Laser processing equipment

Abstract

The invention provides laser processing equipment. A rotatable lens assembly is arranged in a lens barrel; the rotatable lens assembly comprises a rotating support, a first lens and a rotating shaft. The rotating support is arranged in the lens barrel. The first lens is arranged on the rotating bracket; the other end of the rotating shaft is rotationally connected with the inner wall of the lens barrel; the rotating shaft deviates from the gravity center of the rotating support on the rotating support, so that the rotating support can be located at a first position under the action of gravity without external force, at the moment, the first lens is located on the light path of the light beam, and the laser processing equipment is in a first processing mode; when the rotating support rotates to the second position under the action of external force, the first lens is located outside the light path, the laser processing equipment is in the second processing mode, and the beam angle of the first processing mode is larger than or smaller than the beam angle of the second processing mode. An external driving structure is not needed for driving, and space and cost are saved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device. Background Art

[0002] With the development of laser modules themselves, the application field and market scope of laser processing equipment have become larger and larger in recent years, and the performance and user experience of laser processing equipment have also attracted more and more attention from the industry. Laser processing equipment focuses the laser beam on the substrate to be processed. The material absorbs the laser energy, generates a thermal excitation process in the irradiated area, and produces complex physical and chemical changes such as metamorphosis, melting, ablation, and evaporation to produce processing traces. In the actual processing process, when processing materials of different thicknesses and different materials, the laser focus position needs to be changed according to the different materials to achieve the best processing effect. Moreover, the requirements for beam quality are different when performing different processing modes. Some laser processing modes require that the focal spot of the laser beam focused on the surface of the processing substrate is small enough. The smaller the spot, the finer the processing. Other laser processing modes require a longer beam Rayleigh length or a smaller beam angle to achieve a certain processing depth. Therefore, in actual application, it is necessary to flexibly control the beam quality or beam focal length, and also to accurately control the distance between the laser module and the processing substrate to achieve the best effect.

[0003] When switching between different laser processing modes, the only way is to stop the processing, manually adjust the distance between the laser module and the processing substrate, and then restart the machine. This manual switching mode is inefficient and cannot achieve continuous and efficient switching between different laser processing modes, and cannot meet the needs of complex processing.

[0004] Therefore, how to provide a laser processing device that can efficiently switch between different laser processing modes and save space and cost has become a technical problem that needs to be solved. Summary of the invention

[0005] The present application provides a laser processing device that can continuously and efficiently switch between different laser processing modes and save space and cost.

[0006] In a first aspect, a laser processing device provided by an embodiment of the present application includes a laser emission module, a lens barrel, and a rotatable lens assembly, wherein the rotatable lens assembly is disposed in the lens barrel, and the laser emission module is used to emit a light beam; the rotatable lens assembly includes: A rotating bracket, wherein the rotating bracket is arranged in the lens barrel; A first lens, wherein the first lens is disposed on a first mounting surface of the rotating bracket; and a rotating shaft, one end of which is fixed to the rotating bracket, and the other end of which is rotatably connected to the inner wall of the lens barrel; the rotating shaft is arranged on the rotating bracket away from the center of gravity of the rotating bracket, so that the rotating bracket is located at a first position under the action of gravity; When the rotating bracket is located at the first position, the first lens is located on the optical path of the light beam, and the laser processing equipment is in a first processing mode; when the rotating bracket is rotated to the second position, the first lens is located outside the optical path, and the laser processing equipment is in a second processing mode, and the beam angle of the first processing mode is greater than or less than the beam angle of the second processing mode.

[0007] The laser processing equipment provided by the present application includes a laser emission module, a lens barrel and a rotatable lens assembly, the rotatable lens assembly is arranged in the lens barrel, and the laser emission module is used to emit a light beam; the rotatable lens assembly includes a rotating bracket, a first lens and a rotating shaft, and the rotating bracket is arranged in the lens barrel; the first lens is arranged on the first mounting surface of the rotating bracket; one end of the rotating shaft is fixed to the rotating bracket, and the other end is rotatably connected to the inner wall of the lens barrel; the rotating shaft is arranged on the rotating bracket deviating from the center of gravity of the rotating bracket, so that the rotating bracket can be located in the first position under the action of gravity in the absence of external force, at which time the first lens is located in the optical path of the light beam, and the laser processing equipment is in the first processing mode; when the rotating bracket rotates to the second position under the action of external force, the first lens is located outside the optical path, and the laser processing equipment is in the second processing mode, the light beam angle of the first processing mode is greater than or less than the light beam angle of the second processing mode, and in the present application, the rotating bracket switches from the second position to the first position under the action of its own gravity, without the need for an external driving structure to drive, thereby saving space and cost.

[0008] In an optional embodiment, the rotatable lens assembly also includes a second lens, which is arranged on a second mounting surface of the rotating bracket, and the second mounting surface is an intersecting surface with the first mounting surface; when the rotating bracket is rotated to the second position, the second lens is located in the optical path of the light beam; when the rotating bracket is rotated to the first position, the second lens is located outside the optical path of the light beam.

[0009] In an optional implementation, a height of the first mounting surface when the rotating bracket rotates to the first position is different from a height of the second mounting surface when the rotating bracket rotates to the second position.

[0010] In an optional embodiment, the height of the first lens in the optical path of the light beam is lower than the height of the second lens in the optical path of the light beam, the focal length of the first lens is smaller than the focal length of the second lens, and the height difference between the focus of the first lens and the focus of the second lens is less than or equal to a preset height difference.

[0011] In an optional implementation, the first mounting surface is perpendicular to the second mounting surface, and a first distance between the rotating shaft and the first mounting surface is smaller than a second distance between the rotating shaft and the second mounting surface.

[0012] In an optional embodiment, the laser processing equipment further includes a third lens, and the third lens is located on the optical path of the light beam; A through hole portion is provided on the second mounting surface of the rotating bracket. When the rotating bracket rotates to the second position, the through hole portion is located on the optical path of the light beam.

[0013] In an optional embodiment, a height difference between a focal position of the third lens when the rotating bracket is located at the second position and an equivalent focal point of the first lens and the third lens when the rotating bracket is located at the first position is less than or equal to a preset height difference. In an optional embodiment, the laser processing equipment further includes a driving member, and the driving member is at least used to drive the rotating bracket to switch from the first position to the second position.

[0014] In an optional embodiment, the driving member includes an electromagnetic coil and a magnetically attracted structure, the electromagnetic coil is attached to the inner wall of the lens barrel or embedded in the lens barrel, and the magnetically attracted structure is arranged at an end of the first mounting surface of the rotating bracket away from the second mounting surface; the electromagnetic coil is used to magnetically attract or repel the magnetically attracted structure, so that the magnetically attracted structure drives the rotating bracket to rotate to the second position.

[0015] In an optional embodiment, the laser processing equipment also includes a first clamping member and a second clamping member, and the first clamping member and the second clamping member are both fixed to the inner wall of the lens barrel, the first clamping member is used to engage the rotating bracket when the rotating bracket is located at the first position, and the second clamping member is used to engage the rotating bracket when the rotating bracket is located at the second position. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments are briefly introduced below.

[0017] Figure 1 It is a simplified structural schematic diagram of a laser processing device provided in an embodiment of the present application; Figure 2 This is a partial perspective structural diagram of a rotating bracket in a laser provided in an embodiment of the present application in a first position. Figure 1 ; Figure 3 The embodiment of the present application provides a partial perspective structure diagram of a rotating bracket in a laser in a second position. Figure 1 ; Figure 4 This is a partial perspective structural diagram of a rotating bracket in a laser provided in an embodiment of the present application in a first position. Figure 2 ; Figure 5 The embodiment of the present application provides a partial perspective structure diagram of a rotating bracket in a laser in a second position. Figure 2 ; Figure 6 This is a partial perspective structural diagram of a rotating bracket in a laser provided in an embodiment of the present application in a first position. Figure 3 ; Figure 7 The embodiment of the present application provides a partial perspective structure diagram of a rotating bracket in a laser in a second position. Figure 3 ; Figure 8 It is a partial perspective structural diagram of a laser provided in an embodiment of the present application; Fig. 9 This is a schematic structural diagram of a first rotating bracket provided in an embodiment of the present application, in which a first lens is provided in a first position; Fig.10 It is a structural schematic diagram of a second rotating bracket provided in an embodiment of the present application, in which a first lens and a second lens are provided in a first position; Fig.11 This is a schematic structural diagram of a third rotating bracket inside a lens barrel provided by an embodiment of the present application in a first position; Fig.12 This is a schematic structural diagram of a fourth rotating bracket in a lens barrel in a first position provided by an embodiment of the present application; Fig.13 It is a schematic diagram of the structure of a laser provided in an embodiment of the present application and also including a gas nozzle; Fig.14 It is a partial perspective structural diagram of a rotating bracket in a laser provided in an embodiment of the present application at a second position; Fig.15 is a structural schematic diagram of a rotating bracket provided in an embodiment of the present application in a second position; Fig.16 is a schematic diagram of a first emergent light beam formed when the rotating bracket provided in an embodiment of the present application is in the first position; Fig.17 is a schematic diagram of a second emergent light beam formed when the rotating bracket provided in an embodiment of the present application is in the second position; Fig.18 is a schematic structural diagram of a laser provided in an embodiment of the present application including a third lens and a first type of rotating bracket in a first position; Fig.19is a structural schematic diagram of a laser provided in an embodiment of the present application including a third lens and a first rotating bracket in a second position; Fig. 20 This is a schematic diagram of the first type of rotating bracket provided in the embodiment of the present application forming a first outgoing light beam when in the first position Figure 1 ; Fig.21 This is a schematic diagram of the first rotating bracket provided in the embodiment of the present application forming a second outgoing light beam when in the second position Figure 1 ; Fig. 22 This is a schematic diagram of the first type of rotating bracket provided in the embodiment of the present application forming a first outgoing light beam when in the first position Figure 2 ; Fig.23 This is a schematic diagram of the first rotating bracket provided in the embodiment of the present application forming a second outgoing light beam when in the second position Figure 2 ; Fig.24 It is a structural schematic diagram of a laser processing device provided by an embodiment of the present application in which a driving component is located in a certain position; Fig.25 is a schematic diagram of a structure in which a driving component is located in another position in a laser processing device provided by an embodiment of the present application; Fig.26 It is a structural schematic diagram of the first locking member in the lens barrel provided by the embodiment of the present application when the rotating bracket is locked in the first position; Fig. 27 It is a structural schematic diagram of the second locking member in the lens barrel provided by an embodiment of the present application when the rotating bracket is locked in the second position. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. In addition, the reference to "embodiment" or "implementation method" in the present application means that the specific features, structures or characteristics described in conjunction with the embodiments or implementation methods may be included in at least one embodiment of the present application. The appearance of the phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments.

[0019] The present application provides a laser processing device 1000. Applications of the laser processing device 1000 include but are not limited to engraving, cutting, welding, drilling, marking, 3D printing, etc. In this embodiment, the laser processing device 1000 can switch between different processing modes, for example, an engraving mode and a cutting mode.

[0020] See also Figure 1 , the laser processing equipment 1000 includes a laser 100. Optionally, the laser processing equipment 1000 also includes a z-direction drive motor 71, a z-guide rail (not shown), a host computer (not shown), and a controller (not shown). The z-direction drive motor 71 is connected to the laser 100, and is used to drive the laser 100 to move up and down in the z direction. The host computer refers to a computer that can directly issue control commands, and various signal changes are displayed on the screen. The controller electrically connects the host computer with the z-direction drive motor 71, the laser 100, other drive components, etc. The controller receives the working instructions of the host computer to control the z-direction drive motor 71, the laser 100, other drive components, etc.

[0021] The laser processing device 1000 further includes a guide rail assembly 73 along the x-direction, an x-direction drive motor 74, a guide rail assembly 75 along the y-axis direction, and a y-direction drive motor (not shown), so that the laser processing device 1000 can move along the x-direction and the y-direction.

[0022] See also Figure 2-Figure 7 The laser 100 includes a laser emission module 10, a lens barrel 20 and a rotatable lens assembly 30.

[0023] The laser emission module 10 is used to emit a laser beam. The present application does not specifically describe the type of the laser emission module 10. Optionally, the laser emission module 10 includes but is not limited to a solid laser module, a gas laser module, a semiconductor laser module, or a liquid laser module. The solid laser module has the characteristics of small device, firmness, ease of use, and high output power, and is often used in occasions requiring high power output, such as large laser processing equipment. The semiconductor laser module has the characteristics of small size, long life, firmness, and simple structure. The semiconductor laser module usually uses a laser diode as an energy source, and realizes the processing of materials by controlling the parameters of the laser beam. It is suitable for small or desktop engraving machines, and is also commonly used in DIY laser processing equipment 1000. Among them, the blue light engraving laser module is a laser module that uses a semiconductor laser diode as a laser source. Its operating wavelength is usually between 400 and 500 nanometers, has a high energy density and high precision, and is suitable for engraving of various materials such as stainless steel and glass. Gas laser modules have the characteristics of simple structure, low cost, easy operation, uniform medium, and long continuous working time. For example, CO2 laser modules are commonly used for cutting and engraving metal and non-metal materials. Its output light wavelength is 10.6μm, which is easy to absorb metal materials, and the speed of laser cutting and engraving is fast. Liquid laser modules have the characteristics of continuously adjustable output wavelength.

[0024] See also Figure 2-Figure 7The lens barrel 20 is in a hollow cylindrical shape. The lens barrel 20 is aligned with the light-emitting end of the laser emitting module 10 , or the laser emitting module 10 is disposed in the lens barrel 20 , so that the laser beam emitted by the laser emitting module 10 is emitted through the hollow cavity of the lens barrel 20 .

[0025] See also Figure 2-Figure 7 , the rotatable lens assembly 30 is arranged in the lens barrel 20. Optionally, the rotatable lens assembly 30 is installed in the lens barrel 20, and a lens is arranged in the rotatable lens assembly 30 to focus the laser beam to form a preset light spot on the target plane.

[0026] See also Figure 8 , Fig. 9 and Fig.10 The rotatable lens assembly 30 includes a rotating bracket 32 ​​, a first lens 31 and a rotating shaft 33 .

[0027] Taking the axial direction of the lens barrel 20 as the z direction as an example, the plane perpendicular to the lens barrel 20 is the xoy plane.

[0028] See also Figure 8 , Fig. 9 and Fig.10 The rotating bracket 32 ​​is disposed in the lens barrel 20 . One end of the rotating shaft 33 is fixed to the rotating bracket 32 ​​, and the other end of the rotating shaft 33 is rotatably connected to the inner wall of the lens barrel 20 .

[0029] Specifically, the extending direction of the rotating shaft 33 is located in the xoy plane. For example, the rotating shaft 33 extends along the x direction. The number of the rotating shaft 33 can be two, and the two rotating shafts 33 are respectively arranged on both sides of the rotating bracket 32, so that the rotating bracket 32 ​​can be smoothly rotated around the x direction in the lens barrel 20. In other embodiments, the rotating shaft 33 can also extend along the y direction. Specifically, the inner wall of the lens barrel 20 is provided with two relatively arranged rotating shaft holes, and the two rotating shafts 33 are respectively arranged in the rotating shaft holes and can rotate in the rotating shaft holes. In other embodiments, the rotating shaft 33 can be fixed to the lens barrel 20, and the rotating shaft hole can be arranged on the rotating bracket 32.

[0030] See also Figure 8 , Fig. 9 and Fig.10 The rotating bracket 32 ​​includes a plurality of mounting surfaces, and mounting holes are provided on the mounting surfaces. The lenses are installed in the mounting holes. Specifically, the rotating bracket 32 ​​includes a first mounting surface 311. The first lens 31 is provided on the first mounting surface 311 of the rotating bracket 32, and is installed in the first mounting hole on the first mounting surface 311. The first lens 31 includes but is not limited to a convex lens or a concave lens.

[0031] When the rotating bracket 32 ​​rotates along with the rotating shaft 33 in the lens barrel 20 , the first lens 31 also rotates.

[0032] The rotating shaft 33 is arranged on the rotating bracket 32 ​​away from the center of gravity of the rotating bracket 32, so that the rotating bracket 32 ​​is located at the first position N1 under the action of gravity. The rotating shaft 33 is arranged on the rotating bracket 32 ​​away from the center of gravity of the rotating bracket 32, which means that the line where the rotating shaft 33 is located does not pass through the center of gravity.

[0033] See also Figure 2-Figure 7 When the rotating bracket 32 ​​is located at the first position N1, the first lens 31 is located on the optical path of the light beam. The first lens 31 can focus the laser beam emitted by the laser emission module 10. The laser processing device 1000 is in a first processing mode. The first processing mode includes but is not limited to an engraving mode, a cutting mode, a welding mode, a drilling mode, a marking mode, and a 3D printing mode.

[0034] See also Figure 2-Figure 7 When the rotating bracket 32 ​​rotates to the second position N2, the first lens 31 is located outside the optical path. At this time, the laser beam emitted by the laser emission module 10 can be focused by other lenses. The laser processing equipment 1000 is in the second processing mode. The second processing mode includes but is not limited to engraving mode, cutting mode, welding mode, drilling mode, marking mode, and 3D printing mode.

[0035] In this embodiment, when the rotating bracket 32 ​​rotates to the first position N1 and the second position N2, the space occupied by the rotating bracket 32 ​​is small, so that switching between different modes can be achieved while reducing the space occupied by the rotating bracket 32, which is conducive to the miniaturization of the laser processing equipment 1000.

[0036] The beam angle of the first processing mode is greater than or less than the beam angle of the second processing mode. For example, the beam angle of the first processing mode is greater than the beam angle of the second processing mode, the first processing mode is an engraving mode, and the second processing mode is a cutting mode. Or, for another example, the beam angle of the first processing mode is less than the beam angle of the second processing mode, the first processing mode is a cutting mode, and the second processing mode is an engraving mode.

[0037] The requirements for the beam in the engraving mode and the cutting mode are different. For example, the laser engraving mode requires that the focal spot focused on the surface of the processing substrate is small enough. The smaller the spot, the finer the processing. The laser cutting mode requires a longer beam Rayleigh length or a smaller beam angle to achieve a certain cutting depth. The beam angle in the cutting mode is smaller than the beam angle in the engraving mode. Moreover, the ideal position of the focused spot in the engraving mode is on the surface of the processing substrate, and the ideal position in the cutting mode is that the focus of the spot is placed at a position about half the thickness of the processing substrate.

[0038] In traditional technology, the lens displacement is achieved by manually adjusting the focusing cap. The adjustment process requires people to observe the size of the laser spot and then repeatedly adjust the focal length of the laser according to the spot. The adjustment method is inconvenient, and observing the laser for a long time may cause certain harm to the user.

[0039] The laser processing equipment 1000 provided in the present application includes a laser emission module 10, a lens barrel 20 and a rotatable lens assembly 30. The rotatable lens assembly 30 is arranged in the lens barrel 20. The laser emission module 10 is used to emit a light beam; the rotatable lens assembly 30 includes a rotating bracket 32, a first lens 31 and a rotating shaft 33. The rotating bracket 32 ​​is arranged in the lens barrel 20; the first lens 31 is arranged on the first mounting surface 311 of the rotating bracket 32; one end of the rotating shaft 33 is fixed to the rotating bracket 32, and the other end is rotatably connected to the inner wall of the lens barrel 20; the rotating shaft 33 is arranged on the rotating bracket 32 ​​away from the center of gravity of the rotating bracket 32, so that the rotating bracket 32 ​​can rotate without external force. It can be located in the first position N1 under the action of gravity, at which time the first lens 31 is located on the optical path of the light beam, and the laser processing equipment 1000 is in the first processing mode; when the rotating bracket 32 ​​is rotated to the second position N2 under the action of external force, the first lens 31 is located outside the optical path, and the laser processing equipment 1000 is in the second processing mode. The beam angle of the first processing mode is greater than or less than the beam angle of the second processing mode. When switching to the first processing mode, the external force can be removed and the rotating bracket 32 ​​can return to the first position N1 under the action of its own gravity. While realizing continuous and efficient switching between different laser processing modes, no external driving structure is required to drive it, saving space and cost.

[0040] For further optional information, see Fig. 9 The rotating bracket 32 ​​further includes a second mounting surface 312. The second mounting surface 312 and the first mounting surface 311 are intersecting surfaces.

[0041] The present application does not specifically describe the rotation angle of the rotating bracket 32 ​​from the first position N1 to the second position N2. The rotation angle of the rotating bracket 32 ​​from the first position N1 to the second position N2 can be an obtuse angle, a right angle, or an acute angle, and can even be greater than 180°. Among them, the sum of the angle between the first mounting surface 311 and the second mounting surface 312 and the minimum rotation angle between the first position N1 and the second position N2 is 180°. In this embodiment, the first mounting surface 311 is perpendicular to the second mounting surface 312, and the minimum rotation angle between the first position N1 and the second position N2 is 90°. In this way, the rotating bracket 32 ​​is a relatively regular structure, which is easy to process and form, and occupies a relatively small space.

[0042] See also Fig. 9In an optional embodiment, a second mounting hole is provided on the second mounting surface 312, and the second mounting hole is empty. When the rotating bracket 32 ​​rotates from the first position N1 to the second position N2, the laser beam passes through the second mounting hole.

[0043] For example, see Figure 2 , Figure 8 , Fig. 9 , the rotating bracket 32 ​​is located at the first position N1 without external force (under gravity). At the first position N1, the center of gravity of the rotating bracket 32 ​​is located below the reference plane S1 parallel to the xoy plane where the rotating shaft 33 is located, that is, with the reference plane S1 where the rotating shaft 33 is located as the interface, the weight of the part of the rotating bracket 32 ​​located above the reference plane S1 is less than the weight of the part located below the reference plane S1. At this time, the center of gravity of the rotating shaft 33 bracket is located below the rotating shaft 33, and the rotating shaft 33 bracket is in a relatively stable state.

[0044] The first lens 31 is a convex lens. After passing through the first lens 31, the light beam shrinks, the light beam angle increases, and the light spot position is raised, which can be applied to the engraving mode.

[0045] For example, see Figure 3 , Figure 8 , Fig. 9 , the rotating bracket 32 ​​is located at the second position N2 under the action of the driving force. The second mounting surface 312 rotates to a position facing the laser beam. The second mounting hole of the second mounting surface 312 is empty, and the laser beam directly passes through the second mounting hole. Figure 2 In the implementation mode, since a convex lens is not provided, the beam angle is reduced and the spot position is lowered, and it can be applied to the cutting mode.

[0046] For example, see Figure 4 , Figure 8 , Fig. 9 , the rotating bracket 32 ​​is located at the first position N1 without external force (under gravity). At the first position N1, the center of gravity of the rotating bracket 32 ​​is located below the reference plane S1 parallel to the xoy plane where the rotating shaft 33 is located, that is, with the reference plane S1 where the rotating shaft 33 is located as the interface, the weight of the part of the rotating bracket 32 ​​located above the reference plane S1 is less than the weight of the part located below the reference plane S1. At this time, the center of gravity of the rotating shaft 33 bracket is located below the rotating shaft 33, and the rotating shaft 33 bracket is in a relatively stable state.

[0047] The first lens 31 is a concave lens. After the light beam passes through the first lens 31, it is elongated, the beam angle is reduced, and the spot position is lowered, which can be applied to the cutting mode.

[0048] For example, see Figure 5 , Figure 8 , Fig. 9, the rotating bracket 32 ​​is located at the second position N2 under the action of the driving force. The second mounting surface 312 rotates to a position facing the laser beam. The second mounting hole of the second mounting surface 312 is empty, and the laser beam directly passes through the second mounting hole. Figure 4 In the implementation mode, since no concave lens is provided, the beam angle is increased, the light spot position is raised, and it can be applied to the engraving mode.

[0049] Further optionally, the first mounting surface 311 is perpendicular to the second mounting surface 312. A first distance between the rotating shaft 33 and the first mounting surface 311 is smaller than a second distance between the rotating shaft 33 and the second mounting surface 312. In this way, in this embodiment, when the rotating bracket 32 ​​rotates to the first position N1, the height of the first mounting surface 311 is smaller than the height of the second mounting surface 312 when the rotating bracket 32 ​​rotates to the second position N2.

[0050] For further optional information, see Fig.10 The rotatable lens assembly 30 further includes a second lens 34. The second lens 34 is disposed on the second mounting surface 312 of the rotating bracket 32 ​​and is mounted in a second mounting hole on the second mounting surface 312.

[0051] When the rotating bracket 32 ​​rotates along with the rotating shaft 33 in the lens barrel 20 , the first lens 31 and the second lens 34 also rotate accordingly.

[0052] The rotating shaft 33 is arranged on the rotating bracket 32 ​​deviating from the center of gravity of the rotating bracket 32, so that the rotating bracket 32 ​​is located at the first position N1 under the action of gravity, and the first lens 31 is located on the light beam path. The rotating shaft 33 is arranged on the rotating bracket 32 ​​deviating from the center of gravity of the rotating bracket 32 ​​means that the line where the rotating shaft 33 is located does not pass through the center of gravity. Of course, the rotating bracket 32 ​​can also be located at the second position N2 under the action of force, and the second lens 34 is located on the light beam path. Among them, the first lens 31 is a convex lens, and the second lens 34 is a concave lens; or, the second lens 34 is a convex lens, and the first lens 31 is a concave lens.

[0053] For example, see Figure 6 , Figure 8 , Fig.10 , the rotating bracket 32 ​​is located at the first position N1 without external force (under gravity). At the first position N1, the center of gravity of the rotating bracket 32 ​​is located below the reference plane S1 parallel to the xoy plane where the rotating shaft 33 is located, that is, with the reference plane S1 where the rotating shaft 33 is located as the interface, the weight of the part of the rotating bracket 32 ​​located above the reference plane S1 is less than the weight of the part located below the reference plane S1. At this time, the center of gravity of the rotating shaft 33 bracket is located below the rotating shaft 33, and the rotating shaft 33 bracket is in a relatively stable state.

[0054] The first lens 31 is a convex lens. After passing through the first lens 31, the light beam shrinks, the light beam angle increases, and the light spot position is raised, which can be applied to the engraving mode.

[0055] For example, see Figure 7 , Figure 8 , Fig.10 , the rotating bracket 32 ​​is located at the second position N2 under the action of the driving force. The second mounting surface 312 rotates to a position facing the laser beam. The second lens 34 of the second mounting surface 312 is in the path of the laser beam. The second lens 34 is a concave lens. Figure 6 , the light beam is elongated after passing through the second lens 34, the beam angle is reduced, and the spot position is lowered, which can be applied to the cutting mode.

[0056] Of course, in other embodiments, the first lens 31 is a concave lens, the second lens 34 is a convex lens, and the rotating bracket 32 ​​is located at the first position N1, which can be applied to the cutting mode; the rotating bracket 32 ​​is located at the second position N2, which can be applied to the engraving mode.

[0057] The present application does not specifically limit the shape of the rotating bracket 32. Optionally, the rotating bracket 32 ​​may be a rectangular block, a triangular block, a polyhedral block, a sphere, a hemisphere, etc.

[0058] In this embodiment, the structure of the rotating bracket 32 ​​is designed to achieve that the rotating bracket 32 ​​can return to the first position from the second position under the action of its own gravity without external force, and the laser processing equipment 1000 switches from the second processing mode to the first processing mode. In other words, the laser processing equipment does not require a driving structure when switching from the second processing mode to the first processing mode, which reduces the setting of the driving structure, saves space and cost, and is also conducive to the miniaturization of the laser processing equipment 1000.

[0059] Furthermore, in this embodiment, the first lens 31 and the second mounting hole are respectively arranged on two vertical surfaces of the rotating bracket 32 ​​to realize the rotation of the rotating bracket 32 ​​by 90 degrees, so that the first lens 31 can be switched within the light beam path or moved out of the light beam path, thereby realizing the switching between the first processing mode and the second processing mode. Compared with other switching methods of placing the first lens 31 within the light beam path or moving it out of the light beam path, the structure of this embodiment is simpler and occupies less space.

[0060] In an alternative embodiment, see Fig.11 By designing the volume of the portion of the rotating bracket 32 ​​located above the reference plane S1 to be smaller than the volume of the portion located below the reference plane S1, the weight of the portion of the rotating bracket 32 ​​located above the reference plane S1 is made smaller than the weight of the portion located below the reference plane S1.

[0061] For example, the rotating bracket 32 ​​is a triangular block, and the six vertices of the triangular block are defined as A, B, C, D, E, and H. The first mounting surface 311 is a rectangular surface with vertices ABEH, and the second mounting surface is a rectangular surface with vertices BHCD. The first mounting surface 311 includes AB, AE, EH, and BH. The second mounting surface includes BH, BC, CD, and DH.

[0062] The rotating shaft 33 is located at the position F. The length of the EH side is smaller than the length of the HD side. The length of the FE side is smaller than the length of the FD side. In this way, the volume of the portion of the rotating bracket 32 ​​located above the reference plane S1 is smaller than the volume of the portion located below the reference plane S1.

[0063] In another alternative embodiment, see Fig.12 By arranging a heavier counterweight structure 35 in the portion of the rotating bracket 32 ​​below the reference plane S1, the weight of the portion of the rotating bracket 32 ​​above the reference plane S1 is less than the weight of the portion below the reference plane S1. In this embodiment, the volume of the portion of the rotating bracket 32 ​​above the reference plane S1 may be greater than, less than, or equal to the volume of the portion below the reference plane S1.

[0064] For example, the rotating bracket 32 ​​is a triangular block, and the six vertices of the triangular block are defined as A, B, C, D, E, and H. The first mounting surface 311 is a rectangular surface with vertices ABEH, and the second mounting surface is a rectangular surface with vertices BHCD. The rotating shaft 33 is located at the position of F. The first mounting surface 311 includes AB, AE, EH, and BH. The second mounting surface includes BH, BC, CD, and DH.

[0065] The length of the EH side may be less than, greater than, or equal to the length of the HD side. The length of the FE side may be less than, greater than, or equal to the length of the FD side, so that the volume of the portion of the rotating bracket 32 ​​located above the reference plane S1 is less than, greater than, or equal to the volume of the portion located below the reference plane S1.

[0066] When the rotating bracket 32 ​​rotates to other positions under the action of external force, the rotating bracket 32 ​​automatically returns to the first position N1 under the action of gravity after the external force is removed.

[0067] See also Figure 2-Figure 7 and Fig.13 The laser 100 further includes an air nozzle 60. The air nozzle 60 is disposed at the light-emitting end of the lens barrel 20. The inner cavity of the air nozzle 60 is connected to the inner cavity of the lens barrel 20, and the laser beam is emitted from the lens barrel 20 and then emitted to the processing surface through the air nozzle opening of the air nozzle 60.

[0068] The laser processing equipment 1000 further includes an air supply assembly (not shown), which is used to provide air blowing. The air supply assembly is connected to the air nozzle 60 and is used to blow air to the processing surface during laser processing.

[0069] In this embodiment, the light beam of the laser processing device 1000 in the first switching mode can pass smoothly through the nozzle 60 without being blocked by the nozzle 60. The light beam of the laser processing device 1000 in the second switching mode can also pass smoothly through the nozzle 60 without being blocked by the nozzle 60.

[0070] If the rotating bracket 32 ​​is disposed at a position far from the air nozzle 60 and close to the laser light source, the lens on the rotating bracket 32 ​​may cause the light beam to be blocked by the air nozzle 60 when the beam angle of the emitted light beam is increased. Furthermore, the rotating bracket 32 ​​may be designed close to the air nozzle 60, so as to achieve the change of the beam angle at the end of the light beam, which is conducive to the emitted light beam passing through the air nozzle 60 smoothly without being blocked by the air nozzle 60 even when the beam angle of the emitted light beam is increased.

[0071] Optional, see Fig.10 , Fig.14 and Fig.15 , the second mounting surface 312 and the first mounting surface 311 are intersecting surfaces. When the rotating bracket 32 ​​is located at the first position N1, the first mounting surface 311 is perpendicular to the axial direction of the lens barrel 20, the first lens 31 is disposed on the first mounting surface 311, and the laser beam is emitted through the first lens 31 and the air nozzle 60. When the rotating bracket 32 ​​is located at the second position N2, the second mounting surface 312 is perpendicular to the axial direction of the lens barrel 20.

[0072] In an alternative embodiment, see Fig.10 , Fig.14 and Fig.15 The rotatable lens assembly 30 further includes a second lens 34. The second lens 34 is disposed on the second mounting surface 312 of the rotating bracket 32. When the rotating bracket 32 ​​rotates to the second position N2, the second lens 34 is located on the optical path of the light beam, and the laser beam is emitted through the second lens 34 and the air nozzle 60. At this time, the first lens 31 is located outside the optical path.

[0073] See also Figure 8 When the rotating bracket 32 ​​rotates to the first position N1, the laser beam is emitted through the first lens 31 and the air nozzle 60. At this time, the second lens 34 is located outside the optical path of the beam.

[0074] See also Fig.14 When the rotating bracket 32 ​​rotates to the second position N2, the laser beam is emitted through the second lens 34 and the air nozzle 60. At this time, the first lens 31 is located outside the optical path of the beam.

[0075] The following is a further description of an embodiment in which the rotatable lens assembly 30 includes a first lens 31 and a second lens 34 .

[0076] Optional, see Fig.16 and Fig.17 , the height of the first mounting surface 311 when the rotating bracket 32 ​​rotates to the first position N1 is different from the height of the second mounting surface 312 when the rotating bracket 32 ​​rotates to the second position N2.

[0077] In this embodiment, the height of the first mounting surface 311 when the rotating bracket 32 ​​rotates to the first position N1 is designed to be different from the height of the second mounting surface 312 when the rotating bracket 32 ​​rotates to the second position N2. In this way, even after the laser beam passes through different lenses, the sizes of the first output beam M1 and the second output beam M2 are similar or the same when passing through the air nozzle 60, so as to avoid the change of the beam angle of the laser beam after the mode is switched, resulting in the beam diameter being larger than the size of the air nozzle mouth, thereby causing problems such as inaccurate beam processing and reduced beam action efficiency.

[0078] For details, please refer to Fig.16 and Fig.17 , when the rotating bracket 32 ​​rotates to the first position N1, the height of the first mounting surface 311 is less than the height of the second mounting surface 312 when the rotating bracket 32 ​​rotates to the second position N2, for example, the distance between the rotating shaft 33 and the first mounting surface 311 is less than the distance between the rotating shaft 33 and the second mounting surface 312. For example, when the rotating bracket 32 ​​rotates to the second position N2, the height of the second lens 34 is higher (higher than the height of the first lens 31 in the engraving mode), which is convenient for forming a second outgoing light beam M2 with a smaller beam angle for use in the cutting mode. When the rotating bracket 32 ​​rotates to the first position N1, the height of the first lens 31 is lower (lower than the height of the second lens 34 in the cutting mode), which is convenient for forming a first outgoing light beam M1 with a larger beam angle for use in the engraving mode.

[0079] In this embodiment, the length of the EH side can be greater than the length of the HD side. Optionally, a heavier counterweight structure 35 is provided in the portion of the rotating bracket 32 ​​below the reference plane S1, so that the weight of the portion of the rotating bracket 32 ​​above the reference plane S1 is less than the weight of the portion below the reference plane S1.

[0080] In this embodiment, a heavier counterweight structure 35 may be provided in a portion of the rotating bracket 32 ​​below the reference plane S1 for illustration.

[0081] Optional, see Fig.16 and Fig.17, the height of the first lens 31 in the optical path of the light beam is lower than the height of the second lens 34 in the optical path of the light beam. The focal length of the first lens 31 is smaller than the focal length of the second lens 34. In this embodiment, the focal length of the second lens 34 is designed to be larger than the focal length of the first lens 31, so as to form a second output light beam M2 with a smaller beam angle in the cutting mode. In addition, the height of the second lens 34 in the cutting mode is designed to be higher than the height of the first lens 31 in the engraving mode, so that the sizes of the first output light beam M1 and the second output light beam M2 are similar or the same when passing through the air nozzle 60, so as to avoid the problem that the beam angle of the laser beam changes after the mode is switched, resulting in a beam diameter larger than the size of the air nozzle, thereby causing inaccurate beam processing, reduced beam efficiency, and other problems.

[0082] In other words, in this embodiment, two focusing lenses with different focal lengths are provided to form different beam qualities. The second lens 34 is a long focus lens, which is used in the cutting mode, and the second lens 34 is a short focus lens, which is used in the engraving mode. The cutting or engraving mode is switched by switching the two lenses (the first lens 31 and the second lens 34) in the optical path. Before and after the switching, the light beam can pass through the air nozzle 60 and will not be blocked by the air nozzle 60.

[0083] In other embodiments, the height of the first lens 31 in the optical path of the light beam may be equal to the height of the second lens 34 in the optical path of the light beam.

[0084] Optional, see Fig.16 and Fig.17 , a height difference between a focus of the first lens 31 and a focus of the second lens 34 is less than or equal to a preset height difference.

[0085] Specifically, when the first lens 31 and the second lens 34 are switched on the optical path to achieve switching between the engraving mode and the cutting mode, the spot height of the laser beam after passing through the first lens 31 and the spot height of the laser beam after passing through the second lens 34 have a certain height difference, so that the spot after passing through the first lens 31 is located at a suitable position for the engraving mode, and the spot after passing through the second lens 34 is located at a suitable position for the cutting mode, thereby achieving efficient switching between the engraving mode and the cutting mode.

[0086] The present application does not limit the size of the preset height difference. Optionally, the height difference between the focus of the first lens 31 and the focus of the second lens 34 can be 0. Optionally, the preset height difference can be half the thickness of the processed substrate, and the focus of the first lens 31 is higher than the focus of the second lens 34, so that when the first lens 31 is switched to the optical path (engraving mode), the spot of the first outgoing light beam M1 is set on the surface of the processing surface to obtain a better engraving effect; and when the second lens 34 is switched to the optical path (cutting mode), the spot of the second outgoing light beam M2 is set at a position about half the thickness of the processed substrate to obtain a better cutting effect. During this switching process, there is no need to adjust the z-axis drive motor 71, so that continuous and efficient switching between engraving mode and cutting mode can be achieved, thereby improving processing efficiency.

[0087] Furthermore, in the present embodiment, the height difference between the focus of the first lens 31 and the focus of the second lens 34 is set to be less than or equal to a preset height difference, that is, the height difference between the focus of the first lens 31 and the focus of the second lens 34 is relatively small, so that the laser beam when the rotating bracket 32 ​​is in the first position N1 and the second position N2 can pass through the air nozzle 60, thereby preventing the laser beam when the rotating bracket 32 ​​is in the first position N1 and the second position N2 from being blocked by the air nozzle 60.

[0088] For example, the preset height difference includes but is not limited to 0-10 mm. Further, the preset height difference includes but is not limited to 0 mm, 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7 mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, 9.5 mm, 10 mm, etc., any one or any value between two thereof.

[0089] If the first lens 31 is switched on the optical path when switching to the engraving mode, and the spot position of the laser beam after passing through the first lens 31 is not set on the surface of the processed substrate, the z-axis drive motor 71 can be adjusted to adjust the overall height of the laser head so that the spot position of the laser beam is not set on the surface of the processed substrate.

[0090] If the second lens 34 is switched on the optical path when switching to the cutting mode, and the spot position of the laser beam after passing through the second lens 34 is not set at a certain depth position (optimal cutting depth) below the surface of the processed substrate, the z-axis drive motor 71 can be adjusted to adjust the overall height of the laser head so that the spot position of the laser beam is set at a certain depth position (optimal cutting depth) below the surface of the processed substrate.

[0091] The present application does not specifically describe the rotation angle of the rotating bracket 32 ​​from the first position N1 to the second position N2. The rotation angle of the rotating bracket 32 ​​from the first position N1 to the second position N2 can be an obtuse angle, a right angle, or an acute angle, and can even be greater than 180°. Among them, the sum of the angle between the first mounting surface 311 and the second mounting surface 312 and the minimum rotation angle between the first position N1 and the second position N2 is 180°. In this embodiment, the first mounting surface 311 is perpendicular to the second mounting surface 312, and the minimum rotation angle between the first position N1 and the second position N2 is 90°. In this way, the rotating bracket 32 ​​is a relatively regular structure, which is easy to process and form, and occupies a relatively small space.

[0092] Optionally, the first mounting surface 311 is perpendicular to the second mounting surface 312. A first distance between the rotating shaft 33 and the first mounting surface 311 is smaller than a second distance between the rotating shaft 33 and the second mounting surface 312. In this way, in this embodiment, when the rotating bracket 32 ​​rotates to the first position N1, the height of the first mounting surface 311 is smaller than the height of the second mounting surface 312 when the rotating bracket 32 ​​rotates to the second position N2.

[0093] In another alternative embodiment, see Fig.19 The second mounting surface 312 may not be provided with a lens. For example, a through hole portion 36 is provided on the second mounting surface 312 of the rotating bracket 32. When the rotating bracket 32 ​​rotates to the second position N2, the through hole portion 36 is located on the optical path of the light beam, and the laser beam is emitted through the through hole portion 36 and the air nozzle 60.

[0094] Optional, see Fig.18 and Fig.19 The laser processing equipment 1000 further includes a third lens 40. The third lens 40 is located on the optical path of the light beam. The position of the third lens 40 can be fixed.

[0095] The height difference between the focal position of the third lens 40 when the rotating bracket 32 ​​is located at the second position N2 and the equivalent focal points of the first lens 31 and the third lens 40 when the rotating bracket 32 ​​is located at the first position N1 is less than or equal to the preset height difference.

[0096] The equivalent focus of the first lens 31 and the third lens 40 refers to the combined focus of the first lens 31 and the third lens 40 .

[0097] Furthermore, in the present embodiment, the height difference between the focal position of the third lens 40 when the rotating bracket 32 ​​is located at the second position N2 and the equivalent focal points of the first lens 31 and the third lens 40 when the rotating bracket 32 ​​is located at the first position N1 is less than or equal to a preset height difference, so that the laser beam when the rotating bracket 32 ​​is at the first position N1 and the second position N2 can pass through the air nozzle 60, thereby preventing the laser beam when the rotating bracket 32 ​​is at the first position N1 and the second position N2 from being blocked by the air nozzle 60.

[0098] For example, the preset height difference includes but is not limited to 0-10 mm. Further, the preset height difference includes but is not limited to 0 mm, 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7 mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, 9.5 mm, 10 mm, etc., any one or any value between two thereof.

[0099] Optional, see Fig. 20 The third lens 40 is a convex lens, and the first lens 31 is a convex lens. When the rotating bracket 32 ​​is at the first position N1, the third lens 40 and the first lens 31 are on the optical path to form a first outgoing light beam M1 with a first beam angle, and work in the engraving mode. Fig.21 When the rotating bracket 32 ​​is in the second position N2, the third lens 40 is on the optical path, forming a second outgoing beam M2 with a second beam angle, and works in a cutting mode, so as to form a first beam angle of the first outgoing beam M1 that is greater than a second beam angle of the second outgoing beam M2.

[0100] Optional, see Fig. 22 The third lens 40 is a convex lens, and the first lens 31 is a concave lens. When the rotating bracket 32 ​​is at the first position N1, the third lens 40 and the first lens 31 form a first outgoing light beam M1 with a first beam angle on the optical path, which is the working cutting mode. Fig.23 When the rotating bracket 32 ​​is in the second position N2, the third lens 40 is on the optical path, forming a second outgoing light beam M2 with a second beam angle, and working in the engraving mode, forming a first beam angle of the first outgoing light beam M1 that is smaller than a second beam angle of the second outgoing light beam M2.

[0101] In this embodiment, by designing the focal position of the third lens 40 when the rotating bracket 32 ​​is located at the second position N2 to be different from the focal position of the lens group when the rotating bracket 32 ​​is located at the first position N1, it is possible to achieve different beam angles of the outgoing light beams in the two modes (for example, the beam angle when the lens group is working is greater or less than the beam angle when the third lens 40 is working alone). After switching the engraving mode and the cutting mode, there is no need to adjust the z-axis drive motor 71, but the processing can be switched continuously, thereby achieving continuous and efficient switching between the engraving mode and the cutting mode.

[0102] This embodiment switches between the engraving mode and the cutting mode by switching one lens or multiple lenses in the optical path. For example, when only one lens is in the optical path, it is in the cutting mode, and when two lenses are in the optical path, the equivalent focal length of the lens group becomes shorter, which is the engraving mode. By setting the position and parameters of the lens, it is also ensured that the light beams all pass through the air nozzle 60, and at the same time, the volume of the laser processing equipment 1000 is miniaturized.

[0103] Optional, see Figure 8 and Fig.14 The laser processing equipment 1000 further includes a driving member 50. The driving member 50 is at least used to drive the rotating bracket 32 ​​to switch from the first position N1 to the second position N2.

[0104] In an optional embodiment, the driving member 50 provides a driving force for the rotating bracket 32 ​​to rotate from the first position N1 to the second position N2, so that the rotating bracket 32 ​​is located at the second position N2 to work in the cutting mode. When the driving force of the driving member 50 is removed, the rotating bracket 32 ​​can return to the first position N1 under its own gravity to work in the engraving mode.

[0105] In an alternative embodiment, see Figure 8 and Fig.14 , the driving member 50 includes an electromagnetic coil 51 and a magnetically attracted structure 52. By designing the driving member 50 to include the electromagnetic coil 51 and the magnetically attracted structure 52, the space occupied by the driving member 50 is reduced, and it is also convenient to apply the driving force of the driving member 50 and remove the driving force. For example, when the electromagnetic coil 51 is energized, the driving member 50 applies a driving force to the rotating bracket 32, and the driving force drives the rotating bracket 32 ​​to rotate to the second position N2. When the electromagnetic coil 51 is not energized, the driving force of the driving member 50 on the rotating bracket 32 ​​is removed, and the rotating bracket 32 ​​returns to the first position N1 under the action of its own gravity.

[0106] See also Figure 8 and Fig.14The electromagnetic coil 51 is attached to the inner wall of the lens barrel 20 or embedded in the lens barrel 20 to reduce the space occupied by the electromagnetic coil 51 and reduce the obstruction of the optical path. The central axis of the electromagnetic coil 51 is parallel to or coincides with the central axis of the lens barrel 20.

[0107] Optionally, the magnetically attracted structure 52 is disposed at one end of the first mounting surface 311 of the rotating bracket 32 ​​away from the second mounting surface 312. The magnetically attracted structure 52 includes but is not limited to a permanent magnet, an electromagnet, or a metal body that is non-magnetic but can be magnetically attracted or repelled.

[0108] In other embodiments, the magnetically attracted structure 52 may also be disposed at one end of the second mounting surface 312 of the rotating bracket 32 ​​away from the first mounting surface 311. In other embodiments, there are two magnetically attracted structures 52, one magnetically attracted structure 52 is disposed at one end of the second mounting surface 312 of the rotating bracket 32 ​​away from the first mounting surface 311; and the other magnetically attracted structure 52 is disposed at one end of the first mounting surface 311 of the rotating bracket 32 ​​away from the second mounting surface 312.

[0109] The electromagnetic coil 51 is used to magnetically attract or repel the magnetically attracted structure 52 when powered on, so that the magnetically attracted structure 52 drives the rotating bracket 32 ​​to rotate to the second position N2.

[0110] In other embodiments, the electromagnetic coil 51 may also be in other forms or other positions. For example, the electromagnetic coil 51 is a small block protruding from the inner wall of the lens barrel 20 or embedded in the inner wall of the lens barrel 20 .

[0111] The present application does not specifically limit the position of the electromagnetic coil 51 .

[0112] In a first alternative implementation, see Fig.24 The electromagnetic coil 51 is disposed at a position opposite to the magnetically attracted structure 52 when the rotating bracket 32 ​​is located at the first position N1. The electromagnetic coil 51 repels the magnetically attracted structure 52 when energized, thereby providing a driving force for the rotating bracket 32 ​​and rotating the rotating bracket 32 ​​to the second position N2.

[0113] In a second alternative implementation, see Fig.14 The electromagnetic coil 51 is disposed at a position opposite to the magnetically attracted structure 52 when the rotating bracket 32 ​​is located at the second position N2. The electromagnetic coil 51 attracts the magnetically attracted structure 52 when energized, thereby providing a driving force for the rotating bracket 32, so that the rotating bracket 32 ​​rotates to the second position N2.

[0114] In a third alternative implementation, see Fig.25The electromagnetic coil 51 is arranged at a position opposite to the magnetically attracted structure 52 when the rotating bracket 32 ​​is located between the first position N1 and the second position N2. When the electromagnetic coil 51 is energized, the magnetically attracted structure 52 is first attracted to make the rotating bracket 32 ​​leave the first position N1. After the magnetically attracted structure 52 reaches the position of the electromagnetic coil 51, the magnetically attracted structure 52 is repelled to make the rotating bracket 32 ​​approach the second position N2, thereby providing driving force for the rotating bracket 32 ​​and rotating the rotating bracket 32 ​​to the second position N2.

[0115] In the above process, the direction of the current in the electromagnetic coil 51 can be adjusted to control the electromagnetic coil 51 to attract or repel the magnetically attracted structure 52; by adjusting the current in the electromagnetic coil 51, the movement of the rotating bracket 32 ​​is smooth and the impulse when reaching the second position N2 is small, so as to avoid collision damage to the rotating bracket 32 ​​and the lens on the rotating bracket 32.

[0116] Optional, see Fig.26 The laser processing equipment 1000 further includes a first clamping member 61 and a second clamping member 62. The first clamping member 61 and the second clamping member 62 are both fixed to the inner wall of the lens barrel 20. The first clamping member 61 is used to clamp the rotating bracket 32 ​​when the rotating bracket 32 ​​is located at the first position N1. The second clamping member 62 is used to clamp the rotating bracket 32 ​​when the rotating bracket 32 ​​is located at the second position N2.

[0117] Optionally, when the rotating bracket 32 ​​is located at the first position N1, the first locking member 61 is used to lock the rotating bracket 32 ​​near the AE side. In other words, the first locking member 61 is located near the AE side when the rotating bracket 32 ​​is located at the first position N1.

[0118] See also Fig.26 and Fig. 27 The first clamping member 61 includes a first abutting block 611 and a first elastic arm 612. The first abutting block 611 is convexly disposed on the inner wall of the lens barrel 20. The first abutting block 611 has a first abutting surface 613. When the rotating bracket 32 ​​is located at the first position N1, the first abutting surface 613 is in contact with the end of the first mounting surface 311 away from the second mounting surface 312. A clamping groove is formed between the first elastic arm 612 and the first abutting surface 613 of the first abutting block 611 to accommodate the end of the first mounting surface 311 away from the second mounting surface 312. For example, when the rotating bracket 32 ​​is a triangular block, the corner where the AE side is located is clamped between the first elastic arm 612 and the first abutting block 611 at the first position N1, so as to fix the rotating bracket 32 ​​at the first position N1 and improve the stability of the rotating bracket 32 ​​at the first position N1.

[0119] Accordingly, when the rotating bracket 32 ​​is located at the second position N2, the second clamping member 62 is used to clamp the rotating bracket 32 ​​near the CD edge. In other words, the second clamping member 62 is located near the CD edge when the rotating bracket 32 ​​is located at the second position N2.

[0120] See also Fig.26 and Fig. 27 The second clamping member 62 includes a second abutting block 621 and a second elastic arm 622. The second abutting block 621 is convexly disposed on the inner wall of the lens barrel 20. The second abutting block 621 has a second abutting surface 623. When the rotating bracket 32 ​​is located at the second position N2, the second abutting surface 623 is in contact with the end of the second mounting surface 312 away from the first mounting surface 311. A clamping groove is formed between the second elastic arm 622 and the second abutting surface 623 of the second abutting block 621 to accommodate the end of the second mounting surface 312 away from the first mounting surface 311. For example, when the rotating bracket 32 ​​is a triangular block, the corner where the CD side is located is clamped between the second elastic arm 622 and the second abutting block 621 at the second position N2, so as to fix the rotating bracket 32 ​​at the second position N2 and improve the stability of the rotating bracket 32 ​​at the second position N2.

[0121] Optionally, the electromagnetic coil 51 may be disposed in the first abutment block 611 and / or the second abutment block 621. By arranging the electromagnetic coil 51 in the abutment block and cooperating with the magnetically attracted structure 52 disposed on the rotating bracket 32, driving from the first position N1 to the second position N2, fixing at the first position N1, fixing at the second position N2, etc. may be achieved. In this embodiment, the first elastic arm 612 and the second elastic arm 622 may not be disposed. In this embodiment, the laser processing equipment 1000 further includes a position detection device (not shown) to detect whether the rotating bracket 32 ​​is located at the first position N1 or the second position N2. The position detection device includes but is not limited to a pressure sensor, a light intensity detector, an infrared sensor, etc. The position detection device can be provided on the aforementioned first abutment block 611 and the second abutment block 621. The position detection device is electrically connected to the aforementioned controller.

[0122] The laser processing device 1000 provided in the present application can be used in the field of laser engraving, laser cutting, etc. The laser processing device 1000 provided in the present application has fast switching, good repeatability, small system space requirements, low cost, and can be applied to complex processing with frequent switching between engraving and cutting, and can obtain good engraving and processing effects without the need for very high-power lasers, thereby reducing the overall cost.

[0123] The laser processing equipment 1000 provided in the present application includes but is not limited to the following control method steps.

[0124] Turn on the laser processing equipment 1000, and the position detection device detects the position of the rotating bracket 32 ​​at this time, determines the working mode of the laser processing equipment 1000 at this time, and gives corresponding instructions in the form of voice, text display, or indicator light. For example, the rotating bracket 32 ​​is in the first position N1, and the current working mode is engraving mode.

[0125] When it is necessary to switch to the cutting mode, the user end can trigger the switching signal, the electromagnetic coil 51 is energized, and the AE side of the rotating bracket 32 ​​is attracted to the first target position. The in-position detection device on the second abutment block 621 detects whether the second mounting surface 312 abuts the second abutment surface 623 to detect whether the AE side has reached the first target position; if it is determined that the AE side has reached the first target position, start the laser 100.

[0126] If the AE edge does not reach the first target position, the current in the electromagnetic coil 51 is increased according to a preset degree, and the AE edge is detected again to see if it reaches the first target position. If it is determined that the AE edge has reached the first target position, the laser 100 is started. If the AE edge has not reached the first target position after the second detection, a warning signal is issued.

[0127] When it is necessary to switch to the engraving mode, the user end can trigger the switching signal, the electromagnetic coil 51 is powered off, and the rotating bracket 32 ​​rotates down the CD side under the action of gravity. After a preset time, the in-position detection device on the first abutting block 611 detects whether the first mounting surface 311 abuts the first abutting surface 613 to detect whether the CD side has reached the second target position; if it is determined that the CD side has reached the second target position, the laser 100 is started. If it is detected that the CD side has not reached the second target position, the electromagnetic coil 51 passes a reverse current to repel the AE side, so that the CD side rotates to the second target position, and detects again whether the CD side has reached the second target position. If it is determined that the CD side has reached the second target position again, the laser 100 is started. If it is detected again that the CD side has not reached the second target position, a warning signal is issued.

[0128] The following is an example of the working process of the laser processing equipment 1000.

[0129] In the first step, the host computer sets the parameters for engraving and cutting the processing substrate, including the cutting light source power percentage p, speed S, object thickness T, the distance D from the focus to the object surface (positive on the processing substrate and negative inside the processing substrate), air pressure and air volume, and sets the content of the engraving work at the same time.

[0130] The second step is to start the start command on the host computer and pass the above parameters to the controller. The controller connects to the host computer for communication, receives the work instructions of the host computer, and controls the z-axis drive motor 71, the laser 100, the drive element 50 and other parts. According to the corresponding instructions, the laser is turned on to a fixed current, the x, y, z three-axis motors are driven to operate, and the electromagnetic coil 51 is driven to control the movement of the rotating bracket 32.

[0131] The third step is to switch to the cutting mode after the engraving mode is finished. When the focus needs to be readjusted, the controller can control the laser 100 to stop outputting the laser. During this period, the z-axis drive motor 71 is controlled to operate according to the thickness of the substrate to adjust the height of the laser 100 to let the focus reach a suitable position. The drive member 50 controls the rotating bracket 32 ​​to start operating until the adjustment is completed. After the system switches to the cutting mode, the z-axis drive motor 71 gives the controller a feedback that the switching is completed. After receiving all the feedback, the controller starts to output the laser according to the instructions and starts cutting after controlling the air pressure and airflow to the corresponding value. When the system switches from the cutting mode to the engraving mode, the laser 100 must also be turned off to avoid damage to the structural parts caused by the laser irradiation during the switching process.

[0132] Step 4: Engraving and cutting can be switched automatically and flexibly at any time according to the above steps. After completing the engraving or cutting work, turn off the laser 100 and the system returns to the default state, which can be the engraving or cutting state. The air nozzle 60 stops working after a few minutes of continuous airflow, and the laser fan stops working after a few minutes of continuous heat dissipation. The system is in a waiting state, waiting for the next work.

[0133] The laser processing equipment 1000 provided in the present application uses a combination of lens or lens group switching and a z-axis driving motor 71 to adjust the distance between the laser 100 and the processing substrate to adjust the focal length of the beam to achieve free switching between the two modes of engraving and cutting, ensuring that the light spot is extremely small during engraving, thereby improving the precision of engraving; when cutting, the Rayleigh length of the beam is long enough to improve the cutting effect; this flexible switching is more efficient than traditional manual switching, does not require manual intervention, and is very beneficial for complex processing with frequent switching between engraving and cutting. Compared with the solution of moving the lens position in the x-axis, this solution can ensure good beam quality at the air nozzle 60, and will not block light and become hot due to the switching between engraving and cutting modes. The lens switching method has the least impact on the volume, and is a miniaturized switching device.

[0134] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present application, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. A laser processing device, characterized in that: The invention comprises a laser emission module, a lens barrel and a rotatable lens assembly, wherein the rotatable lens assembly is arranged in the lens barrel, and the laser emission module is used to emit a light beam; the rotatable lens assembly comprises: A rotating bracket, wherein the rotating bracket is arranged in the lens barrel; A first lens, wherein the first lens is disposed on a first mounting surface of the rotating bracket; and a rotating shaft, one end of which is fixed to the rotating bracket, and the other end of which is rotatably connected to the inner wall of the lens barrel; the rotating shaft is arranged on the rotating bracket away from the center of gravity of the rotating bracket, so that the rotating bracket is located at a first position under the action of gravity; When the rotating bracket is located at the first position, the first lens is located on the optical path of the light beam, and the laser processing equipment is in a first processing mode; when the rotating bracket is rotated to the second position, the first lens is located outside the optical path, and the laser processing equipment is in a second processing mode, and the beam angle of the first processing mode is greater than or less than the beam angle of the second processing mode.

2. The laser processing equipment according to claim 1, characterized in that: The rotatable lens assembly also includes a second lens, which is arranged on a second mounting surface of the rotating bracket, and the second mounting surface and the first mounting surface are intersecting surfaces; when the rotating bracket is rotated to the second position, the second lens is located in the optical path of the light beam; when the rotating bracket is rotated to the first position, the second lens is located outside the optical path of the light beam.

3. The laser processing equipment according to claim 2, characterized in that: When the rotating bracket rotates to the first position, the height of the first mounting surface is different from the height of the second mounting surface when the rotating bracket rotates to the second position.

4. The laser processing equipment according to claim 3, characterized in that: The height of the first lens in the optical path of the light beam is lower than the height of the second lens in the optical path of the light beam, the focal length of the first lens is smaller than the focal length of the second lens, and the height difference between the focus of the first lens and the focus of the second lens is less than or equal to a preset height difference.

5. The laser processing equipment according to claim 4, characterized in that: The first mounting surface is perpendicular to the second mounting surface, and a first distance between the rotating shaft and the first mounting surface is smaller than a second distance between the rotating shaft and the second mounting surface.

6. The laser processing equipment according to claim 1, characterized in that: The laser processing equipment further includes a third lens, and the third lens is located on the optical path of the light beam; A through hole portion is provided on the second mounting surface of the rotating bracket. When the rotating bracket rotates to the second position, the through hole portion is located on the optical path of the light beam.

7. The laser processing equipment according to claim 6, characterized in that: The height difference between the focal position of the third lens when the rotating bracket is located at the second position and the equivalent focal points of the first lens and the third lens when the rotating bracket is located at the first position is less than or equal to a preset height difference.

8. The laser processing equipment according to any one of claims 2 to 7, characterized in that: The laser processing equipment further includes a driving member, which is at least used to drive the rotating bracket to switch from the first position to the second position.

9. The laser processing equipment according to claim 8, characterized in that: The driving member includes an electromagnetic coil and a magnetically attracted structure, wherein the electromagnetic coil is attached to the inner wall of the lens barrel or embedded in the lens barrel, and the magnetically attracted structure is arranged at an end of the first mounting surface of the rotating bracket away from the second mounting surface; the electromagnetic coil is used to magnetically attract or repel the magnetically attracted structure, so that the magnetically attracted structure drives the rotating bracket to rotate to the second position.

10. The laser processing equipment according to any one of claims 1 to 7, characterized in that: The laser processing equipment also includes a first clamping piece and a second clamping piece, both of which are fixed to the inner wall of the lens barrel, the first clamping piece is used to clamp the rotating bracket when the rotating bracket is located at the first position, and the second clamping piece is used to clamp the rotating bracket when the rotating bracket is located at the second position.

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