Position calibration device and semiconductor process equipment

By setting light curtain components and controllers in the process chamber of the semiconductor process equipment, and using calibration light to determine the position information of the workpiece and the robot, the problem of low position calibration accuracy of the workpiece and the robot in the semiconductor process equipment is solved, and high-precision position calibration and workpiece transmission are achieved.

CN119812078AActive Publication Date: 2025-04-11BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202311302649.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-10-09
Publication Date
2025-04-11
Estimated Expiration
2043-10-09

AI Technical Summary

Technical Problem

During the etching or deposition process of semiconductor process equipment, high-precision position calibration and precise position determination of the robot are required to ensure the correct placement and transmission of the workpiece. The prior art is difficult to effectively solve the problem of positional offset of workpieces in the process chamber and position calibration accuracy of the robot.

Method used

A position calibration device is used, including first and second light curtain components arranged in the process chamber, and a controller. The calibrated light is emitted and received by the first and second light curtain components to obtain a projection of the workpiece and the robot based on which the controller determines the position information of the workpiece and the robot.

Benefits of technology

High-precision calibration of the position of the workpiece and the robot is achieved, ensuring the correct placement and transmission of the workpiece in the process chamber, solving the problems of workpiece offset and inaccurate position of the robot, and systematically solving the problems of sticking and jumping of the piece.

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Abstract

The invention provides a position calibration device and semiconductor process equipment. The position calibration device comprises a first light curtain assembly arranged in a process chamber of the semiconductor process equipment; the first light curtain assembly comprises a first light curtain transmitting end, a first light curtain receiving end, a second light curtain transmitting end and a second light curtain receiving end which are located on a first plane, the first light curtain transmitting end is used for transmitting first calibration light to a workpiece in the process chamber, and the first light curtain receiving end is used for receiving the first calibration light; obtaining a first projection of the workpiece at the receiving end of the first light curtain; the second light curtain transmitting end is used for transmitting second calibration light to the workpiece, and the second light curtain receiving end is used for receiving the second calibration light and obtaining a second projection of the workpiece on the second light curtain receiving end; the included angle between the first calibration light and the second calibration light in the first plane is greater than 0 degree; and the controller is used for determining position information of the workpiece according to the first projection and the second projection.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a position calibration device and semiconductor process equipment. Background Art

[0002] When semiconductor process equipment performs processing such as etching or deposition, it is necessary to place the wafer on a carrier in a vacuum process chamber. Moreover, in order to improve the processing quality of semiconductor process equipment, before the process, it is necessary to determine whether the wafer is accurately placed at the designated position of the carrier; after the process, the wafer needs to be transferred to the designated position of the next process, which places higher requirements on the transmission accuracy and position calibration accuracy of the wafer. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a position calibration device and a semiconductor process equipment.

[0004] To achieve the purpose of the present invention, a position calibration device is provided, which is applied to semiconductor process equipment, and includes: a first light curtain assembly arranged in a process chamber of the semiconductor process equipment;

[0005] The first light curtain assembly includes a first light curtain transmitting end, a first light curtain receiving end, a second light curtain transmitting end and a second light curtain receiving end located on a first plane.

[0006] The first light curtain transmitting end is used to transmit a first calibration light to the workpiece in the process chamber, and the first light curtain receiving end is used to receive the first calibration light and obtain a first projection of the workpiece at the first light curtain receiving end;

[0007] The second light curtain transmitting end is used to transmit a second calibration light to the workpiece, and the second light curtain receiving end is used to receive the second calibration light and obtain a second projection of the workpiece on the second light curtain receiving end; the angle between the first calibration light and the second calibration light in the first plane is greater than 0°;

[0008] A controller is used to determine position information of the workpiece according to the first projection and the second projection.

[0009] Wherein, determining the position information of the workpiece according to the first projection and the second projection includes:

[0010] determining a measured position of the workpiece along a first coordinate axis in a calibration coordinate system based on the first projection;

[0011] determining a measured position of a second coordinate axis of the workpiece in the calibration coordinate system based on the second projection;

[0012] The position information of the workpiece is determined according to the measured position of the first coordinate axis and the measured position of the second coordinate axis in the calibration coordinate system.

[0013] Wherein, the position calibration device further includes a second light curtain assembly, the second light curtain assembly includes a third light curtain transmitting end, a third light curtain receiving end, a fourth light curtain transmitting end and a fourth light curtain receiving end located in a second plane, and the second plane is located above the first plane;

[0014] The third light curtain emitting end is used to emit a third calibration light to the robot extending into the process chamber, and the third light curtain receiving end is used to receive the third calibration light and obtain a third projection of the robot on the third light curtain receiving end;

[0015] The fourth light curtain transmitting end is used to transmit a fourth calibration light to the manipulator, and the fourth light curtain receiving end is used to receive the fourth calibration light and obtain a fourth projection of the manipulator on the fourth light curtain receiving end; the angle between the third calibration light and the fourth calibration light in the second plane is greater than 0°;

[0016] The controller is further used to determine the position information of the manipulator according to the third projection and the fourth projection.

[0017] Wherein, the position information of the manipulator includes the horizontal offset and horizontality of the manipulator;

[0018] The determining the position information of the manipulator according to the third projection and the fourth projection comprises:

[0019] Determining a horizontal offset of the manipulator according to the third projection;

[0020] The horizontality of the robot is determined according to the fourth projection.

[0021] Wherein, determining the horizontal offset of the manipulator according to the third projection comprises:

[0022] determining a measurement position of a first designated point of the manipulator according to the third projection;

[0023] The horizontal offset of the manipulator is determined based on the measured position of the first designated point and a standard position corresponding to the first designated point.

[0024] Wherein, determining the horizontality of the manipulator according to the fourth projection includes:

[0025] determining the measurement positions of the second designated point and the third designated point of the manipulator according to the fourth projection;

[0026] Determine the position information of the second designated point based on the measured position of the second designated point of the manipulator and the standard position corresponding to the second designated point, and determine the position information of the third designated point based on the third designated point of the manipulator and the standard position corresponding to the third designated point;

[0027] The horizontality of the robot is determined according to the position information of the second designated point and the position information of the third designated point.

[0028] Wherein, the second designated point includes the first endpoint of the lower surface of the manipulator, and the third designated point includes the second endpoint of the lower surface of the manipulator; or, the second designated point includes the second endpoint of the lower surface of the manipulator, and the third designated point includes the first endpoint of the lower surface of the manipulator.

[0029] Wherein, the angle between the first calibration light and the extension direction of the manipulator on the first plane is 30-60°;

[0030] The angle between the second calibration light and the extension direction of the manipulator on the first plane is 120-150°;

[0031] The angle between the third calibration light and the extension direction of the manipulator on the second plane is 30-60°;

[0032] The included angle between the fourth calibration light and the extension and retraction direction of the manipulator on the second plane is 120-150°.

[0033] Wherein, the process chamber further comprises a film transfer port, and the robot enters and exits the process chamber through the film transfer port;

[0034] The position calibration device also includes a manipulator detection component, which is used to detect the extension and retraction amount of the manipulator;

[0035] The manipulator detection component includes a first sensor and a second sensor, the first sensor and the second sensor are arranged inside the film transmission port and opposite to each other, and the first sensor and the second sensor are on the second plane.

[0036] The first sensor includes a pressure sensor or a distance sensor; and the second sensor includes a pressure sensor or a distance sensor.

[0037] Wherein, the controller is also used for:

[0038] Acquiring a first measurement value of a first sensor and a first measurement value of a second sensor during the process of the robot arm extending toward the interior of the process chamber;

[0039] Determine the extension and retraction amount of the manipulator based on the first measurement value of the first sensor, the first measurement value of the second sensor, and the horizontal offset of the manipulator;

[0040] During the process of the manipulator rotating toward the first sensor, obtaining a second measurement value of the first sensor and a first rotation amount of the manipulator;

[0041] determining an adjustment amount of the manipulator in a first direction based on a first rotation amount of the manipulator and a second measurement value of the first sensor;

[0042] During the process of the manipulator rotating toward the second sensor, obtaining a second measurement value of the second sensor and a second rotation amount of the manipulator;

[0043] An adjustment amount of the manipulator in a second direction is determined based on a second rotation amount of the manipulator and a second measurement value of the second sensor.

[0044] Wherein, the illumination height of the first calibration light and the second calibration light is greater than 3 mm;

[0045] The illumination heights of the third calibration light and the fourth calibration light are greater than 8 mm.

[0046] Wherein, the controller is also used for:

[0047] When the ejector pin is in a raised state, based on whether the height difference of the ejector pins in the first projection and the second projection is within a preset height threshold range; the ejector pin is used to lift the workpiece and place it on the carrying surface of the carrying device carrying the workpiece;

[0048] When the height difference of the ejector pin is within the height threshold range and the height of the workpiece is consistent with the height of the ejector pin, it is determined that the workpiece is normal;

[0049] When the height difference of the ejector pin is within the height threshold range and the height of the workpiece is inconsistent with the height of the ejector pin, it is determined that the workpiece has skipped;

[0050] When the height difference of the ejector pins is not within the height threshold range, it is determined that the workpiece is stuck.

[0051] In order to achieve the purpose of the present invention, a semiconductor process equipment is also provided, including a position calibration device, and the position calibration device includes the position calibration device provided by an embodiment of the present invention.

[0052] The present invention has the following beneficial effects:

[0053] The position calibration device provided by the present invention is provided with a first light curtain assembly in a process chamber, the first light curtain assembly includes a first light curtain emitting end, a first light curtain receiving end, a second light curtain emitting end and a second light curtain receiving end located in a first plane, the first light curtain emitting end is used to emit a first calibration light to a workpiece in the process chamber, the first light curtain receiving end is used to receive the first calibration light and obtain a first projection of the workpiece at the first light curtain receiving end, the second light curtain emitting end is used to emit a second calibration light to the workpiece, the second light curtain receiving end is used to receive the second calibration light and obtain a second projection of the workpiece at the second light curtain receiving end; the angle between the first calibration light and the second calibration light in the first plane is greater than 0°, The controller is used to determine the position information of the workpiece according to the first projection and the second projection. Since the angle between the first calibration light and the second calibration light in the first plane is greater than 0°, the first projection and the second projection are obtained through the first light curtain receiving end and the second light curtain receiving end respectively. The controller can determine the position information of the workpiece according to the first projection and the second projection, and judge the state of the workpiece according to the position information of the workpiece. Before implementing the process, it can be judged whether the workpiece is offset during the descent process; after implementing the process, it can be judged whether the workpiece is in the focus ring. If the workpiece is offset or jumps relative to the focus ring, the robot can correct the workpiece when taking the film; or adjust the height of the ejector pin to make the workpiece slide into the focus ring. The controller can also judge whether the film sticks when the needle is raised through the first projection and the second projection. If the film sticks, the charge can be removed, thereby systematically solving the problems of film sticking and film jumping. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic top view of applying the position calibration device provided by an embodiment of the present invention to semiconductor process equipment;

[0055] Figure 2 A three-dimensional schematic diagram of applying the position calibration device provided by an embodiment of the present invention to semiconductor process equipment;

[0056] Figure 3 A schematic diagram of the structure of a semiconductor process equipment provided by an embodiment of the present invention;

[0057] Figure 4 is a schematic diagram of a workpiece on a first plane in an embodiment of the present invention;

[0058] Figure 5 A flow chart of a position calibration method provided by an embodiment of the present invention;

[0059] Figure 6 This is a projection schematic diagram of the first light curtain assembly in an embodiment of the present invention;

[0060] Figure 7A schematic diagram of calibrating the position of a workpiece using a standard coordinate system in an embodiment of the present invention;

[0061] Figure 8 A schematic diagram of calibrating the horizontal offset of a manipulator in an embodiment of the present invention;

[0062] Fig. 9 A schematic diagram of calibrating the horizontality of a manipulator in an embodiment of the present invention;

[0063] Fig.10 It is a projection schematic diagram of the second light curtain assembly in an embodiment of the present invention;

[0064] Fig.11 A schematic diagram of a workpiece skipping in an embodiment of the present invention;

[0065] Fig.12 It is a schematic diagram of workpiece adhesion in an embodiment of the present invention. DETAILED DESCRIPTION

[0066] In order to enable those skilled in the art to better understand the technical solution of the present invention, the position calibration device, position calibration method and semiconductor process equipment using the position calibration device provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0067] In order to facilitate the description of the position calibration device provided by the embodiment of the present invention, an actual application scenario is used as an example for introduction below, that is, the position calibration device is applied to semiconductor process equipment as an example. It should be noted that although the embodiment of the present invention takes the position calibration device applied to semiconductor process equipment as an example, it does not mean that the application scenario of the position calibration device provided by the embodiment of the present invention is limited. The position calibration device provided by the embodiment of the present invention can also be applied to other semiconductor processing equipment.

[0068] Figure 1 A schematic top view of applying the position calibration device provided by an embodiment of the present invention to a semiconductor process device, wherein the semiconductor process device may be, for example, a deposition device, an etching device, a heat treatment device, a cooling device, a degumming device, or a cleaning device, Figure 2 The present invention is a three-dimensional schematic diagram of applying the position calibration device provided by the embodiment of the present invention to semiconductor process equipment. Figure 1 and Figure 2 The semiconductor process equipment includes a process chamber 1 and a manipulator 2 for transferring a workpiece, and the workpiece may include a wafer, for example. The process chamber 1 is used to process the workpiece, and the manipulator 2 is used to transfer the workpiece, such as transferring the workpiece from outside the process chamber 1 to inside the process chamber 1, or transferring the workpiece from inside the process chamber 1 to outside the process chamber 1.

[0069] The manipulator 2 includes a manipulator arm 21 and a finger 22, wherein the finger 22 is disposed at the end of the manipulator 2 and is used to grasp a workpiece. One end of the manipulator arm 21 is connected to a driving component 23, and driven by the driving component 23, the manipulator arm 21 can translate in a first direction, translate in a second direction (perpendicular to the paper surface), and perform rotational motion on a rotation axis parallel to the first direction, wherein the first direction and the second direction are arranged vertically. The other end of the manipulator arm 21 is connected to the finger 22, and the finger 22 translates in the first direction, translates in the second direction, and performs rotational motion on a rotation axis parallel to the first direction with the manipulator arm 21.

[0070] In some embodiments, a film transfer port 11 is provided on the wall of the process chamber 1. When the gate valve of the film transfer port 11 is opened, the robot 2 can extend into the process chamber 1 through the film transfer port 11 to place a workpiece into the process chamber or take a workpiece out of the process chamber.

[0071] The process chamber 1 also includes a carrying device 4 for carrying a workpiece, and the carrying device 4 includes but is not limited to an electrostatic chuck, a vacuum adsorption chuck, a mechanical chuck, etc. In some embodiments, the carrying device 4 is arranged at the bottom of the process chamber 1, and the upper surface of the carrying device 4 serves as a carrying surface for carrying the workpiece. The film transfer port 11 is arranged on the side wall of the process chamber 1, and the first direction is a direction perpendicular to the side wall of the process chamber 1. The robot 2 extends into the process chamber 1 from the film transfer port 11, that is, the robot 2 extends into the process chamber 1 from the first direction and is located above the carrying device 4. The rotating axis of the robot 2 is parallel to the first direction, and the rotating axis of the robot 2 is perpendicular to the side wall of the process chamber 1. The robot 2 can also move up and down in the second direction to move the workpiece away from or close to the carrying device 4.

[0072] like Figure 1 , Figure 2 and Figure 4 As shown, the first plane in the embodiment of the present invention is the plane when processing the workpiece. The second plane refers to the top of the carrying device 4. The extension and retraction of the manipulator 2 can be measured by the extension amount R, and the rotation can be measured by the rotation amount δ. The height of the manipulator 2 in the process chamber can be obtained by the reference value (height value) BTO. The present application does not limit the BTO value. For example, the BTO value can be 3mm. When the workpiece is located in the standard position of the first plane, the ejector pin 44 rises to support the workpiece, the manipulator 2 withdraws from the process chamber, and the ejector pin 44 descends to place the workpiece on the carrying surface of the carrying device 4. Similarly, when the process is completed, the ejector pin 44 lifts the workpiece from the carrying device 4, the manipulator extends into the process chamber to support the workpiece, the ejector pin 44 descends, and the manipulator 2 withdraws from the process chamber to remove the workpiece.

[0073] Figure 3 A schematic diagram of the structure of a semiconductor process equipment provided by an embodiment of the present invention, Figure 4 A schematic diagram of a portion of the structure of a semiconductor process equipment provided by an embodiment of the present invention. Figure 3 and Figure 4 The carrying device 4 includes an electrostatic chuck 41 and a focusing ring 42. The focusing ring 42 is an annular structure and is arranged at the periphery of the carrying surface of the electrostatic chuck 41. When the electrostatic chuck 41 is in use, the workpiece is arranged on the carrying surface of the electrostatic chuck 41 and is located on the inner side of the focusing ring 42. After a voltage is applied to the electrostatic chuck 41, an adsorption force for adsorbing the workpiece is generated.

[0074] The ejector pin 44 can move upward and extend out of the bearing surface of the electrostatic chuck 41, that is, the top of the ejector pin 44 is higher than the bearing surface of the electrostatic chuck 41, or it can move downward and be lower than the bearing surface of the electrostatic chuck 41, that is, the top of the ejector pin 44 is lower than the bearing surface of the electrostatic chuck 41.

[0075] See also Figure 1-Figure 4 The position calibration device provided by the embodiment of the present invention includes: a first light curtain assembly 5 arranged in the process chamber 1, which is used to calibrate the position of the workpiece 3 on the first plane.

[0076] The first light curtain assembly 5 includes a first light curtain transmitting end 51, a first light curtain receiving end 52, a second light curtain transmitting end 53 and a second light curtain receiving end 54. The first light curtain transmitting end 51 is used to transmit the first calibration light to the workpiece in the process chamber 1, and the first light curtain receiving end 52 is used to receive the first calibration light and obtain the first projection of the workpiece 3 based on the sensed first standard light. Specifically, the first standard light blocked by the workpiece 3 cannot be sensed by the first light curtain receiving end 52, and the first standard light not blocked by the workpiece 3 can be sensed by the first light curtain receiving end 52. The first light curtain receiving end 52 can obtain the first projection of the workpiece 3 based on the sensed first standard light.

[0077] The second light curtain transmitting end 53 is used to transmit the second calibration light to the workpiece, and the second light curtain receiving end 54 is used to receive the second calibration light, and obtain the sensed second standard light to obtain the second projection of the workpiece 3 at the second light curtain receiving end. Specifically, the second standard light blocked by the workpiece 3 cannot be sensed by the second light curtain receiving end 54, and the second standard light not blocked by the workpiece 3 can be sensed by the second light curtain receiving end 54, and the second light curtain receiving end 54 can obtain the second projection of the workpiece 3 according to the sensed second standard light.

[0078] In the embodiment of the present invention, the angle between the first calibration light and the second calibration light in the plane where the first plane is located is greater than 0°, that is, the first calibration light and the second calibration light are not parallel lights. For example, the angle between the first calibration light and the second calibration light is 45° or 90° or other angles, that is, the first calibration light and the second calibration light are projected on the workpiece 3 from different angles, and the first projection and the second projection obtained are two projections of the workpiece at different angles. Compared with determining the position of the workpiece from one projection, determining the position information of the workpiece on the first plane based on the first projection and the second projection is more accurate.

[0079] The first projection and the second projection are obtained through the first light curtain receiving end and the second light curtain receiving end respectively. The controller can determine the position information of the workpiece according to the first projection and the second projection, and judge the state of the workpiece according to the position information of the workpiece. Before implementing the process, it can be judged whether the workpiece is offset during the descent process; after implementing the process, it can be judged whether the workpiece is in the focus ring. If the workpiece is offset or jumps relative to the focus ring, the robot can correct the workpiece when taking the film; or, the workpiece can be slid into the focus ring by adjusting the height of the ejector pin. The controller can also determine whether the film sticks when the needle is raised through the first projection and the second projection. If the film sticks, the charge can be removed, thereby systematically solving the problems of film sticking and film jumping. The health status of the ejector pin can also be judged according to the first projection and the second projection, that is, whether the top of the ejector pin is flush.

[0080] like Figure 2 As shown, the first light curtain emitting end 51 is arranged on the side of the film transmission port 11, and is on the first plane with the film transmission port 11. The angle between the first calibration light emitted by the first light curtain emitting end 51 and the extension and retraction direction of the manipulator 2 on the first plane is 30-60°, for example, the angle is 30°, 40°, 45°, 50°, 55° or 60°.

[0081] The angle between the second calibration light emitted by the second light curtain emitting end 53 and the projection of the extension and retraction direction of the manipulator 2 on the first plane is 120-150°, for example, the angle is 120°, 130°, 140° or 150°. When the angle between the first calibration light and the extension and retraction direction of the manipulator 2 on the first plane and the angle between the second calibration light and the projection of the extension and retraction direction of the manipulator 2 on the first plane are adjusted, the angle between the first calibration light and the second calibration light projected on the first plane can be made to be 90°, so as to more accurately determine the position of the workpiece 3 on the first plane, thereby facilitating the calibration of the position of the workpiece 3.

[0082] In some embodiments, the illumination heights of the first calibration light and the second calibration light are greater than 3 mm, that is, the illumination height of the first calibration light on the first light curtain receiving end 52 is greater than or equal to 3 mm, for example, the illumination height is 3 mm or 5 mm. The illumination height of the second calibration light on the second light curtain receiving end 54 is greater than or equal to 3 mm, for example, the illumination height is 3 mm or 5 mm.

[0083] The position of the workpiece on the first plane is calibrated using the first calibration light and the second calibration light. In practical applications, the workpiece may jump or stick. The first calibration light and the second calibration light can also be used to determine whether the workpiece jumps or sticks. For example, the verticality, horizontality, and height of the workpiece 3 are calibrated using the first calibration light and the second calibration light, so that the verticality, horizontality, and height of the workpiece are within a preset threshold range.

[0084] In some embodiments, the position of the workpiece in the first projection can be represented by a first coordinate system, and the position of the workpiece in the second projection can be represented by a second coordinate system. However, whether the position of the workpiece is in the preset position needs to be judged in a standard coordinate system in the first plane, so the position of the workpiece in the first coordinate system and the second coordinate system needs to be mapped to the standard coordinate system.

[0085] The position calibration device (not shown in the figure) also includes a controller, which is used to determine the measurement position of the workpiece in the first coordinate system based on the first projection, and determine the measurement position of the workpiece in the second coordinate system based on the second projection, and determine the measurement position of the workpiece in the calibration coordinate system based on the measurement position of the first coordinate system and the measurement position of the second coordinate system.

[0086] In some embodiments, the first coordinate system includes a first coordinate axis and a second coordinate axis, the second coordinate system includes a first coordinate axis and a second coordinate axis, the first coordinate axis of the first coordinate system and the first coordinate axis of the second coordinate system correspond to two coordinate axes of the calibration coordinate system respectively; the measurement position of the first coordinate system includes a first measurement position of the first coordinate axis in the first coordinate system, and the measurement position of the second coordinate system includes a first measurement position of the first coordinate axis in the second coordinate system.

[0087] This embodiment does not limit the position information of the workpiece. The position information of the workpiece can be either a relative position or an absolute position. When the position information of the workpiece is a relative position, the position information of the workpiece refers to the position information between the workpiece and the carrier. When the position information of the workpiece is an absolute position, the position information of the workpiece refers to the position information of the workpiece in the process chamber.

[0088] In some embodiments, determining the position information of the workpiece according to the first projection and the second projection includes: determining a measured position of the workpiece in the calibration coordinate system based on a first measured position of the first coordinate axis in the first coordinate system and a first measured position of the first coordinate axis in the second coordinate system.

[0089] For example, Figure 5 A flow chart of a position calibration method provided by an embodiment of the present invention. Figure 5 The step of calibrating the position of the workpiece on the first plane comprises:

[0090] Step S51 : determining a measurement position of a first coordinate axis of the workpiece in a calibration coordinate system based on the first projection.

[0091] See also Figure 6 , obtain a first projection of the workpiece (observed toward the light source side of the first calibration light), and represent the measurement position of the workpiece in the first projection according to the first coordinate system, wherein the first coordinate axis (horizontal axis) represents the position of the workpiece 3 in the first plane, and the second coordinate axis (vertical axis) represents the height of the workpiece 3. Based on the horizontal coordinate in the first projection, the measurement position of the workpiece in the first coordinate system can be determined.

[0092] The second measurement position of the second coordinate axis is the height of the workpiece. Based on the height of the workpiece, it can be determined whether the workpiece has sheet jumping and sheet sticking phenomena. The height of the ejector pin can also be determined to calibrate the height of the ejector pin.

[0093] Step S52: determining a measurement position of the workpiece along a second coordinate axis in the calibration coordinate system based on the second projection.

[0094] See also Figure 6 , obtain the second projection of the workpiece (observed toward the light source side of the first calibration light), and characterize the measured position of the workpiece in the second projection according to the second coordinate system. In the second coordinate system, the first coordinate axis (horizontal axis) represents the position of the workpiece in the direction perpendicular to the second calibration light, and the second coordinate axis (vertical axis) represents the height of the workpiece. It should be noted that the first projection and the second projection are only different in angle, and both are projected on the carrier and the workpiece.

[0095] The measuring position of the second coordinate axis is the height of the workpiece. Based on the height of the workpiece, it can be determined whether the workpiece has sheet jumping and sheet sticking phenomena. The height of the ejector pin can also be determined to calibrate the height of the ejector pin.

[0096] Step S53, determining the position information of the workpiece according to the measured position of the first coordinate axis and the measured position of the second coordinate axis in the calibration coordinate system.

[0097] In the calibration coordinate system, the first coordinate axis and the second coordinate axis are two mutually perpendicular coordinate axes in the standard coordinate system in the first plane, such as Figure 7 As shown, the first coordinate axis is the X-axis, and the second coordinate axis is the Y-axis.

[0098] The measurement position of the first coordinate axis (X axis) in the calibration coordinate system can be determined based on the measurement position of the first coordinate axis in the first coordinate system, and the measurement position of the second coordinate axis (Y axis) can be determined based on the measurement position of the first coordinate axis in the second coordinate system.

[0099] Specifically, the measured position of the first coordinate axis in the first coordinate system is used as the measured position of the first coordinate axis in the calibration coordinate system, and the measured position of the first coordinate axis determined in the second coordinate system is used as the measured position of the second coordinate axis in the calibration coordinate system, thereby determining the position information (measured position) of the workpiece in the standard coordinate system. Based on the position information of the workpiece and the preset standard position, it is determined whether the measured position of the workpiece coincides with the preset standard position, thereby realizing calibration of the position of the workpiece.

[0100] The measured position of the first coordinate axis in the first coordinate system is used as the measured position of the first coordinate axis of the workpiece in the calibration coordinate system, that is, Figure 6 The measured position of the first coordinate axis in corresponds to Figure 7 The measured position of the first coordinate axis in (x1 and x2).

[0101] The measured position of the first coordinate axis in the second coordinate system is used as the measured position of the second coordinate axis of the workpiece in the calibration coordinate system, that is, Figure 6 The measured position of the first coordinate axis in corresponds to Figure 7 The measured position of the second coordinate axis in (y1 and y2).

[0102] See also Figure 7 , the shaded area is the measured position of the workpiece on the first plane, and the thick dotted line is the first standard position. When the overlap between the measured position of the workpiece and the first standard position reaches a preset overlap threshold, the position calibration of the workpiece is completed. For example, when the overlap reaches 99%, the position calibration of the workpiece is considered to be completed.

[0103] In some embodiments, Figure 2 As shown, the position calibration device also includes a second light curtain assembly 6 disposed in the process chamber, which is used to calibrate the positions of the robot and the workpiece in the second plane.

[0104] The second light curtain assembly 6 includes a third light curtain transmitting end 61, a third light curtain receiving end 62, a fourth light curtain transmitting end 63 and a fourth light curtain receiving end 64 located in a second plane, wherein the second plane is located above the first plane.

[0105] The third light curtain transmitting end 61 is used to transmit the third calibration light to the robot extending into the process chamber 1, and the third light curtain receiving end 62 is used to receive the third calibration light and obtain the third projection of the robot at the third light curtain receiving end. Specifically, the third standard light blocked by the robot cannot be sensed by the third light curtain receiving end 62, and the third standard light not blocked by the robot can be sensed by the third light curtain receiving end 62, and the third light curtain receiving end 62 can obtain the third projection of the robot according to the sensed third standard light.

[0106] The fourth light curtain transmitting end 63 is used to transmit the fourth calibration light to the manipulator extending into the process chamber 1, and the fourth light curtain receiving end 64 is used to receive the fourth calibration light and obtain the fourth projection of the manipulator at the fourth light curtain receiving end. Specifically, the fourth standard light blocked by the manipulator cannot be sensed by the fourth light curtain receiving end 64, and the fourth standard light not blocked by the manipulator can be sensed by the fourth light curtain receiving end 64, and the fourth light curtain receiving end 64 can obtain the fourth projection of the manipulator according to the sensed fourth standard light.

[0107] The third light curtain emitting end 61 and the third light curtain receiving end 62 are arranged at opposite sides in the second plane, and the robot 2 extending into the process chamber 1 is located on the optical path of the third calibration light. When the robot 2 extends into the process chamber 1, the third calibration light can project the robot 2, and the third light curtain receiving end 62 senses the third calibration light and obtains the third projection of the robot 2.

[0108] The fourth light curtain transmitting end 63 and the fourth light curtain receiving end 64 are arranged on opposite sides in the second plane, and the robot is located in the optical path of the fourth calibration light. When the robot 2 is extended into the process chamber 1, the fourth calibration light can project the robot 2, and the fourth light curtain receiving end 64 can sense the fourth calibration light and obtain the fourth projection of the robot.

[0109] The angle between the third calibration light and the fourth calibration light in the second plane is greater than 0°, that is, the third calibration light and the fourth calibration light are not parallel lights. For example, the angle between the third calibration light and the fourth calibration light is 45° or 90° or other angles, that is, the third calibration light and the fourth calibration light are projected onto the manipulator from different angles to facilitate more accurate position calibration of the manipulator.

[0110] When the manipulator does not carry a workpiece and extends into the process chamber, the position of the manipulator can be calibrated based on the third projection and the fourth projection without opening the process chamber or breaking the vacuum in the process chamber, thereby reducing environmental pollution. For example, the offset and levelness of the manipulator are calibrated, wherein the offset includes the offset in the first direction (the direction in which the manipulator is extended) and the offset in the third direction. The levelness includes the levelness in the first direction and the levelness in the third direction. When the manipulator carries a workpiece, the position information of the workpiece can also be obtained based on the third projection and the fourth projection, and the position of the workpiece in the first direction and the second direction can be adjusted based on the position information of the workpiece to calibrate the position of the workpiece.

[0111] like Figure 2As shown, the third light curtain emitting end 61 is arranged on the side of the film transmission port 11, and the film transmission port 11 is on the second plane, and the angle between the third calibration light emitted by the third light curtain emitting end 61 and the extension direction (first direction) of the manipulator 2 on the second plane is 30-60°, for example, the angle is 30°, 40°, 45°, 50°, 55° or 60°.

[0112] The angle between the fourth calibration light emitted by the fourth light curtain transmitting end 63 and the projection of the extension and retraction direction (first direction) of the manipulator 2 on the second plane is 120-150°, for example, the angle is 120°, 130°, 140° or 150°. When the angle between the third calibration light and the extension and retraction direction of the manipulator on the second plane and the angle between the fourth calibration light and the extension and retraction direction of the manipulator on the second plane are adjusted, the angle between the third calibration light and the fourth calibration light projected on the second plane can be made to be 90°, so as to more accurately determine the position of the manipulator on the second plane, thereby facilitating the calibration of the manipulator position.

[0113] In some embodiments, the illumination height of the third calibration light is greater than 8 mm, that is, the illumination height of the third calibration light generated on the third light curtain receiving end 62 is greater than 8 mm, for example, the illumination height is 8 mm or 10 mm. The illumination height of the fourth calibration light is greater than 8 mm, that is, the illumination height of the fourth calibration light generated on the fourth light curtain receiving end 64 is greater than 8 mm, for example, the illumination height is 8 mm or 10 mm. The illumination height of the third calibration light starts from the surface of the carrying device.

[0114] In some embodiments, the controller is further used to determine the position information of the manipulator according to the third projection and the fourth projection, wherein the position information of the manipulator includes the horizontal offset and the horizontality of the manipulator.

[0115] In some embodiments, determining the position information of the manipulator according to the third projection and the fourth projection includes: determining the horizontal offset of the manipulator according to the third projection; and determining the horizontality of the manipulator according to the fourth projection.

[0116] In some embodiments, determining the horizontal offset of the manipulator according to the third projection includes: determining the measured position of the first designated point of the manipulator according to the third projection; determining the horizontal offset of the manipulator based on the measured position of the first designated point and the standard position corresponding to the first designated point. The first designated position may be an end point of the manipulator, such as the left front end or the right front end, and any position may be used as the first designated position as long as the horizontal offset can be calibrated. It should be noted that the manipulator in the embodiment of the present invention includes a left finger and a right finger, and the left front end point refers to the front end point of the left finger.

[0117] like Figure 8As shown, the first designated point of the manipulator 3 can be the left front end point of the manipulator, and the measured position D of the first designated point can be obtained from the third projection. When the difference between the measured position D of the first designated point and the standard position C corresponding to the first designated point is large, it indicates that the horizontal offset of the manipulator 3 is large, otherwise it is small. When the horizontal offset is less than the preset first threshold, it is determined that the horizontal offset of the manipulator 3 meets the calibration requirements.

[0118] Specifically, the measurement position of the first designated point of the manipulator is determined based on the third projection; the first position difference is determined based on the measurement position of the first designated point and the standard position corresponding to the first designated point; when the first position difference is equal to or less than a preset first threshold, the calibration of the horizontal offset of the manipulator is completed; when the first position difference is greater than the preset first threshold, the horizontal offset of the manipulator continues to be calibrated.

[0119] For example, see Figure 8 , the gray area is the actual projection of the robot 3, and the shadow area 2 is the standard position of the robot. Determine the horizontal offset of the robot according to the third projection, including:

[0120] Step S71, obtaining the measurement position of the manipulator at the first designated point in the third projection.

[0121] Assuming that the first designated point is the left front end point of the manipulator, the measurement position D of the first designated point is obtained from the first projection.

[0122] Step S72, obtaining a first position difference between the measured position of the first designated point and the standard position of the first designated point.

[0123] Among them, the standard position of the first designated point refers to the standard position of the left front end point of the manipulator, such as Figure 8 The standard position of the first designated point in is C. By calculating the measured position of the first designated point and the standard position of the first designated point, the distance difference between the measured position of the first designated point and the standard position can be determined to obtain a first position difference, such as the distance between C and D is the first position difference.

[0124] Step S73, when the first position difference is equal to or less than the preset first threshold, the calibration of the horizontal offset of the manipulator is completed. When the first position difference is greater than the preset first threshold, the horizontal offset of the manipulator continues to be calibrated using the first projection.

[0125] Among them, the first threshold is a preset threshold, which can be set according to the processing accuracy of the workpiece, and this embodiment does not limit this. When the first position difference is equal to or less than the first threshold, the horizontal offset of the manipulator meets the preset requirements. When the first position difference is greater than the first threshold, the horizontal offset of the manipulator does not meet the preset requirements, and it is necessary to continue to calibrate the horizontal offset of the manipulator, such as telescopic movement, first direction or second direction rotation.

[0126] In some embodiments, determining the horizontality of the manipulator based on the fourth projection includes: determining the measured positions of the second designated point and the third designated point of the manipulator based on the fourth projection; determining the position information of the second designated point based on the measured position of the second designated point of the manipulator and the standard position corresponding to the second designated point, and determining the position information of the third designated point based on the third designated point of the manipulator and the standard position corresponding to the third designated point; determining the horizontality of the manipulator based on the position information of the second designated point and the position information of the third designated point.

[0127] For example, see Fig. 9 , the gray area is the actual projection of the robot 3, and the shadow area 2 is the standard position of the robot. The horizontality of the robot according to the fourth projection includes:

[0128] Step S81, obtaining the measurement positions of the second designated point and the third designated point of the manipulator in the fourth projection.

[0129] The second designated point and the third designated point may be any two points that can calibrate the horizontality of the manipulator. For example, the second designated point includes the left endpoint of the lower surface of the manipulator, and the third designated point includes the right endpoint of the lower surface of the manipulator, that is, the second designated point is the lower left endpoint E of the manipulator, and the third designated point is the lower right endpoint F of the manipulator.

[0130] Step S82, obtaining a second position difference between the measured position of the second designated point and the standard position of the second designated point, and obtaining a third position difference between the measured position of the third designated point and the standard position of the third designated point.

[0131] The standard position of the second designated point is G, and the standard position of the third designated point is H (blocked by the grayscale area). The second position difference between the measured position E of the second designated point and the standard position G of the second designated point is calculated, and the third position difference between the measured position F of the third designated point and the standard position H of the third designated point is calculated.

[0132] Step S83, when the second position difference and the third position difference are both equal to or less than the preset second threshold, complete the calibration of the horizontality of the manipulator; when at least one of the second position difference and the third position difference is greater than the second threshold, continue to use the second projection to calibrate the horizontality of the manipulator.

[0133] It should be noted that the second designated point of the present application includes the first endpoint (such as the left endpoint) of the lower surface of the manipulator, the third designated point includes the second endpoint (such as the right endpoint) of the lower surface of the manipulator, the second designated point includes the second endpoint of the lower surface of the manipulator, and the third designated point includes the first endpoint of the lower surface of the manipulator. However, the present application is not limited to this, and the second designated point and the third designated point may also be other suitable position points.

[0134] In some embodiments, Figure 1 As shown, the position calibration device also includes a manipulator detection component 7 for detecting the extension and rotation amount of the manipulator 2.

[0135] The manipulator detection assembly 7 includes a first sensor 71 and a second sensor 72 . The first sensor 71 and the second sensor 72 are arranged inside the film transmission port 11 and are arranged opposite to each other. The first sensor 71 and the second sensor 72 are arranged on the second plane.

[0136] In some embodiments, the first sensor 71 includes a pressure sensor or a distance sensor; and the second sensor 72 includes a pressure sensor or a distance sensor.

[0137] The following uses the pressure sensor as an example to introduce the robot detection component's adjustment of the robot's extension and rotation amounts.

[0138] like Figure 1 As shown, when the robot 2 moves into the process chamber 1, the robot 2 squeezes the first sensor 71 and the second sensor 72, and the first sensor 71 and the second sensor 72 obtain measurement values ​​(pressure values). When the measurement values ​​reach a preset measurement threshold, the extension amount of the robot 2 into the process chamber 1 is the maximum extension amount R.

[0139] The manipulator 2 rotates in the first direction (rotates to the left), the manipulator 2 squeezes the first sensor 71, and the first sensor 71 obtains a measurement value. When the measurement value obtained by the first sensor 71 reaches a preset measurement threshold, the maximum rotation amount δ of the manipulator 2 in the first direction can be determined. left The manipulator 2 rotates in the second direction (rotates right), the manipulator 2 squeezes the second sensor 72, and the second sensor 72 obtains a measurement value. When the measurement value obtained by the second sensor 72 reaches a preset measurement threshold, the maximum rotation amount δ of the manipulator 2 in the second direction can be determined. right . The first direction and the second direction are opposite, for example, the first direction is clockwise and the second direction is counterclockwise.

[0140] In the embodiment of the present application, after the first sensor 71 and the second sensor 72 obtain measurement values, the controller is used to calibrate the position of the manipulator on the second plane based on the measurement values.

[0141] The controller in this embodiment is also used for: obtaining the first measurement value of the first sensor and the first measurement value of the second sensor during the process of the robot extending toward the inside of the process chamber; determining the extension and retraction amount of the robot based on the first measurement value of the first sensor, the first measurement value of the second sensor and the horizontal offset of the robot; obtaining the second measurement value of the first sensor and the first rotation amount of the robot during the process of the robot rotating toward the first sensor; determining the adjustment amount of the robot in the first direction based on the first rotation amount of the robot and the second measurement value of the first sensor; obtaining the second measurement value of the second sensor and the second rotation amount of the robot during the process of the robot rotating toward the second sensor; determining the adjustment amount of the robot in the second direction based on the second rotation amount of the robot and the second measurement value of the second sensor.

[0142] For example, before the controller calibrates the position of the workpiece on the first plane, the controller further includes:

[0143] Step S91 , when the robot arm is extended into the process chamber, a first measurement value of the first sensor and a first measurement value of the second sensor are obtained.

[0144] The first sensor and the second sensor may be pressure sensors or distance sensors. The following description takes the pressure sensor as an example. The first measurement value and the second measurement value are pressure values.

[0145] Step S92, determining the extension and retraction amount of the manipulator based on the first measurement value of the first sensor, the first measurement value of the second sensor, and the horizontal offset of the manipulator.

[0146] When the first measurement value of the first sensor and the first measurement value of the second sensor reach a preset pressure threshold, the horizontal offset of the manipulator is recorded, and the horizontal offset is the maximum extension amount R of the manipulator.

[0147] Step S93: Acquire a second measurement value of the first sensor and a first rotation amount of the manipulator while the manipulator rotates toward the first sensor.

[0148] Step S94, determining an adjustment amount of the manipulator in the first direction based on the first rotation amount of the manipulator and the second measurement value of the first sensor;

[0149] When the second measurement value of the first sensor reaches a preset pressure threshold, the first rotation amount of the manipulator is recorded, and the first rotation amount is determined as the maximum adjustment amount δleft of the manipulator in the first direction.

[0150] Step S95: while the manipulator is rotating toward the second sensor, a second measurement value of the second sensor and a second rotation amount of the manipulator are obtained.

[0151] Step S96: determining an adjustment amount of the manipulator in the second direction based on a second rotation amount of the manipulator and a second measurement value of the second sensor.

[0152] When the second measurement value of the second sensor reaches the preset pressure threshold, the second rotation amount of the manipulator is recorded, and the second rotation amount is determined as the maximum adjustment amount δright of the manipulator in the second direction.

[0153] In some embodiments, the method of determining the reference value includes: determining the BTO using the second light curtain assembly.

[0154] Specifically, see Fig.10 Based on the projections of the third and fourth projections generated by the second light curtain assembly, the manipulator is adjusted in the second direction so that the BTO of the manipulator reaches a preset reference value. For example, the reference value of the manipulator is 3 mm, that is, the height difference between the upper surface of the manipulator and the top of the ejector pin is 3 mm.

[0155] After determining the maximum rotation amount δleft in the first direction, the maximum rotation amount δright in the second direction, and the telescopic amount R of the manipulator, the position information of the manipulator is recorded, such as the telescopic amount R∈(0, R+Rmax,), the rotation amount δ∈(δ-δleft, δ+δright), BTO. In some embodiments, the descent amount of the manipulator can also be determined, and the descent amount is usually a fixed value, such as a descent amount of 6 mm.

[0156] Before implementing the process, use a robot to carry the workpiece and transfer the workpiece into the process chamber. Use the recorded expansion and contraction amount R, rotation amount δ and BTO as the initial position of the robot. Start the second light curtain assembly, record the measured position of the workpiece when the robot is carrying the film, compare it with the initial position, and fine-tune the robot R∈(0, R+Rmax,), δ∈(δ-δleft, δ+δright) to ensure that the workpiece reaches the second plane. The ejector pin is raised, and the workpiece is placed on the ejector pin. The robot withdraws from the process chamber, then lowers the pin and places the workpiece on the carrying device. Start the first light curtain assembly to detect whether the workpiece is in the first plane after the pin is lowered. Figure 6 If the detected difference between the workpiece position and the standard position is large, it can be judged that the ejector pin is abnormal. If the detected difference between the workpiece position and the standard position is within the normal range, the process can be carried out.

[0157] In some embodiments, the first light curtain assembly can be used to calibrate the levelness, stickiness, and jump of the ejector pin.

[0158] The step of adjusting the horizontality of the ejector pins using the first light curtain assembly includes: using the first projection obtained by the first light curtain receiving end and the second projection obtained by the second light curtain receiving end to determine whether the height difference between different ejector pins is within a preset range, so as to judge whether the ejector pins are at the same height. If so, it is indicated that the horizontality of the ejector pins meets the preset requirements. If not, it is necessary to adjust the heights of the ejector pins respectively through the electric drive device so that the top ends of the ejector pins are within the preset range.

[0159] After the process is completed, the ejector pin is raised and the first light curtain assembly is used to detect whether the workpiece is sticking or jumping. Figure 6 As shown, if the height difference of the ejector pins is within the preset range and the workpiece is flush, the workpiece is judged to be normal, and the robot enters the process chamber to take the sheet.

[0160] Specifically, the controller is also used to determine whether the height difference between different ejectors is within a preset height threshold range based on the first projection and the second projection when the ejector is in a raised state; determine that the workpiece is normal when the height difference between the ejectors is within the height threshold range and the height of the workpiece is consistent with the height of the ejector; determine that the workpiece has jumped when the height difference between the ejectors is within the height threshold range and the height of the workpiece is inconsistent with the height of the ejector; and determine that the workpiece has stuck when the height difference between the ejectors is not within the height threshold range.

[0161] See also Fig.11 When the height difference of the ejector pin 44 is within the preset range, but the height of the workpiece 3 is inconsistent with the height of the ejector pin 44, it is determined that the workpiece 3 has jumped the film, and the position of the workpiece 3 and the focusing ring is observed through the first light curtain assembly. If the workpiece is in the focusing ring, the needle is raised; entering the light curtain detection range of the second plane, the manipulator is calibrated to take the film; if the workpiece slides out of the focusing ring, the ejector pin is controlled to raise the needle on the side of the focusing ring to make the workpiece slide into the focusing ring. If the workpiece cannot be slid into the focusing ring after multiple attempts, the cavity is opened to take the film.

[0162] like Fig.12 When the height of the ejector pin is abnormal, it is judged that the workpiece 3 is stuck, and nitrogen is used to control the air pressure in the process chamber, and the ejector pin 44 is started to desorb again, and then the ejector pin is raised to detect the state of the workpiece 3.

[0163] In some embodiments, Figure 2 As shown, the first light curtain assembly also includes a protective screen (not shown in the figure), and the surfaces of the first light curtain transmitting end 51, the second light curtain transmitting end 53, the first light curtain receiving end 52 and the second light curtain receiving end 54 are all provided with a protective screen.

[0164] The second light curtain assembly 6 also includes a protective screen, and the surfaces of the third light curtain transmitting end, the fourth light curtain transmitting end, the third light curtain receiving end and the fourth light curtain receiving end are all provided with a protective screen.

[0165] The protective screen can protect the first light curtain assembly 5 and the second light curtain assembly 6 during the implementation of the process, prevent the surfaces of the first light curtain assembly 5 and the second light curtain assembly 6 from being etched by plasma, and prevent the process chamber from being contaminated by the etching of the first light curtain assembly 5 and the second light curtain assembly 6, that is, the protective screen protects the first light curtain assembly 5 and the second light curtain assembly 6, and prevents the process chamber 1 from being contaminated.

[0166] In some embodiments, the material of the protective shield is sapphire or mica.

[0167] The position calibration device provided by the present invention is provided with a first light curtain assembly in a process chamber, the first light curtain assembly includes a first light curtain transmitting end, a first light curtain receiving end, a second light curtain transmitting end and a second light curtain receiving end, the first light curtain transmitting end transmits a first calibration light, the second light curtain transmitting end transmits a second calibration light, the first light curtain transmitting end and the first light curtain receiving end are arranged on opposite sides of a first plane, and the first plane is located on the optical path of the first calibration light, so that the first light curtain receiving end can receive the projection of the workpiece; the second light curtain transmitting end and the second light curtain receiving end are arranged on opposite sides of the first plane, and the first plane is located on the optical path of the second calibration light, so that the second light curtain receiving end The projection of the workpiece can be received. Since the angle between the first calibration light and the second calibration light in the plane where the first plane is located is greater than 0°, the first projection and the second projection are obtained through the first light curtain receiving end and the second light curtain receiving end respectively. The controller can determine the position information of the workpiece based on the first projection and the second projection, and judge the state of the workpiece based on the position information of the workpiece. Before implementing the process, it can be judged whether the workpiece is offset during the descent process; after implementing the process, it can be judged whether the workpiece is in the focus ring. If the workpiece is offset or jumps relative to the focus ring, the robot can correct the workpiece when taking the film; or adjust the height of the ejector pin to make the workpiece slide into the focus ring. The controller can also judge whether the film sticks when the needle is raised through the first projection and the second projection. If the film sticks, the charge can be removed, thereby systematically solving the problems of film sticking and film jumping.

[0168] An embodiment of the present invention further provides a semiconductor process equipment, including a position calibration device, wherein the position calibration device includes the position calibration device provided by the embodiment of the present invention.

[0169] The position calibration device can be used to calibrate the workpiece on the first plane, and can also calibrate the manipulator and the workpiece on the second plane.

[0170] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A position calibration device, applied to semiconductor process equipment, comprising: A first light curtain assembly disposed in a process chamber of the semiconductor process equipment; The first light curtain assembly includes a first light curtain transmitting end, a first light curtain receiving end, a second light curtain transmitting end and a second light curtain receiving end located on a first plane. The first light curtain transmitting end is used to transmit a first calibration light to the workpiece in the process chamber, and the first light curtain receiving end is used to receive the first calibration light and obtain a first projection of the workpiece at the first light curtain receiving end; The second light curtain transmitting end is used to transmit a second calibration light to the workpiece, and the second light curtain receiving end is used to receive the second calibration light and obtain a second projection of the workpiece at the second light curtain receiving end; The included angle between the first calibration light and the second calibration light in the first plane is greater than 0°; A controller is used to determine position information of the workpiece according to the first projection and the second projection.

2. The position calibration device according to claim 1, characterized in that: The determining the position information of the workpiece according to the first projection and the second projection includes: determining a measured position of the workpiece along a first coordinate axis in a calibration coordinate system based on the first projection; determining a measured position of a second coordinate axis of the workpiece in the calibration coordinate system based on the second projection; The position information of the workpiece is determined according to the measured position of the first coordinate axis and the measured position of the second coordinate axis in the calibration coordinate system.

3. The position calibration device according to claim 1, characterized in that: The position calibration device further includes a second light curtain assembly, the second light curtain assembly includes a third light curtain transmitting end, a third light curtain receiving end, a fourth light curtain transmitting end and a fourth light curtain receiving end located in a second plane, and the second plane is located above the first plane; The third light curtain emitting end is used to emit a third calibration light to the robot extending into the process chamber, and the third light curtain receiving end is used to receive the third calibration light and obtain a third projection of the robot on the third light curtain receiving end; The fourth light curtain transmitting end is used to transmit a fourth calibration light to the robot extending into the process chamber, and the fourth light curtain receiving end is used to receive the fourth calibration light and obtain a fourth projection of the robot on the fourth light curtain receiving end; the angle between the third calibration light and the fourth calibration light in the second plane is greater than 0°; The controller is further used to determine the position information of the manipulator according to the third projection and the fourth projection.

4. The position calibration device according to claim 3, characterized in that: The position information of the manipulator includes the horizontal offset and levelness of the manipulator; The determining the position information of the manipulator according to the third projection and the fourth projection comprises: Determining a horizontal offset of the manipulator according to the third projection; The horizontality of the manipulator is determined based on the fourth projection.

5. The position calibration device according to claim 4, characterized in that: Determining the horizontal offset of the manipulator according to the third projection includes: determining a measurement position of a first designated point of the manipulator according to the third projection; The horizontal offset of the manipulator is determined based on the measured position of the first designated point and a standard position corresponding to the first designated point.

6. The position calibration device according to claim 4, characterized in that: Determining the horizontality of the manipulator according to the fourth projection includes: determining the measurement positions of the second designated point and the third designated point of the manipulator according to the fourth projection; Determine the position information of the second designated point based on the measured position of the second designated point of the manipulator and the standard position corresponding to the second designated point, and determine the position information of the third designated point based on the third designated point of the manipulator and the standard position corresponding to the third designated point; The horizontality of the robot is determined according to the position information of the second designated point and the position information of the third designated point.

7. The position calibration device according to claim 6, characterized in that: The second designated point includes a first endpoint of the lower surface of the manipulator, and the third designated point includes a second endpoint of the lower surface of the manipulator; or, the second designated point includes a second endpoint of the lower surface of the manipulator, and the third designated point includes a first endpoint of the lower surface of the manipulator.

8. The position calibration device according to claim 3, characterized in that: The angle between the first calibration light and the extension direction of the manipulator on the first plane is 30-60°; The angle between the second calibration light and the extension direction of the manipulator on the first plane is 120-150°; The angle between the third calibration light and the extension direction of the manipulator on the second plane is 30-60°; The included angle between the fourth calibration light and the extension and retraction direction of the manipulator on the second plane is 120-150°.

9. The position calibration device according to claim 3, characterized in that: The process chamber also includes a film transfer port, through which the robot enters and exits the process chamber; The position calibration device also includes a manipulator detection component, which is used to detect the extension and retraction amount of the manipulator; The manipulator detection component includes a first sensor and a second sensor, the first sensor and the second sensor are arranged inside the film transmission port and opposite to each other, and the first sensor and the second sensor are arranged on the second plane.

10. The position calibration device according to claim 9, characterized in that: The first sensor includes a pressure sensor or a distance sensor; and the second sensor includes a pressure sensor or a distance sensor.

11. The position calibration device according to claim 7, characterized in that: The controller is also used for: Acquiring a first measurement value of a first sensor and a first measurement value of a second sensor during the process of the robot arm extending toward the interior of the process chamber; Determine the extension and retraction amount of the manipulator based on the first measurement value of the first sensor, the first measurement value of the second sensor, and the horizontal offset of the manipulator; During the process of the manipulator rotating toward the first sensor, obtaining a second measurement value of the first sensor and a first rotation amount of the manipulator; determining an adjustment amount of the manipulator in a first direction based on a first rotation amount of the manipulator and a second measurement value of the first sensor; During the process of the manipulator rotating toward the second sensor, obtaining a second measurement value of the second sensor and a second rotation amount of the manipulator; An adjustment amount of the manipulator in a second direction is determined based on a second rotation amount of the manipulator and a second measurement value of the second sensor.

12. The position calibration device according to claim 3, characterized in that: The illumination heights of the first calibration light and the second calibration light are greater than 3 mm; The illumination heights of the third calibration light and the fourth calibration light are greater than 8 mm.

13. The position calibration device according to claim 1, characterized in that: The controller is also used for: When the ejector pin is in a raised state, based on whether the height difference of the ejector pins in the first projection and the second projection is within a preset height threshold range; the ejector pin is used to lift the workpiece and place it on the carrying surface of the carrying device carrying the workpiece; When the height difference of the ejector pin is within the height threshold range and the height of the workpiece is consistent with the height of the ejector pin, it is determined that the workpiece is normal; When the height difference of the ejector pin is within the height threshold range and the height of the workpiece is inconsistent with the height of the ejector pin, it is determined that the workpiece has skipped; When the height difference of the ejector pins is not within the height threshold range, it is determined that the workpiece is stuck.

14. A semiconductor process equipment, comprising a position calibration device, characterized in that: The position calibration device comprises the position calibration device according to any one of claims 1 to 13.

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