addition, the release film adhesive layer RFa may include an adhesive member such as OCA or PSA. Alternatively, the release film adhesive layer RFa may include a silicone adhesive or an acrylic adhesive. However, one or more embodiments are not limited thereto.

[0150] In a plan view, the release film adhesive layer RFa may be arranged to be spaced apart from the first part PPCBa1. In detail, in a plan view, at least a portion of the release film adhesive layer RFa may be arranged along the outside of the first part PPCBa1 to surround at least a portion of the first part PPCBa1. The release film adhesive layer RFa may include a first release film adhesive layer RFa1 and a second release film adhesive layer RFa2. In a plan view, the first release film adhesive layer RFa1 and the second release film adhesive layer RFa2 may be arranged to face each other with a printed circuit board adhesive layer PCBa therebetween. In an embodiment, for example, in a plan view, the first release film adhesive layer RFa1 may be arranged on the outside of a closed loop formed by the printed circuit board adhesive layer PCBa, and the second release film adhesive layer RFa2 may be arranged inside a closed loop formed by the printed circuit board adhesive layer PCBa. However, one or more embodiments are not limited thereto.

[0151] like Fig.13 As shown in , a portion of the release film adhesive layer RFa can be attached to a portion of the second portion PPCBa2. In other words, the second portion PPCBa2 can be attached to the release film RF through the release film adhesive layer RFa. Alternatively, the release film RF can be attached to the second portion PPCBa2 through the release film adhesive layer RFa. Fig.13A portion of the second release film adhesive layer RFa2 is shown attached to a portion of the second portion PPCBa2, but one or more embodiments are not limited thereto. As another example, in a plan view, when the second portion PPCBa2 is arranged outside the closed loop formed by the printed circuit board adhesive layer PCBa, a portion of the first release film adhesive layer RFa1 may also be attached to a portion of the second portion PPCBa2.

[0152] Next, if Fig.14 As shown in , the printed circuit board PCB can be bonded to the second panel area 10A2. As described above, the pads of the display panel 10 can be arranged in the second panel area 10A2, and after the bumps of the printed circuit board PCB are set on the pads of the display panel 10, the bumps are attached to the pads, respectively, and thus, the printed circuit board PCB can be bonded to the second panel area 10A2. Generally, the printed circuit board PCB can be attached to the display panel 10 by using a pressurizing device. In detail, an anisotropic conductive film can be arranged between the pads of the second panel area 10A2 and the bumps of the printed circuit board PCB, and a certain amount of heat and pressure can be applied to the top of the printed circuit board PCB by using a pressurizing device such as a hot press bar, so that the bumps are attached to the pads. The anisotropic conductive film may include a thermosetting resin and a conductive ball, and the thermosetting resin may be thermally cured when a certain amount of heat and pressure is applied to the top of the printed circuit board PCB.

[0153] Next, if Fig.15 As shown in , the release film RF can be removed from the printed circuit board PCB. Accordingly, the printed circuit board adhesive layer PCBa can be formed. In detail, the release film adhesive layer RFa can be attached to the release film RF, and the release film adhesive layer RFa can be attached to the second part PPCBa2 (see Fig.13 That is, the release film RF can be attached to the second part PPCBa2 (see Fig.13 In this case, the release film adhesive layer RFa can also be removed as the release film RF is detached. Fig.13 ) can also be removed along with the removal of the release film adhesive layer RFa. Accordingly, since only the first portion PPCBa1 corresponding to the printed circuit board adhesive layer PCBa exists on the printed circuit board PCB (see Fig.13 ), thus the printed circuit board adhesive layer PCBa can be formed. That is, the printed circuit board adhesive layer PCBa can be a preliminary printed circuit board adhesive layer PPCBa from which by-products are removed.

[0154] In addition, the residual adhesive layer RFa' may be arranged on the rear surface of the printed circuit board PCB to which the release film adhesive layer RFa is attached. The residual adhesive layer RFa' and the release film adhesive layer RFa may include the same material as each other. After the release film adhesive layer RFa is removed from the printed circuit board PCB, a portion of the release film adhesive layer RFa may remain on the rear surface of the printed circuit board PCB. The residual adhesive layer RFa' may be a portion of the release film adhesive layer RFa remaining on the rear surface of the printed circuit board PCB. Accordingly, the residual adhesive layer RFa' may correspond to the release film adhesive layer RFa. In detail, the residual adhesive layer RFa' may include a first residual adhesive layer RFa1' and a second residual adhesive layer RFa2', and the first residual adhesive layer RFa1' and the second residual adhesive layer RFa2' may correspond to the first release film adhesive layer RFa1 and the second release film adhesive layer RFa2, respectively. Therefore, repeated descriptions thereon will be omitted.

[0155] In detail, the residual adhesive layer RFa' may be arranged on the rear surface of the printed circuit board PCB in contact with the printed circuit board adhesive layer PCBa. In a plan view, the residual adhesive layer RFa' may be arranged to be spaced apart from the printed circuit board adhesive layer PCBa. In a plan view, at least a portion of the residual adhesive layer RFa' may be arranged along the outer side of the printed circuit board adhesive layer PCBa to surround at least a portion of the printed circuit board adhesive layer PCBa.

[0156] Next, if Fig.16 As shown in , the printed circuit board PCB can be attached to the bottom of the metal plate MP by the bending panel bending area 10BA. In detail, the printed circuit board PCB can be attached to the bottom of the second metal plate MP2 by the bending panel bending area 10BA. That is, by attaching the printed circuit board adhesive layer PCBa below the second metal plate MP2, the printed circuit board PCB can be attached to the bottom of the second metal plate MP2. In other words, the printed circuit board PCB can be attached to the bottom of the second metal plate MP2 through the printed circuit board adhesive layer PCBa. In this case, the second panel area 10A2 can also be arranged below the second metal plate MP2. The second lower protective layer LPL2 attached to the second panel area 10A2 can be attached to the bottom of the second metal plate MP2 through the third lower protective layer adhesive layer LPLa3. Accordingly, the second panel area 10A2 can be attached to the bottom of the second metal plate MP2.

[0157] The by-products protruding to the outside of the printed circuit board adhesive layer PCBa may cause post-processing defects and appearance defects. However, in the method of manufacturing a display device according to the present embodiment, the release film adhesive layer RFa is used to remove the by-products protruding to the outside of the printed circuit board adhesive layer PCBa, and therefore, the post-processing defects and appearance defects caused by the by-products protruding to the outside of the printed circuit board adhesive layer PCB can be prevented or significantly reduced. Therefore, the possibility of defects in the manufacturing process of the display device 1 can be effectively reduced.

[0158] As described above, the present disclosure has been described with reference to one or more embodiments shown in the attached drawings, but should be considered only in a descriptive sense. It will be understood by those skilled in the art that various modifications and equivalent embodiments can be made therefrom. Therefore, the true technical protection scope of the present disclosure should be defined by the technical spirit of the claims.

[0159] According to the embodiments of the present disclosure as described above, a display device and a method of manufacturing a display device that reduce the possibility of defects occurring in a manufacturing process can be realized. However, the scope of the present disclosure is not limited by the above effects.

[0160] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the claims.

Claims

1. A method for manufacturing a display device, the method comprising: Providing a display panel, the display panel comprising a first panel area, a second panel area, and a panel bending area between the first panel area and the second panel area, wherein a metal plate is attached below the first panel area of ​​the display panel; providing a printed circuit board having a preliminary printed circuit board adhesive layer and a release film attached thereto; bonding the printed circuit board to the second panel area; forming a printed circuit board adhesive layer by removing the release film from the printed circuit board; as well as attaching the printed circuit board below the metal plate by bending the panel bending area, wherein, in the process of providing the printed circuit board, the release film is attached to the printed circuit board via a release film adhesive layer located between the release film and the printed circuit board, The preliminary printed circuit board adhesive layer includes a first portion and a second portion other than the first portion, the first portion corresponds to the printed circuit board adhesive layer, and The release film adhesive layer is attached to the second portion.

2. The method according to claim 1, wherein: Forming the printed circuit board adhesive layer includes removing the release film adhesive layer from the printed circuit board by removing the release film from the printed circuit board.

3. The method according to claim 2, wherein: Forming the printed circuit board adhesive layer further includes removing the second portion attached to the release film adhesive layer when removing the release film adhesive layer from the printed circuit board.

4. The method according to claim 1, wherein: The first portion and the second portion include the same material as each other.

5. The method according to claim 4, wherein: The first portion includes a first conductive adhesive layer, a second conductive adhesive layer, and a conductive nonwoven layer located between the first conductive adhesive layer and the second conductive adhesive layer, and The second portion and the conductive nonwoven layer include the same material as each other.

6. The method according to claim 5, wherein: In the process of providing the printed circuit board, the first conductive adhesive layer of the preliminary printed circuit board adhesive layer is attached to the printed circuit board.

7. The method according to claim 1, wherein: In the process of providing the printed circuit board, the release film adhesive layer and the printed circuit board adhesive layer are arranged on the same surface of the printed circuit board.

8. The method according to claim 1, wherein: In the process of providing the printed circuit board, the release film adhesive layer is arranged to be spaced apart from the first portion in a plan view.

9. The method according to claim 1, wherein: In providing the printed circuit board, at least a portion of the release film adhesive layer is arranged along an outer side of the first portion to surround at least a portion of the first portion in a plan view.

10. The method according to claim 1, wherein: In the process of providing the printed circuit board, the preliminary printed circuit board adhesive layer is arranged along an outer portion of the printed circuit board to surround at least a portion of the printed circuit board in a plan view.

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