Second-generation high temperature superconducting tape composite structure and method of making

Abstract

The application provides a second-generation high-temperature superconducting tape composite structure and a preparation method thereof, which comprises two second-generation high-temperature superconducting tapes and an indium foil, the outer surfaces of the two second-generation high-temperature superconducting tapes are each coated with a silver layer; the indium foil is arranged between the two second-generation high-temperature superconducting tapes, and the two second-generation high-temperature superconducting tapes and the indium foil are combined and connected to form a silver-indium alloy layer as an intermediate layer and the two second-generation high-temperature superconducting tapes respectively located on the two sides of the intermediate layer. The application forms a current shunt structure by arranging the silver-indium alloy layer, the thickness ratio of the silver layer on one side of the superconducting layer and the silver layer on one side of the metal-based tape, and the full-coating silver layer on the side surface, the current flows through the silver layer on the side surface when the tape loses superconductivity, propagates along a long current propagation path, and increases heat generation, thereby improving the superconductivity propagation speed and protecting the superconducting tape. The second-generation high-temperature superconducting tape prepared by the preparation method of the application has a superconductivity propagation speed of not less than 130 cm / s under the condition of 70 A, which is 5-8 times higher than that of other second-generation high-temperature superconducting tapes.

Description

Technical Field

[0001] This invention relates to the field of superconducting materials technology, specifically to a second-generation high-temperature superconducting tape composite structure and its preparation method. Background Technology

[0002] Second-generation high-temperature superconducting tapes have advantages such as high transition temperature, high irreversible field, and high current carrying capacity, and are widely used in fields such as power, magnets, and metallurgy.

[0003] The critical current of second-generation high-temperature superconducting tapes is unevenly distributed along its length, exhibiting fluctuations of 10–20%. During the complex service life of these tapes, changes in stress and temperature significantly affect their critical current, potentially causing the operating current to approach or exceed the tape's critical current. This leads to localized quenching in the second-generation high-temperature superconducting tape. If the quenching is not detected and addressed promptly, the temperature in the quenched area will rise sharply, causing irreversible damage to the superconducting tape. This area that experiences quenching first is called a hot spot. The quenching propagation speed of the superconducting tape determines the detection time; increasing the quenching propagation speed can shorten the time from quenching to a decrease in operating current, thus protecting the superconducting tape.

[0004] Furthermore, in existing superconducting tape products, the superconducting layer is typically not located in the geometric neutral layer of the tape. Because the intrinsic property of superconducting materials is tensile sensitivity, the critical bending performance of superconducting tapes differs between the inner and outer sides of the superconducting layer. Existing second-generation high-temperature superconducting tapes have an outer bending diameter of approximately 7 mm and an inner bending diameter of approximately 3 mm, which limits their practical engineering applications. Adjusting the position of the neutral layer in superconducting tapes, placing it near the neutral layer, can improve the critical bending performance of the superconducting tapes. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a second-generation high-temperature superconducting tape composite structure and its preparation method.

[0006] The second-generation high-temperature superconducting tape composite structure provided by the present invention includes two second-generation high-temperature superconducting tapes to be composited and an indium foil, wherein the outer surfaces of the two second-generation high-temperature superconducting tapes to be composited are coated with a silver layer.

[0007] The indium foil is disposed between the two second-generation high-temperature superconducting tapes to be composited, and the two second-generation high-temperature superconducting tapes to be composited are connected to the indium foil to form a silver-indium alloy layer as an intermediate layer and two composite second-generation high-temperature superconducting tapes located on both sides of the intermediate layer.

[0008] Preferably, the two composite second-generation high-temperature superconducting strips are symmetrically arranged on both sides of the silver-indium alloy layer.

[0009] Preferably, the second-generation high-temperature superconducting tape to be composited is connected to the indium foil by ultrasonic welding.

[0010] Preferably, the composite second-generation high-temperature superconducting tape includes a superconducting layer and a metal substrate stacked together, wherein the superconducting layer is disposed on the side of the metal substrate close to the silver-indium alloy layer;

[0011] The composite second-generation high-temperature superconducting tape is covered with a silver layer on all four sides, and the silver layers on one side of the superconducting layer of the two composite second-generation high-temperature superconducting tapes are connected by a silver-indium alloy layer.

[0012] Preferably, a transition layer is provided between the superconducting layer and the metal substrate.

[0013] Preferably, the thickness ratio between the silver layer between the superconducting layer and the silver-indium alloy layer and the silver layer covering the side of the metal substrate away from the superconducting layer is 0.01-0.2.

[0014] Preferably, the silver layer on the outer surface of the second-generation high-temperature superconducting tape to be composited is deposited using a multi-pass roll-to-roll technique, with the outermost pass on the left and the outermost pass on the right having angles of 15-30° and -15-30° with the target plane, respectively.

[0015] Preferably, the side of the second-generation high-temperature superconducting tape to be composited is completely covered by a silver layer with no exposed parts, and the thickness of the silver layer on the side is 10-100 nm.

[0016] The method for preparing the second-generation high-temperature superconducting tape composite structure according to the present invention includes the following steps:

[0017] Step S1: Select indium foil of appropriate specifications according to the specifications of the second-generation high-temperature superconducting tape to be composited;

[0018] Step S2: Arrange the two second-generation high-temperature superconducting tapes to be composited on the upper and lower sides of the indium foil, respectively;

[0019] Step S3: Using a roll-to-roll pre-composite process, two second-generation high-temperature superconducting tapes to be composited and indium foil are simultaneously passed through a pressure device to form a pre-composite second-generation high-temperature superconducting tape.

[0020] Step S4: Using a roll-to-roll composite process, the pre-composite second-generation high-temperature superconducting tape is formed into a second-generation high-temperature superconducting tape composite structure by ultrasonic welding device.

[0021] Preferably, in step S1, the thickness of the second-generation high-temperature superconducting tape to be composited is 20-150 μm and the width is 2-12 mm;

[0022] In the composite second-generation high-temperature superconducting tape, the thickness of the silver layer on the superconducting layer side and the thickness of the silver layer on the metal substrate side are both 1-2 μm, and the difference in the thickness of the silver layer on the superconducting layer side of the two composite second-generation high-temperature superconducting tapes is -100-100 nm.

[0023] The indium foil is 0.5-1.0 μm thicker than the silver layer on one side of the superconducting layer of the second-generation high-temperature superconducting tape to be composited, and 0.01-0.1 mm narrower than the second-generation high-temperature superconducting tape to be composited.

[0024] In step S2, the silver layer and indium foil are positioned opposite each other on the side of the second-generation high-temperature superconducting tape to be composited, which is closer to the superconducting layer.

[0025] In step S3, a tension of 2-7N is applied to the composite second-generation high-temperature superconducting tape, while no tension is applied to the indium foil. The pressure device uses a roller pressure head with a pressure of 2-4 bar. Slits are installed at the front and back of the pressure device, and the width of the slits is 0.001-0.01 mm wider than the composite second-generation high-temperature superconducting tape.

[0026] In step S4, the ultrasonic welding device uses a roller pressure head, the ultrasonic welding amplitude is 30%-50%, the pressure is 3-5 bar, and the conveyor speed of the roll-to-roll device is 10-100 m / h.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. This invention forms a current shunt structure by setting a silver-indium alloy layer, a silver layer thickness ratio on one side of the superconducting layer to that on the metal substrate side, and a fully covered silver layer on the side. When the tape loses quench, the current flows through the side silver layer and along the long current propagation path, increasing heat generation and thus improving the quench propagation speed, thereby protecting the superconducting tape. The second-generation high-temperature superconducting tape prepared by the preparation method described in this invention has a quench propagation speed of not less than 130 cm / s, which is 5 to 8 times higher than other second-generation high-temperature superconducting tapes.

[0029] 2. This invention reduces the strain of the superconducting layer when the superconducting tape is bent by adjusting the position of the superconducting layer closer to the neutral layer of the superconducting tape, thereby reducing the critical bending diameter of the superconducting tape and improving its critical bending performance. The two superconducting layers in the composite superconducting tape are symmetrically distributed, so that the superconducting tape has the same bending performance on both sides, which is beneficial to the application of the superconducting tape. Its critical bending diameter on both sides does not exceed 1.5 mm, which is more than 50% smaller than other second-generation high-temperature superconducting tapes. Attached Figure Description

[0030] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0031] Figure 1 This is a schematic cross-sectional view of the second-generation high-temperature superconducting tape after composite processing in this invention.

[0032] Figure 2 The quench propagation velocity of existing second-generation high-temperature superconducting tapes under different currents.

[0033] Figure 3 This is a graph showing the relationship between current and quench propagation velocity in Example 1 of the composite structure and preparation method of a second-generation high-temperature superconducting tape according to the present invention.

[0034] The diagram shows:

[0035] Silver layer 1, transition layer 4

[0036] Silver-indium alloy layer 2 Metal base band 5

[0037] Superconducting layer 3 Detailed Implementation

[0038] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the scope of protection of the present invention.

[0039] This invention discloses a second-generation high-temperature superconducting tape composite structure and its preparation method. The second-generation high-temperature superconducting tape prepared by the method provided by this invention forms a current shunt structure by setting a silver-indium alloy layer, adjusting the thickness ratio of the silver layer on the superconducting layer side to the silver layer on the metal substrate side, and fully covering the side with a silver layer. This results in a quench propagation velocity of not less than 130 cm / s, which is 5 to 8 times higher than other second-generation high-temperature superconducting tapes. By adjusting the position of the superconducting layer to be close to the neutral layer of the superconducting tape, its critical bending diameter does not exceed 1.5 mm, which is more than 50% smaller than other second-generation high-temperature superconducting tapes.

[0040] The second-generation high-temperature superconducting tape composite structure provided by the present invention includes a first second-generation high-temperature superconducting tape to be composited, an indium foil, and a second second-generation high-temperature superconducting tape to be composited. The outer surfaces of both second-generation high-temperature superconducting tapes are coated with a silver layer. The indium foil is disposed between the two second-generation high-temperature superconducting tapes. The three components are connected by ultrasonic welding. Figure 1 As shown, the composite second-generation high-temperature superconducting tape is formed with an Ag2In layer disposed between the two composite second-generation high-temperature superconducting tapes.

[0041] The structure of the second-generation high-temperature superconducting tape to be composited consists of silver, a superconducting layer, a transition layer, a metal substrate, and silver again. The silver layer on the surface of the second-generation high-temperature superconducting tape to be composited is deposited using an improved multi-pass roll-to-roll technique. The angles between the outermost pass on the left and the outermost pass on the right and the target plane are 15-30° and -15-30°, respectively. The sides of the second-generation high-temperature superconducting tape to be composited are completely covered by the silver layer, with no exposed parts. The thickness of the silver layer on the sides is 10-100 nm.

[0042] Two composite second-generation high-temperature superconducting tapes are symmetrically arranged on both sides of the silver-indium alloy layer 2. The second-generation high-temperature superconducting tape includes a superconducting layer 3 and a metal substrate 5 stacked together. The superconducting layer 3 is disposed on the side of the metal substrate 5 closest to the silver-indium alloy layer 2. The composite second-generation high-temperature superconducting tape is surrounded by a silver layer 1. The silver layer 1 on the superconducting layer 3 side of the two composite second-generation high-temperature superconducting tapes is connected by the silver-indium alloy layer 2. A transition layer 4 is disposed between the superconducting layer 3 and the metal substrate 5. The thickness ratio of the silver layer 1 on the superconducting layer 3 side to the silver layer 2 on the metal substrate 5 side of the composite second-generation high-temperature superconducting tape is 0.01-0.2.

[0043] The present invention provides a method for preparing a second-generation high-temperature superconducting tape composite structure, which is used to prepare the above-mentioned second-generation high-temperature superconducting tape composite structure, and specifically includes the following steps:

[0044] Step S1: Select indium foil of appropriate specifications according to the specifications of the second-generation high-temperature superconducting tape to be composited;

[0045] Step S2: Arrange the first second-generation high-temperature superconducting tape to be composited, the indium foil, and the second second-generation high-temperature superconducting tape to be composited in a certain order;

[0046] Step S3: Using a roll-to-roll pre-composite process, the first second-generation high-temperature superconducting tape to be composited, the indium foil, and the second second-generation high-temperature superconducting tape to be composited are simultaneously formed into a second-generation high-temperature superconducting tape pre-composite structure through a pressure device.

[0047] Step S4: Using a roll-to-roll composite process, the pre-composite second-generation high-temperature superconducting tape is formed into a second-generation high-temperature superconducting tape composite structure by ultrasonic welding device.

[0048] In step S1, the thickness of the second-generation high-temperature superconducting tape to be composited is 20-150 μm, the width is 2-12 mm, the thickness of the silver layer on the superconducting layer side and the thickness of the silver layer on the base band side are both 1-2 μm, and the difference in the thickness of the silver layer on the superconducting layer side between the first and second second-generation high-temperature superconducting tapes to be composited is -100-100 nm; the thickness of the indium foil is 0.5-1.0 μm thicker than the thickness of the silver layer on the superconducting layer side of the second-generation high-temperature superconducting tape to be composited, and the width is 0.01-0.1 mm narrower than the second-generation high-temperature superconducting tape to be composited.

[0049] In step S2, the silver layer and indium foil of the second-generation high-temperature superconducting tape to be composited are opposite each other, close to the superconducting layer.

[0050] In step S3, a tension of 2-7 N is applied to the composite second-generation high-temperature superconducting tape, while no tension is applied to the indium foil. The pressure device uses a roller pressure head with a pressure of 2-4 bar. Slits are installed at both ends of the pressure device, and the slit width is 0.001-0.01 mm wider than the composite second-generation high-temperature superconducting tape.

[0051] In step S4, the ultrasonic welding device uses a roller pressure head, the ultrasonic welding amplitude is 30%-50%, and the pressure is 3-5 bar; the conveyor speed of the roll-to-roll device is 10-100 m / h.

[0052] Example 1

[0053] This embodiment provides a composite structure and preparation method for a second-generation high-temperature superconducting tape, including the following steps:

[0054] Step S1: The silver layer of the second-generation high-temperature superconducting tape to be composited has a thickness of 1.5μm and a width of 4.2mm, and the indium foil has a thickness of 2.2μm and a width of 4.15mm.

[0055] Step S2: Arrange the two second-generation high-temperature superconducting tapes to be composited on the upper and lower sides of the indium foil, respectively. The silver layer 1 of the second-generation high-temperature superconducting tapes to be composited is opposite to the indium foil on the side of the superconducting layer 3.

[0056] Step S3: Using a roll-to-roll pre-composite process, a tension of 5N is applied to the second-generation high-temperature superconducting tape to be composited, while no tension is applied to the indium foil. The first second-generation high-temperature superconducting tape to be composited, the indium foil, and the second second-generation high-temperature superconducting tape to be composited are simultaneously passed through a pressure device to form a pre-composite structure of the second-generation high-temperature superconducting tape. The pressure device uses a roller pressure head with a pressure of 3 bar. Slits with a width of 4.005 mm are installed before and after the pressure device.

[0057] Step S4: Using a roll-to-roll composite process, at a conveyor speed of 60 m / h, the pre-composite second-generation high-temperature superconducting tape is formed into a second-generation high-temperature superconducting tape composite structure through an ultrasonic welding device. The ultrasonic welding device uses a roller indenter with an amplitude of 40% and a pressure of 4 bar.

[0058] Figure 3 This is a graph showing the relationship between quench propagation velocity and current in Example 1 of the composite structure and preparation method of a second-generation high-temperature superconducting tape according to the present invention. Figure 3 As shown, the horizontal axis represents the current, and the vertical axis represents the quench propagation velocity. The second-generation high-temperature superconducting tape prepared using the above method exhibits a quench propagation velocity of 138 cm / s at 70 A.

[0059] Example 2

[0060] This embodiment provides a composite structure and preparation method for a second-generation high-temperature superconducting tape, including the following steps:

[0061] Step S1: The silver layer of the second-generation high-temperature superconducting tape to be composited has a thickness of 2μm and a width of 12mm, and the indium foil has a thickness of 3μm and a width of 11.9mm.

[0062] Step S2: Arrange the two second-generation high-temperature superconducting tapes to be composited on the upper and lower sides of the indium foil, respectively. The silver layer 1 of the second-generation high-temperature superconducting tapes to be composited is opposite to the indium foil on the side of the superconducting layer 3.

[0063] Step S3: Using a roll-to-roll pre-composite process, a tension of 7N is applied to the second-generation high-temperature superconducting tape to be composited, while no tension is applied to the indium foil. The first second-generation high-temperature superconducting tape to be composited, the indium foil, and the second second-generation high-temperature superconducting tape to be composited are simultaneously passed through a pressure device to form a pre-composite structure of the second-generation high-temperature superconducting tape. The pressure device uses a roller pressure head with a pressure of 4 bar. Slits with a width of 12.01 mm are installed before and after the pressure device.

[0064] Step S4: Using a roll-to-roll composite process, at a conveyor speed of 100 m / h, the pre-composite second-generation high-temperature superconducting tape is formed into a second-generation high-temperature superconducting tape composite structure through an ultrasonic welding device. The ultrasonic welding device uses a roller indenter with an amplitude of 50% and a pressure of 5 bar.

[0065] The second-generation high-temperature superconducting tape prepared by the above method has a quench propagation velocity of 135 cm / s at 70 A.

[0066] Example 3

[0067] This embodiment provides a composite structure and preparation method for a second-generation high-temperature superconducting tape, including the following steps:

[0068] Step S1: The silver layer of the second-generation high-temperature superconducting tape to be composited has a thickness of 1μm and a width of 2mm, and the indium foil has a thickness of 1.5μm and a width of 1.99mm.

[0069] Step S2: Arrange the two second-generation high-temperature superconducting tapes to be composited on the upper and lower sides of the indium foil, respectively. The silver layer 1 of the second-generation high-temperature superconducting tapes to be composited is opposite to the indium foil on the side of the superconducting layer 3.

[0070] Step S3: Using a roll-to-roll pre-composite process, a 2N tension is applied to the second-generation high-temperature superconducting tape to be composited, while no tension is applied to the indium foil. The first second-generation high-temperature superconducting tape to be composited, the indium foil, and the second second-generation high-temperature superconducting tape to be composited are simultaneously passed through a pressure device to form a pre-composite structure of the second-generation high-temperature superconducting tape. The pressure device uses a roller pressure head with a pressure of 2 bar. Slits with a width of 2.001 mm are installed before and after the pressure device.

[0071] Step S4: Using a roll-to-roll composite process, at a conveyor speed of 10 m / h, the pre-composite second-generation high-temperature superconducting tape is formed into a second-generation high-temperature superconducting tape composite structure through an ultrasonic welding device. The ultrasonic welding device uses a roller indenter with an amplitude of 30% and a pressure of 3 bar.

[0072] The second-generation high-temperature superconducting tape prepared by the above method has a quench propagation velocity of 140 cm / s at 70 A.

[0073] Comparative Example 1

[0074] The difference between Comparative Example 1 and Example 1 is that the superconducting tape in Comparative Example 1 is not composited. The second-generation high-temperature superconducting tape prepared by the above method has a quench propagation velocity of 10.1 cm / s at 70 A.

[0075] Comparative Example 2

[0076] The difference between Comparative Example 2 and Example 1 is that the superconducting tape in Comparative Example 2 is not coated with a silver layer. The second-generation high-temperature superconducting tape prepared by the above method has a quench propagation velocity of 17.3 cm / s at 70 A.

[0077] Comparative Example 3

[0078] The difference between Comparative Example 3 and Example 1 is that the silver layer thickness of the superconducting tape in Comparative Example 3 is 3 μm, and the indium foil thickness is 2 μm. Otherwise, all other steps are the same as in Example 1. The second-generation high-temperature superconducting tape prepared using the above method exhibits a quench propagation velocity of 13.6 cm / s at 70 A.

[0079] Comparative Example 4

[0080] The difference between Comparative Example 4 and Example 1 is that the silver layer thickness of the first superconducting tape to be composited in Comparative Example 4 is 1.4 μm, and the silver layer thickness of the second superconducting tape to be composited is 1.6 μm. Otherwise, all other steps are the same as in Example 1. The second-generation high-temperature superconducting tape prepared using the above method exhibits a quench propagation velocity of 41.8 cm / s at 70 A.

[0081] Comparative Example 5

[0082] The difference between Comparative Example 5 and Example 1 is that in step S3 of Comparative Example 5, a tension of 3N is applied to the indium foil. Apart from this, the remaining steps are the same as in Example 1. The second-generation high-temperature superconducting tape prepared using the above method will experience indium foil breakage, making it impossible to prepare a second-generation high-temperature superconducting tape.

[0083] In summary, the present invention, by employing the aforementioned composite structure and preparation method of the second-generation high-temperature superconducting tape, can significantly improve the quench propagation speed of the second-generation high-temperature superconducting tape.

[0084] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0085] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A second-generation high temperature superconducting tape composite structure, characterized by, It includes two second-generation high-temperature superconducting tapes to be composited with indium foil, and the outer surfaces of the two second-generation high-temperature superconducting tapes to be composited are coated with a silver layer. The indium foil is disposed between two second-generation high-temperature superconducting tapes to be composited, and the two second-generation high-temperature superconducting tapes to be composited are connected with the indium foil to form a silver-indium alloy layer (2) as an intermediate layer and two composite second-generation high-temperature superconducting tapes located on both sides of the intermediate layer respectively. Two composite second-generation high-temperature superconducting strips are symmetrically arranged on both sides of the silver-indium alloy layer (2); The composite second-generation high-temperature superconducting tape includes a superconducting layer (3) and a metal substrate (5) arranged in layers. The superconducting layer (3) is disposed on the side of the metal substrate (5) close to the silver-indium alloy layer (2). The composite second-generation high-temperature superconducting tape is covered with a silver layer (1) on all four sides. The silver layer (1) on one side of the superconducting layer (3) of the two composite second-generation high-temperature superconducting tapes is connected by a silver-indium alloy layer (2).

2. The second-generation high-temperature superconducting tape composite structure according to claim 1, characterized in that, The second-generation high-temperature superconducting tape to be composited is connected to the indium foil by ultrasonic welding.

3. The second-generation high-temperature superconducting tape composite structure according to claim 1, characterized in that, A transition layer (4) is provided between the superconducting layer (3) and the metal substrate (5).

4. The second-generation high-temperature superconducting tape composite structure according to claim 1, characterized in that, The thickness ratio between the silver layer (1) between the superconducting layer (3) and the silver-indium alloy layer (2) and the silver layer (1) covering the side of the metal substrate (5) away from the superconducting layer (3) is 0.01-0.

2.

5. The second-generation high-temperature superconducting tape composite structure according to claim 1, characterized in that, The silver layer on the outer surface of the second-generation high-temperature superconducting tape to be composited is deposited using a multi-roll-to-roll technique, with the outermost left and right lanes having angles of 15-30° and -15-30° with the target plane, respectively.

6. The second-generation high-temperature superconducting tape composite structure according to claim 1, characterized in that, The side of the second-generation high-temperature superconducting tape to be composited is completely covered by a silver layer with no exposed parts, and the thickness of the silver layer on the side is 10~100nm.

7. A method for preparing a second-generation high-temperature superconducting tape composite structure, characterized in that, The method for preparing the second-generation high-temperature superconducting tape composite structure according to any one of claims 1-6 comprises the following steps: Step S1: Select indium foil of appropriate specifications according to the specifications of the second-generation high-temperature superconducting tape to be composited; Step S2: Arrange the two second-generation high-temperature superconducting tapes to be composited on the upper and lower sides of the indium foil, respectively; Step S3: Using a roll-to-roll pre-composite process, two second-generation high-temperature superconducting tapes to be composited and indium foil are simultaneously passed through a pressure device to form a pre-composite second-generation high-temperature superconducting tape. Step S4: Using a roll-to-roll composite process, the pre-composite second-generation high-temperature superconducting tape is formed into a second-generation high-temperature superconducting tape composite structure by ultrasonic welding device.

8. The method for preparing the second-generation high-temperature superconducting tape composite structure according to claim 7, characterized in that, In step S1, the thickness of the composite second-generation high-temperature superconducting tape is 20-150 μm and the width is 2-12 mm. In the composite second-generation high-temperature superconducting tape, the thickness of the silver layer (1) on one side of the superconducting layer (3) and the thickness of the silver layer (1) on one side of the metal substrate (5) are both 1-2 μm, and the thickness difference of the silver layer (1) on one side of the superconducting layer (3) of the two composite second-generation high-temperature superconducting tapes is -100-100 nm. The indium foil is 0.5-1.0 μm thicker than the silver layer (1) on one side of the superconducting layer (3) of the second-generation high-temperature superconducting tape to be composited, and its width is 0.01-0.1 mm narrower than that of the second-generation high-temperature superconducting tape to be composited. In step S2, the silver layer (1) of the second-generation high-temperature superconducting tape to be composited is opposite to the indium foil on the side close to the superconducting layer (3); In step S3, a tension of 2-7N is applied to the composite second-generation high-temperature superconducting tape, while no tension is applied to the indium foil. The pressure device uses a roller pressure head with a pressure of 2-4 bar. Slits are installed at the front and back of the pressure device, and the width of the slits is 0.001-0.01 mm wider than the composite second-generation high-temperature superconducting tape. In step S4, the ultrasonic welding device uses a roller pressure head, the ultrasonic welding amplitude is 30%-50%, the pressure is 3-5 bar, and the belt speed of the roll-to-roll device is 10-100 m / h.

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