Intelligent defect detection method in damping adhesive tape winding process

Abstract

The invention discloses an intelligent defect detection method in a damping adhesive tape winding process, and relates to the technical field of visual inspection.The method adopts a defect detection system for work, and the system comprises a supporting material press-in module, an infrared detection module, an information analysis module and an arrangement adjustment module; the support material press-in module is used for pressing a flexible support material into a base material of the damping adhesive tape, the infrared detection module is used for generating an image of a reflected characteristic absorption peak by adopting infrared spectrum propagation to meet polyurethane and polyethylene, and the information analysis module is used for comprehensively analyzing a processed infrared spectrum image. The arrangement adjusting module is used for adjusting the arrangement density of the strip-shaped supporting materials in the damping adhesive tape in real time according to the characteristic absorption peak analysis result, and the material releasing unit is used for controlling putting of the strip-shaped flexible supporting materials on the damping adhesive tape.

Description

Technical Field

[0001] The present invention relates to the field of visual inspection technology, and in particular to an intelligent defect detection method in the winding process of a shock-absorbing tape. Background Art

[0002] Shock-absorbing tape is widely used in many industries and scenarios due to its superior shock-absorbing and sound-insulating properties. The base material of the shock-absorbing tape is generally a mixture of polyurethane and polyethylene flexible foam materials. Strips of flexible support material are pressed into the bottom layer, and the two materials are bonded together with an adhesive. The winding process allows the shock-absorbing tape to be stored while the two materials are bonded more tightly.

[0003] If the arrangement density of the strip flexible support material on the shock-absorbing tape is too low, the tape will be insufficiently strong and difficult to adapt to the high-frequency vibration environment. If the arrangement density is too high, the shock-absorbing tape substrate may be easily cracked when it is wound due to tightness. Polyurethane and polyethylene are both substrate components. Polyurethane is better than polyethylene in terms of flexibility to resist cracking. Due to the poor compatibility between polyurethane and polyethylene, it is difficult to form a completely uniform arrangement state on the substrate.

[0004] The arrangement of the strip flexible support material in the prior art does not take into account the arrangement state of the two substrates, but only adopts a uniform density arrangement mode, ignoring the possibility of cracking defects in places where polyurethane is arranged more. Therefore, it is necessary to design an intelligent defect detection method in the winding process of the shock-absorbing tape with real-time adjustment. Summary of the invention

[0005] The purpose of the present invention is to provide an intelligent defect detection method during the winding process of a shock-absorbing tape to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: an intelligent defect detection method during the winding process of a shock-absorbing tape, the method adopts a defect detection system to work, the system includes a support material pressing module, an infrared detection module, an information analysis module, and an arrangement adjustment module, the support material pressing module is used to press flexible support material into the substrate of the shock-absorbing tape, the infrared detection module uses infrared spectrum propagation to encounter polyurethane and polyethylene, and generates an image of the characteristic absorption peak reflected back, the information analysis module is used to perform a comprehensive analysis of the processed infrared spectrum image, and the arrangement adjustment module is used to adjust the arrangement density of the strip support material in the shock-absorbing tape in real time according to the characteristic absorption peak analysis results.

[0007] According to the above technical solution, the supporting material pressing module includes a material releasing unit, a pressing unit, and a gluing unit. The material releasing unit is used to control the release of a strip of flexible supporting material onto the shock-absorbing tape. The pressing unit is used to press the strip of flexible supporting material into the bottom layer of the shock-absorbing tape. The gluing unit is used to apply glue to the pressing part of the two before pressing.

[0008] The infrared detection module includes an infrared transmitter, an infrared detector, an infrared signal processing module, and an infrared spectrum integration module. The infrared detector is electrically connected to the infrared signal processing module, and the infrared signal processing module is electrically connected to the infrared spectrum integration module. The infrared transmitter uses an infrared light source to emit outwards, the infrared detector is used to detect infrared light reflected or transmitted from the sample, and convert it into an electrical signal, the infrared signal processing module is used to amplify, filter and process the signal transmitted by the detector to generate spectrum information, and the infrared spectrum integration module is used to integrate the spectrum information into an infrared spectrum image;

[0009] The information analysis module includes an image analysis module, a characteristic absorption peak comparison module, and a substrate distribution definition module. The image analysis module is electrically connected to the image analysis module and the infrared spectrum integration module, the characteristic absorption peak comparison module is electrically connected to the image analysis module, and the substrate distribution definition module is electrically connected to the characteristic absorption peak comparison module; the image analysis module analyzes the infrared spectrum image, the characteristic absorption peak comparison module compares the characteristic absorption peak intensity and wave number of polyurethane and the characteristic absorption peak intensity and wave number of polyethylene by analyzing the infrared spectrum, and the substrate distribution definition module is used to determine the ratio and distribution position of polyurethane and polyethylene;

[0010] The arrangement adjustment module includes an arrangement interval calculation module, a database, and a defect visual monitoring module. The database is electrically connected to the image analysis module and the infrared spectrum integration module. The arrangement interval calculation module is electrically connected to the characteristic absorption peak comparison module and the substrate distribution definition module. The arrangement interval calculation module reads the judgment results of polyurethane and polyethylene, automatically adjusts the arrangement density technical parameters of the strip support material, and changes the arrangement density of the strip support material in the shock-absorbing tape substrate. The database is used to record infrared spectrum images and arrangement density data of strip support materials, and store them in the database for subsequent analysis and comparison. The defect visual monitoring module is used to use a camera to visually monitor cracking defects during the winding process of the shock-absorbing tape.

[0011] According to the above technical solution, the following steps are included:

[0012] S1. Before the winding process of the shock-absorbing tape, an infrared scanning signal is emitted from top to bottom to the shock-absorbing tape to ensure that the infrared light effectively passes through the shock-absorbing tape. The infrared light is received by the infrared detector below, and the received position coordinate signal is processed to generate an infrared spectrum image. At the same time, visual real-time monitoring is used to determine whether there is a crack defect on the edge of the shock-absorbing tape during the winding process;

[0013] S2. Compare the absorption peak intensity and wave number data in the infrared spectrum with the shock-absorbing tape substrate image to determine whether polyurethane or polyethylene exists. Draw a distribution map of the shock-absorbing tape substrate of polyurethane and polyethylene based on the information of the infrared spectrum image to evaluate the content ratio of polyurethane and polyethylene at various locations of the shock-absorbing tape substrate.

[0014] S3. According to the judgment results of polyurethane and polyethylene, the arrangement density of the strip support material arranged under the shock-absorbing tape substrate is automatically adjusted, and the processed infrared spectrum image, substrate distribution map, absorption peak intensity and wave number data and the arrangement density of the strip support material are stored in the database;

[0015] S4. Production personnel check infrared spectral images and crack defect monitoring results, evaluate the accuracy of the arrangement density of the strip support materials, and verify and optimize the arrangement density parameters of the strip support materials.

[0016] According to the above technical solution, in S1, the infrared spectrum generation process is specifically as follows:

[0017] S2-1, dividing the detection area of ​​the infrared detector into a detection point array, wherein the array has a plurality of detection points, and when the shock-absorbing tape is translated before winding, recording the coordinates of each detection point of each infrared detector in real time;

[0018] S2-2. Use an infrared transmitter to emit infrared light, use an infrared detector to receive the reflected infrared light, use the infrared detector to obtain the intensity change of the received wave, calculate the absorption peak intensity and wave number, the infrared light intensity of each band emitted by the infrared transmitter is j0, the intensity of the received wave received by a certain detection point is j1, then the light intensity attenuation value is Δj=j0-j1, the wave number is related to the number of absorption peaks F, if the light intensity attenuation value of a certain band reaches the peak value within the receiving wave receiving time, it is defined as the absorption peak, different detection points detect the same position The number of absorption peaks will be different, and the average value ΔF is taken;

[0019] S2-3, let the detection area have i detection points, and the received wave intensity of each detection point be j i , for each j i The size of the absorption peak is compared to determine the light intensity variation characteristics of each detection point, and an infrared spectrum is generated based on the absorption peak intensity and wave number data.

[0020] According to the above technical solution, in S2, the working method of combining the shock-absorbing tape substrate pattern with the infrared spectrum is:

[0021] S2-4, extracting marking points according to the infrared spectrum and the shock-absorbing tape substrate pattern respectively, making the marking points of the two patterns overlap with each other, and scaling with the marking points as the center;

[0022] S2-5, aligning the infrared spectrum with the contour of the shock-absorbing tape substrate pattern, superimposing the fitted infrared spectrum onto the substrate distribution map, and generating a final fitting image.

[0023] According to the above technical solution, the specific method for determining whether polyurethane and polyethylene exist is:

[0024] S3-1. Analyze the light intensity and wave number of the received waves at each detection point. When the light intensity attenuation value Δj of the selected band is less than the lower critical value j min , this area is defined as the potential polyurethane area, and the variance of the number of absorption peaks F is collected for calculation. If the variance of the number of absorption peaks F If it is less than the set value X, that is, the stability meets the requirement, then this area is judged to be polyurethane;

[0025] S3-2, when the light intensity attenuation value Δj of the selected band at a certain detection point is greater than the high critical value j max , then this region is defined as the potential polyethylene region. If the variance of the number of absorption peaks F is If it is less than the set value X, that is, the stability meets the requirements, this area is judged to be polyethylene.

[0026] According to the above technical solution, in S4, the working method of the arrangement interval calculation module is:

[0027] S4-1. Find the area corresponding to the polyurethane area in the substrate distribution map in the infrared spectrum image, and increase the strip support material arrangement density F in this area. The increase is positively correlated with the ratio of Δj, specifically: Where F0 is the default arrangement density, and k is the weight coefficient of light intensity;

[0028] S4-2. Find the area corresponding to the polyethylene in the substrate distribution map in the infrared spectrum image, and reduce the strip support material arrangement density F in this area. The reduction range is positively correlated with the ratio of Δj to A, specifically: Where F0 is the default arrangement density.

[0029] According to the above technical solution, in S4, verifying and optimizing the arrangement density parameters of the strip support material includes:

[0030] When checking the arrangement density of the strip support material, if cracking is detected at the edge of the shock-absorbing tape substrate during the subsequent winding process, the arrangement density F of the strip support material is first reduced. If the normal monitoring effect is achieved subsequently, there is no need to adjust the arrangement density F of the strip support material. If the monitoring effect is still not achieved, the infrared detector is used again to obtain the change in the light intensity of the received wave, and then the arrangement density F of the strip support material is determined.

[0031] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: the present invention determines the distribution of polyurethane and polyethylene in the shock-absorbing tape substrate by analyzing the characteristic absorption peaks of the infrared spectrum, and then adjusts the spacing distance of the strip flexible support material according to the proportion of polyurethane in the shock-absorbing tape substrate at a certain position, so that the substrate portion where the proportion of polyurethane in the substrate is high, that is, the portion with greater toughness, is arranged with a larger density of strip flexible support material, and vice versa, fewer strip flexible support materials are arranged, so that the shock-absorbing tape can minimize the problem of cracking while ensuring the strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0033] Figure 1 It is a schematic diagram of the overall module structure of the present invention. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figure 1 The present invention provides a technical solution: an intelligent defect detection method during the winding process of a shock-absorbing tape, the method adopts a defect detection system to work, the system includes a support material pressing module, an infrared detection module, an information analysis module, and an arrangement adjustment module, the support material pressing module is used to press the flexible support material into the substrate of the shock-absorbing tape, the infrared detection module uses infrared spectrum propagation to encounter polyurethane and polyethylene, and generates an image of the characteristic absorption peak reflected back, the information analysis module is used to perform a comprehensive analysis on the processed infrared spectrum image, and the arrangement adjustment module is used to adjust the arrangement density of the strip support material in the shock-absorbing tape in real time according to the characteristic absorption peak analysis result;

[0036] The supporting material pressing module includes a material releasing unit, a pressing unit, and a gluing unit. The material releasing unit is used to control the release of a strip of flexible supporting material onto the shock-absorbing tape. The pressing unit is used to press the strip of flexible supporting material into the bottom layer of the shock-absorbing tape. The gluing unit is used to apply glue to the pressing part of the two before pressing.

[0037] The infrared detection module includes an infrared transmitter, an infrared detector, an infrared signal processing module, and an infrared spectrum integration module. The infrared detector is electrically connected to the infrared signal processing module, and the infrared signal processing module is electrically connected to the infrared spectrum integration module. The infrared transmitter uses an infrared light source to emit outwards, the infrared detector is used to detect infrared light reflected or transmitted from the sample, and convert it into an electrical signal, the infrared signal processing module is used to amplify, filter and process the signal transmitted by the detector to generate spectrum information, and the infrared spectrum integration module is used to integrate the spectrum information into an infrared spectrum image.

[0038] The information analysis module includes an image analysis module, a characteristic absorption peak comparison module, and a substrate distribution definition module. The image analysis module is electrically connected to the image analysis module and the infrared spectrum integration module, the characteristic absorption peak comparison module is electrically connected to the image analysis module, and the substrate distribution definition module is electrically connected to the characteristic absorption peak comparison module; the image analysis module analyzes the infrared spectrum image, the characteristic absorption peak comparison module compares the characteristic absorption peak intensity and wave number of polyurethane and the characteristic absorption peak intensity and wave number of polyethylene by analyzing the infrared spectrum, and the substrate distribution definition module is used to determine the ratio and distribution position of polyurethane and polyethylene;

[0039] The arrangement adjustment module includes an arrangement interval calculation module, a database, and a defect visual monitoring module. The database is electrically connected to the image analysis module and the infrared spectrum integration module. The arrangement interval calculation module is electrically connected to the characteristic absorption peak comparison module and the substrate distribution definition module. The arrangement interval calculation module reads the judgment results of polyurethane and polyethylene, automatically adjusts the arrangement density technical parameters of the strip support material, and changes the arrangement density of the strip support material in the shock-absorbing tape substrate. The database is used to record infrared spectrum images and arrangement density data of the strip support material, and store them in the database for subsequent analysis and comparison. The defect visual monitoring module is used to use a camera to visually monitor cracking defects during the winding process of the shock-absorbing tape.

[0040] The following steps are involved:

[0041] S1. Before the winding process of the shock-absorbing tape, an infrared scanning signal is emitted from top to bottom to the shock-absorbing tape to ensure that the infrared light effectively passes through the shock-absorbing tape. The infrared light is received by the infrared detector below, and the received position coordinate signal is processed to generate an infrared spectrum image. At the same time, visual real-time monitoring is used to determine whether there is a crack defect on the edge of the shock-absorbing tape during the winding process;

[0042] S2. Compare the absorption peak intensity and wave number data in the infrared spectrum with the shock-absorbing tape substrate image to determine whether polyurethane or polyethylene exists. Draw a distribution map of the shock-absorbing tape substrate of polyurethane and polyethylene based on the information of the infrared spectrum image to evaluate the content ratio of polyurethane and polyethylene at various locations of the shock-absorbing tape substrate.

[0043] S3. According to the judgment results of polyurethane and polyethylene, the arrangement density of the strip support material arranged under the shock-absorbing tape substrate is automatically adjusted, and the processed infrared spectrum image, substrate distribution map, absorption peak intensity and wave number data and the arrangement density of the strip support material are stored in the database;

[0044] S4. Production personnel check infrared spectrum images and crack defect monitoring results, evaluate the accuracy of the arrangement density of strip support materials, and verify and optimize the arrangement density parameters of strip support materials;

[0045] In S1, the generation process of the infrared spectrum is as follows:

[0046] S2-1, dividing the detection area of ​​the infrared detector into a detection point array, wherein the array has a plurality of detection points, and when the shock-absorbing tape is translated before winding, recording the coordinates of each detection point of each infrared detector in real time;

[0047] S2-2. Use an infrared transmitter to emit infrared light, use an infrared detector to receive the reflected infrared light, use the infrared detector to obtain the intensity change of the received wave, calculate the absorption peak intensity and wave number, the infrared light intensity of each band emitted by the infrared transmitter is j0, the intensity of the received wave received by a certain detection point is j1, then the light intensity attenuation value is Δj=j0-j1, the wave number is related to the number of absorption peaks F, if the light intensity attenuation value of a certain band reaches the peak value within the receiving wave receiving time, it is defined as the absorption peak, different detection points detect the same position The number of absorption peaks will be different, and the average value ΔF is taken;

[0048] S2-3, let the detection area have i detection points, and the received wave intensity of each detection point be j i , for each j i The size of the absorption peak is compared to determine the light intensity variation characteristics of each detection point, and an infrared spectrum is generated based on the absorption peak intensity and wave number data;

[0049] In S2, the working method of combining the shock-absorbing tape substrate pattern with the infrared spectrum is as follows:

[0050] S2-4, extracting marking points according to the infrared spectrum and the shock-absorbing tape substrate pattern respectively, making the marking points of the two patterns overlap with each other, and scaling with the marking points as the center;

[0051] S2-5, aligning the infrared spectrum with the contour of the shock-absorbing tape substrate pattern, and superimposing the fitted infrared spectrum onto the substrate distribution map to generate a final fitting image;

[0052] The specific method for determining whether polyurethane and polyethylene are present is:

[0053] S3-1. Analyze the light intensity and wave number of the received waves at each detection point. When the light intensity attenuation value Δj of the selected band is less than the lower critical value j min , this area is defined as the potential polyurethane area, and the variance of the number of absorption peaks F is collected for calculation. If the variance of the number of absorption peaks F If it is less than the set value X, that is, the stability meets the requirement, then this area is judged to be polyurethane;

[0054] S3-2, when the light intensity attenuation value Δj of the selected band at a certain detection point is greater than the high critical value j max , then this region is defined as the potential polyethylene region. If the variance of the number of absorption peaks F is If it is less than the set value X, that is, the stability meets the requirement, then this area is judged to be polyethylene;

[0055] In S4, the working method of the arrangement interval calculation module is:

[0056] S4-1. Find the area corresponding to the polyurethane area in the substrate distribution map in the infrared spectrum image, and increase the strip support material arrangement density F in this area. The increase is positively correlated with the ratio of Δj, specifically: Where F0 is the default arrangement density, and k is the weight coefficient of light intensity;

[0057] S4-2. Find the area corresponding to the polyethylene in the substrate distribution map in the infrared spectrum image, and reduce the strip support material arrangement density F in this area. The reduction range is positively correlated with the ratio of Δj to A, specifically: Where F0 is the default arrangement density;

[0058] In S4, the verification and optimization of the arrangement density parameters of the strip support material include:

[0059] When checking the arrangement density of the strip support material, if cracking is detected at the edge of the shock-absorbing tape substrate during the subsequent winding process, the arrangement density F of the strip support material is first reduced. If the normal monitoring effect is achieved subsequently, there is no need to adjust the arrangement density F of the strip support material. If the monitoring effect is still not achieved, the infrared detector is used again to obtain the change in the light intensity of the received wave, and then the arrangement density F of the strip support material is determined.

[0060] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0061] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Intelligent defect detection method during the winding process of shock-absorbing tape, characterized by: The method adopts a defect detection system to work, which includes a support material pressing module, an infrared detection module, an information analysis module, and an arrangement adjustment module. The support material pressing module is used to press flexible support materials into the substrate of the shock-absorbing tape. The infrared detection module uses infrared spectrum propagation to encounter polyurethane and polyethylene, and generates images of characteristic absorption peaks reflected back. The information analysis module is used to perform comprehensive analysis on the processed infrared spectrum image. The arrangement adjustment module is used to adjust the arrangement density of the strip support material in the shock-absorbing tape in real time according to the characteristic absorption peak analysis results.

2. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 1 is characterized in that: The supporting material pressing module includes a material releasing unit, a pressing unit, and a gluing unit. The material releasing unit is used to control the release of a strip of flexible supporting material onto the shock-absorbing tape. The pressing unit is used to press the strip of flexible supporting material into the bottom layer of the shock-absorbing tape. The gluing unit is used to apply glue to the pressing part of the two before pressing. The infrared detection module includes an infrared transmitter, an infrared detector, an infrared signal processing module, and an infrared spectrum integration module. The infrared detector is electrically connected to the infrared signal processing module, and the infrared signal processing module is electrically connected to the infrared spectrum integration module. The infrared transmitter uses an infrared light source to emit outwards, the infrared detector is used to detect infrared light reflected or transmitted from the sample, and convert it into an electrical signal, the infrared signal processing module is used to amplify, filter and process the signal transmitted by the detector to generate spectrum information, and the infrared spectrum integration module is used to integrate the spectrum information into an infrared spectrum image; The information analysis module includes an image analysis module, a characteristic absorption peak comparison module, and a substrate distribution definition module. The image analysis module is electrically connected to the image analysis module and the infrared spectrum integration module, the characteristic absorption peak comparison module is electrically connected to the image analysis module, and the substrate distribution definition module is electrically connected to the characteristic absorption peak comparison module; the image analysis module analyzes the infrared spectrum image, the characteristic absorption peak comparison module compares the characteristic absorption peak intensity and wave number of polyurethane and the characteristic absorption peak intensity and wave number of polyethylene by analyzing the infrared spectrum, and the substrate distribution definition module is used to determine the ratio and distribution position of polyurethane and polyethylene; The arrangement adjustment module includes an arrangement interval calculation module, a database, and a defect visual monitoring module. The database is electrically connected to the image analysis module and the infrared spectrum integration module. The arrangement interval calculation module is electrically connected to the characteristic absorption peak comparison module and the substrate distribution definition module. The arrangement interval calculation module reads the judgment results of polyurethane and polyethylene, automatically adjusts the arrangement density technical parameters of the strip support material, and changes the arrangement density of the strip support material in the shock-absorbing tape substrate. The database is used to record infrared spectrum images and arrangement density data of strip support materials, and store them in the database for subsequent analysis and comparison. The defect visual monitoring module is used to use a camera to visually monitor cracking defects during the winding process of the shock-absorbing tape.

3. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 2 is characterized in that: The following steps are involved: S1. Before the winding process of the shock-absorbing tape, an infrared scanning signal is emitted from top to bottom to the shock-absorbing tape to ensure that the infrared light effectively passes through the shock-absorbing tape. The infrared light is received by the infrared detector below, and the received position coordinate signal is processed to generate an infrared spectrum image. At the same time, visual real-time monitoring is used to determine whether there is a crack defect on the edge of the shock-absorbing tape during the winding process; S2. Compare the absorption peak intensity and wave number data in the infrared spectrum with the shock-absorbing tape substrate image to determine whether polyurethane or polyethylene exists. Draw a distribution map of the shock-absorbing tape substrate of polyurethane and polyethylene based on the information of the infrared spectrum image to evaluate the content ratio of polyurethane and polyethylene at various locations of the shock-absorbing tape substrate. S3. According to the judgment results of polyurethane and polyethylene, the arrangement density of the strip support material arranged under the shock-absorbing tape substrate is automatically adjusted, and the processed infrared spectrum image, substrate distribution map, absorption peak intensity and wave number data and the arrangement density of the strip support material are stored in the database; S4. Production personnel check infrared spectral images and crack defect monitoring results, evaluate the accuracy of the arrangement density of the strip support materials, and verify and optimize the arrangement density parameters of the strip support materials.

4. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 3 is characterized in that: In S1, the infrared spectrum generation process is specifically as follows: S2-1, dividing the detection area of ​​the infrared detector into a detection point array, wherein the array has a plurality of detection points, and when the shock-absorbing tape is translated before winding, recording the coordinates of each detection point of each infrared detector in real time; S2-2. Use an infrared transmitter to emit infrared light, use an infrared detector to receive the reflected infrared light, use the infrared detector to obtain the intensity change of the received wave, calculate the absorption peak intensity and wave number, the infrared light intensity of each band emitted by the infrared transmitter is j0, the intensity of the received wave received by a certain detection point is j1, then the light intensity attenuation value is Δj=j0-j1, the wave number is related to the number of absorption peaks F, if the light intensity attenuation value of a certain band reaches the peak value within the receiving wave receiving time, it is defined as the absorption peak, different detection points detect the same position The number of absorption peaks will be different, and the average value ΔF is taken; S2-3, let the detection area have i detection points, and the received wave intensity of each detection point be j i , for each j i The size of the absorption peak is compared to determine the light intensity variation characteristics of each detection point, and an infrared spectrum is generated based on the absorption peak intensity and wave number data.

5. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 4 is characterized in that: In S2, the working method of combining the shock-absorbing tape substrate pattern with the infrared spectrum is as follows: S2-4, extracting marking points according to the infrared spectrum and the shock-absorbing tape substrate pattern respectively, making the marking points of the two patterns overlap with each other, and scaling with the marking points as the center; S2-5, aligning the infrared spectrum with the contour of the shock-absorbing tape substrate pattern, superimposing the fitted infrared spectrum onto the substrate distribution map, and generating a final fitting image.

6. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 5 is characterized in that: The specific method for judging whether polyurethane and polyethylene exist is: S3-1. Analyze the light intensity and wave number of the received waves at each detection point. When the light intensity attenuation value Δj of the selected band is less than the lower critical value j min , this area is defined as the potential polyurethane area, and the variance of the number of absorption peaks F is collected for calculation. If the variance of the number of absorption peaks F If it is less than the set value X, that is, the stability meets the requirement, then this area is judged to be polyurethane; S3-2, when the light intensity attenuation value Δj of the selected band at a certain detection point is greater than the high critical value j max , then this region is defined as the potential polyethylene region. If the variance of the number of absorption peaks F is If it is less than the set value X, that is, the stability meets the requirements, this area is judged to be polyethylene.

7. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 6 is characterized in that: In S4, the working method of the arrangement interval calculation module is: S4-1. Find the area corresponding to the polyurethane area in the substrate distribution map in the infrared spectrum image, and increase the strip support material arrangement density F in this area. The increase is positively correlated with the ratio of Δj, specifically: Where F0 is the default arrangement density, and k is the weight coefficient of light intensity; S4-2. Find the area corresponding to the polyethylene in the substrate distribution map in the infrared spectrum image, and reduce the strip support material arrangement density F in this area. The reduction range is positively correlated with the ratio of Δj to A, specifically: Where F0 is the default arrangement density.

8. The intelligent defect detection method during the winding process of the shock-absorbing tape according to claim 7 is characterized in that: In S4, verifying and optimizing the arrangement density parameters of the strip support material includes: When checking the arrangement density of the strip support material, if cracking is detected at the edge of the shock-absorbing tape substrate during the subsequent winding process, the arrangement density F of the strip support material is first reduced. If the normal monitoring effect is achieved subsequently, there is no need to adjust the arrangement density F of the strip support material. If the monitoring effect is still not achieved, the infrared detector is used again to obtain the change in the light intensity of the received wave, and then the arrangement density F of the strip support material is determined.

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