Radio frequency chip packaging adhesive, adhesive film containing same, and preparation method and application thereof

Abstract

The invention relates to a radio frequency chip packaging adhesive, an adhesive film containing the radio frequency chip packaging adhesive and a preparation method and application of the radio frequency chip packaging adhesive. The preparation method of the adhesive film for packaging the radio frequency chip comprises the following steps: sequentially adding the materials in the component A into a reaction kettle, heating and stirring, and discharging after vacuum defoaming; sequentially adding the materials in the component B into the reaction kettle, stirring and discharging; uniformly mixing the component A and the component B according to a ratio, filtering, and carrying out vacuum defoaming to obtain a glue solution; transferring the glue solution to a coating machine, and coating the glue solution between a PET base film and a PET release film to obtain a glue film; and rolling and slitting to obtain a sheet-shaped or roll-shaped adhesive film. Based on the special requirements of the adhesive film for the radio frequency chip, the matched epoxy resin and curing system are preferably selected, and the high-performance adhesive film for packaging the chip, which is good in temperature resistance, high in glass transition temperature, low in linear expansion coefficient, low in moisture absorption rate, small in buckling deformation and high in cohesiveness, is prepared through scientific compatibility of the formula and optimization of the processing technology.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging adhesive films, and in particular to radio frequency chip packaging adhesive, an adhesive film containing the same, and a preparation method and application thereof. Background Art

[0002] Epoxy resin has the advantages of good adhesion, strong mechanical properties, good insulation and good solvent resistance, and has always occupied a place in the field of chip packaging.

[0003] Although epoxy resin has unique characteristics in chip packaging, it also has inherent drawbacks and is difficult to apply in some special chip packaging fields. These drawbacks are mainly reflected in high brittleness, high shrinkage and warpage, and cannot meet the actual requirements of high-performance chips for low linear expansion coefficient and high glass transition temperature, as well as high temperature resistance and low moisture absorption. In these aspects, epoxy resin pales in comparison with other packaging materials. This has largely restricted the application of epoxy resin materials in the field of chip packaging, especially in RF chip packaging.

[0004] Therefore, how to preserve the original performance of epoxy resin while striving to make up for the above shortcomings to meet the application in RF chip packaging is an industry problem that needs to be solved urgently.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] In view of the deficiencies in the prior art, the embodiments of the present invention disclose a radio frequency chip encapsulation adhesive, an adhesive film containing the same, and a preparation method and application thereof, so as to make up for the shortcomings of epoxy resin while retaining the original performance of epoxy resin and meet the application in radio frequency chip packaging.

[0007] The technical solution adopted by the present invention is as follows:

[0008] A radio frequency chip packaging adhesive comprises a component A and a component B; the component A mainly comprises an epoxy resin, a toughening agent, a black paste, a defoaming agent, a coupling agent, a dispersant and a powder filler, wherein by weight, the epoxy resin accounts for 6 to 20.6% of the component A, the toughening agent accounts for 3 to 6% of the component A, the black paste accounts for 1 to 2% of the component A, the defoaming agent accounts for 0.1 to 0.3% of the component A, the coupling agent accounts for 0.2 to 0.5% of the component A, the dispersant accounts for 0.1 to 0.2% of the component A, and the powder filler accounts for 75 to 85% of the component A; the component B mainly comprises an aromatic amine curing agent, an alicyclic curing agent and a curing agent accelerator, wherein by weight, the aromatic amine curing agent accounts for 52 to 78% of the component B, the alicyclic curing agent accounts for 20 to 42% of the component B, and the curing agent accelerator accounts for 2 to 6% of the component B; wherein the mass ratio of the component A to the component B is 100:(5 to 9).

[0009] A further technical solution is that the epoxy resin is a trifunctional epoxy resin or a tetrafunctional epoxy resin, and the epoxy resin is any one of KR-470, EP 8403, S-510, S-720, XY530L, EP 6901, EP 8404 and SQSN-4132A70.

[0010] A further technical solution is that the toughening agent is a core-shell toughening agent or a rubber toughening agent. The toughening agent is any one of RA1340, RF928, RA840, MX-125, MX-154, MX-254, F-202, FM 9201 and W35.

[0011] A further technical solution is that the defoaming agent is any one or two of BYK-A530, KS-603, BYK-141, BYK-066N and Dow Corning 163; the coupling agent is any one of KH-560, KH-550, A-187, KBM-303 and KBM-803; and the dispersant is any one of BYK-9011, BYK-110, BYK-163 and SDJ-8110.

[0012] A further technical solution is that the powder filler is spherical silicon dioxide or spherical aluminum oxide with a particle size of 0.5 to 30 μm, and the powder filler is any one of SC-2500SXJ, NQ1160F, SHA0200, NQ005, Q-600, Q099, NA1020W, QY10 and NA1050W.

[0013] A further technical solution is that the aromatic amine curing agent is any one of diethyltoluenediamine and 3,3'-diethyl-4,4'-diaminodiphenylmethane; the alicyclic curing agent is any one of 3,3-dimethyl-4,4-diaminodicyclohexylmethane, isophoronediamine and 4,4'-diaminodicyclohexylmethane; and the curing agent accelerator is any one of Accelerator 399 and AEP.

[0014] The present invention also discloses an adhesive film for radio frequency chip packaging, which comprises a PET base film, an adhesive layer and a PET release film stacked in sequence, wherein the adhesive layer comprises the radio frequency chip packaging adhesive according to any one of claims 1 to 6.

[0015] The present invention also discloses a preparation method of the aforementioned adhesive film for radio frequency chip packaging, comprising the following steps: putting the materials in component A into a reactor in sequence, heating and stirring, and unloading after vacuum degassing; putting the materials in component B into a reactor in sequence, stirring and unloading; mixing component A and component B evenly in proportion, filtering and vacuum degassing to obtain adhesive solution; transferring the adhesive solution to a coating machine, coating the adhesive solution between a PET base film and a PET release film to obtain an adhesive film; winding and slitting to obtain a sheet-shaped or rolled adhesive film.

[0016] Its further technical solution is that when the materials in component A are put into the reactor in sequence, the heating temperature is 50-70°C, the stirring speed is 60-80r / min, and the stirring time is 1-2h; when the materials in component B are put into the reactor in sequence, the heating temperature is 30-50°C, the stirring speed is 60-90r / min, and the stirring time is 1-2h; the oven temperature of the coater is 50-80°C, the coating gap is 260-450μm, the operating speed is 1-2m / min, and a film with a thickness of 100-350μm is obtained.

[0017] The present invention also discloses the application of the aforementioned adhesive film for radio frequency chip packaging in chip packaging. When in use, the PET release film is torn off, the adhesive film is pressed onto the chip through lamination, and is bonded to the chip after being heated and cured at 130-175°C.

[0018] The beneficial effects of the embodiments of the present invention are as follows:

[0019] The RF chip encapsulation adhesive film and preparation method thereof of the embodiments of the present invention are based on the special requirements of adhesive films for RF chips, preferably match epoxy resins and curing systems, and through scientific formulation and optimization of processing technology, prepare a series of high-performance adhesive films with high performance and wide adaptability that meet the actual requirements of RF chip packaging.

[0020] Its performance advantages are mainly reflected in the following points:

[0021] 1) High glass transition temperature

[0022] The embodiments of the present invention use epoxy resins with high functionality, such as trifunctional and tetrafunctional epoxy resins. After chemical reaction, a three-dimensional network structure with high crosslinking degree will appear in the molecular structure of the epoxy resin, further improving the glass transition temperature of the polymer, so that the product has more excellent physical properties. In addition, the present invention uses aromatic curing agents, which contain a large number of benzene ring structures in the molecular structure and have high reaction activity, which is more helpful to improve the glass transition temperature of the polymer and the overall performance of the polymer.

[0023] At the same time, the product uses a combination of high-functionality epoxy resin and aromatic amine curing agent, and its temperature resistance is very good. The reason is that there are many benzene ring structures with good temperature resistance in the molecular structure, as well as a spatial network structure with a higher cross-linking density. These special structures help to improve the high temperature resistance of the product and extend the service life of the finished product.

[0024] 2) Low linear expansion coefficient

[0025] The chip packaging field has high requirements for the linear expansion coefficient. The linear expansion coefficient of packaging materials is usually lower than 30-40ppm / ℃, and lower than 15ppm / ℃ in special cases. RF chip packaging belongs to the latter. In order to reduce the linear expansion coefficient of packaging film materials, the embodiments of the present invention focus on adjusting the resin system and powder filler.

[0026] The greater the crosslinking density of the epoxy resin, the lower the linear expansion coefficient of the product, and the denser the molecular structure of the product, the lower the linear expansion coefficient. As described in the first item, the embodiment of the present invention uses a high-functionality epoxy resin and an aromatic amine curing agent. This raw material combination is very beneficial to reducing the linear expansion coefficient of the product.

[0027] In addition, powder fillers play a more important role in reducing the linear expansion coefficient. Silica, especially spherical silica, has a low linear expansion coefficient of 3ppm / ℃. The introduction of spherical silica into the formulation system can significantly reduce the linear expansion coefficient of the product. More importantly, the use of spherical silica with different particle sizes can not only effectively adjust the viscosity of the mixture, but also significantly reduce the linear expansion coefficient.

[0028] 3) Low hygroscopicity

[0029] Due to the limitations of application scenarios, chip packaging film materials must have relatively low hygroscopicity to meet the needs of chips in sensitive environments such as moisture and temperature when used. To achieve this goal, the present invention proceeds from three aspects.

[0030] First, the molecular structure gap of conventional polymers is about 70 to 100 nm, and water vapor is usually difficult to penetrate. However, under high temperature and high pressure conditions, conventional polymers are difficult to resist the erosion of water vapor. Improving the compactness of the molecular structure and the cross-linking density of the polymer can effectively enhance the hygroscopicity of the polymer. The embodiment of the present invention uses a high-functionality epoxy resin with an aromatic amine curing agent to play a good role in this regard.

[0031] Second, powder fillers can greatly improve the hygroscopicity of the product. The embodiment of the present invention uses spherical silica and spherical alumina with regular structure. These powder fillers are evenly distributed in the film, which can prevent the penetration of water vapor and effectively keep the water vapor out of the product. More importantly, through the combination of powder fillers with different particle sizes, the gaps in the resin are almost filled with powder fillers, which improves the hygroscopicity of the product to a greater extent.

[0032] Third, the embodiments of the present invention use additives with special structures, such as dispersants and coupling agents, which can form connection points between epoxy resin and powder filler, enhance the compatibility and dispersion effect of epoxy resin and powder filler, and thus greatly improve the overall hygroscopicity of the product. In addition, coupling agents and dispersants are hydrophobic substances, and also have a good effect of preventing water vapor erosion.

[0033] 4) Thermal conductivity

[0034] Chip packaging materials need to have good thermal conductivity to conduct the heat generated during the operation of the chip in a timely and effective manner, protect the integrated circuit, and increase the service life of IC components.

[0035] An embodiment of the present invention provides two types of packaging film materials, one of which uses spherical silicon dioxide as a thermal conductive medium and has average thermal conductivity, and the other uses spherical aluminum oxide as a thermal conductive medium and has excellent thermal conductivity. This distinction can meet the actual needs of packaging plants and provide packaging companies with more choices. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 The invention relates to an adhesive film for radio frequency chip packaging and a preparation method thereof. DETAILED DESCRIPTION

[0037] The specific implementation of the present invention is described below in conjunction with the accompanying drawings.

[0038] First embodiment:

[0039] The radio frequency chip packaging adhesive includes component A and component B.

[0040] Component A includes 12.85% epoxy resin EP8403, 5% toughening agent MX-254, 1.5% black paste, 0.1% defoamer BYK-A530 and 0.1% defoamer BYK-066N, 0.35% coupling agent KBM-303, 0.1% dispersant BYK-9011, as well as 11.5% powder filler SC-2500SXJ, 5.6% powder filler NQ1160F, 52.3% powder filler SHA0200 and 10.6% powder filler Q099.

[0041] Component B includes 53.6% of aromatic amine curing agent 3,3'-diethyl-4,4'-diaminodiphenylmethane, 41.3% of alicyclic curing agent 3,3-dimethyl-4,4-diaminodicyclohexylmethane and 5.1% of curing agent accelerator AEP.

[0042] The mass ratio of component A to component B is 100:6.55.

[0043] The adhesive film for radio frequency chip packaging comprises a PET base film, an adhesive layer and a PET release film which are stacked in sequence, and the adhesive layer comprises the aforementioned radio frequency chip packaging adhesive.

[0044] A method for preparing an adhesive film for radio frequency chip packaging comprises the following steps:

[0045] Step S1, the materials in component A are sequentially put into a reaction kettle, heated and stirred, and discharged after vacuum degassing; the materials in component B are sequentially put into a reaction kettle, stirred, and discharged.

[0046] Specifically, when the materials in component A are sequentially added into the reactor, the heating temperature is 60°C, the stirring speed is 60r / min, the stirring time is 1.5h and vacuum degassing is performed. When the materials in component B are sequentially added into the reactor, the heating temperature is 40°C, the stirring speed is 60r / min and the stirring time is 2h.

[0047] Step S2, mixing component A and component B evenly according to a certain proportion, filtering and vacuum degassing to obtain a glue solution.

[0048] Step S3, the adhesive solution is transferred to a coating machine, and the adhesive solution is coated between the PET base film and the PET release film to obtain an adhesive film.

[0049] Specifically, the oven temperature of the coater is 50° C., the coating gap is 260 μm, the running speed is 1 m / min, and a film with a thickness of 105 μm is obtained.

[0050] Step S4, rolling and slitting to obtain a sheet or roll of film.

[0051] Second embodiment:

[0052] The radio frequency chip packaging adhesive includes component A and component B.

[0053] Component A includes 8.5% epoxy resin S-720, 4% toughening agent F-202, 1.7% black paste, 0.3% defoaming agent Dow Corning 163, 0.3% coupling agent A-187, 0.2% dispersant BYK-110, as well as 9.5% powder filler Q099, 12.3% powder filler Q600, 50.7% powder filler SHA0200 and 12.5% ​​powder filler NQ005.

[0054] Component B includes 61.1% of aromatic amine curing agent diethyltoluenediamine, 33.0% of alicyclic curing agent isophoronediamine and 5.9% of curing agent accelerator Accelerator 399.

[0055] Among them, the mass ratio of component A to component B is 100:7.39.

[0056] The adhesive film for radio frequency chip packaging comprises a PET base film, an adhesive layer and a PET release film which are stacked in sequence, and the adhesive layer comprises the aforementioned radio frequency chip packaging adhesive.

[0057] A method for preparing an adhesive film for radio frequency chip packaging comprises the following steps:

[0058] Step S1, the materials in component A are sequentially put into a reaction kettle, heated and stirred, and discharged after vacuum degassing; the materials in component B are sequentially put into a reaction kettle, stirred, and discharged.

[0059] Specifically, when the materials in component A are added to the reactor in sequence, the heating temperature is 70°C, the stirring speed is 80r / min, and the stirring time is 1h; when the materials in component B are added to the reactor in sequence, the heating temperature is 50°C, the stirring speed is 80r / min, and the stirring time is 1h.

[0060] Step S2, mixing component A and component B evenly according to a certain proportion, filtering and vacuum degassing to obtain a glue solution.

[0061] Step S3, the adhesive solution is transferred to a coating machine, and the adhesive solution is coated between the PET base film and the PET release film to obtain an adhesive film.

[0062] Specifically, the oven temperature of the coater is 80° C., the coating gap is 400 μm, the running speed is 1.5 m / min, and a film with a thickness of 260 μm is obtained.

[0063] Step S4, rolling and slitting to obtain a sheet or roll of film.

[0064] Third embodiment:

[0065] The radio frequency chip packaging adhesive includes component A and component B.

[0066] Component A includes 19.9% ​​epoxy resin SQSN-4132A70, 3% toughening agent RA1340, 1.2% black paste, 0.1% defoamer KS-603 and 0.2% defoamer BYK-A530, 0.5% coupling agent KBM-803, 0.1% dispersant BYK-163, and 11.2% powder filler SC-2500SXJ, 30.9% powder filler SHA0200, 25.7% powder filler NA1020W, and 7.2% powder filler QY10.

[0067] Component B includes 59.2% of aromatic amine curing agent diethyltoluenediamine, 38.3% of alicyclic curing agent 4,4'-diaminodicyclohexylmethane and 2.5% of curing agent accelerator AEP.

[0068] Among them, the mass ratio of component A to component B is 100:5.25.

[0069] The adhesive film for radio frequency chip packaging comprises a PET base film, an adhesive layer and a PET release film which are stacked in sequence, and the adhesive layer comprises the aforementioned radio frequency chip packaging adhesive.

[0070] A method for preparing an adhesive film for radio frequency chip packaging comprises the following steps:

[0071] Step S1, the materials in component A are sequentially put into a reaction kettle, heated and stirred, and discharged after vacuum degassing; the materials in component B are sequentially put into a reaction kettle, stirred, and discharged.

[0072] Specifically, when the materials in component A are added into the reactor in sequence, the heating temperature is 50°C, the stirring speed is 70r / min, and the stirring time is 2h; when the materials in component B are added into the reactor in sequence, the heating temperature is 30°C, the stirring speed is 70r / min, and the stirring time is 1.5h.

[0073] Step S2, mixing component A and component B evenly according to a certain proportion, filtering and vacuum degassing to obtain a glue solution.

[0074] Step S3, the adhesive solution is transferred to a coating machine, and the adhesive solution is coated between the PET base film and the PET release film to obtain an adhesive film.

[0075] Specifically, the oven temperature of the coater is 70° C., the coating gap is 350 μm, the running speed is 2 m / min, and a film with a thickness of 220 μm is obtained.

[0076] Step S4, rolling and slitting to obtain a sheet or roll of film.

[0077] Fourth embodiment:

[0078] The radio frequency chip packaging adhesive includes component A and component B.

[0079] Component A includes 8.4% epoxy resin EP 8404, 6% toughening agent MX-154, 1.9% black paste, 0.1% defoamer BYK-141 and 0.1% defoamer BYK-066N, 0.3% coupling agent KH-550, 0.2% dispersant BYK-9011, and 26.5% powder filler NA1020W, 13.3% powder filler QY10, and 43.2% powder filler NA1050W.

[0080] Component B contains 70.1% of aromatic amine curing agent 3,3'-diethyl-4,4'-diaminodiphenylmethane, 26.7% of alicyclic curing agent 3,3-dimethyl-4,4-diaminodicyclohexylmethane and 3.2% of curing agent accelerator Accelerator 399.

[0081] Among them, the mass ratio of component A to component B is 100:8.76.

[0082] The adhesive film for radio frequency chip packaging comprises a PET base film, an adhesive layer and a PET release film which are stacked in sequence, and the adhesive layer comprises the aforementioned radio frequency chip packaging adhesive.

[0083] A method for preparing an adhesive film for radio frequency chip packaging comprises the following steps:

[0084] Step S1, the materials in component A are sequentially put into a reaction kettle, heated and stirred, and discharged after vacuum degassing; the materials in component B are sequentially put into a reaction kettle, stirred, and discharged.

[0085] Specifically, when the materials in component A are sequentially added into the reactor, the heating temperature is 50°C, the stirring speed is 60r / min, and the stirring time is 1.5h. When the materials in component B are sequentially added into the reactor, the heating temperature is 45°C, the stirring speed is 90r / min, and the stirring time is 2h.

[0086] Step S2, mixing component A and component B evenly according to a certain proportion, filtering and vacuum degassing to obtain a glue solution.

[0087] Step S3, the adhesive solution is transferred to a coating machine, and the adhesive solution is coated between the PET base film and the PET release film to obtain an adhesive film.

[0088] Specifically, the oven temperature of the coater is 60° C., the coating gap is 300 μm, the running speed is 1.5 m / min, and a film with a thickness of 200 μm is obtained.

[0089] Step S4, rolling and slitting to obtain a sheet or roll of film.

[0090] Fifth embodiment:

[0091] The present invention also discloses the application of the aforementioned adhesive film for radio frequency chip encapsulation in chip encapsulation. When in use, the PET release film is torn off, the adhesive film is pressed onto the chip through film lamination, and then bonded to the chip after being heated and cured at 130-175°C. Specifically, since the adhesive film has fluidity and reactivity at room temperature, after being left at room temperature for a period of time, the adhesive film undergoes a certain proportion of reaction, loses fluidity, and improves processability, and can be attached to the chip, meeting the unique processing process of radio frequency chips.

[0092] Performance comparison test:

[0093] The epoxy resin films prepared in the first to fourth embodiments and epoxy resin films of foreign competitors were subjected to performance tests, and the results are shown in Table 1.

[0094] Table 1

[0095]

[0096]

[0097] Detection method:

[0098] Shear strength: According to ASTM D3165, 25℃.

[0099] Hot air test: 350~400℃ / 20S hot air test.

[0100] Glass transition temperature: measured according to ASTM E6604 using a differential scanning calorimeter at a heating rate of 10°C / min.

[0101] Linear expansion coefficient: According to ASTM E1545, 25°C. ɑ1 is the linear expansion coefficient of the low temperature range (30-80°C), and ɑ2 is the linear expansion coefficient of the high temperature range (120-180°C).

[0102] Curing shrinkage: According to DIN 16945, 25°C.

[0103] PCT water absorption: According to GB / T1034-1998, 121℃, RH100 / 72h.

[0104] Warpage: 25°C, diagonal method.

[0105] Thermal conductivity: According to ASTM C518, 25℃.

[0106] Thermal shock test: According to GB / T 2423.5-2019, cracking at -50℃~150℃.

[0107] It can be seen from the data in Table 1 that the RF chip encapsulation film provided by the present invention has the characteristics of good temperature resistance, high glass transition temperature, low linear expansion coefficient, low moisture absorption rate, small warping deformation and strong adhesion, and can meet the special requirements of RF chip encapsulation.

[0108] Specifically, the first to fourth embodiments can pass the hot air test of 350-400°C / 20S, there is no crack on the surface of the film, and the cross section is delicate, smooth and defect-free. The glass transition temperature is higher than 170°C and can withstand rigorous reliability testing. The linear expansion coefficient ɑ1 is lower than 17ppm / °C, which meets the requirements of advanced packaging for epoxy resin materials. The PCT water absorption rate is lower than 0.4%, which is better than the test threshold of 0.6-0.7%, and the hot and cold shock test shows that the embodiments provided by the present invention have good performance in resisting high and low temperature cycles. The first to fourth embodiments are also excellent in warping deformation. The cured film is tested by the diagonal method, and its warping deformation is not more than 5%. In addition, the embodiments provided by the present invention have good bonding properties, and the shear strength of the film is higher than 12MPa, which can be effectively bonded to the substrate, thereby improving the density and tightness of the bonding surface.

[0109] In order to reflect the differences, the characteristics of the first to fourth embodiments are distinguished. The first embodiment is a general-purpose product with good comprehensive performance and high cost performance, which can meet the general needs of RF chips. The second embodiment has the characteristics of high glass transition temperature, low linear expansion coefficient, and low PCT water absorption, and is suitable for application scenarios with higher requirements. The third embodiment has better bonding strength and resistance to hot and cold shock effects, and can be used in application scenarios with strict requirements on the bonding performance and temperature difference of the product. The thermal conductivity of the fourth embodiment is as high as 1.725W / (m·K), which is a product with good thermal conductivity, especially suitable for special applications with high chip wiring density, high degree of functionality, small chip size, and high requirements for the thermal conductivity of the chip.

[0110] In addition, the present invention selects a foreign competing product as a comparative example. It is not difficult to see from the data in Table 1 that compared with competing products, the embodiments provided by the present invention have advantages in temperature resistance, linear expansion coefficient, glass transition temperature, curing shrinkage, PCT water absorption, warping deformation, etc., and can completely replace foreign competing products in the field of chip packaging. Therefore, the embodiments provided by the present invention have outstanding superiority.

[0111] In summary, the embodiments of the present invention use epoxy resin, toughening agent, powder filler and special additives, with curing agent and accelerator, and through the optimization of the scientific compatibility of each component and raw materials, assisted by a reasonable processing method, to obtain a high-performance adhesive film for chip packaging with good temperature resistance, high glass transition temperature, low linear expansion coefficient, low moisture absorption rate, small warping deformation, and strong adhesion. Compared with foreign competing products, the embodiments provided by the present invention have outstanding advantages, can solve technical problems in the industry, and have broad market application prospects.

[0112] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0113] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. Radio frequency chip packaging adhesive, characterized in that: It includes component A and component B; The component A mainly includes epoxy resin, toughening agent, black paste, defoamer, coupling agent, dispersant and powder filler. By weight percentage, the epoxy resin accounts for 6-20.6% of the component A, the toughening agent accounts for 3-6% of the component A, the black paste accounts for 1-2% of the component A, the defoamer accounts for 0.1-0.3% of the component A, the coupling agent accounts for 0.2-0.5% of the component A, the dispersant accounts for 0.1-0.2% of the component A, and the powder filler accounts for 75-85% of the component A; The B component mainly includes an aromatic amine curing agent, an alicyclic curing agent and a curing agent accelerator. By weight percentage, the aromatic amine curing agent accounts for 52-78% of the B component, the alicyclic curing agent accounts for 20-42% of the B component, and the curing agent accelerator accounts for 2-6% of the B component; The mass ratio of component A to component B is 100:(5-9).

2. The radio frequency chip packaging adhesive according to claim 1, characterized in that: The epoxy resin is a trifunctional epoxy resin or a tetrafunctional epoxy resin.

3. The radio frequency chip packaging adhesive according to claim 1, characterized in that: The toughening agent is a core-shell toughening agent or a rubber toughening agent.

4. The radio frequency chip packaging adhesive according to claim 1, characterized in that: The defoaming agent is any one or two of BYK-A530, KS-603, BYK-141, BYK-066N and Dow Corning 163; the coupling agent is any one of KH-560, KH-550, A-187, KBM-303 and KBM-803; the dispersant is any one of BYK-9011, BYK-110, BYK-163 and SDJ-8110.

5. The radio frequency chip packaging adhesive according to claim 1, characterized in that: The powder filler is spherical silicon dioxide or spherical aluminum oxide with a particle size between 0.5 and 30 μm.

6. The radio frequency chip packaging adhesive according to claim 1, characterized in that: The aromatic amine curing agent is any one of diethyltoluenediamine and 3,3'-diethyl-4,4'-diaminodiphenylmethane; the alicyclic curing agent is any one of 3,3-dimethyl-4,4-diaminodicyclohexylmethane, isophoronediamine and 4,4'-diaminodicyclohexylmethane; the curing agent accelerator is any one of Accelerator 399 and AEP.

7. Adhesive film for radio frequency chip packaging, characterized in that: The adhesive film for radio frequency chip encapsulation comprises a PET base film, an adhesive layer and a PET release film stacked in sequence, and the adhesive layer comprises the radio frequency chip encapsulation adhesive according to any one of claims 1 to 6.

8. The method for preparing the adhesive film for radio frequency chip packaging according to claim 7, characterized in that: The following steps are involved: The materials in component A are sequentially put into the reactor, heated and stirred, and then discharged after vacuum degassing; the materials in component B are sequentially put into the reactor, stirred and then discharged; Mix component A and component B evenly according to the proportion, filter and vacuum degas to obtain glue solution; The adhesive liquid is transferred to a coating machine, and the adhesive liquid is coated between the PET base film and the PET release film to obtain an adhesive film; Rolling and slitting to obtain sheet or roll film.

9. The preparation method according to claim 8, characterized in that: When the materials in component A are sequentially added into the reactor, the heating temperature is 50-70°C, the stirring speed is 60-80r / min, and the stirring time is 1-2h; when the materials in component B are sequentially added into the reactor, the heating temperature is 30-50°C, the stirring speed is 60-90r / min, and the stirring time is 1-2h; The oven temperature of the coating machine is 50-80°C, the coating gap is 260-450 μm, the running speed is 1-2 m / min, and the obtained adhesive film has a thickness of 100-350 μm.

10. Application of the adhesive film for radio frequency chip packaging according to claim 7 in chip packaging, characterized in that: When in use, tear off the PET release film, press the adhesive film onto the chip after laminating, and bond it to the chip after heating and curing at 130-175℃.

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