A high-performance hemispherical resonator gyroscope measurement system

Abstract

The present invention relates to the field of high-precision gyroscope devices, and particularly to a high-performance hemispherical resonator gyroscope measurement system. The system includes: a measurement module that measures the measurement angular velocity of the object to be measured through a hemispherical resonator gyroscope; a temperature monitoring module that includes a temperature sensor and is used to monitor the housing temperature of the sealed housing; a temperature conversion module, where the temperature monitoring module and the temperature conversion module are electrically connected, and the temperature conversion module is used to convert the housing temperature into the oscillator temperature of the resonator; and an output correction module, where the measurement module and the temperature conversion module are both electrically connected to the output correction module, and the output correction module can correct the measurement angular velocity according to the oscillator temperature, obtain the corrected angular velocity of the measurement object and output it. It is possible to balance the influence of temperature changes on the output data of the hemispherical resonator gyroscope through compensation means, thereby improving the measurement accuracy of the hemispherical resonator gyroscope.

Description

Technical Field

[0001] The present invention relates to the field of high-precision gyroscope devices, and particularly to a high-performance hemispherical resonator gyroscope measurement system. Background Art

[0002] A hemispherical resonator gyroscope (HRG) is a high-precision gyroscope with inertial navigation level performance, which relies on a hemispherical resonator to achieve precise measurement of angular velocity and angle changes. However, during the operation of the hemispherical resonator gyroscope, the change in the ambient temperature where the hemispherical resonator gyroscope is located will cause the temperature of the resonator to change, which will in turn cause parameters such as the Young's modulus, density, radius, and Poisson's ratio of the resonator to change, affecting the output accuracy of the gyroscope.

[0003] Usually, by monitoring the oscillator temperature of the resonator, and then correcting the angular velocity measured by the hemispherical resonator gyroscope through the oscillator temperature, the measurement accuracy of the hemispherical resonator gyroscope can be improved. However, for a high-performance hemispherical resonator gyroscope, its resonator is usually hermetically encapsulated in a sealed housing. The sealed housing is compact, with a narrow internal space, and in order to improve the stability of the resonance frequency and the measurement accuracy, the sealed housing is usually evacuated to a low pressure or vacuum to reduce the influence of air resistance on the resonance motion. In this regard, if a temperature sensor is set inside the sealed housing of the hemispherical resonator gyroscope, it will increase the assembly difficulty of the hemispherical resonator gyroscope. In addition, even if the temperature sensor is installed inside the sealed housing, if the distance between the temperature sensor and the resonator is far, in the case of a change in the external temperature of the sealed housing, a certain temperature gradient will appear inside the sealed housing, and the temperature value feedback by the temperature sensor cannot accurately reflect the temperature of the resonator; if the distance between the temperature sensor and the resonator is close, although the temperature of the resonator can be monitored more accurately, it is easy to affect the resonance motion due to being close to the resonator, and even come into contact with the resonator during the vibration of the resonator.

[0004] Therefore, there is an urgent need to propose a high-performance hemispherical resonator gyroscope measurement system, which balances the influence of temperature changes on the output data of the hemispherical resonator gyroscope through compensation means, and then improves the measurement accuracy of the hemispherical resonator gyroscope. Summary of the Invention

[0005] The object of the present invention is to provide a high-performance hemispherical resonator gyroscope measurement system, which can at least partially overcome the above technical problems, balance the influence of temperature changes on the output data of the hemispherical resonator gyroscope through compensation means, and then improve the measurement accuracy of the hemispherical resonator gyroscope, and can monitor the temperature of the resonator without changing the original assembly structure of the hemispherical resonator gyroscope and thus increasing the assembly difficulty.

[0006] A high-performance hemispherical resonator gyroscope measurement system provided by the present invention includes: a measurement module, the measurement module includes a hemispherical resonator gyroscope, the resonator of the hemispherical resonator gyroscope is encapsulated inside a sealed housing, the sealed housing is installed on a measurement object, and the measurement module measures the measurement angular velocity of the measurement object through the hemispherical resonator gyroscope; a temperature monitoring module, the temperature monitoring module includes a temperature sensor, the temperature sensor is arranged on the outer surface of the sealed housing, and the temperature monitoring module is used to monitor the housing temperature of the sealed housing; a temperature conversion module, the temperature monitoring module and the temperature conversion module are electrically connected, and the temperature conversion module is used to convert the housing temperature into the oscillator temperature of the resonator; and an output correction module, the measurement module and the temperature conversion module are both electrically connected to the output correction module, and the output correction module can correct the measurement angular velocity according to the oscillator temperature to obtain the corrected angular velocity of the measurement object and output it.

[0007] Further, the sealed housing is composed of a cylindrical base and a hemispherical shell top cover, and the open side of the cylindrical base and the open side of the hemispherical shell top cover are hermetically connected to each other; the resonator is installed on the cylindrical base, the lip edge of the resonator is flush with the open side of the cylindrical base, and the housing of the resonator is concentric with the hemispherical shell top cover; the inside of the sealed housing is evacuated.

[0008] Further, the temperature conversion module converts the housing temperature into the oscillator temperature in the following manner:

[0009] ,

[0010] wherein, T Z ( t n ) is the oscillator temperature at the n th time step, Δt is the time step, σ is the Stefan-Boltzmann constant, A Z is the effective thermal radiation area of the resonator, m Z is the mass of the resonator, c Z is the specific heat capacity of the resonator, ε K is the emissivity of the sealed housing, A K is the effective thermal radiation area of the sealed housing, ε Z is the emissivity of the resonator, T C ( tn ) is the housing temperature at the n th time step.

[0011] Furthermore, a plurality of heat-conducting ridges are provided on the outer surface of the sealed housing, and a plurality of outwardly extending support legs are also provided on the outer surface of the sealed housing. An installation portion is provided at the end of the support legs. The hemispherical resonator gyroscope is installed on the measurement object through the installation portion, so that there is a gap between the sealed housing and the measurement object.

[0012] Furthermore, a plurality of circumferentially uniformly distributed bosses are fixedly provided on the measurement object. An installation table is provided at one end of the boss away from the measurement object. A card slot is provided on one side of the installation table facing the measurement object. In the direction from the bottom of the card slot to the opening of the card slot, the width of the card slot gradually increases. An elastic body is also provided on the measurement object. The elastic body is located inside the ring formed by the bosses, and one end of the elastic body is fixedly connected to the measurement object. Each of the installation portions corresponds to each of the installation tables one by one, and a tenon corresponding to the card slot is provided on the installation portion. When the sealed housing is installed on the measurement object, each of the tenons is correspondingly clamped in each of the card slots, and the other end of the elastic body abuts against each of the installation portions and repels the installation portions in a direction away from the measurement object.

[0013] Furthermore, a plurality of the temperature sensors are provided, and each of the temperature sensors is uniformly arranged on the outer surface of the sealed housing. The housing temperature is the average value of the temperature values monitored by each of the temperature sensors.

[0014] Furthermore, the output correction module corrects the measured angular velocity in the following manner:

[0015] Obtain the mapping relationship among the oscillator temperature, the measured angular velocity, and the angular velocity deviation through a temperature chamber test; substitute the current oscillator temperature and the measured angular velocity into the mapping relationship to obtain the current angular velocity deviation; obtain the current corrected angular velocity based on the current angular velocity deviation and the measured angular velocity.

[0016] Furthermore, the temperature chamber used in the temperature chamber test includes a heat preservation chamber and a turntable located inside the heat preservation chamber. The turntable can rotate at a preset speed. The temperature chamber test includes:

[0017] Install the sealed housing of the hemispherical resonator gyroscope on the turntable, adjust the temperature of the incubator to the first preset temperature and keep it warm for a preset duration, so that the temperature of the oscillator is equal to the first preset temperature; rotate the turntable and gradually increase the rotational speed of the turntable, measure the measured angular velocity of the turntable through the measurement module, and record the rotational speed of the turntable and the measured angular velocity corresponding to this rotational speed in real time; according to the rotational speed of the mounting table and the measured angular velocity, obtain the relationship between the measured angular velocity and the angular velocity deviation at the first preset temperature.

[0018] Further, within the operating temperature range of the hemispherical resonator gyroscope, determine multiple test temperatures at a preset temperature gradient. Through the above-mentioned incubator test, obtain the relationship between the measured angular velocity and the angular velocity deviation corresponding to multiple test temperatures, and construct a mapping relationship of oscillator temperature - measured angular velocity - angular velocity deviation.

[0019] Further, the corrected angular velocity of the measurement object is obtained according to the following method:

[0020] Obtain the mapping relationship of oscillator temperature - measured angular velocity - angular velocity deviation of the hemispherical resonator gyroscope through the incubator test; install the sealed housing of the hemispherical resonator gyroscope on the measurement object, and then obtain the measured angular velocity and oscillator temperature of the measurement object; when the oscillator temperature is equal to one of the test temperatures, determine the angular velocity deviation according to the relationship between the measured angular velocity and the angular velocity deviation at this test temperature, and then obtain the corrected angular velocity of the measurement object; when the oscillator temperature is not equal to any of the test temperatures, obtain the angular velocity deviations corresponding to each test temperature at this measured angular velocity, and then fit the angular velocity deviations corresponding to each temperature point within the operating temperature range of the hemispherical resonator gyroscope, and then obtain the corrected angular velocity of the measurement object.

[0021] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0022] 1. The high-performance hemispherical resonator gyroscope measurement system provided by the embodiments of the present disclosure makes the temperature of the oscillator equal to the temperature of the housing at the initial moment. On this basis, Δtis the time step, which can convert the housing temperature at the current time step and the oscillator temperature at the current time step into the oscillator temperature at the next time step. Since the housing temperature is monitored in real time by the temperature monitoring module, the housing temperatures at each time step can be converted into the corresponding oscillator temperatures in the above manner. Then, the output correction module can correct the measured angular velocity according to the oscillator temperature, thereby realizing temperature compensation and making the accuracy of the angular velocity measurement result output by the hemispherical resonator gyroscope higher; moreover, the high-performance hemispherical resonator gyroscope measurement system monitors the temperature of the resonator by monitoring the temperature of the sealed housing, that is, no additional components are added inside the packaging structure of the hemispherical resonator gyroscope, thus not increasing the assembly difficulty of the hemispherical resonator gyroscope and not having a potential impact on the vibration of the resonator;

[0023] 2. The high-performance hemispherical resonator gyroscope measurement system provided by the embodiments of the present disclosure can make the temperature of the sealed housing more uniform by setting heat-conducting ribs, thereby making the actual heat conduction process between the sealed housing and the resonator more consistent with the heat conduction process set in the process of converting the housing temperature into the oscillator temperature, and thus making the converted oscillator temperature more accurate; in addition, the heat-conducting ribs can increase the structural strength of the sealed housing, so that the sealed housing itself can be thinner, which is also beneficial to reducing the difference between the outer surface temperature and the inner surface temperature of the sealed housing, and thus making the temperature of the sealed housing monitored by the temperature monitoring module on the outer surface of the sealed housing equal to the temperature of the inner surface of the sealed housing, which can make the converted oscillator temperature more accurate;

[0024] 3. The high-performance hemispherical resonator gyroscope measurement system provided by the embodiments of the present disclosure obtains the mapping relationship between the oscillator temperature - measured angular velocity - angular velocity deviation of the hemispherical resonator gyroscope through a temperature chamber test. Then, when the oscillator temperature and the measured angular velocity among the three are known, the corresponding angular velocity deviation can be obtained, and then the angular velocity deviation and the measured angular velocity are added together to obtain the corrected angular velocity of the measurement object. Description of the Drawings

[0025] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, form a part of this application, and do not limit the embodiments of the present invention. In the drawings:

[0026] Figure 1 is the structural block diagram of the high-performance hemispherical resonator gyroscope measurement system shown according to the embodiments of the present invention;

[0027] Figure 2 is the three-dimensional structural schematic diagram of the hemispherical resonator gyroscope of the high-performance hemispherical resonator gyroscope measurement system shown according to the embodiments of the present invention installed on the measurement object;

[0028] Figure 3 Schematic diagram of the installation process of the hemispherical resonator gyroscope shown according to an embodiment of the present invention on a measurement object;

[0029] Figure 4 According to Figure 1 Vertical sectional view shown, wherein the cutting plane passes through the axis of the resonator;

[0030] Figure 5 According to Figure 1 Another vertical sectional view shown, wherein the cutting plane passes through the transverse slot. In the figure, the right drawing is a partial enlarged view of the corresponding area of the left drawing.

[0031] Marks in the drawings and corresponding component names:

[0032] 1 - Resonator; 2 - Sealed housing; 21 - Cylindrical base; 211 - Support; 212 - Mounting seat; 22 - Hemispherical shell top cover; 23 - Heat - conducting rib; 24 - Support leg; 25 - Mounting part; 251 - Tenon; 3 - Measurement object; 31 - Boss; 32 - Mounting table; 33 - Slot; 34 - Elastomer. Detailed implementation manners

[0033] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with embodiments and drawings. The illustrative embodiments of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention. It should be noted that the present invention has been in the actual R & D and use stage.

[0034] The hemispherical resonator gyroscope is a high - precision gyroscope that relies on the hemispherical resonator to achieve precise measurement of angular velocity and angular change. However, during the operation of the hemispherical resonator gyroscope, the change in the ambient temperature where the hemispherical resonator gyroscope is located will cause the temperature of the resonator to change, and then lead to changes in parameters such as Young's modulus, density, radius, and Poisson's ratio of the resonator, affecting the gyro output accuracy.

[0035] In order to ensure the accuracy of the hemispherical resonator gyroscope, a temperature - stabilization method is usually adopted. By adding a temperature - control system outside the gyroscope, the hemispherical resonator gyroscope can work in a constant - temperature environment. However, setting up a temperature - control system will make the structure of the hemispherical resonator gyroscope redundant and its volume increase, which is not conducive to its miniaturization design requirements. Therefore, the present invention provides a high - performance hemispherical resonator gyroscope measurement system, which adopts a temperature - compensation method to compensate the output data of the hemispherical resonator gyroscope, and then balances the influence of temperature change on the output data of the hemispherical resonator gyroscope, achieving the purpose of improving the measurement accuracy of the hemispherical resonator gyroscope.

[0036] Embodiment 1:

[0037] As shown in Figure 1 the figure, this embodiment provides a high-performance hemispherical resonator gyroscope measurement system, which includes:

[0038] A measurement module, the measurement module includes a hemispherical resonator gyroscope, the resonator 1 of the hemispherical resonator gyroscope is encapsulated inside a sealed housing 2, the sealed housing 2 is installed on a measurement object 3, and the measurement module measures the measurement angular velocity of the measurement object 3 through the hemispherical resonator gyroscope;

[0039] A temperature monitoring module, the temperature monitoring module includes a temperature sensor, the temperature sensor is arranged on the outer surface of the sealed housing 2, and the temperature monitoring module is used to monitor the housing temperature of the sealed housing 2;

[0040] A temperature conversion module, the temperature monitoring module and the temperature conversion module are electrically connected, and the temperature conversion module is used to convert the housing temperature into the oscillator temperature of the resonator 1; and,

[0041] An output correction module, the measurement module and the temperature conversion module are both electrically connected to the output correction module, and the output correction module can correct the measurement angular velocity according to the oscillator temperature to obtain the corrected angular velocity of the measurement object 3 and output it.

[0042] Preferably, the inside of the sealed housing 2 is evacuated.

[0043] Specifically, the temperature conversion module converts the housing temperature into the oscillator temperature in the following manner:

[0044] ,

[0045] wherein, T Z ( t n ) is the oscillator temperature at the n th time step, Δt is the time step, σ is the Stefan-Boltzmann constant, A Z is the effective thermal radiation area of the resonator 1, m Z is the mass of the resonator 1, c Z is the specific heat capacity of the resonator 1, ε K is the emissivity of the sealed housing 2, A K is the effective thermal radiation area of the sealed housing 2, ε Zis the emissivity of the harmonic oscillator 1, T C ( t n ) is the housing temperature at the n th time step.

[0046] Accordingly, by making the temperature of the oscillator at the initial moment equal to the housing temperature (for example, storing the hemispherical resonator gyroscope in a heat-insulated environment for a preset duration so that the temperature of the oscillator is equal to the temperature of the sealed housing 2, and then installing the hemispherical resonator gyroscope on the measurement object 3), on this basis, with Δt as the time step, the housing temperature at the current time step and the oscillator temperature at the current time step are converted into the oscillator temperature at the next time step according to the above method. Since the housing temperature is monitored in real time by the temperature monitoring module, the housing temperature at each time step can be converted into the corresponding oscillator temperature through the above method. Then, the output correction module can correct the measured angular velocity according to the oscillator temperature, thereby realizing temperature compensation and making the accuracy of the angular velocity measurement result output by the hemispherical resonator gyroscope higher. And the high-performance hemispherical resonator gyroscope measurement system monitors the temperature of the harmonic oscillator 1 by monitoring the temperature of the sealed housing 2, that is, no additional components are added inside the packaging structure of the hemispherical resonator gyroscope, thus not increasing the assembly difficulty of the hemispherical resonator gyroscope and not having a potential impact on the vibration of the harmonic oscillator 1.

[0047] Preferably, as Figures 2 to 5 shown, the sealed housing 2 is composed of a cylindrical base 21 and a hemispherical shell top cover 22, and the open side of the cylindrical base 21 and the open side of the hemispherical shell top cover 22 are hermetically connected face to face; it should be understood that a heat-conducting dressing, such as heat-conducting silica gel, is provided between the interfaces of their hermetic connection;

[0048] The harmonic oscillator 1 is installed on the cylindrical base 21, the lip edge of the harmonic oscillator 1 is flush with the open side of the cylindrical base 21, and the housing of the harmonic oscillator 1 is concentric with the hemispherical shell top cover 22.

[0049] More specifically, as Figure 4 shown, one end of the cylindrical base 21 is open and the other end is closed. A support 211 is provided on the plate surface of the closed side of the cylindrical base 21 facing the open side of the cylindrical base 21, and a mounting seat 212 is provided on the end surface of the support 211 facing the open side of the cylindrical base 21. The shaft of the harmonic oscillator 1 is installed in the mounting seat 212. Preferably, the support 211 is made of heat-insulating material.

[0050] Accordingly, the heat transfer between the sealed housing 2 and the harmonic oscillator 1 is only thermal radiation, which can greatly simplify the effective thermal radiation area of the harmonic oscillator 1 and the effective thermal radiation area of the sealed housing 2 in the process of converting the housing temperature into the oscillator temperature.

[0051] It should be understood that in the above-mentioned high-performance hemispherical resonator gyroscope measurement system, since the process of converting the housing temperature to the oscillator temperature is "iterative", the error of the converted oscillator temperature will increase with the increase of the number of iterations. For this reason, the high-performance hemispherical resonator gyroscope measurement system provided in this embodiment needs to be "reset" in a timely manner, that is, when the number of iterations is greater than the preset number of iterations (that is, in the case of a large error, the preset number of iterations is determined by experiments and will not be elaborated), by means of, for example, storing the hemispherical resonator gyroscope in a heat-insulated environment for a preset duration, so that the oscillator temperature is equal to the housing temperature, and then restarting the iterative calculation, thereby avoiding too large an error in the converted oscillator temperature and being beneficial to ensuring the accuracy of the output corrected angular velocity. Preferably, in the above process, after selecting the initial time step, the time step is dynamically adjusted during the iterative calculation. If the change amount of the housing temperature per unit time is greater than the first preset threshold, the time step is reduced to be less than the initial time step. If the change amount of the housing temperature per unit time is less than the second preset threshold, the time step is increased to be greater than the initial time step. If the change amount of the housing temperature per unit time is between the first preset threshold and the second preset threshold, the time step is maintained at the initial time step. Accordingly, by dynamically adjusting the time step, it is beneficial to balance the number of iterations and the conversion accuracy.

[0052] Preferably, continuing to refer to Figures 2 to 5 , a plurality of heat-conducting ribs 23 are provided on the outer surface of the sealed housing 2 (that is, heat-conducting ribs are provided on the outer surfaces of both the cylindrical base 21 and the hemispherical shell top cover 22), and a plurality of outwardly extending support feet 24 are further provided on the outer surface of the sealed housing 2 (illustrated as the case where the support feet 24 are provided on the cylindrical base 21), and an installation portion 25 is provided at the end of the support feet 24;

[0053] The hemispherical resonator gyroscope is installed on the measurement object 3 through the installation portion 25, so that there is a gap between the sealed housing 2 and the measurement object 3.

[0054] More preferably, these heat-conducting ribs 23 include meridional ribs (that is, Figure 2 the transverse heat-conducting ribs 23 in Figure 2 and latitudinal ribs (that is,

[0055] Thus, these heat-conducting ribs 23 can make the temperature of the sealed housing 2 more uniform, so that the actual heat conduction process between the sealed housing 2 and the resonator 1 is more consistent with the set heat conduction process in the process of converting the housing temperature into the resonator temperature, and thus the converted resonator temperature is more accurate. In addition, the heat-conducting ribs 23 can increase the structural strength of the sealed housing 2, so that the sealed housing 2 itself can be thinner, which is also beneficial to reducing the difference between the outer surface temperature and the inner surface temperature of the sealed housing 2. Thus, the temperature of the sealed housing 2 monitored by the temperature monitoring module on the outer surface of the sealed housing 2 is equal to the temperature of the inner surface of the sealed housing 2, and the converted resonator temperature can be more accurate.

[0056] More preferably, a plurality of circumferentially evenly distributed bosses 31 are fixedly arranged on the measurement object 3. An installation table 32 is arranged at one end of the boss 31 away from the measurement object 3. A card slot 33 is arranged on the side of the installation table 32 facing the measurement object 3. In the direction from the bottom of the card slot 33 to the opening of the card slot 33, the width of the card slot 33 gradually increases.

[0057] An elastomer 34 is further arranged on the measurement object 3. The elastomer 34 is located inside the ring formed by the bosses 31, and one end of the elastomer 34 is fixedly connected to the measurement object 3.

[0058] Each of the installation parts 25 corresponds to each of the installation tables 32, and a tenon 251 corresponding to the card slot 33 is arranged on the installation part 25.

[0059] When the sealed housing 2 is installed on the measurement object 3, each of the tenons 251 is correspondingly clamped in each of the card slots 33, and the other end of the elastomer 34 abuts against each of the installation parts 25 and repels the installation part 25 in a direction away from the measurement object 3.

[0060] Specifically, the elastomer 34 can be a spring, an elastic gasket or an elastic washer. The illustrated elastomer 34 is an elastic washer.

[0061] Accordingly, when installing the hemispherical resonator gyroscope onto the measurement object 3, it is only necessary to misalign the installation part 25 with the installation table 32 and then press it against the elastic body 34, causing the elastic body 34 to contract. Then, rotate the sealed housing 2 so that the tenon 251 aligns with the card slot 33, release the sealed housing 2, and complete the installation under the repulsive action of the elastic body 34. That is, rapid disassembly and assembly can be achieved between the hemispherical resonator gyroscope and the measurement object 3. Furthermore, in the case where it is necessary to continuously monitor the angular velocity of the measurement object 3 for a long time, by quickly replacing the hemispherical resonator gyroscope, the angular velocity monitoring blank period caused by "zeroing" can be reduced. By replacing the hemispherical resonator gyroscope, the high-performance hemispherical resonator gyroscope measurement system can be applied to the application scenario of continuously monitoring the angular velocity of the measurement object 3 for a long time, and the situation of excessive error in the oscillator temperature caused by multiple iterations will not occur. In addition, the structural design of the card slot 33 can not only play a role in guiding and introducing the tenon 251 when installing the hemispherical resonator gyroscope, but also ensure that during the process of monitoring the angular velocity of the measurement object 3, the hemispherical resonator gyroscope will not rotate relative to the measurement object 3 (that is, it will not rotate relative to the ring formed by the convex platforms 31 when the angular velocity of the measurement object 3 suddenly changes. Specifically, it is achieved by the repulsive action of the elastic body 34 and the positioning function of the structure that "the width of the card slot 33 gradually increases from the bottom of the card slot 33 to the opening of the card slot 33").

[0062] Preferably, there are multiple temperature sensors, and each of the temperature sensors is uniformly arranged on the outer surface of the sealed housing 2, and the housing temperature is the average value of the temperature values monitored by each of the temperature sensors.

[0063] Accordingly, on the basis of the above-mentioned arrangement of the heat-conducting ribs 23 to equalize the temperature of the sealed housing 2, by arranging multiple temperature sensors on the outer surface of the sealed housing 2 and then using the average value of the temperature values monitored by each sensor as the housing temperature, accidental errors can be further avoided, and thus the accuracy of the converted oscillator temperature can be ensured.

[0064] Embodiment 2:

[0065] This embodiment is based on Embodiment 1, and the difference is that in this embodiment:

[0066] The output correction module corrects the measured angular velocity in the following manner:

[0067] Obtain the mapping relationship among the oscillator temperature, the measured angular velocity, and the angular velocity deviation through a temperature chamber test;

[0068] Substitute the current oscillator temperature and the measured angular velocity into the mapping relationship to obtain the current angular velocity deviation;

[0069] Obtain the current corrected angular velocity based on the current angular velocity deviation and the measured angular velocity.

[0070] Specifically, the incubator used in the incubator test includes an insulation chamber and a turntable located inside the insulation chamber, and the turntable can rotate at a preset speed;

[0071] The incubator test includes:

[0072] Install the sealed housing 2 of the hemispherical resonator gyroscope on the turntable, adjust the insulation chamber to a first preset temperature and keep it warm for a preset duration so that the oscillator temperature is equal to the first preset temperature;

[0073] Rotate the turntable and gradually increase the speed of the turntable, measure the measured angular velocity of the turntable through the measurement module, and record the turntable speed and the measured angular velocity corresponding to this speed in real time;

[0074] Based on the speed of the mounting table 32 and the measured angular velocity, obtain the relationship between the measured angular velocity and the angular velocity deviation at the first preset temperature.

[0075] Furthermore, within the operating temperature range of the hemispherical resonator gyroscope, determine multiple test temperatures at a preset temperature gradient. Through the above incubator test, obtain the relationship between the measured angular velocity and the angular velocity deviation corresponding to multiple test temperatures, and construct a mapping relationship of oscillator temperature - measured angular velocity - angular velocity deviation.

[0076] Specifically, the corrected angular velocity of the measurement object 3 is obtained according to the following method:

[0077] Obtain the mapping relationship of oscillator temperature - measured angular velocity - angular velocity deviation of the hemispherical resonator gyroscope through the incubator test;

[0078] Install the sealed housing 2 of the hemispherical resonator gyroscope on the measurement object 3, and then obtain the measured angular velocity and oscillator temperature of the measurement object 3;

[0079] When the oscillator temperature is equal to one of the test temperatures, determine the angular velocity deviation according to the relationship between the measured angular velocity and the angular velocity deviation at this test temperature, and then obtain the corrected angular velocity of the measurement object 3;

[0080] When the oscillator temperature is not equal to any of the test temperatures, obtain the angular velocity deviations corresponding to each test temperature at this measured angular velocity, and then fit the angular velocity deviations corresponding to each temperature point within the operating temperature range of the hemispherical resonator gyroscope, and then obtain the corrected angular velocity of the measurement object 3.

[0081] Accordingly, in this embodiment, the mapping relationship of the oscillator temperature - measured angular velocity - angular velocity deviation of the hemispherical resonator gyroscope (i.e., the three-dimensional correspondence between the oscillator temperature, measured angular velocity, and angular velocity deviation) is obtained through the incubator test. Furthermore, when the oscillator temperature and measured angular velocity among the three are known, the corresponding angular velocity deviation can be obtained. Then, by adding the angular velocity deviation and the measured angular velocity, the corrected angular velocity of the measurement object 3 can be obtained. In the above process, by setting an appropriate preset temperature gradient, the time required for the test can be reduced, and the temperature gradient can be refined through fitting, thereby obtaining the complete mapping relationship of the oscillator temperature - measured angular velocity - angular velocity deviation.

[0082] It should be understood that "obtaining the angular velocity deviation corresponding to each test temperature at the measured angular velocity and then fitting the angular velocity deviation corresponding to each temperature point within the operating temperature range of the hemispherical resonator gyroscope" can also be achieved by the interpolation method. Both the "fitting method" and the "interpolation method" used in this process belong to the prior art and will not be elaborated here.

[0083] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high performance hemispherical resonator gyroscope measurement system, characterized in that: include: A measurement module, the measurement module comprising a hemispherical resonator gyroscope, the resonator (1) of the hemispherical resonator gyroscope being encapsulated inside a sealed housing (2), the sealed housing (2) being mounted on a measurement object (3), the measurement module measuring an angular velocity of the measurement object (3) through the hemispherical resonator gyroscope; A temperature monitoring module, the temperature monitoring module comprising a temperature sensor, the temperature sensor being arranged on the outer surface of the sealed housing (2), the temperature monitoring module being used to monitor the housing temperature of the sealed housing (2); a temperature conversion module, the temperature monitoring module and the temperature conversion module being electrically connected, the temperature conversion module being used to convert the shell temperature into the oscillator temperature of the resonator (1); and an output correction module, the measuring module and the temperature conversion module are both electrically connected to the output correction module, and the output correction module can correct the measured angular velocity according to the vibrator temperature, obtain the corrected angular velocity of the measured object (3) and output it; The sealed housing (2) is composed of a cylindrical base (21) and a hemispherical shell top cover (22), and the opening side of the cylindrical base (21) and the opening side of the hemispherical shell top cover (22) are sealed and connected facing each other; The resonator (1) is mounted on the cylindrical base (21), the lip edge of the resonator (1) is flush with the opening side of the cylindrical base (21), and the shell of the resonator (1) and the hemispherical shell top cover (22) are concentric; The interior of the sealed housing (2) is evacuated; A support (211) is provided on a plate surface on a closed side of the cylindrical base (21) facing an open side of the cylindrical base (21), a mounting seat (212) is provided on an end surface of the support (211) facing an open side of the cylindrical base (21), an axial rod of the resonator (1) is mounted in the mounting seat (212), and the support (211) is made of a heat-insulating material; The temperature conversion module converts the housing temperature into the oscillator temperature in the following manner: in, T Z ( t n ) is the n The oscillator temperature at the time step, Δt is the time step, σ is the Stefan-Boltzmann constant, A Z is the effective heat radiation area of ​​the resonator (1), m Z is the mass of the oscillator (1), c Z is the specific heat capacity of the oscillator (1), ε K is the emissivity of the sealed housing (2), A K is the effective heat radiation area of ​​the sealed housing (2), ε Z is the radiative rate of the oscillator (1), T C ( t n ) is the n Shell temperature at time step; A plurality of heat-conducting convex ridges (23) are arranged on the outer surface of the sealed housing (2), and the heat-conducting convex ridges (23) include warp convex ridges and weft convex ridges.

2. A high performance hemispherical resonator gyroscope measurement system according to claim 1, characterized in that: A plurality of outwardly extending legs (24) are also provided on the outer surface of the sealing housing (2), and a mounting portion (25) is provided at the end of the legs (24); The hemispherical resonator gyroscope is mounted on the measurement object (3) via the mounting portion (25), so that a gap exists between the sealed housing (2) and the measurement object (3).

3. A high performance hemispherical resonator gyroscope measurement system according to claim 2, characterized in that: A plurality of circumferentially evenly distributed bosses (31) are fixedly arranged on the measurement object (3); a mounting platform (32) is arranged at one end of the boss (31) away from the measurement object (3); a clamping groove (33) is arranged on a side of the mounting platform (32) facing the measurement object (3); and the width of the clamping groove (33) gradually increases in a direction from the bottom of the clamping groove (33) to the opening of the clamping groove (33); An elastic body (34) is also provided on the measurement object (3), the elastic body (34) is located inside the annular shape of each boss (31), and one end of the elastic body (34) is fixedly connected to the measurement object (3); Each of the mounting portions (25) corresponds to each of the mounting platforms (32) in a one-to-one manner, and a tenon (251) corresponding to the clamping slot (33) is provided on the mounting portion (25); When the sealing housing (2) is mounted on the measurement object (3), each of the tenons (251) is correspondingly engaged in each of the engagement grooves (33), and the other end of the elastic body (34) abuts against each of the mounting portions (25) and pushes the mounting portions (25) in a direction away from the measurement object (3).

4. A high performance hemispherical resonator gyroscope measurement system according to claim 1, characterized in that: There are a plurality of temperature sensors, and each of the temperature sensors is evenly arranged on the outer surface of the sealed shell (2), and the shell temperature is the average value of the temperature values ​​monitored by each of the temperature sensors.

5. A high performance hemispherical resonator gyroscope measurement system according to claim 1, characterized in that: The output correction module corrects the measured angular velocity in the following manner: The mapping relationship among the oscillator temperature, measured angular velocity and angular velocity deviation is obtained through the temperature box test; Substituting the current vibrator temperature and the measured angular velocity into the mapping relationship to obtain the current angular velocity deviation; The current corrected angular velocity is obtained according to the current angular velocity deviation and the measured angular velocity.

6. A high performance hemispherical resonator gyroscope measurement system according to claim 5, characterized in that: The incubator used in the incubator test includes an insulation chamber and a turntable located inside the insulation chamber, and the turntable can rotate at a preset speed; The incubator test includes: The sealed housing (2) of the hemispherical resonator gyroscope is mounted on the turntable, and the insulation chamber is adjusted to a first preset temperature and maintained at a preset temperature for a preset time, so that the oscillator temperature is equal to the first preset temperature; Rotate the turntable and gradually increase the rotation speed of the turntable, measure the measurement angular velocity of the turntable by the measurement module, and record the rotation speed of the turntable and the measurement angular velocity corresponding to the rotation speed in real time; According to the rotation speed of the mounting platform (32) and the measured angular velocity, a relationship between the measured angular velocity and the angular velocity deviation at a first preset temperature is obtained.

7. A high performance hemispherical resonator gyroscope measurement system according to claim 6, characterized in that: Within the operating temperature range of the hemispherical resonator gyroscope, multiple test temperatures are determined with a preset temperature gradient. Through the above-mentioned temperature chamber test, the relationship between the measured angular velocity and the angular velocity deviation corresponding to the multiple test temperatures is obtained, and a mapping relationship of oscillator temperature-measured angular velocity-angular velocity deviation is constructed.

8. A high performance hemispherical resonator gyroscope measurement system according to claim 7, characterized in that: The corrected angular velocity of the measurement object (3) is obtained according to the following method: The mapping relationship between the oscillator temperature, the measured angular velocity and the angular velocity deviation of the hemispherical resonator gyroscope is obtained through the temperature box test; The sealed housing (2) of the hemispherical resonator gyroscope is mounted on a measurement object (3), thereby obtaining a measurement angular velocity and a oscillator temperature of the measurement object (3); When the vibrator temperature is equal to one of the test temperatures, the angular velocity deviation is determined according to the relationship between the measured angular velocity at the test temperature and the angular velocity deviation, thereby obtaining the corrected angular velocity of the measurement object (3); When the oscillator temperature is not equal to any test temperature, the angular velocity deviation corresponding to each test temperature under the measured angular velocity is obtained, and then the angular velocity deviation corresponding to each temperature point within the operating temperature range of the hemispherical resonator gyroscope is fitted, and then the corrected angular velocity of the measurement object (3) is obtained.

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