Method for automatically adjusting printing condition, electronic equipment and computer readable medium

Abstract

The invention discloses a method for automatically adjusting a printing condition, electronic equipment and a computer readable medium, and the method comprises the steps: S1, based on an actual detection result of a quality target set by a client, analyzing printing condition data related to a change trend of the quality target, and after the printing condition data is adjusted to reach the quality target, generating a first adaptive condition, and storing. S2, when external conditions change to cause quality problems, printing condition data are automatically adjusted and improved on the basis of the first self-adaptive condition, and after a quality target is achieved, a second self-adaptive condition is generated and stored; and S3, after the plurality of adaptive conditions are generated, a set of the plurality of adaptive conditions forms a printing condition self-adjustment model, and when a quality problem occurs in the production process, an optimal adaptive condition is automatically matched from the printing condition self-adjustment model and is adjusted to serve as a basis for automatic adjustment of the printing condition data. The adjusting effect is more accurate, and the loss caused by poor adjustment is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of SMT, and in particular relates to a method for automatically adjusting printing conditions, an electronic device and a computer-readable medium. Background Art

[0002] SMT is surface mount technology, which is the most popular technology and process in the current electronic assembly industry. It is a method of installing pinless or short-lead surface mount components on the surface of printed PCB boards.

[0003] At present, during the production process, the screen printers in the SMT industry adjust the parameters of solder paste printing according to the actual inspection results through linkage with the inspection machine to optimize the solder paste printing conditions and improve the quality of solder paste printing on the substrate. However, the current method only analyzes the current single solder paste printing results, and does not perform an overall trend analysis based on the data, resulting in the risk of failure in the adjustment process, resulting in the loss of poor solder paste printing quality on the substrate. In order to solve the above technical problems, the present invention is derived. Summary of the invention

[0004] In view of at least one of the above-mentioned technical problems, an object of the present invention is to provide a method, an electronic device and a computer-readable medium for automatically adjusting printing conditions.

[0005] The technical solution of the present invention is:

[0006] An object of the present invention is to provide a method for automatically adjusting printing conditions based on analyzing actual production data for screen printing in an SMT production line, comprising the following steps:

[0007] S1. Based on the actual test results of the quality target set by the customer, the printing condition data related to the change trend of the quality target is analyzed, and after the printing condition data is adjusted to achieve the quality target, the first adaptive condition is generated and saved;

[0008] S2. When the external conditions change and cause quality problems, the printing condition data is automatically adjusted based on the first adaptive condition. After the quality target is improved and achieved, the second adaptive condition is generated and saved;

[0009] S3. After generating multiple adaptive conditions, the set of the multiple adaptive conditions constitutes a printing condition self-adjustment model and includes the first adaptive condition and the second adaptive condition. When quality problems occur in the production process, the optimal adaptive condition is automatically matched from the printing condition self-adjustment model and the adaptive condition is called out as the basis for automatic adjustment of the printing condition data.

[0010] Preferably, in step S1, the first adaptive condition includes all printing condition data related to the change trend of the quality target.

[0011] Preferably, the printing conditions include scraper-related conditions, printing pressure conditions, cleaning-related conditions, demoulding-related conditions and gap conditions.

[0012] Preferably, in step S2, when quality problems are caused by changes in external conditions, it is necessary to first analyze the types of quality problems, which include solder paste amount problems, solder paste shape problems and printing stability problems.

[0013] Preferably, after analyzing the type of the quality problem, the printing condition data related to the type of quality problem is automatically adjusted using the first adaptive condition.

[0014] Preferably, the quality target includes but is not limited to the area and volume of solder paste printing.

[0015] Preferably, the external conditions include but are not limited to production machine types and production product materials.

[0016] Another object of the present invention is to provide an electronic device, comprising at least one processor; and at least one memory on which a computer program is stored, and when the computer program is executed by the at least one processor, the method described above is implemented.

[0017] Another object of the present invention is to provide a computer storage medium having a computer program stored thereon, wherein when the computer program is executed by at least one processor of an electronic device, the electronic device executes the method as described above.

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] The method, electronic device and computer-readable medium for automatically adjusting printing conditions of the present invention continuously collect relevant data on actual production of customers, automatically adjust printing conditions through data analysis, and generate a self-adjusting model for printing conditions. The adaptive conditions in the self-adjusting model for printing conditions will be continuously enriched with production, and more optimized and suitable adaptive conditions will be provided for the changing trend of the quality target of the entire production. The adjustment effect is more accurate, and the loss caused by poor adjustment is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0021] Figure 1 A flow chart of a method for automatically adjusting printing conditions according to an embodiment of the invention;

[0022] Figure 2A graph showing a change trend of some printing conditions and target quality of a method for automatically adjusting printing conditions according to an embodiment of the present invention;

[0023] Figure 3 A printing association diagram of screen printing according to an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of cleaning of screen printing according to an embodiment of the present invention;

[0025] Figure 5 It is a schematic diagram of demoulding of screen printing according to an embodiment of the present invention.

[0026] Among them: 10, substrate; 20, stencil; 21, opening; 30, scraper; 40, solder paste; 50, cleaning nozzle; 60, cleaning roll paper; 70, forming solder paste. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0028] See also Figures 1 to 5 , an embodiment of the present invention provides a method for automatically adjusting printing conditions, comprising the following steps:

[0029] S1. Based on the actual test results of the quality target set by the customer, the printing condition data related to the change trend of the quality target is analyzed, and after the printing condition data is adjusted to achieve the quality target, the first adaptive condition is generated and saved; Figure 2 ((a) to (e)), Figure 2 (a) to (c) show three graphs of printing condition data as examples. Figure 2 (d) and (e) exemplarily show the changing trends of two quality targets (e.g., the area and volume of the printed solder paste 40). The horizontal dotted line represents the quality target set by the customer (the customer inputs the quality target on the control panel of the screen printer before production). Figure 2 The curves in (d) and (e) represent the quality target results of the actual detection output under the printing condition data. When the curve is close to the target value, it means that the quality target has been achieved. When the quality target is achieved, the corresponding printing condition data is the optimal printing condition under the printing condition.

[0030] S2. When the external conditions change and cause quality problems, the printing condition data is automatically adjusted based on the first adaptive condition. After the quality target is improved and achieved, the second adaptive condition is generated and saved. It should be noted that the external condition is a condition other than the printing condition, which is not specifically described or limited. For example, the printing of substrates 10 of different types or materials, or the production of different machine models, requires different printing conditions to achieve the quality target. Therefore, when the external conditions change during the production process, the quality target will also change, thereby causing quality problems, that is, quality degradation. It should be noted that the method of the embodiment of the present invention is for the entire production. During the entire production process, there may be multiple external conditions. Therefore, after different external conditions change, quality problems may occur, and multiple second adaptive conditions will be generated at this time.

[0031] S3. After generating multiple adaptive conditions, the set of multiple adaptive conditions constitutes a printing condition self-adjustment model and includes the first adaptive condition and multiple second adaptive conditions mentioned above. When quality problems occur in the production process, the optimal adaptive condition is automatically matched from the printing condition self-adjustment model and the adaptive condition is called out as the basis for automatic adjustment of the printing condition data. That is, in the method of the embodiment of the present invention, production data is continuously collected to make the adaptive conditions of the printing adjustment self-adjustment model richer.

[0032] Further preferably, in step S1, the first adaptive condition includes all printing condition data related to the change trend of the quality target. Further preferably, the printing condition includes conditions related to the scraper 30, printing pressure conditions (i.e. printing pressure, such as Figure 3 The downward arrow shown in the figure specifically represents the pressure of the scraper 30 when pressing the solder paste 40 into the opening 21 of the stencil 20 or the mask having the opening 21 provided on the substrate 10), cleaning related conditions, demolding related conditions and gap amount conditions. More specifically, the scraper 30 related conditions include, for example, the scraper 30 action mode (i.e., the number of printing times), the scraper 30 speed (i.e., Figure 3 The horizontal arrows shown in the figure indicate the horizontal movement speed of the scraper 30 along the screen 20 or the mask), the action division of the scraper 30 (some areas have more printing times, some areas have fewer printing times), etc., and there are also examples such as Figure 3 The angle of the scraper 30 relative to the stencil 20 or the mask is shown. Cleaning related conditions include, for example, cleaning method (dry cleaning or wet cleaning), cleaning suction (the hole part needs additional suction to suck out the solder paste 40 attached therein, and cleaning suction refers to the suction force), cleaning speed (such as Figure 4As shown, the suction nozzle is pressed on the cleaning roll 60 and moves horizontally to clean the solder paste 40 attached to the stencil 20 or the mask. The moving speed is the cleaning speed, the amount of cleaning roll 60, etc. Demolding related conditions include demolding mode, demolding speed, demolding stroke, demolding priority and demolding suction (sucking and fixing the molded solder paste 7040 to be demolded during demolding, demolding suction refers to the suction force of sucking and fixing the molded solder paste 7040 to be demolded). The gap amount refers to the amount of Figure 3 The spacing between the substrate 10 and the stencil 20 or mask is shown.

[0033] Preferably, in step S2, when the external conditions change and cause quality problems, it is necessary to first analyze the type of quality problems. The types of quality problems mainly include the problem of the amount of solder paste 40 (for example, the amount of solder paste 40 is too much or too little), the problem of the shape of solder paste 40 (for example, the size of solder paste 40 is too small or too large), and the problem of printing stability (for example, when a batch of products is produced, when the quality target reaches a set standard or above, it indicates that the printing is stable, and when it is lower than the standard, it indicates that the printing is unstable). Of course, in addition to the above-mentioned problems, position problems (for example, whether the printing position of solder paste 40 is offset) and the like are also included. In the embodiment of the present invention, the problem of the amount of solder paste 40, the problem of the shape of solder paste 40, and the problem of printing stability are preferably included. Further preferably, after analyzing the type of quality problem, the first adaptive condition is used to automatically adjust the printing condition data related to the quality problem of this type. It should be noted that each quality problem is related to one or more (generally multiple) printing conditions, so the first adaptive condition is used to automatically adjust the printing condition data related to the quality problem of this type, and all relevant printing condition data can be adjusted, or the main (that is, the most influential) printing condition data can be adjusted.

[0034] Preferably, the quality target is mainly set according to customer needs. In the embodiment of the present invention, the quality target includes but is not limited to the area and volume of the printed solder paste 40 .

[0035] The method of the embodiment of the present invention continuously collects relevant data of the customer's actual production, automatically adjusts the printing conditions through data analysis, and generates a self-adjusting model for the printing conditions. The adaptive conditions in the self-adjusting model for the printing conditions will be continuously enriched with production, and more optimized and suitable adaptive conditions will be provided for the changing trend of the quality target of the entire production. The adjustment effect is more accurate, and the loss caused by poor adjustment is reduced.

[0036] An embodiment of the present invention further provides an electronic device, which is in the form of a general-purpose computing electronic device and may include at least one processor and at least one memory, wherein the processor is used to control the operation and function of the electronic device. For example, in some embodiments, the processor may implement various operations with the aid of instructions stored in a memory coupled thereto.

[0037] The electronic device in the embodiment of the present invention exemplarily includes a variety of computer-readable media. These media can be any available media that can be accessed by the electronic device, including volatile and non-volatile media, removable and non-removable media. The computer-readable medium shown in the embodiment of the present invention can be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium can be, for example, but not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present invention, a computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it. In the present invention, a computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, wherein a computer-readable program code is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which may send, propagate, or transmit programs for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0038] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A method for automatically adjusting printing conditions, characterized in that: The following steps are involved: S1. Based on the actual test results of the quality target set by the customer, the printing condition data related to the change trend of the quality target is analyzed, and after the printing condition data is adjusted to achieve the quality target, the first adaptive condition is generated and saved; S2. When the external conditions change and cause quality problems, the printing condition data is automatically adjusted based on the first adaptive condition. After the quality target is improved and achieved, the second adaptive condition is generated and saved; S3. After generating multiple adaptive conditions, the set of the multiple adaptive conditions constitutes a printing condition self-adjustment model and includes the first adaptive condition and the second adaptive condition. When quality problems occur in the production process, the optimal adaptive condition is automatically matched from the printing condition self-adjustment model and the adaptive condition is called out as the basis for automatic adjustment of the printing condition data.

2. The method according to claim 1, characterized in that In step S1, the first adaptive condition includes all printing condition data related to the change trend of the quality target.

3. The method according to claim 2, characterized in that The printing conditions include scraper-related conditions, printing pressure conditions, cleaning-related conditions, demoulding-related conditions and gap conditions.

4. The method according to claim 1, characterized in that: In step S2, when quality problems are caused by changes in external conditions, it is necessary to first analyze the types of quality problems, which include solder paste quantity problems, solder paste shape problems, and printing stability problems.

5. The method according to claim 4, characterized in that After analyzing the type of the quality problem, the printing condition data related to the type of quality problem is automatically adjusted using the first adaptive condition.

6. The method according to claim 1, characterized in that The quality targets include the area and volume of solder paste printing.

7. The method according to claim 1, characterized in that The external conditions include production machine types and production product materials.

8. An electronic device comprising at least one processor; and at least one memory having a computer program stored thereon, characterized in that: When the computer program is executed by the at least one processor, the method according to any one of claims 1 to 7 is implemented.

9. A computer storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by at least one processor of an electronic device, the electronic device executes the method according to any one of claims 1 to 7.

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