Display module, preparation method thereof and display device

Abstract

The invention provides a display module, a preparation method thereof and a display device. The display module comprises a display panel, a base material layer, a photocuring adhesive layer and a conductive layer. The substrate layer is arranged on the non-display side of the display panel. The photocuring adhesive layer is arranged on the side, away from the display panel, of the base material layer, and a plurality of open grooves are formed in the side, away from the base material layer, of the photocuring adhesive layer at intervals. The conductive layer is arranged on the side, away from the display panel, of the photocuring adhesive layer. The side, away from the display panel, of the photocuring adhesive layer is provided with a plurality of open grooves arranged at intervals, and when the display module is impacted by external force, the open groove parts can deform to absorb impact energy, so that the display panel is protected from being easily affected by the external force impact, the film printing degree of the display panel can be reduced, and the display effect of the display module is improved. Therefore, the probability of poor film printing of the display module is reduced. The conductive layer is arranged on the side, away from the display panel, of the photocuring adhesive layer, and the conductive layer replaces a copper foil to achieve the effects of electric conduction, grounding, electrostatic shielding and the like.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device. Background Art

[0002] At present, OLED display modules are becoming thinner and lighter, and the path for the pressure from processes such as bonding to be transmitted to the display panel is becoming shorter and shorter. The pressure on the display panel will inevitably increase. As a result, the probability of poor film printing on the display panel is getting higher and higher, and the degree of film printing is more obvious, affecting the user experience. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a display module and a method for manufacturing the same, and a display device, which are used to reduce the degree of film printing on a display panel, thereby reducing the probability of defective film printing on the display module. The specific technical solution is as follows:

[0004] In a first aspect, the present application provides a display module, comprising: a display panel; a substrate layer, disposed on a non-display side of the display panel;

[0005] The photocurable adhesive layer is arranged on the side of the substrate layer away from the display panel, and a plurality of slots are arranged at intervals on the side of the photocurable adhesive layer away from the substrate layer; and the conductive layer is arranged on the side of the photocurable adhesive layer away from the display panel.

[0006] In some embodiments, the depth of the groove is less than the thickness of the photocurable adhesive layer.

[0007] In some embodiments, the ratio of the depth of the groove to the thickness of the photocurable adhesive layer is 0.2-0.5.

[0008] In some embodiments, the photocurable adhesive layer includes a grooved area and a flat area located on a side of the grooved area close to the display panel, the thickness of the grooved area is equal to the depth of the groove, the thickness of the grooved area is 25μm-35μm, and the thickness of the flat area is 45μm-55μm.

[0009] In some embodiments, the opening area of ​​the groove remains constant or gradually decreases along the thickness direction of the display module.

[0010] In some embodiments, a cross-section of the groove along the thickness direction of the display module is V-shaped, U-shaped, rectangular, square, hemispherical or trapezoidal.

[0011] In some embodiments, adjacent grooves are colinear or coplanar.

[0012] In some embodiments, the elastic modulus of the photocurable adhesive is 100 Kpa-300 Kpa.

[0013] In some embodiments, the thickness of the conductive layer is 1 μm-5 μm.

[0014] In some embodiments, the conductive layer is a metal plating layer.

[0015] A second aspect of the present application provides a method for preparing a display module, which is used to manufacture the display module described above, and is characterized by comprising at least the following steps:

[0016] preparing a substrate layer on a non-display side of the display panel;

[0017] A photocurable adhesive layer is prepared on a side of the substrate layer away from the display panel, wherein a plurality of grooves are arranged at intervals on the side of the photocurable adhesive layer away from the substrate layer;

[0018] A conductive layer is prepared on a side of the photocurable adhesive layer away from the display panel.

[0019] In some embodiments, the steps of preparing the photocurable adhesive layer are as follows:

[0020] Providing a mold, wherein the pattern of the mold is mirror-symmetrical to the photocurable adhesive layer;

[0021] injecting light-curing adhesive into the mold;

[0022] Transferring the photocurable adhesive to a side of the substrate layer away from the display panel;

[0023] The photocurable adhesive layer is irradiated with light to cure the photocurable adhesive layer.

[0024] A third aspect of the present application provides a display device, which includes the display module described above.

[0025] Beneficial effects of the embodiments of the present application:

[0026] The display module and its manufacturing method and display device provided in the embodiment of the present application, the display module includes a display panel, a substrate layer, a photocurable adhesive layer and a conductive layer. The photocurable adhesive layer can automatically bond with the substrate layer during the curing process, which can reduce the use of one layer of adhesive layer compared to the traditional solution using foam, so it is beneficial to reduce the thickness of the display module. A plurality of slots arranged alternately are provided on the side of the photocurable adhesive layer away from the display panel. When the display module is impacted by external force, the slotted part can deform itself to absorb the impact energy, thereby protecting the display panel from being easily affected by external force impact, thereby reducing the degree of film printing on the display panel, thereby reducing the probability of poor film printing on the display module. A conductive layer is provided on the side of the photocurable adhesive layer away from the display panel, and the conductive layer replaces the copper foil to perform the functions of conduction, grounding, electrostatic shielding, etc.

[0027] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0029] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present application, wherein the light-curing adhesive layer is one of the embodiments;

[0030] Figure 2 This is the second embodiment of the light-curing adhesive layer;

[0031] Figure 3 This is the third embodiment of the light-curing adhesive layer;

[0032] Figure 4 This is the fourth embodiment of the light-curing adhesive layer;

[0033] Figure 5 The fifth embodiment of the light-curing adhesive layer;

[0034] Figure 6 This is the sixth embodiment of the photocurable adhesive layer;

[0035] Figure 7 The seventh embodiment of the light-curing adhesive layer;

[0036] Figure 8 It is a schematic diagram of the display panel after being bonded to the substrate layer, polarizer, and cover plate;

[0037] Fig. 9 A schematic diagram of the structure of the mold provided in the embodiment of the present application;

[0038] Fig.10 It is a schematic diagram of the structure of pouring a light-curing adhesive layer into a mold;

[0039] Fig.11 It is a schematic diagram of the structure of transferring the photocurable adhesive layer to the substrate layer.

[0040] The reference numerals are as follows:

[0041] Cover plate 1; optical adhesive 2; polarizer 3; display panel 4; substrate layer 5; photocurable adhesive layer 6; flat area 61; groove area 62; groove 621; conductive layer 7; mold 8. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0043] At present, OLED products are increasingly pursuing thin and light designs, and the internal space of the products is extremely precious. As display modules become thinner and thinner, the film prints caused by process pressures such as lamination become more obvious. For high-end flagship models of various terminals, the film print level requirements are higher. Therefore, it is urgent to propose a new solution that can meet the needs of thin and light products and the requirements of film print level.

[0044] To this end, the present application embodiment provides a display module, such as Figure 1 As shown, the display module includes a display panel 4, a substrate layer 5, a photocurable adhesive layer 6 and a conductive layer 7. The substrate layer 5 is arranged on the non-display side of the display panel 4. The photocurable adhesive layer 6 is arranged on the side of the substrate layer 5 away from the display panel 4, and a plurality of grooves 621 are arranged at intervals on the side of the photocurable adhesive layer 6 away from the substrate layer 5. The conductive layer 7 is arranged on the side of the photocurable adhesive layer 6 away from the display panel 4.

[0045] In this embodiment, a photocurable adhesive layer 6 is provided on the side of the substrate layer 5 away from the display panel 4. The photocurable adhesive layer 6 can be automatically bonded to the substrate layer 5 during the curing process. Compared with the traditional solution using foam, the use of one adhesive layer can be reduced, so it is beneficial to reduce the thickness of the display module. A plurality of slots 621 arranged alternately are provided on the side of the photocurable adhesive layer 6 away from the display panel 4. When the display module is impacted by external force, the slot 621 part can deform itself to absorb the impact energy, thereby protecting the display panel 4 from being easily affected by external force impact. Therefore, the degree of film printing on the display panel 4 can be reduced, thereby reducing the probability of poor film printing on the display module. A conductive layer 7 is provided on the side of the photocurable adhesive layer 6 away from the display panel 4. The conductive layer 7 replaces the copper foil to perform the functions of conduction, grounding, electrostatic shielding, etc.

[0046] In addition, in this embodiment, the photocurable adhesive layer 6 avoids the generation of film prints by utilizing the slots 621 on one side of the photocurable adhesive layer 6 to be easily deformed and absorb impact energy, thereby reducing the magnitude of the impact force acting on the display panel 4 and alleviating film prints. In conventional technology, the method to avoid the generation of film prints is to set a buffer layer such as foam on the side of the substrate layer 5 away from the display panel 4. The buffering principle is mainly based on the porous structure and material properties of the buffer layer. Taking foam as an example, foam is a porous polymer material whose pores are filled with air, which enables the foam to absorb energy when impacted, thereby playing a buffering role, reducing the magnitude of the impact force acting on the display panel 4 and alleviating film prints. Due to the loose and porous nature of the foam itself, the thickness of the buffer layer made of foam is relatively large. Replacing the foam with a photocurable adhesive layer 6 can greatly reduce the thickness of the display module.

[0047] It can be understood that the display module can be COE (Color-filter On Encapsulation) or polarizer 3 packaging. This embodiment only takes polarizer 3 packaging as an example. Figure 1 A polarizer 3 and a cover plate 1 are sequentially arranged on one side of the display panel 4 away from the substrate layer 5 in a direction away from the display panel 4 , and the polarizer 3 and the cover plate 1 are bonded together by a transparent optical adhesive 2 .

[0048] In some embodiments of the present application, Figure 1 As shown, the depth of the groove 621 is less than the thickness of the photocurable adhesive layer 6. The depth of the groove 621 is less than the thickness of the photocurable adhesive layer 6, which can increase the strength of the photocurable adhesive layer 6, and the portion not penetrated by the groove 621 can prevent the impact force from continuing to be transmitted to the display panel 4, thereby better reducing the degree of film printing and improving the yield rate of the display module.

[0049] Optionally, the ratio of the depth of the groove 621 to the thickness of the photocurable adhesive layer 6 is 0.2-0.5, for example, it can be 0.2, 0.3, 0.35, 0.4, 0.45, 0.5, etc. The depth of the groove 621 is greater than or equal to 0.2 times the thickness of the photocurable adhesive layer 6, which is beneficial to reducing the deformation difficulty of the groove area 62 and improving the degree of deformation. The depth of the groove 621 is less than or equal to 0.5 times the thickness of the photocurable adhesive layer 6, so that the photocurable adhesive layer 6 has a flat area 61 of a certain thickness except the groove area 62 above, which is beneficial to improve the strength of the photocurable adhesive layer 6, and the thickness of the flat area 61 is relatively large, which can better block the force from continuing to be transmitted to the display panel 4, so that the photocurable adhesive layer 6 can better protect the display panel 4 from the influence of external forces, reduce the degree of film printing, and improve the product yield of the display module.

[0050] It should be noted that the thickness of the groove area 62 is equal to the depth of the groove 621 , the flat area 61 is located on the side of the groove area 62 close to the display panel 4 , and in the direction shown in the figure, the flat area 61 is located at the bottom of the groove area 62 .

[0051] Optionally, the thickness of the grooved area 62 is 25μm-35μm, for example, the thickness of the grooved area 62 may be 25μm, 28μm, 30μm, 32μm, 35μm, etc., and the thickness of the flat layer is 45μm-55μm, for example, the thickness of the flat layer may be 45μm, 48μm, 50μm, 52μm, 55μm, etc.

[0052] In some embodiments of the present application, Figures 1 to 4 As shown, the opening area of ​​the slot 621 remains constant or gradually decreases along the thickness direction of the display module.

[0053] The opening area of ​​the slot 621 remains unchanged or gradually decreases, which can reduce the difficulty of manufacturing the slot 621 and is conducive to improving production efficiency.

[0054] When the opening area gradually decreases, the side wall of the slot 621 is more conducive to dispersing the force and is less likely to cause stress concentration.

[0055] In some embodiments of the present application, the cross-section of the slot 621 along the thickness direction of the display module is V-shaped, U-shaped, rectangular, square, hemispherical or trapezoidal. Figure 1 The cross section of the slot 621 along the thickness direction of the display module is V-shaped. Figure 2 The cross section of the slot 621 along the thickness direction of the display module is U-shaped. Figure 3 The cross section of the slot 621 along the thickness direction of the display module is hemispherical. Figure 4 The cross section of the slot 621 along the thickness direction of the display module is a trapezoid. The cross section of the slot 621 along the thickness direction of the display module is a U-shaped or square cross section, which is not shown in the figure. Figure 2 On the basis of this, simply replace the shape of the slot 621.

[0056] Among them, the U-shape, square and rectangle can be understood as the opening area remaining basically unchanged along the thickness direction, while the V-shape, trapezoid and hemispherical can be understood as the opening area gradually decreasing along the thickness direction. The groove 621 with a U-shape, square, rectangle, V-shape, trapezoid and hemispherical cross section along the thickness direction is easy to deform due to the existence of the groove 621 when subjected to pressure, and absorbs energy, thereby relieving the pressure on the display panel 4 at the bottom of the light curing glue. For the hemispherical groove 621, the stress is more evenly distributed in the groove 621, and stress concentration is not easy to occur.

[0057] In some embodiments of the present application, adjacent slots 621 are colinear or coplanar.

[0058] Adjacent slots 621 are collinear, for example, for V-shaped or trapezoidal slots 621, Figure 1 , Figure 4 As shown, the intervals between adjacent slots 621 are triangular in cross section along the thickness direction of the display module. For U-shaped or hemispherical slots 621, Figure 3 As shown, the intervals between adjacent slots 621 are close to a herringbone shape in the cross section along the thickness direction of the display module.

[0059] When adjacent slots 621 are collinear, the intervals between the adjacent slots 621 are smaller. At this time, the slot area 62 is more likely to deform, thereby quickly absorbing the energy generated by the impact force, thereby reducing the film print.

[0060] Adjacent slots 621 are coplanar. For example, for square or rectangular slots 621, Figure 2 As shown, the intervals between adjacent slots 621 are rectangular or square in cross section along the thickness direction of the display module. Figure 5 , Figure 6 As shown, the intervals between adjacent slots 621 are trapezoidal in cross section along the thickness direction of the display module. Figure 7 As shown, the intervals between adjacent slots 621 are close to a “J” shape in the cross section along the thickness direction of the display module.

[0061] When adjacent slots 621 are coplanar, the intervals between the adjacent slots 621 are larger, and deformation of the same degree will absorb more energy, thereby reducing the transmission of impact force to the display panel 4 and reducing film printing.

[0062] In some embodiments of the present application, the elastic modulus of the photocuring adhesive is 100 Kpa-300 Kpa. For example, the elastic modulus of the photocuring adhesive may be 100 Kpa, 150 Kpa, 200 Kpa, 250 Kpa, 300 Kpa, etc.

[0063] The elastic modulus is a physical quantity that describes the material's ability to resist elastic deformation. The higher the value, the harder the material, and vice versa. The elastic modulus of light-curing adhesive is between 100Kpa-300Kpa, which means that light-curing adhesive is prone to deformation when subjected to external force and is a flexible material.

[0064] The elastic modulus of the photocuring adhesive is 100Kpa-300Kpa. When it is impacted by external force, it is easy to undergo elastic deformation and absorb energy. The grooved area 62 is more likely to deform than the flat area 61, so it can absorb most of the energy and reduce the magnitude of the force transmitted to the display panel 4, thereby reducing the degree of film printing on the display panel 4.

[0065] The photocurable adhesive may be, for example, but not limited to, an ultraviolet light-curable adhesive, and the ratio of each component in the photocurable adhesive may be adjusted according to the strength of the photocurable adhesive. The main components of the photocurable adhesive generally include a polymer, a crosslinker, an initiator, and an adjuvant.

[0066] Please refer back to Figure 1 In some embodiments of the present application, the thickness of the conductive layer 7 is 1 μm-5 μm. For example, the thickness of the conductive layer 7 may be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, etc.

[0067] The thickness of the conductive layer 7 is greater than 1 μm, which can ensure the continuity of the conductive layer 7 and reduce the risk of faults in the middle. The thickness of the conductive layer 7 is less than or equal to 5 μm, which is conducive to thinning the thickness of the display module and meeting the user's demand for thinner display modules.

[0068] Optionally, the conductive layer 7 is a metal plating layer.

[0069] The metal coating can be directly deposited on the surface of the photocurable adhesive layer 6 by physical vapor deposition, chemical vapor deposition or electroplating, without the need for adhesive layer bonding, which can further reduce the thickness of the display module. Physical vapor deposition includes but is not limited to vacuum evaporation, magnetron sputtering or ion plating.

[0070] A second aspect of the present application provides a method for preparing a display module, which is used to prepare the display module described above, and at least comprises the following steps:

[0071] S1: preparing a substrate layer 5 on the non-display side of the display panel 4 .

[0072] S2: preparing a photocurable adhesive layer 6 on a side of the substrate layer 5 away from the display panel 4 , and a plurality of grooves 621 are arranged at intervals on the side of the photocurable adhesive layer 6 away from the substrate layer 5 .

[0073] S3: preparing a conductive layer 7 on a side of the photocurable adhesive layer 6 away from the display panel 4 .

[0074] The substrate layer 5 can be polyimide (PI) or polyethylene terephthalate (PET), and the substrate layer 5 is arranged on the non-display side of the display panel 4, and the substrate layer 5 is used to support the display panel 4 and improve the strength of the display panel 4. A photocurable adhesive layer 6 is prepared on the side of the substrate layer 5 away from the display panel 4, and the photocurable adhesive layer 6 is used to absorb the pressure generated by the stacking of other film layers on the side away from the display panel 4, thereby reducing the risk of poor film printing on the display panel 4 caused by the stacking of film layers. In this embodiment, by making grooves 621 on the side of the photocurable adhesive layer 6 away from the display panel 4, the grooves 621 are spaced apart from each other. When the photocurable adhesive layer 6 is subjected to the pressure of the film layer from the upper layer, the groove 621 part can deform itself to absorb the impact energy, thereby protecting the display panel 4 from being easily affected by external force impact, so that the degree of film printing on the display panel 4 can be reduced, thereby reducing the probability of poor film printing on the display module. A conductive layer 7 is disposed on a side of the photocurable adhesive layer 6 away from the display panel 4 , and the conductive layer 7 replaces the copper foil to perform functions such as conduction, grounding, and electrostatic shielding.

[0075] Before preparing the substrate layer 5 on the non-display side of the display panel 4, the display panel 4 and the polarizer 3 are bonded, and then a layer of transparent optical adhesive 2 is bonded, and then the cover plate 1 and the transparent optical adhesive 2 are bonded. Figure 8 shown.

[0076] In some embodiments of the present application, the steps of preparing the photocurable adhesive layer 6 are as follows:

[0077] S21: providing a mold 8, wherein the pattern of the mold 8 is mirror-symmetrical to the photocurable adhesive layer 6, such as Fig. 9 As shown;

[0078] S22: Inject light-curing glue into the mold 8, such as Fig.10 As shown;

[0079] S23: Transferring the photocurable adhesive to the side of the substrate layer 5 away from the display panel 4, such as Fig.11 As shown;

[0080] S24: irradiating the light-curing adhesive layer 6 with light to cure the light-curing adhesive layer 6 .

[0081] The photocurable adhesive layer 6 is formed by UV transfer on the substrate layer 5, which can also be called a UV adhesive layer. UV transfer is also called UV infusion process or UV coating process. It is a technology that uses the non-stick properties of UV transfer glue and metal to transfer various ultra-thin key effects to PET, PI, PC (polycarbonate) or PMMA (polymethyl methacrylate) sheets through UV transfer process. Then a conductive layer 7 is set on the UV glue, such as PVD Coating (physical vapor deposition coating). The photocurable adhesive layer 6 plus the conductive layer 7 replaces the Embo glue (grid glue), foam, top glue, copper foil and other film layers in the prior art. The thickness of the display module is reduced from the original 230μm to the current 82μm. The thickness of the improved photocurable adhesive layer 6 plus the conductive layer 7 is only 35% of the thickness of the original four film layers, and the benefits are very obvious.

[0082] Specifically, a UV transfer light curing adhesive layer 6, i.e., a UV adhesive layer, is formed on the substrate layer 5. The UV adhesive layer is divided into two parts. The first part is a flat area 61, which is a whole-surface UV adhesive with a thickness of about 45 μm-55 μm. This part mainly improves the compressive strength of the module and can effectively protect the module from being subjected to pressure, resulting in problems such as the display panel 4 breaking and mold printing. The second part is a slotted area 62, which is a UV adhesive with a thickness of about 25 μm-35 μm. When the display module is impacted by an external force, the slotted area 62 of this structure can deform itself to absorb the impact energy, thereby protecting the display panel 4 from being less susceptible to external impact.

[0083] The third aspect of the embodiment of the present application provides a display device, which includes the display module described above. The display device can be, but is not limited to, a mobile phone, a tablet computer, a display, a television, a laptop computer, a car computer, etc. The display device includes a display module, which includes a display panel 4, a substrate layer 5, a photocurable adhesive layer 6 and a conductive layer 7. The photocurable adhesive can automatically bond with the substrate layer 5 during the curing process. Compared with the traditional solution using foam, the use of one layer of adhesive layer can be reduced, so it is beneficial to reduce the thickness of the display module. A plurality of slots 621 arranged alternately are provided on the side of the photocurable adhesive layer 6 away from the display panel 4. When the display module is impacted by external force, the slot 621 part can deform itself to absorb the impact energy, thereby protecting the display panel 4 from being easily affected by external force impact, so the degree of film printing on the display panel 4 can be reduced, thereby reducing the probability of poor film printing on the display module. A conductive layer 7 is provided on the side of the photocurable adhesive layer 6 away from the display panel 4, and the conductive layer 7 replaces the copper foil for conducting electricity, grounding, electrostatic shielding, etc.

[0084] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0085] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0086] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A display module, characterized in that: include: Display panel; A substrate layer, disposed on the non-display side of the display panel; A photocurable adhesive layer is provided on a side of the substrate layer away from the display panel, and a plurality of grooves are provided at intervals on the side of the photocurable adhesive layer away from the substrate layer; The conductive layer is arranged on a side of the photocurable adhesive layer away from the display panel.

2. The display module according to claim 1, characterized in that: The depth of the groove is less than the thickness of the photocurable adhesive layer.

3. The display module according to claim 2, characterized in that: The ratio of the depth of the groove to the thickness of the photocurable adhesive layer is 0.2-0.

5.

4. The display module according to claim 2, characterized in that: The photocurable adhesive layer includes a grooved area and a flat area located on one side of the grooved area close to the display panel. The thickness of the grooved area is equal to the depth of the groove, the thickness of the grooved area is 25μm-35μm, and the thickness of the flat area is 45μm-55μm.

5. The display module according to claim 1, characterized in that: The opening area of ​​the groove remains constant or gradually decreases along the thickness direction of the display module.

6. The display module according to claim 5, characterized in that: The cross section of the groove along the thickness direction of the display module is V-shaped, U-shaped, rectangular, square, hemispherical or trapezoidal.

7. The display module according to claim 6, characterized in that: Adjacent grooves are colinear or coplanar.

8. The display module according to claim 6, characterized in that: The elastic modulus of the photocurable adhesive is 100Kpa-300Kpa.

9. The display module according to any one of claims 1 to 8, characterized in that: The thickness of the conductive layer is 1 μm-5 μm.

10. The display module according to any one of claims 1 to 8, characterized in that: The conductive layer is a metal plating layer.

11. A method for preparing a display module, used for preparing the display module according to any one of claims 1 to 10, characterized in that: At least the following steps are included: preparing a substrate layer on a non-display side of the display panel; A photocurable adhesive layer is prepared on a side of the substrate layer away from the display panel, wherein a plurality of grooves are arranged at intervals on the side of the photocurable adhesive layer away from the substrate layer; A conductive layer is prepared on a side of the photocurable adhesive layer away from the display panel.

12. The method for preparing a display module according to claim 11, characterized in that: The steps of preparing the photocurable adhesive layer are as follows: Providing a mold, wherein a pattern of the mold is mirror-symmetrical to the photocurable adhesive layer; injecting light-curing adhesive into the mold; Transferring the photocurable adhesive to a side of the substrate layer away from the display panel; The photocurable adhesive layer is irradiated with light to cure the photocurable adhesive layer.

13. A display device, characterized in that: A display module comprising any one of claims 1-10.

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