Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display substrate, an electric control chip arranged on the display substrate, a frame and a guiding component. The frame is arranged around the electric control chip. The guiding component is located below the frame. The bottom of the frame is provided with an embedding groove. The guiding component is embedded in the embedding groove. The guiding component is in a thin layer structure. The frame is made of a light-transmitting material. According to the application, accurate alignment can be realized without occupying available space. The application has good application prospects for the design and manufacturing standards of highly integrated and small-sized display devices.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, in particular to a display module and a display device. BACKGROUND

[0002] In the manufacturing process of display devices, in order to achieve the purpose of partial electronic control of the display device, it is necessary to connect the electric control chip with the electric control area of the display substrate to connect the control loop. In some processes, the connection mode is called COB process, which means that the IC chip is aligned and bonded on the PCB. The English name is chip on board. This method is also a common bonding method in current display technology. Its characteristics are high equipment precision, and it is used for processing lines with more numbers, smaller gaps and smaller areas.

[0003] The existing alignment method usually uses visual acquisition, infrared, laser acquisition and other collectors to collect the overall outline of the installation area to complete the alignment. For the increasingly narrow or more complex shape of the PCB structure form, the alignment accuracy has gradually exposed some reliability problems. Because there are many functional structure designs on the PCB, and it is narrow due to the miniaturization design requirement, it is necessary to study some more accurate and space-saving solutions to improve the alignment accuracy. SUMMARY

[0004] Based on this, the purpose of the present application is to provide a display module and a display device to solve the problems in the prior art.

[0005] To achieve the above purpose, the present application provides a display module, which comprises a display substrate, an electric control chip arranged on the display substrate, a frame and a guide component. The frame is arranged around the electric control chip. The guide component is located below the frame. The bottom of the frame is provided with an embedding groove. The guide component is embedded in the embedding groove. The guide component is a thin layer structure. The frame is made of a light-transmitting material.

[0006] The beneficial effects of the present application are as follows: by arranging the guide component on the display substrate, embedding the guide component in the embedding groove at the bottom of the frame, and making the frame of a light-transmitting material, the collector can collect the guide component through the frame. The bonding operation of the electric control chip is positioned, and accurate alignment can be achieved without occupying the available space. It has good application prospect for the design and manufacturing standards of highly integrated and miniaturized display devices.

[0007] Preferably, the cross section of the frame is an inverted ladder structure, and the surface area of the bottom of the frame towards the display substrate is smaller than that of the top.

[0008] Preferably, the top of the frame is outwardly convex to form an arc surface.

[0009] Preferably, the edge distance between the projected edge of the frame projected onto the display substrate and the edge of the guide component is 2-5 μm.

[0010] Preferably, the cross section of the frame is rectangular structure, and the surface area of the bottom of the frame is equal to that of the top.

[0011] Preferably, the number of the guide components is four, and the four guide components are divided into two groups of guide components, which are symmetrically arranged with the center point of the frame and the symmetry axis of the display substrate.

[0012] Preferably, the display substrate is provided with a bonding area, and the electric control chip and the guide components are located in the bonding area.

[0013] To achieve the above object, the present application further provides a display device comprising the display module.

[0014] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be understood through practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 Structure schematic view of the display module provided by the first embodiment of the present application;

[0016] Fig. 2 Structure schematic view of the display module provided by the first embodiment of the present application;

[0017] Fig. 3 Structure schematic view of the frame and the guide component provided by the second embodiment of the present application.

[0018] Explanation of main element symbols:

[0019] 10, display substrate; 11, bonding area; 20, electric control chip; 30, frame; 31, arc surface; 40, guide component.

[0020] The following specific implementation will further illustrate the present application in combination with the above drawings. DETAILED DESCRIPTION

[0021] For the purpose of promoting an understanding of the application, the application will now be described in greater detail with reference to the figures. Various embodiments of the application are depicted in the drawings. It is to be understood that the application can assume various alternative forms of embodiments, and it is therefore not limited to the embodiments described herein. On the contrary, the intention is for this disclosure to cover all modifications, equivalents, and alternatives falling within the scope of the application.

[0022] It is to be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right" and similar expressions are used for explanation purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0024] Reference will now be made to the drawings, wherein Figs. 1-2 The display module in the first embodiment of the application comprises a display substrate 10, an electric control chip 20, a frame 30 and a guiding component 40.

[0025] The electric control chip 20, the frame 30 and the guiding component 40 are respectively connected to the surface of the display substrate 10. The display substrate 10 is provided with a bonding area. The electric control chip 20, the frame 30 and the guiding component 40 are all arranged in the bonding area. The electric control chip 20 is located at the center of the bonding area 11. The frame 30 surrounds the electric control chip 20. The guiding component 40 is located below the frame 30. The frame 30 is provided with an embedding groove at the center of the bottom of the display substrate 10. The guiding component 40 is embedded in the embedding groove. The top of the guiding component 40 is connected to the inner wall of the embedding groove through transparent glue, so as to strengthen the connection between the guiding component 40 and the frame 30, and improve the support strength of the frame 30 and the structural strength of the display module. The frame 30 is made of transparent material, such as transparent polymer, so that the guiding component 40 can be captured by the collector through the frame 30.

[0026] In the embodiment, the guide component 40 is a thin layer structure, the height of the guide component 40 is much lower than the height of the frame 30, the number of the guide component 40 is 4, the 4 guide components 40 are divided into two groups of guide components 40, the two groups of guide components 40 are symmetrically arranged at the center point of the frame 30, and symmetrically arranged at the symmetry axis of the display substrate 10 or the symmetry axis of the binding area 11, it should be noted that in order to make the guide component 40 more easily collected by the collector, the guide component 40 is designed as one of a cross shape, a dot shape, so as to have a more prominent profile shape compared with other components.

[0027] In the embodiment, the guide component 40 can be arranged on the surface of the display substrate 10 before the frame 30 is formed on the display substrate 10,

[0028] In the embodiment, the cross section of the frame 30 is a rectangular structure, the surface area of the bottom of the frame 30 towards the display substrate 10 is equal to the surface area of the top.

[0029] It should be noted that the frame 30 is a frame-shaped component with a certain thickness, and has a certain height along the vertical direction of the display substrate 10, the size and shape of the frame 30 are designed with reference to the size of the binding area 11, for different shapes of the binding area 11, the frame 30 is different, in the case of designing the frame 30, the available space of the binding area 11 on the display substrate 10 is very limited, therefore, by arranging the guide component 40 below the frame 30, not only the available space is not occupied, but also the accuracy of alignment is ensured.

[0030] In specific implementation, by arranging the guide component 40 on the display substrate 10, embedding slots are arranged at the bottom of the frame 30, the guide component 40 is embedded into the embedding slots, the frame 30 is made of a light-transmitting material, so that the collector can collect the guide component 40 through the frame 30, the guide component 40 is used for positioning the binding operation of the electric control chip 20, so that accurate alignment can be realized without occupying the available space, which has good application prospect for the design and manufacturing standard of high integration and miniaturization, narrow and small display devices.

[0031] It should be noted that the above implementation process is only to illustrate the feasibility of the present application, but it does not mean that the display module of the present application has only the above unique implementation process, on the contrary, as long as the display module of the present application can be implemented, it can be included in the feasible implementation scheme of the present application.

[0032] Please refer to 3, the display module in the second embodiment of the present application is shown, the display module in the second embodiment is different from the display module in the first embodiment in that the cross section of the frame 30 is a reverse trapezoidal structure, the surface area of the bottom of the frame 30 towards the display substrate 10 is smaller than the surface area of the top.

[0033] It should be noted that in the case of small size, the image profile of the guide component 40 is easily interfered by the profile edge of the frame 30, resulting in a certain degree of recognition error, in order to improve this problem, in the width dimension, the frame 30 is designed as a special structure gradually tapered in the direction perpendicular to the display substrate 10 and from bottom to top, if observed from the direction of the surface of the display substrate 10, the surface area of the top of the frame 30 is greater than the surface area of the bottom of the frame 30, specifically, the cross section of the frame 30 is designed as a reverse trapezoidal structure, that is, the small area of the bottom of the frame 30 towards the display substrate 10 is smaller than the surface area of the top.

[0034] Further, the top of the frame 30 is outwardly convex to form an arc surface 31, so that the frame 30 itself has a certain convex lens effect, which can magnify the image of the guide component 40 inside the frame 30. Designing such a frame 30, on the one hand, the convex lens effect is formed on the frame 30 by its special shape design, so that the guide component 40 arranged at the bottom of the frame 30 can be magnified in the top view of the frame 30, which is more conducive to the capture of the collector, and at the same time, due to the principle of convex lens imaging, the vertical coordinate of the center point of the guide component 40 does not change, so the positioning accuracy is not affected, on the other hand, the frame 30 with this structure is conducive to optimizing the overall structure distribution, that is, the part of the frame 30 at the bottom in contact with the display substrate 10 can be designed to be relatively narrow, thereby ensuring the miniaturization size requirement of the display module and reducing the space occupation of the remaining components, and the top part can be designed to gradually widen the frame 30 part, thereby making full use of the avoidance space to form a convex effect, on the other hand, it can also more effectively block the heat dissipation.

[0035] It should be noted that the edge distance between the projection edge formed by the projection of the top of the frame 30 onto the display substrate 10 and the edge of the guide component 40 is 2-5μm, according to the space utilization rate and the recognition success rate of the collector, the edge distance between the projection edge formed by the projection of the top of the frame 30 onto the display substrate 10 and the edge of the guide component 40 is preferably 3.5-5μm.

[0036] It should be noted that the display module provided by the second embodiment of the present application has the same implementation principle and some technical effects as the first embodiment, for brevity, the unmentioned part of the second embodiment can be referred to the corresponding content in the first embodiment.

[0037] The display device in the third embodiment of the present application comprises the display module mentioned above.

[0038] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0039] The above-described embodiments only express several implementation manners of the present application, which are described in a more specific and detailed manner, but cannot be understood as a limitation on the patent scope of the present application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A display module, characterized by The display module comprises a display substrate, an electric control chip arranged on the display substrate, a frame and a guiding component, the frame is arranged around the electric control chip, the guiding component is arranged below the frame, an embedding groove is arranged at the bottom of the frame, the guiding component is embedded in the embedding groove, the guiding component is in a thin layer structure, the frame is made of a light-transmitting material, the cross section of the frame is in an inverted ladder shape, the surface area of the bottom of the frame is smaller than that of the top, and the top of the frame is outwardly convex to form an arc surface.

2. The display module of claim 1, wherein, The edge distance between the projection edge formed by the projection of the top of the frame on the display substrate and the edge of the guiding component is 2-5 microns.

3. The display module of claim 1, wherein, The guiding component is in a cross shape or a dot shape.

4. The display module of claim 1, wherein, The number of the guiding components is four, the four guiding components are divided into two groups of guiding components, the two groups of guiding components are symmetrically arranged with the center point of the frame as the center and symmetrically arranged with the symmetry axis of the display substrate.

5. The display module of claim 1, wherein, The display substrate is provided with a bonding area, and the electric control chip and the guiding component are arranged in the bonding area.

6. A display device, characterized by comprising: The display module comprises any one of claims 1-5.

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