Heat dissipation structure and display device

Abstract

The invention provides a heat dissipation structure and a display device, belongs to the technical field of display, and can solve the problem of uneven heat dissipation in the prior art. The heat dissipation structure disclosed by the invention comprises a heat dissipation plate and a plurality of heat dissipation fins arranged on the heat dissipation plate, and in the direction from the first center of the radiating plate to the edge, the maximum height of each radiating fin is gradually reduced, so that the radiating surfaces of the radiating fins are gradually reduced.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a heat dissipation structure and a display device. Background Art

[0002] At present, Micro-OLED (Micro-Organic Light-Emitting Diode) used in the field of micro-display is a miniaturized display technology with advantages such as high resolution, low power consumption, high brightness, and high contrast, so it has broad application prospects in the field of high-end display devices. However, due to its high brightness and relatively low luminous efficiency, heat accumulation is more serious, which seriously affects the life performance of the light-emitting device. Summary of the invention

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provide a heat dissipation structure and a display device.

[0004] In a first aspect, the technical solution adopted to solve the technical problem of the present disclosure is a heat dissipation structure, which includes a heat dissipation plate and a plurality of heat dissipation fins arranged on the heat dissipation plate;

[0005] In a direction from the first center of the heat sink plate to the edge, the maximum height of each heat sink gradually decreases, so that the heat dissipation surface of the heat sink gradually decreases.

[0006] In some embodiments, a plurality of the heat sinks are arranged side by side along a first direction, and the heat sinks extend along a second direction, and the first direction is perpendicular to the second direction;

[0007] Second centers of the orthographic projections of the heat sinks on the heat sink plate are connected to form a straight line extending along the first direction.

[0008] In some embodiments, for any of the heat sinks, the height of the heat sink gradually decreases from the second center to two sides oppositely disposed along the second direction.

[0009] In some embodiments, the heat sink includes a first surface away from the heat sink and a second surface in contact with the heat sink, the first surface includes a first sub-surface, a second sub-surface, and a third sub-surface connecting the first sub-surface and the second sub-surface;

[0010] In each of the heat sinks, the first dihedral angles formed between the first sub-surface and the second surface are all equal; in each of the heat sinks, the second dihedral angles formed between the second sub-surface and the second surface are all equal.

[0011] In some embodiments, for any of the heat sinks, the heights of the heat sinks from the second center to two sides oppositely disposed along the second direction are all equal.

[0012] In some embodiments, the lengths of the heat sinks in the second direction are equal.

[0013] In some embodiments, the plurality of heat sinks are divided into a plurality of rows of heat sinks and a plurality of columns of heat sinks;

[0014] The heat sink row includes a plurality of first heat sinks arranged side by side in a first direction; the heat sink column includes a plurality of second heat sinks arranged side by side in a second direction;

[0015] For any row of the heat sinks, in the first direction and away from the third center of the heat sink row, the maximum height of each of the first heat sinks gradually decreases;

[0016] For any column of the heat sink fins, along the second direction and away from the fourth center of the column of heat sink fins, the maximum height of each of the second heat sink fins gradually decreases.

[0017] In some embodiments, the plurality of heat sinks include a third heat sink located at the first center and a fourth heat sink remaining except the third heat sink;

[0018] The plurality of fourth heat sinks are divided into a plurality of heat sink groups; for any of the heat sink groups, the plurality of fourth heat sinks are distributed in a ring shape, and the center lines of the fourth heat sinks form a virtual closed loop; the virtual rectangular frames of the plurality of heat sink groups are set to nest the third heat sinks in sequence;

[0019] For any two adjacent heat sink groups, the maximum height of the fourth heat sink in the heat sink group close to the first center is greater than the maximum height of the fourth heat sink in the other heat sink group;

[0020] The maximum height of the third heat sink is greater than the maximum height of the fourth heat sink.

[0021] In some embodiments, for any one of the heat sink groups, the maximum heights of the fourth heat sinks are the same.

[0022] In some embodiments, the virtual closed loop is any one of a circle, an ellipse, and a rectangle.

[0023] In some embodiments, the outline shape of the orthographic projection of the heat sink on the heat sink plate is any one of a rectangular, polygonal, circular or elliptical shape.

[0024] In a second aspect, an embodiment of the present disclosure further provides a display device, including a driving backplane, a plurality of light-emitting devices, and a heat dissipation structure as described in any one of the first aspects;

[0025] The driving backplane includes a substrate and a driving circuit arranged on a side of the substrate close to the light-emitting device; the heat dissipation structure is arranged on a side of the substrate away from the driving circuit;

[0026] The heat sink is arranged on a side of the heat sink away from the substrate.

[0027] In some embodiments, the base substrate is a silicon substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of non-uniform heat source distribution;

[0029] Figure 2 is a schematic diagram of an existing heat dissipation structure;

[0030] Figure 3a A three-dimensional schematic diagram of a heat dissipation structure in Example 1 provided in an embodiment of the present disclosure;

[0031] Figure 3b for Figure 3a A top view of the structure;

[0032] Figure 3c for Figure 3a Side view of the structure;

[0033] Figure 4a A three-dimensional schematic diagram of a heat dissipation structure in Example 2 provided in an embodiment of the present disclosure;

[0034] Figure 4b for Figure 4a A top view of the structure;

[0035] Figure 4c for Figure 4a Side view of the structure;

[0036] Figure 5a A three-dimensional schematic diagram of a heat dissipation structure in Example 3 provided in an embodiment of the present disclosure;

[0037] Figure 5b for Figure 5a A top view of the structure;

[0038] Figure 5c for Figure 5a Side view of the structure;

[0039] Figure 6a A three-dimensional schematic diagram of a heat dissipation structure in Example 4 provided in an embodiment of the present disclosure;

[0040] Figure 6b for Figure 6a A top view of the structure;

[0041] Figure 6c for Figure 6a Side view of the structure;

[0042] Figure 7a A three-dimensional schematic diagram of a heat dissipation structure in Example 5 provided in an embodiment of the present disclosure;

[0043] Figure 7b for Figure 7a A top view of the structure;

[0044] Figure 7c for Figure 7a Side view of the structure;

[0045] Figure 8 A schematic diagram of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the embodiments of the present disclosure clearer, the technical scheme in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the present disclosure for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present disclosure.

[0047] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0048] The "multiple or several" mentioned in this disclosure refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0049] It should be noted that, in the present disclosure, the first direction X, the second direction Y and the third direction Z intersect each other in pairs. In the present disclosure, the first direction X and the second direction Y are perpendicular to each other in the plane where the heat sink is located, the first direction X is a horizontal direction, the second direction Y is a vertical direction, and the third direction Z is a vertical direction, which is perpendicular to the plane where the heat sink is located, is used as an example for explanation, but does not constitute a limitation to the present disclosure.

[0050] In the related art, the heating phenomenon of the organic light-emitting diode (OLED) display module during operation affects the life of the device, which is summarized into the following three reasons: First, the driving backplane used in the OLED display module includes at least one driving chip (IC). The driving chip (IC) is the main heat source in the OLED display module. The heat generated by the driving chip during operation diffuses outward in a decreasing temperature gradient with itself as the center, such as Figure 1 Second, in order to reduce the integration of the driver backplane and facilitate manufacturing, the OLED display module uses the COCBonding process, which will bind other ICs to the driver backplane, and other ICs will also generate heat when working. Third, OLED devices emit light during operation, which will also generate a certain proportion of heat.

[0051] Due to the above three reasons, there are multiple uneven heat sources in the OLED display module, which will inevitably lead to uneven temperature distribution on the OLED display module. The higher the temperature, the greater the impact on the OLED device, which is mainly manifested in abnormal display effects and low device life. For example, the device life in the high temperature area is worse than that in other areas, and the "burn-in" phenomenon (local brightness reduction) will appear faster, which will affect the display quality of the module.

[0052] Existing heat dissipation structures all use heat sinks 01 with consistent specifications, such as Figure 2 As shown, the heat dissipation areas corresponding to different temperature zones of the display module are the same. It is difficult to achieve uniform heat dissipation using this type of heat sink.

[0053] In view of this, the embodiments of the present disclosure provide a heat dissipation structure and a display device, which essentially adjust the heat dissipation area of ​​the heat sink to adapt the heat dissipation strength of each temperature zone, thereby achieving temperature balance in each temperature zone and avoiding the influence of uneven temperature on the display effect; at the same time, the heat dissipation structure dissipates heat for the display device, which is beneficial to improve the life of the light-emitting device.

[0054] For ease of understanding, first, the present disclosure describes a heat dissipation structure. The heat dissipation structure provided in the embodiment of the present disclosure is a heat dissipation structure applied to a display device, and is used to dissipate heat for a driving circuit and a light emitting device in the display device as a whole.

[0055] Figure 3a This is a three-dimensional schematic diagram of the heat dissipation structure in Example 1 provided in an embodiment of the present disclosure, Figure 3b for Figure 3a Top view of the structure, Figure 3c for Figure 3a Side view of the structure; Figure 4a This is a three-dimensional schematic diagram of the heat dissipation structure in Example 2 provided in an embodiment of the present disclosure. Figure 4b for Figure 4a Top view of the structure, Figure 4c for Figure 4a Side view of the structure; Figure 5a This is a three-dimensional schematic diagram of the heat dissipation structure in Example 3 provided in an embodiment of the present disclosure, Figure 5b for Figure 5a Top view of the structure, Figure 5c for Figure 5a Side view of the structure; Figure 6a This is a three-dimensional schematic diagram of the heat dissipation structure in Example 4 provided in an embodiment of the present disclosure, Figure 6b for Figure 6a Top view of the structure, Figure 6c for Figure 6a Side view of the structure; Figure 7a This is a three-dimensional schematic diagram of the heat dissipation structure in Example 5 provided in an embodiment of the present disclosure, Figure 7b for Figure 7a Top view of the structure, Figure 7c for Figure 7a Side view of the structure.

[0056] like Figure 3a to Figure 3c , Figure 4a to Figure 4c , Figure 5a to Figure 5c , Figure 6a to Figure 6c or Figure 7a to Figure 7c The heat dissipation structure 10 includes a heat dissipation plate 1 and a plurality of heat dissipation fins 2 arranged on the heat dissipation plate 1; in a direction from a first center O1 of the heat dissipation plate 1 to an edge, a maximum height of each heat dissipation fin 2 gradually decreases, so that the heat dissipation surface of the heat dissipation fin 2 gradually decreases.

[0057] The edge of the heat sink 1 refers to the outer contour of the heat sink 1. Taking the contour shape of the orthographic projection of the heat sink 1 on the XOY reference plane as a rectangle as an example, the edge of the heat sink 1 includes a first side AB, a second side BC, a third side CD and a fourth side DA. Figure 3b , Figure 4b , Figure 5b , Figure 6b and Figure 7b As shown, the first center O1 points to the direction of the edge, for example, O 1 A direction, O 1 B direction, O 1 C direction, O 1 D direction, O 1 E direction, O 1 F direction, O 1 G direction and O 1 H direction.

[0058] It should be noted that, in the present disclosure, “the height of the heat sink 2 ” refers to the dimension of the heat sink 2 in the third direction Z, and the third direction Z is the thickness direction of the heat sink 1 .

[0059] Optionally, the heat sinks 2 are arranged parallel to each other, and there is a certain distance between adjacent heat sinks 2 .

[0060] Optionally, while ensuring that other dimensions of the heat sink 2 remain unchanged, the maximum height of each heat sink 2 gradually decreases in the direction from the first center O1 of the heat sink 1 to the edge, which means that the heat dissipation surface of the heat sink 2 gradually decreases.

[0061] Optionally, while ensuring that the width of the heat sink 2 remains unchanged, the length of each heat sink 2 gradually decreases in the direction from the first center O1 of the heat sink 1 to the edge, and the maximum height of each heat sink 2 gradually decreases, which means that the heat dissipation surface of the heat sink 2 gradually decreases.

[0062] The heat dissipation surface of the heat sink 2 refers to the side surface of the heat sink 2, which is mainly a surface parallel to the YOZ reference plane, and of course can also include a surface parallel to the XOZ reference plane and a surface parallel to the XOY reference plane.

[0063] It should be noted that in the present disclosure, "the width of the heat sink 2" refers to the size of the heat sink 2 in the first direction X; "the length of the heat sink 2" refers to the size of the heat sink 2 in the second direction Y. It should be noted that in the present disclosure, the width of the heat sink 2 at each position is the same. The height of the heat sink 2 at different positions may be the same or different. The length of the heat sink 2 at different positions may be the same or different.

[0064] In the subsequent display device manufacturing process, the first center O1 of the heat dissipation structure 10 is aligned with the location of the heat source in the display device; during the operation of the display device, the heat sink 2 structure with a gradually decreasing heat dissipation surface is used to dissipate the gradient-decreasing distributed temperature generated by the heat source, thereby achieving overall temperature balance and avoiding the influence of uneven temperature on the display effect. At the same time, the heat dissipation structure 10 is used to quickly cool the heat generated by the heat source, thereby improving the life of the light-emitting device 30 in the high-temperature area.

[0065] In some embodiments, Figure 3b or Figure 4b As shown, a plurality of heat sinks 2 are arranged side by side along a first direction X, and the heat sinks 2 extend along a second direction Y, and the first direction X and the second direction Y are perpendicular; the second centers O2 of the orthographic projections of the heat sinks 2 on the heat sink 1 are connected to form a straight line FH extending along the first direction X. Among the plurality of heat sinks 2, the heat sink 2 located at the first center O1 is the central heat sink 2a, and there is only one of them, and the second center O2 of the central heat sink 2a coincides with the first center O1 of the heat sink 1.

[0066] like Figure 3a and Figure 3c ,or Figure 4a and Figure 4c As shown, in O 1 In the H direction, the maximum height of each heat sink 2 gradually decreases. 1 In the F direction, the maximum height of each heat sink 2 gradually decreases.

[0067] Alternatively, if Figure 3a and Figure 3b As shown, a row of heat sinks 2 are arranged on the heat sink 1, and the second centers O2 of each heat sink 2 are located on the same straight line FH, and the extension direction of the straight line FH is the first direction X. The straight line FH passes through the first center O1 of the heat sink 1. For any heat sink 2, the height of the heat sink 2 gradually decreases from the second center O2 to the two sides relatively arranged along the second direction Y. Among them, the two sides relatively arranged along the second direction Y include a first side 31 and a second side 32. In the same heat sink 2, the height of the heat sink 2 corresponding to the position of the second center O2 is the maximum height of the heat sink 2, and the height of the heat sink 2 corresponding to the position of the first side 31 and the second side 32 is the minimum height of the heat sink 2.

[0068] Alternatively, if Figure 3a and Figure 3b As shown, in O 1 In the H direction, the length of each heat sink 2 gradually decreases. 1 In the F direction, the length of each heat sink 2 gradually decreases.

[0069] Alternatively, if Figure 3a and Figure 3b As shown, the length of the central heat sink 2a is the maximum length of the heat sink 1 in the second direction Y.

[0070] Alternatively, if Figure 3a and Figure 3b As shown, the heat sink 2 includes a first surface S1 away from the heat sink 1 and a second surface in contact with the heat sink 1 (not shown in the figure, which can be considered as an XOY reference surface), the first surface S1 includes a first sub-surface S11, a second sub-surface S12, and a third sub-surface S13 connecting the first sub-surface S11 and the second sub-surface S12; in each heat sink 2, the first dihedral angle α1 formed between the first sub-surface S11 and the second surface is equal; in each heat sink 2, the second dihedral angle α2 formed between the second sub-surface S12 and the second surface is equal. Exemplarily, the first sub-surface S11 and the second sub-surface S12 are both flat planes, and the third sub-surface S13 is a curved surface. As another example, the first sub-surface S11, the second sub-surface S12 and the third sub-surface S13 are all arc surfaces, the first dihedral angle α1 is the dihedral angle formed between the tangent plane at the center position of the first sub-surface S11 and the second surface; the second dihedral angle α2 is the dihedral angle formed between the tangent plane at the center position of the second sub-surface S12 and the second surface.

[0071] Optionally, the first dihedral angle α1 and the second dihedral angle α2 are equal.

[0072] For Example 1, in O 1 In the H direction, the maximum height of each heat sink 2 gradually decreases. 1 In the direction F, the maximum height of each heat sink 2 gradually decreases; and for any heat sink 2, the height of the heat sink 2 gradually decreases from the second center O2 to the two sides relatively arranged along the second direction Y; on this basis, the first dihedral angle α1 and the second dihedral angle α2 in each heat sink 2 are equal, which means that in the direction from the first center O1 of the heat sink 1 to the edge, the heat dissipation surface of each heat sink 2 gradually decreases, so that the heat dissipation capacity of the heat dissipation structure 10 shows a decreasing trend in the direction from the first center O1 to the edge, which is conducive to achieving overall balance of the gradient decreasing distribution temperature of the heat source.

[0073] Alternatively, if Figure 4a and Figure 4b As shown, a row of heat sinks 2 are arranged on the heat sink 1, and the second centers O2 of each heat sink 2 are located on the same straight line FH, and the extension direction of the straight line FH is the first direction X. The straight line FH passes through the first center O1 of the heat sink 1. For any heat sink 2, the heights of the heat sinks 2 are equal from the second center O2 to the two sides oppositely arranged along the second direction Y. In other words, for any heat sink 2, the heights of any positions of the heat sink 2 are equal. In other words, the vertical distances from any point on the first surface S1 to the second surface are equal.

[0074] Alternatively, if Figure 4a and Figure 4b As shown, the lengths of the heat sinks 2 are all equal.

[0075] Alternatively, if Figure 4a and Figure 4b As shown in c, the length of each heat sink 2 is the maximum length of the heat sink 1 in the second direction Y.

[0076] For Example 2, when the length and width of each heat sink 2 remain unchanged, by adjusting the height of each heat sink 2, such as in 1 In the H direction, the maximum height of each heat sink 2 gradually decreases. 1 In the F direction, the maximum height of each heat sink 2 gradually decreases, which means that in the direction from the first center O1 of the heat sink 1 to the edge, the heat dissipation surface of each heat sink 2 gradually decreases, so that the heat dissipation structure 10 has a decreasing heat dissipation capacity in the direction from the first center O1 to the edge, which is conducive to achieving overall balance of the gradient decreasing distribution temperature of the heat source.

[0077] Alternatively, if Figure 3a to Figure 3c ,or Figure 4a to Figure 4c As shown, the two groups of heat sinks 2 located on both sides of the extension direction (second direction Y) of the central heat sink 2a are axially symmetrically arranged with the central heat sink 2a as the symmetry axis, that is, bilaterally symmetrical.

[0078] Alternatively, if Figure 3a to Figure 3c ,or Figure 4a to Figure 4c As shown, the heat sinks 2 are symmetrically arranged with a straight line as the axis of symmetry, that is, aligned up and down.

[0079] Alternatively, if Figure 3a to Figure 3c ,or Figure 4a to Figure 4c As shown, the distances between two adjacent heat sinks 2 are equal.

[0080] In addition to the case where a row of heat sinks 2 is provided in the above-mentioned Examples 1 and 2, multiple heat sinks 2 may be arranged in an array as in Examples 3 to 5, such as the rectangular array arrangement in Examples 3 and 4, and the circular array arrangement in Example 5.

[0081] In some embodiments, Figures 5a to 5c As shown, the plurality of heat sinks 2 are divided into a plurality of rows of heat sink rows 41 and a plurality of columns of heat sink columns 42; the heat sink rows 41 include a plurality of first heat sinks 21 arranged side by side along a first direction X; the heat sink columns 42 include a plurality of second heat sinks 22 arranged side by side along a second direction Y. The first heat sinks 21 in any two adjacent rows of heat sink rows 41 are arranged opposite to each other; the second heat sinks 22 in any two adjacent columns of heat sink columns 42 are arranged opposite to each other.

[0082] For any row of heat sinks 41, the maximum height of each first heat sink 21 gradually decreases in the first direction X and away from the third center O3 of the heat sink row 41. Optionally, the first heat sink 21 located at the third center O3 in the heat sink row 41 is a first central heat sink 2b, and the height of the first central heat sink 2b is greater than the heights of other first heat sinks 21 in the heat sink row 41, that is, the closer the first heat sink 21 is to the first central heat sink 2b, the higher its height; conversely, the farther the first heat sink 21 is from the first central heat sink 2b, the lower its height. Optionally, the dimensions of each first heat sink 21 in the first direction X are the same, and the dimensions in the second direction Y are the same. For example, when the first heat sink 21 is a rectangular heat sink 2, the dimension of the first heat sink 21 in the first direction X is the width of the first heat sink 21, and the dimension in the second direction Y is the length of the first heat sink 21; when the first heat sink 21 is a cylindrical heat sink 2, the dimension of the first heat sink 21 in the first direction X or the second direction Y is the cylinder diameter, and the cylinder diameters of each first heat sink 21 are the same. Optionally, the first heat sink 21 is a rectangular heat sink 2 or a cylindrical heat sink 2, that is, the heights of each position on the first heat sink 21 are consistent.

[0083] For any column of heat sinks 42, in the second direction Y and away from the fourth center O4 of the heat sink column 42, the maximum height of each second heat sink 22 gradually decreases. Optionally, the orthographic projection of the second heat sink 22 in the heat sink column 42 on the heat sink 1 does not overlap with the fourth center O4, and the second heat sink 22 is located on both sides of the fourth center O4. Exemplarily, the two second heat sinks 22 closest to the fourth center O4 in the heat sink column 42 are the second center heat sink 2c, and the height of the second center heat sink 2c is greater than the height of the other second heat sinks 22 in the heat sink column 42, that is, the closer the second heat sink 22 is to the second center heat sink 2c, the higher the height; conversely, the farther the second heat sink 22 is from the second center heat sink 2c, the lower the height. Optionally, the dimensions of each second heat sink 22 in the first direction X are the same, and the dimensions in the second direction Y are the same. For example, when the second heat sink 22 is a rectangular heat sink 2, the dimension of the second heat sink 22 in the first direction X is the width of the first heat sink 21, and the dimension in the second direction Y is the length of the second heat sink 22; when the second heat sink 22 is a cylindrical heat sink 2, the dimension of the second heat sink 22 in the first direction X or the second direction Y is the cylinder diameter, and the cylinder diameters of each second heat sink 22 are the same. Optionally, the second heat sink 22 is a rectangular heat sink 2 or a cylindrical heat sink 2, that is, the height of each position on the second heat sink 22 is consistent.

[0084] It should be noted that Example 3 uses the heat sink 2 as a rectangular heat sink 2 as an example, but is not limited to a rectangular heat sink 2. For example, it can also be a cylindrical heat sink 2, an elliptical heat sink 2, a hexagonal heat sink 2, etc.

[0085] The height of the first heat sink 21 (or the second heat sink 22 ) closest to the first center O1 is greater than the heights of all other first heat sinks 21 (or the second heat sink 22 ).

[0086] Alternatively, if Figure 5a to 5c As shown, for any heat sink row 41, a plurality of first heat sinks 21 are arranged axially symmetrically with the line EG connecting the third center O3 and the first center O1 as the axis of symmetry. For any heat sink column 42, a plurality of second heat sinks 22 are arranged axially symmetrically with the line FH connecting the fourth center O4 of the first center heat sink 2b and the first center O1 as the axis of symmetry.

[0087] For Example 3, when other dimensions of each heat sink 2 (including the first heat sink 21 and the second heat sink 22) remain unchanged, by adjusting the height of each heat sink 2, such as the central heat sink 2a having the highest height, the height of the heat sink 2 gradually decreases in the direction from the first center O1 of the heat sink 1 to the edge (for example, in various directions radially with the first center O1 as the center), so that the heat dissipation surface of the heat sink 2 gradually decreases, thereby making the heat dissipation capacity of the heat dissipation structure 10 show a decreasing trend, which is beneficial to achieve overall balance of the gradient decreasing distribution temperature of the heat source.

[0088] In some embodiments, Figure 6a to Figure 6c or Figures 7a to 7c As shown, the plurality of heat sinks 2 include a third heat sink 23 located at the first center O1 and the remaining fourth heat sink 24 except the third heat sink 23. The plurality of fourth heat sinks 24 are divided into a plurality of heat sink groups 5; for any heat sink group 5, the plurality of fourth heat sinks 24 are distributed in a ring shape, and the center connecting line of each fourth heat sink 24 forms a virtual closed loop; the virtual closed loop of the plurality of heat sink groups 5 is set to nest the third heat sink 23 in sequence. Exemplarily, the plurality of fourth heat sinks 24 are divided into three groups of heat sink groups 5, which are sequentially recorded as the first group of heat sink groups 5, the second group of heat sink groups 5 and the third group of heat sink groups 5 from the first center O1 to the edge direction, and the third group of heat sink groups 5 nest the second group of heat sink groups 5, the second group of heat sink groups 5 nest the first group of heat sink groups 5, and the first group of heat sink groups 5 surround the third heat sink 23.

[0089] For Example 4, the heat sinks 2 are arranged in a rectangular array. Figure 6a to Figure 6cAs shown, the virtual closed loop is a rectangle, that is, for any heat sink group 5, multiple fourth heat sinks 24 are distributed in a ring shape, and the center lines of each fourth heat sink 24 form a virtual rectangular frame; the virtual rectangular frames of multiple heat sink groups 5 are set to nest the third heat sinks 23 in sequence.

[0090] For Example 5, the heat sinks 2 are arranged in a circular array. Figure 7a to Figure 7c As shown, the virtual closed loop is a circle, that is, for any heat sink group 5, multiple fourth heat sinks 24 are distributed in a ring shape, and the center lines of each fourth heat sink 24 form a virtual circular frame; the virtual circular frames of multiple heat sink groups 5 are set to nest the third heat sinks 23 in sequence.

[0091] The third heat sink 23 is the central heat sink among the plurality of heat sinks 2; the maximum height of the third heat sink 23 is greater than the maximum height of the fourth heat sink 24, that is, the third heat sink 23 has the highest height. The heights of the fourth heat sinks 24 in each heat sink group 5 in which the third heat sink 23 is nested sequentially decrease. For any two adjacent heat sink groups 5, the maximum height of the fourth heat sink 24 in the heat sink group 5 close to the first center O1 is greater than the maximum height of the fourth heat sink 24 in the other heat sink group 5.

[0092] Optionally, the third heat sink 23 and each fourth heat sink 24 have the same size in the first direction X; the third heat sink 23 and each fourth heat sink 24 have the same size in the second direction Y. For example, when the third heat sink 23 and each fourth heat sink 24 are rectangular heat sinks 2, the size of the third heat sink 23 and each fourth heat sink 24 in the first direction X is the width of the heat sink 2, and the size in the second direction Y is the length of the heat sink 2; when the second heat sink 22 is a cylindrical heat sink 2, the size of the third heat sink 23 and each fourth heat sink 24 in the first direction X or the second direction Y is the cylinder diameter, and the third heat sink 23 and each fourth heat sink 24 have the same cylinder diameter.

[0093] Alternatively, if Figure 6a to Figure 6c or Figures 7a to 7c As shown, for any heat sink group 5, the maximum height of each fourth heat sink 24 is the same. Exemplarily, the third heat sink 23 and each fourth heat sink 24 are rectangular heat sinks 2 or cylindrical heat sinks 2, that is, the heights of each position on the third heat sink 23 are consistent and are the maximum heights; the heights of each position on the fourth heat sink 24 are consistent and are the maximum heights. It should be noted that Example 4 and Example 5 are both described by taking the heat sink 2 as a cylindrical heat sink 2 as an example, but are not limited to rectangular heat sinks 2, for example, they can also be rectangular heat sinks 2, elliptical heat sinks 2, hexagonal heat sinks 2, etc.

[0094] Optionally, for any heat sink group 5 , the plurality of fourth heat sinks 24 are ring-shaped and evenly distributed.

[0095] For Example 4 and Example 5, when other dimensions of each heat sink 2 (including the third heat sink 23 and the fourth heat sink 24) remain unchanged, by adjusting the height of each heat sink 2, such as the central heat sink 2a having the highest height, the height of the heat sink 2 gradually decreases in the direction from the first center O1 of the heat sink 1 to the edge (for example, in various directions radially with the first center O1 as the center), so that the heat dissipation surface (cylindrical side) of the heat sink 2 gradually decreases, thereby making the heat dissipation capacity of the heat dissipation structure 10 show a decreasing trend, which is beneficial to achieve overall balance of the gradient decreasing distribution temperature of the heat source.

[0096] Optionally, the virtual closed loop may be an ellipse or the like in addition to the rectangle and circle illustrated above, and the present disclosure does not limit this.

[0097] Optionally, the contour shape of the orthographic projection of the heat sink 2 on the heat sink plate 1 is any one of a rectangle, a polygon, a circle or an ellipse.

[0098] For the above examples 1 to 5, after the position of each heat sink 2 is fixed, the heat dissipation area of ​​each heat sink 2 can be set based on the principle of convective heat transfer. First, the convective heat transfer formula is as follows: Q = H × A × (T1-T2); wherein Q represents the convective heat transfer amount (unit watt W), which refers to the amount of heat diffused outward through the heat sink 2 per unit time, and is set by the user according to the heat generated by the actual power consumption of the display device. Under the premise that the display device is fixed, the heat generated per unit time during the actual normal operation of the driver IC and the light-emitting device 30 is simulated as the Q value. H represents the convective heat transfer coefficient (unit watt per square meter per degree Celsius W / (m 2 ×℃)), which is related to the operating environment of the display device (air medium flow rate), including natural convection and forced convection. Natural convection refers to the situation where the air medium flow rate is low, and the corresponding convection heat transfer coefficient is small; forced convection refers to the situation where the air medium flow rate is high (for example, there is a fan to assist in heat dissipation), and the corresponding convection heat transfer coefficient is large. The larger the convection heat transfer coefficient, the better the heat transfer performance. A represents the effective convection heat transfer area of ​​the heat sink 2 (in square meters m 2 ), that is, the heat dissipation area of ​​the heat sink 2, which is a parameter to be determined. T1 represents the surface temperature of the drive backplane 20 (in degrees Celsius), which can be a fixed value that can be preset, and is the constant temperature that the user expects the drive backplane 20 to be at. T2 represents the cooling fluid temperature (in degrees Celsius), that is, the ambient temperature, which is fixed under test conditions, such as a room temperature of 25°C.

[0099] It can be seen from the above convective heat transfer formula that, under the condition that the convective heat transfer amount Q, the convective heat transfer coefficient H and the cooling fluid temperature T2 remain unchanged, the surface temperature T1 of the driving back plate 20 can be reduced by adjusting the effective convective heat transfer area A of the heat sink 2. Conversely, the user sets the expected constant temperature that the driving back plate 20 should be at, and the effective convective heat transfer area A of the heat sink 2 can be obtained as the surface area of ​​the heat sink 2 (including at least the side surface of the heat sink 2, and the top surface can also be added).

[0100] The present disclosure can make targeted improvements to each heat sink 2 according to the heat source distribution, fluid flow direction, and heat dissipation gradient target to form implementation plans of Examples 1 to 5.

[0101] In some embodiments, the heat sink 1 and the plurality of heat sinks 2 are integrally formed. For example, they can be integrally formed by CNC machining or die casting. Alternatively, the heat sink 1 and the plurality of heat sinks 2 can also be split structures. For example, the heat sink structure 10 can be formed by welding, bonding, or other combination methods between different components.

[0102] In some embodiments, the material of the heat dissipation structure 10 can be aluminum, aluminum alloy, copper, copper alloy or other materials with high thermal conductivity.

[0103] The above is a complete description of the heat dissipation structure 10 provided in the embodiment of the present disclosure.

[0104] In addition, the present disclosure also provides a display device. Figure 8 A schematic diagram of a display device provided in an embodiment of the present disclosure, such as Figure 8 As shown, the display device includes a driving backplane 20, a plurality of light-emitting devices 30, and a heat dissipation structure 10 provided in any one of the above embodiments or a combination thereof.

[0105] The driving backplane 20 includes a base substrate 201 and a driving circuit 202 disposed on a side of the base substrate 201 close to the light emitting device 30. The driving circuit 202 includes a driving chip IC and a pixel driving circuit and other circuit structures.

[0106] It should be noted that the light emitting device 30 involved in the embodiments of the present disclosure may include but is not limited to OLED, Micro OLED, Quantum Dot Light Emitting Diodes (QLED) or Micro Light Emitting Diodes (Micro LED), etc. Optionally, the light emitting device 30 is a Micro OLED device.

[0107] The heat dissipation structure 10 is disposed on a side of the base substrate 201 away from the driving circuit 202 ; the heat sink 2 is disposed on a side of the heat dissipation plate 1 away from the base substrate 201 .

[0108] Optionally, the orthographic projection of the heat dissipation structure 10 on the base substrate 201 covers the orthographic projection of the driving circuit 202 on the base substrate 201; the first center O1 of the heat dissipation structure 10 falls into the central area of ​​the driving chip IC. Exemplarily, when the driving circuit 202 includes multiple driving chip ICs, the display device can be provided with multiple heat dissipation structures 10, and the driving chip ICs and the heat dissipation structures 10 are provided in a one-to-one correspondence.

[0109] Optionally, the heat dissipation structure 10 may be bonded to the driving backplane 20 by means of a thermally conductive adhesive 40. Optionally, the display device further comprises a cover plate 50 disposed on a side of the light emitting device 30 away from the base substrate 201.

[0110] In some embodiments, the material of the base substrate 201 includes silicon. Optionally, the base substrate 201 is a silicon substrate.

[0111] When the display device is used in a fixed scenario, the fitting direction of the heat dissipation structure 10 and the driving back plate 20 can be adjusted according to the fluid flow direction in the use environment to adapt the second direction Y (the length extension direction of the heat sink 2) to the fluid flow direction to increase the convection heat exchange area and achieve efficient heat dissipation.

[0112] In normal operation of the display device, the temperature of the areas corresponding to the driver chip IC and the light-emitting device 30 are different. The display device provided by the embodiment of the present disclosure includes a heat dissipation structure 10, which substantially adjusts the heat dissipation area of ​​the heat sink 2 to adapt the heat dissipation strength of each temperature area, thereby achieving the purpose of reducing the temperature gradient on the surface of the driver backplane 20, thereby achieving temperature balance in each temperature area and avoiding the influence of uneven temperature on the display effect; at the same time, the heat dissipation structure 10 dissipates heat for the display device, which is conducive to improving the life of the light-emitting device 30.

[0113] For example, the display device can be any product with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a vehicle-mounted device, etc. Other essential components of the display device are well understood by those skilled in the art, and are not described in detail here, nor should they be used as limitations on the present disclosure.

[0114] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A heat dissipation structure, characterized in that: It includes a heat dissipation plate and a plurality of heat dissipation fins arranged on the heat dissipation plate; In a direction from the first center of the heat sink plate to the edge, the maximum height of each heat sink gradually decreases, so that the heat dissipation surface of the heat sink gradually decreases.

2. The heat dissipation structure according to claim 1, characterized in that: A plurality of the heat sinks are arranged side by side along a first direction, and the heat sinks extend along a second direction, and the first direction is perpendicular to the second direction; Second centers of the orthographic projections of the heat sinks on the heat sink plate are connected to form a straight line extending along the first direction.

3. The heat dissipation structure according to claim 2, characterized in that: For any of the heat sinks, the height of the heat sink gradually decreases from the second center to the two sides oppositely arranged along the second direction.

4. The heat dissipation structure according to claim 3, characterized in that: The heat sink comprises a first surface away from the heat sink and a second surface in contact with the heat sink, wherein the first surface comprises a first sub-surface, a second sub-surface, and a third sub-surface connecting the first sub-surface and the second sub-surface; In each of the heat sinks, the first dihedral angles formed between the first sub-surface and the second surface are all equal; in each of the heat sinks, the second dihedral angles formed between the second sub-surface and the second surface are all equal.

5. The heat dissipation structure according to claim 2, characterized in that: For any of the heat sinks, from the second center to two sides oppositely arranged along the second direction, the heights of the heat sinks are all equal.

6. The heat dissipation structure according to claim 5, characterized in that: The lengths of the heat sinks in the second direction are equal.

7. The heat dissipation structure according to claim 1, characterized in that: The plurality of heat sinks are divided into a plurality of rows of heat sinks and a plurality of columns of heat sinks; The heat sink row includes a plurality of first heat sinks arranged side by side in a first direction; the heat sink column includes a plurality of second heat sinks arranged side by side in a second direction; For any row of the heat sinks, in the first direction and away from the third center of the heat sink row, the maximum height of each of the first heat sinks gradually decreases; For any column of the heat sink fins, along the second direction and away from the fourth center of the column of heat sink fins, the maximum height of each of the second heat sink fins gradually decreases.

8. The heat dissipation structure according to claim 1, characterized in that: The plurality of heat sinks include a third heat sink located at the first center and a fourth heat sink remaining except the third heat sink; The plurality of fourth heat sinks are divided into a plurality of heat sink groups; for any of the heat sink groups, the plurality of fourth heat sinks are distributed in a ring shape, and the center lines of the fourth heat sinks form a virtual closed loop; the virtual rectangular frames of the plurality of heat sink groups are set to nest the third heat sinks in sequence; For any two adjacent heat sink groups, the maximum height of the fourth heat sink in the heat sink group close to the first center is greater than the maximum height of the fourth heat sink in the other heat sink group; The maximum height of the third heat sink is greater than the maximum height of the fourth heat sink.

9. The heat dissipation structure according to claim 8, characterized in that: For any of the heat sink groups, the maximum heights of the fourth heat sinks are the same.

10. The heat dissipation structure according to claim 8, characterized in that: The virtual closed loop is any one of a circle, an ellipse, and a rectangle.

11. The heat dissipation structure according to any one of claims 1 to 10, characterized in that: The outline shape of the orthographic projection of the heat sink on the heat sink plate is any one of a rectangle, a polygon, a circle or an ellipse.

12. A display device, characterized in that: It comprises a driving backplane, a plurality of light-emitting devices and a heat dissipation structure as claimed in any one of claims 1 to 11; The driving backplane comprises a substrate and a driving circuit arranged on a side of the substrate close to the light-emitting device; the heat dissipation structure is arranged on a side of the substrate away from the driving circuit; The heat sink is arranged on a side of the heat sink away from the substrate.

13. The display device according to claim 12, characterized in that: The base substrate is a silicon substrate.

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