Temperature control aging method for PCB (Printed Circuit Board) connected silicon-based OLED (Organic Light Emitting Diode) product

Abstract

The invention relates to the technical field of display temperature control, and discloses a temperature control aging method for connecting a PCB (Printed Circuit Board) with a silicon-based OLED (Organic Light Emitting Diode) product, which comprises the following steps of: 1, assembling an upper computer, a single chip microcomputer, a power supply, a relay group, a temperature control platform, a thermocouple and a gauge outfit on a substrate, and enabling the temperature control platform to enter a constant-temperature control mode under the control of the upper computer; 2, placing the silicon-based OLED product on a temperature control platform; step 3, the temperature control platform starts a vacuumizing device by using a photoelectric signal to adsorb the silicon-based OLED product on the temperature control platform; 4, the silicon-based OLED product is in close contact with the temperature control platform, and a semiconductor chilling plate in the temperature control platform is started to cool the silicon-based OLED product; and 5, when the temperature of the silicon-based OLED product reaches the preset temperature, the temperature control platform keeps the preset temperature, so that the temperature of the silicon-based OLED product is constant. Through the arrangement of the temperature control platform, the heat dissipation effect is improved, the temperature of the silicon-based OLED product is effectively reduced, the stability of the silicon-based OLED product is improved, and the service life of the silicon-based OLED product is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of display temperature control, and in particular to a method for temperature control and aging of a PCB-connected silicon-based OLED product. Background Art

[0002] Silicon-based OLED (Micro OLED) is a display technology that replaces the glass substrate of traditional OLED with a single-crystal silicon substrate. This technology is widely used in AR / VR head-mounted display devices, electronic viewfinders, civilian infrared / night vision equipment and other fields due to its advantages such as high resolution, high integration, low power consumption, small size and light weight. Unlike traditional LCD, silicon-based OLED is a self-luminous display technology that does not require a backlight source, but it will generate a certain amount of heat during the light-emitting process. Silicon-based OLED integrates the different functional modules contained in the driver chip into the single-crystal silicon chip through the CMOS process, reducing external connection lines and achieving refined display, but this also means that more electronic components are concentrated in a small space, resulting in concentrated heat.

[0003] However, the prior art has the following problems:

[0004] Existing silicon-based OLED products will show a series of performance changes when the temperature rises. On the one hand, as the temperature rises, the organic materials in the OLED will undergo physical and chemical changes, which will lead to instability in brightness and color. On the other hand, high temperature will accelerate the aging process of organic materials, thereby shortening the service life of the display. Existing silicon-based OLED products usually use environmental temperature control, which has poor heat dissipation effect, and the temperature of silicon-based OLEDs fluctuates greatly, and it is impossible to ensure the constant temperature of the product. Summary of the invention

[0005] The purpose of the present invention is to provide a PCB-connected silicon-based OLED product temperature control aging method in order to solve the above problems and overcome the defects of the prior art, as described below.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention provides a temperature-controlled aging method for a PCB-connected silicon-based OLED product, comprising the following steps:

[0008] Step 1: Assemble the host computer, single-chip microcomputer, power supply, relay group, temperature control platform, thermocouple, and meter on the substrate, and control the temperature control platform to enter the constant temperature control mode through the control of the host computer;

[0009] Step 2: Place the silicon-based OLED product on a temperature-controlled platform;

[0010] Step 3: The temperature control platform uses the photoelectric signal to start the vacuum device to adsorb the silicon-based OLED product on the temperature control platform;

[0011] Step 4: The silicon-based OLED product is in close contact with the temperature control platform, and the semiconductor cooling sheet in the temperature control platform is activated to cool the silicon-based OLED product;

[0012] Step 5: When the temperature of the silicon-based OLED product reaches the preset temperature, the temperature control platform maintains the preset temperature to keep the temperature of the silicon-based OLED product constant.

[0013] Preferably, the constant temperature control mode comprises the following steps:

[0014] Step A1: The host computer sends the set temperature digital to the single-chip microcomputer, and the host computer sets the voltage and current of the power supply;

[0015] Step A2: The single chip microcomputer controls the relay group to close, and the relay group controls the power output;

[0016] Step A3: The power supply supplies power to the temperature control platform through the relay group through the voltage and current set by the host computer;

[0017] Step A4: The relay group switches the current direction transmitted to the temperature control platform through the control of the single chip microcomputer, so as to increase or decrease the temperature of the temperature control platform;

[0018] Step A5: The thermocouple converts the temperature signal of the silicon-based OLED product into an electrical signal and inputs it into a meter;

[0019] Step A6: The meter converts the electrical signal into a temperature digital signal and transmits it to the single chip microcomputer;

[0020] Step A7: After receiving the temperature digital signal from the meter, the single-chip microcomputer compares it with the set temperature digital of the host computer, and repeats the above steps A2 to A6 to keep the temperature digital of the meter equal to the set temperature digital of the host computer.

[0021] Preferably, the temperature control platform includes a heat dissipation base, a semiconductor refrigeration plate is installed on the heat dissipation base, the semiconductor refrigeration plate is connected to the relay group through a wire, the semiconductor refrigeration plate is connected to thermal grease, the thermal grease is connected to a vacuum fixture, and the top surface of the vacuum fixture is in contact with the bottom surface of the silicon-based OLED product.

[0022] Preferably, a fiber optic photoelectric sensor and a vacuum pump are installed in the vacuum fixture, the fiber optic photoelectric sensor is connected to the vacuum pump via a wire, and the vacuum pump is in contact with the bottom surface of the silicon-based OLED product.

[0023] Preferably, the step three comprises the following steps:

[0024] Step B1: The optical fiber photoelectric sensor senses the silicon-based OLED product;

[0025] Step B2: The light display photoelectric sensor controls the vacuum pump to start via the wire;

[0026] Step B2: After the vacuum pump is started, the air between the silicon-based OLED product and the vacuum fixture is evacuated, so that the silicon-based OLED product is tightly adsorbed on the vacuum fixture.

[0027] Preferably, a temperature sensor is provided on the thermocouple, and the temperature sensor of the thermocouple is connected to a vacuum jig. When the silicon-based OLED product is tightly adsorbed on the vacuum jig, the temperature sensor of the thermocouple is in contact with the silicon-based OLED product.

[0028] Preferably, the relay group includes a temperature rising relay and a temperature falling relay, the temperature rising relay and the temperature falling relay are respectively connected to the power supply and the single-chip computer through wires, the temperature rising relay and the temperature falling relay are respectively connected to the semiconductor refrigeration plate through wires, and the current direction between the temperature rising relay and the semiconductor refrigeration plate is opposite to the current direction between the temperature falling relay and the semiconductor refrigeration plate.

[0029] Preferably, the temperature increase relay and the temperature decrease relay are arranged to be interlocked, and the temperature increase relay and the temperature decrease relay cannot be turned on at the same time.

[0030] Preferably, the step A4 comprises the following steps:

[0031] Step C1: The single-chip computer compares the temperature digital signal transmitted by the meter. When the temperature digital signal is greater than the set temperature digital of the host computer, the temperature reduction relay is energized and the temperature increase relay is de-energized; when the temperature digital signal is less than the set temperature digital of the host computer, the temperature reduction relay is de-energized and the temperature increase relay is energized;

[0032] Step C2: When the temperature-lowering relay is powered on and the temperature-raising relay is powered off, the temperature-raising relay transmits a forward current to the semiconductor refrigeration chip through a wire to heat up the semiconductor refrigeration chip; when the temperature-raising relay is powered on and the temperature-lowering relay is powered off, the temperature-lowering relay transmits a reverse current to the semiconductor refrigeration chip through a wire to cool down the semiconductor refrigeration chip;

[0033] Step C3: The semiconductor cooling chip transfers the temperature to the connected silicon-based OLED product through thermal grease and vacuum fixture, keeping the temperature of the silicon-based OLED product constant at the set number.

[0034] The beneficial effects are:

[0035] 1. The PCB is connected to the temperature control aging method of silicon-based OLED products. Through the setting of the temperature control platform, the vacuum fixture can tightly adsorb the silicon-based OLED products on its surface. The temperature of the silicon-based OLED products is heat exchanged through the cooperation of semiconductor cooling sheets, thermal grease and vacuum fixtures to achieve the cooling effect. The heat dissipation effect is improved through the close-fitting temperature control method, which effectively reduces the temperature of the silicon-based OLED products and improves their stability and service life.

[0036] 2. The PCB is connected to the temperature control aging method of silicon-based OLED products. Through the cooperation between the single-chip microcomputer, relay group, thermocouple and meter, the semiconductor refrigeration plate is controlled to heat up or cool down according to the actual temperature of the silicon-based OLED product, so that the temperature of the silicon-based OLED product can be maintained at the set temperature, keeping the temperature of the silicon-based OLED product constant. While avoiding overheating of the silicon-based OLED product, it can also avoid affecting the performance of the silicon-based OLED product due to too low temperature.

[0037] 3. The PCB-connected silicon-based OLED product temperature control aging method has the advantages of simple structure, low cost, easy implementation, etc., and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 is a schematic diagram of a temperature control platform of the present invention;

[0040] Figure 2 It is a schematic diagram of a semiconductor refrigeration sheet of the present invention;

[0041] Figure 3 is a schematic diagram of a vacuum fixture of the present invention;

[0042] Figure 4 It is a schematic diagram of the constant temperature control mode of the present invention;

[0043] Figure 5 It is a schematic diagram of the thermocouple assembly of the present invention. DETAILED DESCRIPTION

[0044] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0045] Example 1

[0046] See also Figure 1 - Figure 5 , a temperature control aging method for a PCB-connected silicon-based OLED product, comprising the following steps:

[0047] Step 1: Assemble the host computer, single-chip microcomputer, power supply, relay group, temperature control platform, thermocouple, and meter on the substrate, and control the temperature control platform to enter the constant temperature control mode through the control of the host computer;

[0048] Step 2: Place the silicon-based OLED product on a temperature-controlled platform;

[0049] Step 3: The temperature control platform uses the photoelectric signal to start the vacuum device to adsorb the silicon-based OLED product on the temperature control platform;

[0050] Step 4: The silicon-based OLED product is in close contact with the temperature control platform, and the semiconductor cooling sheet in the temperature control platform is activated to cool the silicon-based OLED product;

[0051] Step 5: When the temperature of the silicon-based OLED product reaches the preset temperature, the temperature control platform maintains the preset temperature to keep the temperature of the silicon-based OLED product constant.

[0052] Furthermore, the constant temperature control mode in step 1 includes the following steps:

[0053] Step A1: The host computer is connected to the single-chip computer through a wire, and the host computer sends the set temperature digital to the single-chip computer. The host computer is also connected to the power supply through a wire, and the host computer sets the voltage and current of the power supply, thereby controlling the maximum output voltage and current of the power supply and maintaining the stability of the current and voltage output;

[0054] Step A2: The single chip microcomputer controls the closure of the relay group, the relay group controls the power output, the relay group transmits the current to the temperature control platform and controls the forward and reverse direction of the current;

[0055] Step A3: The power supply supplies power to the temperature control platform through the voltage and current set by the host computer through the relay group; the temperature control platform includes a heat dissipation base, a semiconductor refrigeration plate is installed on the heat dissipation base, the semiconductor refrigeration plate is connected to the relay group through a wire, the semiconductor refrigeration plate is connected to thermal conductive silicone grease, the thermal conductive silicone grease is connected to a vacuum fixture, the top surface of the vacuum fixture is in contact with the bottom surface of the silicon-based OLED product; an optical fiber photoelectric sensor and a vacuum pump are installed in the vacuum fixture, the optical fiber photoelectric sensor is connected to the vacuum pump through a wire, and the vacuum pump is in contact with the bottom surface of the silicon-based OLED product;

[0056] Step A4: the relay group switches the current direction transmitted to the temperature control platform through the control of the single-chip microcomputer to realize the temperature control platform heating or cooling; the relay group includes a heating relay and a cooling relay, the heating relay and the cooling relay are respectively connected to the power supply and the single-chip microcomputer through wires, the heating relay and the cooling relay are respectively connected to the semiconductor refrigeration plate through wires, the current direction between the heating relay and the semiconductor refrigeration plate is opposite to the current direction between the cooling relay and the semiconductor refrigeration plate, when the current in the semiconductor refrigeration plate is positive, the top surface of the semiconductor refrigeration plate becomes the hot end and starts heating, when the current in the semiconductor refrigeration plate is reverse, the top surface of the semiconductor refrigeration plate becomes the cold end and starts cooling; the heating relay and the cooling relay are set to be interlocked, the heating relay and the cooling relay cannot be turned on at the same time, when the heating relay is turned on and energized, the cooling relay is turned off and powered off, when the cooling relay is turned on and energized, the heating relay is turned off and powered off;

[0057] Step A5: The thermocouple converts the temperature signal of the silicon-based OLED product into an electrical signal and inputs it into a meter;

[0058] Step A6: The meter converts the electrical signal into a temperature digital signal and transmits it to the single chip microcomputer;

[0059] Step A7: After receiving the temperature digital signal from the meter, the single-chip microcomputer compares it with the set temperature digital of the host computer, and repeats the above steps A2 to A6 to keep the temperature digital of the meter equal to the set temperature digital of the host computer.

[0060] Furthermore, the step three includes the following steps:

[0061] Step B1: The optical fiber photoelectric sensor senses the silicon-based OLED product;

[0062] Step B2: The light display photoelectric sensor controls the vacuum pump to start via the wire;

[0063] Step B3: After the vacuum device is started, the air between the silicon-based OLED product and the vacuum fixture is evacuated to allow the silicon-based OLED product to be tightly adsorbed on the vacuum fixture; the vacuum fixture can tightly adsorb the silicon-based OLED product on its surface, and the temperature of the silicon-based OLED product is heat exchanged through the cooperation of semiconductor cooling sheets, thermal grease and vacuum fixture to achieve a cooling effect. The heat dissipation effect is improved through the close-fitting temperature control method, which effectively reduces the temperature of the silicon-based OLED product and improves its stability and service life.

[0064] Furthermore, the step A4 comprises the following steps:

[0065] Step C1: The thermocouple is provided with a temperature sensor, and the temperature sensor of the thermocouple is connected to the vacuum fixture. When the silicon-based OLED product is tightly adsorbed on the vacuum fixture, the temperature sensor of the thermocouple is in contact with the silicon-based OLED product. The thermocouple can collect the real-time temperature of the silicon-based OLED product through the temperature sensor, and convert the real-time temperature into an electrical signal and input it into a meter. The meter converts the electrical signal into a temperature digital signal and transmits it to the single-chip microcomputer. The single-chip microcomputer compares the temperature digital signal transmitted by the meter. When the temperature digital signal is greater than the set temperature number of the host computer, the temperature reduction relay is energized and the temperature increase relay is de-energized; when the temperature digital signal is less than the set temperature number of the host computer, the temperature reduction relay is de-energized and the temperature increase relay is energized;

[0066] Step C2: when the temperature-lowering relay is powered on and the temperature-raising relay is powered off, the temperature-raising relay transmits a forward current to the semiconductor refrigeration chip through a wire, so that the semiconductor refrigeration chip is heated up; when the temperature-raising relay is powered on and the temperature-lowering relay is powered off, the temperature-lowering relay transmits a reverse current to the semiconductor refrigeration chip through a wire, so that the semiconductor refrigeration chip is cooled down;

[0067] Step C3: The semiconductor refrigeration sheet transfers the temperature to the connected silicon-based OLED product through the thermal grease and the vacuum fixture, so that the semiconductor refrigeration sheet can achieve heat exchange with the connected silicon-based OLED product through the cooperation with the thermal grease and the vacuum fixture, thereby controlling the temperature of the connected silicon-based OLED product, keeping the temperature of the silicon-based OLED product constant at the set number, and achieving the effect of controlling the semiconductor refrigeration sheet to increase or decrease the temperature according to the actual temperature of the silicon-based OLED product, so that the temperature of the silicon-based OLED product can be maintained at the set temperature, while avoiding overheating of the silicon-based OLED product, it can also avoid affecting the performance of the silicon-based OLED product due to too low temperature.

[0068] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A temperature-controlled aging method for PCB-connected silicon-based OLED products, characterized in that: The following steps are involved: Step 1: Assemble the host computer, single-chip microcomputer, power supply, relay group, temperature control platform, thermocouple, and meter on the substrate, and control the temperature control platform to enter the constant temperature control mode through the control of the host computer; Step 2: Place the silicon-based OLED product on a temperature-controlled platform; Step 3: The temperature control platform uses the photoelectric signal to start the vacuum device to adsorb the silicon-based OLED product on the temperature control platform; Step 4: The silicon-based OLED product is in close contact with the temperature control platform, and the semiconductor cooling sheet in the temperature control platform is activated to cool the silicon-based OLED product; Step 5: When the temperature of the silicon-based OLED product reaches the preset temperature, the temperature control platform maintains the preset temperature to keep the temperature of the silicon-based OLED product constant.

2. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 1, characterized in that: The constant temperature control mode comprises the following steps: Step A1: The host computer sends the set temperature digital to the single-chip microcomputer, and the host computer sets the voltage and current of the power supply; Step A2: The single chip microcomputer controls the relay group to close, and the relay group controls the power output; Step A3: The power supply supplies power to the temperature control platform through the relay group through the voltage and current set by the host computer; Step A4: The relay group switches the current direction transmitted to the temperature control platform through the control of the single chip microcomputer, so as to increase or decrease the temperature of the temperature control platform; Step A5: The thermocouple converts the temperature signal of the silicon-based OLED product into an electrical signal and inputs it into a meter; Step A6: The meter converts the electrical signal into a temperature digital signal and transmits it to the single chip microcomputer; Step A7: After receiving the temperature digital signal from the meter, the single-chip microcomputer compares it with the set temperature digital of the host computer, and repeats the above steps A2 to A6 to keep the temperature digital of the meter equal to the set temperature digital of the host computer.

3. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 2, characterized in that: The temperature control platform includes a heat dissipation base, a semiconductor refrigeration plate is installed on the heat dissipation base, the semiconductor refrigeration plate is connected to the relay group through a wire, the semiconductor refrigeration plate is connected to thermal grease, the thermal grease is connected to a vacuum fixture, and the top surface of the vacuum fixture is in contact with the bottom surface of the silicon-based OLED product.

4. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 3, characterized in that: An optical fiber photoelectric sensor and a vacuum pump are installed in the vacuum fixture. The optical fiber photoelectric sensor is connected to the vacuum pump via a wire, and the vacuum pump is in contact with the bottom surface of the silicon-based OLED product.

5. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 4, characterized in that: The step three comprises the following steps: Step B1: The optical fiber photoelectric sensor senses the silicon-based OLED product; Step B2: The light display photoelectric sensor controls the vacuum pump to start via the wire; Step B2: After the vacuum pump is started, the air between the silicon-based OLED product and the vacuum fixture is evacuated, so that the silicon-based OLED product is tightly adsorbed on the vacuum fixture.

6. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 5, characterized in that: The thermocouple is provided with a temperature sensor, and the temperature sensor of the thermocouple is connected to the vacuum fixture. When the silicon-based OLED product is tightly adsorbed on the vacuum fixture, the temperature sensor of the thermocouple is in contact with the silicon-based OLED product.

7. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 6, characterized in that: The relay group includes a temperature increasing relay and a temperature decreasing relay, wherein the temperature increasing relay and the temperature decreasing relay are respectively connected to a power supply and a single-chip computer via wires, and the temperature increasing relay and the temperature decreasing relay are respectively connected to a semiconductor refrigeration plate via wires, and the current direction between the temperature increasing relay and the semiconductor refrigeration plate is opposite to the current direction between the temperature decreasing relay and the semiconductor refrigeration plate.

8. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 7, characterized in that: The temperature increase relay and the temperature decrease relay are arranged to be interlocked, and the temperature increase relay and the temperature decrease relay cannot be turned on at the same time.

9. The temperature-controlled aging method for PCB-connected silicon-based OLED products according to claim 8, characterized in that: The step A4 comprises the following steps: Step C1: The single-chip computer compares the temperature digital signal transmitted by the meter. When the temperature digital signal is greater than the temperature setting of the host computer, the temperature reduction relay is energized and the temperature increase relay is de-energized; when the temperature digital signal is less than the temperature setting of the host computer, the temperature reduction relay is de-energized and the temperature increase relay is energized; Step C2: when the temperature-lowering relay is powered on and the temperature-raising relay is powered off, the temperature-raising relay transmits a forward current to the semiconductor refrigeration chip through a wire, so that the semiconductor refrigeration chip is heated up; when the temperature-raising relay is powered on and the temperature-lowering relay is powered off, the temperature-lowering relay transmits a reverse current to the semiconductor refrigeration chip through a wire, so that the semiconductor refrigeration chip is cooled down; Step C3: The semiconductor cooling chip transfers the temperature to the connected silicon-based OLED product through thermal grease and vacuum fixture, keeping the temperature of the silicon-based OLED product constant at the set number.

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