Organic light emitting display device

Abstract

An organic light emitting display device is provided. The organic light emitting display device includes: a substrate including an active area and a non-active area at least partially surrounding the active area; an organic light emitting element in the active region; a conductive line in the non-active area, the conductive line being provided to have a vertical concave-convex shape, and transmitting power to the organic light emitting element; at least two blocking structures in the non-active region, wherein the conductive line at least partially covers a region including the at least one recess; and at least one inorganic layer on the at least one recess.

Description

[0001] This application is a divisional application of the invention patent application with application date of December 16, 2020, application number 202011487125.3, and invention name “Organic Light-Emitting Display Device”. Technical Field

[0002] The invention relates to an organic light emitting display device. Background Art

[0003] Image display devices that realize various information on the screen are considered to be the core technology of the information communication era. Such image display devices are becoming thinner, lighter and more portable while having higher performance characteristics.

[0004] Organic light-emitting elements are self-luminous elements using a thin light-emitting layer between electrodes, which is advantageous in terms of lightness and thinness. A general organic light-emitting display device has a structure in which a pixel driving circuit and an organic light-emitting element are formed on a substrate, and light emitted from the organic light-emitting element passes through the substrate or a barrier layer, thereby displaying an image.

[0005] Since the organic light emitting display device is implemented without a separate light source device, it can be easily implemented as a flexible display device. In this case, a flexible material such as plastic or metal foil can be used as a substrate of the organic light emitting display device.

[0006] Since the performance of the organic light emitting element deteriorates when exposed to moisture, the waterproof design of the outer part of the display device is very important. Therefore, various waterproof designs are applied to the outer part of the display device. On the other hand, for aesthetic reasons, it is necessary to reduce the width of the outer part (frame). As described above, it is difficult to meet the requirements at the same time, but the inventors are continuing to study how to meet both requirements. Summary of the invention

[0007] An object to be achieved by the present invention is to provide an organic light emitting display device and a frame structure applied to the organic light emitting display device.

[0008] The objects of the present invention are not limited to the above objects, and those skilled in the art can clearly understand other objects not mentioned above through the following description.

[0009] According to one aspect of the present invention, an organic light-emitting display device includes: a substrate, the substrate including an active area and an inactive area surrounding the active area; an organic light-emitting element in the active area; and a wire in the inactive area, the wire being arranged to have a vertical concave-convex shape and being used to transmit power to the organic light-emitting element.

[0010] The conductive line may cover a region including at least one groove in which the inorganic layer is dug out.

[0011] The inorganic layer may include at least one of a buffer layer, a gate insulating layer, an interlayer insulating layer, and a protective layer. In this case, the buffer layer may include a multiple buffer portion and an active buffer portion. The active buffer portion may be removed from the groove without removing the multiple buffer portion from the groove.

[0012] The organic light emitting display device may further include an encapsulation layer covering the organic light emitting element. The encapsulation layer may include: a first inorganic layer on the organic light emitting element; an organic layer on the first inorganic layer; and a second inorganic layer on the organic layer.

[0013] The organic light emitting display device may further include: at least two blocking structures in the inactive region, the blocking structures being used to block the flow of the organic layer of the encapsulation layer.

[0014] The conductive line may not vertically overlap a blocking structure disposed at an outermost position among the blocking structures.

[0015] The blocking structure may include: a first blocking structure; a second blocking structure further away from the active region than the first blocking structure; and a third blocking structure further away from the active region than the second blocking structure. The conductive line may not vertically overlap the third blocking structure.

[0016] The first barrier structure may be formed of the same or substantially the same material as the planarization layer and the bank of the active region. The second barrier structure may be formed by sequentially stacking the same material as the planarization layer, the bank and the spacer of the active region. The third barrier structure may be formed of the same or substantially the same material as the planarization layer of the active region.

[0017] According to another aspect of the present invention, an organic light-emitting display device includes: a substrate, the substrate including an active area and an inactive area at least partially surrounding the active area; an organic light-emitting element in the active area; a conductive line in the inactive area, the conductive line being arranged to have a vertical concave-convex shape and being used to transmit power to the organic light-emitting element; at least two blocking structures in the inactive area, wherein the conductive line at least partially covers an area including at least one groove; and at least one inorganic layer on the at least one groove.

[0018] Additional details of illustrative embodiments are included in the detailed description and accompanying drawings.

[0019] According to an exemplary embodiment of the present invention, an organic light emitting display device that improves damage to a wire of an external portion can be provided. More specifically, according to an exemplary embodiment of the present invention, a structure that can prevent damage to a wire and a driving failure caused thereby and at the same time has a narrow frame can be provided. Therefore, the waterproof performance and long-term reliability of the organic light emitting display device according to an exemplary embodiment of the present invention can be improved.

[0020] The effects according to the present invention are not limited to the above-exemplified contents, and the present application includes more various effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0022] Figure 1 is a plan view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention;

[0023] Figure 2 is a cross-sectional view illustrating a portion of an active region of an organic light emitting display device according to an exemplary embodiment of the present invention;

[0024] Figure 3 is a cross-sectional view illustrating a portion of an inactive region of an organic light emitting display device according to another exemplary embodiment of the present invention;

[0025] Figure 4 is a cross-sectional view illustrating an external portion structure of an organic light emitting display device according to another exemplary embodiment of the present invention;

[0026] Figure 5 yes Figure 4 An enlarged view of portion X. DETAILED DESCRIPTION

[0027] The advantages and features of the present invention and the methods for achieving these advantages and features are described in detail below and in the accompanying drawings. Figure 1 The exemplary embodiments described in detail will be clear. However, the present invention is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present invention and the scope of the present invention. Therefore, the present invention is limited only by the scope of the appended claims.

[0028] The shapes, sizes, proportions, angles, quantities, etc. shown in the accompanying drawings for describing exemplary embodiments of the present invention are merely examples, and the present invention is not limited thereto. In addition, in the following description of the present invention, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present invention. Terms such as "including", "having" and "comprising" used herein are generally intended to allow the addition of other components unless these terms are used together with the term "only". Even if not explicitly stated, the elements are interpreted as including the usual error range.

[0029] When terms such as “on”, “over”, “under”, and “after” are used to describe the positional relationship between two parts, one or more parts may be disposed between the two parts unless these terms are used together with the terms “immediately adjacent to” or “directly”. When an element or layer is disposed “on” another element or layer, it may be disposed directly on the other element or layer, or other layers or other elements may be interposed therebetween.

[0030] When any component is described as being “connected to” or “coupled to” another component, the component may be directly connected to or coupled to the other component, but it should be understood that any other component may be “interposed” between them, or the components may be “connected,” “coupled” or “joined” to each other through a third component.

[0031] Although the terms "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, within the technical concept of the present invention, the first component mentioned below may be the second component.

[0032] Like reference symbols generally refer to like elements throughout the application.

[0033] The size and thickness of each component shown in the figure are shown for ease of description, and the present invention is not limited to the size and thickness of the components shown in the figure. The features of each embodiment of the present invention can be combined or combined with each other in part or in whole and can be technically interlocked and operated in various ways, and these embodiments can be implemented independently of each other or in combination with each other.

[0034] Hereinafter, a display device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0035] Figure 1 is a plan view illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

[0036] Reference Figure 1, the organic light emitting display device 100 includes at least one active area A / A, and a pixel array is arranged in the active area. One or more inactive areas I / A may be arranged around the active area. That is, the inactive area may be adjacent to one or more side surfaces of the active area. Figure 1 In the embodiment, the inactive region surrounds the active region having a rectangular shape. However, the shape of the active region, and the shape and arrangement of the inactive region adjacent to the active region are not limited to Figure 1 The active area and the inactive area may be in a form suitable for the design of an electronic device on which the display device 100 is mounted. The shape of the active area is, for example, a pentagon, a hexagon, a circle, or an ellipse.

[0037] Each pixel in the active area A / A may be associated with a pixel circuit. The pixel circuit may include one or more switching transistors and one or more driving transistors. Each pixel circuit may be electrically connected to a signal line (gate line, data line, etc.) to communicate with a gate driver, data driver, etc. located in the non-active area.

[0038] The gate driver may be implemented as a thin film transistor (TFT) in the non-active area I / A. Such a driver may be referred to as a gate in panel (GIP). In addition, some components such as a data driver IC are mounted on a separate printed circuit board and may be joined to a connection interface (pad, bump, pin, etc.) provided in the non-active area through a circuit film such as a flexible printed circuit board (FPCB), a chip on film (COF), a tape carrier package (TCP), etc. The printed circuit (COF, PCB, etc.) may be located behind the display device 100.

[0039] The organic light-emitting display device 100 may include various additional elements for generating various signals or for driving pixels in the active area. Additional elements for driving pixels may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, etc. The organic light-emitting display device 100 may also include additional elements related to other functions other than pixel driving. For example, the organic light-emitting display device 100 may include additional elements for providing a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, etc. The above-mentioned additional elements may be located in the non-active area and / or in an external circuit connected to the connection interface.

[0040] An organic light emitting display device according to an exemplary embodiment of the present invention may include a substrate 101 on which a thin film transistor and an organic light emitting element are arranged, an encapsulation layer 120 , a polarization layer 145 , and the like.

[0041] The substrate 101 supports various components of the organic light-emitting display device 100. The substrate 101 may be formed of a transparent insulating material, for example, an insulating material such as glass, plastic, etc. The substrate (array substrate) also refers to a concept including elements and functional layers (for example, a switching TFT, a driving TFT connected to the switching TFT, an organic light-emitting element connected to the driving TFT, a protective film, etc.) formed thereon.

[0042] An organic light emitting element is disposed on the substrate 101. The organic light emitting element includes an anode, an organic light emitting layer, and a cathode. The organic light emitting element may be configured as a single light emitting layer structure that emits one light, or may be configured as a structure composed of multiple light emitting layers to emit white light. When the organic light emitting element emits white light, a color filter may be further provided. The organic light emitting element may be formed in the central portion of the substrate 101 corresponding to the active area.

[0043] The encapsulation layer 120 may at least partially cover the organic light emitting element. The encapsulation layer protects the organic light emitting element from external moisture or oxygen.

[0044] The organic light emitting display device 100 may be configured to have a plurality of pixels, each of which may include a plurality of sub-pixels, and in this case, a sub-pixel is a minimum unit for representing one color.

[0045] A sub-pixel circuit may include a plurality of transistors, capacitors, and a plurality of lines. The sub-pixel circuit may be composed of two transistors and one capacitor (2T1C), but is not limited thereto, and may be implemented as a sub-pixel circuit composed of 4T1C, 7T1C, 6T2C, etc. In addition, the sub-pixel may be implemented as an organic light-emitting display device 100 suitable for a top emission type.

[0046] Figure 2 is a cross-sectional view illustrating a portion of an active region of an organic light emitting display device according to an exemplary embodiment of the present invention.

[0047] The organic light emitting display device 100 may include a substrate 101 , a thin film transistor, an organic light emitting element, and various functional layers.

[0048] The substrate 101 is used to support and protect the components of the organic light-emitting display device 100 disposed thereon. The substrate 101 may be a flexible substrate formed of a ductile material having a flexible property. The substrate 101 may be a glass or plastic substrate. In the case of a plastic substrate, a polyimide-based or polycarbonate-based material may be used to have flexibility. In particular, polyimide can be applied to a high temperature process and is widely used for a plastic substrate because it is a material that can be coated.

[0049] The buffer layer 103 is a functional layer for protecting the electrode / lead from impurities such as alkaline ions flowing out from the substrate 101 or the lower layer. The buffer layer may be formed of silicon oxide (SiOx), silicon nitride (SiNx) or a multilayer thereof. The buffer layer 103 may include a multi-buffer and / or an active buffer. A multi-buffer may be formed by alternately stacking silicon nitride (SiNx) and silicon oxide (SiOx), and the multi-buffer may delay the diffusion of moisture and / or oxygen penetrating into the substrate 101. The active buffer protects the semiconductor layer 102 of the transistor and is used to block various defects introduced from the substrate 101. The active buffer may be formed of amorphous silicon (a-Si) or the like.

[0050] The thin film transistor includes a gate electrode 104, a source electrode and a drain electrode 108, and a semiconductor layer 102. The semiconductor layer 102 may be formed of amorphous silicon or polycrystalline silicon. Polycrystalline silicon has a better mobility than amorphous silicon, and thus has lower energy consumption and excellent reliability. Recently, oxide semiconductors have attracted attention due to their excellent mobility and consistency. The semiconductor layer 102 may include: a source region including p-type or n-type impurities, a drain region, and a channel between the source region and the drain region, and the semiconductor layer 102 may include a low-concentration doped region between the source region and the drain region adjacent to the channel.

[0051] The gate insulating layer 105 is an insulating film composed of a single layer or a plurality of layers of silicon oxide (SiOx) or silicon nitride (SiNx), and is provided so that current flowing through the semiconductor layer 102 does not flow to the gate electrode 104 .

[0052] The gate electrode 104 is used as a switch that turns on or off the thin film transistor based on an electrical signal transmitted from the outside through the gate line, and the gate electrode 104 may be composed of a single layer or multiple layers of copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), etc., or an alloy thereof as a conductive metal. The source electrode and the drain electrode 108 are connected to the data line and transmit the electrical signal transmitted from the outside from the thin film transistor to the organic light emitting element. The source electrode and the drain electrode 108 may be composed of a single layer or multiple layers of copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), etc., or an alloy thereof as a metal material.

[0053] In order to insulate the gate electrode 104 and the source and drain electrodes 108 from each other, an interlayer insulating layer 106 composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx) may be provided between the gate electrode 104 and the source and drain electrodes 108 .

[0054] A protective layer 107 formed of an inorganic insulating film such as silicon oxide (SiOx) or silicon nitride (SiNx) may be located on the thin film transistor. The protective layer 107 may prevent unnecessary electrical connection between components of the thin film transistor and prevent contamination or damage from the outside. Depending on the configuration and characteristics of the thin film transistor and the organic light emitting element, the protective layer 107 may be omitted.

[0055] For ease of description, only the driving thin film transistor among various thin film transistors is shown, but the active region may also include a switching thin film transistor, a capacitor, etc. When a signal is applied from a gate line to the switching thin film transistor, the switching thin film transistor transmits the signal from the data line to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits the current transmitted through the power line to the anode using the signal received from the switching thin film transistor, and controls light emission using the current transmitted to the anode.

[0056] The planarization layer 109 is disposed on the thin film transistor. The planarization layer 109 protects the thin film transistor, relieves the steps caused by the thin film transistor, and reduces the parasitic capacitance generated between the thin film transistor, the gate line and the data line and the organic light emitting element. The planarization layer 109 can be formed of one or more of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin and benzocyclobutene.

[0057] The organic light emitting element is disposed on the planarization layer 109. The organic light emitting element includes an anode 112, a light emitting unit 114, and a cathode 116. The anode 112 may be disposed directly on the planarization layer 109. The anode 112 is an electrode for providing holes to the light emitting unit 114 and may be electrically connected to the thin film transistor through a contact hole in the planarization layer 109. The anode 112 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), etc. as a transparent conductive material. When the organic light emitting display device 100 is a top emission type that emits light upward, it may further include a reflective layer so that the emitted light is more smoothly emitted in a direction toward the upper part where the cathode 133 is disposed. The anode 112 may be a double-layer structure in which a transparent conductive layer and a reflective layer formed of a transparent conductive material are stacked in sequence, or a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are stacked in sequence. The reflective layer may be formed of silver (Ag) or an alloy including silver.

[0058] The bank 110 is disposed on the anode 112 and the planarization layer 109 and can actually define a region where light is emitted. The bank 110 is formed by photolithography after a photoresist is formed on the anode 112. The photoresist refers to a photosensitive resin whose solubility in a developer changes due to the action of light, and a specific pattern can be obtained by exposing and developing the photoresist.

[0059] A fine metal mask (FMM) as a deposition mask may be used to form the light emitting unit 114 of the organic light emitting element. At this time, in order to prevent damage that may occur due to contact with the deposition mask disposed on the bank 110 and maintain a constant distance between the bank 110 and the deposition mask, a spacer 111 may be disposed on the bank 110, and the spacer 111 is formed of one of polyimide, photo acryl, and benzocyclobutene (BCB) as a transparent organic material.

[0060] The light emitting unit 114 is disposed between the anode 112 and the cathode 116. The light emitting unit 114 is used to emit light and may include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL), and some components of the light emitting unit 114 may be omitted according to the structure or characteristics of the organic light emitting display device 100.

[0061] The cathode 116 is disposed on the light emitting unit 114 and is used to provide electrons to the light emitting unit 114. Since the cathode 116 needs to provide electrons, it can be formed of a metal material, such as magnesium (Mg), silver-magnesium (Ag:Mg), which is a conductive material with a low work function. In the case where the organic light emitting display device 100 is a top emission type, the cathode 116 can be a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (ITZO), indium tin zinc oxide (ITZO), zinc oxide (IZO) and tin oxide (ITO).

[0062] An encapsulation layer 120 may be provided on the organic light emitting element, and the encapsulation layer 120 is used to prevent oxidation or damage caused by moisture, oxygen or impurities introduced from the outside. The encapsulation layer 120 may be formed by stacking a plurality of inorganic layers, a foreign matter compensation layer and a plurality of barrier films. The inorganic layer may be provided on the entire surface of the upper portion of the organic light emitting element, and the organic layer may be formed of one of silicon nitride (SiNx) and aluminum oxide (AlyOz) as inorganic materials. Additional inorganic layers may be stacked and provided on the foreign matter compensation layer. The foreign matter compensation layer is provided on the inorganic layer, and the foreign matter compensation layer may use an organic material, such as silicon carbide (SiOCz), acrylic, or epoxy resin. When defects occur due to cracks caused by foreign matter or particles that may be generated during the process, these defects may be compensated by covering the curve and foreign matter.

[0063] A barrier film may be provided on the encapsulation layer 120 to further delay the penetration of oxygen and moisture from the outside. The barrier film is configured in the form of a light-transmitting double-sided tape film, and the barrier film may be composed of any one of olefin-based, acrylic-based, and silicon-based insulating materials. Alternatively, a barrier film composed of any one of COP (cycloolefin polymer), COC (cycloolefin copolymer), and PC (polycarbonate) may be further used. A touch electrode (panel), a polarizing film, a glass cover, etc. may be further provided on the encapsulation layer 120.

[0064] Figure 3 is a cross-sectional view illustrating a portion of an inactive region of an organic light emitting display device according to another exemplary embodiment of the present invention.

[0065] like Figure 1 As shown in , the non-active area I / A may be located outside the active area A / A, and a driving circuit (e.g., GIP), a power line, etc. may be arranged thereon. Although pixel circuits and light-emitting elements are not arranged in the non-active area I / A, a substrate 101 and organic / inorganic functional layers 103, 105, 107, 109, 120, etc. may be present therein. In addition, the material used when constructing the active area A / A may be arranged in the non-active area I / A for other purposes. For example, the same metal 104' as the gate electrode of the TFT in the active area, or the same metal 108' as the source electrode / drain electrode may be arranged in the non-active area I / A for lines or electrodes. In addition, the same metal 112' as one electrode (e.g., an anode) of an organic light-emitting diode may be arranged in the non-active area I / A for lines and electrodes.

[0066] The encapsulation layer 120 covers the upper part of the organic light emitting element. The encapsulation layer may be composed of an inorganic layer formed of a glass, metal, aluminum oxide (AlOx) or silicon (Si) based material, or the encapsulation layer may have a structure in which an organic layer and an inorganic layer are alternately stacked. The inorganic layers 121-1 and 121-2 are used to block the penetration of moisture and oxygen, and the organic layer 122 is used to planarize the surfaces of the inorganic layers 121-1 and 121-2.

[0067] The organic layer 122 has a certain degree of fluidity and may flow to the outside of the non-active area during application. Therefore, the blocking structures 190-1, 190-2, and 190-3 are provided to control the diffusion of the organic layer 122 to the non-active area I / A. Figure 3The three barrier structures 190-1, 190-2 and 190-3, i.e., three dams 190-1, 190-2 and 190-3 are illustrated, but the number of dams may vary. In addition, the dams 190-1, 190-2 and 190-3 may be arranged to surround the active area A / A or may be arranged inside the active area A / A. The dams 190-1, 190-2 and 190-3 may be formed of multiple layers using at least one or more materials. For example, the dams 190-1, 190-2 and 190-3 may be manufactured using the materials used when forming the planarization layer 109, the bank 110 and the spacer 111.

[0068] On the encapsulation layer 120, the touch sensing lines 154 and the touch driving lines 152 may be alternately disposed, and the touch insulating layer 158 is interposed between the touch sensing lines 154 and the touch driving lines 152. Mutual capacitance (Cm) is formed at the overlapping position of the touch sensing lines 154 and the touch driving lines 152. Therefore, the mutual capacitance (Cm) functions as a touch sensor by charging electric charges using a touch driving pulse provided to the touch driving line 152 and discharging the charged electric charges to the touch sensing line 154.

[0069] The touch drive line 152 includes a plurality of first touch electrodes and a first bridge portion electrically connecting the first touch electrodes to each other. The plurality of first touch electrodes are spaced apart from each other at regular intervals along a first direction. Each of the plurality of first touch electrodes is electrically connected to a first touch electrode adjacent thereto through a first bridge portion. The first bridge portion is disposed on the same layer as the first touch electrode and can be electrically connected to the first touch electrode without a separate contact hole.

[0070] The touch sensing line 154 includes a plurality of second touch electrodes and a second bridge portion electrically connecting the plurality of second touch electrodes. The plurality of second touch electrodes are spaced apart from each other at regular intervals along the second direction. Each of the plurality of second touch electrodes is electrically connected to a second touch electrode adjacent thereto through a second bridge portion. The second bridge portion is disposed on a different layer from the second touch electrode and can be electrically connected to the second touch electrode through a contact hole.

[0071] Each of the first touch electrode, the second touch electrode, the first bridge portion, and the second bridge portion can be formed into a single layer or multilayer structure using a conductive layer having high corrosion resistance and acid resistance and excellent conductivity, such as aluminum (Al), titanium (Ti), copper (Cu), or molybdenum (Mo). For example, each of the first touch electrode, the second touch electrode, the first bridge portion, and the second bridge portion is formed into a three-layer stacked structure such as Ti / Al / Ti or Mo / Al / Mo.

[0072] Each of the touch drive line 152 and the touch sensing line 154 is connected to the touch driver through the wiring and the touch pad provided in the non-active area. Therefore, the touch wiring transmits the touch drive pulse generated by the touch driver to the touch drive line 152 through the touch pad, and transmits the touch signal from the touch sensing line 154 to the touch pad.

[0073] Various circuits and electrodes / lines disposed in the inactive area I / A may be formed of the gate metal 104' and / or the source / drain metal 108'. At this time, the gate metal 104' and the gate electrode of the TFT are formed using the same or substantially the same material in the same process, and the source metal / drain metal 108' and the source electrode / drain electrode of the TFT are formed using the same or substantially the same material in the same process.

[0074] For example, the source metal / drain metal may be used as a power supply (e.g., a low-level power supply (VSS), a high-level power supply (VDD), etc.) line 108'. At this time, the power supply line 108' is connected to the metal layer 112', and the cathode 116 of the organic light emitting element is provided with power through the connection with the source metal / drain metal 108' and the metal layer 112'. The metal layer 112' may be in contact with the power supply line 108' and extend along the sidewall of the outermost portion of the planarization layer 109, thereby contacting the cathode 106 on the planarization layer 109. The metal layer 112' and the anode 112 of the organic light emitting element may be formed using the same or substantially the same material in the same process.

[0075] The inventors have found that Figure 3 Weak points in the outermost structure of the organic light emitting display device shown in FIG. One of the weak points is moisture penetration shown in FIG.

[0076] The power line 108' is designed to be as wide as possible so as to reduce resistance and stably provide power. Therefore, the end of the power line 108' overlaps the blocking structure 190-3 disposed at the outermost position by a predetermined degree. Since the adhesion between the power line 108' and the protective layer 107 disposed thereon is not very high, when the end of the insulating layer 158 disposed outside the blocking structure 190-3 shrinks, the inorganic layers 121-1 and 121-2 disposed thereunder are lifted. Thus, a gap is generated between the power line 108' and the protective layer 107 disposed thereon. In addition, due to the process variation and shadow of the inorganic layers 121-1 and 121-2 of the encapsulation layer, the inorganic layers 121-1 and 121-2 will not completely cover the power line 108'.

[0077] When moisture penetrates into the gaps and / or incompletely covered portions due to these reasons, corrosion of the power supply line 108' occurs. As a result, the line metal may be eluted or deformed, and interlayer delamination may also spread, thereby causing poor driving of the display device.

[0078] The inventors of the present invention recognized the above-mentioned weaknesses and dangers and invented a structure to prevent moisture penetration and corrosion of the wires in the outermost portion.

[0079] Figure 4 is a cross-sectional view illustrating an external structure of an organic light emitting display device according to another exemplary embodiment of the present invention. Figure 5 yes Figure 4 An enlarged view of portion X.

[0080] exist Figure 4 Among the components in Figures 1 to 3 The organic light-emitting display device according to the exemplary embodiment may include a structure in which the line width is adjusted so that the wire 408' of the non-active area is not arranged at the outer edge, and the increase in resistance caused by the wire is suppressed. The structure of the wire is provided by forming such a shape in which the wire 408' has a uneveness in the vertical direction. As an example, the wire 408' in the outer part is only set to the inner side of the blocking structure located at the outermost position, so that while having a uneveness by using the groove (depressed area) from which the lower inorganic layer is removed, its surface area remains the same or similar to that before.

[0081] The organic light emitting display device according to the present exemplary embodiment includes: a substrate 401, the substrate 401 having an active area A / A and an inactive area I / A at least partially surrounding the active area A / A. The organic light emitting display device includes an organic light emitting element in the active area A / A. The organic light emitting display device further includes a wire 408' disposed in the inactive area I / A, the wire 408' is disposed to have a vertical concave-convex shape, and is used to transmit power to the organic light emitting element. Figure 4 and Figure 5 As shown, the wire 408' has a concave-convex shape along the vertical direction. In some embodiments, at least some portions of the wire 408' are not deposited on the same layer. That is, some portions of the wire 408' may not be coplanar with each other. In other embodiments, at least some portions of the wire 408' may extend through other layers other than the layer on which the wire 408' is deposited and contact it. For example, some portions of the wire 408' may extend to contact the substrate 401.

[0082] The wire 408' may be a power line that transmits a low-level power supply (VSS) to the organic light-emitting element. The wire 408' may be formed of a material that is the same or substantially the same as a source electrode or a drain electrode of a thin film transistor (e.g., Ti / Al / Ti). The wire 408' may at least partially cover an area including at least one groove in which the inorganic layer is dug out. Alternatively, the wire 408' may at least partially fill at least one groove in the inorganic layer. That is, at least one groove may be provided by etching or the like, and then the wire 408' may be deposited on the groove and the flat portion around the groove, thereby obtaining a concave-convex shape of the wire 408'. The inorganic layer may include at least one of a buffer layer 403, a gate insulating layer 405, an interlayer insulating layer 406, and a protective layer 407. Reference Figure 5 , it can be seen that when the groove is prepared, only a portion of the buffer layer 403 is removed. For example, the buffer layer 403 includes a multiple buffer portion 403-1 and an active buffer portion 403-2, and the active buffer portion 403-2 is removed from the groove without removing the multiple buffer portion 403-1 from the groove, which can be used as a way to adjust the depth of the groove. When a deeper groove is required, even the multiple buffer portion 403-1 can be removed. The depth, arrangement interval, width, etc. of the groove can vary according to the surface area of ​​the wire.

[0083] The organic light emitting display device may further include: an organic light emitting element on the planarization layer 409; and an encapsulation layer 420 covering the organic light emitting element. In this case, the encapsulation layer 420 may include: a first inorganic layer 421-1 on the organic light emitting element; an organic layer 422 on the first inorganic layer 421-1; and a second inorganic layer 421-2 on the organic layer 422.

[0084] The organic light emitting display device may further include a bank 410 on the planarization layer 409. The bank 410 divides the boundary between (sub) pixels. That is, the area where the bank 410 is opened is a light emitting unit as a light emitting area. The bank 410 can also be used to form a blocking structure.

[0085] The organic light-emitting display device may further include blocking structures 490-1, 490-2, and 490-3 in the non-active area I / A for blocking the flow of the organic layer 422 of the encapsulation layer 420. A plurality of blocking structures may be provided. For example, the blocking structures 490-1, 490-2, and 490-3 may include: a first blocking structure 490-1 closest to the active area; a second blocking structure 490-2 further away from the active area than the first blocking structure 490-1; and a third blocking structure 490-3 further away from the active area than the second blocking structure 490-2, that is, closer to the end of the substrate 401. In this case, the first blocking structure 490-1 may have a relatively low height, and the second blocking structure 490-2 may have a relatively high height. The first blocking structure 490-1 may be formed of the same or substantially the same material as the embankment 410 and the spacer 411 of the active area, or include the above-mentioned materials. The second barrier structure 490-2 may be formed by sequentially stacking the same material as the planarization layer 409 of the active region, the bank 410, and the spacer 411. That is, the first barrier structure 490-1 may be stacked in two stages, and the second barrier structure 490-2 may be stacked in three stages. The third barrier structure 490-3 may be formed of the same or substantially the same material as the planarization layer 409 of the active region, or include the above-mentioned material.

[0086] The conductive line 408' does not vertically overlap with the blocking structure disposed at the outermost position among the blocking structures. Figure 4 When three blocking structures are provided as shown in FIG. 4 , the wire 408 ′ does not overlap with the third blocking structure 490 - 3 . This is because, as mentioned above with reference to Figure 3 As described above, moisture penetration due to cracking or delamination may occur in the area where the conductive line and the outermost barrier structure overlap each other.

[0087] At the same time, a metal layer 412' may be provided to transmit power provided through the wire 408' to the organic light emitting element. The metal layer 412' connects the wire 408' and the cathode electrode 416 of the organic light emitting element. At this time, the metal layer 412' may extend along the side surface (side wall) of the planarization layer 409. The metal layer 412' may be formed of the same material as the anode electrode of the organic light emitting element. The metal layer 412' may be provided with an outlet hole for discharging gas generated in the planarization layer below the metal layer 412'.

[0088] When the conductive line structure of the outer portion is provided as described above, damage to the conductive line due to moisture penetration or cracking can be suppressed. In addition, such a conductive line structure can improve reliability by reducing driving failures of the display device.

[0089] Although the exemplary embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited thereto, and the present invention can be implemented in many different forms without departing from the technical concept of the present invention. Therefore, the exemplary embodiments of the present invention are provided only for the purpose of illustration and are not intended to limit the technical concept of the present invention. The scope of the technical concept of the present invention is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are merely illustrative in all aspects and do not limit the present invention. The scope of protection of the present invention should be interpreted based on the attached claims, and all technical concepts within the equivalent scope thereof should be interpreted as falling within the scope of the present invention.

Claims

1. An organic light emitting display device, comprising: a substrate comprising an active region and an inactive region at least partially surrounding the active region; an organic light emitting element in the active region; A conductive line in the inactive region, the conductive line being arranged to have a vertical concave-convex shape and used to transmit power to the organic light emitting element; at least two blocking structures in the inactive area, wherein the conductive line at least partially covers an area including at least one recess; as well as At least one inorganic layer is on the at least one recess. 2 . The organic light emitting display device according to claim 1 , wherein the inorganic layer is dug out in the groove. 3 . The organic light emitting display device according to claim 2 , wherein the inorganic layer comprises at least one of a gate insulating layer and an interlayer insulating layer. 4 . The organic light emitting display device according to claim 1 , wherein the at least one inorganic layer comprises a protection layer on the conductive line.

5. The organic light emitting display device according to claim 1, further comprising: an encapsulation layer at least partially covering the organic light emitting element, The encapsulation layer includes: a first inorganic layer on the organic light-emitting element; an organic layer on the first inorganic layer; and a second inorganic layer on the organic layer. 6 . The organic light emitting display device according to claim 5 , wherein the blocking structure is used to block the flow of the organic layer of the encapsulation layer. 7 . The organic light emitting display device according to claim 6 , wherein the conductive line does not vertically overlap with a barrier structure disposed at an outermost position among the barrier structures.

8. The organic light emitting display device according to claim 6, wherein the blocking structure comprises: a first blocking structure; a second blocking structure further away from the active area than the first blocking structure; and a third blocking structure further away from the active region than the second blocking structure, The conductive line does not vertically overlap the third barrier structure. 9 . The organic light emitting display device of claim 8 , wherein the first blocking structure is formed of the same material as the bank and the spacer of the active region. 10 . The organic light emitting display device of claim 8 , wherein the second blocking structure is formed by sequentially stacking the same material as a planarization layer, a bank, and a spacer of the active area. 11 . The organic light emitting display device of claim 8 , wherein the third blocking structure is formed of the same material as a planarization layer of the active area. 12 . The organic light emitting display device of claim 8 , wherein the first barrier structure comprises a same material as the bank and the spacer of the active region. 13 . The organic light emitting display device of claim 8 , wherein the second blocking structure comprises the same material as the planarization layer, the bank, and the spacer of the active region. 14 . The organic light emitting display device of claim 8 , wherein the third blocking structure comprises a same material as a planarization layer of the active region. 15 . The organic light emitting display device according to claim 1 , wherein the conductive line at least partially fills at least one trench in the inorganic layer.

16. The organic light emitting display device according to claim 5, further comprising: touch sensing lines and touch driving lines on the encapsulation layer; and a touch insulating layer covering the touch sensing line and the touch driving line. 17 . The organic light emitting display device according to claim 16 , wherein the touch insulation layer is disposed on the blocking structure. 18 . The organic light emitting display device according to claim 17 , wherein an end portion of the touch insulating layer is disposed outwardly to an outermost end portion of a blocking structure disposed at an outermost position among the blocking structures.

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