Grid plate coating device and grid plate machining method

Abstract

The invention relates to the technical field of ship plate processing, in particular to a grid plate coating device and a grid plate processing method.The magnetic field intensity in a solution tank can be controlled by arranging a high-temperature-resistant electric wire, turning on a current generating device and adjusting the magnitude of current, so that the suspension height and position of a grid plate can be adjusted, and the coating effect of the grid plate is improved. Therefore, the grid plates are uniformly distributed in the plating solution, and a local plating layer is prevented from being too thick or too thin. And meanwhile, the grid plate is suspended in the plating solution by virtue of the magnetic field, and the grid plate is not shielded, so that complete galvanization is ensured. In addition, when the high-temperature-resistant wire is electrified, an electric field can be generated in the solution tank. And the electric field can adjust electrolyte distribution in the plating solution, so that the thickness and the uniformity of a plating layer are adjusted. The magnetic field can improve the flowing uniformity of the plating solution, so that the quality of a plating layer is improved.

Description

Technical Field

[0001] The invention relates to the technical field of ship plate processing, and in particular to a grid plate coating device and a grid plate processing method. Background Art

[0002] Polar ships are increasingly used. Grid plates are installed on ships. Grid plates are metal plates with grid structures. They are used to filter larger debris mixed in the inhaled seawater to prevent debris from blocking the device of the ship system accessories. Because the grid has good structural continuity, the seawater gate grid openings of ships sailing in polar regions are usually directly fixed with integrated grid plates on the outer plate.

[0003] The existing processing method requires surface treatment of the grid plate after opening holes in the grid plate. However, during the surface treatment process of the grid plate, such as hot-dip galvanizing, the unreasonable hanging position of the grid plate may cause the local coating to be too thick or too thin. At the same time, the hanging part will be blocked by the hanging equipment, and the blocked part cannot be hot-dip galvanized, resulting in incomplete galvanizing. Summary of the invention

[0004] In view of the shortcomings of the prior art mentioned above, the object of the present invention is to provide a grid plate coating device and a grid plate processing method, which are used to solve the problem in the prior art that when the grid plate is coated, the unreasonable hanging position of the grid plate leads to the local coating being too thick or too thin, and the hanging part is blocked by the hanging equipment, and the blocked part cannot be coated, resulting in incomplete coating.

[0005] To achieve the above-mentioned purpose and other related purposes, the present invention provides a grid plate coating device, which includes a solution tank, a high-temperature resistant wire and a current generating device. The solution tank can be used to hold the plating solution, and the high-temperature resistant wire is embedded in the inner wall of the solution tank. The two ends of the high-temperature resistant wire are respectively electrically connected to the positive and negative poles of the current generating device.

[0006] Optionally, the coating device further comprises a guide wire, which is also arranged on the inner wall of the solution tank, and is used for adsorbing free charges generated in the plating solution.

[0007] The present invention also provides a grid plate processing method, characterized in that, based on the grid plate coating device described above, the processing method comprises:

[0008] Making grid panels;

[0009] Clean the finished grid plate;

[0010] Place the grid plate in a solution tank containing plating solution, turn on the current generating device and adjust the current;

[0011] Remove the coated grid from the solution tank and cool it in a dry, ventilated and safe environment.

[0012] Optionally, the manufacturing of the grid plate includes:

[0013] Cut metal sheets into appropriate sizes and shapes;

[0014] Bend the cut metal sheets according to design requirements;

[0015] Welding of bent metal sheets;

[0016] Before welding the bent metal sheet, the metal sheet is preheated.

[0017] Optionally, before placing the grid plate in a solution tank containing a plating solution, the grid plate is preheated.

[0018] Optionally, the preheating temperature of the grid plate is 150° C.-200° C., and the preheating time is 30 min-120 min.

[0019] Optionally, the cleaning of the manufactured grid plate includes:

[0020] Collect data on grid plates;

[0021] Obtain the surface image of the entire grid plate and mark the oil stains and rust on the grid plate surface;

[0022] Clean the grid plate using cleaning equipment.

[0023] Optionally, the step of placing the grid plate in a solution tank containing a plating solution also includes stirring and heating the plating solution.

[0024] Optionally, the plating solution is a zinc plating solution, the plating temperature is 450° C.-460° C., and the plating time is 30 min-70 min.

[0025] Optionally, the zinc plating solution comprises zinc chloride, ammonium chloride and sodium chloride, and the mass ratio of the zinc chloride, the ammonium chloride and the sodium chloride is 25-40:0.1-0.5:0.1-0.6.

[0026] In a grid plate coating device and a grid plate processing method of the present invention, by setting a high temperature resistant wire, turning on a current generating device and adjusting the current size, the magnetic field strength in the solution tank can be controlled, so that the suspension height and position of the grid plate can be adjusted to make the grid plate evenly distributed in the plating solution, avoiding local plating being too thick or too thin. At the same time, the grid plate is suspended in the plating solution by relying on the magnetic field, and there is no obstruction to the grid plate to ensure complete galvanizing. In addition, the high temperature resistant wire will also generate an electric field in the solution tank when it is energized. The electric field can adjust the electrolyte distribution in the plating solution, thereby adjusting the thickness and uniformity of the coating. The magnetic field can improve the uniformity of the flow of the plating solution, thereby improving the quality of the coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram of a grid plate coating device according to an embodiment of the present invention;

[0028] Figure 2 It is a flow chart of a grid plate processing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] Refer to the following Figure 1 and Figure 2 To describe a grid plate coating device and a grid plate processing method of the present invention. In the description of this embodiment, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0030] like Figure 1 As shown, an embodiment of the present invention provides a grid plate plating device, comprising a solution tank 1, a high temperature resistant wire 2 and a current generating device 4. The solution tank 1 can be used to hold a plating solution. The high temperature resistant wire 2 is embedded in the inner wall of the solution tank 1, and the two ends of the high temperature resistant wire 2 are electrically connected to the positive and negative electrodes of the current generating device 4 respectively.

[0031] When the grid plate needs to be plated, the plating solution is poured into the solution tank 1. The grid plate is placed in the galvanizing solution, and the current generator 4 is turned on to energize the high temperature resistant wire 2. The high temperature resistant wire 2 will generate a magnetic field in the solution tank 1. The magnetic field strength T = (4π×10 -7)×I×N; wherein T is the magnetic field strength, I is the current, and N is the number of coil turns. By adjusting the current, the strength of the magnetic field can be controlled, so that the suspension height and position of the grid plate can be adjusted to make the grid plate evenly distributed in the plating solution to avoid excessive thickness or thinness of the local coating. At the same time, the grid plate is suspended in the plating solution by relying on the magnetic field, and there is no obstruction to the grid plate to ensure complete galvanizing. In addition, the high temperature resistant wire 2 will also generate an electric field in the solution tank 1 when it is energized. Among them, the electric field can adjust the distribution of electrolytes in the plating solution, thereby adjusting the thickness and uniformity of the coating. The magnetic field can improve the uniformity of the flow of the plating solution, thereby improving the quality of the coating.

[0032] Furthermore, the coating device also includes a guide wire 3, which is also arranged on the inner wall of the solution tank 1. The guide wire 3 is used to adsorb free charges generated in the plating solution. Optionally, the guide wire 3 is a metal wire. When the high temperature resistant wire 2 is energized, free charges will be generated in the plating solution. By setting the guide wire 3, the free charges can be guided to move along a fixed trajectory, and during the charge movement process, a weak magnetic field is generated as the charges gather, thereby achieving fine-tuning of the position and suspension state of the grid plate. At the same time, the guide wire 3 can disperse the charges around the high temperature resistant wire 2, reduce the electric field strength on the surface of the high temperature resistant wire 2, reduce the damage to the high temperature resistant wire 2 caused by charge accumulation, and increase the service life of the high temperature resistant wire 2.

[0033] like Figure 2 As shown, the present invention also provides a grid plate processing method based on the grid plate coating device in the above embodiment. The processing method includes:

[0034] Step S1, making a grid plate. Further, making a grid plate includes:

[0035] Cut the metal sheet into corresponding sizes and shapes. Specifically, use laser cutting, plasma cutting or water cutting equipment to cut the metal sheet into required sizes and shapes;

[0036] The cut metal sheet is bent according to the design requirements. Specifically, by using a bending machine or a roller press, the cut metal sheet is bent according to the design requirements to form a grid structure.

[0037] The bent metal sheets are welded. Specifically, the bent metal sheets are welded by welding equipment through a welding process to form a complete grid plate.

[0038] Furthermore, before welding the bent metal sheet, the metal sheet is preheated. By preheating the metal sheet, thermal stress during welding can be reduced, cracks can be avoided, and the quality of the welded joint can be improved.

[0039] Step S2, cleaning the finished grid plate. Further, cleaning the finished grid plate includes:

[0040] Collect data from the grid plate.

[0041] Get the surface image of the entire grid plate and mark the oil and rust on the grid plate surface.

[0042] Clean the grid plate using cleaning equipment.

[0043] By cleaning the oil and rust on the surface of the grid plate, uneven treatment during coating can be avoided, which will affect the anti-corrosion performance of the grid plate.

[0044] Step S3, placing the grid plate in a solution tank containing a plating solution, turning on the current generating device and adjusting the current size. Specifically, pour the plating solution into the solution tank, and use the suspension device to place the grid plate in the solution tank. In combination with the high temperature resistant wire and the guide wire on the inner wall of the solution tank, by turning on the current generating device and adjusting the current size, the magnetic field strength in the solution tank can be controlled, so that the suspension height and position of the grid plate can be adjusted to make the grid plate evenly distributed in the plating solution to avoid the local coating being too thick or too thin. At the same time, the grid plate is suspended in the plating solution by relying on the magnetic field, and the grid plate does not have any shielding to ensure complete galvanizing. In addition, the high temperature resistant wire will also generate an electric field in the solution tank when it is energized. The electric field can adjust the electrolyte distribution in the plating solution, thereby adjusting the thickness and uniformity of the coating. The magnetic field can improve the uniformity of the flow of the plating solution, thereby improving the quality of the coating. By setting the guide wire, the free charge can be guided to move along a fixed trajectory, and during the charge movement process, a weak magnetic field is generated as the charge gathers, thereby achieving fine adjustment of the position and suspension state of the grid plate. At the same time, the guide wire can disperse the electric charge around the high temperature resistant wire, reduce the electric field strength on the surface of the high temperature resistant wire, reduce the damage to the high temperature resistant wire caused by charge accumulation, and increase the service life of the high temperature resistant wire.

[0045] Furthermore, before placing the grid plate in the solution tank containing the plating solution, the grid plate is preheated. The preheating temperature of the grid plate is 150°C-200°C, and the preheating time is 30min-120min. By preheating the grid plate, the temperature difference between the metal plate and the plating solution can be reduced, thereby improving the quality of the plating layer.

[0046] Furthermore, the grid plate is placed in a solution tank containing a plating solution, and the plating solution is previously stirred and heated. The plating solution is a zinc plating solution, which includes zinc chloride, ammonium chloride and sodium chloride. The mass ratio of zinc chloride, ammonium chloride and sodium chloride is 25-40:0.1-0.5:0.1-0.6. Optionally, the ratio of zinc chloride, ammonium chloride and sodium chloride is 25:0.1:0.1. The plating solution temperature is 450°C-460°C, and the plating time is 30min-70min. By stirring and heating the plating solution, the adhesion of the plating solution can be improved and the quality of the surface of the coating can be improved.

[0047] Step S4, take out the plated grid plate from the solution tank and cool it in a dry, ventilated and safe environment. By cooling the plated grid plate in a dry environment and avoiding exposure to humid conditions, water stains and oxidation on the surface of the coating can be prevented. Good ventilation can ensure that the cooling environment is conducive to rapid cooling of the coating and maintaining its uniformity.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A grid plate coating device, characterized in that: The plating device includes a solution tank, a high temperature resistant wire and a current generating device. The solution tank can be used to hold the plating solution. The high temperature resistant wire is embedded in the inner wall of the solution tank. The two ends of the high temperature resistant wire are respectively electrically connected to the positive and negative electrodes of the current generating device.

2. The grid plate coating device according to claim 1, characterized in that: The coating device further comprises a guide wire, which is also arranged on the inner wall of the solution tank and is used for adsorbing free charges generated in the plating solution.

3. A grid plate processing method, characterized in that: Based on the grid plate coating device according to claim 2, the processing method comprises: Making grid panels; Clean the finished grid plate; Place the grid plate in a solution tank containing plating solution, turn on the current generating device and adjust the current; Remove the coated grid from the solution tank and cool it in a dry, ventilated and safe environment.

4. The grid plate processing method according to claim 3, characterized in that: The method for making the grid plate comprises: Cut metal sheets into appropriate sizes and shapes; Bend the cut metal sheets according to design requirements; Welding of bent metal sheets; Before welding the bent metal sheet, the metal sheet is preheated.

5. The grid plate processing method according to claim 3, characterized in that: Prior to placing the grid plate in a solution tank containing a plating solution, the grid plate is preheated.

6. The grid plate processing method according to claim 5, characterized in that: The preheating temperature of the grid plate is 150° C.-200° C., and the preheating time is 30 min-120 min.

7. The grid plate processing method according to claim 3, characterized in that: The cleaning of the manufactured grid plate comprises: Collect data on grid plates; Obtain the surface image of the entire grid plate and mark the oil stains and rust on the grid plate surface; Clean the grid plate using cleaning equipment.

8. The grid plate processing method according to claim 3, characterized in that: The grid plate is placed in a solution tank containing plating solution, and the plating solution is stirred and heated before that.

9. The grid plate processing method according to claim 8, characterized in that: The plating solution is a zinc plating solution, the plating temperature is 450° C.-460° C., and the plating time is 30 min-70 min.

10. The grid plate processing method according to claim 9, characterized in that: The zinc plating solution comprises zinc chloride, ammonium chloride and sodium chloride, and the mass ratio of the zinc chloride, the ammonium chloride and the sodium chloride is 25-40:0.1-0.5:0.1-0.6.

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