Radiating device with micro-channel radiator

Abstract

The invention discloses a heat dissipation device with a micro-channel radiator, and particularly relates to the technical field of cooling devices.The heat dissipation device comprises a shell, a cabinet door is rotationally connected to the front end of the shell, an isolation pad is fixedly connected to the bottom wall of an inner cavity of the shell, and a mounting box is fixedly connected to the front portion of the upper end of the isolation pad; the left and right ends and the rear end of the mounting box are jointly provided with a cooling structure, and the rear end of the cooling structure is provided with a cooling structure. According to the heat dissipation device with the micro-channel heat dissipater, cooling liquid in the cooling structure circularly flows through the effect of the cooling structure and the principle of heat convection, then heat generated by operation of the mounting box is carried into the cooling structure, the cooling liquid is cooled through the effect of the cooling structure, and the heat dissipation efficiency is improved. And the cooled cooling liquid continues to circulate in the cooling structure, heat of the cooling liquid is dissipated into air through the cooling structure, uniform heat dissipation is conducted on the mounting box through the cooling structure, the fault rate is reduced, and the operation stability of the equipment is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of cooling devices, and in particular to a heat dissipation device with a microchannel radiator. Background Art

[0002] As the demand for electricity continues to rise, the heat dissipation management of distribution cabinets has become increasingly important. As an important part of the power system, the temperature control effect of the power cabinet directly affects the safety and reliability of the system. The electrical components inside the power cabinet will generate a lot of heat when they are working for a long time, especially in summer. Due to the small space inside the power cabinet, it is not only not conducive to the construction personnel to repair and handle the inside of the transformer box, but also makes it difficult for the heat inside the transformer box to dissipate into the air. It is easy to damage the electrical components inside the transformer box due to high temperature or short-circuit the circuit connection lines due to high temperature, greatly increasing the hazards of using conventional power cabinets.

[0003] At present, the structure of the power cabinet is relatively simple. When encountering a hot environment, the temperature inside the power cabinet is not easy to dissipate. The electrical equipment in the power cabinet accelerates aging under the action of high temperature, and the failure rate increases. The heat dissipation device of some power cabinets dissipates heat through water cooling, but water cooling will generate a large amount of water vapor and water droplets, which need to be collected and processed. Since the power cabinet is filled with control circuits, etc., direct water cooling will have certain safety hazards.

[0004] Since the internal space of the power cabinet is small, it is not conducive to the heat dissipation into the air, so the components inside the power cabinet are damaged due to high temperature or the circuit connection lines fail due to high temperature; the heat dissipation devices of some power cabinets dissipate heat through water cooling. Under high temperature environment conditions, the heat dissipation effect will be greatly reduced and the heat dissipation effect is general. Summary of the invention

[0005] The main purpose of the present invention is to provide a heat dissipation device with a microchannel radiator, which can effectively solve the problems of uneven heat dissipation, low cooling efficiency and low heat exchange efficiency in existing devices.

[0006] To achieve the above object, the technical solution adopted by the present invention is: A heat dissipation device with a microchannel radiator comprises a shell, the front end of the shell is rotatably connected to a cabinet door, the bottom wall of the shell inner cavity is fixedly connected to an isolation pad, the front part of the upper end of the isolation pad is fixedly connected to an installation box, the left and right ends and the rear end of the installation box are jointly provided with a cooling structure, and the rear end of the cooling structure is provided with a temperature reduction structure.

[0007] Preferably, the cooling structure includes a back plate fixed to the inner cavity of the shell and tightly attached to the rear end of the installation box, the front end of the back plate is symmetrically fixedly connected with a side contact assembly, the upper part of the rear end of the back plate is provided with a connecting pipe 2 connected to the return pipes on both sides, the lower part of the rear end of the back plate is provided with a return pipe connected to the return pipes on both sides, and the rear ends of the return pipe and the connecting pipe 2 are both connected to the cooling structure.

[0008] Preferably, the side contact assembly includes a side panel that is fitted with a side wall of the installation box, and a plurality of heat exchange components are linearly distributed on the inner surface of the side panel. Water supply pipes connected to the second connecting pipe are symmetrically opened on the upper side of the inner surface of the side panel, and the left and right sides of several heat exchange components are connected to the water supply pipe on the same side. A warm water pipe connected to the return pipe is commonly opened on the rear of the inner surface of several heat exchange components.

[0009] Preferably, the heat exchange component includes a Z-shaped heat exchange groove, and the inner surface of the side plate located at the lower side of the Z-shaped heat exchange groove is provided with a cold water pipe connected to an adjacent water supply pipe, and the cold water pipe and the water supply pipe are fixedly connected at the junction with a spring support ring, and the ends of the spring support rings on both sides that are away from each other are fixedly connected with a T-shaped piston valve that is slidably connected to the inner surface of the cold water pipe, and the front and rear sides of the T-shaped piston valve are provided with through holes connected to the rear end, and a plurality of connecting pipes connected to the inner cavity of the Z-shaped heat exchange groove are linearly distributed on the upper part of the inner surface of the cold water pipe, the Z-shaped heat exchange groove located at the upper part overlaps with the Z-shaped heat exchange groove located at the lower part on the left and right, and the side of the inner surface of the Z-shaped heat exchange groove away from the installation box is connected to the warm water pipe.

[0010] Preferably, an upper end of the connecting pipe is rotatably connected to a swirl cap, and a plurality of spiral grooves communicating with the outer surface are annularly distributed on the inner surface of the swirl cap.

[0011] Preferably, heat exchange tubes are symmetrically provided on the inner surface of the back plate, the upper sides of the two heat exchange tubes are connected to the connecting tube 2, the lower sides of the two heat exchange tubes are connected to the return pipe, and the connection between the two heat exchange tubes and the return pipe is fixedly connected with a one-way valve.

[0012] Preferably, the cooling structure includes a cooling box fixedly connected to the rear end of the back plate and a circulating pump fixedly connected to the bottom wall of the inner cavity of the cooling box, a water pipe 1 connected to a return pipe is fixedly connected to the lower front end of the cooling box, one end of the water pipe 1 away from the back plate is connected to the input side of the circulating pump and extends to the upper part of the inner cavity of the water pipe 2 and is fixedly connected to an overflow assembly, a water pipe 2 connected to the output end of the circulating pump is opened at the upper front end of the cooling box, a plurality of baffles are linearly distributed and fixedly connected to the inner surface of the cooling box, and a semiconductor refrigeration plate is fixedly connected to the rear ends of the plurality of baffles.

[0013] Preferably, the overflow assembly comprises branch pipes which are linearly distributed and fixedly connected to the side of the cooling box, several of the branch pipes are connected to a water pipe, and the upper ends of several of the branch pipes are provided with overflow ports connected to their inner cavities.

[0014] Preferably, a plurality of guide grooves are linearly distributed on the upper ends of the baffles, and the guide grooves on two adjacent baffles are staggered in the vertical direction.

[0015] Preferably, the hot end of the semiconductor refrigeration plate is linearly distributed and fixedly connected with a plurality of heat dissipation fins, the rear end of the cooling box is fixedly connected with a cooling box, the upper part of the rear end of the cooling box is provided with an air outlet that passes through the rear part of the inner cavity of the shell and is connected with the rear end of the shell, the rear end of the cooling box is linearly distributed and fixedly connected with a plurality of fans, the rear end of the shell is provided with an air inlet corresponding to the position of the fan, the lower part of the rear end of the cooling box is fixedly installed with a mesh plate that connects the cooling box and the inner cavity of the cooling box, and the surface of the mesh plate is provided with a plurality of capillaries that pass through the front and back and are equipped with one-way valves.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention performs heat exchange with the inner wall of the installation box through the cooperation of the cooling structure and the installation box, and circulates the coolant in the cooling structure through the action of the cooling structure and the principle of heat convection, thereby carrying the heat generated by the operation of the installation box into the cooling structure, and cooling the coolant through the action of the cooling structure. The cooled coolant continues to circulate in the cooling structure, and its heat is dissipated into the air through the cooling structure. The cooling structure evenly dissipates the heat of the installation box, thereby ensuring that the temperature in the installation box is within a safe range, reducing the failure rate, and ensuring the stability of equipment operation.

[0017] 2. The present invention dissipates heat through contact between the Z-shaped heat exchange groove opened in the side contact component and the installation box, and promotes the circulation of the coolant in the Z-shaped heat exchange groove through the action of the water supply pipe and the warm water pipe. The swirl cap provided in the Z-shaped heat exchange groove further promotes the flow of the coolant in the Z-shaped heat exchange groove to form a lasing swirl, thereby accelerating the movement of molecules in the coolant, accelerating its heat exchange rate, and promoting the heat exchange efficiency of the coolant through the side plate and the installation box, thereby improving the heat dissipation efficiency and ensuring that the temperature in the installation box is within a safe range.

[0018] 3. The present invention delivers high-temperature coolant to the upper layer of the cooling box through the cooperation of water pipe 1 and a circulating pump, and distributes it evenly to the cooling box to form a water curtain through the action of the overflow component. The baffle and the guide groove opened on the upper side of the baffle plate allow the coolant to circulate in the cooling box, and the baffle plate and the semiconductor refrigeration plate are used to cool the box. The cooled coolant is delivered to the connecting pipe 2 through the action of water pipe 1 and water pipe 2, so that the coolant in the connecting pipe 2 is circulated, and the coolant is kept at a low temperature, ensuring that the cooling structure can continuously dissipate heat from the installation box. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 A schematic diagram of the positional relationship between the isolation pad and the housing of the present invention; Figure 3 It is a schematic structural diagram of the cooling structure of the present invention; Figure 4 It is a schematic structural diagram of the side contact assembly of the present invention; Figure 5 It is a structural schematic diagram of the heat exchange component of the present invention; Figure 6 It is a schematic diagram of the positional relationship between the T-shaped piston valve and the water supply pipe of the present invention; Figure 7 It is a schematic diagram of the structure of the swirl cap of the present invention; Figure 8 is a schematic diagram of the cross-sectional structure of the back plate of the present invention; Fig. 9 It is a structural schematic diagram of the cooling structure of the present invention; Fig.10 For the present invention Fig. 9 A is an enlarged schematic diagram of the local structure at center A; Fig.11 It is a schematic structural diagram of the cooling box of the present invention.

[0020] In the figure: 1, housing; 2, cabinet door; 3, installation box; 4, cooling structure; 41, side contact assembly; 411, side plate; 412, heat exchange component; 4121, Z-shaped heat exchange groove; 4122, cold water pipe; 4123, T-shaped piston valve; 4124, swirl cap; 4125, spiral groove; 4126, connecting pipe 1; 4127, spring support ring; 413, water supply pipe; 414, warm water pipe; 42, back plate; 422, heat exchange pipe; 423, one-way valve; 43, connecting pipe 2; 44, return pipe; 5, cooling structure; 51, cooling box; 52, water pipe 1; 53, circulation pump; 54, semiconductor refrigeration plate; 541, cooling box; 542, air outlet; 543, cooling fins; 544, fan; 545, mesh plate; 55, baffle; 56, guide groove; 57, water pipe 2; 58, overflow assembly; 581, branch pipe; 582, overflow port; 6, isolation pad. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0022] Embodiment 1, as Figure 1 and Figure 2As shown, a heat dissipation device with a microchannel radiator includes a shell 1, a cabinet door 2 is rotatably connected to the front end of the shell 1, an isolation pad 6 is fixedly connected to the bottom wall of the inner cavity of the shell 1, an installation box 3 is fixedly connected to the front of the upper end of the isolation pad 6, a cooling structure 4 is commonly provided at the left and right ends and the rear end of the installation box 3, and a cooling structure 5 is provided at the rear end of the cooling structure 4.

[0023] The isolation pad 6 is used to prop up the installation box 3 . The isolation pad 6 has a certain water absorption capacity to prevent the internal coolant from leaking due to external impact or other collisions and causing damage to the equipment in the installation box 3 .

[0024] During the operation of this embodiment, first, heat exchange is performed with the inner wall of the installation box 3 through the cooperation of the cooling structure 4 and the installation box 3, and the coolant in the cooling structure 4 circulates through the action of the cooling structure 5 and the principle of heat convection, thereby carrying the heat generated by the operation of the installation box 3 into the cooling structure 5, and the cooling liquid is cooled by the cooling structure 5. The cooled coolant continues to circulate in the cooling structure 4, and its heat is dissipated into the air through the cooling structure 5. The cooling structure 4 evenly dissipates the heat to the installation box 3, thereby ensuring that the temperature in the installation box 3 is within a safe range, reducing the failure rate, and ensuring the stability of the equipment operation.

[0025] Embodiment 2. Based on Embodiment 1, this embodiment dissipates heat through contact between the Z-shaped heat exchange groove 4121 opened in the side contact component 41 and the installation box 3, and promotes the circulation of the coolant in the Z-shaped heat exchange groove 4121 through the action of the water supply pipe 413 and the warm water pipe 414. Further, the swirl cap 4124 provided in the Z-shaped heat exchange groove 4121 promotes the flow of the coolant in the Z-shaped heat exchange groove 4121 to form a swirl, thereby accelerating the movement of molecules in the coolant, accelerating its heat exchange rate, and promoting the heat exchange efficiency between the coolant and the installation box 3 through the side plate 411, thereby improving the heat dissipation efficiency and ensuring that the temperature in the installation box 3 is within a safe range.

[0026] Specifically, to achieve contact heat exchange with the equipment, refer to Figure 3 The cooling structure 4 includes a back plate 42 fixed to the inner cavity of the shell 1 and tightly attached to the rear end of the installation box 3. The front end of the back plate 42 is symmetrically fixedly connected with a side contact component 41. A connecting pipe 2 43 connected with the return pipes 44 on both sides is opened at the upper part of the rear end of the back plate 42. A return pipe 44 connected with the return pipes 44 on both sides is opened at the lower part of the rear end of the back plate 42. The rear ends of the return pipe 44 and the connecting pipe 2 43 are both connected to the cooling structure 5.

[0027] The back plate 42 contacts the rear side of the installation box 3, and heat is exchanged from the rear side of the installation box 3. The coolant is simultaneously circulated in the back plate 42 and the side contact assembly 41 through the connecting pipe 2 43 and the return pipe 44 connected to the side contact assemblies 41 on both sides, thereby keeping the installation box 3 in a low-temperature operating state. At the same time, the connecting pipe 2 43 and the return pipe 44 cooperate with the cooling structure 5 to keep the coolant in a low-temperature state.

[0028] Furthermore, in order to achieve contact heat exchange on the side wall of the equipment and ensure that the temperature is within a safe range, refer to Figure 4 , Figure 5 , Figure 6 and Figure 8 The side contact assembly 41 includes a side plate 411 that is attached to the side wall of the installation box 3. A plurality of heat exchange components 412 are linearly distributed on the inner surface of the side plate 411. Water supply pipes 413 that are connected to the connecting pipe 2 43 are symmetrically opened on the upper side of the inner surface of the side plate 411. The left and right sides of the plurality of heat exchange components 412 are connected to the water supply pipe 413 on the same side. A warm water pipe 414 that is connected to the return pipe 44 is commonly opened on the rear of the inner surface of the plurality of heat exchange components 412.

[0029] The side plate 411 is a copper plate and is fitted with the side wall of the installation box 3. The heat exchange component 412 opened on the inner side is filled with coolant, and the coolant circulates through the water supply pipe 413 and the warm water pipe 414, so that the coolant in the heat exchange component 412 is in a low temperature state, thereby ensuring the heat exchange efficiency with the installation box 3.

[0030] Further, in order to achieve heat exchange between the coolant and the equipment and promote the flow of the coolant in the Z-shaped heat exchange groove 4121, thereby promoting the heat exchange rate, refer to Figure 5 , Figure 6 and Figure 7 The heat exchange component 412 includes a Z-shaped heat exchange groove 4121. The inner surface of the side plate 411 located below the Z-shaped heat exchange groove 4121 is provided with a cold water pipe 4122 connected to the adjacent water supply pipe 413. The cold water pipe 4122 and the water supply pipe 413 are fixedly connected with a spring support ring 4127 at the joint. The ends of the spring support rings 4127 on both sides that are away from each other are fixedly connected with a T-shaped piston valve 4123 that is slidably connected to the inner surface of the cold water pipe 4122. The front and rear sides of the T-shaped piston valve 4123 are provided with a spring support ring 4127 that is connected to the rear end. A through hole is provided on the upper inner surface of the cold water pipe 4122, and a plurality of connecting pipes 4126 connected to the inner cavity of the Z-shaped heat exchange groove 4121 are linearly distributed. The Z-shaped heat exchange groove 4121 located at the upper part overlaps with the Z-shaped heat exchange groove 4121 located at the lower part, and the inner surface of the Z-shaped heat exchange groove 4121 away from the installation box 3 is connected to the warm water pipe 414; the upper end of the connecting pipe 4126 is rotatably connected to a swirl cap 4124, and the inner surface of the swirl cap 4124 is provided with a plurality of spiral grooves 4125 connected to the outer surface in an annular distribution.

[0031] The Z-shaped heat exchange groove 4121 is a vertical Z-shape, and the front vertical parts and rear vertical parts of two adjacent Z-shaped heat exchange grooves 4121 overlap. Due to the molecular thermal effect and the principle of thermal convection, the high-temperature liquid will flow upward relatively, so that the temperature in the Z-shaped heat exchange groove 4121 will be layered, which can be regarded as two chambers with different temperatures, wherein the upper side of the Z-shaped heat exchange groove 4121 away from the installation box 3 is connected to the warm water pipe 414, wherein the high-temperature coolant will overflow from the warm water pipe 414 and return to the return pipe 44 through the warm water pipe 414; During this process, the water supply pipe 413 will continuously supply coolant to the cold water pipe 4122. When in use, the coolant in the water supply pipe 413 is full. Only when the water supply pipe 413 is full of coolant can the pressure of the spring support ring 4127 on the T-shaped piston valve 4123 be offset, and the T-shaped piston valves 4123 in all the cold water pipes 4122 can be pushed open to enter the cold water pipe 4122, and enter the swirl cap 4124 through the connecting pipe 4126. The coolant in the swirl cap 4124 will be sprayed outward along the path of the spiral groove 4125 under the action of pressure. At the same time, since the path of the spiral groove 4125 is helical, the water flow it sprays out has an initial angle, which will stir the coolant originally in the Z-shaped heat exchange groove 4121 to cause a swirl, accelerate the molecular collision rate, thereby improving the heat exchange efficiency between the coolant and the side plate 411, and then improve the cooling rate of the side plate 411 to the installation box 3.

[0032] Further, to achieve heat exchange with the equipment from the rear and assist coolant circulation, refer to Figure 8 Heat exchange tubes 422 are symmetrically provided on the inner surface of the back plate 42. The upper sides of the two heat exchange tubes 422 are connected to the connecting tube 2 43, and the lower sides of the two heat exchange tubes 422 are connected to the return pipe 44. The connection between the two heat exchange tubes 422 and the return pipe 44 is fixedly connected with a one-way valve 423.

[0033] In addition to being diverted to the side contact component 41, the coolant in the connecting pipe 2 43 also enters the heat exchange tube 422, and cools the installation box 3 from the rear side through heat exchange between the heat exchange tube 422 and the back plate 42, thereby assisting the side contact component 41 in cooling and dissipating the heat of the installation box 3.

[0034] Embodiment 3: Based on Embodiment 2, this embodiment further delivers high-temperature coolant to the upper layer of the cooling box 51 through the cooperation of water pipe 1 52 and circulating pump 53, and evenly distributes it to the cooling box 51 to form a water curtain through the action of overflow component 58. The baffle 55 and the guide groove 56 opened on its upper side are used to make the coolant circulate in the cooling box 51, and the baffle 55 and semiconductor refrigeration plate 54 are used to cool the coolant. The cooled coolant is delivered to connecting pipe 2 43 through the action of water pipe 1 52 and water pipe 2 57, so that the coolant in connecting pipe 2 43 forms a circulation, and the coolant is kept at a low temperature, thereby ensuring that the cooling structure 4 can continuously dissipate heat from the installation box 3.

[0035] Specifically, to achieve cooling of the coolant, refer to Fig. 9 and Fig.10 The cooling structure 5 includes a cooling box 51 fixedly connected to the rear end of the back plate 42 and a circulating pump 53 fixedly connected to the bottom wall of the inner cavity of the cooling box 51. A water pipe 52 connected to the return pipe 44 is fixedly connected to the lower front end of the cooling box 51. One end of the water pipe 52 away from the back plate 42 is connected to the input side of the circulating pump 53 and extends to the upper part of the inner cavity of the water pipe 2 57 and is fixedly connected to an overflow component 58. A water pipe 2 57 connected to the output end of the circulating pump 53 is provided at the upper front end of the cooling box 51. A plurality of baffles 55 are linearly distributed and fixedly connected to the inner surface of the cooling box 51, and a semiconductor refrigeration plate 54 is fixedly connected to the rear ends of the plurality of baffles 55.

[0036] It should be specially noted that the above-mentioned circulation pump 53 is a conventional dual-input, dual-output water pump in the prior art, which can absorb high-temperature coolant and send it to the upper side of the cooling box 51 through the water pipe 1 52, and absorb the coolant at the bottom of the cooling box 51 and send it into the connecting pipe 2 43 through the water pipe 2 57. This structure has been widely used in the prior art. In the present invention, it is only used to realize the function of promoting the circulation of the coolant, and its internal structure, operating principle, wiring, and control method are not described in detail.

[0037] Furthermore, in order to make the coolant flow downward evenly, refer to Fig.10 The overflow assembly 58 includes branch pipes 581 that are linearly distributed and fixedly connected to the side of the cooling box 51. Several branch pipes 581 are connected to the water pipe 52. The upper ends of several branch pipes 581 are provided with overflow ports 582 that are connected to their inner cavities; the upper ends of the baffles 55 are linearly distributed and provided with several guide grooves 56, and the guide grooves 56 on two adjacent baffles 55 are staggered with each other in the vertical direction.

[0038] The semiconductor refrigeration sheet 54 is used to cool the coolant in the cooling box 51 through the baffle 55. The guide groove 56 provided on the upper part of the baffle 55 can prolong the time for the coolant to flow through the cooling box 51, improve the cooling efficiency, and ensure that the coolant sent back to the connecting pipe 2 43 is in a low temperature state; Furthermore, the coolant is evenly delivered into the branch pipe 581 by utilizing the function of water pipe 2 57 and the overflow assembly 58, and overflows out through the overflow port 582. The overflowing coolant is no longer scattered and discontinuous, but can form a water curtain, thereby spreading flat on the baffle 55, ensuring the contact area between the coolant and the baffle 55, and improving the cooling efficiency of the coolant.

[0039] Further, in order to achieve cooling of the coolant and ensure that the semiconductor refrigeration sheet 54 is in an efficient cooling state, refer to Fig.11 A plurality of heat dissipating fins 543 are linearly distributed and fixedly connected to the hot end of the semiconductor refrigeration sheet 54, a cooling box 541 is fixedly connected to the rear end of the cooling box 51, an air outlet 542 is provided at the upper rear end of the cooling box 541 and passes through the rear end of the inner cavity of the shell 1 and is connected to the rear end of the shell 1, a plurality of fans 544 are linearly distributed and fixedly connected to the rear end of the cooling box 541, an air inlet is provided at the rear end of the shell 1 corresponding to the position of the fan 544, a mesh plate 545 connecting the cooling box 541 and the inner cavity of the cooling box 51 is fixedly installed at the lower rear end of the cooling box 51, a plurality of capillaries which pass through the front and back and are equipped with one-way valves are provided on the surface of the mesh plate 545.

[0040] When the semiconductor cooling sheet 54 is in use, its hot end will generate heat. If the hot end is not continuously cooled, the cooling efficiency of the cold end cannot be guaranteed. Therefore, a heat dissipation fin 543 is installed at the hot end, and air is blown into the cooling box 541 through a fan 544, and the air flow is driven to flow between the heat dissipation fins 543 and the hot air is discharged through the air outlet 542, so as to maintain the cooling efficiency of the cold end of the semiconductor cooling sheet 54. Synchronously, the air intake rate of the fan 544 is greater than the air outlet rate of the air outlet 542, which will generate a certain pressure in the cooling box 541. These pressures will enter the inner cavity of the cooling box 51 through the micropores opened on the mesh plate 545, and form bubbles in the coolant in the cooling box 51. These bubbles will follow the coolant into the cooling structure 4, thereby further accelerating the molecular movement of the coolant in the Z-shaped heat exchange groove 4121 through the impact generated by the stirring and rupture of the bubbles, thereby accelerating the heat exchange efficiency. In order to avoid excessive pressure, a through hole connected to the cooling box 541 is opened above the cooling box 51, and a one-way valve is installed in the through hole to release the pressure in the cooling box 51.

[0041] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation device with a microchannel heat sink, comprising a housing (1), the front end of the housing (1) being rotatably connected to a cabinet door (2), the bottom wall of the inner cavity of the housing (1) being fixedly connected to an isolation pad (6), the upper front end of the isolation pad (6) being fixedly connected to a mounting box (3), characterized in that: The installation box (3) is provided with a cooling structure (4) at both left and right ends and at the rear end, and a temperature reduction structure (5) is provided at the rear end of the cooling structure (4); The cooling structure (4) comprises a back plate (42) fixed to the inner cavity of the housing (1) and in close contact with the rear end of the installation box (3), and a side contact component (41) is fixedly connected to the front end of the back plate (42) in a left-right symmetrical manner; The side contact assembly (41) comprises a side plate (411) fitted with a side wall of the installation box (3), and a plurality of heat exchange components (412) are linearly distributed on the inner surface of the side plate (411); The heat exchange component (412) comprises a Z-shaped heat exchange groove (4121); a portion of the inner surface of the side plate (411) located below the Z-shaped heat exchange groove (4121) is provided with a cold water pipe (4122) connected to an adjacent water supply pipe (413); a plurality of connecting pipes (4126) connected to the inner cavity of the Z-shaped heat exchange groove (4121) are linearly distributed on the upper portion of the inner surface of the cold water pipe (4122); the Z-shaped heat exchange groove (4121) located at the upper portion overlaps with the Z-shaped heat exchange groove (4121) located at the lower portion, and the side of the inner surface of the Z-shaped heat exchange groove (4121) away from the installation box (3) is both connected to the warm water pipe (414); The upper end of the connecting pipe 1 (4126) is rotatably connected to a swirl cap (4124), and the inner surface of the swirl cap (4124) is provided with a plurality of spiral grooves (4125) in an annular distribution and connected to the outer surface.

2. A heat sink with a microchannel heat sink according to claim 1, characterized in that: A second connecting pipe (43) communicating with the return pipes (44) on both sides is provided at the upper portion of the rear end of the back plate (42), and a return pipe (44) communicating with the return pipes (44) on both sides is provided at the lower portion of the rear end of the back plate (42). The return pipe (44) and the second connecting pipe (43) are both communicated with the cooling structure (5) at the rear ends.

3. A heat dissipation device with a microchannel heat sink according to claim 2, characterized in that: A water supply pipe (413) connected to the second connecting pipe (43) is symmetrically provided on the upper side of the inner surface of the side plate (411), and the left and right sides of the plurality of heat exchange components (412) are connected to the water supply pipe (413) on the same side, and a warm water pipe (414) connected to the return pipe (44) is commonly provided on the rear part of the inner surface of the plurality of heat exchange components (412).

4. The heat dissipation device with a microchannel heat sink according to claim 3, characterized in that: A spring support ring (4127) is fixedly connected to the joint between the cold water pipe (4122) and the water supply pipe (413), and ends of the spring support rings (4127) on both sides that are away from each other are fixedly connected to a T-shaped piston valve (4123) that is slidably connected to the inner surface of the cold water pipe (4122), and the T-shaped piston valve (4123) is provided with through holes on both the front and rear sides that are connected to the rear end.

5. The heat dissipation device with a microchannel heat sink according to claim 2, characterized in that: Heat exchange tubes (422) are symmetrically provided on the inner surface of the back plate (42); the upper sides of the two heat exchange tubes (422) are connected to the second connecting tube (43); the lower sides of the two heat exchange tubes (422) are connected to the return tube (44); and the connection points between the two heat exchange tubes (422) and the return tube (44) are fixedly connected to a one-way valve (423).

6. The heat dissipation device with a microchannel heat sink according to claim 2, characterized in that: The cooling structure (5) comprises a cooling box (51) fixedly connected to the rear end of the back plate (42) and a circulating pump (53) fixedly connected to the bottom wall of the inner cavity of the cooling box (51); a water pipe (52) in communication with a return pipe (44) is fixedly connected to the lower front end of the cooling box (51); an end of the water pipe (52) away from the back plate (42) is connected to the input side of the circulating pump (53) and extends to the upper inner cavity of the water pipe (57) and is fixedly connected to an overflow assembly (58); a water pipe (57) in communication with the output end of the circulating pump (53) is provided at the upper front end of the cooling box (51); a plurality of baffles (55) are linearly distributed and fixedly connected to the inner surface of the cooling box (51); and a semiconductor cooling plate (54) is fixedly connected to the rear ends of the plurality of baffles (55).

7. The heat dissipation device with a microchannel heat sink according to claim 6, characterized in that: The overflow assembly (58) comprises branch pipes (581) which are linearly distributed and fixedly connected to the side of the cooling box (51); a plurality of the branch pipes (581) are in communication with water pipe 1 (52); and a plurality of the branch pipes (581) are provided with overflow ports (582) in communication with their inner cavities at their upper ends.

8. The heat dissipation device with a microchannel heat sink according to claim 6, characterized in that: A plurality of guide grooves (56) are linearly distributed on the upper ends of the baffle plates (55), and the guide grooves (56) on two adjacent baffle plates (55) are staggered in the vertical direction.

9. The heat dissipation device with a microchannel heat sink according to claim 6, characterized in that: The hot end of the semiconductor refrigeration sheet (54) is linearly distributed and fixedly connected to a plurality of heat dissipation fins (543); the rear end of the cooling box (51) is fixedly connected to a cooling box (541); an upper portion of the rear end of the cooling box (541) is provided with an air outlet (542) that passes through the rear end of the inner cavity of the outer shell (1) and is connected to the rear end of the outer shell (1); a plurality of fans (544) are linearly distributed and fixedly connected to the rear end of the cooling box (541); an air inlet is provided at the rear end of the outer shell (1) at a position corresponding to the fan (544); a mesh plate (545) that connects the cooling box (541) and the inner cavity of the cooling box (51) is fixedly installed at the lower portion of the rear end of the cooling box (51); a plurality of capillaries that pass through from front to back and are provided with one-way valves are provided on the surface of the mesh plate (545).

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