Display module containing isolated beacon structure

Abstract

The application provides a display module containing an isolated beacon structure, comprising a display device and a frame structure arranged on the display device, the display device comprising a display area, a non-display area arranged on one side of the display area, and a binding area arranged in the non-display area, a PCB structure and a plurality of conductive lines for electrically connecting the PCB structure being arranged in the binding area and surrounding the PCB structure, the frame structure being arranged around the PCB structure, a plurality of recess spaces for the conductive lines to pass through being arranged in the bottom of the frame structure, the recess spaces being arranged at the top of the dense conductive lines, and a positioning unit for positioning being arranged on one side of the recess space away from the conductive lines, the positioning unit itself being made of a thermochromic material or being coated with a thermochromic material.

Description

Technical Field

[0001] The present invention relates to the technical field of display modules, and in particular to a display module containing an isolation beacon structure. Background Art

[0002] The display module has a display area and a non-display area. The non-display area is provided with a circuit for controlling and driving the display function. The circuit includes a chip and / or circuit board bound to a specific binding area, and a conductive line set in the binding area by printing or other means.

[0003] The chips and / or circuit boards set in the binding area are easily affected by external impact or extrusion during subsequent manufacturing or use, resulting in damage or reduced service life. During the binding process, how the automatic equipment used can accurately bind the chip or circuit board to the specified position is also a problem that needs to be solved.

[0004] Existing display modules use a method of setting positioning marks on certain blank areas on the binding area where no functional components are set to solve the problem of automatic equipment positioning. However, for highly integrated display devices, the blank areas where no functional components are set are themselves very few / very small, which makes it difficult to design positioning marks, and the marking structure set by the existing technology is bound to affect the surrounding functional components, such as the normal function of the conductive circuit mentioned above, resulting in problems such as reduced conductivity, expected external resistance due to insufficient precision, and other functional degradation problems. In addition, if the existing technology design is applied to the above situation, it is bound to result in a smaller marking area, thereby increasing the difficulty of recognition by automatic equipment, resulting in an increased probability of non-recognition or misrecognition, and affecting production. Summary of the Invention

[0005] Based on this, an object of the present invention is to provide a display module including an isolated beacon structure, which can effectively solve the above-mentioned deficiencies in the prior art.

[0006] A display module containing an isolated beacon structure includes a display device and a frame structure arranged on the display device, the display device including a display area, a non-display area arranged on one side of the display area, and a binding area arranged within the non-display area, a PCB structure and a plurality of conductive circuits arranged around the PCB structure for electrically connecting the PCB structure are arranged within the binding area, the frame structure is arranged around the PCB structure, and a plurality of recessed spaces for the conductive circuits to pass through are arranged inwardly at the bottom of the frame structure, the recessed spaces are arranged at the top of the densely concentrated conductive circuits, and a positioning unit for positioning is arranged on the side of the recessed space away from the conductive circuits, the positioning unit itself is made of a thermochromic material or coated with a thermochromic material.

[0007] Further, the line cluster width of the conductive line is 2mm.

[0008] Further, the recess space is square, and the width of the recess space projected in the vertical direction is 2.5mm-3.5mm.

[0009] Further, the positioning unit is a planar thin layer structure, and the positioning unit is arranged in the center of the side of the recess space away from the conductive line by printing or pasting.

[0010] Further, the recess space is circular arc, and the diameter of the recess space projected in the vertical direction is 2.2mm-3mm.

[0011] Further, the positioning unit is a circular arc thin layer structure, and the positioning unit is arranged in the center of the side of the recess space away from the conductive line by printing or pasting.

[0012] Further, the recess space is inverted trapezoidal, and the diameter of the recess space projected in the vertical direction is 2.5mm-3.5mm.

[0013] Further, the positioning unit is a planar thin layer structure, and the positioning unit is arranged in the center of the side of the recess space away from the conductive line by printing or pasting.

[0014] Further, the positioning unit is an inverted trapezoidal structure that fits the recess space, the diameter of the recess space projected in the vertical direction is 2.5mm-3.5mm, and the positioning unit is arranged in the recess space by printing or pasting.

[0015] Further, the frame structure is a transparent plastic material such as PVC.

[0016] The beneficial effects of the present application are: by arranging a plurality of recess spaces for the passage of conductive lines in the recessed bottom of the frame structure, the recess spaces are arranged at the top of the conductive line dense place, on the one hand, for avoiding the conductive line to avoid affecting the functionality of the conductive line, on the other hand, for providing space for heat dissipation of the conductive line when energized, the design position of the recess space corresponds to the design position of the conductive line, without affecting the structural strength of the remaining part; by arranging a positioning unit for positioning on the side away from the conductive line of the recess space, the positioning unit can improve the positioning accuracy on the product with less available space, without occupying or using the mounting position of the remaining components, so that the overall integration is improved, and it is suitable for narrower new manufacturing process; by arranging a positioning unit for positioning on the side away from the conductive line of the recess space, the positioning unit itself is made of thermochromic material or coated with thermochromic material, so that the heat generated by the energization of the conductive line can cause it to change color, so that it is significantly different from the surrounding other images in the image collected by the collection unit of the automatic binding equipment, which is especially beneficial to achieve accurate positioning accuracy in small size, without consuming additional energy, which is beneficial to save cost and integrated design. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a top view of the display device in embodiment 1 of the present application;

[0018] Figure 2 is a top view of the display module containing the isolation beacon structure in embodiment 1 of the present application;

[0019] Figure 3 is a sectional view of the display module containing the isolation beacon structure in embodiment 1 of the present application;

[0020] Figure 4 is a sectional view of the display module containing the isolation beacon structure in embodiment 2 of the present application;

[0021] Figure 5 is a sectional view of the display module containing the isolation beacon structure in embodiment 3 of the present application;

[0022] Figure 6 is a sectional view of the display module containing the isolation beacon structure in embodiment 4 of the present application;

[0023] Main element symbol explanation:

[0024] Display device 10 Conductive line 15 Display area 11 Frame structure 20 Non-display area 12 Recess space 21 Binding area 13 Positioning unit 22 PCB structure 14

[0025] The following specific embodiments will further illustrate the present application in conjunction with the above drawings. DETAILED DESCRIPTION

[0026] For the purpose of promoting an understanding of the application, the application will now be described in greater detail with reference to the figures. Several embodiments of the application are depicted in the drawings. However, the application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It is therefore to be understood that no limitation of the scope of the application is intended by the description of the embodiments.

[0027] It is to be understood that where an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. Where an element such as a layer, region or substrate is referred to as being "connected" to or "coupled" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0029] Embodiment 1

[0030] Referring to Figures 1 to 3 The display module containing the isolation beacon structure in the embodiment of the application comprises a display device 10 and a frame structure 20 arranged on the display device 10. The display device 10 comprises a display area 11, a non-display area 12 arranged on one side of the display area 11, and a binding area 13 arranged in the non-display area 12. A PCB structure 14 is arranged in the binding area 13, and a plurality of conductive lines 15 for electrically connecting the PCB structure 14 are arranged around the PCB structure 14. The frame structure 20 is arranged around the PCB structure 14. A plurality of recess spaces 21 for the conductive lines 15 to pass through are arranged in the bottom of the frame structure 20. The recess spaces 21 are arranged at the top of the dense part of the conductive lines 15. Positioning units 22 for positioning are arranged on the side of the recess spaces 21 away from the conductive lines 15. The positioning units 22 are made of or coated with a thermochromic material.

[0031] Further, the line cluster width of the conductive lines 15 is 2 mm.

[0032] Further, the recess spaces 21 are square. The width of the projection of the recess spaces 21 in the vertical direction is 2.5-3.5 mm.

[0033] Further, the positioning unit 22 is a planar thin layer structure, and the positioning unit 22 is arranged on the center of the recess space 21 away from the conductive circuit 15 by printing or pasting.

[0034] Further, the frame structure 20 is made of transparent plastic material such as PVC.

[0035] It can be understood that, by setting the frame structure 20 to be made of transparent plastic material such as PVC, the non-display area at the bottom of the frame structure 20 can be observed through the frame structure 20.

[0036] It should be noted that, in the present embodiment, four conductive circuits 15 are arranged around the PCB structure 14 for electrically connecting the PCB structure 14, and four recess spaces 21 for the conductive circuits 15 to pass through are arranged in the concave bottom of the frame structure 20.

[0037] It can be understood that, by arranging four recess spaces 21 for the conductive circuits 15 to pass through in the concave bottom of the frame structure 20, the recess spaces 21 are arranged at the top of the dense part of the conductive circuits 15, which on the one hand avoids affecting the functionality of the conductive circuits 15 and on the other hand provides space for heat dissipation when the conductive circuits 15 are powered on. The design position of the recess space 21 corresponds to the design position of the conductive circuit 15, without affecting the structural strength of the remaining part. By arranging the positioning unit 22 for positioning on the side of the recess space 21 away from the conductive circuit 15, positioning with improved binding accuracy is achieved on products with less available space, without occupying or using the mounting position of other components, so that the overall integration is improved, which is suitable for narrower new manufacturing processes. By arranging the positioning unit 22 for positioning on the side of the recess space 21 away from the conductive circuit 15, the positioning unit 22 itself is made of thermochromic material or coated with thermochromic material, so that the heat generated by the conductive circuit 15 can cause it to change color, so that it is significantly different from the surrounding images in the image collected by the acquisition unit of the automatic binding equipment, which is especially beneficial to achieving accurate positioning accuracy in small sizes without consuming additional energy, which is beneficial to saving costs and integrated design.

[0038] Embodiment 2

[0039] Please refer to Figure 4 , the display module containing the isolated beacon structure in embodiment 2 is different from the display module containing the isolated beacon structure in embodiment 1 in that:

[0040] The recess space is in a circular arc shape, the diameter of the recess space projected in the vertical direction is 2.2mm-3mm, the positioning unit is a circular arc thin layer structure, and the positioning unit is arranged in the center of the recess space away from the conductive circuit by printing or pasting.

[0041] Embodiment 3

[0042] Please refer to Figure 5 The display module containing the isolated beacon structure in Embodiment 3 is different from the display module containing the isolated beacon structure in Embodiment 1 in that:

[0043] The recess space is in an inverted trapezoidal shape, the diameter of the recess space projected in the vertical direction is 2.5mm-3.5mm, the positioning unit is a planar thin layer structure, and the positioning unit is arranged in the center of the recess space away from the conductive circuit by printing or pasting.

[0044] Embodiment 4

[0045] Please refer to Figure 6 The display module containing the isolated beacon structure in Embodiment 4 is different from the display module containing the isolated beacon structure in Embodiment 1 in that:

[0046] The positioning unit is in an inverted trapezoidal shape that fits the recess space, the diameter of the recess space projected in the vertical direction is 2.5mm-3.5mm, and the positioning unit is arranged in the recess space by printing or pasting.

[0047] In summary, the display module containing the isolation beacon structure in the above-mentioned embodiments of the present application is provided with a plurality of recessed spaces for the passage of conductive lines at the bottom of the frame structure, and the recessed spaces are arranged at the top of the dense conductive lines, which can avoid affecting the functionality of the conductive lines on the one hand, and provide space for heat dissipation generated by the conductive lines when energized on the other hand. The design position of the recessed space corresponds to the design position of the conductive line, and does not affect the structural strength of the remaining part. By arranging the positioning unit for positioning on the side of the recessed space away from the conductive line, positioning that can improve the binding accuracy is realized on the product with less available space, without occupying or using the mounting position of the remaining components, so that the overall integration is improved, and it is suitable for narrower new manufacturing processes. By arranging the positioning unit for positioning on the side of the recessed space away from the conductive line, the positioning unit itself is made of a thermochromic material or coated with a thermochromic material, so that the heat generated by the energization of the conductive line can cause it to change color, so that it is significantly different from the surrounding images in the image collected by the collection unit of the automatic binding equipment, which is especially beneficial to achieving accurate positioning accuracy in small size without consuming additional energy, which is beneficial to saving cost and integrated design.

[0048] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0049] The above-described embodiments only express several embodiments of the present application, which are described in detail and in detail, but cannot be understood as limiting the scope of the patent of the present application. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A display module comprising a spacer beacon structure, characterized in that, The application relates to a display device and a frame structure arranged on the display device, wherein the display device comprises a display area, a non-display area arranged on one side of the display area, and a binding area arranged in the non-display area, a PCB structure and a plurality of conductive lines for electrically connecting the PCB structure are arranged in the binding area, the frame structure is arranged around the PCB structure, a plurality of recess spaces for the conductive lines to pass through are arranged in the bottom of the frame structure, the recess spaces are arranged on the top of the dense conductive lines, and a positioning unit for positioning is arranged on the side of the recess space away from the conductive lines, wherein the positioning unit is made of a thermochromic material or coated with a thermochromic material. 2.The display module containing the isolated beacon structure of claim 1, wherein, The line cluster width of the conductive lines is 2 mm. 3.The display module containing the isolated beacon structure of claim 1, wherein, The recess space is square, and the width of the recess space projected in the vertical direction is 2.5-3.5 mm.

4. The display module containing the isolated beacon structure according to claim 3, wherein, The positioning unit is a planar thin layer structure, and the positioning unit is arranged in the center of the side of the recess space away from the conductive lines by printing or pasting.

5. The display module containing isolated beacon structures of claim 1, wherein, The recess space is circular arc-shaped, and the diameter of the recess space projected in the vertical direction is 2.2-3 mm. 6.The display module containing the isolated beacon structure of claim 5, wherein, The positioning unit is a circular arc-shaped thin layer structure, and the positioning unit is arranged in the center of the side of the recess space away from the conductive lines by printing or pasting.

7. The display module containing isolated beacon structures of claim 1, wherein, The recess space is inverted trapezoidal, and the diameter of the recess space projected in the vertical direction is 2.5-3.5 mm. 8.The display module containing the isolated beacon structure of claim 7, wherein, The positioning unit is a planar thin layer structure, and the positioning unit is arranged in the center of the side of the recess space away from the conductive lines by printing or pasting.

9. The display module containing isolated beacon structures of claim 1, wherein, The positioning unit is inverted trapezoidal and fits the recess space, the diameter of the recess space projected in the vertical direction is 2.5-3.5 mm, and the positioning unit is arranged in the recess space by printing or pasting.

10. The display module containing a spacer beacon structure according to claim 1, wherein, The frame structure is made of transparent plastic materials such as PVC.

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