Method for adding sub-resolution auxiliary graph

Abstract

The invention provides a method for adding a sub-resolution auxiliary graph, which comprises the following steps of: acquiring a target graph which comprises a plurality of through hole graphs; performing optical simulation on the target graph to obtain the maximum light intensity of each through hole graph; obtaining a sub-resolution auxiliary graph adding sequence of the plurality of through hole graphs based on the maximum light intensity of the plurality of through hole graphs; and respectively adding sub-resolution auxiliary graphs to the plurality of through hole graphs in sequence based on the sub-resolution auxiliary graph adding sequence of the plurality of through hole graphs. By obtaining the maximum light intensity of the plurality of through hole patterns and obtaining the sub-resolution auxiliary pattern adding sequence of the plurality of through hole patterns according to the maximum light intensity, the optical influence of adding the sub-resolution auxiliary patterns on the through hole patterns is avoided, and the optical resolution is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a method for adding sub-resolution auxiliary graphics. Background Art

[0002] In semiconductor manufacturing, as the design size continues to shrink, the photolithography process window of the via layer has become one of the key factors affecting the transfer of the via layer pattern. In order to improve the lithography resolution of the via layer, the numerical aperture of the photolithography process has been continuously increased under the condition of the continuous reduction of the design size and spacing, and the negative effect brought about by this is that the photolithography process window will be reduced.

[0003] In order to improve the lithography process window of the through-hole layer, sub-resolution assist features (SRAF) have been widely used in the mask plate output and lithography process flow of the through-hole layer. In the prior art, the sub-resolution assist feature addition method implants the sub-resolution assist feature through a series of rules based on line width and pattern spacing. It is difficult to cover all the pattern structures or environments in the face of addition conflicts, which may cause the optical impact contrast of some through-hole patterns to be poor and the optical resolution to be low, thereby affecting the size of the lithography process window. Summary of the invention

[0004] Based on this, it is necessary to provide a method for adding sub-resolution auxiliary graphics to address the problems in the above-mentioned background technology, which can at least avoid the optical impact on the through-hole graphics and improve the optical resolution.

[0005] To achieve the above objectives and other related objectives, one aspect of the present application provides a method for adding sub-resolution auxiliary graphics, comprising the following steps:

[0006] Acquire a target pattern, the target pattern comprising a plurality of through-hole patterns;

[0007] Perform optical simulation on the target pattern to obtain the maximum light intensity of each through-hole pattern;

[0008] Obtaining a sub-resolution auxiliary pattern adding sequence of the plurality of through-hole patterns based on the maximum light intensity of the plurality of through-hole patterns;

[0009] Sub-resolution auxiliary patterns are added to the plurality of through-hole patterns in sequence based on the sub-resolution auxiliary pattern adding sequence of the plurality of through-hole patterns.

[0010] In one embodiment, the method of adding sub-resolution auxiliary graphics further includes:

[0011] Based on determining whether each through-hole pattern has an adding conflict with other through-hole patterns, different types of sub-resolution auxiliary patterns are added to the through-hole patterns.

[0012] In one embodiment, the maximum light intensity of the via pattern is inversely proportional to the sub-resolution auxiliary pattern addition sequence of the via pattern:

[0013] When the maximum light intensity of the through-hole pattern is stronger, the ranking of the added sub-resolution auxiliary pattern of the through-hole pattern is lower;

[0014] When the maximum light intensity of the through hole pattern is weaker, the ranking of the added sub-resolution auxiliary pattern of the through hole pattern is higher.

[0015] In one embodiment, a sub-resolution auxiliary pattern adding sequence for obtaining a plurality of through-hole patterns based on the maximum light intensity of the plurality of through-hole patterns comprises:

[0016] sorting the maximum light intensities of the plurality of through-hole patterns from high to low to obtain a light intensity sorting of the plurality of through-hole patterns;

[0017] A sub-resolution auxiliary pattern adding sequence of the plurality of through-hole patterns is obtained based on the light intensity ranking of the plurality of through-hole patterns, and the sub-resolution auxiliary pattern adding sequence of the plurality of through-hole patterns is opposite to the light intensity ranking of the plurality of through-hole patterns.

[0018] In one embodiment, based on determining whether each through-hole pattern has an addition conflict with other through-hole patterns, adding different types of sub-resolution auxiliary patterns to the through-hole pattern includes:

[0019] When there is no adding conflict between the through hole pattern and other through hole patterns, adding a first type of sub-resolution auxiliary pattern to the through hole pattern;

[0020] When there is an addition conflict between two through-hole patterns and the maximum light intensity difference between the two is greater than a preset range, adding a first type of sub-resolution auxiliary pattern;

[0021] When there is an adding conflict between two through-hole patterns and the maximum light intensity difference between the two is smaller than a preset range, a second type of sub-resolution auxiliary pattern is added.

[0022] In one embodiment, a sub-resolution auxiliary pattern adding sequence for obtaining a plurality of through-hole patterns based on the maximum light intensity of the plurality of through-hole patterns comprises:

[0023] Multiple via patterns are graded based on their maximum light intensity:

[0024] When the through-hole levels of the plurality of through-hole patterns are the same, the sub-resolution auxiliary pattern adding sequence of the plurality of through-hole patterns is the same;

[0025] When the through-hole levels of the plurality of through-hole patterns are different, the sub-resolution auxiliary patterns of the plurality of through-hole patterns are added in different sequences.

[0026] In one embodiment, grading the plurality of via patterns based on the maximum light intensity of the plurality of via patterns includes comparing the maximum light intensity of the plurality of via patterns with a preset light intensity range of via grades to respectively determine a via grade of each via pattern.

[0027] In one embodiment, the maximum light intensity of the via pattern is inversely proportional to the via grade of the via pattern:

[0028] When the maximum light intensity of the through-hole pattern is stronger, the through-hole grade of the through-hole pattern is lower;

[0029] When the maximum light intensity of the through-hole pattern is weaker, the through-hole grade of the through-hole pattern is higher.

[0030] In one embodiment, based on determining whether each through-hole pattern has an addition conflict with other through-hole patterns, adding different types of sub-resolution auxiliary patterns to the through-hole pattern includes:

[0031] When there is no adding conflict between the through hole pattern and other through hole patterns, adding a first type of sub-resolution auxiliary pattern to the through hole pattern;

[0032] When there is an adding conflict between two through-hole patterns of different through-hole levels, adding a first type of sub-resolution auxiliary pattern;

[0033] When there is an addition conflict between two through-hole patterns of the same through-hole level, a second type of sub-resolution auxiliary pattern is added.

[0034] In one embodiment, the first type of sub-resolution assist patterns comprises linear assist patterns, and the second type of sub-resolution assist patterns comprises square assist patterns.

[0035] According to the method for adding sub-resolution auxiliary graphics provided by the present invention, by obtaining the maximum light intensity of multiple through-hole graphics, a sub-resolution auxiliary graphics adding sequence of the multiple through-hole graphics is obtained according to the maximum light intensity, thereby avoiding the optical influence of adding sub-resolution auxiliary graphics on the through-hole graphics and improving the optical resolution. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to better describe and illustrate the embodiments and / or examples of those applications disclosed herein, reference may be made to one or more drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed applications, the embodiments and / or examples currently described, and the best modes of these applications currently understood.

[0037] Figure 1 A schematic diagram of a target graphic;

[0038] Figure 2 is a schematic diagram of a sub-resolution auxiliary graphic obtained according to the prior art;

[0039] Figure 3 A schematic diagram of light intensity distribution of a sub-resolution auxiliary pattern obtained according to the prior art;

[0040] Figure 4 is a flow chart of a method for adding sub-resolution auxiliary graphics provided in an embodiment;

[0041] Figure 5 is a schematic diagram of light intensity distribution of a through hole A provided in an embodiment;

[0042] Figure 6 is a schematic diagram of light intensity distribution of a through hole B provided in an embodiment;

[0043] Figure 7 is a schematic diagram of a sub-resolution auxiliary graphic obtained in an embodiment;

[0044] Figure 8 Schematic diagram of light intensity distribution of a sub-resolution auxiliary pattern obtained in one embodiment. DETAILED DESCRIPTION

[0045] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0047] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0048] Spatially relative terms such as "under," "below," "below," "under," "above," "above," etc., may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, the spatially relative terms are intended to include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "on" the other elements or features. Therefore, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0049] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0050] Embodiments of the application are described herein with reference to cross-sectional views that are schematic diagrams of ideal embodiments (and intermediate structures) of the application. Thus, variations from the shapes shown due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, embodiments of the application should not be limited to the specific shapes of the zones shown herein, but rather include shape deviations due to, for example, manufacturing, and the zones shown in the figures are schematic in nature, and their shapes are not intended to display the actual shapes of the zones of the device and are not intended to limit the scope of the application.

[0051] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present application in a schematic manner. Although the illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation, the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout type may also be more complicated.

[0052] Sub-resolution auxiliary patterns enhance the light intensity distribution of isolated and semi-isolated vias through diffraction and interference, thereby improving the lithography process window of isolated and semi-isolated vias. Figure 1 Taking the through-hole layer target pattern shown in FIG. 1 as an example, the sub-resolution auxiliary pattern adding method in the prior art adds the sub-resolution auxiliary pattern through a series of rules based on line width and pattern spacing. The obtained sub-resolution auxiliary pattern is as shown in FIG. Figure 2 As shown, the light intensity distribution is Figure 3 Obviously, the sub-resolution auxiliary pattern adding method in the prior art is difficult to cover all pattern structures or environments in the face of adding conflicts, thus resulting in poor optical contrast and low optical resolution of some through-hole patterns, which in turn affects the size of the photolithography process window.

[0053] In view of the above problems, the present invention provides a method for adding sub-resolution auxiliary graphics, such as Figure 1 As shown, the following steps are included:

[0054] Step S101: obtaining a target pattern, the target pattern at least comprising a plurality of through-hole patterns;

[0055] Step S102: performing optical simulation on the target pattern to obtain the maximum light intensity of each through-hole pattern;

[0056] Step S103: obtaining a sub-resolution auxiliary pattern adding sequence of a plurality of through-hole patterns based on the maximum light intensity of the plurality of through-hole patterns;

[0057] Step S104: adding sub-resolution auxiliary patterns to the plurality of through hole patterns in descending order based on the sub-resolution auxiliary pattern adding sequence of the plurality of through hole patterns.

[0058] First, execute step S401, refer to Figure 1 As shown, a target pattern is obtained, and the target pattern includes a plurality of through-hole patterns.

[0059] In one embodiment, Figure 1 The target pattern shown includes a plurality of through-hole patterns, specifically, the plurality of through-hole patterns include through-hole A, through-hole B, through-hole C, through-hole D, through-hole E, and through-hole F. Further, the plurality of through-hole patterns include through-hole patterns with different maximum light intensities, for example, through-hole A has a different maximum light intensity from through-hole B. In addition, the plurality of through-hole patterns also include through-hole patterns with addition conflicts, that is, different through-hole patterns need to add different sub-resolution auxiliary patterns at the same sub-resolution auxiliary pattern position. For example, through-hole A has an addition conflict with through-hole B, and through-hole A has an addition conflict with through-hole C. Optionally, the plurality of through-hole patterns also include through-hole patterns with no addition conflicts, for example, through-hole E has no addition conflict, and through-hole F has no addition conflict.

[0060] Then execute step S402, refer to Figure 5 and Figure 6 As shown, an optical simulation is performed on the target pattern to obtain the maximum light intensity of each through-hole pattern.

[0061] In one embodiment, optical simulation of the target pattern can obtain the light intensity distribution of each through-hole pattern in the target pattern, and the maximum light intensity of each through-hole pattern can be obtained according to the light intensity distribution of each through-hole pattern. Figure 5 and Figure 6 For example, Figure 5 The light intensity distribution of through hole A is shown, and the maximum light intensity Q of through hole A can be obtained. A , Figure 6 The light intensity distribution of through hole B is shown, and the maximum light intensity Q of through hole B can be obtained. B It can be further known that the maximum light intensity of through hole A is greater than the maximum light intensity of through hole B. In addition, although the light intensity distributions of through hole C, through hole D, through hole E, and through hole F are not shown one by one, the maximum light intensity of through hole C, through hole D, through hole E, through hole F, and even other through holes in the target pattern can also be obtained in this step.

[0062] Then, step S403 is performed to obtain a sub-resolution auxiliary pattern adding sequence of the plurality of through hole patterns based on the maximum light intensity of the plurality of through hole patterns.

[0063] Exemplarily, the maximum light intensity of the through-hole pattern is inversely proportional to the order of adding sub-resolution auxiliary patterns of the through-hole pattern: when the maximum light intensity of the through-hole pattern is stronger, the ranking of adding sub-resolution auxiliary patterns of the through-hole pattern is lower; when the maximum light intensity of the through-hole pattern is weaker, the ranking of adding sub-resolution auxiliary patterns of the through-hole pattern is higher.

[0064] Further, obtaining a sub-resolution auxiliary graphic adding sequence of multiple through-hole graphics based on the maximum light intensity of the multiple through-hole graphics includes: sorting the maximum light intensity of the multiple through-hole graphics from high to low to obtain the light intensity sorting of the multiple through-hole graphics; obtaining a sub-resolution auxiliary graphic adding sequence of the multiple through-hole graphics based on the light intensity sorting of the multiple through-hole graphics, and the sub-resolution auxiliary graphic adding sequence of the multiple through-hole graphics is opposite to the light intensity sorting of the multiple through-hole graphics.

[0065] When the number of through-hole patterns in the target pattern is small, sub-resolution auxiliary patterns can be added to each through-hole pattern in turn, and there is no need to merge the through-hole patterns in the target pattern by grading or grouping. In one embodiment, taking through-holes A, B, and C in the target pattern as an example, when the maximum light intensity Q of through-hole C is C > Maximum light intensity Q at hole A A > Maximum light intensity Q at hole B B When , the sub-resolution auxiliary graphics adding sequence of through hole A, through hole B, and through hole C is: through hole B→through hole A→through hole C.

[0066] When there are a large number of through-hole graphics in the target graphics, and it is impossible to add sub-resolution auxiliary graphics to each through-hole graphic in turn, the through-hole graphics in the target graphics can be grouped or graded to merge and process. Exemplarily, obtaining a sub-resolution auxiliary graphics adding sequence of multiple through-hole graphics based on the maximum light intensity of multiple through-hole graphics includes: grading multiple through-hole graphics based on the maximum light intensity of multiple through-hole graphics: when the through-hole grades of multiple through-hole graphics are the same, the sub-resolution auxiliary graphics adding sequences of multiple through-hole graphics are the same; when the through-hole grades of multiple through-hole graphics are different, the sub-resolution auxiliary graphics adding sequences of multiple through-hole graphics are different. Among them, grading multiple through-hole graphics based on the maximum light intensity of multiple through-hole graphics includes comparing the maximum light intensity of multiple through-hole graphics with the preset light intensity range of the through-hole grade to determine the through-hole grade of each through-hole graphic respectively. Further, the maximum light intensity of the through-hole graphics is inversely proportional to the through-hole grade of the through-hole graphics: when the maximum light intensity of the through-hole graphics is stronger, the through-hole grade of the through-hole graphics is lower; when the maximum light intensity of the through-hole graphics is weaker, the through-hole grade of the through-hole graphics is higher.

[0067] In one embodiment, taking through hole A, through hole B, through hole C, through hole D, through hole E and through hole F in the target pattern as an example, the maximum light intensity Q of through hole C is C >The maximum light intensity of through hole A>The maximum light intensity of through hole E>The maximum light intensity of through hole F>The maximum light intensity of through hole B>The maximum light intensity of through hole D, among which, the maximum light intensities of through hole A, through hole C, through hole E and through hole F are close, and the maximum light intensities of through hole B and through hole D are close. Therefore, it is necessary to classify the through hole patterns with close maximum light intensities into the same through hole grade for processing.

[0068] In one embodiment, grading multiple via patterns based on the maximum light intensity of the multiple via patterns includes comparing the maximum light intensity of the multiple via patterns with a preset light intensity range of via levels to respectively determine the via level of each via pattern. Referring to Table 1, the maximum light intensity of the multiple via patterns is compared with the preset light intensity range of the via levels to respectively determine the via level of each via pattern. The light intensity threshold is set as Ith. The preset light intensity range of via level P1 is < 70%Ith, the preset light intensity range of via level P2 is ≥ 70%Ith and < 80%Ith, the preset light intensity range of via level P3 is ≥ 80%Ith and < 90%Ith, the preset light intensity range of via level P4 is ≥ 90%Ith and < Ith, and the preset light intensity range of via level P5 is ≥ Ith.

[0069] Table 1 Preset Light Intensity Range of Via Levels

[0070]

[0071] In one embodiment, when the maximum light intensity of a via pattern is stronger, its via level is lower, and the sorting of adding sub-resolution assist patterns is also lower; when the maximum light intensity of a via pattern is weaker, its via level is higher, and the sorting of adding sub-resolution assist patterns is higher. Therefore, for via levels P1 to P5, the sequence of adding sub-resolution assist patterns is: via level P1 → via level P2 → via level P3 → via level P4 → via level P5.

[0072] In one embodiment, taking via A, via B, via C, via D, via E, and via F in a target pattern as an example, the via levels of via A, via C, via E, and via F are all P4, for example, and the via levels of via B and via D are both P2, for example. Then, the via levels of via A, via C, via E, and via F are the same, and the via levels of via B and via D are the same, that is, the via level of via D = the via level of via B > the via level of via F = the via level of via E = the via level of via A = the via level of via C. Correspondingly, the sequence of adding sub-resolution assist patterns is: via level P2 (via B, via D) → via level P4 (via A, via C, via E, via F).

[0073] Next, step S404 is executed to respectively add sub-resolution assist patterns to the multiple via patterns in descending order based on the sequence of adding sub-resolution assist patterns of the multiple via patterns.

[0074] Exemplarily, based on determining whether each through-hole pattern has an addition conflict with other through-hole patterns, adding different types of sub-resolution auxiliary patterns to the through-hole pattern includes: when there is no addition conflict with the through-hole pattern, adding a first type of sub-resolution auxiliary pattern to the through-hole pattern; when there is an addition conflict between two through-hole patterns and the maximum light intensity difference between the two is greater than a preset range, adding a first type of sub-resolution auxiliary pattern; when there is an addition conflict between two through-hole patterns and the maximum light intensity difference between the two is less than a preset range, adding a second type of sub-resolution auxiliary pattern. The first type of sub-resolution auxiliary pattern includes a linear auxiliary pattern, and the second type of sub-resolution auxiliary pattern includes a square auxiliary pattern.

[0075] In one embodiment, the through-hole pattern includes a first through-hole pattern and a second through-hole pattern, the maximum light intensity of the first through-hole pattern is greater than the maximum light intensity of the second through-hole pattern, and if there is no adding conflict between the first through-hole pattern and the second through-hole pattern, a linear sub-resolution auxiliary pattern is added to the first through-hole pattern, and a first type of sub-resolution auxiliary pattern, such as a linear auxiliary pattern, is added to the second through-hole pattern. When the first through-hole pattern and the second through-hole pattern are not graded and there is an adding conflict between the first through-hole pattern and the second through-hole pattern, the difference between the maximum light intensity of the first through-hole pattern and the maximum light intensity of the second through-hole pattern is obtained, and when the difference between the two is greater than a preset range (for example, 10%Ith), the first type of sub-resolution auxiliary pattern, such as a linear auxiliary pattern, of the second through-hole pattern is added at the conflicting position; when the difference between the two is less than the preset range (for example, 10%Ith), the second type of sub-resolution auxiliary pattern, such as a square auxiliary pattern, is added at the conflicting position.

[0076] In one embodiment, taking through hole A and through hole B as an example, there is an adding conflict between through hole A and through hole B, the maximum light intensity of through hole A is greater than the maximum light intensity of through hole B, and the difference between the maximum light intensity of through hole A and the maximum light intensity of through hole B is greater than a preset range (for example, 10%Ith), so a linear auxiliary pattern b1 of through hole B is added at the conflicting position, such as Figure 7 shown.

[0077] In one embodiment, taking through hole A and through hole C as an example, there is an addition conflict between through hole A and through hole C, the maximum light intensity of through hole C is greater than the maximum light intensity of through hole A, and the difference between the maximum light intensity of through hole C and the maximum light intensity of through hole A is less than a preset range (for example, 10%Ith), so a square auxiliary pattern ac is added at the conflicting position, such as Figure 7 shown.

[0078] Exemplarily, based on determining whether each through-hole graphic has an adding conflict with other through-hole graphics, adding different types of sub-resolution auxiliary graphics to the through-hole graphics includes: when there is no adding conflict with the through-hole graphic, adding a first type of sub-resolution auxiliary graphics to the through-hole graphic; when there is an adding conflict between two through-hole graphics of different through-hole levels, adding a first type of sub-resolution auxiliary graphics; when there is an adding conflict between two through-hole graphics of the same through-hole level, adding a second type of sub-resolution auxiliary graphics.

[0079] In one embodiment, the through-hole pattern includes a first through-hole pattern and a second through-hole pattern. If there is no adding conflict between the first through-hole pattern and the second through-hole pattern, a linear sub-resolution auxiliary pattern is added to the first through-hole pattern, and a first type of sub-resolution auxiliary pattern, such as a linear auxiliary pattern, is added to the second through-hole pattern. When the through-hole level of the first through-hole pattern is lower than the through-hole level of the second through-hole pattern and there is an adding conflict between the first through-hole pattern and the second through-hole pattern, a first type of sub-resolution auxiliary pattern, such as a linear auxiliary pattern, is added to the conflicting position of the second through-hole pattern; when the through-hole level of the first through-hole pattern is equal to the through-hole level of the second through-hole pattern and there is an adding conflict between the first through-hole pattern and the second through-hole pattern, a second type of sub-resolution auxiliary pattern, such as a square auxiliary pattern, is added to the conflicting position.

[0080] In one embodiment, taking through hole A and through hole B as an example, there is an adding conflict between through hole A and through hole B, and the through hole level of through hole A is lower than the through hole level of through hole B, so a linear auxiliary pattern b1 of through hole B is added at the conflicting position, such as Figure 7 shown.

[0081] In one embodiment, taking through hole A and through hole C as an example, there is an adding conflict between through hole A and through hole C, and the through hole level of through hole A is equal to the through hole level of through hole C, so a square auxiliary pattern ac is added at the conflicting position, such as Figure 7 shown.

[0082] In one embodiment, taking through hole A, through hole B, through hole C, through hole D, through hole E and through hole F in the target pattern as an example, the through hole grades of through hole A, through hole C, through hole E and through hole F are all P4, and the through hole grades of through hole B and through hole D are all P2, firstly, sub-resolution auxiliary patterns are added to through hole B and through hole D according to the through hole grades, specifically, linear auxiliary patterns b1, b2, b3 and b4 are added to through hole B, and linear auxiliary pattern d is added to through hole D. Next, sub-resolution auxiliary patterns are added to through hole A, through hole C, through hole E and through hole F. Specifically, through hole E and through hole F do not have addition conflicts with surrounding patterns, so linear auxiliary pattern e is added to through hole E, linear auxiliary pattern f is added to through hole F, and there is no addition conflict on the right side of through hole C, so linear auxiliary pattern c1 is added to through hole C. There is an addition conflict between through hole A and through hole C, and a square auxiliary pattern ac is added at the conflicting position. In addition, it should be noted that although there is an addition conflict between through hole A and through hole B, since through hole A and through hole B have different through hole levels, before determining whether the through hole pattern has an addition conflict with other through hole patterns, a sub-resolution auxiliary pattern has been added to through hole B according to the through hole level. Figure 1 The process of adding sub-resolution auxiliary graphics to the target graphics shown in FIG. 1 , according to the method of the present application, the obtained sub-resolution auxiliary graphics are as follows: Figure 7 As shown, the light intensity distribution is Figure 8 Obviously, Figure 3 Compared with the light intensity distribution of the auxiliary pattern obtained according to the prior art, the method of adding sub-resolution auxiliary patterns provided in the present application reduces the optical impact on the through-hole pattern and improves the optical resolution.

[0083] According to the method for adding sub-resolution auxiliary graphics provided by the present invention, by obtaining the maximum light intensity of multiple through-hole graphics, a sub-resolution auxiliary graphics adding sequence of the multiple through-hole graphics is obtained according to the maximum light intensity, thereby avoiding the optical influence of adding sub-resolution auxiliary graphics on the through-hole graphics and improving the optical resolution.

[0084] Please note that the above embodiments are for illustrative purposes only and are not intended to limit the present application.

[0085] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0086] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. A method for adding sub-resolution auxiliary graphics, characterized in that: The steps include: Acquire a target pattern, wherein the target pattern includes a plurality of through-hole patterns; Performing optical simulation on the target pattern to obtain the maximum light intensity of each through-hole pattern; Obtaining a sub-resolution auxiliary pattern adding sequence of the plurality of through hole patterns based on the maximum light intensity of the plurality of through hole patterns; Sub-resolution auxiliary patterns are added to the plurality of through hole patterns in sequence based on the sub-resolution auxiliary pattern adding sequence of the plurality of through hole patterns.

2. The method for adding sub-resolution auxiliary graphics according to claim 1, characterized in that: Also includes: Based on determining whether each of the through-hole patterns has an adding conflict with other through-hole patterns, different types of sub-resolution auxiliary patterns are added to the through-hole patterns.

3. The method for adding sub-resolution auxiliary graphics according to claim 2, characterized in that: The maximum light intensity of the through-hole pattern is inversely proportional to the sub-resolution auxiliary pattern addition sequence of the through-hole pattern: When the maximum light intensity of the through hole pattern is stronger, the ranking of the added sub-resolution auxiliary pattern of the through hole pattern is lower; When the maximum light intensity of the through hole pattern is weaker, the ranking of the added sub-resolution auxiliary pattern of the through hole pattern is higher.

4. The method for adding sub-resolution auxiliary graphics according to claim 3, characterized in that: The sub-resolution auxiliary pattern adding sequence of obtaining a plurality of the through hole patterns based on the maximum light intensity of the plurality of the through hole patterns comprises: sorting the maximum light intensities of the plurality of through hole patterns from high to low to obtain a light intensity sorting of the plurality of through hole patterns; A sub-resolution auxiliary pattern adding sequence of the plurality of via patterns is obtained based on the light intensity ranking of the plurality of via patterns, and the sub-resolution auxiliary pattern adding sequence of the plurality of via patterns is opposite to the light intensity ranking of the plurality of via patterns.

5. The method for adding sub-resolution auxiliary graphics according to claim 4, characterized in that: Adding different types of sub-resolution auxiliary graphics to the through-hole graphics based on determining whether each through-hole graphic has an addition conflict with other through-hole graphics includes: When there is no adding conflict between the through hole pattern and other through hole patterns, adding a first type of sub-resolution auxiliary pattern to the through hole pattern; When there is an addition conflict between two through-hole patterns and the maximum light intensity difference between the two is greater than a preset range, adding a first type of sub-resolution auxiliary pattern; When there is an adding conflict between two through-hole patterns and the maximum light intensity difference between the two is smaller than a preset range, a second type of sub-resolution auxiliary pattern is added.

6. The method for adding sub-resolution auxiliary graphics according to claim 3, characterized in that: The sub-resolution auxiliary pattern adding sequence of obtaining a plurality of the through hole patterns based on the maximum light intensity of the plurality of the through hole patterns comprises: The plurality of through hole patterns are graded based on the maximum light intensity of the plurality of through hole patterns: When the through-hole levels of the plurality of through-hole patterns are the same, the sub-resolution auxiliary pattern adding sequences of the plurality of through-hole patterns are the same; When the via levels of the plurality of via patterns are different, the sub-resolution auxiliary patterns of the plurality of via patterns are added in different sequences.

7. The method for adding sub-resolution auxiliary graphics according to claim 6, characterized in that: Grading the plurality of via patterns based on the maximum light intensity of the plurality of via patterns includes comparing the maximum light intensity of the plurality of via patterns with a preset light intensity range of via grades to respectively determine a via grade of each via pattern.

8. The method for adding sub-resolution auxiliary graphics according to claim 7, characterized in that: The maximum light intensity of the through-hole pattern is inversely proportional to the through-hole grade of the through-hole pattern: When the maximum light intensity of the through-hole pattern is stronger, the through-hole grade of the through-hole pattern is lower; When the maximum light intensity of the through-hole pattern is weaker, the through-hole grade of the through-hole pattern is higher.

9. The method for adding sub-resolution auxiliary graphics according to claim 8, characterized in that: Adding different types of sub-resolution auxiliary graphics to the through-hole graphics based on determining whether each through-hole graphic has an addition conflict with other through-hole graphics includes: When there is no adding conflict between the through hole pattern and other through hole patterns, adding a first type of sub-resolution auxiliary pattern to the through hole pattern; When there is an adding conflict between two through-hole patterns of different through-hole levels, adding a first type of sub-resolution auxiliary pattern; When there is an addition conflict between two through-hole patterns of the same through-hole level, a second type of sub-resolution auxiliary pattern is added.

10. The method for adding sub-resolution auxiliary graphics according to claim 5 or 9, characterized in that: The first type of sub-resolution auxiliary patterns includes linear auxiliary patterns, and the second type of sub-resolution auxiliary patterns includes square auxiliary patterns.

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