Display panel and manufacturing method thereof, and display device

Abstract

The present application provides a display panel, a preparation method thereof, and a display device, which relate to the field of display technology. The display panel includes a display area and a non-display area surrounding the display area. The display panel in the non-display area includes a substrate, a conductive layer, and a packaging layer. A plurality of conductive layers are stacked on one side of the substrate, and the plurality of conductive layers include a plurality of signal lines; the packaging layer is located on the side of the signal line away from the substrate, and the orthographic projection of the signal line on the substrate is located within the orthographic projection of the packaging layer on the substrate. By setting the orthographic projection of the signal line on the substrate to be located within the orthographic projection of the packaging layer on the substrate, that is, the signal line is covered with the packaging layer, thereby avoiding the film layer on the side of the packaging layer away from the substrate from being broken due to the unevenness of the signal line, thereby improving the reliability of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the advancement of display technology for mobile phones and other terminals, active-matrix organic light-emitting diode (AMOLED) displays have gradually become mainstream.

[0003] However, current display panels have low reliability. Summary of the invention

[0004] In view of this, embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device to solve the problem of low reliability of display panels in the prior art.

[0005] In a first aspect, the present application provides a display panel, which includes a display area and a non-display area surrounding the display area. The display panel located in the non-display area includes a substrate, a conductive layer and a packaging layer. Multiple conductive layers are stacked on one side of the substrate, and the multiple conductive layers include multiple signal lines; the packaging layer is located on a side of the signal line away from the substrate, and the orthographic projection of the signal line on the substrate is located within the orthographic projection of the packaging layer on the substrate.

[0006] In one embodiment, the multiple signal lines include multiple first signal lines and multiple second signal lines, and the first signal lines and the second signal lines are located in different conductive layers; preferably, the first signal lines and the second signal lines are spaced apart in their orthographic projections on the substrate; preferably, the multiple conductive layers include a first metal layer and a second metal layer, and the second metal layer is located on a side of the first metal layer facing away from the substrate, the first signal lines are located in the first metal layer, and the second signal lines are located in the second metal layer; preferably, the multiple conductive layers further include a third metal layer, and the third metal layer is located on a side of the second metal layer facing away from the substrate; preferably, the third metal layer is a titanium-aluminum-titanium structure; preferably, the substrate further includes an interlayer dielectric layer, and the interlayer dielectric layer is located between the first metal layer and the second metal layer; preferably, the distance between the outer edge of the orthographic projection of the signal line on the substrate and the outer edge of the orthographic projection of the packaging layer on the substrate is greater than or equal to 60 microns.

[0007] In one embodiment, the display panel includes a first dam and a second dam, both of which are located in a non-display area, the first dam is located on a side of the second dam close to the display area, and in a direction perpendicular to the display panel, the height of the second dam is greater than the height of the first dam.

[0008] In one embodiment, a spacer is provided between the first dam and the second dam, and the second dam includes a plurality of organic layers sequentially stacked on the side of the conductive layer facing away from the substrate, and any organic layer extends to the spacer and contacts the first dam; preferably, the multi-layer organic layers of the second dam include an organic glue layer, a pixel definition layer and a support column layer sequentially stacked on the side of the conductive layer facing away from the substrate; preferably, the first dam includes a plurality of organic layers sequentially stacked on the side of the conductive layer facing away from the substrate, and the multi-layer organic layers of the first dam include a pixel definition layer and a support column layer sequentially stacked on the side of the conductive layer facing away from the substrate.

[0009] In one embodiment, in a direction perpendicular to the display panel, the thickness of any organic layer is less than the thickness of the remaining organic layers in the multi-layer organic layer; preferably, in a direction perpendicular to the display panel, the thickness of any organic layer located in the spacing area is less than the thickness of the organic layer located on the second dam.

[0010] In one embodiment, the display panel includes an organic glue layer and a pixel definition layer stacked in sequence on the side of the conductive layer facing away from the substrate, and the display panel also includes an auxiliary layer, which is located between the organic glue layer and the pixel definition layer; preferably, the orthographic projection of the auxiliary layer on the substrate is located within the orthographic projection of the first dam, the second dam and the spacer area on the substrate; preferably, the material of the auxiliary layer can be any one of an organic material, an inorganic material and a metal material; preferably, the display panel also includes an anode layer, the anode layer is located in the display area, and the auxiliary layer and the anode layer are arranged on the same layer.

[0011] In one embodiment, the display panel also includes a touch metal layer, which is located on the side of the packaging layer facing away from the substrate, and in the arrangement direction of the multiple signal lines, the outer edge of the orthographic projection of the touch metal layer on the substrate is located outside the outer edge of the orthographic projection of the packaging layer on the substrate; preferably, the packaging layer includes a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer stacked on the side of the conductive layer facing away from the substrate; preferably, the display panel also includes an inorganic layer, the inorganic layer is located between the conductive layer and the packaging layer, and at least part of the first inorganic packaging layer is in contact with the inorganic layer.

[0012] The second aspect of the present application provides a method for preparing a display panel, comprising: preparing multiple conductive layers on one side of a substrate, the multiple conductive layers comprising multiple signal lines; preparing an encapsulation layer on the side of the conductive layer facing away from the substrate, the orthographic projection of the signal line on the substrate being within the orthographic projection of the encapsulation layer on the substrate.

[0013] In one embodiment, the preparation method further includes: preparing a first dam and a second dam on one side of the substrate, a spacing area is provided between the first dam and the second dam, the second dam includes a plurality of organic layers stacked in sequence on the side of the conductive layer facing away from the substrate, any organic layer extends to the spacing area and contacts the first dam; preferably, the method further includes: preparing a touch metal layer on the side of the encapsulation layer facing away from the substrate, in the arrangement direction of the signal line, the outer edge of the positive projection of the touch metal layer on the substrate is located outside the outer edge of the positive projection of the encapsulation layer on the substrate; preferably, preparing the first dam and the second dam on one side of the substrate includes: preparing a plurality of organic layers based on a mask plate, wherein in a direction perpendicular to the display panel, the thickness of any organic layer located in the spacing area is less than the thickness of the organic layer located in the second dam; preferably, the mask plate used to prepare the organic layer in the spacing area includes a plurality of body parts spaced apart, and in a direction parallel to the display panel, the width of the body part is greater than or equal to the distance between two adjacent body parts; preferably, in a direction parallel to the display panel, the width of the body part is less than or equal to 2 microns; preferably, in a direction parallel to the display panel, the distance between two adjacent body parts is less than or equal to 2 microns.

[0014] A second aspect of the present application provides a display device, comprising the above-mentioned display panel.

[0015] According to the display panel, preparation method thereof and display device provided by the embodiments of the present application, the orthographic projection of the signal line on the substrate is arranged to be within the orthographic projection of the encapsulation layer on the substrate, that is, the signal line is covered with the encapsulation layer, thereby avoiding the film layer on the side of the encapsulation layer away from the substrate from breaking due to the unevenness of the signal line, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 It is a schematic diagram of the cross-sectional structure of the display panel provided in the first embodiment of the present application.

[0018] Figure 2 It is a schematic diagram of the cross-sectional structure of a display panel provided in the second embodiment of the present application.

[0019] Figure 3 It is a schematic diagram of the cross-sectional structure of a display panel provided in the third embodiment of the present application.

[0020] Figure 4It is a schematic diagram of the cross-sectional structure of a display panel provided in the fourth embodiment of the present application.

[0021] Figure 5 yes Figure 2 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0022] Figure 6 It is a schematic diagram of the cross-sectional structure of a display panel provided in the fifth embodiment of the present application.

[0023] Figure 7 It is a schematic diagram of the structure of a display device provided by an embodiment of the present application.

[0024] Figure 8 It is a schematic diagram of the process of the method for preparing a display panel provided in an embodiment of the present application.

[0025] Fig. 9 It is a schematic structural diagram of a mask plate provided in one embodiment of the present application. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0030] Figure 1 is a schematic diagram of the cross-sectional structure of a display panel provided in the first embodiment of the present application. Figure 1As shown, the display panel includes a display area AA and a non-display area NA surrounding the display area AA. The display panel 100 located in the non-display area NA includes a substrate 11, a conductive layer and an encapsulation layer 20. A plurality of conductive layers are stacked on one side of the substrate 11. The plurality of conductive layers include a plurality of signal lines 13. The encapsulation layer 20 is located on the side of the signal line 13 away from the substrate 11, and the orthographic projection of the signal line 13 on the substrate 11 is located within the orthographic projection of the encapsulation layer 20 on the substrate 11. The display panel 100 is configured such that the orthographic projection of the signal line 13 on the substrate 11 is located within the orthographic projection of the encapsulation layer 20 on the substrate 11, that is, the signal line 13 is covered with the encapsulation layer 20 above, thereby preventing the film layer on the side of the encapsulation layer 20 away from the substrate 11 from being broken due to the unevenness of the signal line 13.

[0031] Optionally, in one embodiment, the substrate 11 may be a substrate substrate, and the substrate substrate may include but is not limited to a conductive silicon (Si) substrate, a silicon oxide (SiO x ) substrate, aluminum oxide (Al2O3) substrate (ie, sapphire substrate), silicon carbide (SiC) substrate, gallium nitride (GaN) substrate. In addition, the substrate 10 may also be a flexible substrate, for example, a flexible substrate made of polyimide PI.

[0032] Optionally, in one embodiment, the plurality of conductive layers include a first metal layer M1 and a second metal layer M2 , and the second metal layer M2 is located on a side of the first metal layer M1 facing away from the substrate 11 .

[0033] Optionally, in one embodiment, the plurality of signal lines 13 include a plurality of first signal lines 131 and a plurality of second signal lines 132 , and the first signal lines 131 and the second signal lines 132 are located in different conductive layers.

[0034] Optionally, in one embodiment, the first signal line 131 and the second signal line 132 are arranged at intervals in the orthographic projection on the substrate 11 .

[0035] Specifically, in one embodiment, the first signal line 131 is located in the first metal layer M1 , and the second signal line 132 is located in the second metal layer M2 .

[0036] Optionally, in one embodiment, the distance L between the outer edge of the orthographic projection of the signal line 13 on the substrate 11 and the outer edge of the orthographic projection of the encapsulation layer 20 on the substrate 11 is greater than or equal to 60 micrometers. Exemplarily, the distance L between the outer edge of the orthographic projection of the signal line 13 on the substrate 11 and the outer edge of the orthographic projection of the encapsulation layer 20 on the substrate 11 can be 60 micrometers, 65 micrometers, 70 micrometers, etc.

[0037] Optionally, in one embodiment, the plurality of conductive layers further include a third metal layer M3 , and the third metal layer M3 is located on a side of the second metal layer M2 facing away from the substrate 11 .

[0038] Further optionally, in one embodiment, the third metal layer M3 is a titanium-aluminum-titanium structure.

[0039] Optionally, in one embodiment, the substrate 11 further includes an interlayer dielectric layer 14 , which is located between the first metal layer M1 and the second metal layer M2 , and is used to prevent a short circuit between the first metal layer M1 and the second metal layer M2 .

[0040] The display panel provided in the embodiment of the present application sets the orthographic projection of the signal line on the substrate to be within the orthographic projection of the packaging layer on the substrate, that is, the signal line is covered with the packaging layer, thereby preventing the film layer on the side of the packaging layer away from the substrate from breaking due to the unevenness of the signal line.

[0041] Figure 2 is a schematic cross-sectional structure diagram of a display panel provided in the second embodiment of the present application, Figure 3 is a schematic cross-sectional structure diagram of a display panel provided in the third embodiment of the present application, Figure 4 is a schematic diagram of the cross-sectional structure of a display panel provided in the fourth embodiment of the present application. Figures 2 to 4 As shown, Figures 2 to 4 The display panel and Figure 1 The difference between the display panels shown is that, in this embodiment, the display panel 100 further includes a dam.

[0042] Optionally, in one embodiment, the encapsulation layer 20 is used to encapsulate the display panel 100 , which can isolate water and oxygen, reduce the probability of partial film structure failure due to impurities such as water and oxygen entering the display panel 100 , and ensure the life and reliability of the display panel 100 .

[0043] Optionally, in one embodiment, the encapsulation layer 20 includes a first inorganic encapsulation layer 21 , an organic encapsulation layer 22 , and a second inorganic encapsulation layer 23 sequentially stacked on the substrate 11 .

[0044] Optionally, in one embodiment, the material of the first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 23 is silicon oxide, silicon oxynitride or silicon nitride, etc. The first inorganic encapsulation layer 21 and the second inorganic encapsulation layer 23 can be a single layer, a multi-layer, a composite layer, etc.

[0045] Optionally, in one embodiment, the material of the organic encapsulation layer 22 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 22 can be a single layer, a multilayer, a composite layer, etc.

[0046] Optionally, in one embodiment, the display panel 100 further includes an inorganic layer 15 , and the inorganic layer 15 is located between the conductive layer and the encapsulation layer 12 , and at least a portion of the first inorganic encapsulation layer 21 is in contact with the inorganic layer 15 to play an encapsulation role.

[0047] Optionally, in one embodiment, the display panel 100 includes a touch metal layer 30, which is located on the side of the packaging layer 20 facing away from the substrate 11, and in the arrangement direction X of the multiple signal lines 13, the orthographic projection of the touch metal layer 30 on the substrate 11 is located outside the outer edge of the orthographic projection of the packaging layer 20 on the substrate 11.

[0048] Optionally, in one embodiment, the display panel 100 includes a first dam 40 and a second dam 50, both of which are located in the non-display area NA, and the first dam 40 is located on a side of the second dam 50 close to the display area AA, and the first dam 40 and the second dam 50 can prevent the organic encapsulation layer 22 from overflowing to the outside of the display panel 100.

[0049] Figure 5 yes Figure 2 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figure 5 As shown, in one embodiment, in the direction Y perpendicular to the display panel 100 , the height H2 of the second dam 50 is greater than the height H1 of the first dam 40 , thereby better preventing the organic encapsulation layer 22 from overflowing to the outside of the display panel 100 .

[0050] Optionally, in one embodiment, the first dam 40 includes multiple organic layers stacked in sequence on the side of the conductive layer facing away from the substrate 11, and the multiple organic layers of the first dam 40 include a pixel definition layer 60 and a support column layer 70 stacked in sequence on the side of the conductive layer facing away from the substrate 11.

[0051] Optionally, in one embodiment, the second dam 50 includes multiple organic layers stacked in sequence on the side of the conductive layer facing away from the substrate 11, and the multiple organic layers include an organic glue layer 80, a pixel definition layer 60 and a support column layer 70 stacked in sequence on the side of the conductive layer facing away from the substrate 11.

[0052] Optionally, in one embodiment, a spacer area Q is provided between the first dam 40 and the second dam 50, and any organic layer of the second dam 50 extends to the spacer area Q and contacts the first dam 40, thereby preventing peeling from occurring at the overlapping position of the first signal line 131 and the second signal line 132, further flattening the gap between the first signal line 131 and the second signal line 132, avoiding breakage of the touch metal layer 30, and improving the reliability of the display panel 100.

[0053] Optionally, in one embodiment, in the direction Y perpendicular to the display panel 100, the thickness of any organic layer is less than the thickness of the remaining organic layers in the multi-layer organic layer, that is, any organic layer is the thinnest organic layer among the organic glue layer 80 of the second dam 50, the pixel definition layer 60 and the support column layer 70, which can prevent the first signal line 131 and the second signal line 132 from peeling off at the overlapping position, and can further block the organic encapsulation layer 22 from overflowing to the outside of the display panel 100.

[0054] Please refer again Figure 5 In one embodiment, in a direction Y perpendicular to the display panel 100 , a thickness T1 of any organic layer located in the spacer region is less than a thickness T2 of the organic layer located in the second bank 50 .

[0055] The display panel provided in the embodiment of the present application is configured such that the orthographic projection of the signal line on the substrate is located within the orthographic projection of the encapsulation layer on the substrate, that is, the signal line is covered with the encapsulation layer, thereby preventing the film layer on the side of the encapsulation layer away from the substrate from being broken due to the unevenness of the signal line. Furthermore, a spacing area is provided between the first dam and the second dam, and any organic layer of the second dam extends to the spacing area and contacts the first dam, thereby preventing the first signal line and the second signal line from peeling off at the overlapping position, further flattening the gap between the first signal line and the second signal line, avoiding the touch metal layer from breaking, and improving the reliability of the display panel.

[0056] Figure 6 is a schematic diagram of a cross-sectional structure of a display panel provided in the fifth embodiment of the present application. Figure 6 As shown, Figure 6 and Figure 3 The difference of the display panel shown is that the non-display area NA of the display panel 100 further includes an auxiliary layer 90 .

[0057] Optionally, in one embodiment, the non-display area NA includes a first dam area 101 and a second dam area 102, and a spacer area Q is between the first dam area 101 and the second dam area 102. The orthographic projection of the auxiliary layer 90 located in the non-display area on the substrate 11 is located within the dam area, that is, the orthographic projection of the auxiliary layer 90 located in the non-display area on the substrate 11 is located within the orthographic projections of the first dam 40, the second dam 50 and the spacer area Q on the substrate 11. The auxiliary layer 90 can prevent water vapor from entering the display area AA and affecting the reliability of the display panel 100 when the encapsulation layer 20 is broken.

[0058] Optionally, in one embodiment, the auxiliary layer 90 is located between the organic glue layer 80 and the pixel definition layer 60 .

[0059] Specifically, the auxiliary layer 90 located in the first bank region 101 is located between the substrate 11 and the pixel definition layer 60 .

[0060] The auxiliary layer 90 located in the second bank region 102 is located between the organic glue layer 80 and the pixel definition layer 60 .

[0061] If the organic layer located in the spacer region Q is the organic glue layer 80 , the auxiliary layer 90 located in the spacer region Q is located between the organic glue layer 80 and the encapsulation layer 20 .

[0062] If the organic layer located in the spacer region Q is the pixel definition layer 60 , the auxiliary layer 90 located in the spacer region Q is located between the substrate 11 and the pixel definition layer 60 .

[0063] If the organic layer located in the spacer region Q is the support column layer 70 , the auxiliary layer 90 located in the spacer region Q is located between the substrate 11 and the support column layer 70 .

[0064] Optionally, in one embodiment, the material of the auxiliary layer 90 may be any one of an organic material, an inorganic material, and a metal material.

[0065] Optionally, in one embodiment, the display panel further includes an anode layer, the anode layer is located in the display area AA, and the auxiliary layer 90 and the anode layer are disposed in the same layer.

[0066] The display panel provided in the embodiment of the present application is arranged such that the orthographic projection of the signal line on the substrate is located within the orthographic projection of the encapsulation layer on the substrate, that is, the signal line is covered with the encapsulation layer, thereby preventing the film layer on the side of the encapsulation layer away from the substrate from being broken due to the unevenness of the signal line. Furthermore, the non-display area also includes an auxiliary layer, which can prevent water vapor from entering the display area when the encapsulation layer is broken, thereby affecting the reliability of the display panel.

[0067] An embodiment of the present application further provides a display module, which includes the display panel 100 provided in the above embodiment. Its technical principles and effects are similar and will not be described in detail here.

[0068] Figure 7 Schematic diagram of the structure of the display device provided by the present application. Figure 7 As shown, the display device 700 is a product with an image display function. For example, the display device 700 can be used to display static images, such as pictures or photos. The display device 700 can also be used to display dynamic images, such as videos.

[0069] The display device 700 may be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted smart central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0070] The display device 700 includes a display substrate provided by any of the above embodiments, which may be an organic light emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0071] In addition, the display device 700 may also have functions such as taking pictures, recording, fingerprint recognition, face recognition, etc. Accordingly, the display device 700 also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, etc.

[0072] The embodiment of the present application further provides a method for manufacturing a display panel, which is used to manufacture the above-mentioned display panel 100 . Figure 8 1 is a schematic diagram of a method for preparing a display panel provided in an embodiment of the present application. The method for preparing a display panel includes:

[0073] Step S100: preparing a plurality of conductive layers on one side of a substrate.

[0074] The plurality of conductive layers include a plurality of signal lines 13 .

[0075] Step S200: preparing a packaging layer on the side of the conductive layer facing away from the substrate.

[0076] The orthographic projection of the signal line 13 on the substrate 11 is located within the orthographic projection of the packaging layer 20 on the substrate 11 .

[0077] Optionally, in one embodiment, after step S100 , the preparation method further includes: preparing a first dam 40 and a second dam 50 on one side of the substrate 11 .

[0078] Among them, a spacing area Q is provided between the first dam 40 and the second dam 50, and the second dam 50 includes a plurality of organic layers stacked in sequence on the conductive layer away from the substrate 11, and any organic layer extends to the spacing area Q and contacts the first dam, thereby preventing peeling at the overlapping position of the signal line 13 and further flattening the gap between the signal lines 13, avoiding film breakage, and improving the reliability of the display panel 100.

[0079] Optionally, in one embodiment, a first dam 40 and a second dam 50 are prepared on one side of the substrate 11, including: preparing a plurality of organic layers based on a mask plate, wherein in a direction Y perpendicular to the display panel 100, the thickness of any organic layer located in the spacing area is less than the thickness of the organic layer located in the second dam 50.

[0080] Optionally, in one embodiment, after step S200, the preparation method further includes: preparing a touch metal layer on a side of the encapsulation layer facing away from the substrate.

[0081] In the arrangement direction X of the signal lines 13 , the outer edge of the orthographic projection of the touch metal layer 30 on the substrate 11 is located outside the outer edge of the orthographic projection of the packaging layer 20 on the substrate 11 .

[0082] Fig. 9 Schematic diagram of the structure of a mask plate provided by an embodiment of the present application. Fig. 9 As shown, in one embodiment, the mask plate 300 for preparing the organic layer of the spacer area Q includes a plurality of body parts 310 arranged at intervals, and in the direction X parallel to the display panel, the width W of the body part 310 is greater than or equal to the distance D between two adjacent body parts 310.

[0083] Optionally, in one embodiment, in a direction X parallel to the display panel, a width W of the main body portion 310 is less than or equal to 2 micrometers. Exemplarily, the width W of the main body portion 310 is 2 micrometers, 1.5 micrometers, 1 micrometer, or the like.

[0084] Preferably, the width W of the main body 310 is 1.5 microns.

[0085] Optionally, in one embodiment, in the direction X parallel to the display panel, the distance D between two adjacent main body portions 310 is less than or equal to 2 microns. Exemplarily, the distance D between two adjacent main body portions 310 is 2 microns, 1.5 microns, 1 micron, etc.

[0086] Preferably, the distance D between two adjacent main body portions 310 is 1.4 microns.

[0087] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0088] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: The display panel includes a display area and a non-display area surrounding the display area, and the display panel located in the non-display area includes: substrate; A plurality of conductive layers stacked on one side of the substrate, the plurality of conductive layers comprising a plurality of signal lines; and The encapsulation layer is located on a side of the signal line away from the substrate, and the orthographic projection of the signal line on the substrate is located within the orthographic projection of the encapsulation layer on the substrate.

2. The display panel according to claim 1, characterized in that: The plurality of signal lines include a plurality of first signal lines and a plurality of second signal lines, and the first signal lines and the second signal lines are located in different conductive layers; Preferably, the first signal line and the second signal line are arranged at intervals in orthographic projection on the substrate; Preferably, the plurality of conductive layers include a first metal layer and a second metal layer, the second metal layer is located on a side of the first metal layer away from the substrate, the first signal line is located on the first metal layer, and the second signal line is located on the second metal layer; Preferably, the plurality of conductive layers further include a third metal layer, and the third metal layer is located on a side of the second metal layer away from the substrate; Preferably, the third metal layer is a titanium-aluminum-titanium structure; Preferably, the substrate further comprises an interlayer dielectric layer, and the interlayer dielectric layer is located between the first metal layer and the second metal layer; Preferably, a distance between an outer edge of an orthographic projection of the signal line on the substrate and an outer edge of an orthographic projection of the packaging layer on the substrate is greater than or equal to 60 micrometers.

3. The display panel according to claim 1, characterized in that: The display panel includes a first dam and a second dam, the first dam and the second dam are both located in the non-display area, the first dam is located on a side of the second dam close to the display area, and in a direction perpendicular to the display panel, the height of the second dam is greater than the height of the first dam.

4. The display panel according to claim 3, characterized in that: A spacer is provided between the first bank and the second bank, the second bank comprises a plurality of organic layers sequentially stacked on a side of the conductive layer away from the substrate, any of the organic layers extending to the spacer and contacting the first bank; Preferably, the multi-layer organic layer of the second dam comprises an organic glue layer, a pixel definition layer and a support column layer sequentially stacked on the side of the conductive layer away from the substrate; Preferably, the first dam includes multiple organic layers stacked in sequence on the side of the conductive layer away from the substrate, and the multiple organic layers of the first dam include a pixel definition layer and a support column layer stacked in sequence on the side of the conductive layer away from the substrate.

5. The display panel according to claim 4, characterized in that: In a direction perpendicular to the display panel, the thickness of any one of the organic layers is smaller than the thickness of the remaining organic layers in the multiple organic layers; Preferably, in a direction perpendicular to the display panel, a thickness of any one of the organic layers located in the spacing area is smaller than a thickness of the organic layer located in the second dam.

6. The display panel according to claim 4, characterized in that: The display panel comprises an organic glue layer and a pixel definition layer which are sequentially stacked on a side of the conductive layer away from the substrate, and the display panel further comprises an auxiliary layer which is located between the organic glue layer and the pixel definition layer; Preferably, the orthographic projection of the auxiliary layer on the side of the conductive layer away from the substrate is located within the orthographic projection of the first dam, the second dam and the spacer on the substrate; Preferably, the material of the auxiliary layer may be any one of an organic material, an inorganic material, and a metal material; Preferably, the display panel further comprises an anode layer, the anode layer is located in the display area, and the auxiliary layer and the anode layer are arranged in the same layer.

7. The display panel according to claim 1, characterized in that: It also includes a touch metal layer, which is located on a side of the packaging layer away from the substrate, and in the arrangement direction of the plurality of signal lines, an outer edge of the orthographic projection of the touch metal layer on the substrate is located outside an outer edge of the orthographic projection of the packaging layer on the substrate; Preferably, the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked on a side of the conductive layer away from the substrate; Preferably, the display panel further comprises an inorganic layer, wherein the inorganic layer is located between the conductive layer and the encapsulation layer, and at least a portion of the first inorganic encapsulation layer is in contact with the inorganic layer.

8. A method for preparing a display panel, characterized in that: include: Preparing a plurality of conductive layers on one side of the substrate, wherein the plurality of conductive layers include a plurality of signal lines; A packaging layer is prepared on a side of the conductive layer facing away from the substrate, and the orthographic projection of the signal line on the substrate is located within the orthographic projection of the packaging layer on the substrate.

9. The preparation method according to claim 8, characterized in that: The preparation method further comprises: A first bank and a second bank are prepared on one side of the substrate, a spacer is provided between the first bank and the second bank, the second bank comprises a plurality of organic layers sequentially stacked on a side of the conductive layer away from the substrate, any of the organic layers extends to the spacer and contacts the first bank; Preferably, the method further comprises: preparing a touch metal layer on a side of the encapsulation layer facing away from the substrate, wherein in the arrangement direction of the signal lines, an outer edge of an orthographic projection of the touch metal layer on the substrate is located outside an outer edge of an orthographic projection of the encapsulation layer on the substrate; Preferably, the preparing the first dam and the second dam on one side of the substrate comprises: preparing a plurality of organic layers based on a mask, wherein in a direction perpendicular to the display panel, a thickness of any organic layer located in the spacer is less than a thickness of the organic layer located in the second dam; Preferably, the mask for preparing the organic layer of the spacer region comprises a plurality of body portions arranged at intervals, and in a direction parallel to the display panel, a width of the body portion is greater than or equal to a distance between two adjacent body portions; Preferably, in a direction parallel to the display panel, the width of the main body is less than or equal to 2 microns; Preferably, in a direction parallel to the display panel, a distance between two adjacent main body portions is less than or equal to 2 micrometers.

10. A display device, characterized in that: A display panel comprising any one of claims 1-7.

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