Heat dissipation device and semiconductor device
By designing a heat dissipation device for multiple heat exchange chambers and flow pipelines, the problem of insufficient heat dissipation efficiency and uniformity of multiple heat sources in the prior art is solved, efficient and uniform heat dissipation of heat sources is achieved, and the service life of semiconductor devices is extended.
Patent Information
- Application Number
- CN202411912567.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-04-11
AI Technical Summary
The prior art is difficult to efficiently and uniformly dissipate heat to multiple heat sources, especially in semiconductor devices, where the increase in the temperature of the cooling water leads to a decrease in the heat dissipation efficiency of the subsequent chip unit.
A heat dissipation device is designed, including multiple heat exchange chambers and circulation pipes. The cooling medium flows sequentially through the flow inlet, heat exchange chamber and outflow pipe. The heat exchange chamber is arranged corresponding to the heat source. The temperature of the cooling medium is low before entering the heat exchange chamber, ensuring efficient heat exchange.
It realizes efficient heat dissipation of multiple heat sources, improves heat dissipation uniformity, extends the service life of semiconductor devices and system stability.
Smart Images
Figure CN119812145A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a heat dissipation device and a semiconductor device. Background Art
[0002] Semiconductor devices refer to various electronic components and integrated circuits made of semiconductor materials (such as silicon, germanium, gallium arsenide, etc.), which play a core role in modern electronic technology. Semiconductor devices include diodes, transistors, integrated circuits, power devices, optoelectronic devices, etc.
[0003] In order to ensure that semiconductor devices can work at optimal performance, extend their service life, and maintain system stability and reliability, heat dissipation is an important consideration in semiconductor device design and application. Summary of the invention
[0004] The heat dissipation device and semiconductor device provided in the embodiments of the present application can efficiently dissipate heat for multiple heat sources and can also improve the uniformity of heat dissipation for multiple heat sources.
[0005] In a first aspect, an embodiment of the present application provides a heat dissipation device, which is used to dissipate heat from multiple heat sources, and the heat dissipation device includes:
[0006] A plurality of heat exchange chambers, wherein the plurality of heat exchange chambers and the plurality of heat sources are arranged to overlap in a corresponding manner in a first direction, and the heat exchange chamber comprises an inlet end and an outlet end;
[0007] A circulation pipeline, comprising an inflow pipeline connected to the inlet end and an outflow pipeline connected to the outlet end, wherein the circulation pipeline is used to circulate a cooling medium;
[0008] Among them, the inflow pipeline includes a first main circuit and multiple first branches connected to the first main circuit, different first branches are correspondingly connected to the inlet ends of different heat exchange chambers, and the cooling medium flows along the first main circuit through different first branches, flows into different heat exchange chambers from different inlet ends and flows out along different outlet ends.
[0009] In some embodiments, the outflow pipe includes a second main circuit and multiple second branches connected to the second main circuit, different second branches are correspondingly connected to the outlet ends of different heat exchange chambers, and the cooling medium flows from different outlet ends through different second branches and flows out along the second main circuit.
[0010] In some embodiments, the extending axial direction of the first branch is arranged to intersect with the extending direction of the line between the inlet end and the outlet end of the heat exchange chamber.
[0011] In some embodiments, the inlet end and the outlet end are respectively located at two ends of the heat exchange chamber along a second direction, and the second direction intersects with the first direction;
[0012] The first branch and the second branch both extend along the first direction and are located on a side of the heat exchange chamber away from the heat source along the first direction. The first branch and the second branch are spaced apart in the second direction.
[0013] In some embodiments, the heat dissipation device further comprises a substrate, the substrate having a first surface in the first direction, the first surface being recessed inwardly to form a groove structure, a groove bottom wall of the groove structure being protruded along the first direction to be provided with a protruding structure, and the protruding structure forming a second surface on a side away from the groove bottom wall in the first direction;
[0014] The second surface is located on the side of the first surface facing the groove bottom wall in the first direction, and the groove structure forms the heat exchange cavity between the first surface and the second surface;
[0015] Both side walls of the protrusion structure along the second direction are spaced apart from the groove side walls of the groove structure in the second direction, and both side walls of the protrusion structure along the third direction are abutted against the groove side walls of the groove structure in the third direction. The protrusion structure and the groove side walls of the groove structure enclose the first branch and the second branch, and the first direction, the second direction and the third direction intersect each other.
[0016] In some embodiments, the plurality of heat exchange chambers are spaced apart and distributed along the third direction, and the first direction, the second direction and the third direction intersect each other;
[0017] The first main circuit includes a first portion extending along the second direction and a second portion connected to the first portion and extending along the third direction, the projections of the first branches in the first direction are all inside the projections of the second portion in the first direction, and the first branches are all connected to the second portion;
[0018] The second main circuit includes a third part extending along a third direction and a fourth part connected to the third part and extending along the second direction, the projections of multiple second branches in the first direction are all inside the projections of the third part in the first direction, and multiple second branches are all connected to the third part.
[0019] In some embodiments, the plurality of heat exchange chambers are arranged in an array along the second direction and the third direction;
[0020] The projection of the first part in the first direction is located between the projections of some of the heat exchange chambers in the first direction in the third direction, and a plurality of the second parts are provided, and the plurality of the second parts are all connected to the first part, and the plurality of the second parts are spaced apart and distributed along the second direction;
[0021] The projection of the fourth part in the first direction is on the same side of the projections of the plurality of heat exchange chambers in the first direction in the third direction, a plurality of the third parts are provided, the plurality of the third parts are all connected to the fourth part, the plurality of the third parts are distributed at intervals along the second direction, and the second parts and the third parts are distributed alternately in the second direction.
[0022] In some embodiments, an inner diameter of the first branch gradually increases from the first main path toward one side of the heat exchange chamber.
[0023] In a second aspect, an embodiment of the present application provides a semiconductor device, including a chip structure and the heat dissipation device, wherein the chip structure and the heat dissipation device are stacked along the first direction;
[0024] The chip structure includes a plurality of chip units, the heat source includes the chip unit, the heat exchange cavity forms an opening structure toward one side of the chip structure, the chip structure closes the opening structure in the first direction, and the projection of the chip unit in the first direction is inside the projection of the opening structure in the first direction.
[0025] In some embodiments, the first branch extends along the first direction, the first branch is connected to a side of the heat exchange chamber away from the chip unit, and a projection of the first branch in the first direction is inside a projection of the chip unit in the first direction.
[0026] According to the heat dissipation device and semiconductor device provided by the present application, the heat dissipation device includes a plurality of heat exchange chambers, and the heat exchange chambers are arranged corresponding to the heat source. The heat source and the cooling medium exchange heat in the heat exchange chamber, and the heat on the heat source is transferred to the cooling medium and the heat is taken away by the cooling medium, so as to realize cooling and heat dissipation of the heat source. The heat exchange chamber includes an inlet end and an outlet end, and the heat dissipation device includes an inflow pipe connected to the inlet end and an outflow pipe connected to the outlet end, and the cooling medium flows in the inflow pipe, the inlet end, the heat exchange chamber, the outlet end and the outflow pipe in sequence. The inflow pipe includes a first main circuit and a plurality of first branches connected to the first main circuit, and the plurality of first branches are connected in parallel, and different first branches are connected to the inlet ends of different heat exchange chambers. Each first branch is independently connected to the first main circuit. When the cooling medium flows to the heat exchange chamber in the inflow pipe, the cooling medium in each heat exchange chamber does not exchange heat with the heat source, and the initial temperature is a relatively low temperature, which has a large difference with the working temperature of the heat source, so as to improve the heat exchange efficiency between the cooling medium and the heat source in the heat exchange chamber. At the same time, the multiple first branches directly connect different heat exchange chambers to the first main circuit, so that each heat source can exchange heat with the cooling medium with a lower temperature, which can improve the uniformity of heat dissipation for multiple heat sources. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.
[0028] Figure 1 A schematic diagram of the structure of a heat dissipation device provided in some embodiments of the present application;
[0029] Figure 2 A schematic diagram of a physical structure of a circulation pipeline provided in some embodiments of the present application;
[0030] Figure 3 A schematic structural diagram of a semiconductor device provided for some embodiments of the present application.
[0031] Marking Description:
[0032] 100. Heat dissipation device;
[0033] 101, substrate; 1011, groove structure; 1012, protrusion structure;
[0034] 10. Heat exchange chamber; 11. Inlet end; 12. Outlet end;
[0035] 20, circulation pipeline; 21, inflow pipeline; 211, first main route; 2111, first part; 2112, second part; 212, first branch; 22, outflow pipeline; 221, second main route; 2211, third part; 2212, fourth part; 222, second branch;
[0036] M1, first surface; M2, second surface;
[0037] 200. Chip structure;
[0038] 201, base plate; 202, chip unit;
[0039] X, first direction; Y, second direction; Z, third direction.
[0040] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION
[0041] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.
[0042] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0043] Semiconductor devices refer to various electronic components and integrated circuits made of semiconductor materials (such as silicon, germanium, gallium arsenide, etc.), which play a core role in modern electronic technology. Semiconductor devices include diodes, transistors, integrated circuits, power devices, optoelectronic devices, etc.
[0044] In order to ensure that semiconductor devices can work at optimal performance, extend their service life, and maintain system stability and reliability, heat dissipation is an important consideration in semiconductor device design and application.
[0045] In the related art, water cooling is used to dissipate heat from semiconductor devices. However, semiconductor devices usually include multiple chip units, that is, multiple heat sources. After the cooling water passes through the chip unit in the front of the flow direction, its own temperature will rise, and it is difficult to effectively dissipate heat for the chip unit in the back of the flow direction.
[0046] In view of this, first of all, please refer to Figure 1 to Figure 2 , Figure 1 This is a schematic diagram of the structure of a heat dissipation device 100 provided in some embodiments of the present application. Figure 2 A schematic diagram of the physical structure of a circulation conduit 20 is provided for some embodiments of the present application. It should be noted that the circulation conduit 20 is a virtual structure in the heat dissipation device 100. In order to facilitate the display of the structure of the circulation conduit 20, the circulation conduit 20 is displayed through a physical diagram.
[0047] The embodiment of the present application provides a heat dissipation device 100, which is used to dissipate heat from multiple heat sources. The heat dissipation device 100 includes multiple heat exchange chambers 10 and circulation pipes 20. The multiple heat exchange chambers 10 and the multiple heat sources are arranged in a corresponding overlapping manner in the first direction X. The heat exchange chamber 10 includes an inlet end 11 and an outlet end 12. The circulation pipe 20 includes an inflow pipe 21 connected to the inlet end 11 and an outflow pipe 22 connected to the outlet end 12. The circulation pipe 20 is used to circulate a cooling medium. The inflow pipe 21 includes a first main circuit 211 and multiple first branches 212 connected to the first main circuit 211. Different first branches 212 are correspondingly connected to the inlet ends 11 of different heat exchange chambers 10. The cooling medium flows along the first main circuit 211 through different first branches 212, flows into different heat exchange chambers 10 from different inlet ends 11, and flows out along different outlet ends 12.
[0048] The heat dissipation device 100 provided in the embodiment of the present application is applied to the heat dissipation situation where multiple heat sources are integrated on the same structural member. For example, in the field of semiconductor devices, in order to meet the specific functions and circuit designs of semiconductor devices, multiple chip units 202 are usually integrated on the same base plate 201. In the actual working process, the base plate 201 does not generate heat, and it is mainly the multiple chip units 202 that generate heat. The heat dissipation device 100 provided in the embodiment of the present application can be used in the above-mentioned semiconductor devices to dissipate heat from the chip units 202.
[0049] The heat dissipation device 100 includes a plurality of heat exchange chambers 10. The heat dissipation device 100 as a whole is arranged corresponding to the semiconductor device, and the heat exchange chamber 10 in the heat dissipation device 100 is arranged corresponding to the chip unit 202. The chip unit 202 and the cooling medium perform heat exchange in the heat exchange chamber 10, and the heat on the chip unit 202 is transferred to the cooling medium and taken away by the cooling medium, thereby achieving cooling and heat dissipation of the chip unit 202.
[0050] The heat exchange chamber 10 includes an inlet end 11 and an outlet end 12. The cooling medium flows into the heat exchange chamber 10 from the inlet end 11 and flows out of the heat exchange chamber 10 from the outlet end 12. In order to improve the heat exchange efficiency between the cooling medium and the heat source, the heat source and the heat exchange chamber 10 are overlapped in the first direction X, so that the heat source and the heat exchange chamber 10 have at least an overlapping portion when projected in the first direction X, and heat can be directly transferred from the heat source to the heat exchange chamber 10 and then exchange heat with the cooling medium.
[0051] The heat dissipation device 100 includes an inflow pipe 21 connected to the inlet end 11 and an outflow pipe 22 connected to the outlet end 12. During the operation of the heat dissipation device 100, the temperature of the cooling medium before heat exchange with the heat source is set to be a first temperature, the temperature of the cooling medium after heat exchange with the heat source is set to be a second temperature, the temperature of the heat source before heat exchange with the cooling medium is set to be a third temperature, and the temperature of the heat source after heat exchange with the cooling medium is set to be a fourth temperature.
[0052] The temperature of the heat source during operation is the third temperature, and the cooling medium flows from the inlet pipe 21 to the inlet end 11 and enters the heat exchange chamber 10 at the first temperature. The first temperature is lower than the third temperature, and the cooling medium absorbs the heat generated by the heat source inside the heat exchange chamber 10. In the above process, the temperature of the cooling medium gradually increases from the first temperature to the second temperature; at the same time, the temperature of the heat source gradually decreases from the third temperature to the fourth temperature. At this time, the second temperature is slightly lower than the fourth temperature. Subsequently, the cooling medium flows out of the heat exchange chamber 10 from the outlet end 12 at the second temperature and flows out from the outflow pipe 22. The above flow process is combined with the other structures to cycle back and forth to achieve stable heat dissipation of the heat source by the heat dissipation device 100.
[0053] Furthermore, the inflow pipeline 21 includes a first main channel 211 and a plurality of first branches 212 connected to the first main channel 211. The plurality of first branches 212 are connected in parallel, and different first branches 212 are correspondingly connected to the inlet ends 11 of different heat exchange chambers 10. In other words, each first branch 212 is independently connected to the first main channel 211. When the cooling medium flows in the inflow pipeline 21, the cooling medium flows along the first main channel 211 into each relatively independent first branch 212 and enters different heat exchange chambers 10, and then flows out from the outlet ends 12 of the heat exchange chambers 10. In the above-mentioned flow process, based on the circulation flow of the cooling medium, the cooling medium will not flow back from the inlet end 11 of a certain heat exchange chamber 10 to the first branch 212 and then flow into other heat exchange chambers 10. The cooling medium will flow along the first main channel 211 through different first branches 212, flow into different heat exchange chambers 10 from different inlet ends 11, and flow out along different outlet ends 12.
[0054] After the cooling medium flows into the first main circuit 211 at the first temperature, it flows into different heat exchange chambers 10 along different first branches 212. During the first branches 212, the temperature of the cooling medium is still the first temperature, that is, the cooling medium entering different heat exchange chambers 10 is at the first temperature. When the cooling medium enters the heat exchange chamber 10, there is a large difference between the working temperature of the heat source, that is, the third temperature, so as to improve the heat exchange efficiency between the cooling medium and the heat source in the heat exchange chamber 10. At the same time, multiple first branches 212 directly connect different heat exchange chambers 10 to the first main circuit 211, so that each heat source can exchange heat with the cooling medium with a lower temperature, which can improve the uniformity of heat dissipation for multiple heat sources.
[0055] Optionally, the heat dissipation device 100 dissipates heat by air cooling, and the cooling medium can be set to cold air, which circulates in the inlet pipe 21, the heat exchange chamber 10, and the outlet pipe 22. Alternatively, the heat dissipation device 100 dissipates heat by water cooling, and the cooling medium can be set to cooling water, which circulates in the inlet pipe 21, the heat exchange chamber 10, and the outlet pipe 22.
[0056] In summary, in the embodiment of the present application, the heat dissipation device 100 includes a plurality of heat exchange chambers 10, and the heat exchange chambers 10 are arranged corresponding to the heat source. The heat source and the cooling medium perform heat exchange in the heat exchange chamber 10, and the heat on the heat source is transferred to the cooling medium and taken away by the cooling medium, thereby cooling and dissipating the heat source. The heat exchange chamber 10 includes an inlet end 11 and an outlet end 12, and the heat dissipation device 100 includes an inflow pipe 21 connected to the inlet end 11 and an outflow pipe 22 connected to the outlet end 12, and the cooling medium flows in the inflow pipe 21, the inlet end 11, the heat exchange chamber 10, the outlet end 12 and the outflow pipe 22 in sequence. The inflow pipe 21 includes a first main circuit 211 and a plurality of first branches 212 connected to the first main circuit 211, and the plurality of first branches 212 are connected in parallel, and different first branches 212 are connected to the inlet ends 11 of different heat exchange chambers 10. Each first branch 212 is independently connected to the first main circuit 211. When the cooling medium flows into the heat exchange chamber 10 in the inflow pipe 21, the cooling medium in each heat exchange chamber 10 does not exchange heat with the heat source, and the initial temperature is relatively low, which has a large difference from the working temperature of the heat source, so as to improve the heat exchange efficiency between the cooling medium and the heat source in the heat exchange chamber 10. At the same time, multiple first branches 212 directly connect different heat exchange chambers 10 to the first main circuit 211, so that each heat source can exchange heat with the cooling medium with a relatively low temperature, and the uniformity of heat dissipation of multiple heat sources can be improved.
[0057] In some embodiments, the outflow pipe 22 includes a second main circuit 221 and multiple second branches 222 connected to the second main circuit 221, and different second branches 222 are correspondingly connected to the outlet ends 12 of different heat exchange chambers 10. The cooling medium flows from different outlet ends 12 through different second branches 222 and flows out along the second main circuit 221.
[0058] In order to discharge the cooling medium from the heat exchange chamber 10 in a timely manner and to take into account the convenient setting of the outflow pipe 22, the outflow pipe 22 is set to have multiple second branches 222 connected in parallel and all connected to the second main circuit 221. The cooling medium flows into the second branch 222 from the outlet end 12 of the heat exchange chamber 10 and flows out from the second main circuit 221. When the cooling medium enters the heat exchange chamber 10 from the first branch 212, heat is exchanged with the heat source in the process of flowing from the inlet end 11 to the outlet end 12, and directly flows into the second branch 222 at the outlet end 12. The cooling medium in different second branches 222 is collected in the second main circuit 221 and discharged.
[0059] In this embodiment, only the setting of the first branch 212 and the second branch 222 needs to be considered around the heat exchange chamber 10. The second branch 222 can be connected to the second main circuit 221 in a more flexible setting form. Compared with the outflow pipe 22 being set as a single pipe, the above setting method is easy to set and can conveniently correspond the second branch 222 to the outlet end 12, so that the cooling medium can flow from the heat exchange chamber 10 into the second branch 222.
[0060] Exemplarily, the inlet end 11 and the outlet end 12 of the heat exchange chamber 10 are respectively arranged at the two ends of the heat exchange chamber 10 along the second direction Y, the first branch 212 extends along the second direction Y, the second branch 222 also extends along the second direction Y, and the second direction Y intersects with the first direction X. After facilitating the circulation of the cooling medium at the inlet end 11 and the outlet end 12 of the heat exchange chamber 10, it is only necessary to consider connecting the plurality of first branches 212 to the first main path 211, and connecting the plurality of second branches 222 to the second main path 221, so as to facilitate the setting of the inflow pipe 21 and the outflow pipe 22.
[0061] In some embodiments, the extension axis of the first branch 212 is arranged to intersect with the extension direction of the line between the inlet end 11 and the outlet end 12 of the heat exchange chamber 10 .
[0062] When the cooling medium flows inside the first branch 212, the flow direction of the cooling medium is consistent with the extension axis of the first branch 212. When the cooling medium flows inside the heat exchange chamber 10, it flows from the inlet end 11 to the outlet end 12, and the cooling medium is consistent along the extension direction of the connection between the inlet end 11 and the outlet end 12.
[0063] In order to improve the efficiency of heat exchange between the cooling medium and the heat source inside the heat exchange chamber 10, the extension axis of the first branch 212 is arranged to intersect with the extension direction of the line between the inlet end 11 and the outlet end 12 on the heat exchange chamber 10, that is, when the cooling medium flows into the heat exchange chamber 10 from the first branch 212, the flow direction changes at the inlet end 11. Based on the change in the flow direction of the cooling medium at the inlet end 11, the turbulence degree of the cooling medium inside the heat exchange chamber 10 will be increased. When the cooling medium is in a turbulent state, the mixing effect inside it is better, and the momentum and heat exchange between the fluid micro-groups are frequent, thereby improving the efficiency of heat exchange with the heat source.
[0064] Exemplarily, the inlet end 11 and the outlet end 12 of the heat exchange chamber 10 are respectively arranged at two ends of the heat exchange chamber 10 along the second direction Y, and the cooling medium flows inside the heat exchange chamber 10 along the second direction Y. The first branch 212 may extend along the third direction Z, or the first branch 212 may extend along the first direction X, and the third direction Z, the second direction Y and the first direction X intersect each other.
[0065] Furthermore, in some embodiments, the cavity side wall of the heat exchange cavity 10 has a bending structure along the second direction Y. Exemplarily, the projection of the cavity side wall of the heat exchange cavity 10 in the first direction X includes a W structural portion, and the inlet end 11 and the outlet end 12 are respectively located at the two ends of the heat exchange cavity 10 along the second direction Y. The flow direction of the cooling medium inside the heat exchange cavity 10 changes, and turbulence is generated inside the heat exchange cavity 10 to improve the efficiency of heat exchange with the heat source.
[0066] In some embodiments, the inlet end 11 and the outlet end 12 are respectively located at two ends of the heat exchange chamber 10 along the second direction Y, and the second direction Y intersects the first direction X. The first branch 212 and the second branch 222 both extend along the first direction X and are located on the side of the heat exchange chamber 10 away from the heat source along the first direction X. The first branch 212 and the second branch 222 are spaced apart in the second direction Y.
[0067] The inlet end 11 and the outlet end 12 are respectively located at the two ends of the heat exchange chamber 10 along the second direction Y, and the cooling medium flows inside the heat exchange chamber 10 along the second direction Y. The first branch 212 extends along the first direction X, and the first branch 212 is located on the side of the heat exchange chamber 10 away from the heat source along the first direction X. When the cooling medium flows into the heat exchange chamber 10 from the first branch 212, it first extends along the first direction X in the first branch 212, that is, it flows toward the heat source along the first direction X. When passing through the inlet end 11, the flow direction of the cooling medium changes from the first direction X to the second direction Y. When the flow direction of the cooling medium changes, it collides and agitates with the first branch 212 or the side wall of the heat exchange chamber 10 in the first direction X and surges back and forth along the first direction X, and can make multiple contacts with the heat source in the first direction X to improve the heat exchange efficiency with the heat source.
[0068] Further, the first direction X can be set as a vertical direction, the second direction Y is any direction in the horizontal plane, and the heat source is located above the heat exchange chamber 10 in the vertical direction. The second branch 222 also extends along the first direction X and is located on the side of the heat exchange chamber 10 away from the heat source along the first direction X, that is, the first branch 212 and the second branch 222 are located below the heat exchange chamber 10 in the vertical direction. During the flow of the cooling medium, it flows upward along the first branch 212, and flows downward along the second branch 222 after flowing through the heat exchange chamber 10. Through the above-mentioned arrangement of the pipeline, when the cooling medium is cooling water, it can flow out in the second branch 222 by its own gravity, speeding up the rate at which the cooling water flows out of the heat exchange chamber 10, so that new cooling water can be quickly added to the heat exchange chamber 10 to improve the heat dissipation efficiency of the heat source.
[0069] In some embodiments, the heat sink 100 further includes a substrate 101, the substrate 101 has a first surface M1 in the first direction X, the first surface M1 is recessed inward to form a groove structure 1011, the groove bottom wall of the groove structure 1011 is protruding along the first direction X and is provided with a protruding structure 1012, and the protruding structure 1012 forms a second surface M2 on a side away from the groove bottom wall in the first direction X. The second surface M2 is located on a side of the first surface M1 facing the groove bottom wall in the first direction X, and the groove structure 1011 forms a heat exchange chamber 10 between the first surface M1 and the second surface M2. Both side walls of the protruding structure 1012 along the second direction Y are spaced apart from the groove side walls of the groove structure 1011 in the second direction Y, and both side walls of the protruding structure 1012 along the third direction Z are abutted against the groove side walls of the groove structure 1011 in the third direction Z. The protruding structure 1012 and the groove side walls of the groove structure 1011 enclose a first branch 212 and a second branch 222, and the first direction X, the second direction Y and the third direction Z intersect each other.
[0070] The base 101 serves as the main part of the heat dissipation device 100, and the circulation conduit 20 is formed inside the base 101. The circulation conduit 20 is arranged inside the base. Compared with the method of forming the circulation conduit 20 separately, on the one hand, the strength of the conduit side wall of the circulation conduit 20 can be improved, and the probability of the cooling medium penetrating the conduit side wall when flowing in the circulation conduit 20 can be reduced; on the other hand, the overall appearance of the base 101 is relatively flat, and it can be connected and fixed with the remaining structures.
[0071] Specifically, the groove structure 1011 is recessed inward from the first surface M1, the convex structure 1012 has a second surface M2, and the second surface M2 is located on the side of the first surface M1 facing the groove bottom wall, and the groove structure 1011 forms a heat exchange cavity 10 between the second surface M2 and the first surface M1. The heat exchange cavity 10 forms an opening structure in the first direction X. When the cooling medium flows inside the heat exchange cavity 10, it can directly contact the heat source through the opening structure and directly exchange heat, which can improve the cooling efficiency of the cooling medium on the heat source.
[0072] At the same time, the two side walls of the protrusion structure 1012 along the second direction Y are spaced apart from the two side walls of the groove structure 1011 along the second direction Y, and the two side walls of the protrusion structure 1012 along the third direction Z are abutted against the two side walls of the groove structure 1011 along the third direction Z. The protrusion structure 1012 separates the groove structure 1011 into two parts that are connected only above the second surface M2 of the protrusion structure 1012, corresponding to forming a first branch 212 and a second branch 222 connected to the heat exchange chamber 10, the heat exchange chamber 10 forms an inlet end 11 in the overlapping area of its projection with the first branch 212 in the first direction X, and the heat exchange chamber 10 forms an outlet end 12 in the overlapping area of its projection with the second branch 222 in the first direction X.
[0073] The projections of the inlet end 11 and the outlet end 12 in the first direction X are both located inside the heat exchange chamber 10, so that the turbulent part of the cooling medium generated at the inlet end 11 and the turbulent part generated at the outlet end 12 are both located inside the heat exchange chamber 10, which can improve the efficiency of heat exchange between the cooling medium and the heat source in the heat exchange chamber 10.
[0074] In some embodiments, the plurality of heat exchange chambers 10 are spaced apart along the third direction Z, and the first direction X, the second direction Y, and the third direction Z intersect each other. The first main circuit 211 includes a first portion 2111 extending along the second direction Y and a second portion 2112 connected to the first portion 2111 and extending along the third direction Z. The projections of the plurality of first branches 212 in the first direction X are all inside the projections of the second portion 2112 in the first direction X, and the plurality of first branches 212 are all connected to the second portion 2112. The second main circuit 221 includes a third portion 2211 extending along the third direction Z and a fourth portion 2212 connected to the third portion 2211 and extending along the second direction Y. The projections of the plurality of second branches 222 in the first direction X are all inside the projections of the third portion 2211 in the first direction X, and the plurality of second branches 222 are all connected to the third portion 2211.
[0075] The arrangement of the heat exchange chamber 10 corresponds to the heat source. When the heat source is spaced apart along the third direction Z, the heat exchange chamber 10 is also spaced apart along the third direction Z. At the same time, the first branch 212 and the second branch 222 are located inside the projection of the heat exchange chamber 10 along the first direction X. In order to smoothly transmit the cooling medium to the first branch 212 and smoothly transmit the cooling medium from the second branch 222, the first main circuit 211 and the second main circuit 221 are arranged as follows.
[0076] Specifically, the first main circuit 211 includes a first portion 2111 extending along the second direction Y and a second portion 2112 connected to the first portion 2111 and connected along the third direction Z. The projections of the plurality of first branches 212 in the first direction X are all inside the projections of the second portion 2112 in the first direction X, and the plurality of first branches 212 are all connected to the second portion 2112. When the cooling medium flows into the pipe 21, it flows from the first portion 2111 to the second portion 2112, and then flows into different heat exchange chambers 10 from different first branches 212.
[0077] The second main circuit 221 includes a third portion 2211 extending along the third direction Z and a fourth portion 2212 connected to the third portion 2211 and extending along the second direction Y. The projections of the plurality of second branches 222 in the first direction X are all inside the projections of the third portion 2211 in the first direction X, and the plurality of second branches 222 are all connected to the third portion 2211. When the cooling medium flows in the outflow pipe 22, it flows from different second branches 222 to the third portion 2211, and then flows from the third portion 2211 to the fourth portion 2212 and flows out. The inflow pipe 21 and the outflow pipe 22 are located on both sides of the heat exchange chamber 10 along the second direction Y to reduce the probability of setting interference between the inflow pipe 21 and the outflow pipe 22.
[0078] In some embodiments, a plurality of heat exchange chambers 10 are arranged in an array along the second direction Y and the third direction Z. The projection of the first portion 2111 in the first direction X is located between the projections of some heat exchange chambers 10 in the first direction X in the third direction Z. A plurality of second portions 2112 are provided, and the plurality of second portions 2112 are all connected to the first portion 2111. The plurality of second portions 2112 are distributed at intervals along the second direction Y. The projection of the fourth portion 2212 in the first direction X is located on the same side of the projections of the plurality of heat exchange chambers 10 in the first direction X in the third direction Z. A plurality of third portions 2211 are provided, and the plurality of third portions 2211 are all connected to the fourth portion 2212. The plurality of third portions 2211 are distributed at intervals along the second direction Y. The second portion 2112 and the third portion 2211 are distributed alternately in the second direction Y.
[0079] When the heat sources are arranged in an array along the second direction Y and the third direction Z, the heat exchange chamber 10 is also arranged in an array along the second direction Y and the third direction Z. At the same time, the first branch 212 and the second branch 222 are located inside the projection of the heat exchange chamber 10 along the first direction X. In order to smoothly transmit the cooling medium to the first branch 212 and smoothly transmit the cooling medium from the second branch 222, the first main circuit 211 and the second main circuit 221 are arranged as follows.
[0080] Specifically, the projection of the first part 2111 in the first direction X is located between the projections of part of the heat exchange chamber 10 in the first direction X in the third direction Z. A plurality of second parts 2112 are provided, and the plurality of second parts 2112 are all connected to the first part 2111, and the plurality of second parts 2112 are spaced apart along the second direction Y. When the cooling medium flows into the pipeline 21, it first flows inside the first part 2111 along the second direction Y, then flows inside different second parts 2112 along the third direction Z, and then flows into different first branches 212 and enters different heat exchange chambers 10.
[0081] The projection of the fourth part 2212 in the first direction X is located on the same side of the projections of the plurality of heat exchange chambers 10 in the first direction X in the third direction Z. A plurality of third parts 2211 are provided, and the plurality of third parts 2211 are all connected to the fourth part 2212, and the plurality of third parts 2211 are spaced apart along the second direction Y. When the cooling medium flows in the outflow pipe 22, it flows from different second branches 222 to different third parts 2211, flows inside the third part 2211 along the third direction Z, and then flows into the fourth part 2212 and flows out along the second direction Y.
[0082] The inlet end 11 and the outlet end 12 are located at the two ends of the heat exchange chamber 10 along the second direction Y, and the projections of the first branch 212 and the second branch 222 in the first direction X are located inside the heat exchange chamber 10. Correspondingly, the second part 2112 and the third part 2211 are alternately distributed in the second direction Y, corresponding to the first branch 212 and the second branch 222 being arranged at intervals in the second direction Y to reduce the probability of setting interference between the inflow pipe 21 and the outflow pipe 22.
[0083] In some embodiments, the inner diameter of the first branch channel 212 gradually increases from the first main channel 211 toward one side of the heat exchange chamber 10 .
[0084] In order to reduce the flow pressure of the cooling medium in the pipe 21, the inner diameter of the first branch 212 is set to gradually increase from the first main channel 211 toward the side of the heat exchange chamber 10, which can reduce the difficulty of the cooling medium flowing forward and reduce the flow pressure of the cooling medium in the pipe 21, so as to reduce the pressure on the base 101. At the same time, the inner diameter of the first branch 212 is set to gradually increase from the first main channel 211 toward the side of the heat exchange chamber 10, which can also increase the flow rate of the cooling medium in the pipe 21, thereby accelerating the rate at which the cooling medium flows into the heat exchange chamber 10, increasing the circulation rate of the cooling medium, and thus improving the heat dissipation efficiency of the heat dissipation device 100.
[0085] Second, see Figures 1 to 3 The embodiment of the present application provides a semiconductor device, which includes a chip structure 200 and a heat dissipation device 100 provided in the first aspect of the embodiment of the present application, wherein the chip structure 200 and the heat dissipation device 100 are stacked along a first direction X. The chip structure 200 includes a plurality of chip units 202, the heat source includes the chip unit 202, the heat exchange cavity 10 forms an opening structure on a side facing the chip structure 200, the chip structure 200 closes the opening structure in the first direction X, and the projection of the chip unit 202 in the first direction X is inside the projection of the opening structure in the first direction X.
[0086] Specifically, the chip structure 200 includes a bottom plate 201, a plurality of chip units 202 are spaced apart on the bottom plate 201, the bottom plate 201 connects the plurality of chip units 202 as a whole, and the bottom plate 201 closes the opening structure of the heat exchange cavity 10 in the first direction X. The projection of the chip unit 202 in the first direction X is set to be inside the projection of the opening structure in the first direction X, so that when the cooling medium flows inside the heat exchange cavity 10, it can pass through the entire chip unit 202 and can make full contact with the chip unit 202, thereby fully cooling the chip unit 202.
[0087] In some embodiments, the first branch 212 extends along the first direction X, is connected to the side of the heat exchange chamber 10 away from the chip unit 202, and the projection of the first branch 212 in the first direction X is inside the projection of the chip unit 202 in the first direction X.
[0088] When the cooling medium flows in the first branch 212, the flow direction changes at the inlet end 11, and the position where the cooling medium contacts the chip structure 200 is located inside the projection area of the chip unit 202 on the first direction X, so that the turbulent part generated by the cooling medium at the inlet end 11 is located inside the projection area of the chip unit 202 on the first direction X, which can improve the efficiency of heat exchange between the cooling medium and the chip unit 202.
[0089] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A heat dissipation device, characterized in that: The heat dissipation device is used to dissipate heat from multiple heat sources, and the heat dissipation device includes: A plurality of heat exchange chambers, wherein the plurality of heat exchange chambers and the plurality of heat sources are arranged to overlap in a corresponding manner in a first direction, and the heat exchange chamber comprises an inlet end and an outlet end; A circulation pipeline, comprising an inflow pipeline connected to the inlet end and an outflow pipeline connected to the outlet end, wherein the circulation pipeline is used to circulate a cooling medium; Among them, the inflow pipeline includes a first main circuit and multiple first branches connected to the first main circuit, different first branches are correspondingly connected to the inlet ends of different heat exchange chambers, and the cooling medium flows along the first main circuit through different first branches, flows into different heat exchange chambers from different inlet ends and flows out along different outlet ends.
2. The heat dissipation device according to claim 1, characterized in that: The outflow pipeline includes a second main circuit and multiple second branches connected to the second main circuit, different second branches are correspondingly connected to the outlet ends of different heat exchange chambers, and the cooling medium flows from different outlet ends through different second branches and flows out along the second main circuit.
3. The heat dissipation device according to claim 1, characterized in that: The extending axial direction of the first branch is arranged to intersect with the extending direction of the line between the inlet end and the outlet end of the heat exchange chamber.
4. The heat dissipation device according to claim 2, characterized in that: The inlet end and the outlet end are respectively located at two ends of the heat exchange chamber along a second direction, and the second direction intersects with the first direction; The first branch and the second branch both extend along the first direction and are located on a side of the heat exchange chamber away from the heat source along the first direction. The first branch and the second branch are spaced apart in the second direction.
5. The heat dissipation device according to claim 4, characterized in that: The heat dissipation device further comprises a base, the base having a first surface in the first direction, the first surface being inwardly concave to form a groove structure, the groove bottom wall of the groove structure being protruded along the first direction to form a convex structure, the convex structure forming a second surface on a side away from the groove bottom wall in the first direction; The second surface is located on the side of the first surface facing the groove bottom wall in the first direction, and the groove structure forms the heat exchange cavity between the first surface and the second surface; Both side walls of the protrusion structure along the second direction are spaced apart from the groove side walls of the groove structure in the second direction, and both side walls of the protrusion structure along the third direction are abutted against the groove side walls of the groove structure in the third direction. The protrusion structure and the groove side walls of the groove structure enclose the first branch and the second branch, and the first direction, the second direction and the third direction intersect each other.
6. The heat dissipation device according to claim 4, characterized in that: The plurality of heat exchange chambers are spaced apart and distributed along the third direction, and the first direction, the second direction and the third direction intersect each other; The first main circuit includes a first portion extending along the second direction and a second portion connected to the first portion and extending along the third direction, the projections of the first branches in the first direction are all inside the projections of the second portion in the first direction, and the first branches are all connected to the second portion; The second main circuit includes a third part extending along a third direction and a fourth part connected to the third part and extending along the second direction, the projections of multiple second branches in the first direction are all inside the projections of the third part in the first direction, and multiple second branches are all connected to the third part.
7. The heat dissipation device according to claim 6, characterized in that: The plurality of heat exchange chambers are arranged in an array along the second direction and the third direction; The projection of the first part in the first direction is located between the projections of some of the heat exchange chambers in the first direction in the third direction, and a plurality of the second parts are provided, and the plurality of the second parts are all connected to the first part, and the plurality of the second parts are spaced apart and distributed along the second direction; The projection of the fourth part in the first direction is on the same side of the projections of the plurality of heat exchange chambers in the first direction in the third direction, a plurality of the third parts are provided, the plurality of the third parts are all connected to the fourth part, the plurality of the third parts are distributed at intervals along the second direction, and the second parts and the third parts are distributed alternately in the second direction.
8. The heat dissipation device according to claim 1, characterized in that: The inner diameter of the first branch gradually increases from the first main path toward one side of the heat exchange chamber.
9. A semiconductor device, characterized in that: A heat dissipation device comprising a chip structure and any one of claims 1 to 8, wherein the chip structure and the heat dissipation device are stacked along the first direction; The chip structure includes a plurality of chip units, the heat source includes the chip unit, the heat exchange cavity forms an opening structure toward one side of the chip structure, the chip structure closes the opening structure in the first direction, and the projection of the chip unit in the first direction is inside the projection of the opening structure in the first direction.
10. The semiconductor device according to claim 9, characterized in that The first branch extends along the first direction, is connected to a side of the heat exchange cavity away from the chip unit, and a projection of the first branch in the first direction is inside a projection of the chip unit in the first direction.