A silicon wafer wire sawing device

Abstract

The application discloses a silicon wafer linear cutting device, which comprises a supporting seat, a diamond wire cutting machine is arranged on the supporting seat, the diamond wire cutting machine is provided with four wire guide rollers, further comprises a mounting seat, the mounting seat is arranged on the supporting seat, and a first long hole is arranged on the mounting seat, a bottom plate is arranged on the mounting seat, and a second long hole is arranged on the bottom plate, two U-shaped flow guide plates are arranged, the two U-shaped flow guide plates are symmetrically arranged, the two U-shaped flow guide plates are arranged on the bottom plate, and the opening of the U-shaped flow guide plate faces the horizontal direction, the application can improve the cleaning and cooling effect of the diamond wire, and avoid the direct impact of the cutting fluid on the diamond wire, so that the diamond wire is not deflected or shaken.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer cutting technology, specifically to a silicon wafer wire cutting device. Background Technology

[0002] Wire cutting is a common process in silicon wafer production. During wire cutting, cutting fluid is usually used to cool and clean the diamond wire. However, existing methods typically spray cutting fluid directly onto the diamond wire, which can easily cause the diamond wire to deflect or vibrate. This deflection or vibration is more pronounced when the spray direction is not parallel to the diamond wire, thus reducing the cutting quality of the silicon ingot. Summary of the Invention

[0003] The purpose of this invention is to provide a silicon wafer wire cutting device that improves the cleaning and cooling effect on diamond wire and can effectively reduce or avoid diamond wire deflection or vibration.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a silicon wafer wire cutting device, comprising a support base, on which a diamond wire cutting machine is mounted, the diamond wire cutting machine having four wire rollers; further comprising: a mounting base, the mounting base being disposed on the support base and having a first elongated hole; a base plate, the base plate being disposed on the mounting base and having a second elongated hole penetrating through it; two U-shaped guide plates, the two U-shaped guide plates being symmetrically arranged, both of the two U-shaped guide plates being disposed on the base plate, and the openings of the U-shaped guide plates facing horizontally; two belt rollers, both of the belt rollers being rotatably mounted on the mounting base; and a belt, the belt being fitted onto the base plate and the two belt rollers. Externally, a receiving cavity is formed between the belt, the base plate, and the two U-shaped guide plates; a drive assembly for driving the belt to rotate; a cutting fluid inlet assembly for connecting to an external cutting fluid supply device and for spraying cutting fluid into the inner side of the two U-shaped guide plates; and a cutting fluid recovery assembly for recovering the cutting fluid. When the cutting fluid inlet assembly sprays cutting fluid into the inner side of the two U-shaped guide plates and the belt rotates, it drives the cutting fluid temporarily stored inside the receiving cavity to rotate horizontally. The belt is fitted over the outside of the upward-moving portion of the diamond wire cutting machine, and the upward-moving portion of the diamond wire cutting machine passes through the first elongated hole and the second elongated hole.

[0005] Furthermore, the cutting fluid introduction assembly includes: a cover plate, with one cover plate respectively disposed on the top of each of the U-shaped guide plates; two fluid guide pipes, which are centrally symmetrically arranged and respectively fixed to two cover plates; and a nozzle, with at least one nozzle disposed on each of the fluid guide pipes; wherein the fluid guide pipes are used to connect to an external cutting fluid supply device.

[0006] Furthermore, the U-shaped guide vane includes: a straight section, of which there are two, the two straight sections being parallel and spaced apart; and an arc section, which is disposed between the two straight sections; wherein the nozzle is close to the inner side of one of the straight sections.

[0007] Furthermore, the drive assembly includes: a drive shaft rotatably mounted on the support base, with one of the belt rollers fixedly connected to the bottom end of the drive shaft; and a drive motor mounted on the support base, with its output end fixedly connected to the drive shaft.

[0008] Furthermore, the cutting fluid recovery assembly includes: a collection hood disposed on the support base; and a drain pipe disposed at the bottom of the collection hood, which is used to connect to an external filtration device.

[0009] Furthermore, the mounting base is rotatably equipped with two first limiting rollers and two second limiting rollers; the two first limiting rollers are located on both sides of one of the U-shaped guide plates, and the two second limiting rollers are located on both sides of the other U-shaped guide plate; both the first limiting rollers and the second limiting rollers are used to press the belt and cause the belt to adhere to the outer wall of the U-shaped guide plate.

[0010] Furthermore, each of the U-shaped guide vanes is provided with a baffle on both sides, and the baffle is adjacent to the belt.

[0011] Furthermore, the first elongated hole and the second elongated hole are positioned correspondingly, and the widths of the first elongated hole and the second elongated hole are equal.

[0012] Compared with the prior art, the beneficial effects achieved by the present invention are as follows.

[0013] 1. In this invention, the cutting fluid discharged from the first elongated hole flows downward by gravity, which helps to improve the scouring effect of the cutting fluid discharged from the second elongated hole on the diamond wire. This scouring effect is mainly vertical, which helps to improve the cooling and cleaning effect on the diamond wire. At the same time, the nozzle does not spray the cutting fluid directly onto the diamond wire, thereby effectively reducing or avoiding the diamond wire from deflecting or shaking.

[0014] 2. By driving the cutting fluid stored in the containment cavity to rotate, the rotating flow of cutting fluid helps to improve the cooling effect on the diamond wire, and at the same time, it is easier to remove the silicon powder attached to the diamond wire, effectively improving the cooling and cleaning effect on the diamond wire. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0016] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0017] Figure 2 This is a schematic diagram of the belt and diamond wire in embodiment one of the present invention.

[0018] Figure 3 This is a schematic diagram of the belt, base plate, and U-shaped guide plate in Embodiment 1 of the present invention.

[0019] Figure 4 This is a schematic diagram of the cutting fluid introduction component and the U-shaped guide plate in embodiment one of the present invention.

[0020] Figure 5 This is a schematic diagram of the U-shaped guide plate and the base plate in Embodiment 1 of the present invention.

[0021] Figure 6 This is a schematic diagram of the mounting base structure according to Embodiment 1 of the present invention.

[0022] Figure 7 This is a schematic diagram of the installation of the cutting fluid recovery component according to Embodiment 1 of the present invention.

[0023] Figure 8 This is a schematic diagram of the first limiting roller, the second limiting roller, and the belt in the second embodiment of the present invention.

[0024] Figure 9 This is a schematic diagram showing the positions of the first limiting roller and the second limiting roller in Embodiment 2 of the present invention.

[0025] Figure 10 This is a schematic diagram of the installation of the driving component according to Embodiment 3 of the present invention.

[0026] In the diagram: 1. Support base; 11. Diamond wire cutting machine; 2. Mounting base; 21. First elongated hole; 22. Base plate; 221. Second elongated hole; 23. First limiting roller; 24. Second limiting roller; 3. Belt; 31. Belt roller; 4. Cutting fluid recovery assembly; 41. Collection cover; 42. Drain pipe; 5. Drive assembly; 51. Drive motor; 52. Drive shaft; 6. Cutting fluid inlet assembly; 61. Cover plate; 62. Guide pipe; 63. Nozzle; 7. U-shaped guide plate; 71. Arc section; 72. Straight section; 8. Baffle; 9. Receiving cavity. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1

[0029] Please see Figures 1-7 The present invention provides a technical solution: a silicon wafer wire cutting device, including a support base 1, on which a diamond wire cutter 11 is mounted. The diamond wire cutter 11 uses four wire rollers, and the diamond wire used to cut the silicon ingot is wound on the four wire rollers. The four wire rollers are arranged in two rows and two columns. A mounting base 2 is provided on the support base 1, and a first elongated hole 21 is provided on the mounting base 1. A base plate 22 is provided on the mounting base 2, and a second elongated hole 221 is provided on the base plate 22. The first elongated hole 21 and the second elongated hole 221 are positioned correspondingly, and the widths of the first elongated hole 21 and the second elongated hole 221 are equal, the lengths of the first elongated hole 21 and the second elongated hole 221 are also equal, and the first elongated hole 21 and the second elongated hole 221 are connected.

[0030] Two U-shaped guide plates 7 are provided on the base plate 22. The two U-shaped guide plates 7 are symmetrically arranged, and the openings of the U-shaped guide plates 7 face the horizontal direction. Two belt rollers 31 are rotatably arranged on the mounting base 2. A belt 3 is wound around the outside of the two belt rollers 31. At the same time, a receiving cavity 9 is formed between the base plate 22, the belt 3, and the two U-shaped guide plates 7, with the belt 3 sleeved on the outside of the base plate 22 and the belt 3. The vertically upward moving part of the diamond wire in the diamond wire cutting machine 11 passes through the receiving cavity 9, and this part of the diamond wire passes through the first elongated hole 21 and the second elongated hole 221. The length of this part of the diamond wire is greater than the width of the belt 3.

[0031] The silicon wafer cutting device also includes a drive assembly 5, a cutting fluid inlet assembly 6, and a cutting fluid recovery assembly 4; the drive assembly 5 is used to drive the belt 3 to rotate, and the cutting fluid recovery assembly 4 is used to recover the cutting fluid; the cutting fluid inlet assembly 6 is used to connect to an external cutting fluid supply device, and the cutting fluid inlet assembly 6 is used to spray the cutting fluid into the inner side of the two U-shaped guide plates 7; when the cutting fluid inlet assembly 6 is used to spray the cutting fluid into the inner side of the two U-shaped guide plates 7, and the belt 3 is rotating, it is convenient to drive the cutting fluid stored in the receiving cavity 9 to rotate in the horizontal direction.

[0032] The U-shaped guide plate 7 consists of two straight sections 72 and one arc section 71. The two straight sections 72 are parallel and spaced apart, and the arc section 71 is located between the two straight sections 72. In addition, the inner walls of the two straight sections of the belt 3 are in contact with the outer walls of the two straight sections 72 included in the U-shaped guide plate 7. The U-shaped guide plate 7 is made of wear-resistant and corrosion-resistant material, and the belt 3 can be a wear-resistant and corrosion-resistant conveyor belt.

[0033] The cutting fluid inlet assembly 6 includes two cover plates 61, which are respectively disposed at the top of two U-shaped guide plates 7. A fluid guide tube 62 is fixedly disposed on each of the two U-shaped guide plates 7, and the two fluid guide tubes 62 pass through the two cover plates 61 respectively. The two fluid guide tubes 62 are centrally symmetrically arranged and are connected to an external cutting fluid supply device. Two nozzles 63 are connected to each fluid guide tube 62, and the two nozzles 63 on one fluid guide tube 62 are centrally symmetrically arranged with the two nozzles 63 on the other fluid guide tube 62. The nozzles 63 are adjacent to the inner side of one of the straight sections 72 and are used to spray cutting fluid into the inner side of the arc section 71. Through the guiding effect of the arc section 71 and in conjunction with the operation of the belt 3, the cutting fluid stored in the receiving cavity 9 is driven to rotate in the horizontal direction.

[0034] The cutting fluid recovery assembly 4 includes a collection cover 41 disposed on the support base 1. The collection cover 41 is located below the mounting base 2, and the lower part of the diamond wire cutter 11 is located inside the collection cover 41. A drain pipe 42 is connected to the bottom of the collection cover 41, and the drain pipe 42 is used to connect to an external filter device.

[0035] In this embodiment, cutting fluid is sprayed onto the arc segment 71 through the nozzle 63, and by controlling the amount introduced into the receiving cavity 9 per unit time to be greater than the amount discharged from the first elongated hole 21, the cutting fluid can be stored in the receiving cavity 9. The portion of the diamond wire passing through the first elongated hole 21 moves upward, and the cutting fluid discharged from the first elongated hole 21 flows downward by gravity. Therefore, this helps to improve the scouring effect of the cutting fluid discharged from the second elongated hole 221 on the portion of the diamond wire located directly below the first elongated hole 21. This scouring effect is mainly vertical, which helps to improve the scouring effect on the diamond wire. The cooling and cleaning effects are enhanced, while also reducing the impact on the diamond wire operation. Furthermore, by cooperating with the drive assembly 5 to drive the belt 3, the cutting fluid inside the containment cavity 9 rotates horizontally. By controlling the pressure of the cutting fluid ejected from the nozzle 63 and controlling the speed of the belt 3 through the drive assembly 5, the rotation speed of the cutting fluid is prevented from being too high, thus reducing the impact on the diamond wire operation. Moreover, the nozzle 63 does not directly spray the cutting fluid onto the diamond wire, thereby reducing or avoiding the diamond wire from deflecting or shaking, effectively ensuring the cutting quality of the silicon ingot by the diamond wire cutting machine 11.

[0036] At the same time, the rotating flow of cutting fluid helps to improve the cooling effect on the diamond wire, and also facilitates the removal of silicon powder adhering to the diamond wire. Combined with the flushing effect of the cutting fluid discharged from the second elongated hole 221 on the diamond wire, the cooling and cleaning effect on the diamond wire is effectively improved.

[0037] The cutting fluid overflowing from the top of the belt 3, the cutting fluid flowing out from the gap between the belt 3 and the U-shaped guide plate 7 and the bottom plate 22, and the cutting fluid on the diamond wire cutter 11 are all collected into the collection hood 41 and connected to an external filter device through the drain pipe 42 to facilitate the recycling of silicon powder and cutting fluid. In addition, a baffle 8 is provided on the outer wall of each straight section 72. The baffle 8 has an inverted L-shaped structure and is adjacent to the belt 3. By setting the baffle 8, the flow of cutting fluid overflowing from the top of the belt 3 into both ends of the belt 3 is reduced.

[0038] Example 2

[0039] Please see Figure 8 , Figure 9Based on Embodiment 1, this embodiment rotatably mounts two first limiting rollers 23 and two second limiting rollers 24 on the mounting base 2. The two first limiting rollers 23 are arranged in parallel and are located on both sides of one of the U-shaped guide plates 7. The two second limiting rollers 24 are arranged in parallel and are located on both sides of the other U-shaped guide plate 7. Both the first limiting rollers 23 and the second limiting rollers 24 are used to press the belt 3, causing the belt 3 to adhere to the U-shaped guide plate 7 and the outer wall of the base plate 22. During the movement of the belt 3, the sealing between the belt 3 and the U-shaped guide plate 7 and the base plate 22 can be improved, thereby helping to reduce the cutting fluid flowing out from the gap between the belt 3 and the U-shaped guide plate 7 and the base plate 22.

[0040] Example 3

[0041] Please see Figure 1 and Figure 10 Based on Embodiment 2, the drive assembly 5 includes a drive shaft 52 rotatably mounted on the support base 1, with one of the belt rollers 31 fixedly connected to the bottom end of the drive shaft 52; the drive assembly 5 also includes a drive motor 51, which is mounted on the support base 1 and has its output end fixedly connected to the drive shaft 52. The belt roller 31 connected to the drive shaft 52, the drive shaft 52, and the output shaft of the drive motor 51 are coaxial; in addition, a protective cover may be provided on the outside of the drive motor 51.

[0042] By driving the drive shaft 52 to rotate through the drive motor 51, the belt roller 31 connected to the drive shaft 52 can be rotated. Under the action of the other belt roller 31, the belt 3 can be turned.

[0043] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A silicon wafer wire cutting device, comprising a support base (1), wherein a diamond wire cutter (11) is disposed on the support base (1), the diamond wire cutter (11) having four wire rollers; characterized in that, Also includes: Mounting base (2), the mounting base (2) is disposed on the support base (1), and the mounting base (2) is provided with a first elongated hole (21). The base plate (22) is disposed on the mounting base (2), and a second elongated hole (221) is provided through the base plate (22). U-shaped guide plate (7), there are two U-shaped guide plates (7), the two U-shaped guide plates (7) are symmetrically arranged, both U-shaped guide plates (7) are arranged on the bottom plate (22), and the opening of the U-shaped guide plate (7) faces the horizontal direction; Two belt rollers (31) are provided, and both belt rollers (31) are rotatably mounted on the mounting base (2). The belt (3) is fitted to the outside of the base plate (22) and two belt rollers (31), and a receiving cavity (9) is formed between the belt (3), the base plate (22) and the two U-shaped guide plates (7). Drive assembly (5), the drive assembly (5) is used to drive the belt (3) to operate; Cutting fluid inlet assembly (6), the cutting fluid inlet assembly (6) is used to connect to an external cutting fluid supply device, and the cutting fluid inlet assembly (6) is used to spray cutting fluid into the inner side of two U-shaped guide plates (7); Cutting fluid recovery assembly (4), the cutting fluid recovery assembly (4) is used to recover cutting fluid; When the cutting fluid inlet assembly (6) is used to spray cutting fluid into the inner side of the two U-shaped guide plates (7), and the belt (3) is running, it is used to drive the cutting fluid temporarily stored in the receiving cavity (9) to rotate in the horizontal direction. The belt (3) is fitted around the outside of the diamond wire upward movement part of the diamond wire cutting machine (11), and the diamond wire upward movement part of the diamond wire cutting machine (11) passes through the first elongated hole (21) and the second elongated hole (221). The cutting fluid inlet assembly (6) includes: Cover plate (61), each of the U-shaped guide plates (7) is provided with a cover plate (61) on its top. Liquid guide tube (62), there are two liquid guide tubes (62), the two liquid guide tubes (62) are arranged in a centrally symmetrical manner, and the two liquid guide tubes (62) are respectively fixed on the two cover plates (61); At least one nozzle (63) is provided on each of the liquid guide tubes (62). The fluid guide tube (62) is used to connect to an external cutting fluid supply device.

2. The silicon wafer wire cutting device according to claim 1, characterized in that, The U-shaped guide vane (7) includes: A straight segment (72), wherein there are two straight segments (72), which are parallel and spaced apart; An arc segment (71) is disposed between two straight segments (72); The nozzle (63) is located near the inside of one of the straight sections (72).

3. The silicon wafer wire cutting device according to claim 1, characterized in that, The driving component (5) includes: A drive shaft (52) is rotatably mounted on the support base (1), and one of the belt rollers (31) is fixedly connected to the bottom end of the drive shaft (52). A drive motor (51) is mounted on the support base (1), and the output end of the drive motor (51) is fixedly connected to the drive shaft (52).

4. The silicon wafer wire cutting device according to claim 1, characterized in that, The cutting fluid recovery assembly (4) includes: A collection cover (41) is disposed on the support base (1); A drain pipe (42) is provided at the bottom of the collection hood (41) and is used to connect to an external filter device.

5. A silicon wafer wire cutting device according to claim 1, characterized in that, The mounting base (2) is rotatably equipped with two first limiting rollers (23) and two second limiting rollers (24). Two first limiting rollers (23) are located on both sides of one of the U-shaped guide plates (7), and two second limiting rollers (24) are located on both sides of the other U-shaped guide plate (7); The first limiting roller (23) and the second limiting roller (24) are both used to press the belt (3) and cause the belt (3) to adhere to the outer wall of the U-shaped guide plate (7).

6. A silicon wafer wire cutting device according to claim 1, characterized in that, Each of the U-shaped guide vanes (7) is provided with baffles (8) on both sides, and the baffles (8) are adjacent to the belt (3).

7. A silicon wafer wire cutting device according to claim 1, characterized in that, The first elongated hole (21) is positioned corresponding to the second elongated hole (221), and the widths of the first elongated hole (21) and the second elongated hole (221) are equal.

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