Folding type flexible microelectronic assembly of ultrasonic transducer

Abstract

A system for an ultrasound probe is provided herein. In one example, an ultrasound probe (600) includes a housing (920); and a transducer assembly (601) positioned inside the housing, the transducer assembly comprising: an ultrasound module (632); one or more printed circuit boards (PCBs) (624); and one or more flexible interconnectors (400, 500) configured to have an at least double-bend configuration in which the one or more flexible interconnectors contact the acoustic module and the one or more PCBs, the one or more flexible interconnectors (400, 500) being configured to have an at least double-bend configuration in which the one or more flexible interconnectors (400, 500) contact the acoustic module and the one or more PCBs.

Description

Technical Field

[0001] Embodiments of the subject matter disclosed herein relate to an ultrasound transducer assembly for use with an ultrasound probe system. Background Art

[0002] Ultrasonic transducers are widely used for ultrasonic imaging of objects. Specifically, in the medical field, ultrasonic transducers are often used to obtain high-quality images of a certain area in the patient's body. In addition, the high-quality images can be used to diagnose the patient. Ultrasonic transducers usually include a transducer array, which is usually used to send and receive ultrasonic waves or sound waves. These sound waves are further processed to obtain an image of the object. Generally, the transducer array can be flat (e.g., linear) or convex (e.g., curvilinear). Flat transducer arrays are often used for cardiac imaging, while convex transducer arrays are used for other diagnostic imaging applications such as abdominal imaging.

[0003] In some examples, an ultrasound transducer may include an acoustic module configured to generate and receive acoustic signals, and one or more circuit boards configured to receive electrical signals. The shape of an ultrasound probe determines the type of imaging application for which it is suitable. For example, narrow probes with flat arrays are often used for cardiac imaging. Summary of the invention

[0004] In one example, an ultrasound probe includes a shell; a transducer assembly positioned inside the shell, the transducer assembly including: an acoustic module; one or more printed circuit boards (PCBs); and one or more flexible interconnects constructed with a double-bend configuration, wherein the one or more flexible interconnects contact the acoustic module and the one or more PCBs.

[0005] It should be understood that the above brief description is provided to introduce in a simplified form selected concepts that are further described in the detailed description. It is not meant to identify key features or essential features of the claimed subject matter, the scope of which is uniquely defined by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The present invention will be better understood by reading the following description of non-limiting embodiments with reference to the accompanying drawings, in which:

[0007] Figure 1 An ultrasound imaging system is shown according to an exemplary embodiment.

[0008] Figure 2 An exemplary conventional transducer assembly for an ultrasound probe is shown.

[0009] Figure 3 Another exemplary conventional transducer assembly of an ultrasound probe is shown.

[0010] Figure 4 A diagram showing a first flexible interconnector according to a first embodiment of the present disclosure.

[0011] Figure 5 A diagram showing a second flexible interconnector according to a first embodiment of the present disclosure.

[0012] Figure 6 A perspective cross-sectional view of an exemplary ultrasound probe according to a first embodiment of the present disclosure is shown.

[0013] Figure 7 Shows Figure 6 A perspective cutaway view of an ultrasound probe.

[0014] Figure 8 Shows Figure 6 A perspective cutaway view of an ultrasound probe.

[0015] Fig. 9 A perspective cross-sectional view of a second exemplary ultrasound probe according to a second embodiment of the present disclosure is shown.

[0016] Fig.10 Shows Fig. 9 A perspective view of the transducer assembly of an ultrasound probe.

[0017] Fig.11 is a flow chart illustrating a method of manufacturing an ultrasound probe including a transducer assembly with two flexible interconnects. DETAILED DESCRIPTION

[0018] The following detailed description relates to various embodiments of an ultrasound probe including an ultrasound transducer assembly and a medical imaging system including the ultrasound probe.

[0019] The ultrasonic transducer assembly presented herein includes an acoustic module connected to one or more printed circuit boards (PCBs) via one or more flexible interconnects having at least a double-bend configuration. A method of manufacturing an ultrasonic probe includes bending one or more flexible interconnects twice during assembly of the transducer assembly. The system and assembly method having at least a double-bend configuration of the flexible interconnects make it possible to manufacture a compact ultrasonic probe with a significantly reduced footprint in the elevation direction. Reducing the footprint and size can improve ergonomics and user comfort, as well as increase the variety of applications of the ultrasonic probe.

[0020] The ultrasonic transducer assembly disclosed in the present invention includes one or more PCBs aligned along an azimuth plane, wherein at least a double-bend flexible interconnector connects one or more PCBs to an acoustic module. In some examples, the acoustic module may include an acoustic stack and at least one application-specific integrated circuit (ASIC), which may be coupled to an acoustic backing. Each flexible interconnector is designed to be bent twice or more so that the acoustic module can be connected to the PCB, thereby facilitating sending a signal from the acoustic module to the PCB. In a first embodiment, the flexible interconnector may first be bent into an elevation plane and then bent into an azimuth plane. In a second embodiment, the flexible interconnector may first be bent into an elevation plane and then bent into a plane parallel to the acoustic module.

[0021] Orienting the PCB along the azimuth plane allows the width in the elevation plane to be reduced. In this way, the transducer can be ergonomically optimized for imaging width-restricted areas, such as intercostal imaging. In addition, reducing the width in the elevation direction reduces the footprint of the probe handle, thereby improving user comfort.

[0022] Figure 1 An example of an ultrasound imaging system including an ultrasound probe is depicted in FIG. Figures 2 to 3 An example of a conventional transducer assembly for an ultrasound probe is shown. Figures 4 to 5 An example of a first flexible interconnect and a second flexible interconnect configured with a double bend configuration is shown. Figures 6 to 8 A cross-sectional perspective view of an ultrasound probe according to a first embodiment of the present disclosure is shown. Figures 9 and 10 A cross-sectional perspective view of an ultrasound probe according to a second embodiment of the present disclosure is shown. Fig.11 The flowchart in illustrates a method of manufacturing an ultrasound probe according to the present disclosure.

[0023] Figures 2 to 10An exemplary configuration for positioning each component relative to each other is shown. In at least one example, if shown as being in direct contact or directly coupled to each other, such elements may be referred to as being in direct contact or directly coupled, respectively. Similarly, in at least one example, elements shown as being adjacent or adjacent to each other may be adjacent or adjacent to each other, respectively. For example, components placed in coplanar contact with each other may be referred to as being in coplanar contact. For another example, in at least one example, elements positioned to be spaced apart from each other and having only space therebetween without other components may be described and referenced as such. For another example, elements shown as being located above / below each other, located on opposite sides of each other, or located on the left / right side of each other may be described and referenced as such relative to each other. In addition, as shown in the figure, in at least one example, the topmost element or the point of the element may be referred to as the "top" of the component, and the bottommost element or the point of the element may be referred to as the "bottom" of the component. As used herein, top / bottom, upper / lower, above / below may be relative to the vertical axis of the figure, and may be used to describe the position of the elements relative to each other in the figure. Thus, in one example, elements shown as being above other elements are positioned vertically above other elements. For another example, the shapes of the elements depicted in the figures may be referred to as having those shapes (e.g., such as being round, straight, planar, curved, rounded, chamfered, angled, etc.). In addition, in at least one example, elements shown as intersecting each other may be referred to as intersecting elements or intersecting each other. In addition, in one example, elements shown as being within another element or being shown as being outside another element may be described and referenced as such.

[0024] Figure 1 A block diagram of a system 100 according to one embodiment is depicted. In the illustrated embodiment, the system 100 is an imaging system, and more specifically an ultrasound imaging system. As shown, the system 100 includes an ultrasound probe 106, a user interface 122, a medical record system 124, and a remote connection subsystem 160. Multiple dashed lines 130 represent communication couplings between components of the system 100. Multiple solid lines 140 represent communication couplings between components of the ultrasound probe 106. These components may be separate but located in a common room, or may be remote from each other. For example, one or more of the modules described herein may operate in a data server that has a different and remote location for other components of the system 100, such as a probe and a user interface.

[0025] In the illustrated embodiment, the ultrasound probe 106 includes an ultrasound control system integrated into one or more PCBs 150 and a piezoelectric transducer including an array of elements 104, which are piezoelectric elements such as piezoelectric ceramics, high dielectric ceramics, single crystals, etc. The PCB 150 may include a controller 116, which may be part of a single processing unit (e.g., a processor) or distributed across multiple processing units. The controller 116 is configured to control the operation of the system 100, including, for example, image acquisition and image processing. In one example, the controller 116 of the PCB 150 controls the transmit beamformer 101 and the transmitter 102, which drives the elements 104 within the ultrasound probe 106 to transmit ultrasound signals (e.g., continuous or pulsed) into the body or volume (not shown) of the subject. The controller 116 receives control signals from the receiver 108, the receive beamformer 110, the radio frequency (RF) processor 112, and the memory 114.

[0026] The element 104 and the ultrasound probe 106 may have a variety of geometries. The ultrasound signal is backscattered from the in vivo structure (e.g., an inserted needle) to produce an echo that returns to the element 104. The echo is received by the receiver 108. The received echo is provided to the receive beamformer 110, which performs beamforming and outputs a radio frequency (RF) signal. The RF signal is then provided to an RF processor 112 that processes the RF signal. Alternatively, the RF processor 112 may include a complex demodulator (not shown) that demodulates the RF signal to form an I / Q data pair representing the echo signal. The RF or I / Q signal data may then be provided directly to the memory 114 for storage (e.g., temporary storage).

[0027] For example, the controller 116 may include an image processing module that receives image data (e.g., an ultrasound signal in the form of RF signal data or an I / Q data pair) and processes the image data. For example, the image processing module may process the ultrasound signal to generate two-dimensional (2D) slices or frames of ultrasound information (e.g., ultrasound images) or ultrasound waveforms (e.g., continuous or pulsed wave Doppler spectra or waveforms) for display to the operator. The image processing module may be configured to perform one or more processing operations based on a plurality of optional ultrasound modalities on the acquired ultrasound information. By way of example, ultrasound modalities may include color flow, acoustic radiation force imaging (ARFI), B mode, A mode, M mode, spectral Doppler, acoustic flow, tissue Doppler module, C scan, and elastic imaging. In addition, in some examples, one or more processing operations may include one or more image transformations, such as a Radon transform for identifying linear features in ultrasound images.

[0028] When echo signals are received, the acquired ultrasound information may be processed in real time during an imaging session (or scanning session). Additionally or alternatively, the ultrasound information may be temporarily stored in the memory 114 during the imaging session and processed in a less than real-time manner in real-time or offline operation. An image memory 120 is included, which is used to store processed slices or waveforms of acquired ultrasound information that are not scheduled for immediate display. The image memory 120 may include any known data storage medium, such as a permanent storage medium, a removable storage medium, etc. In addition, the image memory 120 may be a non-transitory storage medium.

[0029] In operation, the ultrasound system may acquire data (e.g., 2D data sets, spectral Doppler data sets, and / or volume data sets) through various techniques (e.g., three-dimensional (3D) scanning, real-time 3D imaging, volume scanning, 2D scanning using a probe with a positioning sensor, freehand scanning using voxel correlation techniques, scanning using a 2D or matrix array probe, etc.). An ultrasound spectrum (e.g., waveform) and / or image may be generated (at the controller 116) from the acquired data and displayed to an operator or user on the display device 118.

[0030] The controller 116 is operably connected to a user interface 122 that enables an operator to control at least some operations of the system 100. The ultrasound probe 106 may be communicatively coupled to the user interface 122 via one or more wireless networks. The controller 116 may also be coupled to a remote connection subsystem 160 that includes a remote connection interface 162 and a web server 164. Similarly, the controller 116 is communicatively coupled to a medical record system 124 that is configured to receive and / or store ultrasound image data. The medical record system 124 interacts with an imaging workstation 166. Thus, data and signal transmission between the ultrasound probe 106, the user interface 122, the medical record system 124, and the remote connection subsystem for generating, interpreting, and managing ultrasound images may be achieved via one or more wireless networks. The user interface 122 may include hardware, firmware, software, or a combination thereof that enables an individual (e.g., an operator) to directly or indirectly control the operation of the system 100 and its various components. As shown, the user interface 122 includes a display device 118 having a display area 117. In some embodiments, the user interface 122 may also include one or more user input devices 115, such as a physical keyboard, a mouse, and / or a touchpad. In one embodiment, a touchpad may be configured to the controller 116 and the display area 117 so that when the user moves a finger / glove / stylus on the surface of the touchpad, the cursor on the ultrasound image or Doppler spectrum on the display device 118 moves in a corresponding manner.

[0031] In an exemplary embodiment, the display device 118 is a touch-sensitive display (e.g., a touch screen) that can detect the presence of an operator's touch on the display area 117 and can also identify the location of the touch in the display area 117. The touch can be applied by, for example, at least one of an individual's hand, a glove, a stylus, etc. In this way, the touch-sensitive display can also be characterized as a user input device configured to receive input from an operator (such as a request to adjust or update the orientation of the displayed image). The display device 118 also communicates information from the controller 116 to the operator by displaying the information to the operator. The display device 118 and / or the user interface 122 can also perform audio communication. The display device 118 is configured to present information to the operator during or after an imaging or data acquisition session. The information presented can include an ultrasound image (e.g., one or more 2D frames), graphic elements, measurement graphics of the displayed image, user-selectable elements, user settings, and other information (e.g., administrative information, patient's personal information, etc.).

[0032] In addition to the image processing module, the controller 116 may also include one or more of a graphics module, an initialization module, a tracking module, and an analysis module. The image processing module, the graphics module, the initialization module, the tracking module, and / or the analysis module may coordinate with each other to present information to the operator during and / or after the imaging session. For example, the image processing module may be configured to display the acquired image on the display device 118, and the graphics module may be configured to display a specified graphic with the displayed image, such as an optional icon related to the image (e.g., an image rotation icon) and a measurement parameter (e.g., data).

[0033] The screen of the display area 117 of the display device 118 is composed of a series of pixels that display data acquired using the ultrasound probe 106. The acquired data includes one or more imaging parameters calculated for each pixel or a group of pixels of the display (e.g., a group of pixels assigned the same parameter value), wherein the one or more calculated image parameters include one or more of intensity, velocity (e.g., blood flow velocity), color blood flow velocity, texture, granularity, contractility, deformation, and deformation rate values. This series of pixels then constitutes a display image and / or Doppler spectrum generated from the acquired ultrasound data.

[0034] Now go to Figure 2 and Figure 3 , shows an example of a conventional transducer assembly for an ultrasound probe. Figure 2 A cross-sectional view of a first example of a conventional transducer assembly 200 is shown. Figures 2 to 10A coordinate system 299 is provided for reference. The zx plane may correspond to the azimuth plane, and the yz plane may correspond to the elevation plane. The transducer assembly 200 may be included in an ultrasound probe including a housing (not shown) in which the transducer assembly 200 is positioned. The transducer assembly 200 includes an acoustic module 214 (e.g., an electroacoustic module (EAM)). The acoustic module 214 may include an acoustic stack 215 and one or more ASICs 216. The acoustic module 214 is in contact with one or more PCBs 222 via a flexible interconnect 202. The flexible interconnect 202 may be positioned between the acoustic stack 215 and the ASIC 216. The transducer assembly 200 may include an acoustic backing 218 positioned to contact the ASIC 216. The acoustic backing 218 may be configured to achieve isolation from an ultrasonic signal. The acoustic backing 218 may also contact a heat sink 220. In some examples, the heat sink 220 is a heat sink. Heat sink 220 may be positioned on a side of acoustic backing 218 opposite the side directly coupled to ASIC 216. Heat sink 220 may be configured to remove heat from transducer assembly 200 to reduce degradation and improve device performance.

[0035] The flexible interconnect 202 may include a flat flexible electrical interconnect device including conductive traces in a flexible insulating material. Electrical signals may be transmitted between the acoustic module 214 and one or more PCBs 222. The flexible interconnect 202 may include one or more bends or folds that span an elevation plane (e.g., from an xy plane to an xz plane (e.g., an azimuth plane)) so that contact may be made between the acoustic module 214 and one or more PCBs 222. In some examples, the flexible interconnect 202 may include a first side section 206, a top section 208, and a second side section 204 opposite to the first side section 206. The first bend 212 may transition between the first side section 206 and the top section 208, and the second bend 210 may transition between the top section 208 and the second side section 204.

[0036] The one or more PCBs 222 of the transducer assembly 200 may be oriented along the azimuth plane. The size of the one or more PCBs 222 of the ultrasound probe defines the size of the handle of the probe along the azimuth direction. The width of the ultrasound probe (e.g., along the y-axis) may be a limiting factor for the application of the probe. The single bend on each side across the elevation plane and the majority of the contact with the one or more PCBs along the z-axis may result in a probe that is wider than may be used for certain applications such as cardiac approaches requiring intercostal imaging.

[0037] Figure 3A cross-sectional view of a second example of a conventional ultrasound probe 300 is shown. The ultrasound probe 300 includes a housing including a lens 302 positioned around a transducer assembly 301. In some examples, the transducer assembly 301 includes an acoustic module 304 including an acoustic stack 350 and an ASIC 308. A flexible interconnect 306 may be positioned between and in contact with the acoustic stack 350 and the ASIC 308, and may be configured to send signals received from the acoustic stack 350 and / or the ASIC 308 to one or more PCBs 312. The ASIC 308 may further contact an acoustic backing 310 on an opposite side away from the flexible interconnect 306. The acoustic backing 310 may be configured to isolate acoustic signals.

[0038] The flexible interconnect 306 may include a plurality of bends or folds so that it can contact one or more PCBs 312 of the transducer assembly 301. For example, on both the first side and the second side, the flexible interconnect 306 may include a first bend 318, a second bend 320, and a third bend 322. The first bend and the second bend may form an obtuse angle, and the third bend may include a 180-degree turn. The one or more PCBs 312 of the ultrasound probe 300 may be oriented along an elevation plane. The width of the elevation plane may be defined by the size of the one or more PCBs 312 in the elevation direction. The width of the ultrasound probe 300 in the elevation direction may be less than the length in the azimuth direction.

[0039] With one or more PCBs aligned parallel to the elevation plane, the size or compact size of one or more PCBs 312 can be configured for application in an ultrasound probe 300, such as for intercostal imaging, and can therefore be smaller than an ideal or practical size to enable intercostal imaging and maintain user comfort and grip.

[0040] An ultrasound probe with one or more double-folded flexible interconnects is presented herein, which allow contact between an acoustic module and one or more PCBs positioned along an azimuth plane while keeping the elevation aperture small, such as can be used for specific applications such as intercostal imaging. The at least double-bend configuration of one or more flexible interconnects can also increase the number of surfaces available for heat transfer, and can also reduce the number of surfaces available for heat transfer. The curved configuration is described herein as a double-bend configuration, but it should be understood that there can be more than two bends and the curved configuration is at least a double-bend configuration.

[0041] Now go to Figure 4 and Figure 5, respectively show a first flexible interconnector 400 and a second flexible interconnector 500 that may be included in a transducer assembly according to a first embodiment of the present disclosure. The first flexible interconnector 400 and the second flexible interconnector 500 may be flat flexible electrical interconnects that include conductive traces within a flexible insulating material. The first flexible interconnector 400 and the second flexible interconnector 500 may be included in a transducer assembly of an ultrasound probe, such as the reference Figures 6 to 8 Further explanation. Figure 4 and Figure 5 The first flexible interconnector 400 and the second flexible interconnector 500 are respectively shown in an unfolded state, and Figures 6 to 8 Shown in a folded state.

[0042] In some examples, the first flexible interconnect 400 and the second flexible interconnect 500 and other flexible interconnects described herein can be made of a thin layer of polyamide or any other type of plastic that can withstand high temperatures and is highly resistant to chemicals and radiation. In some examples, the circuit can then be printed onto the polyamide layer using copper traces or conductive inks that form electrical traces.

[0043] The first flexible interconnect 400 may include a plurality of bends, including a first bend 404 and a second bend 406. The first bend 404 may transition between a first section 412 and a second section 414. The second bend 406 may transition between a second section 414 and a third section 416. In some examples, the first section 412 may include a first connector 402 and one or more capacitors 410. The capacitor 410 may be configured for electrical decoupling. In other examples, there may be no capacitor. The first connector 402 may be configured as a connector coupled to a PCB that contacts the flexible interconnect 400 within the ultrasound probe. In some examples, the second section 414 may include passive components 408 such as capacitors, resistors, inductors, diodes, thermistors, etc., but in other examples, there may be no passive components.

[0044] The second flexible interconnect 500 may include a similar plurality of bends, including a first bend line 504 and a second bend line 506. The first bend line 504 may transition between the first section 512 and the second section 514. The second bend line 506 may transition between the second section 514 and the third section 516. In some examples, the first section 512 may include a second connector 502 and a capacitor 510. In other examples, the capacitor 510 may not be present. The second connector 502 may be configured as a connector coupled to a PCB that contacts the flexible interconnect 500 within the ultrasound probe. In some examples, the second section 514 may include passive components 508 such as capacitors, resistors, inductors, diodes, thermistors, etc. In other examples, the passive components 508 may not be present. In some examples, each bend described herein may be 90 degrees when assembled. In other examples, the angles of the bends may vary.

[0045] In some examples, the passive component 408 of the first flexible interconnect may be positioned closer to the first bend 404 than the passive component 508 of the second flexible interconnect may be positioned closer to the first bend 504. In this way, the design of the two flexible interconnects may allow connection to a PCB that is not centered within the transducer assembly. In other examples, the passive components of each flexible interconnect may be positioned in the same location when the PCB is centered or may not exist.

[0046] Figures 6 to 8 The relative positioning of the first flexible interconnect 400 and the second flexible interconnect 500 within the ultrasound probe when assembled is shown and similar part numbers are used accordingly. Figure 6 A cutaway perspective view of an ultrasound probe 600 is shown. The ultrasound probe 600 includes a nosepiece 620 in which a transducer assembly 601 is housed. The nosepiece 620 may include a lens 622. When packaged, the lens 622 may be positioned on top of the transducer assembly 601 (e.g., relative to the z-axis) and may be configured to contact a patient being imaged.

[0047] The transducer assembly 601 may include one or more flexible interconnects, including a first flexible interconnect 400 and a second flexible interconnect 500. As previously described, the first flexible interconnect 400 and the second flexible interconnect 500 may be flat flexible electrical interconnects that include conductive traces within a flexible insulating material. The first flexible interconnect 400 and the second flexible interconnect 500 may be positioned and configured to contact the acoustic module 632. In some examples, the acoustic module 632 is an EAM that includes an acoustic stack 630 and / or one or more ASICs (not shown). The acoustic stack 630 and other acoustic stacks described herein may include an array of piezoelectric elements that are configured to generate and / or receive acoustic signals entering or leaving the patient being imaged. Due to the dual-bend configuration, the first flexible interconnect 400 and the second flexible interconnect 500 may be further positioned and configured to contact one or more PCBs 624. In some examples, the first flexible interconnect 400 may be a reference Figure 4 The first flexible interconnector 400 described above, and the second flexible interconnector 500 may be a reference Figure 5 Each of the first flexible interconnect 400 and the second flexible interconnect 500 may be supported by a structural stiffener such as stiffener 616 .

[0048] One or more PCBs 624 and other PCBs of the transducer assembly described herein may include single-sided boards, double-sided boards, or multi-layer boards. In one example, one or more PCBs 624 may include reference Figure 1 The main circuit board of the ultrasound control system described above. For example, the one or more PCBs 624 may include one or more of the following: transmitter and receiver channels for generating and processing ultrasound signals; analog-to-digital converters for converting analog transducer signals into digital signals; digital circuitry for performing beamforming, filtering, and other algorithms for processing ultrasound data; memory including RAM and / or flash memory; complex programmable logic devices (CPLDs); and control circuitry including one or more microcontrollers.

[0049] Similar to reference Figure 4 As described, the first flexible interconnector 400 can be divided into a first section 412, a second section 412, and a third section 416, wherein the first bend 404 transitions between the first section 412 and the second section 412, and the second bend 406 transitions between the second section 412 and the third section 416. Although not shown in FIG. Figure 6, but the second flexible interconnect 500 can be partitioned and bent in a similar manner. The first section 412 can be positioned parallel to the azimuth plane (e.g., the xz plane). The second section 412 can be positioned parallel to the elevation plane (e.g., the yz plane). The third section 416 can be positioned parallel to the xy plane (e.g., parallel to the acoustic module 632). In some examples, when assembling the transducer assembly 601, each of the first bend 404 and the second bend 406 can be a 90-degree bend, so that each of the first section 412, the second section 414, and the third section 416 can be perpendicular to each of the other sections. In this way, the first flexible interconnect 400 and the second flexible interconnect 500 can make it possible to connect between the acoustic module 632 in a first direction (e.g., the xy plane) and one or more PCBs 624 in a second direction (e.g., the azimuth plane), which can reduce the occupied area and / or aperture in the elevation direction. Furthermore, the double-bend configuration may make it possible to increase the amount of surface of the flexible interconnect that is available for, for example, heat transfer and / or heat dissipation purposes.

[0050] The first section 412 may be positioned toward the first side 690 of the ultrasound probe 600. The second section 412 may be positioned toward the first end 694 of the ultrasound probe 600, wherein the first end 694 is vertically adjacent to the first side 690. The first section 512 of the second flexible interconnect 500 (which is located at Figure 6 The second section 514 of the second flexible interconnect 500 may be positioned toward the second side 692 opposite the first side 690, and the second section 514 of the second flexible interconnect 500 may be positioned toward the second end 696 opposite the first end 694. The third section 416 of the first flexible interconnect 400 and the third section 516 of the second flexible interconnect 500 (which is not clearly visible in FIG. 1 ) may be positioned toward the second side 692 opposite the first side 690, and the second section 514 of the second flexible interconnect 500 may be positioned toward the second end 696 opposite the first end 694. Figure 6 The first section 412 may be parallel to and in contact with the stiffener 616, wherein the stiffener may be positioned along the azimuth plane and directed toward the first side 690. In some examples, another backing may be positioned toward the second side 692, and may be parallel to and in contact with the first section 512 of the second flexible interconnect 500.

[0051] The third section 416 of the first flexible interconnect 400 can be positioned in the same xy plane as the third section 516 of the second flexible interconnect 500, wherein the third section 416 is positioned toward the first end 694 and the third section 516 of the second flexible interconnect 500 is positioned toward the second end 696. By positioning the respective corresponding sections of the first flexible interconnect 400 and the second flexible interconnect 500 relative to each other within the ultrasound probe 600, the amount of surface available for both heat transfer and for contact with the ASIC and the PCB is increased.

[0052] At least one PCB 624 may be included in the transducer assembly 601. The at least one PCB 624 may be positioned parallel to the azimuth plane and thus may be parallel to the first section 412 of the first flexible interconnect 400 (and parallel to the first section 412 of the first flexible interconnect 400) when the transducer assembly 601 is assembled. Figure 6 The first flexible interconnect 400 and the second flexible interconnect 500 may be parallel to the first section of the second flexible interconnect 500 not visible in the figure). At least one PCB 624 may be positioned between the first sections along the y-axis. Each of the first flexible interconnect 400 and the second flexible interconnect 500 may be oriented so that the corresponding connector may face inwardly toward the at least one PCB 624, as shown in FIG. Figure 7 What I see.

[0053] Now go to Figure 7 , shows another cross-sectional perspective view of the ultrasound probe 600 according to the first embodiment of the present disclosure. The second flexible interconnector 500 may include a first section 512, a second section 514 and a third section 516, which are Figure 7 Not clearly visible in the reference. Figures 4 to 6 As described, the first flexible interconnect 400 (specifically the first section 412 of the first flexible interconnect 400) may include a first connector 402. Similarly, the second flexible interconnect 500 (specifically the first section 512) may include a second connector 502. The first connector 402 may be configured to be coupled to a first corresponding connector 706 of at least one PCB 624. The second connector 502 may be configured to be coupled to a second corresponding connector 712 of at least one PCB 624. The first connector 402 and the second connector 502 may be configured to be different shapes so that they are respectively connected to the first corresponding connector 706 and the second corresponding connector 712 of different shapes from each other. In this way, the first flexible interconnect 400 and the second flexible interconnect 500 and the at least one PCB 624 may be configured to make assembly more efficient. In addition, the different shapes may play a poka-yoke role to prevent or avoid assembly errors. For example, the first connector 402 and the second connector 502 and the corresponding connectors 706, 712 may be mezzanine connectors.

[0054] In some examples, the capacitors 410 and 510 (if present) can be positioned such that an open space 720 is formed between the capacitors and the at least one PCB 624 when the transducer assembly 601 is assembled. In addition, the double-folded configuration of the first flexible interconnect 400 and the second flexible interconnect 500 facilitates the formation of the open space 720, whereby the second sections 414, 514 are spaced apart from each other on opposite sides along the azimuth direction, so that the open space 720 can be formed therebetween.

[0055] The ultrasound probe 600 may also include an acoustic stack 630. The acoustic stack 630 may contact the first flexible interconnect 400 and the second flexible interconnect 500 at the third section 416 of the first flexible interconnect 400 and the third section 516 of the second flexible interconnect 500. In some examples, the first flexible interconnect 400 and the second flexible interconnect 500 may further contact the ASIC 730 so that the third sections 416, 516 of the first flexible interconnect 400 and the second flexible interconnect 500 are directly positioned between the acoustic stack 630 and the ASIC 730. The ASIC 730 may further contact the acoustic backing 716 on the opposite side, rather than contacting the third section of the flexible interconnect. For example, the bottom side of the ASIC 730 may contact the acoustic backing 716, and the top side of the ASIC 730 may contact the flexible interconnect. The first flexible interconnect 400 and the second flexible interconnect 500 may be positioned between the acoustic stack 630 and the ASIC 730, for example, the top surface of the third section of the first flexible interconnect 400 and the second flexible interconnect 500 may be in coplanar contact with the bottom surface of the acoustic stack 630, and the bottom surface of the third section 416, 516 of the first flexible interconnect 400 and the second flexible interconnect 500 may be in coplanar contact with the top surface of the ASIC 730. In this way, contact between the flexible interconnect and the acoustic module may be maintained, and the acoustic backing may be more easily blocked and / or absorbed by the acoustic module. Figure 7 As can be seen, a gap 722 may exist between the bottom surface of the acoustic backing 716 and the first and second portions of the first and second flexible interconnects 400, 500 so that a space for accommodating and / or placing a heat dissipation device (e.g., a heat sink, a heat pipe, etc.) may be formed.

[0056] Figure 8One or more PCBs 624 are shown in a perspective view of the second side 692 and the second end 696. The one or more PCBs 624 can be configured to be positioned within the probe 600 and connected to the first flexible interconnect 400 and the second flexible interconnect 500 in only one direction. For example, the first corresponding connector 706 of the PCB 624 can be configured to be coupled to the first connector 402 of the first flexible interconnect 400, but not to the second connector 502 of the second flexible interconnect 500. In this way, the efficiency of assembly can be improved.

[0057] The double-bend configuration of each of the first and second flexible interconnects can increase the amount of surface available for heat dissipation. As discussed, the double-bend configuration can make it possible to form gaps 722, which increase the space laterally and below (e.g., below the bottom surface) of the backing 716 where a heat exchanger can be mounted. This can reduce any increase in footprint caused by adding heat dissipation devices to the exterior facing surface (particularly in the elevation direction).

[0058] Each flexible interconnect and the placement of the flexible interconnect within the probe can be configured to reduce the footprint along the elevation plane while maintaining contact between the acoustic module and one or more PCBs. In some examples, reducing the footprint in the elevation direction can make it possible to use the ultrasound probe 600 in a wider range of applications. For example, for imaging scenarios that require the lens 622 of the ultrasound probe 600 to be placed such as for cardiac ultrasound imaging, the footprint of the probe 600 in the elevation direction is directly related to the function of placing the ultrasound probe 600 to pass through the intercostal space for imaging. In addition, the footprint in the azimuth direction can be directly related to one or more PCBs positioned along the azimuth direction, and one or more PCBs can be selected for user comfort and ergonomics. In this way, the double-bend configuration of the flexible interconnect makes it possible to optimize the footprint of the probe 600 to achieve usage, comfort and ergonomics while maintaining heat transfer functions and acoustic modulation.

[0059] It should be understood that although the transducer assembly 601 is described herein as including two flexible interconnects, in some examples, the transducer assembly 601 may include only one flexible interconnect. For example, the third sections 416 and 516 may be formed as part of the same section so that there is a single flexible interconnect with two sides, wherein each of the two sides has at least a double-bend configuration. As another example, a transducer assembly with a flexible interconnect having a single wing having at least a double-bend configuration has been envisioned.

[0060] In addition, as previously described, it should be understood that although a double-bend configuration is described herein, in some examples, the flexible interconnect may include more than two bends, such as a triple-bend configuration. These bends may be 90 degrees or other suitable angles as previously described.

[0061] Now go to Fig. 9 and Fig.10 , shows an ultrasound probe 900 according to a second embodiment of the present disclosure. Fig. 9 An ultrasound probe 900 is shown as seen from a cutaway perspective view illustrating the location of one or more PCBs within the housing. Fig.10 An ultrasound probe 900 is shown as seen from a cutaway perspective view illustrating the configuration and location of one or more interconnects.

[0062] Similar to the ultrasound probe 600, the ultrasound probe 900 includes a transducer assembly 950 housed within a nosepiece 920. The housing 920 may include a lens 922 configured to contact the patient during image acquisition. The transducer assembly 950 may include one or more interconnects configured with a double-bend configuration, and in some examples may include two flexible interconnects. For example, the transducer assembly 950 includes a first flexible interconnect 902 and a second flexible interconnect 914. The first flexible interconnect 902 may include a first segment 904, a second segment 906, and a third segment 1002, wherein the first bend 916 transitions between the first segment 904 and the second segment 906, and the second bend 1006 transitions between the second segment 906 and the third segment 1002. Similarly, the second flexible interconnect 914 may include a first segment 908 , a second segment 910 , and a third segment 1004 , wherein a first bend 918 transitions between the first segment 908 and the second segment 910 , and a second bend 1008 transitions between the second segment 910 and the third segment 1004 .

[0063] The third sections 1002, 1004 of the first flexible interconnect 902 and the second flexible interconnect 914 can both contact the acoustic module 1020, respectively. In some examples, the acoustic module 1020 can include an acoustic stack 1012 and an ASIC 1010. The lens 922 of the nosepiece 920 can be positioned on (e.g., covering) the acoustic module 1020, and can be positioned against the patient so that the acoustic module transmits the generated ultrasonic signal through the patient and receives the ultrasonic signal. The third sections 1002, 1004 can be positioned between the acoustic stack 1012 and the ASIC 1010. The first sections 904, 908 of the first flexible interconnect 902 and the second flexible interconnect 914 can each include a connector, for example, the first section 904 can include a first connector 930, and the first section 908 can include a second connector 932. The first connector 930 and the second connector 932 can be configured to be connected to one or more PCBs 924. For example, the first connector 930 may be configured to connect to a first PCB 934, and the second connector 932 may be configured to connect to a second PCB 936. The first flexible interconnect 902 and the second flexible interconnect 914 may be configured to transmit signals from the acoustic stack 1012 and / or the ASIC 1010 to one or more PCBs 924. The first connector 930 and the second connector 932 may include edge board connectors, 90 degree board-to-board connectors, etc. to send signals from the acoustic module 1020 directly to one or more PCBs. In some examples, each edge board connector may be configured to couple to a corresponding PCB.

[0064] The first sections 904, 908 can be made parallel to the acoustic module 1020, for example, parallel to the xy plane, and the first sections 904, 908 are positioned along the azimuth plane (e.g., the xz plane) to which the one or more PCBs 924 are connected via the first connector 930 and the second connector 932, respectively. Therefore, the flexible interconnector can contact the acoustic module in the first plane, and connect to one or more PCBs in the second plane, wherein the second plane is perpendicular to the first plane. In this way, the footprint in the elevation direction (e.g., along the yz plane) can be reduced. In some examples, reducing the elevation aperture and footprint can make it possible to use the ultrasound probe 900 in applications such as intercostal imaging applications that require a small elevation footprint. Therefore, the double-bend configuration of the first flexible interconnector 902 and the second flexible interconnector 914 can make it possible to make a direct connection between the acoustic module 1020 and the one or more PCBs 924 without excessively increasing the elevation footprint or the azimuth footprint. In this way, user comfort and ergonomics can be optimized, and applicability for various applications can be improved.

[0065] In addition, an acoustic backing 940 may be positioned directly below and in contact with the ASIC 1010 to provide isolation from the generated ultrasonic signals. The acoustic backing 940 may be separated from the first sections 904, 908 by a gap 942 to allow placement of heat dissipation / heat transfer devices (e.g., heat sinks) during assembly as previously described. The double-bend configuration of the first flexible interconnect 902 and the second flexible interconnect 914 with the separated second sections 906, 910 may allow placement of such devices, thereby allowing for improved cooling of the assembly and reduced assembly degradation.

[0066] Similar to what was described above, it should be understood that while the transducer assembly 950 is described herein as including two flexible interconnects, in some examples, the transducer assembly 950 may include only one flexible interconnect. For example, the third segments 1002 and 1004 may be formed as part of the same segment such that there is a single flexible interconnect with two sides, wherein each of the two sides has a double-bend configuration. As another example, a transducer assembly with a flexible interconnect having a single wing having two or more bends has been envisioned.

[0067] Fig.11 A flow chart illustrating a method 1100 for manufacturing an ultrasound probe including folding a flexible interconnect twice during assembly is shown. Figures 6 to 10 The method 1100 is described with respect to the first embodiment or the second embodiment described above, however it should be understood that the method 1100 may be implemented to produce other examples without departing from the scope of the present disclosure.

[0068] At 1102, method 1100 may include attaching an acoustic stack to a top of each third segment of the first flexible interconnect and the second flexible interconnect. In this case, the top may refer to an exterior of a lens of the third segment that is positioned to face the nosepiece of the ultrasound probe. In some examples, a first side of the acoustic stack may be attached to the third segment of the first flexible interconnect, and a second side of the acoustic stack may be attached to the third segment of the second flexible interconnect, wherein the first side and the second side are opposite to each other along an azimuth direction (e.g., an x-axis of coordinate system 299).

[0069] At 1104, method 1100 may include attaching one or more ASICs to the bottom of each third segment of the first and second flexible interconnects. In this case, the bottom may refer to the outer surface of the third segment that is positioned away from the nose of the housing of the ultrasound probe. In this way, the one or more ASICs may be positioned on the side of the third segment opposite the acoustic stack. Thus, the third segments of the first and second flexible interconnects may be parallel to the acoustic module and directly positioned between and in contact with the acoustic stack and the one or more ASICs.

[0070] At 1106, the method 1100 may include folding each of the first and second flexible interconnects by 90 degrees along a corresponding second bend. The second bend as referred to herein may be a second bend (e.g., second bend 406 and second bend 1006) of the first flexible interconnect of the ultrasound probe 600 and the ultrasound probe 900 and a second bend (e.g., second bend 1008) of the second flexible interconnect of the ultrasound probe 600 and the ultrasound probe 900. Folding each of the first and second flexible interconnects by 90 degrees along a corresponding second bend may cause the second section of each of the first and second flexible interconnects to be parallel to the elevation plane (e.g., the yz plane of the coordinate system 299) and perpendicular to the acoustic module.

[0071] At 1108, method 1100 may include positioning one or more PCBs along an azimuthal plane (e.g., an xz plane of coordinate system 299). Positioning the one or more PCBs may include positioning the one or more PCBs below the one or more ASICs within the transducer assembly. The one or more PCBs may be aligned along the z-axis to match the position of the connector along the z-axis of the first flexible interconnect and the second flexible interconnect.

[0072] At 1110, method 1100 may include folding each of the first flexible interconnect and the second flexible interconnect by 90 degrees along a corresponding first bend. In some examples, the first bend may be a first bend (e.g., first bend 404 or first bend 916) of the first flexible interconnect of the ultrasound probe 600 or the ultrasound probe 900 and a first bend (e.g., first bend 918) of the second flexible interconnect of the ultrasound probe 600 or the ultrasound probe 900. When manufacturing the ultrasound probe according to the first embodiment, one or more PCBs may be positioned before or, in some examples, after folding at the first bend. When manufacturing the ultrasound probe according to the second embodiment, one or more PCBs may be positioned after folding at the first bend. In some embodiments, as described in reference to Figures 6 to 8As described above, folding 90 degrees along the corresponding first bend can make the corresponding first segment parallel to the azimuth plane. Figures 9 and 10 As described above, folding 90 degrees along the corresponding first bend can make the first section parallel to the third section and the acoustic module.

[0073] Although it is described herein that the first flexible interconnect and the second flexible interconnect can be folded along the corresponding first bend and / or the corresponding second bend at the same time, it should be understood that the first flexible interconnect can be folded along its first bend and second bend before or after the second flexible interconnect is folded along its first bend and second bend. In addition, it should be understood that in some examples, the first bend can be folded before the second bend. In addition, in some scenarios, the PCB can be positioned after the double bend of the two flexible interconnects, as shown at 1108.

[0074] At 1112, method 1100 may include connecting the flexible interconnect to one or more PCBs via a connector. Figures 6 to 10 Described, each flexible interconnector in the first flexible interconnector and the second flexible interconnector may include a connector. The connector may be attached to the first section of each flexible connector or otherwise configured as a part of the first section of each flexible connector. The connector may be positioned on the inner exterior of each first section so as to face toward one or more PCBs positioned between the first sections of the flexible interconnector along the x-axis. In some embodiments, one or more PCBs may include corresponding corresponding connectors for coupling to the connectors of the first flexible interconnector and the second flexible interconnector. In other embodiments, the connectors of the first flexible interconnector and the second flexible interconnector may be configured as edge board connectors, 90-degree board-to-board connectors, or other types of connectors configured to be directly connected to the edge of the corresponding PCB.

[0075] At 1114, method 1100 may include packaging the transducer assembly into a probe housing. For example, the housing may be a layered construction including, for example, a plastic shell exterior, a method shield, an acoustic insulator, and in some examples, may include a phase change chamber. It should be understood that additional components such as heat sinks may be assembled as part of the transducer assembly and packaged into the probe housing.

[0076] The technical effect of the systems and methods provided herein is the contact between the acoustic module of the transducer assembly of the ultrasound probe and one or more PCBs, while maintaining the reduced footprint of the probe in the elevation direction via one or more interconnects having a double-bend configuration. In addition, the double-bend configuration can increase the amount of surface available for heat dissipation purposes, thereby reducing component degradation of the transducer assembly. The result of the systems and methods herein is a compact ultrasound probe that is configured to improve applicability for various applications including intercostal imaging, as well as improve user comfort and ergonomics.

[0077] The present disclosure also provides a support for an ultrasound probe, the support comprising: a housing, a transducer assembly positioned inside the housing, the transducer assembly comprising: an acoustic module, one or more printed circuit boards (PCBs) and one or more flexible interconnects, the one or more flexible interconnects being configured to have at least a double-bend configuration, wherein the one or more flexible interconnects contact the acoustic module and the one or more PCBs. In a first example of the system, each of the one or more flexible interconnects is partitioned into a first section, a second section, and a third section. In a second example of the system that optionally includes the first example, each of the one or more flexible interconnects includes a first bend and a second bend, wherein the first bend transitions between the first section and the second section, and the second bend transitions between the second section and the third section. In a third example of the system that optionally includes one or both of the first example and the second example, the one or more PCBs are positioned parallel to the azimuth plane. In a fourth example of the system that optionally includes one or more or each of the first to third examples, the first section of each of the one or more flexible interconnects is positioned parallel to the azimuth plane, the second section of each of the one or more flexible interconnects is positioned parallel to the elevation plane, and the third section of each of the one or more flexible interconnects is positioned parallel to the acoustic module. In a fifth example of the system that optionally includes one or more or each of the first to fourth examples, the acoustic module is an electroacoustic module (EAM) including an acoustic stack and an application specific integrated circuit (ASIC), and wherein the one or more flexible interconnects are positioned between the acoustic stack of the acoustic module and the ASIC. In a sixth example of the system that optionally includes one or more or each of the first to fifth examples, the third section of each of the one or more flexible interconnects is positioned between and in contact with the acoustic stack of the acoustic module and the ASIC.

[0078] The present disclosure also provides a support for a transducer assembly of an ultrasound probe, the support comprising: an acoustic module, at least one flexible interconnector, and one or more circuit boards, wherein the acoustic module comprises an acoustic stack, each flexible interconnector comprises a first segment, a second segment, and a third segment, the first segment of each of the at least one flexible interconnector is coupled to the acoustic module, wherein the third segment of each of the at least one flexible interconnector is coupled to the one or more circuit boards, wherein each of the at least one flexible interconnector comprises a first bend between the first segment and the second segment and a second bend between the second segment and the third segment. In a first example of the system, the first segment of each of the at least one flexible interconnector is positioned to contact and be parallel to the acoustic module, and the second segment of each of the at least one flexible interconnector is positioned to be parallel to the elevation plane of the transducer assembly. In a second example of the system that optionally includes the first example, the third segment of each of the at least one flexible interconnector comprises a connector to connect to one of the one or more circuit boards. In a third example of the system, which optionally includes one or both of the first and second examples, the connector of the third section of each flexible interconnect of at least one flexible interconnect is configured to connect to the corresponding connector of the corresponding circuit board. In a fourth example of the system, which optionally includes one or more or each of the first to third examples, the connector of the third section of each flexible interconnect of at least one flexible interconnect is configured to connect to the edge of the corresponding PCB. In a fifth example of the system, which optionally includes one or more or each of the first to fourth examples, each flexible interconnect of at least one flexible interconnect is configured to have at least a double-bend configuration, including at least a first bend and a second bend. In a sixth example of the system, which optionally includes one or more or each of the first to fifth examples, the first bend and the second bend are 90-degree bends. In a seventh example of the system, which optionally includes one or more or each of the first to sixth examples, the first bend and the second bend are less than or greater than 90-degree bends. In an eighth example of the system that optionally includes one or more or each of the first to seventh examples, the first flexible interconnect and the second flexible interconnect are configured to connect signals from the acoustic module in a first direction to one or more circuit boards in a second direction.

[0079] The present disclosure also provides a support for a method, the method comprising folding one or more flexible interconnects of a transducer assembly of an ultrasound probe twice, and connecting the one or more flexible interconnects to one or more printed circuit boards (PCBs) of the transducer assembly. In a first example of the method, the one or more flexible interconnects contact at least one of an acoustic stack and an ASIC of an acoustic module. In a second example of the method that optionally includes the first example, the one or more flexible interconnects each include a flexible electrical interconnect device that includes a conductive trace. In a third example of the method that optionally includes one or both of the first and second examples, the one or more flexible interconnects are each configured to send a signal from an acoustic module to one or more PCBs.

[0080] As used herein, the elements or steps listed in the singular and beginning with the word "one" or "a kind of" should be understood as not excluding a plurality of said elements or steps, unless such exclusion is explicitly stated. In addition, the reference to "one embodiment" of the present invention is not intended to be interpreted as excluding the existence of additional embodiments that also include the cited features. In addition, unless explicitly stated to the contrary, "comprising", "including" or "having" an embodiment of an element or multiple elements with a specific characteristic may include additional such elements that do not have the characteristic. The terms "including" and "in..." are used as the concise language equivalents of the corresponding terms "including" and "wherein". In addition, the terms "first", "second" and "third" etc. are only used as marks, and are not intended to impose numerical requirements or specific positional order on their objects.

[0081] This written description uses examples to disclose the invention, including the best mode, and also to enable a person skilled in the relevant art to practice the invention, including making and using any devices or systems and performing any included methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to a person skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insignificant differences from the literal language of the claims.

Claims

1. An ultrasonic probe (600), comprising: Housing (920); A transducer assembly (601), the transducer assembly being positioned inside the housing, the transducer assembly comprising: Acoustic Module (632); one or more printed circuit boards (PCBs) (624); and One or more flexible interconnects (400, 500) configured to have at least a double-bend configuration, wherein the one or more flexible interconnects contact the acoustic module and the one or more PCBs.

2. The ultrasound probe according to claim 1, wherein each of the one or more flexible interconnects (400, 500) is partitioned into a first section (412, 512), a second section (414, 514) and a third section (416, 516).

3. The ultrasound probe of claim 2, wherein each of the one or more flexible interconnects (400, 500) comprises a first bend (404, 504) and a second bend (406, 506), wherein the first bend transitions between the first segment (412, 512) and the second segment (414, 514), and the second bend transitions between the second segment and the third segment (416, 516).

4. The ultrasound probe of claim 1, wherein the one or more PCBs (624) are positioned parallel to an azimuth plane.

5. The ultrasound probe according to claim 2, wherein the first section (412, 512) of each of the one or more flexible interconnects (400, 500) is positioned parallel to an azimuth plane, the second section (414, 514) of each of the one or more flexible interconnects is positioned parallel to an elevation plane, and the third section (416, 516) of each of the one or more flexible interconnects is positioned parallel to the acoustic module (632).

6. An ultrasound probe according to claim 2, wherein the acoustic module (632) is an electroacoustic module (EAM) including an acoustic stack (630) and an application specific integrated circuit (ASIC) (730), and wherein the one or more flexible interconnects are positioned between the acoustic stack and the ASIC of the acoustic module.

7. The ultrasound probe according to claim 6, wherein the third section (416, 516) of each of the one or more flexible interconnects (400, 500) is positioned between and in contact with the acoustic stack (630) of the acoustic module and the ASIC (730).

8. The ultrasound probe of claim 2, wherein the third section (416, 516) of each of the one or more flexible interconnects (400, 500) comprises a connector (402, 502) to connect to one of the one or more PCBs (624).

9. The ultrasound probe of claim 8, wherein the connector (402, 502) of the third section of each of the at least one flexible interconnect is configured to connect to a corresponding connector (706, 712) of a corresponding PCB (624).

10. The ultrasound probe of claim 8, wherein the connector (930, 932) of the third section of each of the one or more flexible interconnects is configured to connect to an edge of a corresponding PCB (924).

11. The ultrasound probe according to claim 3, wherein the first bend (404, 504) and the second bend (406, 506) are 90 degree bends.

12. A method comprising: Folding one or more flexible interconnects of a transducer assembly of an ultrasound probe twice (1106, 1110); as well as The one or more flexible interconnects are connected to one or more printed circuit boards (PCBs) of the transducer assembly (1112).

13. The method of claim 12, wherein the one or more flexible interconnects (400, 500) contact at least one of an acoustic stack (630) and an ASIC (730) of an acoustic module (632).

14. The method of claim 12, wherein the one or more flexible interconnects (400, 500) each comprise a flexible electrical interconnect device comprising a conductive trace.

15. The method of claim 13, wherein the one or more flexible interconnects (400, 500) are each configured to transmit a signal from the acoustic module (632) to the one or more PCBs (624).

Images