Ultrasonic gas phase cleaning machine for chip processing

Abstract

The invention discloses an ultrasonic gas-phase cleaning machine for chip processing, and relates to the field of ultrasonic gas-phase cleaning, the ultrasonic gas-phase cleaning machine comprises a case with a storage bin arranged on the front side, the storage bin is arranged on the outer surface of the case and used for temporarily placing a chip and cleaning liquid, a button plate is fixedly connected to one end, close to a placing table, of the case, and the ultrasonic gas-phase cleaning machine further comprises a cleaning bin, a closed environment for cleaning the chip is provided; the cover plate unit is used for sealing and covering the cleaning bin and has the function of isolating large stains; the bearing unit is used for placing the chip and ensuring that the chip is stably placed in the cleaning process; and the gas phase circulation unit is used for releasing cleaning liquid steam, condensing, purifying and recycling the cleaning liquid and realizing cyclic utilization, the gas phase circulation unit can heat and evaporate the cleaning liquid and spray the cleaning liquid in a spraying state during working, and impurities on the to-be-processed chip are removed along with the clamping of ultrasonic waves, so that the cleaning efficiency is improved. And meanwhile, the gas phase circulating unit can purify the condensed cleaning liquid and realize cyclic utilization.

Description

Technical Field

[0001] The invention relates to the technical field of ultrasonic gas phase cleaning, in particular to an ultrasonic gas phase cleaning machine for chip processing. Background Art

[0002] Ultrasonic gas phase cleaning is an advanced cleaning process that combines the advantages of ultrasonic technology and gas phase cleaning. It first heats the cleaning liquid to evaporate into the gas phase, so that the cleaning liquid molecules can more easily penetrate into the tiny gaps and complex structures of the objects to be cleaned. At the same time, the ultrasonic generator is used to generate high-frequency vibrations, which are converted into mechanical vibrations through the transducer to induce cavitation in the gas phase environment. Countless tiny bubbles are rapidly generated, expanded and burst on the surface of the object, generating a strong impact force to peel off and disperse dirt and impurities. This cleaning method combines the penetration advantages of the gas phase with the efficient peeling ability of ultrasound. It can effectively remove grease, particulate pollutants and organic residues on the surface of various precision parts, such as chips, optical lenses, etc., and has little damage to the object and high cleaning efficiency. It is especially suitable for fields with extremely high requirements for cleanliness and precision.

[0003] During the ultrasonic vapor cleaning process, the cleaning liquid needs to be condensed and recovered. However, during the recovery process, dust, grease and other substances in the chip may be present in the cleaning liquid. If it is used directly without purification, these substances will adhere to the subsequent chip surface. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention solves the technical problems by adopting the following technical solutions: an ultrasonic gas phase cleaning machine for chip processing according to the present invention comprises a chassis with a storage bin on the front, a storage bin on the outer surface of the chassis for temporarily placing chips and cleaning liquid, a button board fixedly connected to one end of the chassis close to the placement table, and further comprising: The cleaning chamber provides a closed environment for cleaning chips; The cover unit is used to cover the cleaning chamber and isolate larger stains; The carrier unit is used to place the chip and ensure that the chip is firmly placed during the cleaning process; A gas phase circulation unit, used to release the cleaning liquid vapor, condense and purify the recovered cleaning liquid and realize recycling; The cleaning chamber includes a partition arranged in the middle section, which separates the cleaning chamber into an upper and lower chamber. The upper chamber is used for cleaning chips, and the lower chamber is used for condensing and recovering cleaning liquid. A support plate 1 is symmetrically arranged on the top of the partition, and an ultrasonic reflector with a reflective surface having a specific curvature and texture is arranged on the support plate 1, which is used to reflect and focus ultrasonic waves to every corner of the chamber to ensure that every part of the chip can be uniformly subjected to ultrasonic action. A water inlet is fixedly connected to the outer surface of the partition, and an inclined surface is arranged on the lower chamber.

[0005] Preferably, the cleaning chamber is arranged on the top of the chassis, the cover plate unit is placed on the top of the cleaning chamber, and the gas phase circulation unit is arranged on the inner wall of the cleaning chamber.

[0006] Preferably, the cover unit includes a sealing cover wrapped with a high-precision rubber sealing ring to ensure a sealing effect, a handle is fixedly connected to the top of the sealing cover, a support rod 1 is fixedly connected to the bottom of the sealing cover, and a filter plate that can cover the water inlet is fixedly connected to the bottom of the support rod 1 to separate larger impurities in the cleaning liquid.

[0007] Preferably, the bottom of the sealing cover contacts the top of the cleaning bin, and the bottom of the filter plate contacts the top of the water inlet.

[0008] Preferably, the carrying unit includes a servo motor, the output end of the servo motor is fixedly connected to a rotating shaft, the end of the rotating shaft away from the servo motor is fixedly connected to a placement plate, the placement plate is provided with a groove designed on its surface and accurately matches the shape of the chip, the inner wall of the placement plate is provided with a clamping block, and magnetic blocks are symmetrically provided on both sides of the placement plate, the clamping blocks are used to place the chip to be processed, which can ensure that the chip to be processed is firmly placed during the cleaning process to avoid displacement due to ultrasonic vibration, and the outer surface of the placement plate is fixedly connected to a water brushing mechanism.

[0009] Preferably, the water brushing mechanism includes a second support rod, the outer surface of the second support rod is slidably connected to a sliding block, the outer surface of the sliding block is provided with a second support plate, the inner wall of the second support plate is fixedly connected to a telescopic spring, the end of the telescopic spring close to the chip is fixedly connected to a movable plate, the outer surface of the movable plate is fixedly connected to a soft brush, and the two ends of the movable plate are fixedly connected to two magnetic blocks that attract each other with the first magnetic block.

[0010] Preferably, the outer surface of the servo motor 1 is fixedly connected to the inner wall of the cleaning chamber, and the upper and lower ends of the support rod 2 are fixedly connected to the outer surface of the placement plate.

[0011] Preferably, the gas phase circulation unit includes a liquid pumping machine, which is provided with a water inlet end, and the cleaning liquid on the inclined surface will flow into the liquid pumping machine through the water inlet end. The outer surface of the liquid pumping machine is fixedly connected with a transmission pipe, and a purification mechanism is provided on the transmission pipe. The top of the transmission pipe is fixedly connected with a heating evaporator, and the heating evaporator adopts microchannel heating technology, which can quickly heat the cleaning liquid to the boiling point and produce uniform steam. The outer surface of the heating evaporator is provided with a spray device, which is composed of a plurality of high-precision atomizing nozzles, and can evenly spray steam into the chamber in the form of extremely fine droplets, which are in full contact with the chip surface.

[0012] Preferably, the purification mechanism includes a support plate three, a separation block fixedly connected by screws is provided at the bottom of the support plate three, and the separation block can be removed, side panels are symmetrically provided at both ends of the support plate three, the inner wall of the side panel is fixedly connected with a sliding rod, the outer surface of the sliding rod is slidably connected with a moving block, the outer surface of the moving block is fixedly connected with a membrane clamp, and the inner wall of the membrane clamp is placed with multiple layers of filter membranes.

[0013] Preferably, the outer surface of the pumping machine is fixedly connected to the bottom of the chassis, and the support plate three is arranged on the outer surface of the transmission pipe.

[0014] The beneficial effects of the present invention are as follows: 1. The present invention provides a cover plate unit. After the sealing cover is covered on the cleaning chamber, when the chip to be processed is cleaned, the stains on the chip will be cleaned and fall onto the partition. At the same time, since the steam is finally cooled and condensed into a cleaning liquid in the cleaning chamber and flows into the inclined surface through the water inlet, after the sealing cover is covered, the filter plate will also cover the water inlet, thereby preventing larger impurity particles from entering the water inlet along the water flow and causing the water inlet to be blocked. When the sealing cover is taken away, the filter plate will also be taken away for easy cleaning.

[0015] 2. The present invention sets a carrying unit. When the chip to be processed is placed between the clamping blocks, the servo motor drives the rotating shaft to rotate, thereby driving the placement plate and the chip to be processed to rotate steplessly within the range of 0-360°. This rotation design allows all surfaces of the chip to be fully exposed to the ultrasonic field and the cleaning liquid vapor, thereby improving the uniformity of cleaning.

[0016] 3. The present invention sets a water brushing mechanism. When the support plate 2 moves to the chip to be processed, the magnetic block 1 will attract the magnetic block 2, so that the telescopic spring is stretched, and the moving plate will drive the soft brush to contact the chip to be processed. The soft brush can not only further remove impurities from the chip surface, but also can brush off the water layer attached to the surface of the chip to be processed after the bubbles are broken. The water layer will hinder the contact between the bubbles and impurities, thereby affecting the effect of gas phase cleaning.

[0017] 4. The present invention sets a purification mechanism. After the cleaning liquid enters the support plate three, it will come into contact with the multi-layer filter membrane. The water flow impact force of the cleaning liquid will make the multi-layer filter membrane of the moving block be on the top of the sliding rod. However, with the long-term adsorption and purification of the multi-layer filter membrane, impurities will adhere to the multi-layer filter membrane, thereby making the filtering effect of the multi-layer filter membrane worse. At the same time, the gravity of the multi-layer filter membrane will become greater and greater until the impact force of the water flow can no longer move the moving block. The multi-layer filter membrane will be at the separation block. At this time, the separation block can be disassembled to replace the multi-layer filter membrane. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1It is a structural schematic diagram of the present invention.

[0019] Figure 2 It is a top view of the structure of the present invention.

[0020] Figure 3 It is a structural schematic diagram of the cover plate unit of the present invention.

[0021] Figure 4 It is a structural schematic diagram of the cleaning bin of the present invention.

[0022] Figure 5 It is a structural schematic diagram of the bearing unit of the present invention.

[0023] Figure 6 It is a structural schematic diagram of the water brushing mechanism of the present invention.

[0024] Figure 7 It is a structural sectional view of the water brushing mechanism of the present invention.

[0025] Figure 8 It is a schematic structural diagram of the gas phase circulation unit of the present invention.

[0026] Fig. 9 It is a structural schematic diagram of the purification mechanism of the present invention.

[0027] Fig.10 It is a structural sectional view of the purification mechanism of the present invention.

[0028] In the figure: 1, chassis; 2, placement table; 3, storage bin; 4, cleaning bin; 5, cover unit; 6, bearing unit; 7, gas phase circulation unit; 8, button board; 51, sealing cover; 52, handle; 53, support rod 1; 54, filter plate; 41, partition; 42, support plate 1; 43, water inlet; 44, high-frequency ultrasonic transducer; 45, inclined plane; 46, ultrasonic reflector; 61, servo motor; 62, rotating shaft; 63, placement board; 64, clamping block; 65, magnetic block 1; 66, chip to be processed; 6 7. Water brushing mechanism; 671. Support rod 2; 672. Sliding block; 673. Support plate 2; 674. Telescopic spring; 675. Moving plate; 676. Magnetic block 2; 677. Soft brush; 71. Liquid pump; 72. Transmission pipe; 73. Water inlet; 74. Purification mechanism; 75. Heating evaporator; 76. Spray device; 741. Support plate 3; 742. Side plate; 743. Separation block; 744. Screw; 745. Sliding rod; 746. Moving block; 747. Membrane clamp; 748. Multi-layer filter membrane. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0030] Example 1, using Figure 1-Figure 10 An ultrasonic gas phase cleaning machine for chip processing according to one embodiment of the present invention is described as follows.

[0031] like Figure 1-Figure 2 As shown, an ultrasonic gas phase cleaning machine for chip processing of the present invention comprises a case 1 with a storage bin 3 provided on the front, a storage bin 3 provided on the outer surface of the case 1 for temporarily placing chips and cleaning liquid, a button plate 8 is fixedly connected to one end of the case 1 close to the placement table 2, and further comprises: The cleaning chamber 4 provides a closed environment for cleaning the chips; The cover plate unit 5 is used to cover the cleaning chamber 4 and has the function of isolating larger stains, and the size of the isolated stains is related to the aperture size of the filter plate 54; A carrying unit 6, used to place the chip and ensure that the chip is firmly placed during the cleaning process; The gas phase circulation unit 7 is used to release the cleaning liquid vapor, condense and purify the recovered cleaning liquid and realize recycling; When the present invention is working, the chip to be processed 66 is first placed in the carrier unit 6, and then the cover unit 5 is covered in the cleaning chamber 4. Then the gas circulation unit 7 heats and evaporates the cleaning liquid and sprays it in a spray state, accompanied by ultrasonic blessing, so as to remove impurities on the chip to be processed 66. At the same time, the gas circulation unit 7 also purifies the condensed cleaning liquid and realizes recycling.

[0032] like Figure 4 As shown, the cleaning chamber 4 includes a partition 41 arranged in the middle section, and the partition 41 separates the cleaning chamber 4 into an upper chamber and an lower chamber. The upper chamber is used for cleaning chips, and the lower chamber is used for condensing and recovering cleaning liquid. A support plate 42 is symmetrically arranged on the top of the partition 41, and an ultrasonic reflector 46 with a reflective surface having a specific curvature and texture is arranged on the support plate 42, which is used to reflect and focus the ultrasonic wave to every corner of the chamber to ensure that every part of the chip can be uniformly subjected to the ultrasonic action. The outer surface of the partition 41 is fixedly connected to a water inlet 43, and a slope 45 is arranged on the lower chamber.

[0033] The cleaning chamber 4 is arranged on the top of the chassis 1 , the cover unit 5 is placed on the top of the cleaning chamber 4 , and the gas phase circulation unit 7 is arranged on the inner wall of the cleaning chamber 4 .

[0034] like Figure 3 As shown, the cover unit 5 includes a sealing cover 51 wrapped with a high-precision rubber sealing ring to ensure the sealing effect. A handle 52 is fixedly connected to the top of the sealing cover 51, and a support rod 53 is fixedly connected to the bottom of the sealing cover 51. The bottom of the support rod 53 is fixedly connected to a filter plate 54 that can cover the water inlet 43, which is used to separate larger impurities in the cleaning liquid.

[0035] After the sealing cover 51 is covered on the cleaning chamber 4, when the chip 66 to be processed is cleaned, the stains on the chip will be cleaned and fall onto the partition 41. At the same time, since the steam in the cleaning chamber 4 is finally cooled and condensed into a cleaning liquid and flows into the inclined surface 45 through the water inlet 43, after the sealing cover 51 is covered, the filter plate 54 will also cover the water inlet 43, thereby preventing larger impurity particles from entering the water inlet 43 along the water flow and causing the water inlet 43 to be blocked. When taking the sealing cover 51, the filter plate 54 will also be taken away for easy cleaning.

[0036] The bottom of the sealing cover 51 contacts the top of the cleaning chamber 4 , and the bottom of the filter plate 54 contacts the top of the water inlet 43 .

[0037] The specific workflow is as follows: During operation, the chip to be processed 66 is first placed in the carrier unit 6, and then the sealing cover 51 is covered. The frequency of the ultrasonic generating system, the rotation speed of the servo motor 61 in the carrier unit 6, and the steam flow rate and temperature of the gas phase cleaning liquid supply system are set. The high-frequency ultrasonic transducer 44 emits high-frequency ultrasonic waves to form a strong ultrasonic field in the cleaning chamber. The cavitation effect of the ultrasonic field produces a large number of tiny bubbles near the surface of the chip. These bubbles will generate strong impact force during the process of formation, growth and rupture, destroying the adhesion between the impurities on the chip surface and the chip, causing the impurities to fall off the chip surface. The rotating chip to be processed ensures that all parts of the chip can be evenly exposed to the action of ultrasound and cleaning liquid steam, further improving the cleaning effect.

[0038] Embodiment 2, use Figure 1-Figure 10 An ultrasonic gas phase cleaning machine for chip processing according to one embodiment of the present invention is described as follows.

[0039] like Figure 5As shown, an ultrasonic vapor cleaning machine for chip processing of the present invention is based on the first embodiment, and the carrying unit 6 includes a servo motor 61, and the output end of the servo motor 61 is fixedly connected to a rotating shaft 62, and the end of the rotating shaft 62 away from the servo motor 61 is fixedly connected to a placement plate 63, and the placement plate 63 is provided with a groove designed on its surface to accurately match the chip shape, and the inner wall of the placement plate 63 is provided with a clamping block 64, and magnetic blocks 65 are symmetrically provided on both sides of the placement plate 63. The clamping block 64 is used to place a chip 66 to be processed, which can ensure that the chip to be processed is firmly placed during the cleaning process to avoid displacement due to ultrasonic vibration, and the outer surface of the placement plate 63 is fixedly connected to a water brushing mechanism 67.

[0040] When the chip to be processed 66 is placed between the clamping blocks 64, the servo motor 61 will drive the rotating shaft 62 to rotate, thereby driving the placement plate 63 and the chip to be processed 66 to rotate steplessly within the range of 0-360°, and the rotation speed can be adjusted between 1-10 rpm according to the cleaning requirements. This rotation design allows all surfaces of the chip to be fully exposed to the ultrasonic field and the cleaning liquid vapor, thereby improving the uniformity of cleaning. During the rotation process, when the placement plate 63 is in a vertical state every once in a while, the servo motor 61 will stop running, thereby starting the water brushing mechanism 67 to work.

[0041] like Figure 6-Figure 7 As shown, the water brushing mechanism 67 includes a support rod 671, the outer surface of the support rod 671 is slidably connected to a sliding block 672, the outer surface of the sliding block 672 is provided with a support plate 673, the inner wall of the support plate 673 is fixedly connected to a telescopic spring 674, the end of the telescopic spring 674 close to the chip is fixedly connected to a movable plate 675, the outer surface of the movable plate 675 is fixedly connected to a soft brush 677, and the two ends of the movable plate 675 are fixedly connected to a magnetic block 676 that attracts the magnetic block 1 65.

[0042] When the support plate 673 is in a vertical state, the gravity of the sliding block 672 and the support plate 673 will cause the sliding block 672 to move downward along the support rod 671. When the support plate 673 moves to the chip 66 to be processed, the magnetic block 1 65 will attract the magnetic block 2 676, so that the telescopic spring 674 is stretched, and the moving plate 675 will drive the soft brush 677 to contact the chip 66 to be processed. The soft brush 677 can not only further remove impurities from the surface of the chip, but also brush off the water layer attached to the surface of the chip 66 to be processed after the bubbles are broken. The water layer will hinder the contact between the bubbles and impurities, thereby affecting the effect of gas phase cleaning.

[0043] The outer surface of the servo motor 611 is fixedly connected to the inner wall of the cleaning chamber 4 , and the upper and lower ends of the support rod 2 671 are fixedly connected to the outer surface of the placement plate 63 .

[0044] like Figure 8 As shown, the gas phase circulation unit 7 includes a pump 71, which is provided with a water inlet 73. The cleaning liquid on the inclined surface 45 will flow into the pump 71 through the water inlet 73. The outer surface of the pump 71 is fixedly connected with a transmission pipe 72, and a purification mechanism 74 is provided on the transmission pipe 72. The top of the transmission pipe 72 is fixedly connected with a heating evaporator 75. The heating evaporator 75 adopts microchannel heating technology, which can quickly heat the cleaning liquid to the boiling point and generate uniform steam. The outer surface of the heating evaporator 75 is provided with a spray device 76, which is composed of a plurality of high-precision atomizing nozzles, and can evenly spray the steam into the chamber in the form of extremely fine droplets to fully contact the chip surface.

[0045] Although the filter plate 54 can remove larger impurities in the cleaning liquid after condensation, tiny particulate impurities cannot be separated. After the cleaning liquid enters the water inlet 73, the pump will draw the cleaning liquid into the purification mechanism 74 for purification, and then it will enter the heating evaporator 75 to be heated into steam and sprayed out through the spray device 76.

[0046] like Figure 9-10 As shown, the purification mechanism 74 includes a support plate three 741, and a separation block 743 fixedly connected by a screw 744 is arranged at the bottom of the support plate three 741, and the separation block 743 can be removed. Side plates 742 are symmetrically arranged at both ends of the support plate three 741, and a sliding rod 745 is fixedly connected to the inner wall of the side plate 742, and a moving block 746 is slidably connected to the outer surface of the sliding rod 745, and a membrane clamp 747 is fixedly connected to the outer surface of the moving block 746, and a multi-layer filter membrane 748 is placed on the inner wall of the membrane clamp 747.

[0047] After the cleaning liquid enters the support plate three 741, it will come into contact with the multi-layer filter membrane 748. The impact force of the water flow of the cleaning liquid will cause the moving block 746 and the multi-layer filter membrane 748 to be at the top of the sliding rod 745. However, as the multi-layer filter membrane 748 is adsorbed and purified for a long time, impurities will adhere to the multi-layer filter membrane 748, thereby deteriorating the filtering effect of the multi-layer filter membrane 748. At the same time, the gravity of the multi-layer filter membrane 748 will become greater and greater until the impact force of the water flow can no longer move the moving block 746. The multi-layer filter membrane 748 will be at the separation block 743. At this time, the separation block 743 can be removed to replace the multi-layer filter membrane 748.

[0048] The outer surface of the pumping machine 71 is fixedly connected to the bottom of the chassis 1 , and the support plate 3 741 is arranged on the outer surface of the transmission tube 72 .

[0049] The specific workflow is as follows: During operation, first, when the servo motor 61 drives the chip 66 to be processed to rotate, each surface of the chip can be fully exposed to the ultrasonic field and the cleaning liquid vapor to improve the uniformity of cleaning. After a period of time, when the placement plate 63 is in a vertical state, the servo motor 61 will stop running, and the gravity of the sliding block 672 and the support plate 673 will cause the sliding block 672 to move downward along the support rod 671. When the support plate 673 moves to the chip 66 to be processed, the magnetic block 1 65 will attract the magnetic block 2 676, so that the telescopic spring 674 is stretched, and the moving plate 675 will drive the soft brush 677 to contact the chip 66 to be processed. The soft brush 677 can not only further remove impurities from the surface of the chip The bubbles can fall off and the water layer attached to the surface of the chip 66 to be processed after the bubbles are broken can be brushed off. Finally, after the cleaning liquid is condensed, it will enter the water inlet 73 and be pumped into the purification mechanism 74 by the pump for purification. Then it will enter the heating evaporator 75 to be heated into steam and sprayed out through the spray device 76. During the purification process, impurities will adhere to the multi-layer filter membrane 748, thereby deteriorating the filtering effect of the multi-layer filter membrane 748. At the same time, the gravity of the multi-layer filter membrane 748 will become greater and greater until the impact force of the water flow can no longer move the moving block 746. The multi-layer filter membrane 748 will be at the separation block 743. At this time, the separation block 743 can be disassembled to replace the multi-layer filter membrane 748.

[0050] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. An ultrasonic gas phase cleaning machine for chip processing, comprising a chassis with a storage bin on the front, a storage bin on the outer surface of the chassis for temporarily placing chips and cleaning liquid, a button board fixedly connected to one end of the chassis close to the placement table, characterized in that: Also includes: The cleaning chamber provides a closed environment for cleaning chips; The cover unit is used to cover the cleaning chamber and has the function of isolating stains; The carrier unit is used to place the chip and ensure that the chip is firmly placed during the cleaning process; A gas phase circulation unit, used to release the cleaning liquid vapor, condense and purify the recovered cleaning liquid and realize recycling; The cleaning chamber includes a partition arranged in the middle section, which separates the cleaning chamber into an upper chamber and an lower chamber. The upper chamber is used for cleaning chips, and the lower chamber is used for condensing and recovering cleaning liquid. A support plate 1 is symmetrically arranged on the top of the partition, and an ultrasonic reflector with a reflective surface having a curvature and texture is arranged on the support plate 1, which is used to reflect and focus ultrasonic waves to every corner of the chamber to ensure that every part of the chip can be uniformly subjected to ultrasonic action. A water inlet is fixedly connected to the outer surface of the partition, and an inclined surface is arranged on the lower chamber.

2. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The cleaning chamber is arranged on the top of the chassis, the cover plate unit is placed on the top of the cleaning chamber, and the gas phase circulation unit is arranged on the inner wall of the cleaning chamber.

3. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The cover unit includes a sealing cover wrapped with a rubber sealing ring to ensure the sealing effect. The top of the sealing cover is fixedly connected to a handle, the bottom of the sealing cover is fixedly connected to a support rod 1, and the bottom of the support rod 1 is fixedly connected to a filter plate that can cover the water inlet to separate impurities in the cleaning liquid.

4. The ultrasonic gas phase cleaning machine for chip processing according to claim 3, characterized in that: The bottom of the sealing cover contacts the top of the cleaning bin, and the bottom of the filter plate contacts the top of the water inlet.

5. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The carrying unit includes a servo motor, the output end of the servo motor is fixedly connected to a rotating shaft, the end of the rotating shaft away from the servo motor is fixedly connected to a placement plate, the placement plate is provided with a groove designed on its surface to match the chip shape, the inner wall of the placement plate is provided with a clamping block, and magnetic blocks are symmetrically provided on both sides of the placement plate. The clamping blocks are used to place the processed chip to ensure that the processed chip is firmly placed during the cleaning process to avoid displacement due to ultrasonic vibration, and the outer surface of the placement plate is fixedly connected to a water brushing mechanism.

6. The ultrasonic gas phase cleaning machine for chip processing according to claim 5, characterized in that: The water brushing mechanism includes a second support rod, the outer surface of the second support rod is slidably connected to a sliding block, the outer surface of the sliding block is provided with a second support plate, the inner wall of the second support plate is fixedly connected to a telescopic spring, the end of the telescopic spring close to the chip is fixedly connected to a movable plate, the outer surface of the movable plate is fixedly connected to a soft brush, and both ends of the movable plate are fixedly connected to a second magnetic block that attracts the first magnetic block.

7. The ultrasonic gas phase cleaning machine for chip processing according to claim 6, characterized in that: The outer surface of the servo motor 1 is fixedly connected to the inner wall of the cleaning chamber, and the upper and lower ends of the support rod 2 are fixedly connected to the outer surface of the placement plate.

8. The ultrasonic gas phase cleaning machine for chip processing according to claim 1, characterized in that: The gas phase circulation unit includes a pumping machine, which is provided with a water inlet end. The cleaning liquid on the inclined surface will flow into the pumping machine through the water inlet end. The outer surface of the pumping machine is fixedly connected with a transmission pipe, and a purification mechanism is provided on the transmission pipe. The top of the transmission pipe is fixedly connected with a heating evaporator. The heating evaporator adopts microchannel heating technology, which can heat the cleaning liquid to boiling point and generate uniform steam. The outer surface of the heating evaporator is provided with a spray device, which is composed of multiple atomizing nozzles, and can evenly spray steam into the chamber in the form of droplets to fully contact the chip surface.

9. The ultrasonic gas phase cleaning machine for chip processing according to claim 8, characterized in that: The purification mechanism includes a support plate three, a separation block fixedly connected by screws is arranged at the bottom of the support plate three, and the separation block can be removed. Side panels are symmetrically arranged at both ends of the support plate three, and the side panels are made of transparent glass. The inner wall of the side panel is fixedly connected with a sliding rod, and the outer surface of the sliding rod is slidably connected with a moving block, and the outer surface of the moving block is fixedly connected with a membrane clamping plate, and the inner wall of the membrane clamping plate is placed with multiple layers of filter membranes.

10. The ultrasonic gas phase cleaning machine for chip processing according to claim 9, characterized in that: The outer surface of the pumping machine is fixedly connected to the bottom of the chassis, and the support plate three is arranged on the outer surface of the transmission pipe.

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