Surface temperature monitoring sensing device

Abstract

The invention relates to a surface temperature monitoring sensing device. The structure comprises an insulating support layer; the temperature monitoring unit is assembled on the insulating supporting layer and comprises a temperature monitoring part and a leading-out connecting part electrically connected with the temperature monitoring part, the temperature monitoring part and the leading-out connecting part are both located on the insulating supporting layer, and the leading-out connecting part is located on one side of the temperature monitoring part; the temperature monitoring part at least comprises a temperature sensing circuit layer used for temperature sensing, and the temperature sensing circuit layer is electrically connected with the leading-out connecting unit on the leading-out connecting part. And the insulation protection unit covers the temperature monitoring unit in a pressing manner, is used for protecting the temperature monitoring unit and can be fixedly connected with the cushion where the insulation protection unit is located. The surface temperature of the target object can be effectively monitored, and the reliability of temperature monitoring is improved.

Description

Technical Field

[0001] The invention relates to a temperature monitoring sensor, in particular to a surface temperature monitoring sensor device. Background Art

[0002] In order to accurately control the temperature of seat heating, the seat cushion heating should generally be temperature monitored to determine the temperature state of the seat, and then the heating state of the seat can be adjusted.

[0003] At present, NTC (Negative Temperature Coefficient) is mostly used to monitor the temperature status of seat cushions. In order to improve the reliability of temperature monitoring, NTC should be installed in the seat. Due to the characteristics of NTC, NTC will feel like a foreign body in the seat and has limited pressure bearing capacity. Therefore, when NTC is installed in the seat, it should be installed at the wiring harness end of the car seat cushion. Since the wiring harness end is far away from the effective heating area, NTC cannot truly reflect the current temperature of the seat cushion. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a surface temperature monitoring sensor device that can effectively implement surface temperature monitoring and improve the reliability of temperature monitoring.

[0005] According to the technical solution provided by the present invention, a surface temperature monitoring sensor device is used for surface temperature monitoring. The surface temperature monitoring sensor device is in a flexible state and includes:

[0006] Insulating support layer;

[0007] The temperature monitoring unit is mounted on the insulating support layer and includes a temperature monitoring part and a lead-out connection part for leading out the temperature monitoring part, wherein:

[0008] The temperature monitoring part and the lead-out connection part are both located on the insulating support layer, and the lead-out connection part is located on one side of the temperature monitoring part;

[0009] The temperature monitoring part at least includes a temperature sensing circuit layer for temperature sensing, and the temperature sensing circuit layer is electrically connected to the lead-out connection unit of the lead-out connection part;

[0010] The insulating protection unit is pressed onto the temperature monitoring unit to protect the temperature monitoring unit.

[0011] The temperature monitoring part also includes a temperature sensing support substrate, a temperature sensing circuit connection layer and a temperature sensing monitoring base, wherein:

[0012] The temperature sensing circuit layer is prepared on the temperature sensing monitoring substrate, and the temperature sensing support substrate is adaptively connected to the temperature sensing circuit layer through the temperature sensing circuit connection layer;

[0013] The temperature monitoring part is assembled on the insulating support layer through a temperature sensing support substrate, and the temperature sensing monitoring substrate is located between the temperature sensing circuit layer and the insulating protection layer.

[0014] The temperature monitoring unit is prepared based on a clean room photolithography process, wherein the preparation of the temperature monitoring unit includes:

[0015] Preparing a temperature-sensitive monitoring base film, and preparing a temperature-sensitive metal layer on the temperature-sensitive monitoring base film;

[0016] Preparing a metal mask layer on the temperature-sensitive metal layer, and patterning the metal mask layer to generate a patterned metal mask layer after patterning;

[0017] Using the above-mentioned patterned metal mask layer to wet-etch the temperature-sensitive metal layer, so as to generate a temperature-sensitive circuit base layer after the wet etching;

[0018] A temperature sensing circuit connecting base layer is prepared on the temperature sensing circuit base layer, and a temperature sensing supporting substrate base layer is assembled on the temperature sensing circuit base layer using the prepared temperature sensing circuit connecting base layer, so as to form a temperature sensing monitoring matrix after assembly;

[0019] The above-mentioned temperature sensing monitoring substrate is cut by using a femtosecond laser cutting process to generate a temperature sensing monitoring part after cutting.

[0020] The temperature sensing circuit layer includes at least one temperature sensing structure made of a thermosensitive material, wherein:

[0021] Each temperature sensing structure includes a temperature sensing structure body and at least two temperature sensing connection ends adapted to be connected to the temperature sensing structure body, so that the temperature sensing structure body can be led out by using the temperature sensing connection ends;

[0022] The temperature sensing structure body includes a plurality of arc-shaped temperature sensing areas.

[0023] The lead-out connection portion includes a lead-out connection substrate, wherein:

[0024] The lead-out connection unit is prepared on the lead-out connection substrate;

[0025] The lead-out connection unit at least comprises a lead-out connection wire body group located on the lead-out connection substrate, and the lead-out connection wire body group comprises at least two lead-out connection wires;

[0026] When the lead-out connection unit is connected to the temperature sensing circuit layer, the two lead-out connection wires in the lead-out connection unit are respectively electrically connected to the two temperature sensing connection ends of the temperature sensing structure, so that the temperature sensing circuit layer is led out through the electrical connection between the lead-out connection wires and the temperature sensing connection ends.

[0027] The lead-out connection unit is prepared on the lead-out connection substrate by screen printing process, wherein the lead-out connection unit is prepared by:

[0028] Provide lead-out connection base layer,

[0029] A plurality of lead-out connection wire body groups are prepared on the lead-out connection base layer by a screen printing process, so as to form a lead-out connection matrix after the lead-out connection wire body groups are prepared;

[0030] The lead-out connection base is cut to form a lead-out connection portion after cutting.

[0031] When the lead-out connection unit is connected to the temperature sensing circuit layer, a lead-out connection line is electrically connected to a corresponding temperature sensing connection end through a lead-out intermediate connection body, and the lead-out intermediate connection body is located between the lead-out connection line and the temperature sensing connection end.

[0032] After the temperature sensing monitoring part is formed by cutting, the two temperature sensing connection ends of the temperature sensing structure are in an exposed state;

[0033] When the lead-out connection unit is connected to the temperature sensing circuit layer, the connection method includes:

[0034] Providing an alignment connection fixture, the alignment connection fixture comprising a first alignment connection body and a second alignment connection body, wherein the first alignment connection body and the second alignment connection body are hingedly connected;

[0035] The lead-out connection part is assembled in the first alignment connection body, and the temperature sensing monitoring part is assembled in the second alignment connection body, wherein the lead-out connection line and the temperature sensing connection end are both in an exposed state;

[0036] Aligning and contacting the first alignment connector with the second alignment connector so that the temperature sensing connection end is in positive correspondence contact with the end of the lead-out connection line;

[0037] The temperature sensing connection end and the end of the lead-out connection line in the contact state are at least heated and pressurized by aligning the connection fixture, so that the temperature sensing connection end and the end of the corresponding contact lead-out connection line are bonded and fixed after heating and pressurizing.

[0038] A first alignment positioning groove is provided in the first alignment connector to allow the lead-out connecting portion to be embedded, and a first alignment elastic column is provided in the first alignment positioning groove, wherein:

[0039] When the lead-out connection part is embedded in the first alignment positioning groove, the lead-out connection part is sleeved on the first alignment elastic column through the lead-out positioning hole of the lead-out connection part;

[0040] A second alignment positioning groove is provided in the second alignment connector to allow the temperature sensing monitoring part to be embedded, and a second alignment elastic column is provided in the second alignment positioning groove, wherein:

[0041] When the temperature sensing monitoring part is embedded in the second alignment positioning groove, the temperature sensing monitoring part is sleeved on the second alignment elastic column through the temperature sensing positioning hole of the temperature sensing monitoring part;

[0042] The first alignment connector is aligned and contacted with the second alignment connector, the second alignment elastic column is aligned and contacted with the first alignment elastic column, and the temperature sensing connection end is in positive corresponding contact with the end of the lead-out connection line.

[0043] A temperature sensing connection piece is provided at each temperature sensing connection end, and a lead-out connection piece is provided at one end of the lead-out connection line, wherein:

[0044] The first alignment connector is aligned and contacted with the second alignment connector so that the temperature sensing connector is in positive corresponding contact with the lead-out connector, and after heating and pressurization, the temperature sensing connector and the lead-out connector are bonded and fixed.

[0045] The advantages of the present invention are as follows: the surface temperature monitoring sensor device is flexible and can be effectively attached to the area / position of the target object to be temperature monitored, so as to monitor the temperature of the target object; a plurality of arc-shaped temperature sensing areas are arranged on the temperature sensing structure, which effectively reduces the resistance change caused by the deformation of the surface and will not interfere with the temperature detection result.

[0046] When the lead-out connection substrate is made of TPU film, the lead-out connection substrate can be stretched. At this time, the first lead-out connection line and the second lead-out connection line can be pulled up synchronously with the lead-out connection substrate to avoid cracks and circuit breakages caused by micro-deformation of the seat cushion, thereby improving the stability and reliability of temperature monitoring.

[0047] The distance between the temperature sensing circuit layer and the temperature monitoring area / position of the target object is small, which can realize rapid sensing of the surface temperature of the target object and improve the effectiveness and reliability of temperature monitoring of the target object.

[0048] The temperature monitoring part can be prepared by using the clean room photolithography process, and the lead-out connection part can be prepared by using the screen printing process, which can give full play to the advantages of the clean room photolithography process and the screen printing process, and can reduce the cost while ensuring the temperature monitoring accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 The figure is a schematic structural diagram of an embodiment of a surface temperature monitoring sensor device of the present invention.

[0050] Figure 2 The figure is a schematic diagram showing the connection between a temperature sensing structure and a lead-out connecting wire assembly according to an embodiment of the present invention.

[0051] Figure 3 It is a connection diagram of another embodiment of the temperature sensing structure and the lead-out connecting wire group of the present invention.

[0052] Figure 4It is a schematic diagram of the connection between the temperature sensing structure and the lead-out connecting wire assembly according to the third embodiment of the present invention.

[0053] Figure 5 It is a schematic diagram of an embodiment of the present invention in which an alignment connection fixture is used for alignment connection.

[0054] Figure 6 It is a partial schematic diagram of an embodiment of the present invention in which the temperature sensing monitoring part is embedded in the second alignment positioning groove.

[0055] Figure 7 It is a partial schematic diagram of an embodiment of the present invention in which the lead-out connecting portion is embedded in the first alignment positioning groove.

[0056] Figure 8 It is a schematic structural diagram of an embodiment of the alignment connection fixture of the present invention.

[0057] Explanation of the accompanying drawings: 1-temperature monitoring substrate, 2-temperature sensing circuit layer, 3-temperature sensing circuit connection layer, 4-temperature sensing supporting substrate, 5-lead connection substrate, 6-lead connection line body layer, 7-insulating protection layer, 8-protective connection layer, 9-transition connection unit layer, 10-arc area, 11-first temperature sensing connecting piece, 12-second temperature sensing connecting piece, 13-first lead connection line, 14-second lead connection line, 15-insulating support layer, 16-temperature sensing structure body, 17-first alignment connector, 18-temperature sensing positioning hole, 19-second alignment connector, 20-second lead connection piece, 21-first lead connection piece, 22-lead positioning hole, 23-connecting hinge, 24-first alignment positioning groove, 25-first alignment elastic column, 26-second alignment elastic column, 27-second alignment positioning groove. DETAILED DESCRIPTION

[0058] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0059] In order to effectively realize surface temperature monitoring and improve the reliability of temperature monitoring, the present invention provides a surface temperature monitoring sensor device, specifically, for surface temperature monitoring, the surface temperature monitoring sensor device is in a flexible state, including:

[0060] Insulating support layer 15;

[0061] The temperature monitoring unit is mounted on the insulating support layer 15 and includes a temperature monitoring portion and a lead-out connection portion for leading out the temperature monitoring portion, wherein:

[0062] The temperature monitoring part and the lead-out connection part are both located on the insulating support layer, and the lead-out connection part is located on one side of the temperature monitoring part;

[0063] The temperature monitoring part at least comprises a temperature sensing circuit layer 2 for temperature sensing, and the temperature sensing circuit layer 2 is electrically connected to the lead-out connection unit of the lead-out connection part;

[0064] The insulating protection unit is pressed onto the temperature monitoring unit to protect the temperature monitoring unit.

[0065] It should be noted that the surface temperature monitoring sensor device is in a flexible state, which specifically means that the surface temperature monitoring sensor device of the present invention has a flexible characteristic. The flexible surface temperature monitoring sensor device can be used to monitor the surface temperature of the target object. For example, the target object can be the car seat mentioned in the above background technology. When the target object is a car seat, the surface temperature monitoring sensor device of the present invention should be installed in the seat cushion. Thereafter, the surface temperature of the seat cushion of the car seat can be monitored. Of course, the surface temperature monitoring sensor device should be kept fixed in the seat cushion. Since the surface temperature monitoring sensor device is in a flexible state, the problems existing in the existing NTC seat cushion surface temperature sensor monitoring can be avoided. When the target object is of other types, the surface temperature monitoring sensor device of the present invention can be installed in the position / area specified by the target object according to the situation of the target object, and the specific surface temperature monitoring required can be achieved.

[0066] Figure 1 An embodiment of a surface temperature monitoring sensor device is shown in the figure. As can be seen from the figure, the surface temperature monitoring sensor device should include an insulating support layer 15. The insulating support layer 15 should be made of an insulating material with supporting capacity. For example, the insulating support layer 15 can be made of a TPU (thermoplastic polyurethane elastomer) film. Of course, the insulating support layer 15 can also be made of other materials, which can be selected according to needs.

[0067] In order to realize temperature monitoring, a temperature monitoring unit is provided at least on the insulating support layer 15, and then the surface temperature monitoring of the target object can be realized by using the temperature monitoring unit. In one embodiment of the present invention, the temperature monitoring unit may include a temperature monitoring part and a lead-out connection part, wherein the temperature monitoring part is a functional part capable of realizing temperature monitoring, and the lead-out connection part specifically leads out the temperature monitoring part, specifically, leads out the temperature monitoring part, specifically refers to leading out the temperature monitoring part so that it can be connected to an external temperature controller or other control device, and then, the external temperature controller or the like can determine the surface temperature value of the target object according to the output value of the temperature monitoring part, and the method of determining the surface temperature value of the target object according to the temperature monitoring part can be consistent with the prior art, such as the corresponding description below.

[0068] In specific implementation, the temperature monitoring part should include at least a temperature sensing circuit layer 2, and temperature sensing can be achieved using the temperature sensing circuit layer 2. From the above description, it can be seen that the temperature sensing circuit layer 2 should be led out through the lead-out connection part. It should be noted that when the temperature sensing circuit layer 2 is led out, the temperature sensing circuit layer 2 is mainly led out through the lead-out connection unit in the lead-out connection part.

[0069] In order to improve the reliability of temperature monitoring, an insulating protection unit can be provided on the temperature monitoring unit. After that, the temperature monitoring unit can be protected by the insulating protection unit. The Bureau stipulates that the temperature monitoring part and the lead-out connection part can be covered and protected by the insulating protection unit. It should be noted that when the target object is a car seat cushion, it can be fixedly connected to the seat cushion through the insulating protection unit. Specifically, when the insulating protection unit is fixedly connected to the seat cushion, the insulating support layer 15 is generally also located in the seat cushion, but the insulating support layer 15 is in a state away from the temperature monitoring surface in the seat cushion. The position of the insulating support layer 15 should be based on not affecting the temperature monitoring of the seat cushion surface.

[0070] In one embodiment of the present invention, the temperature monitoring unit further comprises a temperature sensing support substrate 4, a temperature sensing circuit connection layer 3 and a temperature sensing monitoring base 1, wherein:

[0071] The temperature sensing circuit layer 2 is prepared on the temperature sensing monitoring substrate 1, and the temperature sensing supporting substrate 4 is adaptively connected to the temperature sensing circuit layer 2 through the temperature sensing circuit connecting layer 3;

[0072] The temperature monitoring part is assembled on the insulating support layer 15 through the temperature sensing support substrate 4 , and the temperature sensing monitoring substrate 1 is located between the temperature sensing circuit layer 2 and the insulating protection layer.

[0073] Figure 1 and Figure 5 An embodiment of the temperature monitoring unit is shown in FIG. 1 . In the figure, the temperature monitoring unit should include a temperature sensing support substrate 4, wherein the temperature sensing support substrate 4 includes a PET film, that is, the temperature sensing support substrate 4 can be made of a PET film. Of course, the temperature sensing support substrate 4 can also be made of other materials. When the temperature sensing monitoring unit is located on the insulating support layer 15, it specifically means that the temperature monitoring unit is assembled on the insulating support layer 15 through the temperature sensing support substrate 4. Figure 1 and Figure 5 Specifically, the temperature sensing support substrate 4 should generally be fixed on the insulating support layer 15, such as the temperature sensing support substrate 4 can be fixed on the insulating support layer 15 by bonding or other methods.

[0074] After the temperature monitoring unit is assembled on the insulating support layer 15, the temperature sensing circuit layer 2 is located above the temperature sensing support substrate 4. Figure 1 and Figure 5In the figure, the temperature sensing circuit layer 2 can be connected to the temperature sensing support substrate 4 through the temperature sensing circuit connecting layer 3. Generally, the temperature sensing circuit connecting layer 3 can be a double-sided adhesive layer. Of course, the temperature sensing circuit connecting layer 3 can also be made of other materials, depending on whether the temperature sensing circuit layer 2 can be adapted to be connected to the temperature sensing support substrate 4.

[0075] Figure 1 and Figure 5 In the embodiment, a temperature sensing circuit layer 2 is provided with a temperature sensing monitoring substrate 1 above the temperature sensing circuit layer 2, wherein the temperature sensing circuit layer 2 can be prepared on the temperature sensing monitoring substrate 1, wherein the temperature sensing monitoring substrate 1 includes a PI (polyimide) film, and the temperature sensing circuit layer 2 can be prepared on the PI film. When assembled on the insulating support layer 15, the temperature sensing circuit layer 2 can also be protected by the temperature sensing monitoring substrate 1. It can be seen from the above description that the insulating protection unit will be pressed on the temperature monitoring part, and when the temperature monitoring part adopts the above structure, the insulating protection unit will also be pressed on the temperature sensing monitoring substrate 1.

[0076] In one embodiment of the present invention, the temperature monitoring unit is prepared based on a clean room photolithography process, wherein the preparation of the temperature monitoring unit includes:

[0077] Preparing a temperature-sensitive monitoring base film, and preparing a temperature-sensitive metal layer on the temperature-sensitive monitoring base film;

[0078] Preparing a metal mask layer on the temperature-sensitive metal layer, and patterning the metal mask layer to generate a patterned metal mask layer after patterning;

[0079] Using the above-mentioned patterned metal mask layer to wet-etch the temperature-sensitive metal layer, so as to generate a temperature-sensitive circuit base layer after the wet etching;

[0080] A temperature sensing circuit connecting base layer is prepared on the temperature sensing circuit base layer, and a temperature sensing supporting substrate base layer is assembled on the temperature sensing circuit base layer using the prepared temperature sensing circuit connecting base layer, so as to form a temperature sensing monitoring matrix after assembly;

[0081] The above-mentioned temperature sensing monitoring substrate is cut by using a femtosecond laser cutting process to generate a temperature sensing monitoring part after cutting.

[0082] It is understandable that when preparing the temperature monitoring part, a temperature-sensitive monitoring base film should be prepared first, and then a temperature-sensitive metal layer can be prepared on the temperature-sensitive monitoring base film. Specifically, the temperature-sensitive monitoring base film and the temperature-sensitive monitoring substrate 1 can be made of the same material. For example, when the temperature-sensitive monitoring substrate 1 is a PI film, the temperature-sensitive monitoring base film is also a PI film. The following is an example of the method of preparing the temperature-sensitive monitoring base film. Specifically, when preparing the temperature-sensitive monitoring base film, a feasible method is to provide a glass wafer and spin-coat a Polyimid (PI) coating solvent on the glass wafer at a high speed (rotation speed 3000-4500rpm), and then place the glass wafer coated with the PI solvent in a 350°C oven for drying for 1 hour. After that, a PI film with a thickness of 1.5μm to 3μm can be obtained, so that a temperature-sensitive monitoring base film can be obtained. It can be seen that the corresponding thicknesses of the temperature-sensitive monitoring base film and the temperature-sensitive monitoring substrate 1 are both 1.5μm to 3μm.

[0083] It should be noted that after the temperature sensing monitoring base film is prepared, a temperature sensing metal layer is prepared on the temperature sensing monitoring base film. When preparing the temperature sensing metal layer, a sputtering process can be used. Of course, other process methods can also be used, which can be selected according to needs. The temperature sensing metal layer covers the temperature sensing monitoring base film, and the thickness of the temperature sensing metal layer can generally be 100nm to 200nm.

[0084] After the temperature-sensitive metal layer is prepared, a metal mask layer should be prepared on the temperature-sensitive metal layer. Generally, the metal mask layer can be a photoresist, and the metal mask layer covers the temperature-sensitive metal layer. The method of preparing the metal mask layer can be consistent with the prior art. After the metal mask layer is prepared, the metal mask layer is patterned to generate a patterned metal mask layer after patterning. For example, the metal mask layer can be patterned by UV lamp, etc. The patterning method can be selected according to needs, specifically based on the ability to form the desired patterned metal mask layer. After the temperature-sensitive metal layer is patterned, part of the temperature-sensitive metal layer can be exposed, and part of the temperature-sensitive metal layer can be covered.

[0085] After the patterned metal mask layer is prepared, the patterned metal mask layer can be used to wet-etch the temperature-sensitive metal layer to generate a temperature-sensitive circuit base layer after wet etching. Specifically, when the temperature-sensitive metal layer is wet-etched, the wet etching method can be consistent with the prior art, so as to achieve wet etching of the temperature-sensitive metal layer. It should be noted that the temperature-sensitive circuit base layer generated by wet etching can generally include one or more temperature-sensitive circuit layers 2. When multiple temperature-sensitive circuit layers 2 are included, the preparation of batch temperature-sensitive circuit layers 2 can also be achieved.

[0086] After the temperature sensing circuit base layer is prepared, the patterned metal mask layer should be removed. Thereafter, a temperature sensing circuit connection base layer is prepared on the temperature sensing circuit base layer. It can be understood that the prepared temperature sensing circuit connection base layer can form a temperature sensing circuit connection layer 3. Therefore, the material of the temperature sensing circuit connection base layer should be consistent with the temperature sensing circuit connection layer 3, such as the temperature sensing circuit connection base layer can be a double-sided adhesive layer.

[0087] After the temperature sensing circuit connection base layer is prepared, a temperature sensing support substrate base layer can be prepared on the temperature sensing circuit connection base layer, wherein the prepared temperature sensing support substrate base layer is used to prepare the temperature sensing support substrate 4, therefore, the temperature sensing support substrate base layer can refer to the description of the above temperature sensing support substrate 4. After the temperature sensing support substrate base layer is prepared, a temperature sensing monitoring substrate can be formed, therefore, the temperature sensing monitoring substrate should include a temperature sensing monitoring base film, a temperature sensing circuit base layer, a temperature sensing circuit connection base layer and a temperature sensing support substrate base layer.

[0088] In order to form the temperature-sensing monitoring part, the temperature-sensing monitoring substrate formed above should be cut. For example, the temperature-sensing monitoring substrate can be cut using a femtosecond laser cutting process. When the temperature-sensing monitoring part is formed by cutting, a temperature-sensing monitoring base 1 can be formed based on the temperature-sensing monitoring base film, a temperature-sensing circuit layer 2 can be formed based on the temperature-sensing circuit base layer, a temperature-sensing circuit connection layer 3 can be formed based on the temperature-sensing circuit connection base layer, and a temperature-sensing support base layer 4 can be formed based on the temperature-sensing support base layer. Specifically, the process conditions of the femtosecond laser cutting process can be consistent with the prior art, and the temperature-sensing monitoring part can be formed by cutting. In addition, when the femtosecond laser cutting process is used for cutting, separation from the above-mentioned glass wafer can also be achieved.

[0089] In order to facilitate the lead-out of the temperature sensing circuit layer 2, when femtosecond laser cutting is used, the corresponding areas of the temperature sensing circuit connection layer 3 and the temperature sensing support substrate 4 should be smaller than the corresponding areas of the temperature sensing circuit layer 2 and the temperature sensing monitoring substrate 1, specifically, so as to facilitate the lead-out connection without affecting the temperature sensing circuit layer 2. For details, please refer to the corresponding lead-out connection instructions below.

[0090] Specifically, when the temperature sensing monitoring part is prepared by the ultra-clean room photolithography process, due to the use of high-precision plating technology, the size error of the temperature sensing circuit layer 2 can be controlled within 10nm, and the coverage area of ​​the sensing circuit layer 2 can be increased from 1mm 2 Up to 10mm 2The coating process is the above-mentioned sputtering process for preparing the temperature-sensitive metal layer. Using femtosecond laser precision cutting, the cutting line width is controlled within 20 microns. The cutting process is fast and safe, and will not damage the surrounding circuits, ensuring a very high yield rate. The corresponding thicknesses of the temperature-sensing circuit layer 2 and the temperature-sensing monitoring substrate 1 are not more than 5 microns. Together with the thickness of the temperature-sensing circuit connection layer 3 and the temperature-sensing supporting substrate 4, the total thickness of the temperature-sensing monitoring part does not exceed 150 microns. The internal resistance of the temperature-sensing circuit layer 2 is generally 1.5kΩ-2kΩ. Therefore, when the temperature-sensing monitoring part is prepared based on the clean room photolithography process, it can have a higher preparation efficiency and a lower preparation cost.

[0091] It should be noted that based on the characteristics of the clean room photolithography process, it can be known that the clean room photolithography process cannot produce large-sized connecting wires. When the clean room photolithography process is used to prepare the connecting wires, the internal resistance of the prepared connecting wires is greater than 100Ω due to the thickness of the coating layer (nanometer level) in the photolithography process, which has a great impact on the sensing accuracy. The production cost and cycle of the coating with a thickness exceeding 500nm will increase exponentially, and the economic benefits will be lost. Therefore, after the temperature sensing monitoring part is prepared by the clean room photolithography process, the present invention should cooperate with the temperature sensing monitoring part through the lead-out connection part, so as to use the lead-out connection part to lead out the temperature sensing monitoring part, thereby ensuring the temperature monitoring accuracy of the temperature monitoring sensor device of the present invention, and also reducing costs. For the situation of the lead-out connection part, please refer to the corresponding description below.

[0092] In one embodiment of the present invention, the temperature sensing circuit layer 2 includes at least one temperature sensing structure made of a thermosensitive material, wherein:

[0093] Each temperature sensing structure includes a temperature sensing structure body 16 and at least two temperature sensing connection ends adapted to be connected to the temperature sensing structure body 16, so as to lead out the temperature sensing structure body 16 by using the temperature sensing connection ends;

[0094] The temperature sensing structure body 16 includes a plurality of arc-shaped temperature sensing areas.

[0095] Specifically, the temperature sensing circuit layer 2 generally includes at least one temperature sensing structure. The number of temperature sensing structures in the temperature sensing circuit layer 2 can be selected according to needs, such as the area of ​​seat cushion temperature monitoring and the monitoring accuracy. When the temperature sensing circuit layer 2 includes multiple temperature sensing structures, the multiple temperature sensing structures can be connected in parallel into one.

[0096] In order to achieve temperature sensing, the temperature sensing structure should be made of a thermosensitive material. Specifically, the temperature of the surface of the target object can be sensed by the temperature sensing structure, and the corresponding temperature value can be calculated by an external control device, etc. In specific implementation, the thermosensitive material used in the temperature sensing structure includes at least one of platinum, gold, copper or nickel. The thermosensitive material used in the temperature sensing structure can be selected as needed to meet the temperature monitoring requirements of the surface of the target object.

[0097] It should be noted that after the temperature monitoring portion is cut, the two temperature sensing connection ends of the temperature sensing structure are in an exposed state. When the two temperature sensing connection ends are in an exposed state, it is convenient for the subsequent electrical connection with the temperature sensing connection ends.

[0098] Figure 2 An embodiment of a temperature sensing structure is shown in FIG. Figure 2 The bold black part in the figure is the temperature sensing structure body 16 of the temperature sensing structure. Two temperature sensing connection ends are provided at both ends of the temperature sensing structure body 16. The temperature sensing structure body 16 can be led out through the two temperature sensing connection ends, wherein the two temperature sensing connection ends can respectively form a first temperature sensing connection end and a second temperature sensing connection end. The temperature sensing structure body 16 can be electrically connected to the lead-out connection unit through the first temperature sensing connection end and the second temperature sensing connection end to form a loop. Thereafter, the temperature of the surface of the target object can be sensed by the temperature sensing structure body 16. Specifically, when sensing the temperature, a resistance value corresponding to the surface temperature can be obtained by the temperature sensing structure body 16, so that the external control device can calculate the corresponding temperature value according to the resistance value. The specific principles of temperature sensing and temperature monitoring can be consistent with the prior art.

[0099] In specific implementation, the temperature sensing structure body 16 includes a plurality of arc-shaped temperature sensing areas 10. Figure 2 In the figure, the temperature sensing structure body 16 includes three arc-shaped temperature sensing areas 10. It can be understood that the arc shape of the temperature sensing area 10 forms a curved structure, which can effectively reduce the resistance change caused by non-temperature changes, thereby effectively improving the accuracy and stability of surface temperature monitoring of the target object.

[0100] Figure 3 Another embodiment of the temperature sensing structure body 16 is shown in FIG. Figure 2 Compared with the temperature sensing structure body 16, Figure 3 The temperature sensing structure body 16 in the embodiment may have more temperature sensing areas 10 . Figure 4 FIG. 4 shows a third embodiment of the temperature sensing structure body 16. Figure 4 In the embodiment, the temperature sensing area 10 is annular, and a plurality of temperature sensing areas 10 may be concentrically distributed. In specific implementation, the shape of the temperature sensing structure body 16 and the condition of the arc-shaped temperature sensing area 10 included in the temperature sensing structure body 16 may be selected as required, so as to effectively adapt to the target object and improve the temperature monitoring accuracy and reliability.

[0101] In one embodiment of the present invention, the lead-out connection portion comprises a lead-out connection substrate 5, wherein:

[0102] The lead-out connection unit is prepared on the lead-out connection substrate 5;

[0103] The lead-out connection unit at least comprises a lead-out connection wire body group located on the lead-out connection substrate 5, and the lead-out connection wire body group comprises at least two lead-out connection wires;

[0104] When the lead-out connection unit is connected to the temperature sensing circuit layer 2, the two lead-out connection wires in the lead-out connection unit are respectively electrically connected to the two temperature sensing connection ends of the temperature sensing structure, so that the temperature sensing circuit layer 2 is led out through the electrical connection between the lead-out connection wires and the temperature sensing connection ends.

[0105] Figure 1 and Figure 5 An embodiment of the lead-out connection part is also shown in the figure, in which the lead-out connection part includes a lead-out connection substrate 5, and the lead-out connection substrate 5 may include a TPU film, that is, the lead-out connection substrate 5 may be made of a TPU film, and the lead-out connection part is fixed on the insulating support layer 15 through the lead-out connection substrate 5, and the lead-out connection substrate 5 and the temperature-sensing support substrate 4 are located on the same side surface of the insulating support layer 15; in addition, Figure 1 and Figure 5 In the embodiment, the lead-out connection substrate 5 and the temperature-sensing support substrate 4 are in contact with each other.

[0106] The lead-out connection unit is located on the lead-out connection substrate 5, and the lead-out connection wire body group in the lead-out connection unit can be used to form a lead-out connection wire body layer 6 located on the lead-out connection substrate 5. Therefore, the lead-out connection wire body layer 6 can include several lead-out connection wire body groups. Generally, the number of lead-out connection wire bodies is generally consistent with the number of temperature sensing structures, that is, one temperature sensing structure can be led out through one lead-out connection wire body group.

[0107] In order to lead out the above-mentioned temperature sensing structure, each lead-out connection wire body group should generally include at least two lead-out connection wires, and the two lead-out connection wires are generally independent of each other. Generally, one lead-out connection wire body group can lead out one temperature sensing structure, that is, there is a one-to-one correspondence between the lead-out connection wire body group and the temperature sensing structure. The temperature sensing structure can be led out by using one lead-out connection wire body group, and then the temperature sensing circuit layer 2 can be led out. Therefore, when the temperature sensing circuit layer 2 is led out, it specifically means that the corresponding temperature sensing structure in the temperature sensing circuit layer 2 is led out through the lead-out connection wire body group.

[0108] When the temperature sensing structure is led out by using a lead-out connection wire body group, the two lead-out connection wires in the lead-out connection unit are mainly electrically connected to the two temperature sensing connection ends of the temperature sensing structure respectively. Specifically, the two lead-out connection wires can form a first lead-out connection wire 13 and a second lead-out connection wire 14 respectively. The first lead-out connection wire 13 can be electrically connected to the first temperature sensing connection end, and the second lead-out connection wire 14 can be electrically connected to the second temperature sensing connection end. After connecting in this way, the lead-out of the temperature sensing structure can be realized, such as Figure 2 to Figure 4 shown.

[0109] In one embodiment of the present invention, the lead-out connection unit is prepared on the lead-out connection substrate 5 by screen printing process, wherein the lead-out connection unit is prepared by:

[0110] Provide lead-out connection base layer,

[0111] A plurality of lead-out connection wire body groups are prepared on the lead-out connection base layer by a screen printing process, so as to form a lead-out connection matrix after the lead-out connection wire body groups are prepared;

[0112] The lead-out connection base is cut to form a lead-out connection portion after cutting.

[0113] In order to effectively lead out the temperature sensing monitoring part, the present invention can prepare the lead-out connection part by screen printing process, wherein the lead-out connection part is prepared by screen printing process, specifically, the lead-out connection unit is prepared on the lead-out connection substrate 5 by screen printing process. Specifically, when the screen printing process is adopted, the lead-out connection base layer should be provided first, wherein the lead-out connection substrate 5 can be formed by the lead-out connection base layer, and therefore, the lead-out connection base layer should be made of the same material as the above-mentioned lead-out connection substrate 5. In specific implementation, the required lead-out connection base layer can be provided according to the description of the above-mentioned lead-out connection substrate 5.

[0114] It should be noted that after providing the lead-out connection base layer, the lead-out connection base layer may be subjected to necessary treatment. The necessary treatment of the lead-out connection base layer is based on whether it can meet the requirements of the screen printing process on the lead-out connection base layer. After the lead-out connection base layer is treated, a plurality of lead-out connection wire body groups are prepared on the lead-out connection base layer by the screen printing process. The process conditions and methods for preparing the lead-out connection wire body groups by the screen printing process are consistent with the prior art. In addition, the lead-out connection wire body group can refer to the above description. The lead-out connection wires in the lead-out connection wire body group are generally silver wires.

[0115] Generally, a plurality of lead-out connection wire body groups are independent of each other. Thereafter, the lead-out connection base is cut, for example, by using a cutting machine to cut the lead-out connection base. After cutting, a lead-out connection portion can be formed. Optionally, each lead-out connection portion includes at least one lead-out connection wire body group.

[0116] It should be noted that when the lead-out connection part is prepared by screen printing, a large-area lead-out connection line can be produced, and the length of the lead-out connection line can easily exceed 1000mm, and the width is within 0.1mm. In addition, the processing thickness of the lead-out connection line is higher than 5000nm (compared with the photolithography process) and the internal resistance is less than 10 ohms, so that the internal resistance of the lead-out connection line is much lower than the internal resistance of the temperature sensing circuit layer 2. When the temperature sensing circuit layer 2 is led out by the lead-out connection line body group, there is almost no effect on the accuracy of temperature monitoring, that is, the prepared lead-out connection unit can meet the lead-out requirements of effectively electrically connecting the temperature sensing circuit layer 2. In addition, when the lead-out connection part is prepared by screen printing, it also has a very high cost advantage; when the lead-out connection line is a silver wire, the thickness is much lower than the inner diameter of the commonly used copper wire. After packaging, it can effectively reduce the foreign body sensation and improve the adaptability of surface temperature monitoring.

[0117] In a specific implementation, each lead-out connection line may also include a plurality of arc-shaped areas, that is, each lead-out connection line may be in a curved shape, such as Figure 2 to Figure 4 As shown, when the lead-out connection line is in a curved shape, it can be seen from the above description that the resistance change caused by non-temperature change can be effectively reduced, and the accuracy of temperature monitoring can be improved. It should be noted that when the lead-out connection substrate 5 adopts a TPU film, the lead-out connection substrate 5 can be pulled up. At this time, the lead-out connection line can be pulled up synchronously with the lead-out connection substrate 5 to avoid cracks and circuit breaks caused by micro-deformation of the target object, thereby improving the stability and reliability of temperature monitoring.

[0118] In one embodiment of the present invention, when the lead-out connection unit is connected to the temperature sensing circuit layer 2, a lead-out connection line is electrically connected to a corresponding temperature sensing connection end through a lead-out intermediate connection body, and the lead-out intermediate connection body is located between the lead-out connection line and the temperature sensing connection end.

[0119] As can be seen from the above description, the temperature monitoring part and the lead-out connection part are prepared by different process steps. Therefore, after the temperature monitoring part and the lead-out connection part are prepared by the above process, the temperature monitoring part cannot be electrically connected and then led out through the lead-out connection part. In order to achieve the corresponding connection between the lead-out connection part and the temperature monitoring part, it is also necessary to electrically connect the lead-out connection unit and the temperature sensing circuit layer 2 accordingly.

[0120] It can be seen from the above description that when the lead-out connection unit is connected to the temperature sensing circuit layer 2, one end of the lead-out connection line is mainly electrically connected to the temperature sensing connection end in the temperature sensing circuit layer 2. In one embodiment of the present invention, one end of the lead connection line can be electrically connected to a temperature sensing connection end through a lead-out intermediate connector. Therefore, when the ends of the two lead-out connection lines are connected to the corresponding temperature sensing connection ends through the corresponding lead-out intermediate connectors, the lead-out connection unit and the temperature sensing circuit layer 2 can be connected accordingly.

[0121] Figure 1 An embodiment of correspondingly connecting the lead-out connecting wire to the temperature sensing connecting end through the lead-out intermediate connecting body is shown in FIG. Figure 1 In the embodiment, a transition connection unit layer 9 can be set on the lead-out connection line body layer 6, and the transition connection unit layer 9 includes at least two lead-out intermediate connectors. The number of lead-out intermediate connectors in the transition connection unit layer 9 can be selected as 2, depending on whether the lead-out connection line can be connected to the corresponding temperature sensing connection end.

[0122] In specific implementation, the intermediate connector is preferably connected by a conductive adhesive strip, wherein the conductive adhesive strip is supported on the connecting wire layer 6. Figure 1 In the embodiment, the temperature sensing structure is located above the lead-out connection line body layer 6. At this time, the temperature sensing connection end is located above the conductive adhesive connection strip. After that, the temperature sensing connection end and the lead-out connection line can be electrically connected through the conductive adhesive connection strip, such as the above-mentioned conductive adhesive connection strip electrically connecting the first temperature sensing connection end to one end of the first lead-out connection line 13, and the other conductive adhesive connection strip electrically connecting the second temperature sensing connection end to one end of the second lead-out connection line 14. It should be understood that the conductive adhesive connection strip can be made of existing commonly used conductive adhesives, and the specific requirements for conductive connection shall prevail. When connected through the conductive adhesive connection strip, the surface temperature monitoring sensor device of the present invention can have a better flexibility.

[0123] When the conductive adhesive connecting strip is used as the lead-out intermediate connector to connect the lead-out connecting wire body to the temperature sensing connecting end, the lead-out intermediate connector needs to be manually prepared on the lead-out connecting wire body layer 6 . This method has a low connection efficiency.

[0124] In order to improve the efficiency of the lead-out connection wire group in leading out the temperature sensing circuit layer 2, in one embodiment of the present invention, when the lead-out connection unit is connected to the temperature sensing circuit layer 2, the connection method includes:

[0125] Providing an alignment connection fixture, the alignment connection fixture comprises a first alignment connection body 17 and a second alignment connection body 19, and the first alignment connection body 17 and the second alignment connection body 19 are hingedly connected;

[0126] The lead-out connection part is assembled in the first alignment connection body 17, and the temperature sensing monitoring part is assembled in the second alignment connection body 19, wherein the lead-out connection line and the temperature sensing connection end are both in an exposed state;

[0127] Align the first alignment connector 17 and the second alignment connector 19 so that the temperature sensing connection end is in direct contact with the end of the lead-out connection line;

[0128] The temperature sensing connection end and the end of the lead-out connection line in the contact state are at least heated and pressurized by aligning the connection fixture, so that the temperature sensing connection end and the end of the corresponding contact lead-out connection line are bonded and fixed after heating and pressurizing.

[0129] In order to improve the efficiency and reliability of the connection, in one embodiment of the present invention, an alignment connection fixture can be used to achieve the alignment connection between the lead-out connection unit and the temperature sensing circuit layer 2. Figure 5 and 8 An embodiment of the alignment connection fixture is shown in FIG. 1 , and the alignment connection fixture may include a first alignment connection body 17 and a second alignment connection body 19. Figure 8 An embodiment is shown in which the first alignment connector 17 and the second alignment connector 19 are hingedly connected by a connecting hinge 23. When the first alignment connector 17 and the second alignment connector 19 are hingedly connected, the first alignment connector 17 and the second alignment connector 19 can rotate relative to each other so that the first alignment connector 17 and the second alignment connector 19 are aligned and contacted.

[0130] Specifically, when the lead-out connection wire is aligned and connected with the corresponding temperature-sensing connection terminal, the lead-out connection part can be located in the first alignment connection body 17, and the temperature-sensing monitoring part can be located in the second alignment connection body 19. It can be understood that the lead-out connection wire and the temperature-sensing connection terminal in the lead-out connection part should be in an exposed state so as not to affect the alignment and contact between the end of the lead-out connection wire and the corresponding temperature-sensing connection terminal. It should be noted that the position state of the lead-out connection part in the first alignment connection body 17 and the position state of the temperature-sensing monitoring part in the second alignment connection body 19 should be based on the condition that the end of the lead-out connection wire is in positive corresponding contact with the temperature-sensing connection terminal when the first alignment connection body 17 and the second alignment connection body 9 are aligned and contacted.

[0131] When the end of the lead-out connection wire is in positive corresponding contact with the temperature-sensing connection end, the alignment connection fixture can be used to heat and pressurize the joint portion in positive corresponding contact, so that after heating and pressurizing, the temperature-sensing connection end can be bonded and fixed with the corresponding end of the lead-out connection wire. Specifically, when bonding and fixing, it specifically means that the ends of the two lead-out connection wires are effectively connected with the two corresponding temperature-sensing connection ends. It can be known from the above description that at this time, the electrical connection between the lead-out connection unit and the temperature-sensing circuit layer 2 can be realized. In specific implementation, the heating temperature and the pressure state of the pressurization can be selected according to actual needs, so as to meet the requirements of bonding and fixing the ends of the temperature-sensing connection end and the corresponding contact lead-out connection wire.

[0132] In one embodiment of the present invention, a first alignment positioning groove 24 is provided in the first alignment connector 17 to allow the lead-out connection portion to be embedded, and a first alignment elastic column 25 is provided in the first alignment positioning groove 24, wherein:

[0133] When the lead-out connection part is embedded in the first alignment positioning groove 24, the lead-out connection part is sleeved on the first alignment elastic column 25 through the lead-out positioning hole 22 of the lead-out connection part;

[0134] A second alignment positioning groove 27 for allowing the temperature sensing monitoring part to be embedded is provided in the second alignment connector 19, and a second alignment elastic column 26 is provided in the second alignment positioning groove 27, wherein:

[0135] When the temperature sensing monitoring part is embedded in the second alignment positioning groove 27, the temperature sensing monitoring part is sleeved on the second alignment elastic column 26 through the temperature sensing positioning hole 18 of the temperature sensing monitoring part;

[0136] The first alignment connector 17 is aligned and contacted with the second alignment connector 19, and the second alignment elastic column 26 is aligned and contacted with the first alignment elastic column 25, so that the temperature sensing connection end is in positive corresponding contact with the end of the lead-out connection line.

[0137] Figure 8 In the illustrated embodiment, a first alignment positioning groove 24 may be provided in the first alignment connector 17, and the form of the first alignment positioning groove 24 is based on the embedding of the lead-out connection portion. A first alignment elastic column 25 may be provided in the first alignment positioning groove 24, and the axial direction of the first alignment elastic column 25 is perpendicular to the surface of the first alignment positioning groove 24, and the first alignment elastic column 25 may have elastic expansion and contraction capability, and the first alignment elastic column 25 may expand and contract along the axial direction of the first alignment elastic column 25.

[0138] In a specific implementation, a lead-out positioning hole 22 can be provided on the lead-out connection portion, and the lead-out positioning hole 22 can penetrate the lead-out connection portion, such as at least penetrating the lead-out connection substrate 5, and between the corresponding ends of the two lead-out connection lines, such as Figure 7 The specific requirement is that the lead-out connection portion can be sleeved on the first alignment elastic column 25 through the lead-out connection hole 22 .

[0139] Specifically, a second alignment positioning groove 27 and a second alignment connecting elastic column 26 can be set in the second alignment connector 19. The second alignment positioning groove 27 and the second alignment elastic column 26 can refer to the corresponding description of the first alignment positioning groove 24 and the first alignment elastic column 25, so as to meet the requirements of assembling the temperature sensing monitor in the second alignment positioning groove 27.

[0140] According to the description of the temperature sensing monitoring part, the temperature sensing positioning hole 18 can only penetrate the temperature sensing monitoring substrate 1 and the corresponding temperature sensing circuit layer 2. Figure 6 and Figure 8As shown. After the temperature sensing monitoring part is sleeved on the second alignment elastic column 26 through the temperature sensing positioning hole 18, the temperature sensing monitoring part can be assembled in the second alignment connector 19. Thereafter, the second alignment connector 19 can be aligned and contacted with the first alignment connector 17. During the alignment and contact process, the second alignment elastic column 26 contacts the first alignment elastic column 25, and based on the elasticity of the first alignment elastic column 25 and the second alignment elastic column 26, the temperature sensing connection end can finally be in positive contact with the end of the lead-out connection line, so as to prepare for subsequent heating and pressurization.

[0141] In one embodiment of the present invention, a temperature sensing connection piece is provided at each temperature sensing connection end, and a lead-out connection piece is provided at one end of the lead-out connection line, wherein:

[0142] The first alignment connector 17 and the second alignment connector 19 are aligned and contacted so that the temperature sensing connector piece and the lead-out connector piece are in positive corresponding contact, and after heating and pressurization, the temperature sensing connector piece and the lead-out connector piece are bonded and fixed.

[0143] In order to improve the reliability of bonding and fixing, a temperature sensing connecting piece can be provided at each temperature sensing connecting end when the temperature sensing connecting end is prepared. For example, a temperature sensing first connecting piece 11 can be provided at the above-mentioned first temperature sensing connecting end, and a temperature sensing second connecting piece 12 can be provided at the second temperature sensing connecting end. Figure 6 As shown, specifically, the first temperature sensing connecting piece 11 and the second temperature sensing connecting piece 12 can expand the area of ​​the corresponding temperature sensing connecting end. The first temperature sensing connecting piece 11 and the second temperature sensing connecting piece 12 can be prepared and formed with the temperature sensing structure body 16 using the same process steps.

[0144] In addition, a lead-out connecting piece may be provided at the end of the lead-out connecting wire, such as providing a first lead-out connecting piece 21 at the first end of the first lead-out connecting wire 13, and providing a second lead-out connecting piece 20 at the second end of the second lead-out connecting wire 14. It can be understood that the area of ​​the end of the lead-out connecting wire can also be expanded by the first lead-out connecting piece 21 and the second lead-out connecting piece 20. In specific implementation, the shape of the first lead-out connecting piece 21 can be adapted to the shape of the first temperature-sensing connecting piece 11, such as Figure 6 and Figure 7 In the embodiment shown in FIG. 1 , the first lead-out connecting piece 21 and the first temperature-sensing connecting piece 11 may both be arc-shaped, and at the same time, the second lead-out connecting piece 20 and the second temperature-sensing connecting piece 12 may also be arc-shaped.

[0145] After the first alignment connector 17 and the second alignment connector 19 are aligned and contacted, the temperature-sensing connection piece and the lead-out connection piece can be in positive corresponding contact, such as the temperature-sensing first connection piece 11 and the first lead-out connection piece 21 are in positive corresponding contact, and the temperature-sensing second connection piece 12 and the second lead-out connection piece 20 are in positive corresponding contact. Thereafter, after heating and pressurizing, the temperature-sensing connection piece and the lead-out connection piece can be bonded and fixed. It should be noted that during heating and pressurizing, the temperature-sensing connection piece and the lead-out connection piece can be in a molten state, and the molten state can be used to bond and fix the temperature-sensing connection piece and the lead-out connection piece.

[0146] It is understandable that the temperature sensing circuit layer 2 and the lead-out connection unit can also be connected in other ways, which are subject to the requirements of the lead-out connection, and will not be described in detail here. When the lead-out connection unit is connected to the temperature sensing circuit layer 2 in the above manner, the above-mentioned temperature monitoring unit can be formed, and then the temperature monitoring unit can be assembled on the insulating support layer 15 and protected by the insulating protection unit.

[0147] In one embodiment of the present invention, the insulating protection unit includes an insulating protection layer 7 and a protective connection layer 8 disposed on the insulating protection layer 7, wherein:

[0148] The insulating protective layer 7 is pressed onto the temperature monitoring part and the lead-out connecting part at the same time, and the protective connecting layer 8 is located on the insulating protective layer 7, and is fixedly connected to the seat cushion by the protective connecting layer 8.

[0149] Figure 1 An embodiment of the insulating protection unit is shown in FIG. 1 , in which the insulating protection unit includes an insulating protection layer 7 and a protective connection layer 8. The insulating protection layer 7 can be made of existing insulating protection materials, such as insulating materials that can meet the requirements of flexibility. The insulating protection layer 7 will be pressed on the temperature monitoring part and the lead-out connection part at the same time. Figure 1 In the process, the insulating protective layer will be pressed on the lead-out connecting wire body layer 6, the transition connecting unit layer 9 and the temperature sensing monitoring base substrate 1.

[0150] Figure 1 In the figure, the lead-out connecting wire body layer 6 and the transition connecting unit layer 9 are located below the temperature sensing monitoring substrate 1 . Therefore, the thickness of the region where the pressure cover is on the insulating protection layer 7 is greater than the thickness of the region where the pressure cover is on the temperature sensing monitoring substrate 1 .

[0151] A protective connection layer 8 is provided on the insulating protective layer 7, and the protective connection layer 8 includes a double-sided adhesive layer. At this time, the protective connection layer 8 can be fixedly connected to the seat cushion. Of course, the protective connection layer 8 can also adopt other forms, which can be selected according to needs, and are listed here one by one.

Claims

1. A surface temperature monitoring sensor device, characterized in that: Used for surface temperature monitoring, the surface temperature monitoring sensor device is in a flexible state and comprises: Insulating support layer; The temperature monitoring unit is mounted on the insulating support layer and includes a temperature monitoring part and a lead-out connection part for leading out the temperature monitoring part, wherein: The temperature monitoring part and the lead-out connection part are both located on the insulating support layer, and the lead-out connection part is located on one side of the temperature monitoring part; The temperature monitoring part at least includes a temperature sensing circuit layer for temperature sensing, and the temperature sensing circuit layer is electrically connected to the lead-out connection unit of the lead-out connection part; The insulating protection unit is pressed onto the temperature monitoring unit to protect the temperature monitoring unit.

2. The surface temperature monitoring sensor device according to claim 1 is characterized in that: The temperature monitoring part also includes a temperature sensing support substrate, a temperature sensing circuit connection layer and a temperature sensing monitoring base, wherein: The temperature sensing circuit layer is prepared on the temperature sensing monitoring substrate, and the temperature sensing support substrate is adaptively connected to the temperature sensing circuit layer through the temperature sensing circuit connection layer; The temperature monitoring part is assembled on the insulating support layer through a temperature sensing support substrate, and the temperature sensing monitoring substrate is located between the temperature sensing circuit layer and the insulating protection layer.

3. The surface temperature monitoring sensor device according to claim 2 is characterized in that: The temperature monitoring unit is prepared based on a clean room photolithography process, wherein the preparation of the temperature monitoring unit includes: Preparing a temperature-sensitive monitoring base film, and preparing a temperature-sensitive metal layer on the temperature-sensitive monitoring base film; Preparing a metal mask layer on the temperature-sensitive metal layer, and patterning the metal mask layer to generate a patterned metal mask layer after patterning; Using the above-mentioned patterned metal mask layer to wet-etch the temperature-sensitive metal layer, so as to generate a temperature-sensitive circuit base layer after the wet etching; A temperature sensing circuit connecting base layer is prepared on the temperature sensing circuit base layer, and the temperature sensing supporting substrate base layer is assembled on the temperature sensing circuit base layer by using the prepared temperature sensing circuit connecting base layer, so as to form a temperature sensing monitoring matrix after assembly; The above-mentioned temperature sensing monitoring substrate is cut by using a femtosecond laser cutting process to generate a temperature sensing monitoring part after cutting.

4. The surface temperature monitoring sensor device according to claim 3 is characterized in that: The temperature sensing circuit layer includes at least one temperature sensing structure made of a thermosensitive material, wherein: Each temperature sensing structure includes a temperature sensing structure body and at least two temperature sensing connection ends adapted to be connected to the temperature sensing structure body, so that the temperature sensing structure body can be led out by using the temperature sensing connection ends; The temperature sensing structure body includes a plurality of arc-shaped temperature sensing areas.

5. The surface temperature monitoring sensor device according to claim 4 is characterized in that: The lead-out connection portion includes a lead-out connection substrate, wherein: The lead-out connection unit is prepared on the lead-out connection substrate; The lead-out connection unit at least comprises a lead-out connection wire body group located on the lead-out connection substrate, and the lead-out connection wire body group comprises at least two lead-out connection wires; When the lead-out connection unit is connected to the temperature sensing circuit layer, the two lead-out connection wires in the lead-out connection unit are respectively electrically connected to the two temperature sensing connection ends of the temperature sensing structure, so that the temperature sensing circuit layer is led out through the electrical connection between the lead-out connection wires and the temperature sensing connection ends.

6. The surface temperature monitoring sensor device according to claim 5 is characterized in that: The lead-out connection unit is prepared on the lead-out connection substrate by screen printing process, wherein the lead-out connection unit is prepared by: Provide lead-out connection base layer, A plurality of lead-out connection wire body groups are prepared on the lead-out connection base layer by a screen printing process, so as to form a lead-out connection matrix after the lead-out connection wire body groups are prepared; The lead-out connection base is cut to form a lead-out connection portion after cutting.

7. The surface temperature monitoring sensor device for a seat according to claim 6, characterized in that: When the lead-out connection unit is connected to the temperature sensing circuit layer, a lead-out connection line is electrically connected to a corresponding temperature sensing connection end through a lead-out intermediate connection body, and the lead-out intermediate connection body is located between the lead-out connection line and the temperature sensing connection end.

8. The surface temperature monitoring sensor device according to claim 6 is characterized in that: After the temperature sensing monitoring part is formed by cutting, the two temperature sensing connection ends of the temperature sensing structure are in an exposed state; When the lead-out connection unit is connected to the temperature sensing circuit layer, the connection method includes: Providing an alignment connection fixture, the alignment connection fixture comprising a first alignment connection body and a second alignment connection body, wherein the first alignment connection body and the second alignment connection body are hingedly connected; The lead-out connection part is assembled in the first alignment connection body, and the temperature sensing monitoring part is assembled in the second alignment connection body, wherein the lead-out connection line and the temperature sensing connection end are both in an exposed state; Aligning and contacting the first alignment connector with the second alignment connector so that the temperature sensing connection end is in positive correspondence contact with the end of the lead-out connection line; The temperature sensing connection end and the end of the lead-out connection line in the contact state are at least heated and pressurized by aligning the connection fixture, so that the temperature sensing connection end and the end of the corresponding contact lead-out connection line are bonded and fixed after heating and pressurizing.

9. The surface temperature monitoring sensor device according to claim 8 is characterized in that: A first alignment positioning groove is provided in the first alignment connector to allow the lead-out connecting portion to be embedded, and a first alignment elastic column is provided in the first alignment positioning groove, wherein: When the lead-out connection part is embedded in the first alignment positioning groove, the lead-out connection part is sleeved on the first alignment elastic column through the lead-out positioning hole of the lead-out connection part; A second alignment positioning groove is provided in the second alignment connector to allow the temperature sensing monitoring part to be embedded, and a second alignment elastic column is provided in the second alignment positioning groove, wherein: When the temperature sensing monitoring part is embedded in the second alignment positioning groove, the temperature sensing monitoring part is sleeved on the second alignment elastic column through the temperature sensing positioning hole of the temperature sensing monitoring part; The first alignment connector is aligned and contacted with the second alignment connector, the second alignment elastic column is aligned and contacted with the first alignment elastic column, and the temperature sensing connection end is in positive corresponding contact with the end of the lead-out connection line.

10. The surface temperature monitoring sensor device according to any one of claims 7 to 9, characterized in that: A temperature sensing connection piece is provided at each temperature sensing connection end, and a lead-out connection piece is provided at one end of the lead-out connection line, wherein: The first alignment connector is aligned and contacted with the second alignment connector so that the temperature sensing connector is in positive corresponding contact with the lead-out connector, and after heating and pressurization, the temperature sensing connector and the lead-out connector are bonded and fixed.

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