Electronic wire

Abstract

The invention provides an electronic wire. The electronic wire comprises a conductor and an insulating layer wrapping the conductor, and further comprises a shielding layer wrapping the insulating layer, the shielding layer is made of shielding slurry, and the shielding slurry is prepared from the following raw materials in parts by weight: 13.5-16.5 parts of resin, 49.5-60.5 parts of conductive powder, 0.9-1.1 parts of a catalyst and 9-11 parts of a diluent. The electronic wire has the advantages that the shielding slurry is innovated, the shielding layer is formed on the insulating layer outside the conductor, and the shielding performance of the electronic wire is improved. The electronic wire twisted pair can meet the requirements of USB2.0 signals and EDP signals at the same time, and the transmission quality of the electronic wire twisted pair is superior to that of a traditional electronic wire twisted pair at present.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic wire shielding, and in particular to an electronic wire. Background Art

[0002] Traditional electronic wires include conductors and an insulating layer wrapped around the conductors. To achieve the function of signal transmission, the two strands of electronic wires are twisted into a pair, and different twist lengths are used to achieve different characteristic impedances of the twisted pair, ultimately meeting the signal transmission requirements. However, the characteristic impedance stability of the current electronic twisted pair is poor and obviously unstable. The electronic twisted pair can only meet the transmission requirements of USB2.0 and below. Transmission signals higher than USB2.0 (such as EDP signals) will cause abnormal signal transmission quality.

[0003] Currently, the existing industry adopts the method of wrapping conductive cloth on the outside of electronic twisted pair cables to improve the shielding performance of electronic twisted pair cables, but the actual signal transmission quality still cannot meet the EDP (Embedded Display Port) signal. Summary of the invention

[0004] The present disclosure provides an electronic wire to at least solve one of the technical problems existing in the prior art.

[0005] According to the first aspect of the present disclosure, there is provided an electronic wire, comprising a conductor, an insulating layer wrapped around the conductor, and a shielding layer wrapped around the insulating layer, wherein the shielding layer is made of a shielding slurry, and the shielding slurry is composed of the following raw materials in parts by weight: 13.5 to 16.5 parts of resin, 49.5 to 60.5 parts of conductive powder, 0.9 to 1.1 parts of catalyst, and 9 to 11 parts of diluent.

[0006] In one embodiment, the shielding layer is prepared by the following method: the raw materials constituting the shielding slurry are mixed and dispersed according to a weight ratio, and heated and cured until the volume resistivity of the obtained shielding layer is less than 1×10 -3 Ω·m.

[0007] In one embodiment, the curing temperature during the heating curing is 170-190° C., and the curing time is ≤60 min.

[0008] In one embodiment, the shielding slurry further includes 2.7 to 3.3 parts by weight of a reinforcing agent.

[0009] In one possible implementation, the resin is a single-component silicone rubber or a two-component silicone rubber;

[0010] The conductive powder is a mixture of any one or more of silver powder, copper powder, nickel powder, aluminum powder, silver-coated copper powder, silver-coated aluminum powder, nickel-coated graphite powder, carbon black, graphene and carbon nanotube powder;

[0011] The catalyst is a platinum catalyst;

[0012] The reinforcing agent is hydrophobic fumed silica;

[0013] The diluent is one or a mixture of an alkane solvent and an aromatic hydrocarbon solvent.

[0014] In one possible implementation manner, the conductive powder has a powder shape of any one of spherical powder, quasi-spherical powder, flaky powder and linear powder.

[0015] In one embodiment, the Dmax diameter of the flake powder is less than 30 μm, and the flake thickness is less than 5 μm and less than 10 μm; the Dmax diameter of the spherical powder and the quasi-spherical powder is less than 25 μm; the diameter of the linear powder is less than 2 μm, the length is less than 50 μm, and the aspect ratio is greater than 25.

[0016] In one embodiment, the concentration of the platinum catalyst is 1000-5000 ppm.

[0017] In one embodiment, the hydrophobic fumed silica has a particle size of <20 nm and a specific surface area of ​​>150 m 2 / g.

[0018] In one embodiment, the alkane solvent is a mixture of any one or more of heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane and pentadecane; the aromatic hydrocarbon solvent is a mixture of any one or more of toluene, o-xylene, m-xylene and p-xylene.

[0019] Compared with the prior art, the advantages of this application are: 1) This application forms a shielding layer on the insulating layer outside the conductor by innovating the shielding slurry, thereby improving the shielding performance of the electronic wire. 2) The electronic wire twisted pair of this application can simultaneously meet the USB2.0 signal and EDP signal, and the transmission quality is better than the current traditional electronic wire twisted pair. 3) The electronic wire twisted pair of this application has excellent characteristic impedance stability.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0022] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0023] Figure 1 The impedance test diagram of the USB2.0 signal of the electronic twisted pair cable of the first embodiment of the present disclosure is shown;

[0024] Figure 2 The attenuation test diagram of the USB2.0 signal of the electronic twisted pair cable of the first embodiment of the present disclosure is shown;

[0025] Figure 3 The impedance test diagram of the EDP signal of the electronic twisted pair of the embodiment 1 of the present disclosure is shown;

[0026] Figure 4 The echo test diagram of the EDP signal of the electronic twisted pair cable according to the first embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0027] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0028] According to one embodiment of the present disclosure, the present invention provides an electronic wire. An electronic wire includes a conductor, an insulating layer wrapped around the outside of the conductor, and a shielding layer wrapped around the outside of the insulating layer. The shielding layer is made of a shielding slurry, and the shielding slurry is composed of the following raw materials in parts by weight: 13.5 to 16.5 parts of resin, 49.5 to 60.5 parts of conductive powder, 0.9 to 1.1 parts of catalyst, and 9 to 11 parts of diluent. Further preferably, the shielding slurry also includes 2.7 to 3.3 parts by weight of a reinforcing agent. Further preferably, the shielding slurry is composed of the following raw materials in parts by weight: 15 parts of resin, 55 parts of conductive powder, 1 part of catalyst, 3 parts of reinforcing agent, and 10 parts of diluent.

[0029] Preferably, the shielding layer is prepared by the following method: the raw materials constituting the shielding slurry are mixed and dispersed according to a weight ratio, and heated and cured until the volume resistivity of the obtained shielding layer is less than 1×10 -3 Ω·m. Preferably, the curing temperature during heating curing is 170-190°C, and the curing time is ≤60min.

[0030] Preferably, the resin is a single-component silicone rubber or a two-component silicone rubber. The resin is composed of liquid silicone rubber, which can be a single-component silicone rubber or a two-component silicone rubber, and can form a solid silicone rubber with certain strength and stretchability under heating. The available brands of two-component silicone rubber include but are not limited to: Shin-Etsu related brands KE-1950-10 (A / B), KE-1950-20 (A / B), KE-1950-30 (A / B), KE-1950-40 (A / B), KE-1950-50 (A / B), KE-1950-60 (A / B), KEG-2000-40 (A / B), KEG-2000-50 (A / B), KEG-2000-60 (A / B), KEG-2001-40 (A / B), KEG-2001-50 (A / B); Dow Corning related brands SILASTIC TM RBL-9200-60, SILASTIC TM RBL-9200-50, SILASTIC TM RBL-9200-40, SILASTIC TM RBL-9200-30, SILASTIC TM RBL-9200-20. The available brands of one-component silicone rubber include but are not limited to: Momentive TSE3212, TSE322, TSE322S, TSE325, TSE3250, TSE3251, TSE326, TSE326M.

[0031] Preferably, the conductive powder is a mixture of any one or more of silver powder, copper powder, nickel powder, aluminum powder, silver-coated copper powder, silver-coated aluminum powder, nickel-coated graphite powder, carbon black, graphene and carbon nanotube powder. Further, the powder shape of the conductive powder includes but is not limited to spherical powder, quasi-spherical powder, flake powder and linear powder; wherein the flake powder Dmax flake diameter is less than 30μm, 5μm < flake thickness < 10μm; the spherical powder and quasi-spherical powder Dmax diameter is less than 25μm; the linear powder diameter is less than 2μm, the length is less than 50μm, and the aspect ratio is greater than 25.

[0032] Preferably, the catalyst is a platinum catalyst, and the concentration of the platinum catalyst is 1000-5000 ppm. Further, the catalyst is a Custer platinum catalyst, and catalysts of different concentrations can be selected for use, such as 1000ppm, 2000ppm, 3000ppm, 5000ppm and other different concentrations.

[0033] Preferably, the reinforcing agent is hydrophobic fumed silica; further, the particle size of the hydrophobic fumed silica is less than 20 nm, and the specific surface area is greater than 150 m 2 / g.

[0034] Preferably, the diluent is an alkane solvent or an aromatic hydrocarbon solvent, or a mixture of two of them. Further preferably, the alkane solvent is a mixture of any one or more of heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane and pentadecane; and the aromatic hydrocarbon solvent is a mixture of any one or more of toluene, o-xylene, m-xylene and p-xylene.

[0035] The present application is further described in detail below with reference to specific embodiments:

[0036] Example 1

[0037] A shielding slurry comprises the following raw materials in parts by weight: 15 g of single-component silicone rubber, 1 g of a platinum catalyst with a concentration of 3000 ppm, 3 g of hydrophobic fumed silica, 10 g of a diluent-heptane, and 55 g of spherical silver powder with a diameter of 800 nm to 2 μm.

[0038] An electronic wire is prepared by the following method:

[0039] Step 1): Preparation of shielding slurry: Mix the four materials of single-component silicone rubber, platinum catalyst, diluent heptane, and hydrophobic fumed silica evenly until there is no dry powder, and then grind them in a three-roll grinder. The grinding process is: 50μm-40μm-350rpm, 30μm-20μm-350rpm, 10μm-5μm-350rpm, 2μm-1μm-350rpm, 2μm-1μm-350rpm, 2μm- After six passes of grinding at 1 μm-350 rpm, an organic carrier is obtained, 29 g of the ground organic carrier is mixed with 55 g of spherical silver powder, and then five passes of grinding are performed at 50 μm-40 μm-350 rpm, 30 μm-20 μm-350 rpm, 10 μm-5 μm-350 rpm, 3 μm-2 μm-350 rpm, 30 μm-20 μm-350 rpm, loose rolling-tight rolling-loose rolling, and a shielding slurry to be used is obtained;

[0040] Step 2): coating the outside of the conductor with a layer of insulating material, curing, and forming an insulating layer on the outside of the conductor, thereby obtaining a semi-finished electronic wire;

[0041] Step 3): The shielding slurry prepared in step 1) is coated on the outside of the semi-finished electronic wire, and heated and cured at 180°C for 30 minutes to form a shielding layer on the outside of the insulating layer, thereby obtaining an electronic wire; wherein the volume resistivity of the shielding layer is 1.7*10 -4 Ω·m.

[0042] Example 2

[0043] A shielding slurry comprises the following raw materials in parts by weight: 13.5 g of single-component silicone rubber, 0.9 g of a platinum catalyst with a concentration of 1000 ppm, 2.7 g of hydrophobic fumed silica, 9 g of a diluent-heptane, and 60.5 g of flaky silver powder.

[0044] An electronic wire is prepared by the following method:

[0045] Step 1): Preparation of shielding slurry: Mix the four materials of single-component silicone rubber, platinum catalyst, diluent heptane, and hydrophobic fumed silica evenly until there is no dry powder, and then grind them in a three-roll grinder. The grinding process is: 50μm-40μm-350rpm, 30μm-20μm-350rpm, 10μm-5μm-350rpm, 2μm-1μm-350rpm, 2μm-1μm-350rpm, 2 After six grindings at 50 μm-40 μm-350 rpm, 30 μm-20 μm-350 rpm, 10 μm-5 μm-350 rpm, 3 μm-2 μm-350 rpm, 30 μm-20 μm-350 rpm, loose rolling-tight rolling-loose rolling, a total of five grindings are performed to obtain the shielding slurry to be used;

[0046] Step 2): coating the outside of the conductor with a layer of insulating material, curing, and forming an insulating layer on the outside of the conductor, thereby obtaining a semi-finished electronic wire;

[0047] Step 3): Coat the outer surface of the semi-finished electronic wire with the shielding slurry prepared in step 1), and heat and cure until the volume resistivity of the shielding layer is less than 1*10 -3 Ω·m, thus obtaining electron wire.

[0048] Example 3

[0049] A shielding slurry comprises the following raw materials in parts by weight: 16.5 g of single-component silicone rubber, 1.1 g of a platinum catalyst with a concentration of 5000 ppm, 3.3 g of hydrophobic fumed silica, 11 g of a diluent-heptane, and 49.5 g of linear silver powder.

[0050] An electronic wire is prepared by the following method:

[0051] Step 1): Preparation of shielding slurry: Mix the four materials of single-component silicone rubber, platinum catalyst, diluent heptane, and hydrophobic fumed silica evenly until there is no dry powder, and then grind them in a three-roll grinder. The grinding process is: 50μm-40μm-350rpm, 30μm-20μm-350rpm, 10μm-5μm-350rpm, 2μm-1μm-350rpm, 2μm-1μm-350rpm, 2 After six grindings at 50 μm-40 μm-350 rpm, 30 μm-20 μm-350 rpm, 10 μm-5 μm-350 rpm, 3 μm-2 μm-350 rpm, 30 μm-20 μm-350 rpm, loose rolling-tight rolling-loose rolling, a total of five grindings were performed to obtain the shielding slurry to be used;

[0052] Step 2): coating the outside of the conductor with a layer of insulating material, curing, and forming an insulating layer on the outside of the conductor, thereby obtaining a semi-finished electronic wire;

[0053] Step 3): Coat the outer surface of the semi-finished electronic wire with the shielding slurry prepared in step 1), and heat and cure until the volume resistivity of the shielding layer is less than 1*10 -3 Ω·m, thus obtaining electron wire.

[0054] Transmission performance test of electronic wire:

[0055] Two strands of the electronic wire prepared in Example 1 were twisted to obtain an electronic wire twisted pair. The electronic wire twisted pair was tested for different signals. The results are shown in Tables 1 and 2. Figure 1-Figure 4 shown.

[0056] Table 1 High frequency test of twisted pair cable - USB2.0 signal

[0057]

[0058] Table 2 High frequency test of electronic twisted pair - EDP signal

[0059]

[0060] Table 1-2 Figure 1-4 The test results of the transmission quality of the electronic twisted pair are shown in Table 1. Figure 1-2 The test results of USB2.0 signals of electronic twisted pair cables are shown in Table 1. Figure 1-2As shown, the impedance of the electronic twisted pair (TDD11) is 83.969 at the maximum and 80.514 at the minimum, both within the standard impedance (85±10%); the impedance of the electronic twisted pair (TDD22) is 89.861 at the maximum and 83.919 at the minimum, both within the standard impedance (85±10%). The attenuation of the electronic twisted pair at 200MHz and 400MHz also meets the attenuation requirements of the USB2.0 signal of the current electronic twisted pair. Figure 1-2 In the test, the impedance waveform of the USB2.0 signal of the twisted pair cable is stable.

[0061] Among them, TDD11 and TDD22 are usually used to describe the test signal channel. TDD11 represents the forward differential impedance distribution of the channel that is exactly the same as TDD22, while TDD22 represents the reverse differential impedance distribution.

[0062] Table 2 Figure 3-4 The test results of the EDP signal of the electronic twisted pair are shown in Table 2. The maximum impedance of the electronic twisted pair (TDD11) is 87.703 and the minimum is 80.852. The maximum impedance of the electronic twisted pair (TDD22) is 92.172 and the minimum is 86.650, which are in line with the standard impedance (85±10%). The echo of the electronic twisted pair at 1.35G, 2.7G, 4.05G, and 8.1G all meet the current echo requirements of the EDP signal of the electronic twisted pair. Figure 3-4 It can be seen from Table 1 and Table 2 that the electronic wire twisted pair prepared in Example 1 of the present application can simultaneously meet the test of USB2.0 signal and EDP signal, and the transmission quality of the electronic wire twisted pair is significantly better than that of the traditional electronic wire twisted pair. Figure 1-4 It can be seen that the electronic wire twisted pair has excellent characteristic impedance stability.

[0063] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0064] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0065] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An electronic wire, comprising a conductor and an insulating layer wrapped around the conductor, characterized in that: It also includes a shielding layer wrapped around the outside of the insulating layer. The shielding layer is made of shielding slurry, and the shielding slurry is composed of the following raw materials in parts by weight: 13.5 to 16.5 parts of resin, 49.5 to 60.5 parts of conductive powder, 0.9 to 1.1 parts of catalyst, and 9 to 11 parts of diluent.

2. The electronic wire according to claim 1, characterized in that: The shielding layer is prepared by the following method: the raw materials constituting the shielding slurry are mixed and dispersed according to the weight ratio, and heated and cured until the volume resistivity of the obtained shielding layer is less than 1×10 -3 Ω·m.

3. The electronic wire according to claim 2, characterized in that: The curing temperature during the heating curing is 170-190° C., and the curing time is ≤60 min.

4. The electronic wire according to claim 1, characterized in that: The shielding slurry also includes 2.7 to 3.3 parts by weight of a reinforcing agent.

5. The electronic wire according to claim 4, characterized in that: The resin is a single-component silicone rubber or a two-component silicone rubber; The conductive powder is a mixture of any one or more of silver powder, copper powder, nickel powder, aluminum powder, silver-coated copper powder, silver-coated aluminum powder, nickel-coated graphite powder, carbon black, graphene and carbon nanotube powder; The catalyst is a platinum catalyst; The reinforcing agent is hydrophobic fumed silica; The diluent is one or a mixture of an alkane solvent and an aromatic hydrocarbon solvent.

6. The electronic wire according to claim 5, characterized in that: The conductive powder may be in any one of a spherical powder, a quasi-spherical powder, a flaky powder and a linear powder.

7. The electronic wire according to claim 6, characterized in that: The Dmax diameter of flake powder is less than 30μm, 5μm<flake thickness<10μm; the Dmax diameter of spherical powder and quasi-spherical powder is less than 25μm; the diameter of linear powder is less than 2μm, the length is less than 50μm, and the aspect ratio is greater than 25.

8. The electronic wire according to claim 5, characterized in that: The platinum catalyst concentration is 1000-5000 ppm.

9. The electronic wire according to claim 5, characterized in that: The particle size of the hydrophobic fumed silica is less than 20 nm, and the specific surface area is greater than 150 m 2 / g.

10. The electronic wire according to claim 5, characterized in that: The alkane solvent is a mixture of any one or more of heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane and pentadecane; the aromatic hydrocarbon solvent is a mixture of any one or more of toluene, o-xylene, m-xylene and p-xylene.

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